PCB (Printed Circuit Board) substrate dust removal equipment and dust removal process thereof

Abstract

The invention belongs to the technical field of general cleaning, and particularly relates to PCB substrate dust removal equipment and a dust removal process thereof. The invention provides PCB (Printed Circuit Board) substrate dust removal equipment which comprises dust removal devices which are arranged on a workbench in a sliding manner and are oppositely arranged on two sides of a conveying line; the collecting devices are arranged on the workbench in a lifting mode, and one collecting device corresponds to one dust removing device; wherein after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate under negative pressure; after dust removal is finished, the collecting device moves upwards, compressed air is conveyed into the dust removal device, and dust is blown into the collecting device; after dust discharging is finished, a limiting frame of the dust removal device is attached to the outer wall of the substrate, and compressed air is conveyed into the dust removal device to detect whether the surface of the substrate is qualified or not; through the arrangement of the dust removal device, dust on the surface of the substrate can be adsorbed and removed when negative pressure is formed in the dust removal device; when the internal pressure is positive, the device is suitable for detecting whether the smoothness of the surface of the substrate is qualified.

Description

Technical Field

[0001] The present invention belongs to the general field of cleaning technology, and specifically relates to a cleaning method utilizing air flow, and in particular to PCB substrate dust removal equipment and a dust removal process thereof. Background Art

[0002] After the PCB substrate is cut, it needs to be dusted to facilitate subsequent processing.

[0003] In the related art, a negative pressure dust removal device is often used. After the movable plate of the device is brought close to the substrate to be cleaned, negative pressure suction is used to clean the dust on the outer wall of the substrate. However, the dust is sucked into the negative pressure dust removal device for a long time, and some dust will remain in the pipeline of the negative pressure device, which is not only difficult to clean, but also affects the service life of the equipment.

[0004] Moreover, after dust removal, the PCB substrate needs to be tested for surface smoothness. However, the existing test requires the PCB substrate to be transferred to other testing conveyor lines, which is not only time-consuming and labor-intensive, but also the PCB substrate may be scratched or damaged during the transportation process.

[0005] Therefore, how to prevent dust from falling on the surface of the PCB substrate again when the PCB substrate is first dust-removed and then inspected is a technical problem that urgently needs to be solved in the art.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0007] The embodiments of the present disclosure at least provide PCB substrate dust removal equipment and a dust removal process thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides a PCB substrate dust removal device, comprising: Workbench; A conveying line, which is arranged on the workbench and is suitable for driving the substrate to move horizontally back and forth; At least one dust removal device is slidably arranged on the workbench, and two dust removal devices are arranged oppositely on both sides of the conveying line; At least one collecting device, which is arranged on the workbench in a lifting manner and is paired with the dust removal device; Wherein, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collection device moves upward and compressed air is delivered into the dust removal device to blow the dust to the collection device; After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified.

[0009] In an optional embodiment, the dust removal device includes: a horizontal moving pair, which is arranged on the workbench; A connecting air pipe is vertically arranged at the movable end of the horizontal moving pair and is connected to the air pump; A detection dust removal component is arranged at the upper end of the connecting air pipe, is hollow inside, and faces the base plate; When the dust removal component is detected to be in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

[0010] In an optional embodiment, the detection dust removal assembly includes: a sealing plate, which is fixed to the end of the connecting air pipe and is in communication with the connecting air pipe; A detection frame, which is slidably disposed in the sealing plate, and a gap is provided between the outer wall of the detection frame and the inner wall of the sealing plate; A filter cloth is arranged on a side of the detection frame away from the substrate and is suitable for filtering and intercepting dust; The connecting piece has a ring detection frame arranged circumferentially, and one end of the ring detection frame is fixed to the inner wall of the sealing plate; wherein, when the sealing plate is in a negative pressure state, the detection frame is suitable for moving into the sealing plate, and the detection frame is suitable for squeezing the connecting piece to shrink and deform.

[0011] In an optional embodiment, a plurality of spray heads are fixed in the detection frame, which are connected to a water pipe, and the spray heads are suitable for spraying water to wet the surface of the filter cloth.

