A SIC wafer backside processing device and use method

Abstract

The invention discloses a SIC wafer backside processing device and a use method thereof. The device comprises a mounting seat, wherein the inner wall of the mounting seat is provided with a first electric push rod. When in use, a dust removal box is magnetically fitted and fixed to a dustproof frame, a second clamping frame is clamped and fixed to a third electric push rod, a motor is flange-fixed to a diamond cutter disc, a SIC wafer is placed on the upper end of a placement table, the first electric push rod drives the placement table to lift to a specified position, the second electric push rod drives a fixing frame to fix the SIC wafer, the motor drives the diamond cutter disc to rotate at a high speed, the third electric push rod drives a connecting frame to move, a spring is used to resist a lifting frame, a rubber tube is fitted to the SIC wafer for shock resistance, and finally a fan is turned on, a dust removal box is used to remove SIC wafer thinning waste residue, and the back side of the SIC wafer is processed. Thus, the SIC wafer backside processing device and the use method thereof are completed.

Description

Technical Field

[0001] The present invention relates to the technical field related to SIC wafer processing, and in particular to a SIC wafer backside processing device and a use method thereof. Background Art

[0002] As electronic devices develop towards high performance, high frequency, high power, miniaturization and lightweight, traditional silicon-based semiconductor devices are gradually unable to meet the demand. Silicon carbide (SiC), as a wide bandgap semiconductor material, has excellent properties such as high bandgap energy, high breakdown electric field, high saturated electron drift velocity, and high thermal conductivity. It has broad application prospects in new energy vehicles, photovoltaics, smart grids and other fields. The market demand for high-quality and high-precision SiC wafers is increasing, which has promoted the development of SiC wafer back side thinning processing equipment. Therefore, we need a SIC wafer back side processing device and a method for using it.

[0003] However, in the currently used SIC wafer backside processing device and method, the interaction between the grinding tool and the SIC wafer during the thinning operation lacks the corresponding shock absorption and anti-resonance design, which leads to the grinding tool and the wafer being prone to resonance under specific cutting parameters. This resonance not only reduces the thinning accuracy and makes it difficult to ensure the uniformity of wafer thickness, but in severe cases may also cause tool damage and wafer breakage, greatly increasing processing costs and scrap rates, making it impossible to quickly position the SIC wafer, and unable to promptly remove the waste generated by the SIC wafer thinning, which is likely to cause air stagnation in some locations and cause temperature rise. Summary of the invention

[0004] The object of the present invention is to provide a SIC wafer backside processing device and a method of using the same to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A SIC wafer backside processing device comprises a mounting seat, wherein the inner wall of the mounting seat is installed with a first electric push rod, one end of the first electric push rod is fixedly connected to a placing table, the inner wall of the mounting seat is fixedly connected to a positioning rod, the outer wall of the positioning rod is fixedly connected to a first card frame, the inner wall of the first card frame is installed with a second electric push rod, one end of the second electric push rod is installed with a fixing frame, a dust removal box is welded on one side of the mounting seat, a fan is installed on the inner wall of the dust removal box, a first magnetic ring is bonded to one side of the dust removal box, and a first magnetic ring is attached to one side of the first magnetic ring A second magnetic ring, a dustproof frame is bonded to one side of the second magnetic ring, the inner wall of the mounting seat is fixedly connected with a fixing rod, the outer wall of the fixing rod is fixedly connected with a second bracket, the inner wall of the second bracket is installed with a third electric push rod, one end of the third electric push rod is installed with a connecting frame, the inner wall of the connecting frame is fixedly connected with a limiting rod, the outer wall of the limiting rod is fixedly connected with a motor, one end of the motor is flange-connected with a diamond cutter disc, one end of the connecting frame is welded with a spring, one end of the spring is welded with a lifting frame, and the outer wall of the lifting frame is installed with a rubber tube.

[0007] Preferably, the outer wall of the first magnetic ring is tightly fitted with the outer wall of the dust removal box, and the length of the outer wall of the first magnetic ring is smaller than the length of the outer wall of the dust removal box.

[0008] Preferably, the outer wall of the first magnetic ring is tightly fitted with the outer wall of the second magnetic ring, and the length of the outer wall of the first magnetic ring is the same as the length of the outer wall of the second magnetic ring.

[0009] Preferably, the second electric push rod is snap-connected with the fixing frame, and the fixing frame is symmetrically arranged with respect to the central axis of the mounting seat.

[0010] Preferably, the lifting frame is movably connected to the connecting frame, and the inner wall of the connecting frame is of open-hole design.

