High-temperature and high-pressure micro-nano fluidic chip holder device

Abstract

The invention relates to the technical field of micro-nano fluidic chips, and discloses a high-temperature and high-pressure micro-nano fluidic chip holder device which comprises a test base, the inner surface of the test base is fixedly connected with a dust-free material placing plate, the inner surface of the test base is fixedly connected with an electric push rod, the inner surface of the test base is fixedly connected with a sleeve, and the inner surface of the sleeve is fixedly connected with a clamping device. According to the invention, the clamping elastic plates clamp the micro-nano fluidic chip, so that the micro-nano fluidic chip is stably placed on the dust-free material placing plate, a fluidic test is convenient to carry out, the transmission connecting plate ascends and drives the multiple clamping elastic plates and the lifting rods to slidably ascend in the sleeve at the same time, the clamping elastic plates are clamped by the clamping elastic plates, and the clamping elastic plates and the lifting rods are clamped by the clamping elastic plates, so that the micro-nano fluidic chip can be stably placed on the dust-free material placing plate, and the micro-nano fluidic chip can be stably placed on the dust-free material placing plate. The clamping elastic plate can clamp and fix the fluidic chips with different thicknesses, the applicability of the device is improved, the screw rod drives the L-shaped clamping plate to be away from the clamping elastic plate through the sleeve shaft, the clamping range of the clamping elastic plate is changed, and the applicability of the device is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of micro-nanofluidic cores, and in particular to a high-temperature and high-pressure micro-nanofluidic chip holder device. Background Art

[0002] Micro-nanofluidic chip technology integrates the basic operating units of biological, chemical and medical analysis processes such as sample preparation, reaction, separation and detection into a micron or nanometer scale chip to automatically complete the entire analysis process. Micro-nanofluidic chips need to be clamped during use to ensure stability. In the existing technology, it is difficult to clamp micro-nanofluidic chips of different thicknesses.

[0003] The patent with announcement number CN115487887 discloses a high-temperature and high-pressure micro-nanofluidic chip clamp device and its temperature and pressure control method. The patent includes a chip sealing component with an annular pressure inner chamber, wherein the annular pressure inner chamber is connected to a fluid inlet and a fluid outlet, and also includes a clamping body, a sealing ring assembly, an injection assembly, a heater connected to an external computer, a first pressure tracking pump and a second pressure tracking pump. A connected annular pressure inner chamber is formed between the mounting cavity of the clamping body and the chip sealing assembly. The injection assembly and the heater are used to provide a driving force to inject fluid and heat the temperature of the supplied fluid. A pressure tracking pump is used to maintain a constant pressure between the fluid inlet and the fluid outlet, and a second pressure tracking pump is used to apply confining pressure to the chip. Visual detection of the seepage state in the micro-nano pores is achieved through an optical microscope. Through scheme optimization, new technical means and good technical guarantees are provided for truly simulating the high temperature and high pressure environment of underground reservoirs and studying the microscopic seepage mechanism. Although this patent solves the above problems, it is still difficult to clamp micro-nanofluidic chips of different thicknesses and has low applicability. Therefore, a high temperature and high pressure micro-nanofluidic chip clamp device is proposed to solve the above problems. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a high-temperature and high-pressure micro-nanofluidic chip holder device in view of the deficiencies in the above-mentioned prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a high-temperature and high-pressure micro-nanofluidic chip clamp device, comprising a test base, the inner surface of the test base is fixedly connected to a dust-free material placement plate, the inner surface of the test base is fixedly connected to an electric push rod, the inner surface of the test base is fixedly connected to a sleeve, the inner surface of the sleeve is slidably connected to a lifting rod, the top of the lifting rod is fixedly connected to a clamping spring plate, the inner surface of the clamping spring plate is threadedly connected to a screw, one end of the screw is rotatably connected to A sleeve shaft, the side of the sleeve shaft away from the clamping spring plate is fixedly connected with an L-shaped clamping plate, the side of the L-shaped clamping plate close to the clamping spring plate is fixedly connected with a guide rod, the inner surface of the L-shaped clamping plate is slidably connected with a sliding rod, the end of the sliding rod away from the clamping spring plate is fixedly connected with a contact plate, the upper surface of the clamping spring plate is fixedly connected with a lifting connecting plate, the upper surface of the clamping spring plate is fixedly connected with a transmission connecting plate, and a guide tube fixing device for fixing and clamping the guide tube connected to the micro-nano fluidic chip is arranged above the test base A test protection device for protecting the micro-nano fluidic chip during the test is arranged above the test base, the free end of the electric push rod is fixedly connected to the clamping spring plate, the guide rod is slidably connected to the inner surface of the clamping spring plate, a spring is arranged between the contact plate and the L-shaped clamping plate, and the two ends of the lifting connecting plate and the transmission connecting plate are fixedly connected. The micro-nano fluidic chip is placed on the dust-free material placement plate, and the micro-nano fluidic chip is clamped by the clamping spring plate so that the micro-nano fluidic chip is stably placed on the dust-free material placement plate, and the electric push rod is started. The electric push rod drives the clamping spring plate to rise, and the clamping spring plate drives the transmission connecting plate to rise. When the transmission connecting plate rises, it drives multiple clamping spring plates and the lifting rod to slide and rise in the sleeve, and the screw rod is rotated. The screw rod drives the L-shaped clamping plate away from the clamping spring plate through the sleeve shaft. When the L-shaped clamping plate is close to the fluid control chip, the sliding rod drives the resistance plate to approach the fluid control chip. When the fluid control chip deviates, the resistance plate is pushed by the fluid control chip to approach the clamping spring plate. At this time, the elastic reset effect of the spring pushes the resistance plate to reset, and the resistance plate pushes the fluid control chip to reset.

