A grinding head device for full-size wafer chips

Abstract

The present invention relates to the field of wafer chip processing technology, and in particular, to a grinding head device for full-size wafer chips. It includes a product carrier, a grinding wheel, a trimming knife, and a driving mechanism; the driving mechanism is configured to drive the product carrier to move along the Y-axis direction, and drive the grinding wheel to move along the X-axis and Z-axis directions; the product carrier has a bearing surface for placing the wafer product in an inverted manner, and the bearing surface is in a horizontal state, and the surface to be polished of the wafer product is limited to a fixed height by limiting the movement in the Y-axis direction; the grinding head device for full-size wafer chips fixes the height of the surface to be polished by inverting the wafer product, so that the surfaces to be polished of wafer products of different sizes are still at the same height. In addition, combined with the initial position of the grinding wheel, the distance that the grinding wheel descends to complete the grinding can be used as the basis for adjusting the distance of the grinding wheel height.

Description

Technical Field

[0001] The invention relates to the technical field of wafer chip processing, in particular to a wire grinding head device for full-size wafer chips. Background Art

[0002] At present, high-value, high-precision, and high-density chips may have poor bonding or poor multi-layer stacking during the packaging section bonding (WireBonding) process. In this case, the wafer inside the chip is still intact. To repair it, the original wire ends must be smoothed before re-bonding. Some quality problems are not found until they have been molded or diced. The wafer inside the chip is removed with a special solvent (called "wafer washing" in the industry), and the epoxy resin on the outer surface is melted, and the intact wafer chip will leak out, and then the chip will be unplugged from the circuit board. Since the wafer chip and the circuit board are connected by gold wire welding, there will still be wire ends on the wafer chip after it is unplugged.

[0003] However, the current wire grinding head device faces the following problems during use: First, during the grinding process, the grinding wheel will be damaged over time, resulting in a decrease in grinding quality, which in turn affects the quality of wafer chip grinding. Therefore, the grinding wheel needs to be repaired after a period of use. However, the diameter of the grinding wheel will change after repair. At this time, the staff needs to adjust the position of the grinding wheel and conduct a trial grinding after adjustment (testing the quality of wafer chip grinding after adjustment). Then, observe whether the grinding is qualified through a microscope. If it is not qualified, it needs to be readjusted, which makes the entire wafer thread grinding inefficient.

[0004] Secondly, since there are many types of wafer chips, the thickness of the wafer chips changes when facing wafer chips of different sizes. At this time, the horizontal height between the grinding wheel and the wafer chip also changes accordingly, so the position of the grinding wheel needs to be adjusted, which affects the grinding efficiency. Summary of the invention

[0005] The object of the present invention is to provide a wire grinding head device for full-size wafer chips to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, a full-size wafer chip grinding head device is provided, comprising a product carrier, a grinding wheel, a dressing knife, and a driving mechanism; wherein the driving mechanism is configured to drive the product carrier to move along the Y-axis direction, and drive the grinding wheel to move along the X-axis and Z-axis directions; The product carrier has a carrying surface for placing the wafer product in an inverted manner, and the carrying surface is in a horizontal state, and the surface to be polished of the wafer product is limited to a fixed height by limiting the movement in the Y-axis direction; The trimming knife is fixedly arranged below the movement path of the grinding wheel; A grinding wheel driving member for driving the grinding wheel to rotate is coaxially connected to one side of the grinding wheel, and the grinding wheel is in a vertical state with the bearing surface; the grinding wheel has an initial position, and when the unworn grinding wheel is in the initial position, the top of the outer ring of the grinding wheel is at the same height as the surface to be ground; When the grinding wheel reaches the preset working state, the driving mechanism drives the grinding wheel to descend to a preset height so that the outer ring of the grinding wheel can be ground with a dressing knife, and then reset to the initial position; after resetting, the driving mechanism drives the grinding wheel to rise to a preset height so that the top of the outer ring of the grinding wheel is at the same height as the surface to be ground again.

[0007] As a further improvement of the technical solution, the degree of wear of the grinding wheel when reaching a preset working state does not affect the grinding quality of the wafer product.

[0008] As a further improvement of the technical solution, the bottom end of the outer ring of the grinding wheel is at the same height as the top end of the dressing knife, and the preset height for driving the grinding wheel to rise is consistent with the preset height for driving the grinding wheel to descend.

