Chip package packaging device

Abstract

A chip package packaging device includes: a workbench for placing packaging boxes, and both sides of the workbench in the length direction are provided with through slots with one end passing through; a bearing mechanism, including two rotating racks arranged on both sides of the workbench in the length direction and rotating around their own axes, and multiple bearing plates are arranged along the circumferential direction on the circumference of the rotating rack, and a material frame with a top opening is arranged on the bearing plate, and multiple packaging boxes are arranged in the material frame; a transfer mechanism, including a mobile rack and two lifting plates respectively arranged on the upper and lower sides of the workbench, the mobile rack and the lifting plate are arranged to move along the vertical and width directions of the workbench, and the bottom of the mobile rack is provided with multiple push plates along its length direction for pushing the packaging box, and when in use, at least a part of the lifting plate is located in the material frame for supporting the packaging box; a limiting mechanism, including two baffles respectively arranged at both ends of the workbench in the length direction, for limiting the ends of the packaging box. The device can automatically convey the packaging boxes and transfer them in batches, thereby improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a chip packaging device. Background Art

[0002] The chip package is one of the core components of an electronic device, which is mainly composed of a chip, a shell and pins. In the actual processing process, the chip is usually fixed on a lead frame, and then plastic-sealed so that the chip is wrapped in the shell. Then the pins are cut to form a single package, and finally the package is packed into a packaging box. In the prior art, the chip packages are usually transported in sequence by a conveyor belt, and then the chip packages are pushed into the packaging boxes in batches. In order to improve production efficiency, the packaging boxes are generally arranged in sequence in a vertical direction. After one of the packaging boxes carries the chip package, the packaging box is moved upward, and this cycle is repeated. However, after a row of packaging boxes all carry chip packages, the equipment needs to be paused so that there is sufficient time to replace the empty packaging boxes. However, this will cause the interruption of the production process, which is not conducive to improving production efficiency. When replacing the packaging boxes, the packaging boxes need to be taken out one by one, and care must be taken not to drop the chip packages in the packaging boxes, which will also affect production efficiency. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the related prior art, the present application provides a chip package packaging device, which can automatically transport and transfer packaging boxes in batches, improve production efficiency, and has strong practicality.

[0004] In order to achieve the above object, the present invention adopts the following technologies: A chip package packaging device comprises: a workbench, a bearing mechanism, a transfer mechanism, and a limiting mechanism.

[0005] The workbench is used to place packaging boxes, and when placed, the packaging boxes are arranged at intervals along the width direction of the workbench, and a through slot with one end penetrating therethrough is provided on both sides of the length direction of the workbench; the bearing mechanism includes two rotating frames respectively arranged on both sides of the length direction of the workbench and rotating around its own central axis, and a plurality of bearing plates arranged at intervals along the circumferential direction are provided on the circumference of the rotating frame, and a material frame with an opening on the top is placed on the bearing plate, and a plurality of packaging boxes are provided in the material frame along its height direction; the transfer mechanism includes moving frames respectively arranged on the upper and lower sides of the workbench and two lifting plates respectively located under the through slots, and the moving frames and the lifting plates are arranged to move back and forth vertically and in the width direction of the workbench. A plurality of push plates arranged at intervals are provided at the bottom of the movable frame along its length direction, which are used to push the packaging box to move along the width direction of the workbench. When in use, when the material frame is in a horizontal state, at least a part of the lifting plate is located in the material frame, which is used to lift the packaging box; the limiting mechanism includes two baffles respectively arranged at both ends of the length direction of the workbench, which are used to limit the ends of the packaging box, and a plurality of bottom plates arranged to move in the vertical direction and with the length direction parallel to the width direction of the workbench are provided between the baffles. The bottom plate is located below the workbench, and a plurality of spacer blocks arranged at intervals are provided on the top surface along its length direction. When in use, the spacer blocks pass through the workbench to limit the two sides of the packaging box.

[0006] Furthermore, U-shaped portions are provided at both ends of the load-bearing plate in the length direction, the material frame is located between the U-shaped portions, and side plates are provided on the U-shaped portions away from the center of the rotating frame. A clamping block is passed through the side plate and is movable along the length direction of the load-bearing plate. One end of the clamping block is arc-shaped, and the other end abuts against the top end of the material frame, and the inner side is flush with the inner wall of the end of the material frame.