[0006] The cam is connected to the upper and lower ends of the lifting plate, and the cam is connected to the upper and lower ends of the lifting plate by a spring, and the cam is connected to the lower and lower ends of the lifting plate by a spring. The rotating rod is driven by the lifting plate and the sliding plate is driven by the lifting plate, and the lifting plate is driven by the lifting plate to move up and down, and the lifting plate drives the rotating rod to move up and down, and the rotating rod drives the guiding tube to move up and down through the rotating half roller one and the rotating half roller two, thereby changing the height of the guiding tube so that the guiding tube can be docked with the flow control chips of different thicknesses, and rotating the rotating rod, and the rotating rod drives the guiding tube to rotate a certain angle through the rotating half roller one and the rotating half roller two, and the lifting of the rotating rod drives the lifting plate and the sliding plate to slide and lift in the limiting shell, so that the rotating half roller one and the rotating half roller two are more stable during the height adjustment process.

[0007] The folding plate is fixedly connected to the upper surface of the test base, the folding plate is folded to the upper surface of the test base, the folding plate is fixedly connected to the upper surface of the test base, the folding plate is fixedly connected to the upper surface of the test base, the folding plate is fixedly connected to the upper surface of the test base, and the folding plate is fixedly connected to the upper surface of the test base. The protective top plate protects the top of the fluidic chip and pushes the protective top plate up and down. The protective top plate slides on the support rod through the sliding shaft and adjusts the height, so that the protective top plate can protect fluidic chips of different thicknesses. The lifting plate drives the push plate to move up and down during the up and down sliding process. When the push plate rises, it pushes the protective top plate to move upward. When the push plate falls, the protective top plate falls under the influence of gravity, so that the protective top plate automatically rises and falls according to the thickness of the fluidic chip. The closed sliding frame is slid open, and the guide tube is inserted from the top of the protective top plate to the bottom of the protective top plate, so that the guide tube is connected to the fluidic chip while protecting the fluidic chip. The protective side plate one and the protective side plate two protect the sides of the fluidic chip to further prevent the fluidic chip from being affected. After the protective top plate rises, the protective side plate one and the protective side plate two are driven to rise. At this time, the folding side plate one and the folding side plate two are rotated and lowered. When the protective side plate one and the protective side plate two fall, the folding side plate one and the folding side plate two are rotated and lifted, and the folding side plate one and the folding side plate two are folded.

