A device for a full-size wafer chip grinding head

Abstract

The present invention relates to the technical field of wafer chip processing, and specifically, to a grinding head device for full-size wafer chips. It includes a product carrier, a grinding wheel, a dressing tool, and a driving mechanism; the driving mechanism is configured to drive the product carrier to move in the Y-axis direction and drive the grinding wheel to move in the X-axis and Z-axis directions; the product carrier has a bearing surface for placing the wafer product in an inverted manner, and the bearing surface is in a horizontal state. By restricting the movement in the Y-axis direction, the surface to be polished of the wafer product is restricted at a fixed height; in this grinding head device for full-size wafer chips, by inverting the wafer product, the height of the surface to be polished is fixed, so that the surfaces to be polished of wafer products of different sizes are still at the same height. Moreover, in combination with the initial position set for the grinding wheel, the distance for the grinding wheel to descend to complete grinding can be used as the basis for adjusting the height of the grinding wheel.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer chip processing, and more specifically, to a device for grinding the wire heads of full-size wafer chips. Background Art

[0002] Currently, during the bonding (WireBonding) process of high-value, high-precision, and high-density chips in the packaging section, poor bonding or poor multi-layer stacking may occur. The wafers inside such chips are still intact. To repair them, the original wire heads must be ground flat before re-bonding. In some cases, quality problems are discovered only after molding or dicing. After using a special solvent to remove the wafers inside the chips (industry term "washing the crystal") and melting the epoxy resin on the outer surface, the intact and undamaged wafer chips will be exposed, and then the chips are removed from the circuit board. Since the wafer chips and the circuit board are connected by gold wire welding, wire heads still remain on the wafer chips after removal.

[0003] However, the current wire head grinding devices face the following problems during use:

[0004] First, during the grinding process, the working surface of the grinding wheel will be damaged after long-term use, resulting in a decline in grinding quality, which in turn affects the grinding quality of the wafer chips. Therefore, the grinding wheel needs to be dressed after a certain period of use. However, the diameter of the grinding wheel will change after dressing. At this time, the operator needs to adjust the position of the grinding wheel and perform a trial grind (testing the grinding quality of the wafer chips after adjustment), and then observe through a microscope whether the grinding is qualified. If it is unqualified, readjustment is required, making the overall efficiency of grinding the wire heads of the wafers low.

[0005] Second, since there are many types of wafer chips, when facing wafer chips of different sizes, the thickness of the wafer chips changes, and at this time, the horizontal height between the grinding wheel and the wafer chips also changes, so the position of the grinding wheel needs to be adjusted, affecting the grinding efficiency. Summary of the Invention

[0006] The purpose of the present invention is to provide a device for grinding the wire heads of full-size wafer chips to solve the problems raised in the above background art.

[0007] To achieve the above purpose, a device for grinding the wire heads of full-size wafer chips is provided, including a product carrier, a grinding wheel, a dressing tool, and a driving mechanism; wherein, the driving mechanism is configured to drive the product carrier to move along the Y-axis direction and drive the grinding wheel to move along the X-axis and Z-axis directions;

[0008] The product carrier has a bearing surface for placing the wafer product in an inverted manner, and the bearing surface is in a horizontal state. By restricting the movement in the Y-axis direction, the surface to be ground of the wafer product is restricted at a fixed height;

[0009] The dressing tool is fixedly arranged below the movement path of the grinding wheel;

[0010] One side of the grinding wheel is coaxially connected with a grinding wheel driving member for driving the grinding wheel to rotate, and the grinding wheel is perpendicular to the bearing surface; The grinding wheel has an initial position. When the unworn grinding wheel is in the initial position, the top of the outer ring of the grinding wheel is at the same height as the surface to be polished;

[0011] When the grinding wheel reaches the preset working state, the driving mechanism drives the grinding wheel to descend by a preset height to grind the outer ring of the grinding wheel with the dressing tool, and then resets to the initial position; After resetting, the driving mechanism drives the grinding wheel to rise by a preset height so that the top of the outer ring of the grinding wheel is again at the same height as the surface to be polished.

[0012] As a further improvement of this technical solution, the wear degree of the grinding wheel when it reaches the preset working state does not affect the grinding quality of the wafer product.

