51 results about "Photo ablation" patented technology

The invention provides a multi-energy-field auxiliary laser drilling method and device for a silicon carbide micropore with the large depth-diameter ratio, and relates to the technical field of hard and brittle material precision machining.The multi-energy-field auxiliary laser drilling method for the silicon carbide micropore with the large depth-diameter ratio comprises the following steps that a silicon carbide workpiece is ablated layer by layer through an ultrafast laser beam to form the micropore; and in the layer-by-layer ablation process, the workpiece or the ultrafast laser beam generates relative high-frequency micro-amplitude ultrasonic vibration in the axial direction of the micropore, and the low-temperature high-speed air flow is coaxially guided to an ablation point of the ultrafast laser beam so as to remove ablation products and cool the ablation point and the adjacent area of the ablation point. Through organic combination and synergistic effect of ultrafast laser ablation, ultrasonic vibration in the axial direction of a drill hole and coaxial low-temperature high-speed airflow, the problems that in the prior art, due to unsmooth chip removal of ablation products and the remarkable heat effect, the machining depth is limited, the hole wall quality is poor, and the machining efficiency is low are solved.

Described herein is a robotic laser ablation system that comprises a robot and processing circuitry. The robot has an end effector with laser componentry and a camera mounted thereto. Processing circuitry is configured, in response to stored instructions, to perform operations including: receiving the input image of a workpiece from the camera; segmenting the input image to produce an image segment that depicts at least a portion of the workpiece; applying a surface-fitting algorithm to generate a polynomial surface that is fit to the surface in the image segment; computing a set of surface normal vectors across the polynomial surface to generate a set of waypoints offset from the polynomial surface by an offset length; programmatically generating a motion path linking a plurality of the waypoints; and performing laser ablation of the surface of the portion of the workpiece based on the motion path.

The application discloses a device and a process for laser ablation induced controllable damage assisted grinding of hard and brittle materials, which adopts laser irradiation on the material surface, focuses the laser focal point on the material surface to be processed, removes and induces specific depth damage to the material by ablation. By controlling the laser power, scanning speed and ablation track, the degree and type of laser ablation induced thermal damage of the material are effectively controlled. The grinding path of the grinding wheel and the ablation path of the laser are controlled on the same axis, and the distance between the laser ablation and the grinding wheel grinding is set, and the workpiece ablation surface is ground under the preferred grinding parameters. The application systematically puts forward a quantitative control strategy for the degree of laser ablation damage of the material surface, removes the laser induced damage layer by accurate control of the material surface damage and precision grinding, and realizes high-efficiency and high-quality processing of the hard and brittle materials.

The invention discloses an electroplating solution for electroplating beryllium by using an organic solvent and a preparation method of a beryllium metal ribbon, and belongs to the technical field of metal manufacturing, the electroplating solution comprises the following raw materials: the organic solvent, a beryllium source, a reducing agent and a complexing agent; wherein the concentration of the beryllium source is 0.5 to 3 mol / L; the concentration of the reducing agent is 50-100g / L; the concentration of the complexing agent is 40-90 g / L. The invention also provides a preparation method of the beryllium metal thin strip, which comprises the following steps: by taking an aluminum plate as a cathode and a beryllium plate as an anode, electroplating a beryllium coating on the aluminum plate by using the electroplating solution; and removing the aluminum plate and the beryllium coating on one surface of the aluminum plate by laser ablation to obtain the beryllium metal thin strip. According to the method, the technical problem that the low-thickness beryllium metal thin strip cannot be obtained through a rolling technology is solved, beryllium resource waste and organic waste emission are remarkably reduced, and obvious environmental friendliness is achieved.

The application relates to the technical field of isotope detection, in particular to an isotope abundance and ratio detection device and method based on molecular emission spectrum. The device comprises a computer and a long-pulse laser unit, an optical path transmission unit, an LED illumination focusing unit, a three-dimensional displacement table and a spectrometer connected with the computer. The existing viewpoint considers that long-pulse laser is not conducive to micro-area excitation and high-resolution spectrum acquisition due to its wide pulse width, and is less applied in isotope subtle spectral line difference identification. The application breaks through the molecular emission cascade mechanism, enhances the signal intensity, realizes the possibility of micro-area high-resolution isotope molecular detection, generates plasma by in-situ laser ablation, induces molecular emission spectrum, realizes rapid, accurate and real-time in-situ detection of the isotope abundance and ratio in the sample. The device has few optical elements, simple structure and convenient optical path adjustment, and is conducive to miniaturization and on-site application promotion.