[0012] In an optional embodiment, the spray head is arranged on the outside of the filter cloth, and when the air pipe is connected to deliver compressed air into the sealing plate, the spray head is suitable for limiting the position of the filter cloth.

[0013] In an optional embodiment, the connecting member is a flexible member, and when it contracts and deforms, it is suitable for sealing the gap between the detection frame and the sealing plate.

[0014] In an optional embodiment, a pressure sensor is provided in the sealing plate, and the pressure sensor is suitable for detecting the air pressure in the sealing plate; wherein, when the detection frame is pushed outward by compressed air to abut against the substrate, the pressure sensor monitors the pressure range in the sealing plate to detect whether the surface of the substrate is qualified.

[0015] In an optional embodiment, two sliding grooves are arranged in parallel on the side wall of the sealing plate, a sliding block matched with the sliding groove is fixed on the outer wall of the detection frame, and the sliding block is slidably sealed with the sliding groove.

[0016] In an optional embodiment, it includes: A dust removal device is slidably arranged on the workbench, and two dust removal devices are arranged oppositely on both sides of the conveying line; Wherein, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, compressed air is delivered to the dust removal device to clean the dust collected in the dust removal device; After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified; The dust removal device comprises: a horizontal moving pair, which is arranged on the workbench; A connecting air pipe is vertically arranged at the movable end of the horizontal moving pair and is connected to the air pump; A detection dust removal component is arranged at the upper end of the connecting air pipe, is hollow inside, and faces the base plate; When the dust removal component is detected to be in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

[0017] In an optional embodiment, the detection dust removal assembly includes: a sealing plate, which is fixed to the end of the connecting air pipe and is in communication with the connecting air pipe; A detection frame, which is slidably disposed in the sealing plate, and a gap is provided between the outer wall of the detection frame and the inner wall of the sealing plate; A filter cloth is arranged on a side of the detection frame away from the substrate and is suitable for filtering and intercepting dust; The connecting piece has a ring detection frame arranged circumferentially, and one end of the ring detection frame is fixed to the inner wall of the sealing plate; wherein, when the sealing plate is in a negative pressure state, the detection frame is suitable for moving into the sealing plate, and the detection frame is suitable for squeezing the connecting piece to shrink and deform.

[0018] In a second aspect, the embodiment of the present disclosure further provides a dust removal process for a dust removal device, including: During dust removal, after the dust removal device is close to the substrate, the dust removal device is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collection device moves upward and compressed air is delivered into the dust removal device to blow the dust to the collection device; After the dust removal is completed, the limit frame of the dust removal device is fitted with the outer wall of the substrate, and compressed air is delivered into the dust removal device to detect whether the surface of the substrate is qualified.

[0019] The beneficial effects of the present invention are that the PCB substrate dust removal device of the present invention can absorb and remove dust on the surface of the substrate when the internal pressure is negative through the setting of the dust removal device; after the dust removal is completed, the collection device can collect the dust filtered and intercepted on the filter cloth; and the setting of the spray head can prevent the dust on the filter cloth from being blown again and falling on the substrate. When the internal pressure is positive, it is suitable for detecting whether the smoothness of the substrate surface is qualified, thereby improving the work efficiency.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A three-dimensional diagram of a PCB substrate dust removal device provided in an embodiment of the present disclosure; Figure 2 A partial stereoscopic diagram of a conveying line and two detection and dust removal components provided in an embodiment of the present disclosure; Figure 3 A sectional perspective view of a detection and dust removal assembly provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of a positive pressure state inside a sealing plate provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the negative pressure state inside the sealing plate provided in an embodiment of the present disclosure.

[0024] In the figure: 1. Workbench; 2. Conveyor line; 3. Dust removal device; 31. Horizontal moving pair; 32. Connecting air pipe; 33. Detection dust removal assembly; 331. Sealing plate; 332. Detection frame; 333. Filter cloth; 334. Connector; 335. Sprinkler head; 336. Slide; 4. Collection device. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0027] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0028] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0029] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0030] Research has found that the disadvantages of the prior art are: dust is sucked into the negative pressure dust removal device for a long time, and some dust will remain in the pipeline of the negative pressure device, which is not only difficult to clean but also affects the service life of the equipment.

