Die package with sealed die encapsulation

Abstract

Apparatuses and techniques are disclosed for manufacturing a single die or multi-die package with a sealed encapsulation. In one or more aspects, an apparatus includes: a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a sealing portion coupled to the perimeter metallization and the package substrate, the sealing portion configured to seal the die to the package substrate.

Description

[0001] Public background

[0002] 1. Public Domain

[0003] Aspects of the present disclosure relate generally to single die or multi-die packages, and more particularly to multi-die packages that provide an air cavity sealed on the perimeter of the die for a die having an acoustic filter.

[0004] 2. Description of related technologies

[0005] Integrated circuit technology has made great strides in increasing computing power through the miniaturization of active components. Various packaging technologies can be found in many electronic devices, including processors, servers, radio frequency (RF) integrated circuits, etc. Advanced packaging and processing technologies allow complex devices, such as multi-die devices and system-on-chip (SOC) devices, which may include multiple functional blocks, each of which is designed to perform a specific function, such as, for example, microprocessor functions, graphics processing unit (GPU) functions, communication functions (e.g., Wi-Fi, Bluetooth and other communications), etc.

[0006] Reducing the cost of multi-die / multi-chip packaging is the goal of the industry to remain competitive in the market. In the past few years, there has been a trend to abandon expensive wafer-level chip packaging (e.g., thin film acoustic packaging (TFAP) or die-sized SAW (surface acoustic wave) packaging (DSSP) etc.) and utilize new packaging technologies (such as bare die ball top packaging).

[0007] However, ball-top encapsulation has several disadvantages, such as solder fatigue and controlling ball-top leakage. Due to the lack of molded underfill, solder fatigue issues have a negative impact on device reliability. In conventional processing for tight inter-die placement (e.g., 180 microns (um) between dies), controlling the ball-top leakage process is challenging. Large positive or negative ball-top undercuts may cause reliability issues (e.g., early failures due to solder fatigue). In addition, the lack of molded underfill and poor thermal conductivity of the ball-top laminate material have a negative impact on the thermal resistance (e.g., junction temperature resistance Rjb and Rjc) of the bare die package.

[0008] Accordingly, a need exists for systems, apparatus, and methods that overcome the deficiencies of conventional designs, including the methods, systems, and apparatus provided herein below for single and multi-die packaging with hermetic encapsulation.

[0009] Overview

[0010] A simplified summary of one or more aspects disclosed herein is given below. Thus, the following summary should neither be considered an exhaustive overview of all contemplated aspects, nor should the following summary be considered to identify key or decisive elements related to all contemplated aspects or to delineate the scope associated with any particular aspect. Accordingly, the sole purpose of the following summary is to present certain concepts related to one or more aspects of the mechanisms disclosed herein in a simplified form prior to the detailed description given below.

[0011] One or more aspects include an apparatus comprising: a die; a perimeter metallization disposed on a perimeter of the die; a packaging substrate; and a sealing portion coupled to the perimeter metallization and the packaging substrate and configured to seal the die to the packaging substrate.

[0012] One or more aspects include a method for manufacturing a device. The method includes: forming a die; forming a perimeter metallization on a perimeter of the die; forming a package substrate; and coupling a seal to the perimeter metallization and the package substrate to seal the die to the package substrate.

[0013] Other objects and advantages associated with the various aspects disclosed herein will be apparent to those skilled in the art based on the accompanying drawings and detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are presented to aid in describing the various aspects of the disclosure and are provided solely for illustration of the aspects and not limitation thereof.

[0016] Figure 1A A partial cross-sectional view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0017] Figure 1B A partial bottom view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0018] Figure 2 A partial cross-sectional view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0019] Figure 3 A partial cross-sectional view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0020] Figure 4 A partial cross-sectional view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0021] Figure 5 A partial cross-sectional view of an apparatus in accordance with one or more aspects of the present disclosure is illustrated.

[0022] Figure 6Illustrated are plan views of apparatus in accordance with one or more aspects of the present disclosure.

[0023] Figures 7A-7D A partial plan view and associated partial cross-sectional views of a die having perimeter metallization and a seal according to one or more aspects of the present disclosure are illustrated.

[0024] Figures 8A-8E Partial plan views and associated partial cross-sectional views of a die having perimeter metallization, a seal, and a packaging substrate having a cavity are illustrated in accordance with one or more aspects of the present disclosure.

[0025] Fig. 9 Components of an integrated device in accordance with one or more aspects of the present disclosure are illustrated.

[0026] Fig.10 A flow chart illustrating a method for fabricating a device according to one or more aspects of the present disclosure.

[0027] Fig.11 An exemplary mobile device in accordance with one or more aspects of the present disclosure is illustrated.

[0028] Fig.12 Various electronic devices into which any of the disclosed devices according to one or more aspects of the present disclosure may be integrated are illustrated.

[0029] Detailed Description

[0030] Various aspects of the present disclosure are provided in the following description and related drawings for various examples provided for illustrative purposes. Alternative aspects may be designed without departing from the scope of the present disclosure. In addition, well-known elements in the present disclosure will not be described in detail or will be omitted to avoid obscuring the relevant details of the present disclosure.

[0031] The words "exemplary" and / or "example" are used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" and / or "example" is not necessarily to be construed as preferred or superior to other aspects. Likewise, the term "aspects of the disclosure" does not require that all aspects of the disclosure include the discussed feature, advantage, or mode of operation.

[0032] Those skilled in the art will appreciate that the information and signals described below may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the following description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof, depending in part on the specific application, in part on the desired design, in part on the corresponding technology, etc.

[0033] In some of the described example implementations, the following examples are identified where various component structures and portions of operations may be obtained from known conventional techniques and then arranged according to one or more exemplary aspects. In such examples, internal details of portions of known conventional component structures and / or operations may be omitted to help avoid potential confusion of the concepts explained in the illustrative aspects disclosed herein.