[0013] As a further improvement of this technical solution, the bottom end of the outer ring of the grinding wheel is at the same height as the top end of the dressing tool, and the preset height for driving the grinding wheel to rise is the same as the preset height for driving the grinding wheel to descend.

[0014] As a further improvement of this technical solution, a distance is provided between the bottom end of the outer ring of the grinding wheel and the top end of the dressing tool, and the preset height for driving the grinding wheel to rise is the difference between the preset height for driving the grinding wheel to descend and the distance.

[0015] As a further improvement of this technical solution, the driving mechanism includes a Y-axis driving member, a Z-axis driving member and an X-axis driving member;

[0016] The Y-axis driving member is fixedly connected to the bottom of the product carrier;

[0017] The Z-axis driving member is fixedly connected to the grinding wheel driving member;

[0018] The X-axis driving member is fixedly connected to the Z-axis driving member;

[0019] Both the Y-axis driving member and the X-axis driving member are arranged on the substrate.

[0020] As a further improvement of this technical solution, the dressing tool is integrally in a columnar structure, and the top end is narrowed inward to form a grinding part for grinding the grinding wheel.

[0021] As a further improvement of this technical solution, the hardness of the dressing tool is greater than that of the grinding wheel, and the dressing tool is below the center of the grinding wheel and fixed on the substrate.

[0022] As a further improvement of the technical solution, the product carrier includes a carrying platform fixedly connected to the Y-axis driving member and a limiting mechanism;

[0023] The top surface of the carrying platform is a carrying surface;

[0024] The limiting mechanism is used to fixedly mount the wafer product on the carrying surface in a detachable manner.

[0025] As a further improvement of the technical solution, the limiting mechanism includes a cover plate covering the top of the carrying platform, an air extraction chamber provided inside the carrying platform, and a plurality of air suction ports provided on the top of the carrying platform; wherein,

[0026] One end of the air extraction chamber penetrates through the top of the carrying platform and is connected to an air extraction fan through an air extraction pipe;

[0027] A plurality of the air suction ports are all communicated with the air extraction chamber, and the plurality of air suction ports are distributed at one end of the carrying platform close to the grinding wheel.

[0028] As a further improvement of the technical solution, a magnet magnetically matched with the cover plate is provided inside the carrying platform.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] In the full-size wafer chip grinding head equipment, by inverting the wafer product to fix the height of the surface to be ground, when grinding wafer products of different sizes, the surfaces to be ground of the wafer products of different sizes are still at the same height. Moreover, combined with the initial position set for the grinding wheel, the distance that the grinding wheel descends to complete the dressing can be used as the basis for adjusting the height of the grinding wheel, so that the wafer product after the dressing can quickly achieve position adjustment, reduce the number of debugging times, and improve the overall grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 is a schematic diagram of the structure of the product carrier of the present invention;

[0033] Figure 3 is a schematic diagram of the structure of the dressing tool of the present invention;

[0034] Figure 4 is a schematic diagram of the initial position of the grinding wheel of the present invention;

[0035] Figure 5 is a schematic diagram of the position of the dressing tool of the present invention Figure 1 ;

[0036] Figure 6 is a schematic diagram of the structure of the carrying platform of the present invention;

[0037] Figure 7 Schematic cross-sectional structure diagram of the carrier stage of the present invention;

[0038] Figure 8 For the present invention Figure 7 Enlarged schematic diagram of the structure at position A;

[0039] Figure 9 Schematic diagram of the adjustment state of the grinding wheel of the present invention;

[0040] Figure 10 For the present invention Figure 9 Enlarged schematic diagram of the structure at position B;

[0041] Figure 11 Schematic diagram of the position of the dressing tool of the present invention Figure 2 .

[0042] The meanings of each label in the figure are as follows:

[0043] 100, frame; 101, control device; 102, operation port; 103, substrate; 104, grinding wheel drive; 105, Y-axis drive; 106, Z-axis drive; 107, X-axis drive; 110, product carrier; 111, carrier stage; 112, cover plate; 113, magnet; 114, air extraction chamber; 115, air extraction pipe; 116, air suction port; 120, grinding wheel; 130, dressing tool; 200, wafer product; 201, surface to be polished. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0047] It should be understood that the part to be polished in the present invention is the protruding wire head on the outer surface of the wafer product 200, and the wire head is located on the wider surface of the wafer product 200. For ease of understanding, reference may be made to Figure 4 the surface 201 to be polished at the bottom of the wafer product 200 in. The wire head protrudes from the surface 201 to be polished of the wafer product 200, and at this time, the protruding wire head on the surface 201 to be polished needs to be polished.