We provide a laser ablation system equipped with a robot and processing circuitry. [Solution] The robot has an end effector having a laser component and a camera. The circuit receives an input image of a workpiece from the camera in response to a memory command, segments the image to generate image segments that depict the workpiece, applies a surface fitting algorithm to generate a polynomial surface that fits the inner surface of the segments, calculates a set of surface normal vectors crossing the surface to generate a set of waypoints offset from the polynomial surface, programs a motion path connecting the multiple waypoints, and performs operations including laser ablation of the workpiece surface based on the motion path.

The invention discloses a PCB (printed circuit board) circuit laser ablation method. The PCB circuit laser ablation method comprises the following steps: drilling holes in a copper-clad plate; carrying out full-board electroplating on the drilled copper-clad plate, and forming an electroplating copper layer on the surface of the copper foil and the hole wall; forming a tin protection layer on the surface of the electroplating copper layer; ablating the tin protection layer by adopting laser to remove the tin protection layer in a non-circuit pattern area in the PCB design, and at least partially exposing the electroplating copper layer below the tin protection layer; etching the exposed copper layer to expose the dielectric layer; and removing the residual tin protection layer to form a PCB circuit pattern. The indispensable photosensitive dry film in the traditional negative film and positive film process and matched film pasting, exposure and development procedures are abandoned. Therefore, not only is the material cost generated by using the dry film directly eliminated, but also hidden quality dangers such as open circuit and short circuit of a circuit caused by damage of the dry film in the processing process are avoided, so that the product yield is remarkably improved.

The application discloses a variable parameter laser ablation effect fast prediction method based on a finite element model and a neural network model, and solves the problems of limited application scenarios, limited application material ranges and insufficient real-time performance in the prior art. The application obtains simulation data (i.e. a second data set) through a laser ablation effect finite element model, trains and tests a neural network model through the simulation data, obtains an optimal neural network model, and then obtains corresponding data of a material to be measured according to actual working conditions, sets a calculation time step and a laser irradiation time, combines the optimal neural network model, and realizes real-time prediction of the laser ablation effect, so that the calculation precision is high, the time consumption is short, and the method is suitable for fast prediction of the laser ablation effect in a strong dynamic scene.

This invention discloses a method for separating semiconductor wafers, comprising a scribing step: using a scribing tool to scribble lines on the surface of the semiconductor wafer to form separation channels; and a laser ablation step: controlling a laser beam to irradiate the separation channels and move along the separation channels until the semiconductor wafer is separated along the separation channels. This method can reduce the deformation generated during semiconductor separation, reduce the risk of semiconductor chipping and cracking, and improve product yield.

The invention provides a method for preparing a transparent antimony-based chalcogenide film and a photoelectric detector through selective deposition. The transparent photoelectric detector structure provided by the invention comprises a transparent glass substrate, a patterned substrate, a light absorption layer, a wide-band-gap oxide covering layer and a transparent conductive electrode. The transparent light absorption layer is an antimony-based chalcogenide film and is selectively deposited on the patterned substrate. The antimony-based chalcogenide film has different growth orientations and adhesion coefficients on different substrates, and regional selective deposition of the antimony-based chalcogenide film on the patterned substrate can be realized by regulating and controlling the temperature of the substrate. The method provided by the invention breaks through the limitation of the existing transparent photoelectric detector material, and avoids the pattern edge interface damage caused by the traditional patterning methods, such as a stripping method, an etching method and a laser ablation process. The prepared transparent photoelectric detector has the advantages of being simple in preparation, accurate in transparency regulation and control, wide in spectral response in the range of 405-980 nm and the like.

