Mold pattern processing device and processing technology

Abstract

The invention relates to the technical field of mold machining, and discloses a mold pattern machining device and a machining technology.The mold pattern machining device comprises a lifting plate which is arranged in a sliding mode and driven by a servo air cylinder to slide, the lifting plate comprises a containing table used for containing a mold, and the mold pattern machining device further comprises a shielding plate which is fixedly arranged and located above the lifting plate; an opening allowing a mold to penetrate through is formed in the baffle plate, and two sets of clamping mechanisms are installed on the baffle plate and are arranged in a bilateral symmetry mode; the clamping mechanism comprises an extrusion plate which elastically and obliquely slides relative to the baffle plate. According to the device, the lifting process of the lifting plate is ingeniously utilized to move a mold to a machining station, meanwhile, the two extrusion plates can be driven to elastically slide so that the mold can be clamped and fixed by the two extrusion plates, and mold fixing and mold moving to the machining station are conducted at the same time; therefore, the die does not need to be independently fixed after being moved to a machining station, additional fixing operation is reduced, and operation procedures are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of mold processing, and in particular to a mold pattern processing device and a processing technology. Background Art

[0002] Molds are widely used in punching, die forging, cold heading, extrusion, powder metallurgy pressing, pressure casting, and compression or injection molding of engineering plastics, rubber, ceramics and other products. For example, in injection molds, the heated and molten material is injected into the mold cavity by high pressure, and the molded product is obtained after cooling and solidification. For molded products with patterns on the surface, the corresponding pattern shape needs to be processed in the mold cavity by a processing device.

[0003] For example, the Chinese invention patent with application number CN202111526364.X, publication (announcement) number CN114131405B, and name "A mold pattern processing device and method", transports the mold body to the processing positioning hole through the support rod, and then drives the two clamping plates to approach through the pressing push rod, thereby pressing the two sides of the mold body to lock the processing position of the mold body, and drives the driven gear ring to rotate through the rotating drive member, and then cooperates with the three lifting push rods to adjust the drilling angle of the cutter head, and then drives the driving motor to complete the feeding through the feed push rod, thereby completing the pattern processing. The invention can carry out flow-type transmission of the mold body, and can process the workpiece by quickly switching between the upper and lower workstations, and at the same time cooperate with the adjustment of the processing angle of the cutter head to meet the pattern processing in all directions inside the mold. The entire processing process is fast, which effectively improves the processing efficiency of the mold pattern and is highly practical.

[0004] Although the mold pattern processing device and method of the above-mentioned invention patent can improve the processing efficiency to a certain extent, the inventor found in the actual processing process that the existing technology and the above-mentioned patent have the same disadvantages: since the mold needs to be fixed by a fixing mechanism when performing pattern processing, the mold is fixed in the prior art by manually operating the fixing mechanism to clamp and fix the mold, or by electric means as in the above-mentioned patent. However, whether it is manual fixation or electric fixation, it is necessary to clamp and fix the mold through a separate clamping and fixing operation after the mold is moved to the processing station, which undoubtedly increases the operating procedures and reduces the processing speed. Summary of the invention

[0005] The purpose of the present invention is to provide a mold pattern processing device and a processing technology to solve the above-mentioned shortcomings in the prior art.

[0006] In order to achieve the above-mentioned object, the present invention provides the following technical solutions: a mold pattern processing device, comprising a lifting plate that is slidably arranged and driven to slide by a servo cylinder, the lifting plate comprising a placement table for placing the mold, and also comprising a shielding plate that is fixedly arranged and located above the lifting plate, the shielding plate is provided with an opening for the mold to pass through, and two groups of clamping mechanisms are installed on the shielding plate, and the two groups of clamping mechanisms are arranged symmetrically on the left and right; The clamping mechanism comprises a pressing plate elastically and obliquely slidably arranged relative to the shielding plate, and the bottom of the pressing plate is in sliding abutment with the lifting plate; When the servo cylinder drives the lifting plate to slide upward, the lifting plate drives the mold upward to be inserted between the two extrusion plates, and pushes the two extrusion plates to slide elastically toward the mold so that the mold moves to the processing station and is clamped and fixed by the two extrusion plates.

[0007] The above-mentioned mold pattern processing device, the extrusion plate includes an integrally arranged inclined plate and a clamping plate, the inclined plate is inclined from top to bottom and outward, two groups of fixed plates corresponding to the two extrusion plates are fixedly installed on the shielding plate, the number of fixed plates in each group is two, the inclined plate is slidably arranged between the corresponding two fixed plates, an extension plate is fixedly installed on each of the fixed plates, a compression spring is installed between the inclined plate and each extension plate, and the inclined plate is inserted into the opening to extrude the fixed mold.