[0008] The present invention adopts the above technical solution to bring the following beneficial effects: 1. The high-temperature and high-pressure micro-nanofluidic chip clamp device has a clamping spring plate that clamps the micro-nanofluidic chip, so that the micro-nanofluidic chip can be stably placed on a dust-free material placement plate, which is convenient for fluidic testing. When the transmission connecting plate rises, it drives multiple clamping spring plates and lifting rods to slide and rise in the sleeve, so that the clamping spring plate can clamp and fix fluidic chips of different thicknesses, thereby improving the applicability of the device. The screw drives the L-shaped clamping plate away from the clamping spring plate through the sleeve shaft, thereby changing the clamping range of the clamping spring plate, further improving the applicability of the device. The elastic reset action of the spring pushes the contact plate to reset, and the contact plate then pushes the fluidic chip to reset, thereby preventing the fluidic chip from being greatly offset during the test and improving the accuracy of the use of the fluidic chip.

[0009] 2. The high-temperature and high-pressure micro-nanofluidic chip clamp device has a flexible clamping pad that clamps the guide tube, fixes the guide tube without causing damage to the guide tube, improves the stability of the guide tube when inputting fluid into the fluidic chip, and thus improves the use effect of the fluidic chip. The rotating rod drives the guide tube to move up and down by rotating half roller one and rotating half roller two, thereby changing the height of the guide tube so that the guide tube can be docked with fluidic chips of different thicknesses, improving the applicability of the device. The rotating rod drives the guide tube to rotate a certain angle by rotating half roller one and rotating half roller two to prevent the guide tube from loosening during use and affecting the use of the fluidic chip. The slide slides up and down in the limiting housing, making the rotating half roller one and rotating half roller two more stable during the height adjustment process to prevent the guide tube from being damaged.

[0010] 3. The high-temperature and high-pressure micro-nanofluidic chip clamp device has a protective top plate that protects the top of the fluidic chip to prevent impurities from falling onto the fluidic chip during the test and affecting the test effect of the fluidic chip. The protective top plate can protect fluidic chips of different thicknesses, thereby improving the protective effect. The protective top plate automatically rises and falls according to the thickness of the fluidic chip, thereby improving the ease of use of the device. The closed sliding frame is slid open, and the guide tube is inserted from the top of the protective top plate to the bottom of the protective top plate, thereby facilitating the connection of the guide tube to the fluidic chip while protecting the fluidic chip, thereby further improving the ease of use of the device. The protective side plates 1 and 2 protect the sides of the fluidic chip, thereby further preventing the fluidic chip from being affected and improving the protective effect. The folding side plates 1 and 2 are rotated and lowered to increase the protection area. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the present invention; Figure 3 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the test base of the present invention; Figure 4 For the present invention Figure 3 A is a schematic diagram of the enlarged structure of the middle part; Figure 5 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the flow guide pipe fixing device of the present invention; Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure of B; Figure 7 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the test protection device of the present invention.