[0009] As a further improvement of the technical solution, a spacing is set between the bottom end of the outer ring of the grinding wheel and the top end of the dressing knife, and the preset height for driving the grinding wheel to rise is the difference between the preset height for driving the grinding wheel to descend and the spacing.

[0010] As a further improvement of the technical solution, the driving mechanism includes a Y-axis driving member, a Z-axis driving member and an X-axis driving member; The Y-axis driving member is fixedly connected to the bottom of the product carrier; The Z-axis driving member is fixedly connected to the grinding wheel driving member; The X-axis driving member is fixedly connected to the Z-axis driving member; The Y-axis driving component and the X-axis driving component are both arranged on a substrate.

[0011] As a further improvement of the technical solution, the trimming knife is a columnar structure as a whole, and the top end is narrowed inward to form a grinding portion for grinding the grinding wheel.

[0012] As a further improvement of the technical solution, the hardness of the dressing knife is greater than the hardness of the grinding wheel, and the dressing knife is located below the center of the grinding wheel and fixed on the base plate.

[0013] As a further improvement of the technical solution, the product carrier includes a bearing platform and a limiting mechanism fixedly connected to the Y-axis driving member; The top surface of the bearing platform is a bearing surface; The limiting mechanism is used to fix the wafer product on the carrying surface in a detachable manner.

[0014] As a further improvement of the technical solution, the limiting mechanism includes a cover plate arranged on the top of the carrying platform, an air suction cavity arranged inside the carrying platform, and a plurality of air suction ports arranged on the top of the carrying platform; wherein, One end of the air extraction cavity passes through the top of the supporting platform and is connected to the exhaust fan through an air extraction pipe; The plurality of air inlets are all connected to the air extraction cavity, and the plurality of air inlets are distributed at one end of the bearing platform close to the grinding wheel.

[0015] As a further improvement of the technical solution, a magnet that magnetically cooperates with the cover plate is arranged inside the supporting platform.

[0016] Compared with the prior art, the present invention has the following beneficial effects: This is used in full-size wafer chip grinding head equipment. By inverting the wafer product to fix the height of the surface to be polished, the surfaces to be polished of wafer products of different sizes are still at the same height when polishing wafer products of different sizes. In addition, combined with the initial position of the grinding wheel, the distance that the grinding wheel descends to complete the grinding can be used as the basis for adjusting the height of the grinding wheel, so that the position of the wafer product after grinding can be quickly adjusted, reducing the number of debugging times and improving the overall grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of the product carrier of the present invention; Figure 3 It is a structural schematic diagram of the trimming knife of the present invention; Figure 4 It is a schematic diagram of the initial position of the grinding wheel of the present invention; Figure 5 The position of the trimming knife of the present invention is shown in FIG. Figure 1 ; Figure 6 It is a structural schematic diagram of the carrying platform of the present invention; Figure 7 It is a schematic diagram of the cross-sectional structure of the carrier platform of the present invention; Figure 8 For the present invention Figure 7 A schematic diagram of the structure at A; Fig. 9 It is a schematic diagram of the adjustment state of the grinding wheel of the present invention; Fig.10 For the present invention Fig. 9 A schematic diagram of the structure at B; Fig.11 The position of the trimming knife of the present invention is shown in FIG. Figure 2 .

[0018] The meaning of each number in the figure is: 100. Rack; 101. Control device; 102. Operation port; 103. Base plate; 104. Grinding wheel drive; 105. Y-axis drive; 106. Z-axis drive; 107. X-axis drive; 110. Product carrier; 111. Carrier; 112. Cover plate; 113. Magnet; 114. Exhaust chamber; 115. Exhaust pipe; 116. Intake port; 120. Grinding wheel; 130. Dressing knife; 200. Wafer product; 201. Surface to be polished. DETAILED DESCRIPTION

[0019] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] It should be understood that the polished part of the present invention is the protruding thread head on the outer surface of the wafer product 200, and the thread head is located on the wider surface of the wafer product 200. For ease of understanding, please refer to Figure 4 The surface to be polished 201 at the bottom of the wafer product 200 is a surface to be polished, and the wire ends protrude from the surface to be polished 201 of the wafer product 200. At this time, the protruding wire ends on the surface to be polished 201 need to be polished.