[0008] In the above-mentioned mold pattern processing device, a baffle plate is fixedly installed on the side where the two inclined plates are away from each other. When the two extrusion plates clamp the fixed mold, a gap is generated between the side where the two inclined plates are away from each other and the baffle plate. The debris generated when the mold is processed with patterns splashes into the gap and then falls into the baffle plate for collection.

[0009] The above-mentioned mold pattern processing device, the enclosing plate includes a receiving plate, a containing plate, and a bottom plate. The receiving plate is integrally arranged with the containing plate, the receiving plate is located above the containing plate, the top opening of the receiving plate extends outward and opens, the containing plate is used to receive debris, and the bottom plate is elastically rotatably arranged at the bottom of the containing plate by an elastic mechanism to seal the bottom of the containing plate.

[0010] The above-mentioned mold pattern processing device, the clamping mechanism also includes a compacting plate fixedly connected to the baffle plate through a connecting plate, the side surface of the compacting plate is slidably fitted with the outer side surface of the inclined plate, the compacting plate is plug-matched with the inside of the receiving plate, and in the initial state, the bottom of the compacting plate is located above the receiving plate, and the lifting plate pushes the two extrusion plates upward and slides elastically toward the mold, and the bottom of the compacting plate is gradually inserted into the receiving plate to compact the loose debris in the receiving plate.

[0011] The above-mentioned mold pattern processing device, after the mold completes pattern processing and is removed, the servo cylinder drives the lifting plate to slide upward continuously to drive the two extrusion plates to slide elastically continuously, and then drives the bottom of the compacting plate to be continuously inserted into the receiving plate to squeeze the compacted debris and push the bottom plate to rotate elastically until the compacted debris is discharged from the receiving plate.

[0012] In the above-mentioned mold pattern processing device, the thickness of the compacting plate gradually decreases from low to high to increase the distance between the compacting plate and the receiving plate, thereby increasing the volume of the receiving plate so that the debris generated during pattern processing can fall into the receiving plate.

[0013] In the above-mentioned mold pattern processing device, a movable plate is rotatably provided on the left and right sides of the opening, and the two clamping plates are located between the two movable plates. In the initial state, the sides of the two clamping plates that are away from each other are in one-to-one correspondence with the ends of the two movable plates that are close to each other.

[0014] In the above-mentioned mold pattern processing device, the two movable plates correspond to the two receiving plates one by one. When the mold is processing the pattern, the receiving plate and the movable plate are not in contact. In the process that the bottom of the compacting plate pushes the compacted debris to be discharged from the containing plate, the two receiving plates push the corresponding two movable plates upward to rotate so that the debris falling on the movable plate slides into the two receiving plates for collection.

[0015] A mold pattern processing technology, based on the above-mentioned mold pattern processing device, comprises the following steps: S1: Loading: First, adjust the lifting plate to the initial position through the servo cylinder, place the mold on the placement table and abut it against the abutment plate; S2: Move to the processing station: Start the servo cylinder to drive the lifting plate to drive the mold to move upward, so that the mold extends upward from the opening, and the lifting plate slides against the bottom of the two extrusion plates to push the two extrusion plates to slide elastically toward the mold until the two extrusion plates clamp the mold. At this time, the mold moves to the processing station and is automatically fixed; S3: Chip collection: The mold is patterned by starting the tool assembly, and a large amount of chips are generated during the processing. When the mold is fixed, gaps are generated between the sides of the two inclined plates that are away from each other and the shielding plate. The chips pass through the two gaps and fall into the receiving plates of the two enclosure plates for collection; S4; Debris compaction: The lifting plate pushes the two extrusion plates upwards and slides elastically toward the mold, and the bottom of the compaction plate is gradually inserted into the receiving plate to compact the loose debris in the receiving plate; S5: Debris discharge: After the mold completes pattern processing and is removed, the servo cylinder drives the lifting plate to slide upward continuously to drive the two extrusion plates to slide elastically continuously, and then drives the bottom of the compacting plate to be continuously inserted into the receiving plate to squeeze the compacted debris and push the bottom plate to rotate elastically until the compacted debris is discharged from the receiving plate.