[0031] Moreover, after dust removal, the PCB substrate needs to be tested for surface smoothness. However, the existing test requires the PCB substrate to be transferred to other testing conveyor lines, which is not only time-consuming and labor-intensive, but also the PCB substrate may be scratched or damaged during the transportation process.

[0032] Therefore, how to solve the problem of first removing dust from a conveying system and then inspecting the PCB substrate is a technical problem that urgently needs to be solved in this field.

[0033] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] like Figures 1 to 5As shown, some embodiments provide a PCB substrate dust removal device, including: a workbench 1; a conveyor line 2, which is arranged on the workbench 1 and is suitable for driving the substrate to reciprocate horizontally; the conveyor line 2 is suitable for driving the substrate to move horizontally. In this embodiment, the substrate is vertically placed on the conveyor line 2, and a clamping base for limiting the position of the substrate is arranged on the conveyor line 2, and the substrate is vertically fixed on the upper section of the clamping base. At least one dust removal device 3 is slidably arranged on the workbench 1, and two dust removal devices 3 are relatively arranged on both sides of the conveyor line 2; when the substrate moves horizontally to the dust removal station, the two dust removal devices 3 move toward the conveyor line 2 until the detection dust removal component 33 abuts against the side wall of the substrate. At least one collecting device 4 is lifted and lowered on the workbench 1, and one collecting device 4 corresponds to one dust removal device 3; the collecting device 4 faces the dust removal device 3, and its open size is larger than the size of the sealing plate 331. Among them, after the dust removal device 3 approaches the substrate, the dust removal device 3 is suitable for negative pressure suction of dust on the surface of the substrate; after the dust removal is completed, the collection device 4 moves upward and delivers compressed air into the dust removal device 3 to spray the dust to the collection device 4; after the dust removal is completed, the limit frame of the dust removal device 3 fits the outer wall of the substrate, and compressed air is delivered into the dust removal device 3 to detect whether the surface of the substrate is qualified. Through the setting of the dust removal device 3, the dust on the surface of the substrate can be adsorbed and removed when the internal pressure is negative; after the dust removal is completed, the collection device 4 can collect the dust filtered and intercepted on the filter cloth 333; and the setting of the spray head 335 can prevent the dust on the filter cloth 333 from being blown and falling on the substrate again. When the internal pressure is positive, it is suitable for detecting whether the smoothness of the substrate surface is qualified, thereby improving work efficiency.

[0037] Reference Figure 2 , the dust removal device 3 includes: a horizontal moving pair 31, which is arranged on the workbench 1; the horizontal moving pair 31 is perpendicular to the moving direction of the conveyor line 2, and a connecting air pipe 32 is vertically arranged at the movable end of the horizontal moving pair 31, and is connected to the air pump; the horizontal moving pair 31 is suitable for driving the connecting cylinder to move in the direction of the conveyor line 2; preferably, the connecting air pipe 32 is vertically arranged, and a detection dust removal component 33 is arranged at the upper end of the connecting air pipe 32, which is hollow inside and faces the substrate; the size of the detection dust removal component 33 is consistent with the size of the substrate, that is, after the substrate is clamped and fixed by the conveyor line 2, the height of the substrate is consistent with the height of the sealing plate 331, therefore, when the conveyor line 2 drives the substrate to move horizontally, the detection dust removal component 33 is suitable for negative pressure suction to remove dust on the surface of the substrate. Wherein, when the detection dust removal component 33 abuts against the substrate, it is suitable for negative pressure suction of dust on the surface of the substrate. When the dust on the surface of the substrate is cleaned, the conveyor belt drives the substrate to move horizontally in the opposite direction, and delivers compressed air to the detection dust removal component 33. The detection dust removal component 33 is suitable for detecting whether the smoothness of the substrate surface is qualified.