[0023] To this end, the present invention provides a full-size wafer chip grinding head device, such as Figure 2 and Figure 3As shown, it includes a product carrier 110, a grinding wheel 120, a trimming knife 130, and a driving mechanism; wherein the driving mechanism is configured to drive the product carrier 110 to move along the Y-axis direction, and drive the grinding wheel 120 to move along the X-axis and Z-axis directions; Combination Figure 4 The product carrier 110 has a carrying surface for placing the wafer product 200 in an inverted manner, and the carrying surface is in a horizontal state, and the surface 201 to be polished of the wafer product 200 is limited to a fixed height by limiting the movement in the Y-axis direction; The trimming knife 130 is disposed below the movement path of the grinding wheel 120 and is used to trim the grinding wheel 120 when the grinding wheel 120 passes by; A grinding wheel driving member 104 for driving the grinding wheel 120 to rotate is coaxially connected to one side of the grinding wheel 120. The grinding wheel driving member 104 is preferably a motor. Figure 5 , and the grinding wheel 120 is in a vertical state with respect to the bearing surface; the grinding wheel 120 has an initial position, when the unworn grinding wheel 120 is in the initial position, the top end of the outer ring of the grinding wheel 120 is at the same height as the surface to be ground 201, and the bottom end of the outer ring of the grinding wheel 120 is at the same height as the top end of the dressing knife 130 or a spacing is set between the top end of the dressing knife 130; When the grinding wheel 120 reaches the preset working state, the driving mechanism drives the grinding wheel 120 to descend to a preset height so that the outer ring of the grinding wheel 120 can be ground using the dressing knife 130, and then reset to the initial position; after resetting, the driving mechanism drives the grinding wheel 120 to rise to a preset height so that the top of the outer ring of the grinding wheel 120 is at the same height as the surface 201 to be polished again.

[0024] In the above, the preset working state can be preset by quantity, for example, the grinding wheel 120 is in the preset working state after grinding a specified number of wafer products 200; or it can be preset by time, for example, the grinding wheel 120 is in the preset working state after grinding for a specified time. In addition, the degree of wear of the grinding wheel 120 when reaching the preset working state does not affect the grinding quality of the wafer products 200.

[0025] That is, by inverting the wafer product 200 to fix the height of the surface to be polished 201, when polishing wafer products 200 of different sizes, the surfaces to be polished 201 of wafer products 200 of different sizes are still at the same height. In addition, combined with the initial position set for the grinding wheel 120, the distance that the grinding wheel 120 descends to complete the grinding can be used as a basis for adjusting the height of the grinding wheel 120, so that the position of the wafer product 200 after grinding can be quickly adjusted, reducing the number of debugging times and improving the overall grinding efficiency.

[0026] It should be understood that the wire grinding head device also includes a frame 100, such as Figure 1 As shown, the frame 100 is a hollow box structure, and the interior is used to provide installation space for the product carrier 110, the grinding wheel 120, the trimming knife 130, and the driving mechanism. The top of the frame 100 is provided with a control device 101 and an operation port 102. The control device 101 is used to control the driving parameters of the driving mechanism, such as adjusting the driving stroke in the X-axis, Y-axis, and Z-axis directions. The operation port 102 is used for the discharge and retrieval of the wafer product 200. Correspondingly, the product carrier 110 is located below the operation port 102 to facilitate the staff to perform the above-mentioned discharge and retrieval operations. In addition, the product carrier 110, the grinding wheel 120, the trimming knife 130, and the driving mechanism are all arranged on the substrate 103, and the substrate 103 is fixedly installed inside the frame 100.

