An IC chip laser ablation printing device

Abstract

The application discloses IC chip laser ablation printing equipment and relates to the field of chip letter removing processing. The equipment comprises a top base, the bottom of the top base is installed at the top of a receiving box, and a vibrating disc feeding module is sequentially installed at the top of the top base from left to right. The equipment further comprises a material taking manipulator, a laser ablation module, a cleaning module, an ink jet module, a drying module and a double-track moving and carrying module. The laser ablation module is used for laser ablation operation on the chip, thereby assisting in laser ablation cleaning of the letters on the surface of the chip. The cleaning module is used for assisting in cleaning of the particulate matter generated by ablation on the surface of the chip. The laser ablation replaces manual polishing or chemical corrosion to remove the letters, the uniformity of the letter removal is ensured through the precisely controllable light spot energy distribution of the laser, the laser letter removal is non-contact, the chip is not mechanically damaged, the laser letter removal has become a mainstream selection due to high precision and stability, the self-defined ablation depth can be realized, and no additional damage is caused to the IC chip.

Description

Technical Field

[0001] This invention relates to the field of chip de-marking processing, specifically to an IC chip laser ablation printing equipment. Background Technology

[0002] Chip manufacturing is a highly precise and complex process that begins with the design phase, where engineers use specialized design software to create the chip's circuit diagram. These designs are then translated into a series of tiny patterns, precisely etched onto a silicon wafer using photolithography. In photolithography, a laser or electron beam exposes the photoresist, and then chemical processing transfers the pattern onto the silicon wafer. Next, through steps such as ion implantation and etching, electronic components such as transistors, resistors, and capacitors are formed on the silicon wafer. This series of steps requires extremely high precision and cleanliness to ensure the chip's performance and reliability. After all process steps are completed, the silicon wafer is diced into individual chips, packaged, and tested. During IC chip production, products are often reworked due to non-compliance, model changes, or the need to remove characters from the IC chip surface to protect sensitive information for reprocessing and reuse.

[0003] Existing methods for processing characters on the surface of IC chips mostly include physical removal methods such as polishing and chemical etching. However, these two methods are inefficient and only suitable for small batches of IC products. They are limited by the possibility of damaging the product during the process and cannot be applied to small-sized products (less than 1mm×1mm). They cannot meet different work requirements well. Therefore, an IC chip laser ablation printing equipment is needed to help solve this problem. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide an IC chip laser ablation printing equipment to solve the problem that existing IC chip surface character processing methods mostly include physical character removal methods such as grinding and chemical etching. However, these two character removal methods are inefficient, only suitable for small batches of IC products, and are limited by the possibility of product damage during the process. They are also not applicable to small-sized products (less than 1mm×1mm) and cannot well meet the technical problems of different working requirements.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an IC chip laser ablation printing device, comprising a top base, the bottom of which is mounted on the top of a receiving box, and the top of which, from left to right, are sequentially mounted with...

[0006] The vibratory feeder module is used to place chips and make the chips resonate under the action of vibration, making them active and easy to move, thereby realizing the directional movement and orderly arrangement of the chips in a certain direction;

[0007] A robotic arm for picking up and holding chips;

[0008] The laser ablation module is used to perform laser ablation on chips, thereby assisting in the laser ablation and cleaning of text on the chip surface.

[0009] The cleaning module is used to assist in cleaning particles generated by the ablation of the chip surface;

[0010] Inkjet modules are used to brush ink onto the grooves created by ablation on the chip surface to cover the ablation marks and to perform targeted spraying.

[0011] The drying module is used to perform auxiliary drying treatment on the surface of the chip after spraying.

[0012] And it connects the drying module, inkjet module, cleaning module, laser ablation module, material handling robot, and vibratory feeder module.

[0013] The dual-track transfer module is used to assist in the transport and processing of chips, ensuring that the chips can be transported and processed stably.

[0014] The present invention is further configured such that the dual-track transfer module includes first linear modules symmetrically installed on the top of the top seat, and a support plate is slidably provided on one side of the two adjacent first linear modules. A lifting cylinder is installed on the support plate, and a shuttle assembly for carrying the chip is installed at the top of the lifting cylinder.