[0048] For this purpose, the present invention provides a wire head grinding device for a full-size wafer chip, such as Figure 2 and Figure 3 shown, including a product carrier 110, a grinding wheel 120, a dressing tool 130, and a driving mechanism; wherein, the driving mechanism is configured to drive the product carrier 110 to move in the Y-axis direction and drive the grinding wheel 120 to move in the X-axis and Z-axis directions;

[0049] Combined with Figure 4 , the product carrier 110 has a bearing surface for placing the wafer product 200 in an inverted manner, and the bearing surface is in a horizontal state. By restricting the movement in the Y-axis direction, the surface 201 to be polished of the wafer product 200 is restricted at a fixed height;

[0050] The dressing tool 130 is arranged below the movement path of the grinding wheel 120 and is used for dressing the grinding wheel 120 when the grinding wheel 120 passes by;

[0051] One side of the grinding wheel 120 is coaxially connected with a grinding wheel driving member 104 for driving the grinding wheel 120 to rotate. The grinding wheel driving member 104 is preferably a motor. Combined with Figure 5 , and the grinding wheel 120 is perpendicular to the bearing surface; the grinding wheel 120 has an initial position. When the unworn grinding wheel 120 is in the initial position, the top of the outer ring of the grinding wheel 120 is at the same height as the surface 201 to be polished, and the bottom of the outer ring of the grinding wheel 120 is at the same height as the top of the dressing tool 130 or a spacing is provided between the bottom of the outer ring of the grinding wheel 120 and the top of the dressing tool 130;

[0052] When the grinding wheel 120 reaches the preset working state, the driving mechanism drives the grinding wheel 120 to descend by a preset height to dress the outer ring of the grinding wheel 120 by using the dressing tool 130, and then resets to the initial position; after resetting, the driving mechanism drives the grinding wheel 120 to rise by a preset height so that the top of the outer ring of the grinding wheel 120 is again at the same height as the surface 201 to be polished.

[0053] In the above, the preset working state can be preset by quantity. For example, the state of the grinding wheel 120 after grinding a specified quantity of wafer products 200 is in the preset working state; or, it can also be preset by time. For example, the state of the grinding wheel 120 after grinding for a specified time is in the preset working state. Moreover, the wear degree of the grinding wheel 120 when it reaches the preset working state does not affect the grinding quality of the wafer products 200.

[0054] That is to say, by inverting the wafer product 200 to fix the height of the surface to be ground 201, when grinding wafer products 200 of different sizes, the surfaces to be ground 201 of the wafer products 200 of different sizes are still at the same height. And, combined with the initial position set for the grinding wheel 120, the distance that the grinding wheel 120 descends to complete dressing can be used as the basis for adjusting the height of the grinding wheel 120, so that the wafer product 200 after dressing can quickly adjust its position, reduce the number of debugging times, and improve the overall grinding efficiency.

[0055] It should be understood that the grinding head equipment further includes a frame 100, as Figure 1 shown, the frame 100 is a hollow box structure, and the inside is used to provide installation space for the product carrier 110, the grinding wheel 120, the dressing tool 130, and the driving mechanism. A control device 101 and an operation port 102 are provided at the top of the frame 100. The control device 101 is used to control the driving parameters of the driving mechanism, such as adjusting the driving strokes in the X-axis, Y-axis, and Z-axis directions. The operation port 102 is used for loading and unloading the wafer product 200. Correspondingly, the product carrier 110 is located below the operation port 102 to facilitate the above-mentioned loading and unloading operations by the staff. Moreover, the product carrier 110, the grinding wheel 120, the dressing tool 130, and the driving mechanism are all arranged on a substrate 103, and the substrate 103 is fixedly installed inside the frame 100.