[0012] In the figure: 1. test base; 2. dust-free material placement plate; 3. electric push rod; 4. sleeve; 41. lifting rod; 42. clamping spring plate; 43. screw; 44. sleeve shaft; 45. L-shaped clamping plate; 46. guide rod; 47. slide rod; 48. contact plate; 49. lifting connecting plate; 410. transmission connecting plate; 5. guide tube fixing device; 51. rotating rod; 52. rotating half roller one; 53. rotating half roller two; 54. flexible clamping pad; 55. limiting sleeve shell; 56. lifting plate; 57. slide plate; 58. contact spring; 59. push plate; 6. test protection device; 61. support rod; 62. sliding shaft; 63. limiting shaft; 64. protective top plate; 65. closed sliding frame; 66. protective side plate one; 67. folding side plate one; 68. protective side plate two; 69. folding side plate two. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] See also Figure 1-Figure 7One embodiment of the present invention is: a high-temperature and high-pressure micro-nanofluidic chip clamp device, comprising a test base 1, a dust-free material placement plate 2 is fixedly connected to the inner surface of the test base 1, an electric push rod 3 is fixedly connected to the inner surface of the test base 1, a sleeve 4 is fixedly connected to the inner surface of the test base 1, a lifting rod 41 is slidably connected to the inner surface of the sleeve 4, a clamping spring plate 42 is fixedly connected to the top of the lifting rod 41, a screw 43 is threadedly connected to the inner surface of the clamping spring plate 42, one end of the screw 43 is rotatably connected to a sleeve shaft 44, and the sleeve shaft 44 is away from the clamping spring. An L-shaped clamping plate 45 is fixedly connected to one side of the plate 42, a guide rod 46 is fixedly connected to the side of the L-shaped clamping plate 45 close to the clamping spring plate 42, a sliding rod 47 is slidably connected to the inner surface of the L-shaped clamping plate 45, and a contact plate 48 is fixedly connected to the end of the sliding rod 47 away from the clamping spring plate 42, a lifting connecting plate 49 is fixedly connected to the upper surface of the clamping spring plate 42, and a transmission connecting plate 410 is fixedly connected to the upper surface of the clamping spring plate 42. The clamping spring plate 42 clamps the micro-nanofluidic chip so that the micro-nanofluidic chip is stably placed on the dust-free material placement plate 2, which is convenient for fluidic test. As the transmission connecting plate 410 rises, it drives multiple clamping spring plates 42 and lifting rods 41 to slide and rise in the sleeve 4, so that the clamping spring plates 42 can clamp and fix fluidic chips of different thicknesses, thereby improving the applicability of the device. A guide tube fixing device 5 for fixing and clamping a guide tube connected to the micro-nano fluidic chip is arranged above the test base 1. A test protection device 6 for protecting the micro-nano fluidic chip during the test is arranged above the test base 1. The free end of the electric push rod 3 is fixedly connected to the clamping spring plate 42, and the guide rod 46 is slidably connected to the inner surface of the clamping spring plate 42, a spring is arranged between the resistance plate 48 and the L-shaped clamping plate 45, the lifting connecting plate 49 and the transmission connecting plate 410 are fixedly connected at both ends, the screw 43 drives the L-shaped clamping plate 45 away from the clamping spring plate 42 through the sleeve shaft 44, thereby changing the clamping range of the clamping spring plate 42, further improving the applicability of the device, and the elastic reset action of the spring pushes the resistance plate 48 to reset, and the resistance plate 48 then pushes the fluidic control chip to reset, preventing the fluidic control chip from being greatly offset during the test, thereby improving the accuracy of the use of the fluidic control chip.

[0015] Working principle: Place the micro-nanofluidic chip on the dust-free material placement plate 2, clamp the micro-nanofluidic chip through the clamping spring plate 42, so that the micro-nanofluidic chip is stably placed on the dust-free material placement plate 2, which is convenient for fluidic test, start the electric push rod 3, the electric push rod 3 drives the clamping spring plate 42 to rise, the clamping spring plate 42 drives the transmission connecting plate 410 to rise, and the transmission connecting plate 410 rises while driving multiple clamping spring plates 42 and lifting rods 41 to slide and rise in the sleeve 4, so that the clamping spring plate 42 can clamp and fix fluidic chips of different thicknesses, which improves the applicability of the device, and turns the screw 4 3. The screw 43 drives the L-shaped clamping plate 45 away from the clamping spring plate 42 through the sleeve shaft 44, thereby changing the clamping range of the clamping spring plate 42, further improving the applicability of the device. When the L-shaped clamping plate 45 is close to the fluidic chip, the sliding rod 47 drives the contact plate 48 close to the fluidic chip. When the fluidic chip deviates, the contact plate 48 is pushed by the fluidic chip to approach the clamping spring plate 42. At this time, the elastic reset effect of the spring pushes the contact plate 48 to reset, and the contact plate 48 pushes the fluidic chip to reset, preventing the fluidic chip from deviating significantly during the test, thereby improving the accuracy of the use of the fluidic chip.