[0038] Reference Figure 3The detection dust removal assembly 33 includes: a sealing plate 331, which is fixed at the end of the connecting air pipe 32 and communicated with the connecting air pipe 32; an opening is provided at one end of the sealing plate 331 close to the substrate; the detection frame 332 is suitable for protruding from the sealing plate 331 until it abuts against the surface of the substrate. The detection frame 332 is slidably arranged in the sealing plate 331, and a gap is provided between its outer wall and the inner wall of the sealing plate 331; when dusting the surface of the substrate, the detection frame 332 is suitable for sliding into the sealing plate 331; and when detecting the surface of the substrate, the detection frame 332 is suitable for sliding outward and protruding from the sealing plate 331. The filter cloth 333 is arranged on the side of the detection frame 332 away from the substrate and is suitable for filtering and intercepting dust; the aperture of the filter cloth 333 is smaller than the particle size of the dust on the surface of the substrate. When the sealing plate 331 is under negative pressure, the filter cloth 333 is suitable for filtering and intercepting dust to prevent it from flowing into the connecting air pipe 32. After dust removal is completed, the collecting device 4 moves upward to fit with the sealing plate 331. At this time, the sealing plate 331 and the collecting device 4 are in a sealed state, and compressed air is delivered into the sealing plate 331. The compressed air is suitable for blowing the filter cloth 333 to bulge outward, so that the dust intercepted on the filter cloth 333 flows to the collecting device 4. The connecting member 334 is arranged circumferentially around the detection frame 332, and one end of the connecting member 334 is fixed to the inner wall of the sealing plate 331; wherein, when the sealing plate 331 is in a negative pressure state, the detection frame 332 is suitable for moving into the sealing plate 331, and the detection frame 332 is suitable for squeezing the connecting member 334 to shrink and deform. The setting of the connecting piece 334 has the effect of sealing the detection frame 332 and the sealing plate 331 when the detection frame 332 is sucked inward by negative pressure; when the sealing plate 331 is under positive pressure, the detection frame 332 is pushed outward by the compressed air. At this time, part of the compressed air will flow outward through the gap between the detection frame 332 and the sealing plate 331 to prevent the detection frame 332 from being sealed by the substrate, while the sealing plate 331 remains sealed, and the air pump continues to deliver compressed air into the sealing plate 331, which may cause the air pump to be overloaded.

[0039] Furthermore, in order to prevent dust from contaminating the substrate again, a plurality of spray heads 335 are fixed in the detection frame 332, which are connected to the water pipe, and the spray heads 335 are suitable for spraying water to wet the surface of the filter cloth 333. Before the surface smoothness of the substrate is detected, the spray heads 335 spray water on the surface of the filter cloth 333, which can wet the filter cloth 333 and prevent the dust remaining on the outer surface of the filter cloth 333 from being blown by the compressed air and falling on the substrate surface again. At this time, the amount of water sprayed by the spray heads 335 on the surface of the filter cloth 333 is small, which only wets the surface of the filter cloth 333, and no excess water vapor will diffuse to the surface of the substrate. Optionally, the spray heads 335 are arranged on the outside of the filter cloth 333, and when the air pipe 32 is connected to deliver compressed air to the sealing plate 331, the spray heads 335 are suitable for limiting the filter cloth 333.

[0040] Furthermore, the connecting member 334 is a flexible member, and is suitable for sealing the gap between the detection frame 332 and the sealing plate 331 when it contracts and deforms.

[0041] In some embodiments, a pressure sensor is provided in the sealing plate 331, and the pressure sensor is suitable for detecting the air pressure in the sealing plate 331; wherein, when the detection frame 332 is pushed outward by the compressed air to abut against the substrate, the pressure sensor monitors the pressure range in the sealing plate 331 to detect whether the surface of the substrate is qualified. The air pump delivers compressed air to the sealing plate 331, so that the pressure range in the sealing plate 331 is 0.22-0.25MPa; after the detection frame 332 abuts against the outer wall of the substrate, if the surface smoothness of the substrate is qualified, the pressure in the sealing plate 331 is maintained at 0.22-0.25MPa; if the surface of the substrate is uneven, part of the air on the side will leak outward along the surface of the detection frame 332 and the substrate. At this time, the pressure in the sealing plate 331 is less than 0.22MPa, and the substrate is judged to be unqualified.

[0042] Optionally, two slide grooves 336 are arranged in parallel on the side wall of the sealing plate 331 , and a slider matched with the slide groove 336 is fixed on the outer wall of the detection frame 332 , and the slider and the slide groove 336 are slidably sealed.