[0011] Preferably, the lifting frame is movably connected to the rubber tube, and the length of the outer wall of the lifting frame is greater than the length of the outer wall of the rubber tube.

[0012] A SIC wafer backside processing device and a method for using the same include the following steps:

[0013] S1. Take out the device and install it at the designated position, clamp and fix the second electric push rod to the mounting seat, clamp and fix the first bracket to the second electric push rod, screw the positioning rod to the first bracket, tightly bond the first magnetic ring to the dust removal box, tightly bond the second magnetic ring to the dustproof frame, and then magnetically bond the dust removal box to the dustproof frame;

[0014] S2, clamping and fixing the third electric push rod to the mounting seat, clamping and fixing the second bracket to the third electric push rod, threading the fixing rod to the second bracket, threading the limit rod to the motor, and then flange-fixing the motor to the diamond cutter head;

[0015] S3, taking out the SIC wafer, placing the SIC wafer on the upper end of the placement table, opening the first electric push rod, driving the placement table to lift to a specified position, and then opening the second electric push rod, driving the fixing frame to fix the SIC wafer;

[0016] S4, turn on the motor again, drive the diamond cutter disc to rotate at high speed, turn on the third electric push rod, drive the connecting frame to move, use the spring to resist the lifting frame, and use the rubber tube to fit the SIC wafer for shock resistance;

[0017] S5. Finally, the fan is turned on, the dust removal box is used to remove the SIC wafer thinning waste residue, and the back of the SIC wafer is processed.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The second electric push rod is arranged to play a role of clamping and fixing the fixed frame. When the device is used, the second electric push rod and the fixed frame can quickly position the SIC wafer, which increases the accuracy of the processing position. The lifting frame plays a movable role on the rubber cylinder. When the device is used, the lifting frame and the rubber cylinder can thin the SIC wafer to resist the resonance of the contacting part, which increases the usability of the device.

[0020] 2. The fan is fixed by setting a dust removal box. When the device is in use, the dust removal box and the fan can promptly remove the waste generated by SIC wafer thinning, reduce the accumulation of waste and cause air stagnation in some locations, resulting in temperature rise, and increase the usability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the vertical front view structure of a SIC wafer backside processing device and a method of using the present invention;

[0022] Figure 2 It is a schematic diagram of a vertical rear view structure of a SIC wafer backside processing device and a method of using the present invention;

[0023] Figure 3 It is a schematic diagram of the vertical and cross-sectional structure of a SIC wafer backside processing device and a method of using the present invention;

[0024] Figure 4A schematic diagram of the structure of the assembly of a mounting base and a dust removal box parts of a SIC wafer backside processing device and a method of using the present invention;

[0025] Figure 5 A schematic diagram of a fixing frame structure of a SIC wafer backside processing device and a method of using the present invention;

[0026] Figure 6 The present invention is a SIC wafer backside processing device and a method of using the same Figure 3 Schematic diagram of the enlarged combined structure of part A in the middle.

[0027] In the figure: 1. mounting base; 2. first electric push rod; 3. placing table; 4. positioning rod; 5. first bracket; 6. second electric push rod; 7. fixing bracket; 8. dust removal box; 9. fan; 10. first magnetic ring; 11. second magnetic ring; 12. dustproof frame; 13. fixing rod; 14. second bracket; 15. third electric push rod; 16. connecting frame; 17. limiting rod; 18. motor; 19. diamond cutter head; 20. spring; 21. lifting frame; 22. rubber tube. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-6 The present invention provides a SIC wafer backside processing device and a method of using the technical solution:

[0030] A SIC wafer backside processing device comprises a mounting seat 1, the inner wall of the mounting seat 1 is installed with a first electric push rod 2, one end of the first electric push rod 2 is fixedly connected to a placing table 3, the inner wall of the mounting seat 1 is fixedly connected with a positioning rod 4, the outer wall of the positioning rod 4 is fixedly connected with a first card frame 5, the inner wall of the first card frame 5 is installed with a second electric push rod 6, one end of the second electric push rod 6 is installed with a fixing frame 7, a dust removal box 8 is welded on one side of the mounting seat 1, a fan 9 is installed on the inner wall of the dust removal box 8, a first magnetic ring 10 is bonded to one side of the dust removal box 8, a second magnetic ring 11 is attached to one side of the first magnetic ring 10, and the second magnetic ring 11 is attached to one side of the second magnetic ring 11. A dustproof frame 12 is bonded to one side of the ring 11, and the inner wall of the mounting seat 1 is fixedly connected with a fixing rod 13, and the outer wall of the fixing rod 13 is fixedly connected with a second bracket 14, and the inner wall of the second bracket 14 is installed with a third electric push rod 15, and one end of the third electric push rod 15 is installed with a connecting frame 16, and the inner wall of the connecting frame 16 is fixedly connected with a limiting rod 17, and the outer wall of the limiting rod 17 is fixedly connected with a motor 18, and one end of the motor 18 is flange-connected with a diamond cutter disc 19, one end of the connecting frame 16 is welded with a spring 20, and one end of the spring 20 is welded with a lifting frame 21, and the outer wall of the lifting frame 21 is installed with a rubber tube 22.