[0016] See also Figure 1-Figure 7On the basis of the above embodiment, in another embodiment of the present invention, the guide tube fixing device 5 includes a rotating rod 51, a rotating half roller 1 52, a rotating half roller 2 53, and a flexible clamping pad 54. The rotating rod 51 is rotatably connected to the inner surface of the lifting connecting plate 49, the rotating half roller 1 52 is fixedly connected to the end of the rotating rod 51 away from the lifting connecting plate 49, the rotating half roller 2 53 is arranged above the rotating half roller 1 52, and the flexible clamping pad 54 is fixedly connected to the arc surface of the rotating half roller 1 52. The flexible clamping pad 54 clamps the guide tube and fixes the guide tube without damaging the guide tube, thereby improving the stability of the guide tube when inputting fluid into the fluid control chip, thereby improving the use effect of the fluid control chip. The rotating rod 51 drives the guide tube to move up and down through the rotating half roller 1 52 and the rotating half roller 2 53, thereby changing the height of the guide tube so that the guide tube can be docked with fluid control chips of different thicknesses, thereby improving the applicability of the device. The guide tube fixing device 5 also includes a limiting sleeve 55, a lifting The plate 56, the slide plate 57, the resistance spring 58, the push plate 59, the limit sleeve 55 is fixedly connected to the upper surface of the test base 1, the lifting plate 56 is slidably connected to the inner surface of the limit sleeve 55, the slide plate 57 is fixedly connected to the bottom end of the lifting plate 56, the resistance spring 58 is fixedly connected to the lower surface of the slide plate 57, and the push plate 59 is fixedly connected to the top of the lifting plate 56. A spring is arranged between the rotating half roller 1 52 and the rotating half roller 2 53. The flexible clamping pad 54 is fixedly connected to the arc surface of the rotating half roller 2 53. The slide plate 57 is slidably connected to the inner surface of the limit sleeve 55. The bottom end of the resistance spring 58 is fixedly connected to the upper surface of the test base 1. The rotating rod 51 drives the guide tube to rotate a certain angle through the rotating half roller 1 52 and the rotating half roller 2 53 to prevent the guide tube from loosening during use and affecting the use of the flow control chip. The slide plate 57 slides and rises and falls in the limit sleeve 55, so that the rotating half roller 1 52 and the rotating half roller 2 53 are more stable during the height adjustment process to prevent the guide tube from being damaged.

[0017] Working principle: lift the rotating half roller 53 upwards, then place the guide tube between the rotating half roller 1 52 and the rotating half roller 2 53, and lower the rotating half roller 2 53. At this time, the rotating half roller 1 52 and the rotating half roller 2 53 clamp the guide tube through the flexible clamping pad 54 between them, so that the guide tube is fixed without damaging the guide tube, thereby improving the stability of the guide tube when inputting fluid into the fluid control chip, thereby improving the use effect of the fluid control chip. The clamping spring plate 42 moves up and down to drive the lifting connecting plate 49 to move up and down, and the lifting connecting plate 49 drives the rotating rod 51 to move up and down. The rotating rod 51 rotates The half roller 1 52 and the rotating half roller 2 53 drive the guide tube to move up and down, thereby changing the height of the guide tube so that the guide tube can be connected to the flow control chips of different thicknesses, which improves the applicability of the device. The rotating rod 51 is rotated, and the rotating rod 51 drives the guide tube to rotate a certain angle by rotating the half roller 1 52 and the rotating half roller 2 53 to prevent the guide tube from loosening during use and affecting the use of the flow control chip. The lifting and lowering of the rotating rod 51 drives the lifting plate 56 and the slide plate 57 to slide and rise in the limiting sleeve 55, so that the rotating half roller 1 52 and the rotating half roller 2 53 are more stable during the height adjustment process, thereby preventing the guide tube from being damaged.