[0016] Beneficial effects: In the above technical scheme, the present invention provides a mold pattern processing device and processing technology, through the creative design of the clamping mechanism, so that the clamping mechanism is connected with the lifting plate, and the lifting plate is cleverly used to move the mold to the processing station while driving the two extrusion plates to slide elastically so that the mold is clamped and fixed by the two extrusion plates. The mold is fixed and the mold is moved to the processing station at the same time, so there is no need to perform a separate fixing operation after the mold is moved to the processing station, which reduces additional fixing operations, thereby reducing the operating procedures, and can effectively solve the shortcomings of the prior art; The present invention improves the structure of the clamping mechanism, which can not only fix the mold, but also collect debris. Furthermore, the clamping mechanism in the present invention is provided with a compacting plate, so that when the lifting plate pushes the extrusion plate to slide upward to clamp and fix the mold, it will drive the baffle plate to move upward synchronously, while the compacting plate is fixed. At this time, the bottom of the compacting plate is continuously inserted into the containing plate to compact the loose debris in the containing plate, thereby effectively reducing the volume of the debris and increasing the collection amount of the containing plate. It can be seen that the present invention utilizes the structural design of the clamping mechanism, which can cleverly and synchronously realize the compaction of the debris in the process of fixing the mold, thereby producing an unexpected technical effect of increasing the amount of debris collected by the containing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0018] Figure 1 A schematic front view of the structure of a mold pattern processing device provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure when the tool assembly is removed according to an embodiment of the present invention; Figure 3 The embodiment of the present invention provides Figure 2 A schematic diagram of the enlarged structure of part A; Figure 4 A schematic structural diagram of a clamping mechanism provided by an embodiment of the present invention from a first viewing angle; Figure 5 The embodiment of the present invention provides Figure 4 A schematic diagram of the enlarged structure of part B in FIG. Figure 6 A schematic structural diagram of a clamping mechanism from a second viewing angle provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a clamping mechanism provided by an embodiment of the present invention from a third viewing angle; Figure 8 A schematic diagram of the disassembled structure of the clamping mechanism provided in an embodiment of the present invention; Fig. 9 A schematic cross-sectional view of the structure between the clamping mechanism, the shielding plate and the movable plate provided in an embodiment of the present invention; Fig.10 A schematic cross-sectional structural diagram of a mold placed on a placement table in an initial state provided by an embodiment of the present invention; Fig.11 A schematic cross-sectional view of the lifting plate and the extrusion plate when they are in contact with each other provided by an embodiment of the present invention; Fig.12 A schematic cross-sectional view of a mold provided by an embodiment of the present invention when it is clamped and fixed by two extrusion plates; Fig.13 A schematic cross-sectional structural diagram of the movable plate provided in an embodiment of the present invention when being pushed upward by a receiving plate.

[0019] Description of reference numerals: 1. Base; 2. Bracket; 3. Tool assembly; 4. Servo cylinder; 5. Lifting plate; 501. Placement table; 502. Abutment plate; 6. Shielding plate; 601. Opening; 602. Movable plate; 7. Vertical pole; 8. Extrusion plate; 801. Inclined plate; 8011. Inclined groove; 802. Clamp plate; 9. Enclosing plate; 901. Receiver plate; 902. Accommodation plate; 903. Bottom plate; 10. Compression spring; 11. Fixed plate; 1101. Inclined guide plate; 12. Extension plate; 13. Ball; 14. Rotating rod; 15. Linking plate; 16. Limiting block; 17. Arc rod; 18. Reset spring; 19. Compacting plate; 1901. Connecting plate; 20. Rotating shaft; 21. Mold. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0021] First embodiment: like Figure 1-13 As shown, a mold pattern processing device provided by an embodiment of the present invention includes a lifting plate 5 that is slidably arranged and driven to slide by a servo cylinder 4, the lifting plate 5 includes a placement table 501 for placing a mold 21, and also includes a shielding plate 6 that is fixedly arranged and located above the lifting plate 5, and an opening 601 for the mold 21 to pass through is opened on the shielding plate 6, and two groups of clamping mechanisms are installed on the shielding plate 6, and the two groups of clamping mechanisms are arranged symmetrically on the left and right; The clamping mechanism comprises a pressing plate 8 which is elastically and obliquely slidably arranged relative to the shielding plate 6, and the bottom of the pressing plate 8 is in sliding contact with the lifting plate 5; When the servo cylinder 4 drives the lifting plate 5 to slide upward, the lifting plate 5 drives the mold 21 to be inserted upward between the two extrusion plates 8, and pushes the two extrusion plates 8 to slide elastically toward the mold 21 so that the mold 21 moves to the processing station while being clamped and fixed by the two extrusion plates 8.

[0022] The mold pattern processing device provided in this embodiment is used for pattern processing of the mold, and the words related to the direction and position involved in this embodiment are relative to the attached drawings. Specifically, the mold pattern processing device includes a base 1, on which a plurality of vertical rods 7 are fixedly installed, a lifting plate 5 is slidably plugged with the plurality of vertical rods 7, a shielding plate 6 is located on the lifting plate 5 and is fixedly connected with the plurality of vertical rods 7, a servo cylinder 4 is fixedly installed on the base 1, and is used to drive the lifting plate 5 to move up and down, and the servo cylinder 4 can also be replaced by other driving devices such as electric cylinders, a bracket 2 is also fixedly installed on the base 1, and a tool assembly 3 for processing patterns is arranged on the bracket 2, and an air nozzle (not shown in the figure) is arranged on one side of the tool assembly 3, which is used to blow away the debris generated when processing the pattern through gas to prevent affecting the continuous processing, and the tool assembly 3 and the air nozzle can move up and down, left and right, and forward and backward. The structure and moving method of the tool assembly 3 and the air nozzle are all existing technologies and are not repeated here.