[0027] In the above, the driving mechanism can drive the product carrier 110 to move along the Y-axis direction, and drive the grinding wheel 120 to move along the X-axis and Z-axis directions. In one embodiment, the driving mechanism can be divided into a Y-axis driving member 105, a Z-axis driving member 106 and an X-axis driving member 107. As a specific example, Figure 2 As shown, the Y-axis driving member 105 is fixedly connected to the bottom of the product carrier 110, the Z-axis driving member 106 is fixedly connected to the grinding wheel driving member 104, and the X-axis driving member 107 is fixedly connected to the Z-axis driving member 106. Here, the Y-axis driving member 105 and the X-axis driving member 107 are both arranged on the substrate 103. In this way, the Y-axis driving member 105 drives the product carrier 110 to move in the Y-axis direction, the Z-axis driving member 106 drives the grinding wheel 120 to move in the Z-axis direction through the grinding wheel driving member 104, and the X-axis driving member 107 drives the grinding wheel 120 to move in the X-axis direction through the Z-axis driving member 106 and the grinding wheel driving member 104.

[0028] It should be noted that the Y-axis driving component 105, the Z-axis driving component 106 and the X-axis driving component 107 are all existing technologies. For example, they can adopt the driving method of a motor plus a screw, or a hydraulic rod, or an electric push rod, etc. Therefore, the connection relationship between the grinding wheel driving component 104, the Y-axis driving component 105, the Z-axis driving component 106 and the X-axis driving component 107 will not be elaborated here.

[0029] like Figure 3 As shown, the trimming knife 130 is a columnar structure as a whole, and the top end is narrowed inward to form a grinding portion for grinding the grinding wheel 120. The specific shape can refer to the shape of a pencil. At the same time, the hardness of the trimming knife 130 is greater than the hardness of the grinding wheel 120, so as to achieve the grinding of the grinding wheel 120. At the same time, the trimming knife 130 is located below the center of the grinding wheel 120 and is fixed on the substrate 103.

[0030] like Figure 6-Figure 8As shown, the product carrier 110 includes a carrier table 111 and a limiting mechanism fixedly connected to the Y-axis driving member 105, wherein the top surface of the carrier table 111 is a carrier surface; the limiting mechanism is used to fix the wafer product 200 on the carrier surface in a detachable manner. Specifically, there are many ways to fix the wafer product 200, using a pressing type, a negative pressure type, a clamping type, and the like. In order to improve the efficiency of fixing multiple wafer products 200 at the same time. The present invention preferably adopts a negative pressure type, and its specific structure is as follows: The limiting mechanism includes a cover plate 112 covering the top of the carrier 111, an air suction chamber 114 arranged inside the carrier 111, and a plurality of air suction ports 116 arranged on the top of the carrier 111; wherein one end of the air suction chamber 114 passes through the top of the carrier 111 and is connected to the exhaust fan through an air suction pipe 115; the plurality of air suction ports 116 are all connected to the air suction chamber 114, and the plurality of air suction ports 116 are distributed at a portion of the carrier 111 near one end of the grinding wheel 120 (refer to Figure 6 and Figure 7 ). In addition, the opening at the top of the outermost air inlet 116 extends to one end of the carrier 111 close to the grinding wheel 120 to improve the adsorption effect on the wafer product 200. In this way, the air in the air extraction chamber 114 is extracted by the exhaust fan. When the wafer product 200 is placed on the top of the air inlet 116, the outside gas cannot enter the air extraction chamber 114 through the air inlet 116. At this time, the gas in the air extraction chamber 114 is lower than the outside air pressure, so that the wafer product 200 is sucked on the top of the carrier 111 under the action of the air pressure difference. Then, the cover plate 112 is covered on the top of the carrier 111. The part where the cover plate 112 contacts the wafer product 200 is preferably made of rubber material to avoid crushing the wafer product 200. To facilitate the removal of the cover 112 , the present invention provides a magnet 113 that is magnetically attracted to the cover 112 inside the support platform 111 , so that when the cover 112 is close to the top of the support platform 111 , the magnet 113 can automatically attract the cover 112 to the top of the support platform 111 .

[0031] Moreover, after the cover plate 112 is covered on the top of the carrier 111 , one end of the cover plate 112 protrudes toward the grinding wheel 120 to restrict the top of the wafer product 200 and prevent the wafer product 200 from moving upward during the grinding process.

[0032] When the wire grinding head device of the present invention is working, first, the surface 201 to be polished of the wafer product 200 is facing downward (i.e., inverted), then the wafer product 200 is placed on the top of the air intake port 116, and the part to be polished of the wafer product 200 protrudes from the end of the supporting platform 111, then the exhaust fan is started to fix the wafer product 200, and the cover plate 112 is covered to further fix the wafer product 200.