The invention relates to the technical field of chip substrate processing, in particular to chip substrate multi-station laser edge sealing equipment based on a collaborative feeding structure, which comprises a U-shaped conveying table and annular rails positioned on the inner walls of the two sides of the U-shaped conveying table, and a feeding station used for self-checking a chip substrate placing surface and adsorbing and fixing is arranged between the annular rails; the U-shaped conveying table is provided with a horizontal pushing station cooperating with the feeding station to carry out anti-deviation feeding on the stacked chip substrates and an edge sealing station for carrying out turn-over correction and excessive glue removal on the chip substrates. According to the invention, through cooperation of the loading station and the feeding station, anti-deviation loading of the chip substrate is realized, and the placement state is determined according to the distribution difference of excessive glue on the front and back surfaces; and then automatic negative pressure adsorption and clamping fixation are carried out on the correctly placed substrate through the feeding station, so that laser ablation edge sealing is precisely completed, automatic overturning correction is carried out on the wrongly placed substrate and the linkage edge sealing station, and automatic treatment of deviation-preventing feeding, placement state defining, automatic error correction and precise ablation edge sealing is achieved.

A method to refurbish electrostatic chucks includes identifying one or more layers on a minimal contact area (MCA) pad affixed to an electrostatic chuck, configuring a laser ablation system to remove the identified layers, ablating the identified layers with a controlled laser beam from the laser ablation system, identifying one or more deposited metals on the electrostatic chuck, and ablating the identified deposited metals with the laser beam. In another aspect, the MCA pad may include a diamond like carbon layer and a Ti-TiN layer. The laser ablation process removes the layers and deposited metals on an electrostatic chuck in a manner that is performed faster, with a lower cost, and without the use of a multistep chemical process compared to conventional chemical stripping methods.

The application relates to the technical field of diamond processing, in particular to a laser processing method for improving the surface roughness of a diamond, which comprises the following steps: after fixing and arranging a diamond sheet to be processed on a processing table assembly, adjusting a collimating and focusing mirror to be aligned with the surface of the diamond sheet, and preheating the surface of the diamond sheet by using a laser generator; after monitoring that the surface of the diamond sheet reaches a preset temperature, starting an ultrashort pulse laser generator to emit ultrashort pulse laser, and making the ultrashort pulse laser keep a large-interval alternate laser ablation along a preset path by a scanning galvanometer, so that the surface roughness of the diamond sheet reaches a preset value after the vertical alternate ablation along the path. The application can improve the efficient removal of the protruding particles on the surface of the diamond by setting a large-interval scanning path and adopting a four-step scanning method; the method is flexible and fast in operation, the required control system is simple and reliable, and the ablation efficiency of the product is improved.

A laser ablation system including a multi-angle support structure in the form of a carrier which positions multiple nut plates in an axial position along the same incident angle of the laser beam path. Aligning the axis of the nut plate along the radius of the delivered laser beam path minimizes the need for part manipulation during the laser ablation process to achieve similar cleaning results.

The application provides a fused quartz microlens array preparation device and method based on CO2 laser ablation rapid removal and fused quartz microlens array preparation method, and belongs to the field of photochemical processing. In order to solve the problems of high cost, poor thermal stability and difficult to control the machining precision when machining the microlens array of the fused quartz hard and brittle material, and difficult to obtain the low-cost and high-quality microlens array. The coupling model of thermodynamics and fluid mechanics is established, the rough machining structure is simulated to determine the rough machining parameters, the best scanning track is obtained through path planning, the high-power density CO2 laser is used for ablation removal of the fused quartz, and the rapid forming of the microstructure is realized; the low-power density CO2 laser is used for irradiating the microstructure, and the precise fusion polishing is realized. Through the use of a set of CO2 laser for machining the microlens array, the machining cost is reduced, the problem of repeated installation and positioning of the workpiece is avoided, the machining efficiency is further improved, and the high-quality microlens array is prepared with high efficiency and low cost.