[0034] The terms used herein are for the purpose of describing specific aspects only and are not intended to be limiting. As used herein, the singular forms of "a", "a", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "having", "including", and / or "containing" when used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0035] Figure 1AA partial cross-sectional view of a device 100 according to one or more aspects of the present disclosure is illustrated. The device 100 includes a die 120, which may be a bare die. A perimeter metallization 110 is disposed on the perimeter of the die 120. A package substrate 140, which may be a multi-layer laminate substrate, is disposed below the die 120. A seal 130 is coupled to the perimeter metallization 110 and the package substrate 140. The seal 130 is configured to seal the die 120 to the package substrate 140. In some aspects, the seal 130 may have conductive properties, such as solder, silver sintering paste, etc. In other aspects, the seal 130 may be a polymer. The device 100 may have a single die or multi-die package configuration. In some aspects, more than one die may be included, and the multi-die package may include a solder seal encapsulation (i.e., the seal 130 may be a solder ball, solder paste, etc.). The package substrate 140 may include a cavity 142 (which may be an air cavity) around a resonator 124 (e.g., an acoustic resonator). The cavity 142 can be disposed between the tube core 120 and the packaging substrate 140. In some aspects, the cavity 142 has a smaller perimeter than the tube core 120. The cavity 142 is provided in the packaging substrate 140, which allows for a reduced package height and a more rigid connection between the tube core 120 and the packaging substrate 140. In some aspects, the tube core 120 is disposed on the open side of the cavity 142, and the sealing portion 130 is configured to seal the cavity 142. The plurality of resonators 124 are disposed on the surface of the tube core 120, and the tube core 120 is sealed with the cavity by the sealing portion 130 and allows air for the plurality of resonators 124 to fill the cavity 142. The tube core 120 can be electrically coupled to the packaging substrate 140 by a connector 126, and the connector 126 can be a solder ball, a solder bump, a copper pillar, a pin, or any suitable connector. In some aspects, the perimeter metallization 110 is disposed on the bottom of the tube core 120 facing the packaging substrate 140. In some aspects, the sealing portion 130 is at least partially coupled to the top side of the packaging substrate 140 facing the die 120. In some aspects, the packaging encapsulant 150 (e.g., molding / glob top) is disposed over the die 120 and the packaging substrate 140. This configuration can provide various improvements, such as cost reduction (no wafer level packaging), ultra-low reliability requirements for the packaging encapsulant 150 (e.g., molding / glob top), elimination of unreliable globe top leakage / underfill issues, improved solder fatigue reliability (more solder connections with greater surface area), significantly improved thermal resistance (more solder connections with greater surface area), and other benefits discussed herein.

[0036] Figure 1BA partial bottom view of a device 100 is illustrated in accordance with one or more aspects of the present disclosure. In one or more aspects, a larger perimeter pad 112 is added to the perimeter metallization 110 (e.g., copper metallization). The perimeter metallization 110 and the electrical conductivity allow for independent control of the resulting perimeter solder height and bump height by controlling the amount of solder balls / solder on the perimeter metallization 110. The plurality of resonators 124 can be coupled to external circuitry via connector pads 122 (under bump metallization (UBM)), which can be used to couple to Figure 1A 1. The connector pads 122 may be used to couple the signal connections of the die 120. The perimeter pads 112 may be used to couple the perimeter metallization 110 to ground and provide additional mechanical support.

[0037] Figure 2 A partial cross-sectional view of a device 200 according to one or more aspects of the present disclosure is illustrated. The device 200 includes a die 220, which may be a bare die. A perimeter metallization 210 is disposed on the perimeter of the die 220. A packaging substrate 240, which may be a multi-layer laminate substrate, is disposed below the die 220. A sealing portion 230 is coupled to the perimeter metallization 210 and the packaging substrate 240. The sealing portion 230 is configured to seal the die 220 to the packaging substrate 240. The device 200 may have a single die or multi-die packaging configuration. The packaging substrate 240 may include a cavity 242 (e.g., an air cavity) around a resonator 224 (e.g., an acoustic resonator). The cavity 242 may be disposed between the die 220 and the packaging substrate 240. In some aspects, the cavity 242 has a larger perimeter than the die 220. A cavity 242 is provided in the packaging substrate 240, which allows for a reduced package height and a more rigid connection between the die 220 and the packaging substrate 240. The plurality of resonators 224 are disposed on a surface of the die 220, which is sealed with the cavity by the seal 230 and allows air to fill the cavity 242 for the plurality of resonators 224. The die 220 can be electrically coupled to the packaging substrate 240 via a connector 226. In some aspects, a package encapsulant 250 (e.g., a mold / globe) is disposed over the die 220 and the packaging substrate 240. In some aspects, the die 220 is at least partially embedded in the cavity 242. In one or more aspects, the perimeter metallization 210 is at least partially disposed on one side of the die 220, as illustrated. In some aspects, the seal 230 is at least partially coupled to the sidewalls of the cavity 242 and can be coupled to one or more metal layers 244 in the multi-layer packaging substrate 240. This configuration may provide a reduction in package height, a more rigid connection between the die and the package substrate, improved fatigue life of the solder bumps / connections, and other benefits discussed herein.

[0038] Figure 3 A partial cross-sectional view of a device 300 according to one or more aspects of the present disclosure is illustrated. The device 300 includes a die 320, which may be a bare die. A perimeter metallization 310 is disposed on the perimeter of the die 320. A packaging substrate 340, which may be a multi-layer laminate substrate, is disposed below the die 320. A sealing portion 330 is coupled to the perimeter metallization 310 and the packaging substrate 340. The sealing portion 330 is configured to seal the die 320 to the packaging substrate 340. The device 300 may have a single die or multi-die packaging configuration. The packaging substrate 340 may include a cavity 342 (e.g., an air cavity) around a resonator 324 (e.g., an acoustic resonator). The cavity 342 may be disposed between the die 320 and the packaging substrate 340. The die 320 is disposed above the cavity 342, but in some aspects, the die 320 may also be embedded or at least partially embedded in the cavity 342. A cavity 342 is provided in the package substrate 340, which allows for a reduced package height and a more rigid connection between the die 320 and the package substrate 340. The plurality of resonators 324 are disposed on the surface of the die 320, which is sealed with the cavity 342 by the seal 330 and allows air to fill the cavity 342 for the plurality of resonators 324. The die 320 can be electrically coupled to the package substrate 340 via a connector 326. In some aspects, a package encapsulant 350 (e.g., a molded / glob top) is disposed over the die 320 and the package substrate 340. In one or more aspects, an electromagnetic shield 360 can be provided, which can improve EMC shielding and provide heat sink / heat sink functionality. In one or more aspects, the electromagnetic shield can be formed by sputtering copper prior to the molding process. In addition to the other advantages discussed herein, this configuration allows for significantly improved thermal management, with essentially one large heat sink on the die surface, connected to the die perimeter near the heat source.