[0033] When the grinding wheel 120 is not worn, Figure 5 As shown, the top of the grinding wheel 120 is at the same height as the bottom of the wafer product 200 (i.e., the surface to be polished 201). Then, the grinding wheel 120 is driven to the bottom of the surface to be polished 201 by the X-axis driving member 107, and the product carrier 110 is driven to move by the Y-axis driving member 105. The product carrier 110 drives the wafer product 200 to move. When the wafer product 200 passes through the grinding wheel 120, the thread ends at the surface to be polished 201 are polished by the grinding wheel 120.

[0034] Next, two embodiments will be used to illustrate the difference between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing knife 130 being at the same height or the distance between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing knife 130 being set.

[0035] In one embodiment, if Figure 5 As shown, when the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing knife 130 are at the same height, the preset height of the driving grinding wheel 120 to rise is consistent with the preset height of the driving grinding wheel 120 to descend.

[0036] The principle is as follows: Combine Fig. 9 and Fig.10 In the figure, a is the height of the initial position of the grinding wheel 120, b is the preset height of the grinding wheel 120 to be lowered, c is the preset height of the grinding wheel 120 to be raised, d is the distance of the grinding wheel 120 rising from a to c, and e is the distance of the grinding wheel 120 falling from a to b. When the grinding wheel 120 is in the preset grinding state, for example, when grinding 100 wafer products 200 on the rack, the grinding wheel 120 is controlled to drop from the initial position a to the preset height b, assuming that the dropped distance e is 5 mm. Then the grinding wheel 120 is controlled to move in the X-axis direction, at which time the lowered grinding wheel 120 contacts the trimming knife 130, and the trimming knife 130 grinds the grinding wheel 120, shortening the diameter of the grinding wheel 120 by 5 mm. Then, the grinding wheel 120 is controlled to move from the preset height b to the initial position a. At this time, the height difference between the top of the grinding wheel 120 and the surface 201 to be polished is 5 mm. Therefore, the distance d that the grinding wheel 120 is controlled to move from the initial position a to the preset height c is 5 mm.

[0037] Therefore, the distance e that the grinding wheel 120 descends from the initial position a to the preset height b is consistent with the distance d that it rises from the initial position a to the preset height c. In this way, it is only necessary to remember the distance that the grinding wheel 120 descends during the grinding process to know the distance that the grinding wheel 120 rises after returning to the initial position.

[0038] In another embodiment, if Fig.11As shown, when a gap is set between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing knife 130 (i.e., the top end of the dressing knife 130 is lower than the bottom end of the outer ring of the grinding wheel 120), the preset height for driving the grinding wheel 120 to rise is the difference between the preset height for driving the grinding wheel 120 to descend and the gap.

[0039] The principle is as follows: Assume that the distance between the bottom end of the outer ring of the product carrier 110 and the top end of the trimming knife 130 is 1 mm. In this way, when the distance e from the initial position a to the preset height b of the grinding wheel 120 is 5 mm, at this time, due to the existence of a 1 mm spacing, the diameter of the grinding wheel 120 can only be shortened by 4 mm by the trimming knife 130. Therefore, when the grinding wheel 120 is reset to the initial position a, the distance between the top end of the outer ring of the grinding wheel 120 and the surface to be polished 201 is also 4 mm. At this time, the calculation formula for calculating the difference is: difference = 5 mm (distance e) - 1 mm (spacing). Therefore, the preset height to which the driving mechanism drives the grinding wheel 120 to rise is 4 mm.

[0040] It is worth noting that the distance e that the grinding wheel 120 descends from the initial position a to the preset height b needs to be greater than the difference in diameter between the grinding wheel 120 before and after wear. For example, the diameter of the grinding wheel 120 before wear is 15 cm, and the diameter after wear is 14 cm. If the difference in diameter between the grinding wheel 120 before and after wear is 1 cm, then the distance e should also be greater than 1 cm, otherwise the trimming knife 130 cannot contact the grinding wheel 120, making it difficult to achieve the grinding of the grinding wheel 120.