[0023] Among them, the power output end of the servo cylinder 4 is fixedly installed at the center of the lifting plate 5. When the lifting plate 5 moves up and down, it drives the placement table 501 to move up and down synchronously. The placement table 501 is used to place the mold 21. A support plate 502 is fixedly installed on the rear side of the top of the placement table 501. When the mold 21 is placed, the rear side surface of the mold 21 abuts against the support plate 502, so that when the mold 21 is clamped and fixed by two sets of clamping mechanisms, the mold 21 can be centered. There are two clamping mechanisms, which are arranged symmetrically on the left and right. In the initial state, the distance between the two clamping mechanisms is greater than the length of the mold 21 in the left and right directions so that the mold 21 can enter between the two clamping mechanisms. The clamping mechanism includes an extrusion plate 8 elastically and obliquely slidably arranged relative to the baffle plate 6. The bottom of the extrusion plate 8 is slidably abutted against the lifting plate 5. The clamping of the mold 21 by the two extrusion plates 8 is realized by clamping the mold 21. The sliding power of the extrusion plate 8 comes from the driving force when the lifting plate 5 moves upward. The extrusion plate 8 moves obliquely upward when it slides elastically, and the oblique direction is toward the mold 21. Therefore, when the lifting plate 5 pushes the two extrusion plates 8 to slide obliquely, the distance between the two extrusion plates 8 and the mold 21 will be continuously reduced until the two extrusion plates 8 clamp and fix the mold 21. The process of the two extrusion plates 8 clamping and fixing the mold 21 is also the process of moving the mold 21 upward to the processing station. The mold 21 has the same shape and size, so when the mold 21 is clamped and fixed, the height of its upward movement is the same. At this time, the position of the mold 21 is the processing station. Therefore, the invention achieves the clamping and fixing of the mold 21 while moving the mold 21 to the processing station.

[0024] Its working principle is: first, the lifting plate 5 is adjusted to the initial position by the servo cylinder 4, and the mold 21 is placed on the placement table 501 and abutted against the abutment plate 502. Then, the servo cylinder 4 is started to drive the lifting plate 5 to drive the mold 21 to move upward, so that the mold 21 extends upward from the opening 601, and at the same time, the lifting plate 5 slides and abuts against the bottom of the two extrusion plates 8 to push the two extrusion plates 8 to slide elastically upward toward the direction of the mold 21 until the two extrusion plates 8 clamp and fix the mold 21. At this time, the mold 21 also moves to the processing station. It can be seen that the present invention establishes a connection between the clamping mechanism and the lifting plate 5 through the creative design of the clamping mechanism, and cleverly utilizes the rising process of the lifting plate 5 to realize moving the mold 21 to the processing station, while driving the two extrusion plates 8 to slide elastically so that the mold 21 is clamped and fixed by the two extrusion plates 8. The fixation of the mold 21 and the movement of the mold 21 to the processing station are carried out simultaneously, so that there is no need to perform a separate fixing operation after the mold 21 is moved to the processing station, thereby reducing additional fixing operations, thereby reducing operating procedures, and being able to improve the processing speed of the mold 21, which can effectively solve the shortcomings of the prior art.

[0025] In this embodiment, the extrusion plate 8 includes an integrally arranged inclined plate 801 and a clamping plate 802. The inclined plate 801 is inclined from top to bottom and outward. Two groups of fixed plates 11 corresponding to the two extrusion plates 8 are fixedly installed on the shielding plate 6. There are two fixed plates 11 in each group. The inclined plate 801 is slidably arranged between the corresponding two fixed plates 11. An extension plate 12 is fixedly installed on each fixed plate 11. A compression spring 10 is installed between the inclined plate 801 and each extension plate 12. The inclined plate 801 is inserted into the opening 601 to extrude the fixed mold 21. Specifically, one end of the compression spring 10 is fixedly connected to the extension plate 12, and the other end is fixedly connected to the inclined plate 801. Based on the elasticity of the compression spring 10, the elastic sliding of the extrusion plate 8 is realized, and the front and rear sides of the inclined plate 801 are symmetrically provided with inclined grooves 8011. An inclined guide plate 1101 corresponding to the inclined groove 8011 is fixedly installed on the fixed plate 11. The inclined guide plate 1101 is slidably inserted in the inclined groove 8011 to realize the inclined sliding of the extrusion plate 8. In the initial state, the top of the inclined groove 8011 abuts against the top of the inclined guide plate 1101 to realize the limiting of the extrusion plate 8.