A method includes performing a laser ablation process that removes a portion of a wafer to form a trench in a scribe region between adjacent die regions of the wafer, the trench extending from a first side of the wafer toward an opposite second side of the wafer, the trench extending through a metallization structure and an active circuit portion of the wafer, and a bottom of the trench spaced apart from the second side of the wafer. The method also includes performing a wafer expansion process that separates individual semiconductor dies from the wafer after the laser ablation process.

The invention discloses a purple phosphorus / patterned graphene composite multifunctional sensor and a preparation method and application thereof, and relates to the technical field of sensors. The preparation method comprises the following steps: immersing a copper foil sample loaded with graphene into corrosive liquid for etching, and transferring an obtained graphene film to the surface of a substrate after the copper foil is completely removed; processing the graphene film on the substrate by using a laser ablation method, and forming a micron-sized patterned graphene array on the surface of the graphene film; treating the blocky purple phosphorus by adopting a laser liquid phase stripping method to obtain a purple phosphorus nanosheet dispersion liquid; the surface of the patterned graphene array is coated with the obtained purple phosphorus nanosheet dispersion liquid, so that the purple phosphorus nanosheets are compounded with the patterned graphene, and a purple phosphorus / patterned graphene composite sensitive structure is formed; the electrodes are arranged at the two ends of the obtained composite sensitive structure, the purple phosphorus / patterned graphene composite multifunctional sensor is prepared, and high-performance detection of various signals is achieved while the preparation process is kept simple and reliable.

This invention provides a temperature control device for laser ablation-driven micro-impulse measurement experiments, based on a torsion pendulum micro-impulse measurement system. The torsion pendulum micro-impulse measurement system includes a laser, a focusing lens, a displacement stage, a torsion pendulum, a displacement sensor, and a data processing system arranged sequentially. The temperature control device is located in front of the torsion pendulum and fixedly connected to the displacement stage. The temperature control device includes a low-temperature heat sink, an electric heating element, and a temperature control chip, wherein the low-temperature heat sink is shaped to not obstruct the optical path. This solution achieves temperature control of the driven sample in laser ablation-driven impulse measurement experiments without affecting the impulse measurement process of the original torsion pendulum system.

The invention discloses a robot laser ablation system and method for curved-surface parts, and belongs to the technical field of laser machining. The robot laser ablation system comprises a six-degree-of-freedom mechanical arm, a laser machining head, a connecting plate, a console, a tool adjusting platform and a laser generator; according to the method, mechanical arm laser ablation device building, transformation matrix obtaining and curved surface part laser ablation are conducted, efficient laser ablation machining can be conducted on curved surface parts, and compared with traditional cutting or grinding, the machining effect of rapidly removing large allowance is achieved; as the laser processing does not need to directly contact with the parts, the parts are simple to mount and position; for machining with the high precision requirement, the method can serve as a rough machining scheme, a CAM program can be automatically converted into a mechanical arm machining file by means of numerical control program conversion software, and the mechanical arm machining instruction compiling difficulty is reduced.

Aspects of the disclosure include a membrane electrode assembly (MEA) with a trimmed proton-consuming electrode. An example vehicle comprises an electric motor, a battery, and an electrochemical cell with a proton-exchange membrane. The electrochemical cell includes a proton-generating electrode, a proton-consuming electrode, a membrane positioned between the proton-generating and proton-consuming electrodes (the proton-generating electrode, the proton-consuming electrode, and the membrane together forming a membrane electrode assembly), and a gas diffusion layer in direct contact with the proton-consuming electrode. The proton-consuming electrode is trimmed with respect to a first edge of the membrane and with respect to a second edge of the membrane. The first edge is orthogonal to the second edge.The proton-consuming electrode is cut to a focal depth that bypasses the membrane using laser ablation.

The utility model provides a kind of laser ablation surface treatment device and its production line, it is related to workpiece surface treatment technical field, the laser ablation surface treatment device includes workbench, first conveying mechanism, attitude adjusting mechanism and laser processing mechanism, first conveying mechanism includes first conveyor belt, and first conveyor belt is used to convey workpiece;Attitude adjusting mechanism includes adjusting drive component and two adjusting plates, two adjusting plates are spaced apart along the width direction of first conveyor belt, adjusting drive component is used to drive two adjusting plates to move towards each other or mutually far direction;Laser processing mechanism includes forward laser cleaning machine and lateral laser cleaning machine, the laser head of forward laser cleaning machine is set to the upper surface of workpiece, and the laser head of lateral laser cleaning machine is set to the side of workpiece. Through laser cleaning machine, workpiece is cleaned by laser burning, solve the problem that the existing device needs to be handheld and work, resulting in high labor intensity, low working efficiency.