[0041] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A full-size wafer chip grinding head device, characterized by: The invention comprises a product carrier (110), a grinding wheel (120), a trimming knife (130), and a driving mechanism; wherein the driving mechanism is configured to drive the product carrier (110) to move along the Y-axis direction, and to drive the grinding wheel (120) to move along the X-axis and Z-axis directions; The product carrier (110) has a carrying surface for placing the wafer product (200) in an inverted manner, and the carrying surface is in a horizontal state, and the surface to be polished (201) of the wafer product (200) is restricted to a fixed height by limiting the movement in the Y-axis direction; The trimming knife (130) is fixedly arranged below the movement path of the grinding wheel (120); A grinding wheel driving member (104) for driving the grinding wheel (120) to rotate is coaxially connected to one side of the grinding wheel (120), and the grinding wheel (120) and the bearing surface are in a vertical state; the grinding wheel (120) has an initial position, and when the unworn grinding wheel (120) is in the initial position, the top of the outer ring of the grinding wheel (120) is at the same height as the surface to be ground (201); When the grinding wheel (120) reaches a preset working state, the driving mechanism drives the grinding wheel (120) to descend to a preset height, so that the outer ring of the grinding wheel (120) is ground using the dressing knife (130), and then reset to an initial position; after the reset, the driving mechanism drives the grinding wheel (120) to ascend to a preset height, so that the top of the outer ring of the grinding wheel (120) is at the same height as the surface to be ground (201) again.

2. The full-size wafer chip grinding head device according to claim 1 is characterized in that: The degree of wear of the grinding wheel (120) when reaching a preset working state does not affect the grinding quality of the wafer product (200).

3. The full-size wafer chip grinding head equipment according to claim 1 is characterized in that: The bottom end of the outer ring of the grinding wheel (120) and the top end of the trimming knife (130) are at the same height, and the preset height at which the driving grinding wheel (120) rises is consistent with the preset height at which the driving grinding wheel (120) descends.

4. The full-size wafer chip grinding head device according to claim 1 is characterized in that: A spacing is provided between the bottom end of the outer ring of the grinding wheel (120) and the top end of the trimming knife (130), and the preset height for driving the grinding wheel (120) to rise is the difference between the preset height for driving the grinding wheel (120) to descend and the spacing.

5. The full-size wafer chip grinding head equipment according to claim 1 is characterized in that: The driving mechanism comprises a Y-axis driving member (105), a Z-axis driving member (106) and an X-axis driving member (107); The Y-axis driving member (105) is fixedly connected to the bottom of the product carrier (110); The Z-axis driving component (106) is fixedly connected to the grinding wheel driving component (104); The X-axis driving component (107) is fixedly connected to the Z-axis driving component (106); The Y-axis driving component (105) and the X-axis driving component (107) are both arranged on the substrate (103).

6. The full-size wafer chip grinding head device according to claim 1, characterized in that: The trimming knife (130) is a columnar structure as a whole, and the top end is narrowed inwardly to form a grinding portion used for trimming the grinding wheel (120).

7. The full-size wafer chip grinding head device according to claim 5, characterized in that: The hardness of the trimming knife (130) is greater than the hardness of the grinding wheel (120), and the trimming knife (130) is located below the center of the grinding wheel (120) and is fixed on the base plate (103).

8. The full-size wafer chip grinding head device according to claim 5, characterized in that: The product carrier (110) comprises a carrier platform (111) fixedly connected to the Y-axis driving member (105) and a limiting mechanism; The top surface of the bearing platform (111) is a bearing surface; The limiting mechanism is used to fix the wafer product (200) on the carrying surface in a detachable manner.

9. The full-size wafer chip grinding head device according to claim 8, characterized in that: The limiting mechanism comprises a cover plate (112) arranged on the top of the carrying platform (111), an air suction cavity (114) arranged inside the carrying platform (111), and a plurality of air suction ports (116) arranged on the top of the carrying platform (111); wherein: One end of the air extraction chamber (114) passes through the top of the supporting platform (111) and is connected to the exhaust fan via an air extraction pipe (115); The plurality of air intake ports (116) are all in communication with the air extraction chamber (114), and the plurality of air intake ports (116) are distributed at one end of the support platform (111) close to the grinding wheel (120).

10. The full-size wafer chip grinding head device according to claim 9, characterized in that: A magnet (113) is arranged inside the supporting platform (111) and is magnetically matched with the cover plate (112).

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