[0026] The two inclined plates 801 are fixedly installed with a baffle plate 9 on the side away from each other. When the two extrusion plates 8 clamp the fixed mold 21, a gap is generated between the side of the two inclined plates 801 away from each other and the baffle plate 6. The debris generated when processing the pattern of the mold 21 splashes into the gap and then falls into the baffle plate 9 for collection. Specifically, a bottom-blocked space is formed between the baffle plate 9 and the inclined plate 801, and the top of the baffle plate 9 is open. When the two extrusion plates 8 tilt and slide, a gap will be generated between the baffle plate 6. When the two extrusion plates 8 clamp the mold 21, the gap corresponds to the top opening of the baffle plate 9. When the pattern processing is carried out, the debris generated is randomly scattered due to being blown away by the air nozzle, and some of the debris falls into the gap and then falls into the baffle plate 9. The baffle plate 9 and the extrusion plate 8 are both part of the clamping mechanism. It can be seen that by improving the structure of the clamping mechanism, it can not only produce a fixing effect on the mold 21, but also produce a function of collecting debris.

[0027] The enclosure plate 9 includes a receiving plate 901, a receiving plate 902, and a bottom plate 903. The receiving plate 901 and the receiving plate 902 are integrally arranged. The receiving plate 901 is located above the receiving plate 902. The top opening of the receiving plate 901 extends outward and opens. The receiving plate 902 is used to receive debris. The bottom plate 903 is elastically rotated and arranged at the bottom of the receiving plate 902 through an elastic mechanism to block the bottom of the receiving plate 902. Specifically, the bottom of the receiving plate 902 is blocked by the bottom plate 903, and the debris enters the enclosure plate 9 from the top opening of the receiving plate 901, and then enters the receiving plate 902 for collection. Among them, a rotating rod 14 is integrally provided at the center of the bottom plate 903, and the rotating rod 14 is rotatably connected to the containing plate 902. The elastic mechanism includes a linkage plate 15, a limit block 16, an arc rod 17, and a return spring 18. The linkage plate 15 is fixedly connected to the end of the rotating rod 14, and the limit block 16 is fixedly installed on the side of the containing plate 902. One end of the arc rod 17 is fixedly connected to the linkage plate 15, and the other end is slidably inserted into the limit block 16. The return spring 18 is sleeved on the arc rod 17, and the arc center of the arc rod 17 falls on the central axis of the rotating rod 14. One end of the return spring 18 abuts against the linkage plate 15, and the other end abuts against the limit block 16. In the initial state, based on the elastic force of the return spring 18, the bottom plate 903 is located at a specific angle. At this time, the bottom plate 903 blocks the bottom opening of the containing plate 902. At this time, the debris falling into the baffle plate 9 is supported by the bottom plate 903.

[0028] Each bottom plate 903 is configured with two elastic mechanisms, and the two elastic mechanisms are arranged one by one at the two ends of the rotating rod 14, so as to improve the force balance of the bottom plate 903.

[0029] Furthermore, the clamping mechanism also includes a compacting plate 19 fixedly connected to the shielding plate 6 through a connecting plate 1901, the side of the compacting plate 19 slides in contact with the outer side of the inclined plate 801, and the compacting plate 19 is internally plugged into the containing plate 902. In the initial state, the bottom of the compacting plate 19 is located above the containing plate 902 to allow debris to enter the containing plate 902. When the lifting plate 5 pushes the two extrusion plates 8 upward and slides elastically toward the mold 21, the bottom of the compacting plate 19 is gradually inserted into the containing plate 902 to compact the loose debris in the containing plate 902. Specifically, since the debris is in a loose state when it falls into the receiving plate 902 and occupies more collection space, the amount of collected debris will be reduced when the space size is constant. The clamping mechanism in the present invention increases the setting of the compacting plate 19, so that when the lifting plate 5 pushes the extrusion plate 8 to slide upward to clamp the fixed mold 21, it will drive the baffle plate 9 to move upward synchronously, while the compacting plate 19 is fixed. At this time, the bottom of the compacting plate 19 is continuously inserted into the receiving plate 902 to compact the loose debris in the receiving plate 902, thereby effectively reducing the volume of the debris and increasing the collection amount of the receiving plate 902. It can be seen that the present invention utilizes the structural design of the clamping mechanism to cleverly and simultaneously realize the compaction of the debris in the process of fixing the mold 21, resulting in an unexpected technical effect of increasing the amount of debris collected by the receiving plate 902, and since the operation of compacting the debris is realized in the process of fixing the mold 21, the operation of compacting the debris separately is omitted.