The invention discloses a material surface in-situ diagnosis rapid sampling device based on a cascade local vacuum structure, a diagnosis device and a diagnosis method, and relates to the technical field of material surface in-situ diagnosis. The device comprises a sampling head assembly, a differential pumping system, a laser ablation module, a spectrum acquisition module and a gas sampling module, the sampling head assembly comprises two or more stages of nested cavity structures, the differential air exhaust system comprises a plurality of air exhaust units, and the air exhaust units are in one-to-one correspondence with the sealing cavities; the laser ablation module is used for emitting a laser beam to the surface of the to-be-tested material in the innermost layer of sealing cavity through a laser device through optical windows which are arranged on each layer of cavity and are coaxially aligned along the vertical direction; the spectrum acquisition module is used for acquiring an emission spectrum signal of the plasma through the optical window; and the gas sampling module is communicated with the sealing cavity. The sampling head assembly is arranged on the surface of the material to form a local sealing structure, and the surface of the material can be detected on site.

The invention relates to the technical field of semiconductor processing, and discloses a method for removing residual gallium on the back surface of a MicroLED chip, and the method comprises the steps: carrying out the preprocessing of the MicroLED chip after laser stripping; an inert gas laminar flow is applied to the surface of the residual gallium layer of the chip through a laminar flow nozzle which is coaxially arranged with the picosecond laser beam; and under the continuous action of the inert gas laminar flow, a picosecond laser beam is adopted to scan the residual gallium layer so as to realize removal. According to the method, the gallium layer is selectively removed by utilizing the cold processing characteristic of the picosecond laser, and thermal damage to the chip body is avoided; meanwhile, the coaxial inert gas laminar flow can immediately blow away the ablation product to prevent redeposition pollution, and the plasma shielding effect generated in the laser ablation process can be inhibited to improve the machining stability. The method provided by the invention has the beneficial effects of high removal selectivity, low substrate damage, high surface cleanliness after processing, good process stability and the like.

A method for ablating a coating film, cutting glass, and performing post-treatment by using a laser according to the present invention includes coating one side or both sides of thin mother glass with a coating solution for preventing chemical contact in order to proceed with selective chemical treatment, drying the coating solution to form a coating film on one side or both sides of the thin mother glass, obtaining thin-film glasses in cell units applied to electrical and electronic products from the thin mother glass, healing a laser-cut surface of the cut thin-film glasses in cell units through selective chemical treatment of the cut thin-film glasses in cell units, cleaning the thin-film glasses in cell units, and then ablating all of a coating film formed on a surface of the thin-film glasses in cell units, and cleaning the thin-film glasses in cell units from which all of the coating film has been ablated and then chemically healing the surface of the thin-film glasses in cell units in order to eliminate defects or flaws on the surface of the thin-film glasses in cell units from which all of the coating film has been ablated.

The invention discloses a cobalt-chromium-molybdenum alloy laser ablation microstructure and a preparation method and application thereof, and aims to solve the problems that the laser ablation rule of the cobalt-chromium-molybdenum alloy surface microstructure is imperfect and surface defects easily exist in laser processing, the single-pulse ablation threshold value of the cobalt-chromium-molybdenum alloy is firstly explored, and reference is provided for subsequent experiment values; secondly, carrying out an orthogonal experiment by taking the process parameters as factors and taking the depth and the bottom roughness of the microstructure as responses, and selecting optimal process parameters; and finally, the surface of the sample is subjected to fluid polishing, and the cobalt-chromium-molybdenum alloy surface microstructure which meets the expected design size and is good in surface quality is obtained. The method provided by the invention has the characteristics that proper process parameters can be found more conveniently, the machining size conforms to the expected design, the interior of the microstructure is fully and smoothly machined, the surface roughness is low, the surface quality is high and the like, and can be applied to the technical field of metal or alloy surface microstructure preparation.