[0056] In the above, the driving mechanism can drive the product carrier 110 to move in the Y-axis direction, and drive the grinding wheel 120 to move in the X-axis and Z-axis directions. In one embodiment, the driving mechanism can be divided into a Y-axis driving member 105, a Z-axis driving member 106, and an X-axis driving member 107. As a specific example, as Figure 2As shown, the Y-axis driving member 105 is fixedly connected to the bottom of the product carrier 110, the Z-axis driving member 106 is fixedly connected to the grinding wheel driving member 104, and the X-axis driving member 107 is fixedly connected to the Z-axis driving member 106. Among them, both the Y-axis driving member 105 and the X-axis driving member 107 are arranged on the substrate 103. In this way, the Y-axis driving member 105 drives the product carrier 110 to move in the Y-axis direction, the Z-axis driving member 106 drives the grinding wheel 120 to move in the Z-axis direction through the grinding wheel driving member 104, and the X-axis driving member 107 drives the grinding wheel 120 to move in the X-axis direction through the Z-axis driving member 106 and the grinding wheel driving member 104.

[0057] It should be noted that the Y-axis driving member 105, the Z-axis driving member 106, and the X-axis driving member 107 are all prior arts. For example, a driving method of a motor plus a lead screw, or a hydraulic rod, or an electric push rod, etc. can be adopted. Therefore, the connection relationships among the grinding wheel driving member 104, the Y-axis driving member 105, the Z-axis driving member 106, and the X-axis driving member 107 will not be elaborated here.

[0058] As Figure 3 shown, the dressing tool 130 is a columnar structure as a whole, and the top end is narrowed inward to form a grinding portion for dressing the grinding wheel 120. The specific shape can refer to the shape of a pencil. At the same time, the hardness of the dressing tool 130 is greater than that of the grinding wheel 120 to achieve dressing of the grinding wheel 120. At the same time, the dressing tool 130 is located below the center of the grinding wheel 120 and is fixed on the substrate 103.

[0059] As Figures 6 - 8 shown, the product carrier 110 includes a carrier table 111 fixedly connected to the Y-axis driving member 105 and a limiting mechanism. Among them, the top surface of the carrier table 111 is a bearing surface; the limiting mechanism is used to fixedly connect the wafer product 200 to the bearing surface in a detachable manner. Specifically, there are various ways to fix the wafer product 200, such as pressing type, negative pressure type, clamping type, etc. In order to improve the efficiency of simultaneously fixing multiple wafer products 200. The present invention preferably adopts the negative pressure type, and its specific structure is as follows:

[0060] The limiting mechanism includes a cover plate 112 covering the top of the carrier table 111, an air extraction chamber 114 arranged inside the carrier table 111, and a plurality of air suction ports 116 arranged on the top of the carrier table 111; among them, one end of the air extraction chamber 114 penetrates through the top of the carrier table 111 and is connected to an air extraction fan through an air extraction pipe 115; the plurality of air suction ports 116 are all communicated with the air extraction chamber 114, and the plurality of air suction ports 116 are distributed at a part of the carrier table 111 close to the grinding wheel 120 (refer to Figure 6 and Figure 7). Moreover, the opening at the top of the outermost air suction port 116 extends to one end of the carrier 111 close to the grinding wheel 120 to improve the adsorption effect on the wafer product 200. In this way, the air in the air extraction chamber 114 is extracted by the exhaust fan. When the wafer product 200 is placed on the top of the air suction port 116, since the outside gas cannot enter the air extraction chamber 114 through the air suction port 116, the gas in the air extraction chamber 114 is lower than the outside air pressure at this time. Thus, the wafer product 200 is adsorbed on the top of the carrier 111 under the action of the pressure difference. Subsequently, the cover plate 112 can be covered on the top of the carrier 111. The part of the cover plate 112 in contact with the wafer product 200 is preferably made of rubber material to avoid damaging the wafer product 200. For the convenience of disassembling the cover plate 112, a magnet 113 magnetically attracted to the cover plate 112 is arranged inside the carrier 111 in the present invention. In this way, when the cover plate 112 approaches the top of the carrier 111, the magnet 113 can automatically attract the cover plate 112 to the top of the carrier 111.

[0061] Moreover, after the cover plate 112 is covered on the top of the carrier 111, one end of the cover plate 112 protrudes towards the grinding wheel 120 to limit the top of the wafer product 200 and prevent the wafer product 200 from moving upward during the grinding process.

[0062] When the grinding head device of the present invention is working, first, the surface 201 to be ground of the wafer product 200 is placed downward (i.e., inverted), then the wafer product 200 is placed on the top of the air suction port 116, and the part of the wafer product 200 to be ground protrudes from the end of the carrier 111. Then, the exhaust fan is started to fix the wafer product 200, and the cover plate 112 is covered to further fix the wafer product 200.