[0030] Furthermore, after the mold 21 is removed after the pattern processing is completed, the servo cylinder 4 drives the lifting plate 5 to slide upward continuously to drive the two extrusion plates 8 to slide elastically continuously, and then drives the bottom of the compacting plate 19 to be inserted into the receiving plate 902 continuously to squeeze the compacted debris and push the bottom plate 903 to rotate elastically until the compacted debris is discharged from the receiving plate 902. Specifically, Fig.13 As shown, since the two extrusion plates 8 can move a longer distance toward the middle after the mold 21 is removed, the lifting plate 5 can slide upward a longer distance, thereby allowing the baffle plate 9 to move upward a longer distance. The increase in the upward movement distance of the baffle plate 9 causes the distance between the bottom of the compaction plate 19 and the bottom plate 903 to continuously decrease until the bottom of the compaction plate 19 abuts against the bottom plate 903. Based on this, the compaction plate 19 can not only compact the debris in the containing plate 902, but also automatically push the compacted debris in the containing plate 902 out of the containing plate 902, thereby cleaning the debris in the containing plate 902.

[0031] In this embodiment, the thickness of the compacting plate 19 gradually decreases from low to high to increase the distance between the compacting plate 19 and the receiving plate 901 , thereby increasing the volume of the receiving plate 901 so that the debris generated during pattern processing can fall into the receiving plate 901 .

[0032] In this embodiment, a movable plate 602 is rotatably provided on the left and right sides of the opening 601, and two clamping plates 802 are located between the two movable plates 602. In the initial state, the sides of the two clamping plates 802 that are far away from each other are in one-to-one contact with the ends of the two movable plates 602 that are close to each other. Part of the debris generated during the processing of the pattern falls into the gap, and part of the debris with greater power will pass through the gap and fall on the two movable plates 602. Among them, the ends of the two movable plates 602 that are close to each other are rotatably plugged with a rotating shaft 20, and the rotating shaft 20 is rotatably connected to the shielding plate 6. Fig.10 As shown, in the initial state, the ends of the two movable plates 602 that are away from each other abut against the side of the opening 601 so that the two movable plates 602 are limited and cannot continue to rotate downward. At this time, the two movable plates 602 are in a flat state; Fig.12 As shown, when the two extrusion plates 8 clamp and fix the mold 21, the two movable plates 602 are still in a flat state and can receive the flying debris.

[0033] Furthermore, the two movable plates 602 correspond to the two receiving plates 901 one by one. When the mold 21 processes the pattern, the receiving plates 901 and the movable plates 602 do not contact each other. When the bottom of the compacting plate 19 pushes the compacted debris to be discharged from the receiving plate 902, the two receiving plates 901 push the corresponding two movable plates 602 upward to rotate so that the debris falling on the movable plates 602 slides into the two receiving plates 901 for collection. Fig.13 As shown, since the enclosure plate 9 can move upward a longer distance after the mold 21 is removed, the top of the receiving plate 901 can push the corresponding movable plate 602 to rotate upward and become inclined. At this time, the debris on the movable plate 602 can fall into the corresponding receiving plate 901 along the top surface of the movable plate 602 under the action of gravity and be blocked by the side of the compacting plate 19. Then the servo cylinder 4 drives the lifting plate 5 to slide downward. At this time, the compacting plate 19 continuously slides out of the receiving plate 902. When the compacting plate 19 is reset, the debris that falls on the receiving plate 901 enters the receiving plate 902 for collection and is blocked by the bottom plate 903. It can be seen that in the present invention, in the process of the bottom of the compacting plate 19 pushing the compacted debris to be discharged from the receiving plate 902, the two receiving plates 901 unexpectedly push the corresponding two movable plates 602 upward to rotate so that the debris that falls on the movable plate 602 slides into the two receiving plates 901 and is collected.

[0034] Among them, at least two balls 13 are rollingly embedded in the bottom of the extrusion plate 8, and the balls 13 abut against the top of 5, so as to reduce the friction between the extrusion plate 8 and the lifting plate 5.

[0035] Second embodiment: like Figure 1-13 As shown, the present invention provides a mold pattern processing process, comprising the following steps: S1: Loading: First, the lifting plate 5 is adjusted to the initial position by the servo cylinder 4, and the mold 21 is placed on the placement table 501 and abutted against the abutment plate 502; S2: Move to the processing station: Start the servo cylinder 4 to drive the lifting plate 5 to drive the mold 21 to move upward, so that the mold 21 extends upward from the opening 601, and at the same time the lifting plate 5 slides against the bottom of the two extrusion plates 8 to push the two extrusion plates 8 to slide elastically toward the mold 21, until the two extrusion plates 8 clamp and fix the mold 21, then move to the processing station and realize automatic fixation; S3: Chip collection: The mold 21 is patterned by starting the tool assembly 3. A large amount of chips are generated during the processing. When the mold 21 is fixed, gaps are generated between the sides of the two inclined plates 801 that are away from each other and the shielding plate 6. The chips pass through the two gaps and fall into the receiving plates 902 of the two enclosing plates 9 for collection; S4; Debris compaction: The lifting plate 5 pushes the two extrusion plates 8 upward toward the mold 21 during elastic sliding, and the bottom of the compaction plate 19 is gradually inserted into the receiving plate 902 to compact the loose debris in the receiving plate 902; S5: Debris discharge: After the mold 21 completes pattern processing and is removed, the servo cylinder 4 drives the lifting plate 5 to slide upward continuously to drive the two extrusion plates 8 to slide elastically continuously, and then drives the bottom of the compacting plate 19 to be continuously inserted into the receiving plate 902 to squeeze the compacted debris and push the bottom plate 903 to rotate elastically until the compacted debris is discharged from the receiving plate 902.