[0007] Furthermore, a support rod is provided on the outside of the block, the support rod is inserted into the bracket, the bracket is installed on the side plate, a retaining ring is provided on the support rod, the retaining ring is located between the bracket and the side plate, a first spring is sleeved on the support rod, the two ends of the first spring respectively abut against the bracket and the retaining ring, and are always in a compressed state, and a first retaining ring is provided at the end of the support rod for abutting against the outside of the bracket.

[0008] Furthermore, a cross plate is provided on the side of the load-bearing plate away from the workbench, and a slide groove is provided on the cross plate along its length direction, and a connecting rod is passed through the slide groove, and a clamping plate is provided at one end of the connecting rod, and the bottom surface of the clamping plate is flush with the top surface of the material frame, and a connecting plate is provided at the other end of the connecting rod, and a cross bar is provided on the side of the connecting plate, and the cross bar is passed through the convex plate, and the convex plate is installed on the cross plate, and a second retaining ring is provided at the end of the cross bar, and a second spring is sleeved on the cross bar, and the two ends of the second spring respectively abut against the convex plate and the second retaining ring, and are always in a compressed state.

[0009] Furthermore, the transfer mechanism also includes two support plates located under the workbench, the upper ends of the support plates are located in the through grooves and are flush with the top surface of the workbench, the inner sides of the support plates are connected to the moving ends of the first horizontal linear mechanism, the first horizontal linear mechanism is installed under the workbench, and a push rod is provided on the outer side of the support plate, the push rod is located under the lifting plate, and when in use, the push rod abuts against the second retaining ring.

[0010] Furthermore, the support plate is provided with a limit groove arranged along the vertical direction and penetrating the upper end, the lifting plate is slidably fitted in the limit groove, the lifting plate is provided with a guide groove along its length direction, and a movable plate is slidably fitted in the guide groove, the movable plate is connected to the movable end of the first vertical lifting mechanism, the first vertical lifting mechanism is installed under the workbench, and a groove is provided on one side of the material frame. When in use, at least a part of the lifting plate is located in the groove.

[0011] Furthermore, the length of the movable frame is smaller than the distance between the outer sides of the rotating frame, and the top surface is connected to the movable end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame, the support frame is connected to the movable end of the second horizontal linear mechanism, and the second horizontal linear mechanism is installed above the workbench.

[0012] Furthermore, one side of the base plate is sleeved on the vertical rod, the vertical rod is installed at the bottom of the workbench, a third retaining ring is provided at the lower end of the vertical rod, a third spring is sleeved on the vertical rod, two ends of the third spring respectively abut against the third retaining ring and the base plate, and are always in a compressed state. When in use, the push plate abuts against the top of the spacer.

[0013] Furthermore, one of the baffles is provided with limit plates at both ends of the top, the limit plates are L-shaped, and the inner side of the short end is flush with the inner wall of the material frame in the length direction, and the inner side of the long end is flush with the inner side of the limit plate and the inner wall of the material frame in the width direction. The long end of the limit plate is installed on the rotating shaft, and the rotating shaft is rotatably installed on the baffle and connected to the output end of the power equipment. The power equipment is installed on the workbench.

[0014] Furthermore, a through hole is provided on the side of another baffle, and the through hole is aligned with the opening of one of the packaging boxes for passing the chip package.

[0015] The beneficial effects of the present invention are as follows: by transferring the material frame carrying the packaging box in a rotating manner, the packaging boxes can be transferred in batches, and in this process, the normal progress of the chip package packaging process is not affected, so that the chip package packaging operation can be carried out uninterruptedly, thereby improving production efficiency; the packaging box is limited by the limiting mechanism to ensure that the chip package can be smoothly pushed into the packaging box, thereby ensuring the smooth progress of the packaging operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0017] Figure 1 It is a three-dimensional schematic diagram of the overall structure of an embodiment of the present application.

[0018] Figure 2 It is a three-dimensional schematic diagram of the carrying mechanism of an embodiment of the present application.

[0019] Figure 3 for Figure 2 An enlarged schematic diagram of point A.

[0020] Figure 4 for Figure 2 An enlarged schematic diagram of point B.

[0021] Figure 5 It is a three-dimensional schematic diagram of the transfer mechanism of an embodiment of the present application.

[0022] Figure 6 It is a schematic diagram of the cooperation between the transfer mechanism and the supporting mechanism of an embodiment of the present application.

[0023] Figure 7 for Figure 6 Enlarged schematic diagram of point C.

[0024] Figure 8 It is a three-dimensional schematic diagram of the limiting mechanism of an embodiment of the present application.