[0063] When the grinding wheel 120 is not worn, as Figure 5 shown, the top of the grinding wheel 120 is at the same height as the bottom of the wafer product 200 (i.e., the surface 201 to be ground). Then, the grinding wheel 120 is driven below the surface 201 to be ground by the X-axis driving member 107, and the product carrier 110 is driven to move by the Y-axis driving member 105. The product carrier 110 drives the wafer product 200 to move. When the wafer product 200 passes by the grinding wheel 120, the wire head at the surface 201 to be ground is ground by the grinding wheel 120.

[0064] Next, two embodiments will be used to illustrate the difference between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing tool 130 being at the same height or a distance being set between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing tool 130.

[0065] In one embodiment, as Figure 5As shown, when the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing tool 130 are at the same height, the preset height for driving the grinding wheel 120 to rise is the same as the preset height for driving the grinding wheel 120 to descend.

[0066] The principle is as follows: Combining Figure 9 and Figure 10 , in the figure, a is the height of the initial position of the grinding wheel 120, b is the preset height for the grinding wheel 120 to descend, c is the preset height for the grinding wheel 120 to rise, d is the distance for the grinding wheel 120 to rise from a to c, and e is the distance for the grinding wheel 120 to descend from a to b. When the grinding wheel 120 is in the preset grinding state, for example, when grinding 100 wafer products 200 of the frame 100, control the grinding wheel 120 to descend from the initial position a to the preset height b. Assume the descending distance e is 5 millimeters. Then control the grinding wheel 120 to move in the X-axis direction. At this time, the descending grinding wheel 120 contacts the dressing tool 130, and the dressing tool 130 grinds the grinding wheel 120, shortening the diameter of the grinding wheel 120 by 5 millimeters. Then, control the grinding wheel 120 to move up from the preset height b to the initial position a. At this time, the difference in height between the top end of the grinding wheel 120 and the surface to be ground 201 is also 5 millimeters. Therefore, at this time, the distance d for controlling the grinding wheel 120 to move up from the initial position a to the preset height c is 5 millimeters.

[0067] Therefore, the distance e for the grinding wheel 120 to descend from the initial position a to the preset height b is the same as the distance d for the grinding wheel 120 to rise from the initial position a to the preset height c. In this way, only by remembering the descending distance of the grinding wheel 120 during the grinding process, the ascending distance of the grinding wheel 120 after resetting to the initial position can be known.

[0068] In another embodiment, as Figure 11 shown, when a gap is provided between the bottom end of the outer ring of the grinding wheel 120 and the top end of the dressing tool 130 (that is, the top end of the dressing tool 130 is lower than the bottom end of the outer ring of the grinding wheel 120), the preset height for driving the grinding wheel 120 to rise is the difference between the preset height for driving the grinding wheel 120 to descend and the gap.

[0069] The principle is as follows: Assume the gap between the bottom end of the outer ring of the product carrier 110 and the top end of the dressing tool 130 is 1 millimeter. In this way, when the distance e for the grinding wheel 120 to descend from the initial position a to the preset height b is 5 millimeters, at this time, due to the existence of a 1-millimeter gap, the diameter of the grinding wheel 120 can only be shortened by 4 millimeters by the dressing tool 130. Therefore, when the grinding wheel 120 is reset to the initial position a, the distance between the top end of the outer ring of the grinding wheel 120 and the surface to be ground 201 is also 4 millimeters. The calculation formula for calculating the difference at this time is: Difference = 5 millimeters (distance e) - 1 millimeter (gap). Therefore, the preset height for the driving mechanism to drive the grinding wheel 120 to rise is 4 millimeters.

[0070] It should be noted that the distance e from the initial position a to the preset height b of the grinding wheel 120 needs to be greater than the difference in diameter between the grinding wheel 120 before and after wear. For example, the diameter of the unworn grinding wheel 120 is 15 cm, and the diameter after wear is 14 cm. Then the difference in diameter between the grinding wheel 120 before and after wear is 1 cm. At this time, the distance e also needs to be greater than 1 cm. Otherwise, the dressing tool 130 cannot contact the grinding wheel 120, and it is difficult to realize the grinding of the grinding wheel 120.