[0036] A movable plate 602 is rotatably provided on the left and right sides of the opening 601, and two clamping plates 802 are located between the two movable plates 602. In the initial state, the sides of the two clamping plates 802 that are far away from each other are in one-to-one contact with the ends of the two movable plates 602 that are close to each other. Part of the debris generated during the processing of the pattern falls into the gap, and part of the debris with greater power will pass through the gap and fall on the two movable plates 602. A rotating shaft 20 is rotatably inserted into the ends of the two movable plates 602 that are close to each other, and the rotating shaft 20 is rotatably connected to the shielding plate 6. Fig.10 As shown, in the initial state, the ends of the two movable plates 602 that are away from each other abut against the side of the opening 601 so that the two movable plates 602 are limited and cannot continue to rotate downward. At this time, the two movable plates 602 are in a flat state; Fig.12 As shown, when the two extrusion plates 8 clamp and fix the mold 21, the two movable plates 602 are still in a flat state and can receive the flying debris.

[0037] The two movable plates 602 correspond to the two receiving plates 901 one by one. When the mold 21 processes the pattern, the receiving plate 901 and the movable plate 602 do not contact each other. In the process that the bottom of the compacting plate 19 pushes the compacted debris to be discharged from the receiving plate 902, the two receiving plates 901 push the corresponding two movable plates 602 upward to rotate so that the debris falling on the movable plate 602 slides into the two receiving plates 901 for collection.

[0038] In step S5, since the enclosure plate 9 can move upward a longer distance after the mold 21 is removed, the top of the receiving plate 901 can push the corresponding movable plate 602 to rotate upward and become inclined. At this time, the debris on the movable plate 602 can fall into the corresponding receiving plate 901 along the top surface of the movable plate 602 under the action of gravity and be blocked by the side of the compacting plate 19. Then the servo cylinder 4 drives the lifting plate 5 to slide downward. At this time, the compacting plate 19 continuously slides out of the receiving plate 902. When the compacting plate 19 is reset, the debris falling in the receiving plate 901 enters the receiving plate 902 for collection and is blocked by the bottom plate 903. It can be seen that in the process of the bottom of the compacting plate 19 pushing the compacted debris to be discharged from the receiving plate 902, the two receiving plates 901 unexpectedly push the corresponding two movable plates 602 upward to rotate so that the debris falling on the movable plate 602 slides into the two receiving plates 901 and is collected.

[0039] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A mold pattern processing device, comprising a lifting plate (5) which is slidably arranged and driven to slide by a servo cylinder (4), the lifting plate (5) comprising a placement table (501) for placing a mold (21), characterized in that: It also includes a shielding plate (6) fixedly arranged and located above the lifting plate (5), the shielding plate (6) being provided with an opening (601) for the mold (21) to pass through, and two groups of clamping mechanisms being installed on the shielding plate (6), the two groups of clamping mechanisms being arranged symmetrically on the left and right; The clamping mechanism comprises a pressing plate (8) elastically and obliquely slidably arranged relative to the shielding plate (6), and the bottom of the pressing plate (8) is in sliding abutment with the lifting plate (5); When the servo cylinder (4) drives the lifting plate (5) to slide upward, the lifting plate (5) drives the mold (21) to be inserted upward between the two extrusion plates (8), and pushes the two extrusion plates (8) to slide elastically toward the mold (21), so that the mold (21) is moved to the processing station and is clamped and fixed by the two extrusion plates (8).

2. The mold pattern processing device according to claim 1, characterized in that: The extrusion plate (8) comprises an integrally arranged inclined plate (801) and a clamping plate (802), the inclined plate (801) being inclined downward and outwardly, the shielding plate (6) being fixedly mounted with two groups of fixed plates (11) corresponding to the two extrusion plates (8), each group of fixed plates (11) having two, the inclined plate (801) being slidably mounted between the two corresponding fixed plates (11), each of the fixed plates (11) being fixedly mounted with an extension plate (12), a compression spring (10) being mounted between the inclined plate (801) and each of the extension plates (12), the inclined plate (801) being inserted into the opening (601) for extruding the fixed mold (21).