[0039] In some aspects, the electromagnetic shield 360 is disposed above the tube core and at least partially disposed above the packaging substrate 340. In some aspects, the electromagnetic shield 360 includes copper. The electromagnetic shield 360 (e.g., EMC copper shield) can be formed by a sputtering process (e.g., copper sputtering), which can be performed before molding, rather than after molding (not yet cut, no shielding on the side). In some aspects, half cutting can be performed before molding and copper shield sputtering (e.g., the electromagnetic shield 360 does not cover the entire packaging substrate 340). In some aspects, the manufacturing process can include performing top side grinding after molding, which can expose (all) tube cores 320, and then copper shield sputtering can be performed. In some aspects, the manufacturing process can include copper shield sputtering before applying solder paste to the tube core perimeter, similar to chip size solder package-power package (CSSP-PP) manufacturing technology.

[0040] Figure 4 A partial cross-sectional view of a device 400 according to one or more aspects of the present disclosure is illustrated. The device 400 includes a die 420, which may be a bare die. A perimeter metallization 410 is disposed on the perimeter of the die 420. A package substrate 440, which may be a multi-layer laminate substrate, is disposed below the die 420. A seal 430 is coupled to the perimeter metallization 410 and the package substrate 440. The seal 430 is configured to seal the die 420 to the package substrate 440. The device 400 may have a single die or multi-die package configuration. The package substrate 440 may include a cavity 442 (e.g., an air cavity) around a resonator 424 (e.g., an acoustic resonator). The die 420 is disposed above the cavity 442, but in some aspects, the die 420 may also be embedded or at least partially embedded in the cavity 442. The cavity 442 is provided in the package substrate 440, which allows a reduced package height and a more rigid connection between the die 420 and the package substrate 440. The plurality of resonators 424 are disposed on the surface of the die 420, which is sealed with the cavity 442 by the sealing portion 430 and allows air for the plurality of resonators 424 to fill the cavity 442. The die 420 can be electrically coupled to the packaging substrate 440 via a connector 426. In some aspects, a packaging encapsulant 450 (e.g., a molded / glob top) is disposed over the die 420 and the packaging substrate 440. In some aspects, a heat sink 470 is disposed in the packaging substrate 440. The heat sink 470 is configured to allow access to the cavity through the packaging substrate 440. In some aspects, the heat sink 470 has an inner wall covered with copper, for example, configured as a copper tube, which can facilitate sealing the hole with solder or other suitable plugging material. In some aspects, a heat sink sealing portion 472 configured to seal the heat sink 470 and the cavity 442 is provided.

[0041] In one or more aspects of the present disclosure, one of the manufacturing challenges is flux cleaning. For example, for solder balls, conventional manufacturing processes can be used, except that the flux cleaning aspect is addressed, and the heat sink 470 in the package substrate is used to enter the cavity 442 for flux cleaning. The heat sink 470 needs to be sealed after the flux cleaning process, which can be accomplished using the heat sink seal 472. In some aspects, the manufacturing process can use evaporation-free cleaning flux, with or without the heat sink 470. In some aspects, the manufacturing process can include a CSSP-PP process using solder instead of silver (Ag) paste. In some aspects, the manufacturing process can use copper (Cu) columns and use flux-free copper-tin-copper (Cu-SN-Cu) bonding.

[0042] Figure 5A partial cross-sectional view of a device 500 according to one or more aspects of the present disclosure is illustrated. The device 500 includes a die 520, which may be a bare die. A perimeter metallization 510 is disposed on the perimeter of each die 520. A packaging substrate 440, which may be a multi-layer laminate substrate, is disposed below the die 520. A sealing portion 530 is coupled to the perimeter metallization 510 and the packaging substrate 540. The sealing portion 530 is configured to seal the die 520 to the packaging substrate 540. The device 500 is a multi-die packaging configuration. The packaging substrate 440 does not include a cavity, and instead an air gap 542 surrounds a resonator 524 (e.g., an acoustic resonator). The air gap 542 may be disposed between the die 520 and the packaging substrate 540. The die 520 may be electrically coupled to the packaging substrate 540 via a connector 526. The perimeter metallization 510 is copper, the sealing portion is tin, and the tin is coupled to the package substrate at the metal layer 544, which is copper and forms a copper-tin-copper joint. In some aspects, the connector 526 can be coupled to the tube core 520 and the package substrate 540 by a copper-tin-copper joint. In some aspects, manufacturing can include providing a tube core 520 with a perimeter metallization 510. A dry film photoresist (DFR) mask can be patterned for a tin (Sn) plating process. The manufacturing process can continue to perform Sn plating on the perimeter metallization 510 and other exposed copper surfaces. After plating, the manufacturing process can continue to strip the DFR. During assembly, other connection points of the perimeter metallization 510 plated with Sn can be directly bonded to the exposed copper portion of the package substrate 540.

[0043] Figure 6A plan view of a device 600 according to one or more aspects of the present disclosure is illustrated. The device 600 can be a multi-chip molded package that includes one or more dies mounted to a packaging substrate, as disclosed herein. For example, the die 620 of the device 600 can be similar to the various configurations discussed herein. In one or more aspects, the die 620 has a perimeter metallization 610 (e.g., a copper metallization). A plurality of resonators 624 can be coupled to external circuits (e.g., a low noise amplifier 660 (LNA 660)) via connector pads 622 (under bump metallization (UBM)), which can be used to couple to connectors (e.g., solder balls). As discussed herein, all dies on the device 600 need not include a perimeter metallization 610 as in the die 620 and a sealing portion associated with the packaging substrate. However, more than one die in the device 600 can have these features. In some aspects, die 620 is part of a BAW (bulk acoustic wave) acoustic filter or a SAW (surface acoustic wave) acoustic filter. Device 600 may be a multi-die radio frequency (RF) device, a system on a chip (SOC), a radio frequency front end (RFFE) device, etc., and may include multiple components such as power amplifiers, LNAs, antenna tuners, filters, and switches. The specific design and components will vary based on the design criteria and functionality of device 600, so the details of the various components will not be discussed further.

[0044] Figures 7A-7D A partial plan view and related partial cross-sectional views of a die having perimeter metallization and a seal according to one or more aspects of the present disclosure are illustrated. Fig. 7A The die 721 has a perimeter metallization 711 (eg, copper metallization). The perimeter metallization 711 is coupled to a sealing portion 731 , which is configured as a solder dam. The sealing portion 731 is also coupled to a substrate 741 .

[0045] refer to Figure 7B , the die 722 has a perimeter metallization 712 (e.g., copper metallization). The perimeter metallization 712 may optionally have a perimeter pad 752. The perimeter pad 752 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 712 is coupled to a sealing portion 732, which is configured as a solder dam. The sealing portion 732 is also coupled to a substrate 742.