[0015] The present invention is further configured such that the shuttle assembly includes a lower shuttle installed at the top of the lifting cylinder and an upper shuttle installed at the top of the lower shuttle, wherein chip slots for placing chips are equidistantly opened at the top of the upper shuttle, and the sides of the lower shuttle and the upper shuttle are connected and fixed by a fixing component.

[0016] The present invention is further configured such that the fixing component includes a hook fixed on the side of the feeding shuttle and a hinge seat fixed on the side of the unloading shuttle, a pressing plate is hingedly installed on the hinge seat, a pull ring is hingedly installed on the outer side of the pressing plate, and the pull ring and the hook are engaged and snapped together.

[0017] The invention is further configured such that the drying module includes an inverted U-shaped drying box mounted on the top of the top seat, the drying box having a through groove for the dual-track transfer module to pass through, and an infrared heating plate for auxiliary drying is installed at the top of the through groove.

[0018] The present invention is further configured such that the inkjet module includes a second linear module mounted on the top of the top mount, a connecting plate slidably disposed on the second linear module, and an inkjet assembly for assisting inkjet printing is mounted on the connecting plate.

[0019] The present invention is further configured such that the cleaning module includes a third linear module vertically installed at the top of the top seat, a protruding plate slidably installed on the third linear module, a dust collection seat installed on the protruding plate, electrostatic brushes symmetrically protruding on both sides of the bottom of the dust collection seat, and a negative pressure communication hole installed at the top of the dust collection seat, the negative pressure communication hole being connected to a negative pressure pipe.

[0020] The present invention is further configured such that the laser ablation module includes a base plate mounted on the top of a top seat and a laser ablation machine for laser ablation. A mounting plate protrudes from the top of the base plate, and a mounting seat is provided at the top of the mounting plate. A lead screw is rotatably mounted on the mounting seat, and a second slider is sleeved on the lead screw. The second slider and the lead screw are threaded together. A rotating rod is fixed to one end of the lead screw extending out of the mounting seat. A sliding block protrudes from the bottom of the laser ablation machine, and a first slider is slidably mounted on the sliding block. A support rod is hinged between the first slider, the second slider, the sliding block, and the mounting plate.

[0021] The present invention is further configured such that the material handling robot includes a material handling motor installed at the top of the top seat, an extension plate is installed at the front end of the shaft of the material handling motor, a connecting seat is installed at the top of the end of the extension plate away from the material handling motor, a material handling nozzle is slidably installed on the connecting seat, the material handling nozzle is connected to a negative pressure pump, a C-shaped second mounting rod is rotatably embedded at one end of the connecting seat, a first mounting rod is hinged to the end of the second mounting rod away from the connecting seat, and the end of the first mounting rod away from the second mounting rod is fixed at the top of the material handling motor.

[0022] The present invention is further configured such that the vibratory feeder module includes a frame body and a support platform installed at the top of the top seat. A feeding tray is installed at the top of the frame body, and a receiving tray is installed at the top of the support platform.

[0023] In summary, the present invention has the following beneficial effects: The laser ablation module installed at the top of the mounting base allows for auxiliary laser ablation of the chip inside the feeding slot during operation. Rotating the rotating rod drives the lead screw to rotate, and the second slider moves along the threaded connection with the lead screw. The cross-bracing of the support rods adjusts the overall height of the laser ablation machine. During operation, the overall height of the laser ablation machine can be adjusted according to different work requirements. Laser ablation can replace manual grinding or chemical etching for text removal. The precise and controllable laser spot energy distribution ensures uniform text removal. Furthermore, laser text removal is non-contact and does not cause mechanical damage to the chip. Due to its high precision and stability, laser text removal has become the mainstream choice, allowing for customized ablation depths without additional damage to the IC chip, ensuring smooth and stable chip text removal.

[0024] The dual-rail transfer module on the top of the mounting base can further improve the overall work efficiency during operation. The detachable design of the loading shuttle on the first linear module allows for the replacement of different sized loading shuttles according to different work requirements. It can adapt to the de-labeling of IC chips with various packaging forms, such as BGA, DIP, SOP, TSSOP, SOT, SOJ, QFP, QFN, TO, etc., further improving the practicality of the device.