The utility model discloses a kind of processing devices of double-sided positioning processing wafer, including pedestal, and laser processing mechanism, processing fixture, lower camera and upper camera being located on pedestal;The laser processing mechanism is used to carry out laser processing to the wafer to be processed placed on processing fixture;Wafer placement area is provided on the processing fixture, and multiple positioning through holes are provided in wafer placement area and are penetrated;The lower camera is used to shoot multiple positioning through holes from below;The upper camera is used to shoot wafer placement area from above;When the front of the wafer to be processed is placed downward, laser processing mechanism is used to carry out punching treatment to the wafer to be processed;When the front of the wafer to be processed is placed upward, laser processing mechanism is used to carry out slotting treatment to the wafer to be processed;This scheme can minimize the quality influence of laser ablation product on wafer chip circuit, solve the chip processing technology problem of this kind of special needs.

The invention provides a plume velocity vector measurement system based on double-path interference Rayleigh scattering. The plume velocity vector measurement system comprises an optical path subsystem, an optical sub-imaging system and a general subsystem, the light path subsystem is used for generating multi-beam interference to form an interference ring pattern; the optical sub-imaging system is used for capturing and enhancing interference fringe images; and the general subsystem is used for providing a controllable flow field measurement environment and simulating a real thruster jet flow working condition. The method is suitable for non-contact velocity diagnosis in complex environments such as thruster plume, laser ablation plume and combustion jet flow, has high precision, high integration level and strong anti-interference capability, and provides a reliable technical means for thruster performance evaluation and flow field diagnosis.

To provide a laser ablation system that allows for flexible and highly accurate setting of the optimal focusing diameter and laser output according to the material, shape, and purpose of analysis of the object being analyzed. [Solution] A variable magnification beam expander capable of continuously varying the beam diameter of the laser light is placed in the optical path leading to a focusing lens that concentrates the laser light, enabling the setting of any focal diameter according to the sample. In addition, an optical modulator capable of rapidly modulating the output of the laser light is provided, allowing for optimal control of the output for each irradiation position and material.

The present invention provides methods of manufacturing devices with a multilayer structure in which a layer of the multilayer structure is treated with a laser and devices in which one of the layers has been treated with a laser. The invention also relates to devices manufactured by the methods. In some embodiments the invention provides a method of manufacturing a device, the method including the steps of: forming a multilayer structure having a first layer in contact with a second layer, wherein the first layer is formed of a conductive or semiconductive material and has a thickness of no more than 1 pm, and the second layer is formed of an insulating material; and selectively removing, by laser ablation, one or more portions of the second layer to form a pattern in said second layer without damaging the first layer. In other embodiments the invention provides a method of manufacturing a device, the method including the steps of: forming a first layer of a first material; forming a second layer of a second material, different to the first material, on the first layer; and selectively treating, using a laser, one or more portions of the second layer to form a pattern in said second layer, wherein: the laser ablation uses a pulsed laser having a pulse length of no more than 1 picosectond; and the laser that has a beam divergence of at least 10 degrees, preferably at least 12 degrees.

This invention provides a method and apparatus for femtosecond laser feedback shaping of surface micro / nano structures, belonging to the field of laser application technology. Addressing the problems of low edge precision and low efficiency in femtosecond laser processing, this invention replaces the two reflectors of a Michelson interferometer with two spatial light modulators: the first spatial light modulator loads a patterned phase map to define the processing shape, and the second spatial light modulator calculates a corrected phase based on the difference between the measured light field intensity and the theoretical light intensity and loads a corrected phase map, achieving closed-loop feedback shaping and obtaining a high-quality patterned light field. After beam contraction via a multi-stage 4f system, the micro / nano structure is ablated by single-pulse surface exposure, and large-area, high-efficiency fabrication is achieved by combining serial flying scan stitching. This invention requires no mask or vacuum environment, offers high processing precision and efficiency, and can flexibly customize various metasurface micro / nano structures.