[0046] refer to Figure 7C, the die 723 has a perimeter metallization 713 (e.g., copper metallization). The perimeter metallization 713 in this configuration extends to the side of the die 723. The perimeter metallization 713 may optionally have a perimeter pad 753. The perimeter pad 753 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 713 is coupled to a sealing portion 733, which is configured as a solder dam. The sealing portion 733 is also coupled to a substrate 743.

[0047] refer to Figure 7C , the die 724 has a perimeter metallization 714 (e.g., a copper pillar). The perimeter metallization 714 in this configuration has a copper pillar extending from the die 724. The perimeter metallization 714 may optionally have a perimeter pad 754. The perimeter pad 754 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 714 is coupled to a sealing portion 733, which is configured as a solder dam, is coupled to the pillars and can be sealed between the pillars of the perimeter metallization 714 in some portions. The sealing portion 734 is also coupled to a substrate 744.

[0048] Figures 7A-7D A partial plan view and related partial cross-sectional views of a die having perimeter metallization and a seal according to one or more aspects of the present disclosure are illustrated. Fig. 7A The die 721 has a perimeter metallization 711 (eg, copper metallization). The perimeter metallization 711 is coupled to a sealing portion 731 , which is configured as a solder dam. The sealing portion 731 is also coupled to a substrate 741 .

[0049] refer to Figure 7B , the die 722 has a perimeter metallization 712 (e.g., copper metallization). The perimeter metallization 712 may optionally have a perimeter pad 752. The perimeter pad 752 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 712 is coupled to a sealing portion 732, which is configured as a solder dam. The sealing portion 732 is also coupled to a substrate 742.

[0050] refer to Figure 7C , the die 723 has a perimeter metallization 713 (e.g., copper metallization). The perimeter metallization 713 in this configuration extends to the side of the die 723. The perimeter metallization 713 may optionally have a perimeter pad 753. The perimeter pad 753 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 713 is coupled to a sealing portion 733, which is configured as a solder dam. The sealing portion 733 is also coupled to a substrate 743.

[0051] refer to Fig.7D , the die 724 has a perimeter metallization 714 (e.g., a copper pillar). The perimeter metallization 714 in this configuration has a copper pillar extending from the die 724. The perimeter metallization 714 may optionally have a perimeter pad 754. The perimeter pad 754 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 714 is coupled to a sealing portion 733, which is configured as a solder dam, is coupled to the pillars and can be sealed between the pillars of the perimeter metallization 714 in some portions. The sealing portion 734 is also coupled to a substrate 744.

[0052] Figures 8A-8E A partial plan view and related partial cross-sectional views of a die having perimeter metallization, a seal, and a package substrate having a cavity are illustrated in accordance with one or more aspects of the present disclosure. Fig. 8A The die 821 has a perimeter metallization 811 (eg, copper metallization). The perimeter metallization 811 is coupled to a sealing portion 831 that is coupled to the packaging substrate 841 outside the perimeter of the cavity 861 in the packaging substrate 841 .

[0053] refer to Figure 8B , the die 822 has a perimeter metallization 812 (e.g., a copper metallization). The perimeter metallization 812 may optionally have a perimeter pad 852. The perimeter pad 852 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 812 can be disposed on portions of the bottom and sides of the die 822. The perimeter metallization 812 is coupled to a sealing portion 832, which is configured as a polymer or solder dam. The perimeter metallization 812 is coupled to the sealing portion 832, which is coupled to the packaging substrate 842 outside the perimeter of the cavity 862. In this configuration, the die 822 is disposed close to the surface of the packaging substrate 842.

[0054] refer to Figure 8C , the die 823 has a perimeter metallization 813 (e.g., copper metallization). The perimeter metallization 813 can be disposed on portions of the bottom and sides of the die 823. The perimeter metallization 813 is coupled to a seal 833, which can be solder coupled to the bottom and sides of the perimeter metallization 813. The perimeter metallization 813 is coupled to the seal 833, which is coupled to the packaging substrate 843 outside the perimeter of the cavity 863. In this configuration, the die 823 is disposed close to the surface of the packaging substrate 843.

[0055] refer to Fig.8D, the die 824 has a perimeter metallization 814 (e.g., a copper metallization). The perimeter metallization 814 may optionally have a perimeter pad 854. The perimeter pad 854 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 814 may be disposed on portions of the bottom and sides of the die 824. The perimeter metallization 814 is coupled to a seal 834, which is configured as solder extending to the perimeter metallization 814 on the sides of the die 824. The perimeter metallization 814 is coupled to the seal 834, which is coupled to the package substrate 844 outside the perimeter of the cavity 864. In this configuration, a heat sink 874 (or multiple heat sinks) (which may be configured as a hollow tube or hollow through-hole) may be used to control the air within the cavity during manufacturing. The heat slug 874 is sealed at the bottom with a heat slug seal, which may be solder or any suitable material.

[0056] refer to Fig. 8E , the die 825 has a perimeter metallization 815 (e.g., a copper metallization). The perimeter metallization 815 may optionally have a perimeter pad 855. The perimeter pad 855 allows for a larger solder volume, which can improve electrical conductivity, thermal conductivity, and increased mechanical strength. The perimeter metallization 815 can be disposed on the side of the die 825. The perimeter metallization 815 is coupled to a seal 835, which is configured as solder extending to the perimeter metallization 815 on the side of the die 825. The perimeter metallization 815 is coupled to the seal 835, which is coupled to the package substrate 845. A heat sink 875 (or multiple heat sinks), which may be configured as a hollow tube or a hollow through hole. The heat sink 875 is closed at the bottom with a heat sink seal, which may be solder or any suitable material. In this configuration, it should be noted that the die 825 is at least partially embedded in the cavity 865. This provides a greater height reduction than a configuration where the die is located on top of the package substrate 845. In a further aspect, the die can be embedded in the cavity 865, and the perimeter metallization 815 and the seal 835 can be coupled to the sidewalls of the cavity 865, as discussed herein.

[0057] It should be appreciated that the foregoing examples are not intended to limit the various aspects disclosed, and that various alternatives will be apparent to those skilled in the art. For example, in various aspects, the perimeter metallization may include at least one of a plurality of conductive posts, a conductive film, a sputtered conductive layer, may be part of a copper-tin-copper bond, or any other suitable conductive structure. In some aspects, the perimeter metallization includes at least one of copper, silver, tin, gold, aluminum, solder, an alloy, or a combination thereof. In some aspects, the sealing portion includes at least one of solder, silver, tin, solder paste, silver paste, a polymer, or a combination thereof. Therefore, it should be appreciated that the foregoing explanations are provided only as examples to help explain the various aspects, and should not be construed as limiting the various aspects to the provided combinations, components, and / or arrangements.