[0025] The cleaning module installed on the top of the mounting base allows for electrostatic adsorption of particles generated during operation via electrostatic brushes. After electrostatic adsorption, negative pressure adsorption helps to remove the adsorbed impurities. The height of the electrostatic brushes can also be adjusted by adjusting the height of the protruding plate on the third linear module according to different work requirements. This ensures effective adsorption and filtration of impurities during operation, minimizing the impact of ablated particles on subsequent inkjet printing and drying operations. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of the present invention after the dual-rail transfer module is installed on the top seat;

[0028] Figure 3 For the present invention Figure 1 Enlarged structural diagram at point A;

[0029] Figure 4 This is a side view of the vibratory feeder module of the present invention;

[0030] Figure 5This is a schematic diagram of the material handling robot of the present invention;

[0031] Figure 6 This is a side view of the laser ablation module of the present invention;

[0032] Figure 7 This is a schematic diagram of the cleaning module of the present invention;

[0033] Figure 8 This is a schematic diagram of the inkjet module of the present invention;

[0034] Figure 9 This is a schematic diagram of the drying module of the present invention.

[0035] In the diagram: 1. Top seat; 2. Receiving box; 3. Leveling knob; 4. Dual-rail transfer module; 41. First linear module; 42. Shuttle assembly; 421. Feed shuttle; 422. Feed shuttle; 423. Feed chute; 424. Fixing assembly; 4241. Pull ring; 4242. Hinge seat; 4243. Pressing plate; 4244. Hook; 43. Lifting cylinder; 5. Drying module; 51. Drying box; 52. Infrared heating plate; 6. Inkjet module; 61. Second linear module; 62. Connecting plate; 63. Inkjet assembly; 7. Cleaning module; 71. Third... 72. Linear module; 73. Dust collection seat; 74. Negative pressure connecting hole; 8. Electrostatic brush; 9. Laser ablation module; 10. Laser ablation machine; 11. First slider; 12. Second slider; 13. Mounting base; 14. Base plate; 15. Lead screw; 16. Rotating rod; 17. Support rod; 18. Material handling robot; 19. Material handling motor; 10. First mounting rod; 11. Second mounting rod; 12. Extension plate; 13. Material handling nozzle; 14. Vibratory feeder module; 15. Frame body; 16. Loading tray; 17. Bearing platform; 18. Receiving tray. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] A laser ablation printing device for IC chips, such as Figure 1 , Figure 2 and Figure 3As shown, the device includes a top seat 1, the bottom of which is installed on the top of a receiving box 2. A leveling knob 3 is threaded onto the bottom of the receiving box 2, which can effectively adjust the overall level of the receiving box 2 during operation. A dual-track transfer module 4 is installed on the top of the top seat 1 to assist in the transport of chips and ensure that the chips can be stably transported and processed. The dual-track transfer module 4 includes first linear modules 41 symmetrically installed on the top of the top seat 1. A bearing plate is slidably mounted on one side of the two adjacent first linear modules 41. A lifting cylinder 43 is installed on the bearing plate. A feed shuttle assembly 42 for carrying chips is installed on the top of the lifting cylinder 43. The feed shuttle assembly 42 includes a lower feed shuttle 421 installed on the top of the lifting cylinder 43 and an upper feed shuttle 422 installed on the top of the lower feed shuttle 421. Chip slots for placing chips are equidistantly opened on the top of the upper feed shuttle 422.

[0038] The dual-rail transfer module 4 on the top of the top seat 1 can further improve the overall work efficiency during operation through the dual-rail system. Equipped with a lifting cylinder 43, it can realize the alternating operation of the two workstations, which greatly improves the operating speed and ensures that the subsequent chip work can proceed smoothly.

[0039] The sides of the feed shuttle 421 and the feed shuttle 422 are connected and fixed by a fixing component 424. The fixing component 424 includes a hook 4244 fixed on the side of the feed shuttle 422 and a hinge seat 4242 fixed on the side of the feed shuttle 421. A pressing plate 4243 is hingedly installed on the hinge seat 4242. A pull ring 4241 is hingedly installed on the outer side of the pressing plate 4243. The pull ring 4241 and the hook 4244 are engaged and locked together.