[0071] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A full-size wafer chip grinding head device, characterized by: The invention comprises a product carrier (110), a grinding wheel (120), a trimming knife (130), and a driving mechanism; wherein the driving mechanism is configured to drive the product carrier (110) to move along the Y-axis direction, and to drive the grinding wheel (120) to move along the X-axis and Z-axis directions; The product carrier (110) has a carrying surface for placing the wafer product (200) in an inverted manner, and the carrying surface is in a horizontal state, and the surface to be polished (201) of the wafer product (200) is restricted to a fixed height by limiting the movement in the Y-axis direction; The trimming knife (130) is fixedly arranged below the movement path of the grinding wheel (120); A grinding wheel driving member (104) for driving the grinding wheel (120) to rotate is coaxially connected to one side of the grinding wheel (120), and the grinding wheel (120) and the bearing surface are in a vertical state; the grinding wheel (120) has an initial position, and when the unworn grinding wheel (120) is in the initial position, the top of the outer ring of the grinding wheel (120) is at the same height as the surface to be ground (201); When the grinding wheel (120) reaches a preset working state, the driving mechanism drives the grinding wheel (120) to descend to a preset height, so that the outer ring of the grinding wheel (120) is ground using the dressing knife (130), and then reset to an initial position; after the reset, the driving mechanism drives the grinding wheel (120) to ascend to a preset height, so that the top of the outer ring of the grinding wheel (120) is at the same height as the surface to be ground (201) again; The product carrier (110) comprises a carrying platform (111) and a limiting mechanism; The top surface of the bearing platform (111) is a bearing surface; The limiting mechanism is used to fix the wafer product (200) on the carrying surface in a detachable manner; The limiting mechanism comprises a cover plate (112) arranged on the top of the carrying platform (111), an air suction cavity (114) arranged inside the carrying platform (111), and a plurality of air suction ports (116) arranged on the top of the carrying platform (111); wherein: One end of the air extraction chamber (114) passes through the top of the supporting platform (111) and is connected to the exhaust fan via an air extraction pipe (115); The plurality of air intake ports (116) are all in communication with the air extraction chamber (114), and the plurality of air intake ports (116) are distributed at one end of the support platform (111) close to the grinding wheel (120).

2. The full-size wafer chip grinding head device according to claim 1 is characterized in that: The degree of wear of the grinding wheel (120) when reaching a preset working state does not affect the grinding quality of the wafer product (200).

3. The full-size wafer chip grinding head equipment according to claim 1 is characterized in that: The bottom end of the outer ring of the grinding wheel (120) and the top end of the trimming knife (130) are at the same height, and the preset height at which the driving grinding wheel (120) rises is consistent with the preset height at which the driving grinding wheel (120) descends.

4. The full-size wafer chip grinding head device according to claim 1 is characterized in that: A spacing is provided between the bottom end of the outer ring of the grinding wheel (120) and the top end of the trimming knife (130), and the preset height for driving the grinding wheel (120) to rise is the difference between the preset height for driving the grinding wheel (120) to descend and the spacing.

5. The full-size wafer chip grinding head device according to claim 1, characterized in that: The driving mechanism comprises a Y-axis driving member (105), a Z-axis driving member (106) and an X-axis driving member (107); The Y-axis driving member (105) is fixedly connected to the bottom of the product carrier (110); The Z-axis driving component (106) is fixedly connected to the grinding wheel driving component (104); The X-axis driving component (107) is fixedly connected to the Z-axis driving component (106); The Y-axis driving component (105) and the X-axis driving component (107) are both arranged on the substrate (103).

6. The full-size wafer chip grinding head device according to claim 1, characterized in that: The trimming knife (130) is a columnar structure as a whole, and the top end is narrowed inwardly to form a grinding portion used for trimming the grinding wheel (120).

7. The full-size wafer chip grinding head device according to claim 5, characterized in that: The hardness of the trimming knife (130) is greater than the hardness of the grinding wheel (120), and the trimming knife (130) is located below the center of the grinding wheel (120) and is fixed on the base plate (103).

8. The full-size wafer chip grinding head device according to claim 1, characterized in that: A magnet (113) is arranged inside the supporting platform (111) and is magnetically matched with the cover plate (112).

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