[0058] Fig. 9Components of an integrated device 900 in accordance with one or more aspects of the present disclosure are illustrated. Regardless of the various configurations of single die or multi-die packages discussed above, it should be appreciated that the package substrate 920 can be configured to couple the die 910 to a printed circuit board 990 (PCB 990). The die 910 can include a perimeter metallization 912 that is coupled to a seal 914 that is coupled to the package substrate 920. The PCB 990 is also coupled to a power source 980 (e.g., a power management integrated circuit (PMIC)), which allows the package substrate 920 and the die 910 to be electrically coupled to the PMIC 980. Specifically, one or more power (VDD) lines 991 and one or more ground (GND) lines 992 may be coupled to the PMIC 980 to distribute power to the PCB 990, to the package substrate 920 via the VDD BGA pins 925 and the GND BGA pins 927, and to the die 910 coupled to the top metal layer / M1 layer 926 of the package substrate 920. The package substrate 920 has a bottom metal layer 922 and may have one or more internal metal layers 924, as is known in the art. It should be appreciated that the various aspects disclosed are not limited to any particular number of metal layers in the package substrate 920. The VDD line 991 and the GND line 992 may each be formed by a trace, shape, or pattern in one or more metal layers (e.g., layers 1-6) of the PCB 990, which are coupled by one or more vias through insulating layers that separate the metal layers 1-6 in the PCB 990. PCB 990 may have one or more PCB capacitors (PCB cap) 995, which may be used to condition power signals, as known to those skilled in the art. Additional connections and devices may be coupled to package substrate 920 via one or more additional BGA pins (not illustrated) on package substrate 920 and / or pass through PCB 990 to package substrate 920. It will be understood that the illustrated configurations and descriptions are provided merely to help illustrate the various aspects disclosed herein. For example, PCB 990 may have more or fewer metal layers and insulating layers, there may be multiple lines to supply power to various components, and so on. Accordingly, the above illustrative examples and associated drawings should not be interpreted as limiting the various aspects disclosed and claimed herein.

[0059] In order to fully explain the various aspects of the design of the present disclosure, manufacturing methods are discussed herein in conjunction with the various aspects disclosed. Other manufacturing methods are also possible, and the manufacturing methods discussed are presented only to assist in understanding the concepts disclosed herein. It should be appreciated that any manufacturing process discussed is provided only as a general explanation of some aspects of the present disclosure and is not intended to limit the present disclosure or the appended claims. Further, many details of the manufacturing processes known to those skilled in the art may be omitted or combined in each summary process section to facilitate understanding of the various aspects disclosed without having to present every detail and / or all possible process variations in detail.

[0060] From the foregoing, it can be appreciated that there are various methods for making the devices disclosed herein. Fig.10 A flow chart of a method 1000 for manufacturing an apparatus (e.g., 100, 200, 300, 400, 500, 600) is illustrated. The method may include forming a die at block 1002. It should be appreciated that the forming may include obtaining a previously provided / formed die, as many components may be manufactured at different factories / fabrication facilities. The method further includes forming a perimeter metallization on the perimeter of the die at block 1004. The formation of the perimeter metallization may be performed by any of the techniques discussed herein or any suitable process known in the art, which may vary depending on the specific configuration, e.g., Cu pillars, Cu traces / plates. The method further includes forming a packaging substrate at block 1006. It should be appreciated that the forming may include providing / obtaining a previously formed die, as many components may be manufactured at different factories / fabrication facilities. The method further includes coupling a sealing portion to the perimeter metallization and the packaging substrate at block 1008, wherein the sealing portion is configured to seal the die to the packaging substrate. Coupling the seal to the perimeter metallization and the package substrate may be performed by any of the techniques discussed herein or any suitable process known in the art, which may vary depending on the specific configuration, e.g., solder balls, solder paste, silver paste, solder printing, etc. It will be appreciated that the foregoing manufacturing methods are provided at a high level to highlight the manufacture of the general novel aspects of the various aspects disclosed, and are not intended to provide detailed manufacturing instructions, which may vary according to various designs as known in the art.

[0061] Accordingly, it will be appreciated from the above disclosure that additional processes for manufacturing the various aspects disclosed herein will be apparent to those skilled in the art, and a literal reproduction of detailed processes related to the processes discussed above will not be provided or illustrated in the included figures. It will be appreciated that the sequence of manufacturing processes is not necessarily in any order, and for convenience, later processes may be discussed earlier to provide an example of the breadth of the various aspects disclosed.

[0062] The devices and functionality disclosed above may be designed and stored in computer files (e.g., register transfer level (RTL), geometry data flow (GDS) Gerber, etc.) stored on a computer readable medium. Some or all of such files may be provided to a manufacturing processor that manufactures devices based on such files. The resulting products may include various components including semiconductor wafers, which are then cut into semiconductor dies and packaged into semiconductor packages, integrated devices, package-on-package devices, system-on-chip devices, etc., which may then be used in the various devices described herein.

[0063] It will be appreciated that the various aspects disclosed herein may be described as functional equivalents of structures, materials, and / or devices described and / or recognized by those skilled in the art. For example, in one aspect, equipment may include means for performing the various functionalities discussed above. It will be appreciated that the foregoing aspects are provided only as examples, and the claimed aspects are not limited to the specific references and / or illustrations cited as examples.

[0064] Fig.11 An exemplary mobile device according to some examples of the present disclosure is illustrated. Fig.11 , a block diagram of a mobile device configured according to exemplary aspects is depicted and generally designated as mobile device 1100. In some aspects, mobile device 1100 can be configured as a wireless communication device. As shown, mobile device 1100 includes processor 1101. Processor 1101 can be communicatively coupled to memory 1132 over a link, which can be a die-to-die or chip-to-chip link. Mobile device 1100 also includes a display 1128 and a display controller 1126, wherein display controller 1126 is coupled to processor 1101 and display 1128.

[0065] In some respects, Fig.11 It may include: a coder / decoder (CODEC) 1134 (e.g., an audio and / or voice CODEC) coupled to the processor 1101; a speaker 1136 and a microphone 1138 coupled to the CODEC 1134; and a wireless circuit 1140 coupled to a wireless antenna 1142 and the processor 1101 (which may include a modem, RF circuitry, filters, etc., which may be implemented using one or more sealed die configurations (e.g., solder sealed chip encapsulation) including acoustic filter technology (e.g., BAW, SAW, etc.) as disclosed herein).