[0040] With the detachable design of the feed shuttle assembly 42, different sizes of feed shuttles 422 can be replaced according to different work requirements during operation, which can adapt to the debiting of IC chips with various package forms, such as BGA, DIP, SOP, TSSOP, SOT, SOJ, QFP, QFN, TO, etc., further improving the practicality of the device.

[0041] Reference Figure 1 and Figure 4 As shown, a vibratory feeder module 10 is installed on the far left of the top of the top seat 1. The vibratory feeder module 10 includes a frame body 101 and a support platform 103 installed on the top of the top seat 1. A feeding tray 102 is installed on the top of the frame body 101, and a receiving tray 104 is installed on the top of the support platform 103. A voice coil motor for vibration is installed inside the receiving tray 104.

[0042] The voice coil motor inside the carrier platform 103 is activated by the vibratory feeder module 10, which causes the chips to move in a certain direction and arrange them in an orderly manner. The chips are then illuminated by the lighting lamp on the top of the carrier platform 103, which also provides auxiliary lighting for the chip gripping mechanism during the illumination process.

[0043] Reference Figure 1 and Figure 5 As shown, a picking robot 9 for auxiliary adsorption and clamping of chips is installed at the top of the top seat 1. The picking robot 9 includes a picking motor 91 installed at the top of the top seat 1. An extension plate 94 is installed at the front end of the shaft of the picking motor 91. A connecting seat is installed at the top of the end of the extension plate 94 away from the picking motor 91. A picking nozzle 95 is slidably installed on the connecting seat. The picking nozzle 95 is connected to a negative pressure pump. A C-shaped second mounting rod 93 is rotatably embedded at one end of the connecting seat. A first mounting rod 92 is hinged to the end of the second mounting rod 93 away from the connecting seat. The end of the first mounting rod 92 away from the second mounting rod 93 is fixed at the top of the picking motor 91.

[0044] The picking robot 9 is equipped with a picking motor 91 that drives the extension plate 94 to rotate as a whole. During the rotation of the extension plate 94, the connecting seat rotates as a whole, and the picking nozzle 95 moves to the top of the receiving tray 104. The viewing camera captures and processes images of the surrounding environment on the top of the receiving tray 104, providing rich environmental information for the picking robot 9. When the picking nozzle 95 reaches the corresponding position, the picking nozzle 95 extends as a whole to assist in picking up the chip. After picking up the chip, the picking motor 91 rotates and the picking nozzle 95 reaches the top of the shuttle assembly 42, and the chip is placed in the receiving hole discharge slot 423, thus completing the picking and discharging work. The picking and discharging is performed using a high-precision and highly flexible 4-axis robot. Based on vision, the product on the vibratory plate can be positioned, and rotation correction can be performed after picking up the chip.

[0045] Reference Figure 1 and Figure 6 As shown, a laser ablation module 8 is installed at the top of the top seat 1 for laser ablation of the chip, thereby assisting in the laser ablation and cleaning of the text on the chip surface. The laser ablation module 8 includes a base plate 841 installed at the top of the top seat 1 and a laser ablation machine 81 for laser ablation. A mounting plate protrudes from the top of the base plate 841, and a mounting seat 84 is provided at the top of the mounting plate. A lead screw 85 is rotatably mounted on the mounting seat 84. A second slider 83 is sleeved on the lead screw 85. The second slider 83 and the lead screw 85 are threaded together. A rotating rod 851 is fixed to one end of the lead screw 85 that extends out of the mounting seat 84. A slide is protruding from the bottom of the laser ablation machine 81. A first slider 82 is slidably mounted on the slide. A support rod 86 is hinged between the first slider 82, the second slider 83, the slide, and the mounting plate.