[0031] The outer wall of the first magnetic ring 10 is tightly fitted with the outer wall of the dust removal box 8 , and the length of the outer wall of the first magnetic ring 10 is smaller than the length of the outer wall of the dust removal box 8 .

[0032] The outer wall of the first magnetic ring 10 is tightly fitted with the outer wall of the second magnetic ring 11 , and the length of the outer wall of the first magnetic ring 10 is the same as the length of the outer wall of the second magnetic ring 11 .

[0033] The second electric push rod 6 is engaged with the fixing frame 7 , and the fixing frame 7 is symmetrically arranged with respect to the central axis of the mounting seat 1 .

[0034] The lifting frame 21 is movably connected to the connecting frame 16 , and the inner wall of the connecting frame 16 is of an open hole design.

[0035] The lifting frame 21 is movably connected to the rubber tube 22 , and the outer wall length of the lifting frame 21 is greater than the outer wall length of the rubber tube 22 .

[0036] A SIC wafer backside processing device and a method for using the same include the following steps:

[0037] S1. Take out the device and install it at the designated position, clamp and fix the second electric push rod 6 to the mounting seat 1, clamp and fix the first bracket 5 to the second electric push rod 6, screw the positioning rod 4 to the first bracket 5, tightly bond the first magnetic ring 10 to the dust removal box 8, tightly bond the second magnetic ring 11 to the dustproof frame 12, and then magnetically bond the dust removal box 8 to the dustproof frame 12;

[0038] S2, clamp and fix the third electric push rod 15 to the mounting seat 1, clamp and fix the second bracket 14 to the third electric push rod 15, screw the fixing rod 13 to the second bracket 14, screw the limiting rod 17 to the motor 18, and then flange the motor 18 to the diamond cutter head 19;

[0039] S3, take out the SIC wafer, place the SIC wafer on the upper end of the placement table 3, open the first electric push rod 2, drive the placement table 3 to lift to a specified position, then open the second electric push rod 6, drive the fixing frame 7 to fix the SIC wafer;

[0040] S4, the motor 18 is turned on again, the motor 18 drives the diamond cutter head 19 to rotate at a high speed, the third electric push rod 15 is turned on, the third electric push rod 15 drives the connecting frame 16 to move, the spring 20 resists the lifting frame 21, and the rubber tube 22 fits the SIC wafer for shock resistance;

[0041] S5. Finally, the fan 9 is turned on, the dust removal box 8 is used to remove the SIC wafer thinning waste residue, and the back side of the SIC wafer is processed.