[0066] In certain aspects, where one or more of the above blocks are present, the processor 1101, display controller 1126, memory 1132, CODEC 1134, and wireless circuit 1140 may be included in a system-level package or system-on-chip device 1122, which may be implemented in whole or in part using various aspects disclosed herein. Input device 1130 (e.g., physical, or virtual keyboard), power supply 1144 (e.g., battery), display 1128, input device 1130, speaker 1136, microphone 1138, wireless antenna 1142, and power supply 1144 may be located external to the system-on-chip device 1122 and may be coupled to components (such as interfaces or controllers) of the system-on-chip device 1122.

[0067] It should be noted that although Fig.11 A mobile device 1100 is depicted, but the processor 1101 and memory 1132 may also be integrated into a set-top box, music player, video player, entertainment unit, navigation device, personal digital assistant (PDA), fixed location data unit, computer, laptop, tablet device, communication device, mobile phone, or other similar device.

[0068] Fig.12 Various electronic devices that may be integrated with any of the foregoing single-die / multi-die / molded multi-chip devices according to various examples of the present disclosure are illustrated. For example, a mobile phone device 1202, a laptop device 1204, and a fixed location terminal device 1206 may each be generally considered as a user equipment (UE) and may include a semiconductor device 1200 described herein. The semiconductor device 1200 may be, for example, any of an integrated circuit, a die, an integrated device, an integrated device package, an integrated circuit device, a device package, an integrated circuit (IC) package, a single-die / multi-die / molded multi-chip device, etc. described herein. Fig.12 The devices 1202, 1204, 1206 illustrated in the figure are merely exemplary. Other electronic devices can also feature the semiconductor device 1200, including, but not limited to, a group of devices (e.g., electronic devices) including: mobile devices, handheld personal communication system (PCS) units, portable data units (such as personal digital assistants), devices enabled with a global positioning system (GPS), navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units (such as meter reading equipment), communication devices, smart phones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in motor vehicles (e.g., autonomous vehicles), Internet of Things (IoT) devices, or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0069] It will be appreciated that the various aspects disclosed herein may be described as functional equivalents of structures, materials, and / or devices described and / or recognized by those skilled in the art. For example, in one aspect, equipment may include means for performing the various functionalities discussed above. It will be appreciated that the foregoing aspects are provided only as examples, and the claimed aspects are not limited to the specific references and / or illustrations cited as examples.

[0070] Figure 1A-Figure 12 One or more of the components, processes, features, and / or functions described herein may be rearranged and / or combined into a single component, process, feature, or function, or incorporated into several components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that Figure 1A-12 and its corresponding description in this disclosure are not limited to die and / or IC. In some implementations, Figure 1A-Figure 12 The invention and the corresponding description may be used to manufacture, create, provide and / or produce an integrated device. In some implementations, the device may include a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a system-in-package (SiP), a system-on-chip (SoC), a package-on-package (PoP) device, and the like.

[0071] As used herein, the terms "user equipment" (or "UE"), "user device", "user terminal", "client device", "communication device", "wireless device", "wireless communication device", "handheld device", "mobile device", "mobile terminal", "mobile station", "handset", "access terminal", "subscriber device", "subscriber terminal", "subscriber station", "terminal" and variations thereof may interchangeably refer to any suitable mobile or stationary device capable of receiving wireless communications and / or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communication devices, smart phones, personal digital assistants, fixed location terminals, tablet computers, computers, wearable devices, laptop computers, servers, onboard devices in motor vehicles, and / or other types of portable electronic devices typically carried by an individual and / or having communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms are also intended to include a device that communicates with another device that is capable of receiving wireless communications and / or navigation signals (such as through a short-range wireless, infrared, wired connection, or other connection), regardless of whether satellite signal reception, assistance data reception, and / or positioning-related processing occurs at the device or at the other device. A UE can be implemented by any of several types of devices including, but not limited to, a printed circuit (PC) card, a compact flash device, an external or internal modem, a wireless or wired phone, a smart phone, a tablet device, a consumer tracking device, an asset tag, etc.

[0072] Wireless communication between electronic devices may be based on different technologies, such as code division multiple access (CDMA), W-CDMA, time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiplexing (OFDM), global system for mobile communications (GSM), 3GPP long term evolution (LTE), 5G new radio, Bluetooth (BT), Bluetooth low energy (BLE), IEEE 802.11 (WiFi) and IEEE 802.15.4 (Zigbee / Thread), or other protocols that may be used in wireless communication networks or data communication networks. Bluetooth low energy (also known as Bluetooth LE, BLE and Bluetooth Smart).

[0073] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any detail described herein as "exemplary" is not to be construed as trumping other examples. Likewise, the term "example" does not imply that all examples include the discussed features, advantages, or modes of operation. Furthermore, particular features and / or structures may be combined with one or more other features and / or structures. Furthermore, at least a portion of the apparatus described herein may be configured to perform at least a portion of the methods described herein.

[0074] It should be noted that the terms "connected", "coupled" or any variations thereof mean any connection or coupling, direct or indirect, between elements, and may encompass the presence of intermediate elements between two elements via which the two elements are "connected" or "coupled" together, unless the connection is explicitly disclosed as a direct connection.

[0075] Any reference to an element using designations such as "first," "second," etc. herein does not limit the quantity and / or order of those elements. Rather, these designations are used as a convenient method of distinguishing two or more elements and / or element instances. Likewise, unless otherwise stated, a set of elements may include one or more elements.

[0076] Those skilled in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0077] Nothing described or illustrated in this application is intended to confer upon the public any component, act, feature, benefit, advantage, or equivalent, regardless of whether such component, act, feature, benefit, advantage, or equivalent is recited in the claims.

[0078] In addition, those skilled in the art will appreciate that the various illustrative logic blocks, modules, circuits, and algorithmic actions described in conjunction with the examples disclosed herein can be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and actions are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician can implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0079] Although some aspects have been described in conjunction with the device, it will be understood that these aspects also constitute the description of the corresponding method, and therefore the block or component of the device should also be understood as the corresponding method action or the feature of the method action. Similarly, the various aspects described in conjunction with or as the method action also constitute the description of the corresponding block or details or features of the corresponding device. Some or all of the method actions can be performed by hardware devices (or using hardware devices), such as, for example, microprocessors, programmable computers or electronic circuits. In some examples, some or more of the most important method actions can be performed by such devices.