[0043] Some embodiments provide a PCB substrate dust removal device, comprising: a workbench 1; a conveyor line 2, which is arranged on the workbench 1 and is suitable for driving the substrate to move back and forth horizontally; a dust removal device 3, which is slidably arranged on the workbench 1, and two dust removal devices 3 are relatively arranged on both sides of the conveyor line 2; a collecting device 4, which is lifted and arranged on the workbench 1, and one collecting device 4 corresponds to one dust removal device 3; wherein, after the dust removal device 3 approaches the substrate, the dust removal device 3 is suitable for negative pressure suction of dust on the surface of the substrate; after the dust removal is completed, the collecting device 4 moves upward to transport compressed air into the dust removal device 3 , so as to blow the dust to the collecting device 4; after the dust removal is completed, the limit frame of the dust removal device 3 is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device 3 to detect whether the surface of the substrate is qualified; the dust removal device 3 includes: a horizontal moving pair 31, which is arranged on the workbench 1; a connecting air pipe 32, which is vertically arranged at the movable end of the horizontal moving pair 31, and is connected to the air pump; a detection dust removal component 33, which is arranged at the upper end of the connecting air pipe 32, is hollow inside, and faces the substrate; wherein, when the detection dust removal component 33 abuts against the substrate, it is suitable for negative pressure suction of dust on the surface of the substrate.

[0044] Furthermore, the detection dust removal component 33 includes: a sealing plate 331, which is fixed at the end of the connecting air pipe 32 and is connected to the connecting air pipe 32; a detection frame 332, which is slidably arranged in the sealing plate 331, and a gap is provided between the outer wall thereof and the inner wall of the sealing plate 331; a filter cloth 333, which is arranged on the side of the detection frame 332 away from the substrate and is suitable for filtering and intercepting dust; a connecting piece 334, which is circumferentially arranged around the detection frame 332 and one end of which is fixed to the inner wall of the sealing plate 331; wherein, when the sealing plate 331 is in a negative pressure state, the detection frame 332 is suitable for moving into the sealing plate 331, and the detection frame 332 is suitable for squeezing the connecting piece 334 to shrink and deform.

[0045] Some embodiments provide a dust removal process of a dust removal device, including: during dust removal, after the dust removal device 3 approaches the substrate, the dust removal device 3 is adapted to suck dust on the surface of the substrate under negative pressure; After the dust removal is completed, the collecting device 4 moves upward and delivers compressed air into the dust removal device 3 to blow the dust into the collecting device 4; After the dust removal is completed, the limit frame of the dust removal device 3 is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device 3 to detect whether the surface of the substrate is qualified.

[0046] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0048] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A PCB substrate dust removal device, characterized in that: include: Workbench (1); A conveying line (2), which is arranged on the workbench (1) and is suitable for driving the substrate to move horizontally back and forth; At least one dust removal device (3) is slidably arranged on the workbench (1), and two dust removal devices (3) are arranged oppositely on two sides of the conveying line (2); At least one collecting device (4), which is arranged on the workbench (1) in a lifting manner and is arranged in pair with the dust removal device (3); The dust removal device (3) is close to the substrate and sucks dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collecting device (4) moves upward; delivering compressed air into the dust removal device (3) to blow the dust to the collection device (4); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified.

2. The PCB substrate dust removal device according to claim 1, characterized in that: The dust removal device (3) comprises: a horizontal moving pair (31) which is arranged on the workbench (1); A connecting air pipe (32) is vertically arranged at the movable end of the horizontal movable pair (31) and is connected to the air pump; A detection dust removal component (33) is arranged at the upper end of the connecting air pipe (32), is hollow inside, and faces the base plate; When the dust removal component (33) is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

3. The PCB substrate dust removal device according to claim 2, characterized in that: The detection dust removal component (33) comprises: a sealing plate (331) fixed to the end of the connecting air pipe (32) and connected to the connecting air pipe (32); A detection frame (332) which is slidably disposed in the sealing plate (331), and a gap is provided between the outer wall of the detection frame and the inner wall of the sealing plate (331); A filter cloth (333) is arranged on a side of the detection frame (332) away from the substrate and is suitable for filtering and intercepting dust; A connecting piece (334) is provided with a ring detection frame (332) in a circumferential direction, and one end of the connecting piece (334) is fixed to the inner wall of the sealing plate (331); wherein, when the sealing plate (331) is in a negative pressure state, the detection frame (332) is adapted to move into the sealing plate (331), and the detection frame (332) is adapted to squeeze the connecting piece (334) to shrink and deform.