[0042] It should be noted that the present invention is a SIC wafer backside processing device and a method of use. When in use, the second magnetic ring 11 is tightly bonded to the dustproof frame 12, and the dust removal box 8 is magnetically fitted and fixed to the dustproof frame 12, the third electric push rod 15 is clamped and fixed to the mounting seat 1, and the second clamping frame 14 is clamped and fixed to the third electric push rod 15, and the fixing rod 13 is threadedly fixed to the second clamping frame 14, and the limiting rod 17 is threadedly fixed to the motor 18, and the motor 18 is flange-fixed to the diamond cutter disc 19, and the SIC wafer is taken out, and the SIC wafer is placed on the upper end of the placement table 3, and the first electric push rod 2 is driven to place The platform 3 is lifted to a designated position, the second electric push rod 6 drives the fixing frame 7 to fix the SIC wafer, the motor 18 drives the diamond knife disc 19 to rotate, the third electric push rod 15 drives the connecting frame 16 to move, the contact surface between the SIC wafer and the diamond knife disc 19 is injected with water, the spring 20 is used to resist the lifting frame 21, the diamond knife disc 19 is used to grind and thin the SIC wafer, the rubber tube 22 is used to fit the SIC wafer for shock resistance, and finally the fan 9 is turned on, the dust removal box 8 is used to remove the waste residue of the SIC wafer thinning, and the back of the SIC wafer is processed, and thus a SIC wafer back side processing device and a method for using the same are completed.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SIC wafer backside processing device, characterized in that: The invention comprises a mounting seat (1), wherein the inner wall of the mounting seat (1) is installed with a first electric push rod (2), one end of the first electric push rod (2) is fixedly connected to a placing table (3), the inner wall of the mounting seat (1) is fixedly connected with a positioning rod (4), the outer wall of the positioning rod (4) is fixedly connected with a first bracket (5), the inner wall of the first bracket (5) is installed with a second electric push rod (6), one end of the second electric push rod (6) is installed with a fixing bracket (7), one side of the mounting seat (1) is welded with a dust removal box (8), the inner wall of the dust removal box (8) is installed with a fan (9), one side of the dust removal box (8) is bonded with a first magnetic ring (10), one side of the first magnetic ring (10) is bonded with a second magnetic ring (11), one side of the second magnetic ring (11) is bonded with a second magnetic ring A dustproof frame (12) is bonded to the side, the inner wall of the mounting seat (1) is fixedly connected with a fixing rod (13), the outer wall of the fixing rod (13) is fixedly connected with a second bracket (14), the inner wall of the second bracket (14) is installed with a third electric push rod (15), one end of the third electric push rod (15) is installed with a connecting frame (16), the inner wall of the connecting frame (16) is fixedly connected with a limiting rod (17), the outer wall of the limiting rod (17) is fixedly connected with a motor (18), one end of the motor (18) is flange-connected with a diamond cutter disc (19), one end of the connecting frame (16) is welded with a spring (20), one end of the spring (20) is welded with a lifting frame (21), and the outer wall of the lifting frame (21) is installed with a rubber tube (22).

2. The SIC wafer backside processing device according to claim 1, characterized in that: The outer wall of the first magnetic ring (10) is tightly fitted to the outer wall of the dust removal box (8), and the length of the outer wall of the first magnetic ring (10) is smaller than the length of the outer wall of the dust removal box (8).

3. The SIC wafer backside processing device according to claim 1, characterized in that: The outer wall of the first magnetic ring (10) is tightly fitted with the outer wall of the second magnetic ring (11), and the length of the outer wall of the first magnetic ring (10) is the same as the length of the outer wall of the second magnetic ring (11).

4. The SIC wafer backside processing device according to claim 1, characterized in that: The second electric push rod (6) is snap-connected to the fixing frame (7), and the fixing frame (7) is symmetrically arranged with respect to the central axis of the mounting seat (1).

5. The SIC wafer backside processing device according to claim 1, characterized in that: The lifting frame (21) is movably connected to the connecting frame (16), and the inner wall of the connecting frame (16) is of open-hole design.

6. The SIC wafer backside processing device according to claim 1, characterized in that: The lifting frame (21) is movably connected to the rubber tube (22), and the length of the outer wall of the lifting frame (21) is greater than the length of the outer wall of the rubber tube (22).

7. A SIC wafer backside processing device and a method of use, characterized in that: The following steps are involved: S1. Take out the device and install it at the designated position, clamp and fix the second electric push rod (6) to the mounting seat (1), clamp and fix the first bracket (5) to the second electric push rod (6), screw the positioning rod (4) to the first bracket (5), tightly bond the first magnetic ring (10) to the dust removal box (8), tightly bond the second magnetic ring (11) to the dustproof frame (12), and then magnetically bond the dust removal box (8) to the dustproof frame (12); S2, the third electric push rod (15) is clamped and fixed to the mounting seat (1), the second clamping frame (14) is clamped and fixed to the third electric push rod (15), the fixing rod (13) is threadedly fixed to the second clamping frame (14), the limiting rod (17) is threadedly fixed to the motor (18), and the motor (18) is flange-fixed to the diamond cutter disc (19); S3, taking out the SIC wafer, placing the SIC wafer on the upper end of the placement table (3), opening the first electric push rod (2), driving the placement table (3) to be lifted to a designated position by the first electric push rod (2), and then opening the second electric push rod (6), driving the fixing frame (7) to fix the SIC wafer; S4, turning on the motor (18), driving the diamond cutter disc (19) to rotate at high speed, turning on the third electric push rod (15), driving the connecting frame (16) to move, causing the spring (20) to resist the lifting frame (21), and causing the rubber tube (22) to fit the SIC wafer to resist vibration; S5. Finally, the fan (9) is turned on, the dust removal box (8) is used to remove the SIC wafer thinning waste residue, and the back of the SIC wafer is processed.

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