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Ultrafast continuous three-dimensional imaging system and method for ultrashort pulse laser ablated object

A technology of ultra-short pulse laser and three-dimensional imaging, which is applied in laser welding equipment, radio wave measurement system, TV system components, etc. It can solve the problem of difficult to obtain the surface topography of objects and achieve the effect of enhancing continuous observability

Active Publication Date: 2021-06-04
BEIJING INSTITUTE OF TECHNOLOGYGY
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Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problem that it is difficult to obtain the surface topography of the object during the continuous action of the ultrashort pulse laser on the ablation object, and it is impossible to carry out ultrafast continuous and effective observation of the interaction mechanism between the object material and the laser. An ultrafast continuous 3D imaging system and method for ultrashort pulse laser ablation objects, which can realize the acquisition and restoration of 3D contour information on the object surface with ultrahigh temporal resolution

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  • Ultrafast continuous three-dimensional imaging system and method for ultrashort pulse laser ablated object
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  • Ultrafast continuous three-dimensional imaging system and method for ultrashort pulse laser ablated object

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Embodiment 1

[0029] The ultrashort pulse laser source 1 emits a horizontally polarized pulse laser with a pulse width of 50 fs, which is reflected by the first beam splitter-beam combiner 2 as a pump beam and transmitted as a probe beam. The pumping beam is adjusted by the first reflector 6, and then transformed into vertically polarized light by the polarizer 7, and then passes through the time delay platform 8, the V reflector 20 and the VI reflector 21, and is focused on the sample by the lens. 9 surface for ablation; during the propagation of the pump beam, the probe beam first enters the supercontinuum generator 3 composed of an objective lens, a photonic crystal fiber and an objective lens to generate a supercontinuum spectrum with a spectrum of 350nm-1100nm, and then passes through The pulse separator 4 separates the spectrum in time, and the time interval of several femtoseconds can be realized between each spectrum; the pulse sequence λ with multiple spectrums n (350nm-1100nm) int...

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Abstract

The invention relates to an ultrafast continuous three-dimensional imaging system and method for an ultrashort pulse laser ablated object, and belongs to the field of ultrafast imaging. According to the invention, the acquisition and restoration of three-dimensional contour information of an object surface with ultrahigh time resolution can be realized. The system specifically comprises an ultrashort pulse laser light source, a super-continuum spectrum generator, a pulse separation delayer, a multi-frequency pulse interference fringe generator, a polarizer, a time delay platform, a sample, an image acquisition device, a computer, a beam splitting-beam combining mirror, a reflecting mirror, and an image three-dimensional contour extraction method. According to the invention, ultrafast continuous three-dimensional observation in the process of ablating an object material by ultrashort pulse laser can be realized, the time resolution reaches femtosecond-picosecond magnitude, the surface three-dimensional shape of an object in the processing process can be presented, the continuous observability in the experiment process is enhanced, and an important auxiliary effect is provided for the mechanism research of ablating the processed object by the ultrashort pulse laser.

Description

technical field [0001] The invention relates to an ultrafast continuous three-dimensional imaging system and method for ultrashort pulse laser ablation objects, belonging to the field of ultrafast imaging. Background technique [0002] Ultrashort pulse lasers have very short timescales (ns-ps-fs) and ultrahigh energy densities (>10 14 W / cm 2 ), can be used to process some fine and complex micro-nano structures on the surface or inside of materials. However, the interaction between ultrashort pulse laser and materials is a transient process, and the mechanism phenomenon is very difficult to observe. Including laser shock wave front propagation in picosecond time scale, material molecular relaxation vibration, etc.; molecular structure movement in femtosecond time scale, semiconductor carrier movement, plasma formation, etc. or internal morphology to explain its processing mechanism, but the mechanism of the intermediate reaction process is very complicated and often not...

Claims

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Application Information

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IPC IPC(8): B23K26/362B23K26/70
CPCB23K26/362B23K26/702G01S7/484G01B11/25G01B9/02014G01S17/89G01S17/894G01B11/2513H04N25/71
Inventor 姜澜郭宝山张天勇
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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