[0046] The laser ablation module 8, installed at the top of the top seat 1, allows for auxiliary laser ablation of the chips inside the feeding slot 423 during operation. Rotating the rotating rod 851 causes the lead screw 85 to rotate, and the second slider 83, threadedly engaged with the lead screw 85, moves the second slider 83, causing the support rod 86 to cross, thus adjusting the overall height of the laser ablation machine 81. During operation, the overall height of the laser ablation machine 81 can be adjusted according to different work requirements. Laser ablation can replace manual grinding or chemical etching for text removal. The precise and controllable laser spot energy distribution ensures uniform text removal. Furthermore, laser text removal is non-contact and does not cause mechanical damage to the chip. Due to its high precision and stability, laser text removal has become the mainstream choice, allowing for customized ablation depths without additional damage to the IC chip, ensuring smooth and stable text removal.

[0047] Reference Figure 1 and Figure 7 As shown, the cleaning module 7 at the top of the top seat 1 is used to assist in cleaning particles generated by the ablation of the chip surface. The cleaning module 7 includes a third linear module 71 vertically installed at the top of the top seat 1. A protruding plate is slidably installed on the third linear module 71. A dust collection seat 72 is installed on the protruding plate. Electrostatic brushes 74 are symmetrically protruding on both sides of the bottom of the dust collection seat 72. A negative pressure connecting hole 73 is installed at the top of the dust collection seat 72. The negative pressure connecting hole 73 is connected to a negative pressure pipe.

[0048] By using the cleaning module 7 installed at the top of the top mount 1, the electrostatic brush 74 can assist in the electrostatic adsorption treatment of particles generated by ablation during operation. After electrostatic adsorption, negative pressure adsorption can be used to help remove the electrostatically adsorbed impurities. During operation, the height of the electrostatic brush 74 can also be adjusted by adjusting the height of the protruding plate on the third linear module 71 according to different work requirements. This allows for effective adsorption and filtration of impurities during operation, minimizing the impact of ablated particles on subsequent inkjet printing and drying operations.

[0049] Reference Figure 1 and Figure 8 As shown, an inkjet module 6 is installed at the top of the top seat 1 to brush ink on the grooves generated by the ablation of the chip surface to cover the ablation marks and to perform targeted spraying. The inkjet module 6 includes a second linear module 61 installed at the top of the top seat 1. A connecting plate 62 is slidably disposed on the second linear module 61. An inkjet assembly 63 for assisting inkjet spraying is installed on the connecting plate 62.

[0050] The inkjet module 6 and inkjet component 63 can cover the burn marks that remain on the surface of the product after the characters have been removed by brushing ink. The inkjet component 63 is equipped with a vision camera to visually capture the grooves on the surface of the IC chip and then perform targeted spraying, which is highly adaptable to different characters and patterns of different products.

[0051] Reference Figure 1 and Figure 9 As shown, a drying module 5 is installed at the top of the top seat 1. The drying module 5 includes an inverted U-shaped drying box 51 installed at the top of the top seat 1. The drying box 51 has a through groove for the dual-track transfer module 4 to pass through. An infrared heating plate 52 for auxiliary drying is installed at the top of the through groove. A programmable controller that can control several modules is installed inside the top seat 1. The controller model is S7-300, and it can be used but is not limited to this model.

[0052] After ink is applied, the chip needs to be placed in the drying chamber 51 through the drying module 5. The chip is heated and dried to harden the ink. The drying chamber 51 uses an infrared heating plate 52 for heating and drying. The infrared heating plate 52 is based on microcrystalline glass and has a metal oxide nano-electrothermal coating on its surface. It heats the chip through radiation and heat conduction. Different temperatures can be set for products with different packaging forms. To avoid oxidation of the product surface, nitrogen gas can be introduced after the product is semi-closed on both sides.

[0053] Working principle of the invention:

[0054] During operation, the raw material is placed on top of the feeding tray 102, and some of the raw material is placed inside the receiving tray 104. The corresponding feeding shuttle 422 is changed according to the size of the chip, and the feeding shuttle 422 is placed on the unloading shuttle 421. The pull ring 4241 is hung in the hook 4244. The pressing plate 4243 is pressed, so that the pull ring 4241 is hung on the hook 4244, thereby completing the overall fixing of the feeding shuttle 422.

[0055] The voice coil motor inside the carrier platform 103 is activated, which causes the chips to move and arrange in an orderly manner in a certain direction. The chips are then illuminated by the lighting lamp on the top of the carrier platform 103, which also provides auxiliary lighting for the chip gripping mechanism during the illumination process.

