14 results about "Photo ablation" patented technology

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.

The application discloses a variable parameter laser ablation effect fast prediction method based on a finite element model and a neural network model, and solves the problems of limited application scenarios, limited application material ranges and insufficient real-time performance in the prior art. The application obtains simulation data (i.e. a second data set) through a laser ablation effect finite element model, trains and tests a neural network model through the simulation data, obtains an optimal neural network model, and then obtains corresponding data of a material to be measured according to actual working conditions, sets a calculation time step and a laser irradiation time, combines the optimal neural network model, and realizes real-time prediction of the laser ablation effect, so that the calculation precision is high, the time consumption is short, and the method is suitable for fast prediction of the laser ablation effect in a strong dynamic scene.

This invention discloses a method for separating semiconductor wafers, comprising a scribing step: using a scribing tool to scribble lines on the surface of the semiconductor wafer to form separation channels; and a laser ablation step: controlling a laser beam to irradiate the separation channels and move along the separation channels until the semiconductor wafer is separated along the separation channels. This method can reduce the deformation generated during semiconductor separation, reduce the risk of semiconductor chipping and cracking, and improve product yield.

A method to refurbish electrostatic chucks includes identifying one or more layers on a minimal contact area (MCA) pad affixed to an electrostatic chuck, configuring a laser ablation system to remove the identified layers, ablating the identified layers with a controlled laser beam from the laser ablation system, identifying one or more deposited metals on the electrostatic chuck, and ablating the identified deposited metals with the laser beam. In another aspect, the MCA pad may include a diamond like carbon layer and a Ti-TiN layer. The laser ablation process removes the layers and deposited metals on an electrostatic chuck in a manner that is performed faster, with a lower cost, and without the use of a multistep chemical process compared to conventional chemical stripping methods.

This invention provides a temperature control device for laser ablation-driven micro-impulse measurement experiments, based on a torsion pendulum micro-impulse measurement system. The torsion pendulum micro-impulse measurement system includes a laser, a focusing lens, a displacement stage, a torsion pendulum, a displacement sensor, and a data processing system arranged sequentially. The temperature control device is located in front of the torsion pendulum and fixedly connected to the displacement stage. The temperature control device includes a low-temperature heat sink, an electric heating element, and a temperature control chip, wherein the low-temperature heat sink is shaped to not obstruct the optical path. This solution achieves temperature control of the driven sample in laser ablation-driven impulse measurement experiments without affecting the impulse measurement process of the original torsion pendulum system.

The utility model provides a kind of laser ablation surface treatment device and its production line, it is related to workpiece surface treatment technical field, the laser ablation surface treatment device includes workbench, first conveying mechanism, attitude adjusting mechanism and laser processing mechanism, first conveying mechanism includes first conveyor belt, and first conveyor belt is used to convey workpiece;Attitude adjusting mechanism includes adjusting drive component and two adjusting plates, two adjusting plates are spaced apart along the width direction of first conveyor belt, adjusting drive component is used to drive two adjusting plates to move towards each other or mutually far direction;Laser processing mechanism includes forward laser cleaning machine and lateral laser cleaning machine, the laser head of forward laser cleaning machine is set to the upper surface of workpiece, and the laser head of lateral laser cleaning machine is set to the side of workpiece. Through laser cleaning machine, workpiece is cleaned by laser burning, solve the problem that the existing device needs to be handheld and work, resulting in high labor intensity, low working efficiency.

The utility model discloses a kind of processing devices of double-sided positioning processing wafer, including pedestal, and laser processing mechanism, processing fixture, lower camera and upper camera being located on pedestal;The laser processing mechanism is used to carry out laser processing to the wafer to be processed placed on processing fixture;Wafer placement area is provided on the processing fixture, and multiple positioning through holes are provided in wafer placement area and are penetrated;The lower camera is used to shoot multiple positioning through holes from below;The upper camera is used to shoot wafer placement area from above;When the front of the wafer to be processed is placed downward, laser processing mechanism is used to carry out punching treatment to the wafer to be processed;When the front of the wafer to be processed is placed upward, laser processing mechanism is used to carry out slotting treatment to the wafer to be processed;This scheme can minimize the quality influence of laser ablation product on wafer chip circuit, solve the chip processing technology problem of this kind of special needs.