[0018] See also Figure 1-Figure 7On the basis of the above embodiment, in another embodiment of the present invention, the test protection device 6 includes a support rod 61, a sliding shaft 62, a limiting shaft 63, and a protective top plate 64. The support rod 61 is fixedly connected to the upper surface of the test base 1, the sliding shaft 62 is slidably connected to the circumferential surface of the support rod 61, the limiting shaft 63 is fixedly connected to the top of the support rod 61, and the protective top plate 64 is fixedly connected to the end of the sliding shaft 62 away from the support rod 61. The protective top plate 64 protects the top of the fluidic chip to prevent impurities from falling onto the fluidic chip during the test and affecting the test effect of the fluidic chip. The protective top plate 64 can protect fluidic chips of different thicknesses and improve the protection effect. The protective top plate 64 automatically rises and falls according to the thickness of the fluidic chip, which improves the convenience of use of the device. The test protection device 6 also includes a closed sliding frame 65, a protective side plate 1 66, a folding side plate 1 67, a protective side plate 2 68, and a folding side plate 2 69. The closed sliding frame 65 is slidably connected to the upper surface of the protective top plate 64. The protective side plate A folding side plate 66 is hinged on the front and rear sides of the protective top plate 64, a folding side plate 67 is hinged on the side of the bottom of the protective side plate 66 away from the protective top plate 64, a protective side plate 68 is hinged on the left and right sides of the protective top plate 64, a folding side plate 69 is hinged on the side of the bottom of the protective side plate 68 away from the protective top plate 64, the upper surface of the push plate 59 and the lower surface of the protective top plate 64 are in contact with each other, the bottom end of the protective side plate 66 and the upper surface of the test base 1 are in contact with each other, and the bottom end of the protective side plate 68 and the test base 1 are in contact with each other. The upper surfaces are in contact with each other, and the closed sliding frame 65 is slid open to insert the guide tube from above the protective top plate 64 to below the protective top plate 64, so as to connect the guide tube to the fluidic chip while protecting the fluidic chip, thereby further improving the ease of use of the device. The protective side plate 1 66 and the protective side plate 2 68 protect the sides of the fluidic chip to further prevent the fluidic chip from being affected, thereby improving the protective effect. The folding side plate 1 67 and the folding side plate 2 69 are rotated and lowered to increase the protection area.

[0019] Working principle: During the fluidic chip test, the protective top plate 64 protects the top of the fluidic chip to prevent impurities from falling onto the fluidic chip during the test and affecting the test effect of the fluidic chip. The protective top plate 64 is pushed up and down, and the protective top plate 64 slides on the support rod 61 through the sliding shaft 62 and adjusts the height, so that the protective top plate 64 can protect fluidic chips of different thicknesses, thereby improving the protective effect. During the up and down sliding of the lifting plate 56, the push plate 59 is driven to move up and down. When the push plate 59 rises, it pushes the protective top plate 64 to move upward. When the push plate 59 falls, the protective top plate 64 falls under the influence of gravity, so that the protective top plate 64 automatically rises and falls according to the thickness of the fluidic chip, thereby improving the convenience of using the device. The closed sliding frame 65 inserts the guide tube from the top of the protective top plate 64 to the bottom of the protective top plate 64, so as to facilitate the connection of the guide tube with the fluidic chip while protecting the fluidic chip, thereby further improving the ease of use of the device. The protective side plates 1 66 and 68 protect the sides of the fluidic chip, thereby further preventing the fluidic chip from being affected and improving the protective effect. After the protective top plate 64 rises, it drives the protective side plates 1 66 and 68 to rise. At this time, the folding side plates 1 67 and 69 are rotated and lowered to increase the protective area. When the protective side plates 1 66 and 68 are lowered, the folding side plates 1 67 and 69 are rotated and lifted to fold the folding side plates 1 67 and 69.

[0020] The present invention provides a high-temperature and high-pressure micro-nanofluidic chip clamp device. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A high temperature and high pressure micro-nanofluidic chip holder device, comprising a test base (1), characterized in that: The inner surface of the test base (1) is fixedly connected to a dust-free material placement plate (2), the inner surface of the test base (1) is fixedly connected to an electric push rod (3), the inner surface of the test base (1) is fixedly connected to a sleeve (4), the inner surface of the sleeve (4) is slidably connected to a lifting rod (41), the top end of the lifting rod (41) is fixedly connected to a clamping spring plate (42), the inner surface of the clamping spring plate (42) is threadedly connected to a screw rod (43), one end of the screw rod (43) is rotatably connected to a sleeve shaft (44), and the sleeve shaft ( 44) An L-shaped clamping plate (45) is fixedly connected to the side away from the clamping spring plate (42), a guide rod (46) is fixedly connected to the side of the L-shaped clamping plate (45) close to the clamping spring plate (42), a sliding rod (47) is slidably connected to the inner surface of the L-shaped clamping plate (45), an end of the sliding rod (47) away from the clamping spring plate (42) is fixedly connected to a contact plate (48), an upper surface of the clamping spring plate (42) is fixedly connected to a lifting connecting plate (49), and an upper surface of the clamping spring plate (42) is fixedly connected to a transmission connecting plate (410); A flow guide pipe fixing device (5) is arranged above the test base (1), and a test protection device (6) is arranged above the test base (1).

2. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 1, characterized in that: The free end of the electric push rod (3) is fixedly connected to the clamping spring plate (42), the guide rod (46) is slidably connected to the inner surface of the clamping spring plate (42), a spring is provided between the abutment plate (48) and the L-shaped clamping plate (45), and the lifting connecting plate (49) and the transmission connecting plate (410) are fixedly connected at both ends.

3. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 2, characterized in that: The guide tube fixing device (5) comprises a rotating rod (51), a rotating half roller one (52), a rotating half roller two (53), and a flexible clamping pad (54); the rotating rod (51) is rotatably connected to the inner surface of the lifting connecting plate (49); the rotating half roller one (52) is fixedly connected to an end of the rotating rod (51) away from the lifting connecting plate (49); the rotating half roller two (53) is arranged above the rotating half roller one (52); and the flexible clamping pad (54) is fixedly connected to the arc surface of the rotating half roller one (52).

4. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 3, characterized in that: The guide tube fixing device (5) further comprises a limit sleeve (55), a lifting plate (56), a slide plate (57), a resistance spring (58), and a push plate (59), wherein the limit sleeve (55) is fixedly connected to the upper surface of the test base (1), the lifting plate (56) is slidably connected to the inner surface of the limit sleeve (55), the slide plate (57) is fixedly connected to the bottom end of the lifting plate (56), the resistance spring (58) is fixedly connected to the bottom surface of the slide plate (57), and the push plate (59) is fixedly connected to the top end of the lifting plate (56).

5. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 4, characterized in that: A spring is provided between the rotating half roller one (52) and the rotating half roller two (53); the flexible clamping pad (54) is fixedly connected to the arc surface of the rotating half roller two (53); the slide plate (57) is slidably connected to the inner surface of the limiting sleeve (55); and the bottom end of the resisting spring (58) is fixedly connected to the upper surface of the test base (1).

6. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 5, characterized in that: The test protection device (6) comprises a support rod (61), a sliding shaft (62), a limiting shaft (63), and a protective top plate (64); the support rod (61) is fixedly connected to the upper surface of the test base (1); the sliding shaft (62) is slidably connected to the circumferential surface of the support rod (61); the limiting shaft (63) is fixedly connected to the top of the support rod (61); and the protective top plate (64) is fixedly connected to an end of the sliding shaft (62) away from the support rod (61).

7. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 6, characterized in that: The test protection device (6) also includes a closed sliding frame (65), a protective side panel 1 (66), a folding side panel 1 (67), a protective side panel 2 (68), and a folding side panel 2 (69). The closed sliding frame (65) is slidably connected to the upper surface of the protective top panel (64). The protective side panel 1 (66) is hinged to the front and rear sides of the protective top panel (64). The folding side panel 1 (67) is hinged to the side of the bottom of the protective side panel 1 (66) away from the protective top panel (64). The protective side panel 2 (68) is hinged to the left and right sides of the protective top panel (64). The folding side panel 2 (69) is hinged to the side of the bottom of the protective side panel 2 (68) away from the protective top panel (64).

8. The high temperature and high pressure micro-nanofluidic chip holder device according to claim 7, characterized in that: The upper surface of the push plate (59) and the lower surface of the protective top plate (64) are in contact with each other, the bottom end of the protective side plate 1 (66) and the upper surface of the test base (1) are in contact with each other, and the bottom end of the protective side plate 2 (68) and the upper surface of the test base (1) are in contact with each other.

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