Manufacturing process of printed circuit board with steps and printed circuit board

Abstract

The invention discloses a manufacturing process of a printed circuit board with a step, which comprises the following steps: external light imaging: manufacturing a circuit pattern on a copper-clad plate in a dry film pasting mode, designing a dry film removal effect at the step position, and exposing copper on the side wall and the bottom of the step; electroplating copper and tin: sequentially electroplating a copper layer and a tin layer on the circuit pattern area on the copper-clad plate; step bottom laser tin burning: exposing the electrocoppering layer at the bottom of the step by meansof laser ablation of the tin layer; etching: after the dry film on the copper-clad plate is removed, etching off the exposed copper layer on the copper-clad plate to obtain the copper-clad plate of which the circuit pattern is covered by the tin layer; and tin removing: removing the tin layer on the copper-clad plate to obtain the printed circuit board with the outer layer circuit. According to the technological method, the technological process is shortened, and the manufacturing speed is increased. The invention further discloses a printed circuit board manufactured by adopting the manufacturing process. The printed circuit board is provided with a step mechanism.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a manufacturing process of a stepped printed circuit board and the printed circuit board. Background technique [0002] As the large-scale design of the high-end PCB market accelerates towards high-frequency and high-speed design, printed circuit boards designed with steps (cavities) can greatly improve the heat dissipation of components, and printed circuit boards can achieve better shielding effects, and printed circuit boards The volume of the circuit board can be made smaller. Subsequently, higher requirements have been put forward for production and manufacturing. Conventional printed circuit board pattern transfer is realized on a flat surface through special dry film, but for printed circuit boards designed with steps (cavities), dry film It is impossible to stick tightly on the protruding or concave position, and it is impossible to complete the graphic tr...

AI Technical Summary

Problems solved by technology

Subsequently, higher requirements have been put forward for production and manufacturing. Conventional printed circuit board pattern transfer is realized on a flat surface through special dry film, but for printed circuit boards designed with steps (cavities), dry film It is impossible to stick tightly on the protruding or concave position, and it is impossible to complete the graphic transfer on the outer layer of the copper clad laminate at one time. The inner layer of the graphic at the bottom of the step is etched out first, and then laminated, or the bottom of the step only supports full metal retention. (or not to keep) the only choice, when designing steps with multiple depths, the side walls of the steps are covered with metal and the bottom has different electrical patterns, the traditional process cannot complete the pattern transfer at the bottom of the steps, so it is necessary to study the ability to complete the surface layer at one time and the technology of graphic transfer at the bottom of the steps

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