[0080] In the above detailed description, it can be seen that different features are grouped together in each example. This disclosure should not be understood as an intention that the example clauses have more features than the features explicitly mentioned in each clause. On the contrary, various aspects of the present disclosure may include less than all the features of the disclosed individual example clauses. Therefore, the attached clauses should be considered to be incorporated into this description, wherein each clause itself may be a separate example. Although each subordinate clause can be cited in each clause with a specific combination of one of the other clauses, the (all) aspects of the subordinate clause are not limited to the specific combination. It will be appreciated that other example clauses may also include a combination of the subject matter of the subordinate clause (all) aspects with any other subordinate clause or independent clause or any feature with other subordinate and independent clauses. Various aspects disclosed herein explicitly include these combinations, unless explicitly expressed or can be easily inferred that it is not intended to be a specific combination (e.g., contradictory aspects, such as defining an element as both an electrical insulator and an electrical conductor). In addition, it is also intended that the various aspects of the clause may be included in any other independent clause, even if the clause is not directly subordinate to the independent clause.

[0081] Various implementation examples are described in the following numbered clauses.

[0082] Clause 1. An apparatus comprising: a die; a perimeter metallization disposed on a perimeter of the die; a packaging substrate; and a seal coupled to the perimeter metallization and the packaging substrate, wherein the seal is configured to seal the die to the packaging substrate.

[0083] Clause 2. The apparatus of Clause 1, further comprising: a cavity disposed in the packaging substrate, wherein the die is disposed on an open side of the cavity and the seal is configured to seal the cavity.

[0084] Clause 3. The apparatus of clause 2, further comprising: a plurality of resonators disposed on a surface of the die sealed with the cavity.

[0085] Clause 4. The device of Clause 3, wherein the die and the packaging substrate form at least one of a bulk acoustic wave (BAW) acoustic filter or a surface acoustic wave (SAW) acoustic filter.

[0086] Clause 5. The device of any of Clauses 2 to 4, wherein the die is at least partially embedded in the cavity.

[0087] Clause 6. The device of Clause 5, wherein the perimeter metallization is disposed at least partially on one side of the die.

[0088] Clause 7. The device of Clause 6, wherein the seal is at least partially coupled to a sidewall of the cavity.

[0089] Clause 8. The device of any of Clauses 2 to 7, wherein: the die is disposed over the cavity.

[0090] Clause 9. The device of Clause 8, wherein the perimeter metallization is disposed on a bottom portion of the die facing the packaging substrate.

[0091] Clause 10. The apparatus of Clause 9, wherein the seal is at least partially coupled to a top side of the package substrate facing the die.

[0092] Clause 11. The apparatus of any of Clauses 2 to 10, further comprising: a heat slug disposed in the packaging substrate, wherein the heat slug is configured to allow access to the cavity through the packaging substrate.

[0093] Clause 12. The apparatus of clause 11, further comprising: a heat slug seal configured to seal the heat slug and the cavity.

[0094] Clause 13. The apparatus of any of Clauses 1 to 12, further comprising: an electromagnetic shield disposed over the die and at least partially over the packaging substrate.

[0095] Clause 14. The device of Clause 13, wherein the electromagnetic shield is disposed between the die and the package encapsulant.

[0096] Clause 15. The apparatus of any of Clauses 1 to 14, further comprising: a packaging encapsulant disposed over the die and at least partially over the packaging substrate.

[0097] Clause 16. The device of any of Clauses 1 to 15, wherein the perimeter metallization further comprises a plurality of perimeter pads.

[0098] Clause 17. The device of any of Clauses 1 to 16, wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, an alloy, or a combination thereof.

[0099] Item 18. The device of any of Items 1 to 17, wherein the perimeter metallization comprises at least one of a plurality of conductive posts, a conductive film, a sputtered conductive layer, a portion of a copper-tin-copper joint, or a combination thereof.

[0100] Clause 19. The device of any of Clauses 1 to 18, wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, a polymer, or a combination thereof.

[0101] Clause 20. An apparatus as in any of clauses 1 to 19, wherein the apparatus comprises at least one of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

[0102] Clause 21. A method for manufacturing a device, the method comprising: forming a die; forming a perimeter metallization on a perimeter of the die; forming a packaging substrate; and coupling a seal to the perimeter metallization and the packaging substrate, wherein the seal is configured to seal the die to the packaging substrate.

[0103] Clause 22. The method of Clause 21, further comprising: forming a cavity disposed in the packaging substrate, wherein the die is disposed on an open side of the cavity and the sealing portion is configured to seal the cavity.

[0104] Clause 23. The method of Clause 22, further comprising: forming a plurality of resonators disposed on a surface of the die sealed with the cavity.

[0105] Clause 24. The method of Clause 23, wherein the die and the packaging substrate form at least one of a bulk acoustic wave (BAW) acoustic filter or a surface acoustic wave (SAW) acoustic filter.

[0106] Clause 25. The method of any of Clauses 22 to 24, wherein the die is at least partially embedded in the cavity.

[0107] Clause 26. The method of Clause 25, wherein the perimeter metallization is disposed at least partially on one side of the die.

[0108] Clause 27. The method of Clause 26, wherein the seal is at least partially coupled to a sidewall of the cavity.

[0109] Clause 28. The method of any of Clauses 22 to 27, wherein the die is disposed over the cavity.

[0110] Item 29. The method of Item 28, wherein the perimeter metallization is disposed on a bottom portion of the die facing the packaging substrate.

[0111] Clause 30. The method of Clause 29, wherein the encapsulation portion is at least partially coupled to a top side of the packaging substrate facing the die.

[0112] Clause 31. The method of any of Clauses 22 to 30, further comprising: forming a heat slug disposed in the packaging substrate, wherein the heat slug is configured to allow access to the cavity through the packaging substrate.

[0113] Clause 32. The method of Clause 31, further comprising: forming a heat slug seal configured to seal the heat slug and the cavity.

[0114] Clause 33. The method of any of Clauses 21 to 32, further comprising: forming an electromagnetic shield disposed over the die and at least partially over packaging substrate 340 .

[0115] Clause 34. The method of Clause 33, wherein the electromagnetic shield is disposed between the die and the package encapsulant.

[0116] Clause 35. The method of any of Clauses 21 to 34, further comprising: disposing a packaging encapsulant over the die and at least partially over the packaging substrate.