3. The mold pattern processing device according to claim 2, characterized in that: A baffle plate (9) is fixedly mounted on the side of the two inclined plates (801) that is away from each other. When the two extrusion plates (8) clamp the fixed mold (21), gaps are generated between the side of the two inclined plates (801) that is away from each other and the baffle plate (6). Debris generated when processing the pattern on the mold (21) splashes into the gap and then falls into the baffle plate (9) for collection.

4. The mold pattern processing device according to claim 3, characterized in that: The enclosure plate (9) comprises a receiving plate (901), a containing plate (902), and a bottom plate (903); the receiving plate (901) and the containing plate (902) are integrally arranged; the receiving plate (901) is located above the containing plate (902); a top opening of the receiving plate (901) extends outward and opens; the containing plate (902) is used to receive debris; and the bottom plate (903) is elastically rotatably arranged at the bottom of the containing plate (902) by an elastic mechanism so that the bottom of the containing plate (902) is blocked.

5. The mold pattern processing device according to claim 4, characterized in that: The clamping mechanism further comprises a compacting plate (19) fixedly connected to the shielding plate (6) via a connecting plate (1901); the side surface of the compacting plate (19) is slidably fitted with the outer side surface of the inclined plate (801); the compacting plate (19) is plugged into the interior of the containing plate (902); in an initial state, the bottom of the compacting plate (19) is located above the containing plate (902); and in the process of the lifting plate (5) pushing the two extrusion plates (8) upwards and elastically sliding toward the mold (21), the bottom of the compacting plate (19) is gradually inserted into the containing plate (902) to compact loose debris in the containing plate (902).

6. The mold pattern processing device according to claim 5, characterized in that: After the mold (21) has completed pattern processing and the mold (21) has been removed, the servo cylinder (4) drives the lifting plate (5) to continuously slide upwards, thereby driving the two extrusion plates (8) to continuously slide elastically, thereby driving the bottom of the compacting plate (19) to continuously insert into the receiving plate (902) to squeeze the compacted debris and push the bottom plate (903) to elastically rotate until the compacted debris is discharged from the receiving plate (902).

7. The mold pattern processing device according to claim 5, characterized in that: The thickness of the compacting plate (19) gradually decreases from low to high to increase the distance between the compacting plate (19) and the receiving plate (901), thereby increasing the volume of the receiving plate (901) so that debris generated during pattern processing can fall into the receiving plate (901).

8. The mold pattern processing device according to claim 4, characterized in that: A movable plate (602) is rotatably provided on the left and right sides of the opening (601), and the two clamping plates (802) are located between the two movable plates (602). In an initial state, the sides of the two clamping plates (802) that are away from each other abut against the ends of the two movable plates (602) that are close to each other in a one-to-one corresponding manner.

9. The mold pattern processing device according to claim 8, characterized in that: The two movable plates (602) correspond to the two receiving plates (901) one by one. When the mold (21) processes the pattern, the receiving plates (901) and the movable plates (602) do not contact each other. When the bottom of the compacting plate (19) pushes the compacted debris to be discharged from the receiving plate (902), the two receiving plates (901) push the corresponding two movable plates (602) upward to rotate so that the debris falling on the movable plates (602) slides into the two receiving plates (901) for collection.

10. A mold pattern processing technology, which is based on the mold pattern processing device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: Loading: First, the lifting plate (5) is adjusted to the initial position by the servo cylinder (4), and the mold (21) is placed on the placement table (501) and abutted against the abutment plate (502); S2: moving to the processing station: starting the servo cylinder (4) to drive the lifting plate (5) to drive the mold (21) to move upward, so that the mold (21) extends upward from the opening (601) and at the same time the lifting plate (5) slides against the bottom of the two extrusion plates (8) to push the two extrusion plates (8) to slide elastically toward the mold (21) until the two extrusion plates (8) clamp and fix the mold (21). At this time, the mold (21) moves to the processing station and is automatically fixed; S3: debris collection: the mold (21) is patterned by starting the tool assembly (3), a large amount of debris is generated during the processing, and when the mold (21) is fixed, gaps are generated between the side surfaces of the two inclined plates (801) that are away from each other and the shielding plate (6), and the debris falls into the receiving plates (902) of the two enclosing plates (9) through the two gaps and is collected; S4; Debris compaction: the lifting plate (5) pushes the two extrusion plates (8) upwards and elastically slides toward the mold (21), and the bottom of the compaction plate (19) is gradually inserted into the receiving plate (902) to compact the loose debris in the receiving plate (902); S5: Debris discharge: After the mold (21) completes pattern processing and is removed, the servo cylinder (4) drives the lifting plate (5) to continuously slide upward to drive the two extrusion plates (8) to continuously slide elastically, thereby driving the bottom of the compacting plate (19) to continuously insert into the receiving plate (902) to squeeze the compacted debris and push the bottom plate (903) to elastically rotate until the compacted debris is discharged from the receiving plate (902).

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