[0056] The picking motor 91 is started, which drives the extension plate 94 to rotate as a whole. During the rotation of the extension plate 94, the connecting seat rotates as a whole, and the picking nozzle 95 moves to the top of the receiving tray 104. The camera captures and processes the image of the surrounding environment on the top of the receiving tray 104, providing rich environmental information for the picking robot 9. When the picking nozzle 95 reaches the corresponding position, the picking nozzle 95 is extended as a whole to assist in picking up the chip. After picking up the chip, the picking motor 91 rotates and the picking nozzle 95 reaches the top of the shuttle assembly 42, and the chip is placed in the receiving hole discharge slot 423, thus completing the picking and discharging work.

[0057] Start the first linear module 41 and move the shuttle assembly 42 to the top of the laser ablation module 8. The laser ablation machine 81 performs auxiliary laser ablation to remove characters from the chip inside the material receiving hole discharge slot 423. Rotate the rotating rod 851, which drives the lead screw 85 to rotate as a whole. The second slider 83 is threadedly engaged with the lead screw 85, thereby moving the second slider 83 as a whole. The support rod 86 crosses, thereby adjusting the overall height of the laser ablation machine 81. During operation, the overall height of the laser ablation machine 81 can be adjusted according to different work requirements to improve the overall practicality of the device.

[0058] After laser ablation is completed, the first linear module 41 is activated, causing the shuttle assembly 42 to pass under the cleaning module 7. During the movement of the shuttle assembly 42, the electrostatic brush 74 assists in the electrostatic adsorption treatment of the particles generated by ablation. After electrostatic adsorption, the impurities adsorbed by electrostatic adsorption are assisted in being sucked out by negative pressure adsorption. During operation, the height of the electrostatic brush 74 can also be adjusted by adjusting the height of the protruding plate on the third linear module 71 according to different work requirements.

[0059] When the first linear module 41 moves to the inkjet module 6, it stops and the second linear module 61 is started, which in turn moves the connecting plate 62 and moves the inkjet assembly 63 to the designated position. The inkjet assembly 63 can brush ink to cover the traces of ablation that are still retained on the surface of the product after the characters have been removed. The inkjet assembly 63 is equipped with a vision camera to visually capture the grooves on the surface of the IC chip and then perform targeted spraying, which is highly adaptable to different character patterns of different products.

[0060] After inkjet printing, the shuttle assembly 42 on the first linear module 41 passes through the drying module 5, and then the infrared heating plate 52 inside the drying module 5 provides auxiliary heating and drying for the chip inside the shuttle assembly 42, so that the ink hardens. During operation, when the two shuttle assemblies 42 approach each other, the lifting cylinder 43 can be activated to lift the shuttle assembly 42, so that the shuttle assemblies 42 on the two first linear modules 41 can move up and down alternately.

[0061] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. An IC chip laser ablation printing apparatus comprising a top base (1), characterized in that: The top seat (1) is mounted at the top of the receiving box (2), and the top of the top seat (1) is sequentially provided with The vibration disc feeding module (10) is used for placing the chips and making the chips resonate under the action of vibration, become active and easy to move, and then realize the directional movement and orderly arrangement of the chips. The taking manipulator (9) is used for auxiliary adsorption and clamping of the chips. The laser ablation module (8) is used for laser ablation operation of the chips, so as to assist laser ablation cleaning of the characters on the surface of the chips. The cleaning module (7) is used for auxiliary cleaning of the particulate matter generated by the ablation on the surface of the chips. The inkjet module (6) is used for ink brushing of the gullies generated by the ablation on the surface of the chips to cover the ablation traces and targeted spraying. The drying module (5) is used for auxiliary drying treatment of the surface of the chips after spraying, And the double-track transfer module (4) penetratingly connected with the drying module (5), the inkjet module (6), the cleaning module (7), the laser ablation module (8), the taking manipulator (9) and the vibration disc feeding module (10) is used for auxiliary conveying treatment of the chips to ensure stable conveying and processing of the chips. The double-track transfer module (4) comprises first linear modules (41) symmetrically mounted at the top of the top seat (1), and a bearing plate is protrudingly and slidably arranged on one side of the two first linear modules (41), a lifting cylinder (43) is mounted on the bearing plate, and a material shuttle assembly (42) for bearing the chips is mounted at the top of the lifting cylinder (43). The material shuttle assembly (42) comprises a lower material shuttle (421) mounted at the top of the lifting cylinder (43) and an upper material shuttle (422) mounted at the top of the lower material shuttle (421), chip grooves for placing the chips are equidistantly formed in the top of the upper material shuttle (422), and the side edges of the lower material shuttle (421) and the upper material shuttle (422) are fixedly connected through a fixing assembly (424). The fixing assembly (424) comprises a hook (4244) fixed on the side edge of the upper material shuttle (422) and a hinged seat (4242) fixed on the side edge of the lower material shuttle (421), a pressing plate (4243) is hingedly mounted on the hinged seat (4242), a pull ring (4241) is hingedly mounted on the outer side edge of the pressing plate (4243), and the pull ring (4241) is matched and clamped with the hook (4244).