[0117] Clause 36. The method of any one of Clauses 21 to 35, wherein the perimeter metallization further comprises a plurality of perimeter pads.

[0118] Clause 37. The method of any of Clauses 21 to 36, wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, an alloy, or a combination thereof.

[0119] Item 38. The method of any one of Items 21 to 37, wherein the perimeter metallization comprises at least one of a plurality of conductive posts, a conductive film, a sputtered conductive layer, a portion of a copper-tin-copper bond, or a combination thereof.

[0120] Clause 39. The method of any of Clauses 21 to 38, wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, a polymer, or a combination thereof.

[0121] Clause 40. A method as in any of clauses 21 to 39, wherein the device comprises at least one of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

[0122] It should also be noted that the methods, systems and devices disclosed in the description or claims may be implemented by a device including means for performing the corresponding actions and / or functionalities of the disclosed methods.

[0123] In addition, in some examples, an individual action may be subdivided into or include multiple sub-actions. Such sub-actions may be included in and may be part of the disclosure of the individual action.

[0124] Although the foregoing disclosure shows illustrative aspects of the present disclosure, it should be noted that various changes and modifications may be made therein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps, and / or actions in the method claims according to the various aspects of the present disclosure described herein do not have to be performed in any particular order. In addition, although the elements of the present disclosure may be described or claimed in the singular, the plural is also contemplated unless it is explicitly stated to be limited to the singular.

Claims

1. A device comprising: Die; a perimeter metallization disposed on a perimeter of the die; Package substrate; as well as A seal is coupled to the perimeter metallization and the packaging substrate, wherein the seal is configured to seal the die to the packaging substrate.

2. The apparatus of claim 1, further comprising: A cavity is disposed in the packaging substrate, wherein the die is disposed on an open side of the cavity and the sealing portion is configured to seal the cavity.

3. The apparatus of claim 2, further comprising: A plurality of resonators are disposed on a surface of the die sealed with the cavity.

4. The apparatus of claim 3, wherein the die and the packaging substrate form at least one of a bulk acoustic wave (BAW) acoustic filter or a surface acoustic wave (SAW) acoustic filter.

5. The apparatus of claim 2, wherein the die is at least partially embedded in the cavity.

6. The apparatus of claim 5, wherein the perimeter metallization is disposed at least partially on one side of the die. The apparatus of claim 6 , wherein the seal is at least partially coupled to a sidewall of the cavity.

8. The apparatus of claim 2, wherein the die is disposed over the cavity.

9. The apparatus of claim 8, wherein the perimeter metallization is disposed on a bottom portion of the die facing the packaging substrate.

10. The apparatus of claim 9, wherein the sealing portion is at least partially coupled to a top side of the package substrate facing the die.

11. The apparatus of claim 2, further comprising: A heat slug is disposed in the packaging substrate, wherein the heat slug is configured to allow access to the cavity through the packaging substrate.

12. The apparatus of claim 11, further comprising: A heat slug sealing portion is configured to seal the heat slug and the cavity.

13. The apparatus of claim 1, further comprising: An electromagnetic shield is disposed over the die and at least partially over the packaging substrate.

14. The apparatus of claim 13, wherein the electromagnetic shield is disposed between the die and a package encapsulant.

15. The apparatus of claim 1, further comprising: A packaging encapsulant is disposed over the die and at least partially over the packaging substrate.

16. The apparatus of claim 1, wherein the perimeter metallization further comprises a plurality of perimeter pads.

17. The device of claim 1, wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, an alloy, or combinations thereof.

18. The device of claim 1, wherein the perimeter metallization comprises at least one of a plurality of conductive posts, a conductive film, a sputtered conductive layer, a portion of a copper-tin-copper joint, or a combination thereof.

19. The device of claim 1, wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, polymer, or a combination thereof.

20. The apparatus of claim 1, wherein the apparatus comprises at least one of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

21. A method for manufacturing a device, the method comprising: forming a tube core; forming a perimeter metallization on a perimeter of the die; forming a packaging substrate; as well as A seal is coupled to the perimeter metallization and the packaging substrate, wherein the seal is configured to seal the die to the packaging substrate.

22. The method of claim 21, further comprising: A cavity is formed in the package substrate, wherein the die is disposed on an open side of the cavity and the sealing portion is configured to seal the cavity.

23. The method of claim 22, further comprising: A plurality of resonators are formed and disposed on a surface of the die sealed with the cavity.

24. The method of claim 23, wherein the die and the packaging substrate form at least one of a bulk acoustic wave (BAW) acoustic filter or a surface acoustic wave (SAW) acoustic filter.

25. The method of claim 22, wherein the die is at least partially embedded in the cavity.

26. The method of claim 25, wherein the perimeter metallization is disposed at least partially on one side of the die.

27. The method of claim 26, wherein the seal is at least partially coupled to a sidewall of the cavity.

28. The method of claim 22, wherein the die is disposed over the cavity.

29. The method of claim 28, wherein the perimeter metallization is disposed on a bottom portion of the die facing the packaging substrate.

30. The method of claim 29, wherein the encapsulation is at least partially coupled to a top side of the package substrate facing the die.

31. The method of claim 22, further comprising: A heat slug disposed in the packaging substrate is formed, wherein the heat slug is configured to allow access to the cavity through the packaging substrate.

32. The method of claim 31 further comprising: A heat slug seal is formed, which is configured to seal the heat slug and the cavity.

33. The method of claim 21, further comprising: An electromagnetic shield is formed and disposed over the die and at least partially over the packaging substrate.

34. The method of claim 33, wherein the electromagnetic shield is disposed between the die and a package encapsulant.

35. The method of claim 21, further comprising: A packaging encapsulant is disposed over the die and at least partially over the packaging substrate.

36. The method of claim 21 wherein the perimeter metallization further comprises a plurality of perimeter pads.

37. The method of claim 21, wherein the perimeter metallization comprises at least one of copper, silver, tin, gold, aluminum, solder, an alloy, or combinations thereof.

38. The method of claim 21, wherein the perimeter metallization comprises at least one of a plurality of conductive posts, a conductive film, a sputtered conductive layer, a portion of a copper-tin-copper joint, or a combination thereof.

39. The method of claim 21, wherein the seal comprises at least one of solder, silver, tin, solder paste, silver paste, polymer, or a combination thereof.

40. The method of claim 21, wherein the device comprises at least one of: a music player, a video player, an entertainment unit, a navigation device, a communication device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, an access point, a base station, or a device in a motor vehicle.

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