This invention provides a method and apparatus for femtosecond laser feedback shaping of surface micro / nano structures, belonging to the field of laser application technology. Addressing the problems of low edge precision and low efficiency in femtosecond laser processing, this invention replaces the two reflectors of a Michelson interferometer with two spatial light modulators: the first spatial light modulator loads a patterned phase map to define the processing shape, and the second spatial light modulator calculates a corrected phase based on the difference between the measured light field intensity and the theoretical light intensity and loads a corrected phase map, achieving closed-loop feedback shaping and obtaining a high-quality patterned light field. After beam contraction via a multi-stage 4f system, the micro / nano structure is ablated by single-pulse surface exposure, and large-area, high-efficiency fabrication is achieved by combining serial flying scan stitching. This invention requires no mask or vacuum environment, offers high processing precision and efficiency, and can flexibly customize various metasurface micro / nano structures.

The application discloses a material surface in-situ diagnosis fast sampling device based on a cascaded local vacuum structure, a diagnosis device and a diagnosis method, and relates to the technical field of material surface in-situ diagnosis. The device comprises a sampling head assembly, a differential pumping system, a laser ablation module, a spectrum acquisition module and a gas sampling module. The sampling head assembly comprises two or more than two nested cavity structures. The differential pumping system comprises a plurality of pumping units, and each pumping unit corresponds to a sealed cavity. The laser ablation module is used for emitting a laser beam to the surface of a material to be measured in the innermost sealed cavity through an optical window arranged on each layer of cavity and coaxially aligned in the vertical direction by means of a laser device. The spectrum acquisition module is used for collecting the emission spectrum signal of plasma through the optical window. The gas sampling module is in communication with the sealed cavity. The application can detect the material surface on site by arranging the sampling head assembly on the material surface to form a local sealed structure.

A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.

This invention provides a method for in-situ construction of an integrated three-phase electrode with a mesoporous multimetallic catalytic interface using laser cladding-dealloying technology. Using a three-phase electrode substrate as a template, catalytic metal (M1) and active metal (M2) are deposited on its surface by magnetron sputtering. a A bimetallic alloy layer (M1-M1) is formed by laser ablation cladding. a Then, the M is removed by wet etching or electrochemical oxidation. a The components are combined to form a three-dimensional continuous mesoporous catalytic metal interface (3D-M1); finally, a second catalytic metal interface (M2) is added through atomic layer deposition (ALD) or electrochemical electroplating (ECD) to obtain an integrated three-phase electrode (3D-M1-M2) with a mesoporous multi-metal catalytic interface. This invention significantly improves processing efficiency, precision, controllability, substrate versatility, and electrode catalytic performance, and is of great significance to the research and industrialization of technologies such as electrochemical hydrogen production, fuel cells, and metal-air batteries.

This utility model relates to the field of laser ablation platform technology, specifically to a laser ablation platform with active auxiliary air suction function. It includes a laser ablation device and an adjustment device mounted on the device. Side plates are fixed to both sides of the laser ablation device, and threaded rods are fixed to the outer sides of the side plates. A cleaning device is sleeved on the outer side of the threaded rods. The cleaning device includes a moving frame, sliders fixed to both sides of the moving frame, and an air box fixed to the outer side of the moving frame. The sliders are fixedly sleeved with the threaded rods, thereby driving a side gear on one side to rotate (vertically), which in turn drives a connecting rod to rotate on the rotating rod. Finally, it causes the base plate to deflect to one side. Since the air pipe is fixed to the base plate through a locking groove, the air pipe can be quickly inserted and fixed. Simultaneously, the nozzle at the bottom can comprehensively cover the workpiece, removing molten debris and other particulate matter.

This invention relates to the field of chip substrate processing technology, and particularly to a multi-station laser edge-sealing device for chip substrates based on a collaborative feeding structure. The device includes a U-shaped conveyor table, annular tracks on the inner walls of both sides of the U-shaped conveyor table, and a feeding station between the annular tracks for self-inspecting and fixing the placement surface of the chip substrate. The U-shaped conveyor table is equipped with a collaborative feeding station for anti-biased feeding of stacked chip substrates, and an edge-sealing station for flipping and correcting the chip substrates and removing excess adhesive. This invention first achieves anti-biased feeding of the chip substrates through the collaboration of the feeding and loading stations, and clarifies the placement status based on the difference in excess adhesive distribution on the front and back sides. Then, the feeding station autonomously uses negative pressure to adsorb and clamp the correctly placed substrates, precisely completing the laser ablation edge-sealing. For incorrectly placed substrates, the linked edge-sealing station automatically flips and corrects them, achieving automated processing from anti-biased feeding, clarifying the placement status, automatic error correction, and precise ablation edge-sealing.