4. The PCB substrate dust removal device according to claim 3, characterized in that: A plurality of spray heads (335) are fixed in the detection frame (332), which are connected to a water pipe, and the spray heads (335) are suitable for spraying water to wet the surface of the filter cloth (333).

5. The PCB substrate dust removal device according to claim 4, characterized in that: The spray head (335) is arranged on the outside of the filter cloth (333), and when the air pipe (32) is connected to deliver compressed air into the sealing plate (331), the spray head (335) is suitable for limiting the position of the filter cloth (333).

6. The PCB substrate dust removal device according to claim 2, characterized in that: The connecting member (334) is a flexible member, and when it contracts and deforms, it is suitable for sealing the gap between the detection frame (332) and the sealing plate (331).

7. The PCB substrate dust removal device according to claim 2, characterized in that: A pressure sensor is provided in the sealing plate (331), and the pressure sensor is suitable for detecting the air pressure in the sealing plate (331); wherein, when the detection frame (332) is pushed outward by the compressed air to abut against the substrate, the pressure sensor monitors the pressure range in the sealing plate (331) to detect whether the surface of the substrate is qualified.

8. The PCB substrate dust removal device according to claim 2, characterized in that: Two sliding grooves (336) are arranged in parallel on the side wall of the sealing plate (331), and a sliding block matched with the sliding groove (336) is fixed on the outer wall of the detection frame (332), and the sliding block and the sliding groove (336) are slidably sealed.

9. A PCB substrate dust removal device, characterized in that: include: Workbench (1); A dust removal device (3) is slidably arranged on the workbench (1), and two dust removal devices (3) are arranged opposite to each other on both sides of the conveying line (2); Wherein, after the dust removal device (3) is close to the substrate, the dust removal device (3) is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, compressed air is delivered to the dust removal device (3) to clean the dust collected in the dust removal device (3); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified; The dust removal device (3) comprises: a horizontal moving pair (31) which is arranged on the workbench (1); A connecting air pipe (32) is vertically arranged at the movable end of the horizontal movable pair (31) and is connected to the air pump; A detection dust removal component (33) is arranged at the upper end of the connecting air pipe (32), is hollow inside, and faces the base plate; When the dust removal component (33) is in contact with the substrate, it is suitable for sucking dust on the surface of the substrate with negative pressure.

10. The PCB substrate dust removal device according to claim 1, characterized in that: The detection dust removal component (33) comprises: a sealing plate (331) fixed to the end of the connecting air pipe (32) and connected to the connecting air pipe (32); A detection frame (332) which is slidably disposed in the sealing plate (331), and a gap is provided between the outer wall of the detection frame and the inner wall of the sealing plate (331); A filter cloth (333) is arranged on a side of the detection frame (332) away from the substrate and is suitable for filtering and intercepting dust; A connecting piece (334) is provided with a ring detection frame (332) in a circumferential direction, and one end of the connecting piece (334) is fixed to the inner wall of the sealing plate (331); wherein, when the sealing plate (331) is in a negative pressure state, the detection frame (332) is adapted to move into the sealing plate (331), and the detection frame (332) is adapted to squeeze the connecting piece (334) to shrink and deform.

11. A dust removal process of a dust removal device, using the PCB substrate dust removal device according to any one of claims 1-8 or 9-10, characterized in that: include: During dust removal, after the dust removal device (3) is close to the substrate, the dust removal device (3) is suitable for sucking dust on the surface of the substrate with negative pressure; After the dust removal is completed, the collecting device (4) moves upward and delivers compressed air into the dust removal device (3) to blow the dust into the collecting device (4); After the dust removal is completed, the limit frame of the dust removal device (3) is fitted with the outer wall of the substrate, and compressed air is transported into the dust removal device (3) to detect whether the surface of the substrate is qualified.

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