2. The IC chip laser ablation printing apparatus according to claim 1, wherein: The drying module (5) comprises a drying box (51) in the shape of inverted U mounted at the top of the top seat (1), a penetrating groove penetrating through the double-track transfer module (4) is formed in the drying box (51), and an infrared heating plate (52) for auxiliary drying is mounted at the top of the penetrating groove.

3. The IC chip laser ablation printing apparatus according to claim 1, wherein: The inkjet module (6) comprises a second linear module (61) mounted at the top of the top seat (1), a connecting plate (62) is slidably arranged on the second linear module (61), and an inkjet assembly (63) for auxiliary inkjet is mounted on the connecting plate (62).

4. The IC chip laser ablation printing apparatus according to claim 1, wherein: The cleaning module (7) comprises a third linear module (71) vertically installed at the top of the top base (1), a protruding plate is slidably installed on the third linear module (71), a dust suction seat (72) is installed on the protruding plate, two symmetrical electrostatic brushes (74) are protrudingly arranged at the bottom of the dust suction seat (72), a negative pressure communication hole (73) is installed at the top of the dust suction seat (72), and the negative pressure communication hole (73) is in communication with a negative pressure pipe.

5. The IC chip laser ablation printing apparatus according to claim 1, wherein: The laser ablation module (8) comprises a bottom plate (841) installed at the top of the top base (1) and a laser ablation machine (81) for laser ablation, a mounting plate is protrudingly installed at the top of the bottom plate (841), a mounting seat (84) is arranged at the top of the mounting plate, a lead screw (85) is rotatably arranged on the mounting seat (84), a second sliding block (83) is sleeved and installed on the lead screw (85), the second sliding block (83) is in threaded cooperation with the lead screw (85), a rotating rod (851) is fixed to one end of the lead screw (85) protruding out of the mounting seat (84), and a sliding seat is protrudingly arranged at the bottom of the laser ablation machine (81). A first sliding block (82) is slidably arranged on the sliding seat, and a supporting rod (86) is hingedly installed between the first sliding block (82) and the second sliding block (83) and the sliding seat and the mounting plate.

6. The IC chip laser ablation printing apparatus according to claim 1, wherein: The material taking manipulator (9) comprises a material taking motor (91) installed at the top of the top base (1), an extension plate (94) is installed at the front end of the shaft of the material taking motor (91), a connecting seat is installed at the top of one end of the extension plate (94) away from the material taking motor (91), a material taking nozzle (95) is slidably installed on the connecting seat, the material taking nozzle (95) is in communication with a negative pressure pump, a C-shaped second mounting rod (93) is rotatably embedded and installed at one end of the connecting seat, a first mounting rod (92) is hingedly installed at one end of the second mounting rod (93) away from the connecting seat, and the first mounting rod (92) is fixed at the top of the material taking motor (91) away from the second mounting rod (93).

7. The IC chip laser ablation printing apparatus according to claim 1, wherein: The vibrating disc feeding module (10) comprises a rack body (101) and a bearing platform (103) installed at the top of the top base (1), a feeding disc (102) is installed at the top of the rack body (101), and a containing disc (104) is installed at the top of the bearing platform (103).

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