[0025] Fig. 9 It is a three-dimensional schematic diagram from the bottom view of the limiting mechanism of an embodiment of the present application. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] like Figure 1 to Figure 8 As shown, an embodiment of the present application provides a chip package packaging device, including: a workbench 100, a carrying mechanism 200, a transfer mechanism 300, and a limiting mechanism 400.

[0028] The workbench 100 is used to place packaging boxes, and the packaging boxes are arranged at intervals along the width direction of the workbench 100, and the length direction of the packaging boxes is parallel to the length direction of the workbench 100. Both sides of the length direction of the workbench 100 are provided with through slots 101 with one end penetrating therethrough; the carrying mechanism 200 includes two rotating frames 201 respectively arranged on both sides of the length direction of the workbench 100 and rotating around its own central axis, and a plurality of carrying plates 202 arranged at intervals along the circumferential direction are provided on the circumferential side of the rotating frame 201, and a material frame 203 with an opening on the top is placed on the carrying plate 202, and a plurality of packaging boxes are arranged in the material frame 203 along its height direction, wherein the material frame 203 in one of the rotating frames 201 is used to carry empty packaging boxes, and the material frame 203 in the other rotating frame 201 is used to carry packaging boxes with chip packages; the transfer mechanism 300 includes a moving frame 301 and two lifting plates 303 respectively arranged on the upper and lower sides of the workbench 100, and The lifting plates 303 are respectively located in the projection areas of the through slots 101 in the vertical direction. The movable frame 301 and the lifting plates 303 are reciprocatingly arranged in the vertical direction and the width direction of the workbench 100. A plurality of push plates 302 arranged at intervals are arranged at the bottom of the movable frame 301 along its length direction, which are used to push the packaging box to move along the width direction of the workbench 100. When the packaging box needs to be lifted, at least a portion of the lifting plates 303 is located in the material frame 203; the limiting mechanism 400 includes two baffles 401 respectively arranged at both ends of the length direction of the workbench 100, which are used to limit the ends of the packaging box. A plurality of bottom plates 402 are arranged to move in the vertical direction and whose length direction is parallel to the width direction of the workbench 100 between the baffles 401. The bottom plate 402 is located below the workbench 100, and a plurality of spacer blocks 403 arranged at intervals are arranged on the top surface along its length direction. When used, the spacer blocks 403 pass through the workbench 100 to limit the two sides of the packaging box.

[0029] Specifically, both ends of the carrying plate 202 in the length direction are provided with U-shaped parts 204, the material frame 203 is located between the U-shaped parts 204, and a side plate 205 is provided on the U-shaped part 204 away from the center of the rotating frame 201, and a clamping block 206 is penetrated in the side plate 205 and is arranged to move along the length direction of the carrying plate 202. One end of the clamping block 206 is arc-shaped, and the other end abuts against the top of the material frame 203. When the material frame 203 is placed on the carrying plate 202, the clamping block 206 is directed away from the center of the carrying plate 202. , until the inner side of the card block 206 is flush with the inner side of the side plate 205. At this time, the material frame 203 can be placed on the carrying plate 202. Then, the card block 206 can be moved back to limit the open end of the material frame 203 to prevent it from falling during the rotation of the rotating frame 201. At this time, the inner side of the card block 206 is flush with the inner wall of the end of the material frame 203, so that when the packaging box is removed from the material frame 203, the end of the packaging box can be limited to prevent it from falling.

[0030] Specifically, a support rod 207 is provided on the outside of the block 206, and the support rod 207 is inserted in the bracket 208, and the bracket 208 is installed on the side plate 205. A retaining ring 209 is provided on the support rod 207, and the retaining ring 209 is located between the bracket 208 and the side plate 205. A first spring 210 is sleeved on the support rod 207, and the two ends of the first spring 210 respectively abut against the bracket 208 and the retaining ring 209, and are always in a compressed state. Therefore, under the action of the first spring 210, the block 206 always has a tendency to move toward the center of the carrier plate 202, ensuring the limitation of the material frame 203. When the block 203 needs to be moved, it only needs to apply external force to it, and a first retaining ring 211 is provided at the end of the support rod 207, which is used to abut against the outside of the bracket 208 to prevent the block 206 from falling off.

[0031] Specifically, in order to prevent the packaging box from falling during the rotation of the rotating frame 201, a transverse plate 212 is provided on the side of the carrying plate 202 away from the workbench 100, and the transverse plate 212 is provided with a slide groove 213 penetrating up and down along its length direction, and a connecting rod 214 is passed through the slide groove 213, and a clamping plate 215 is provided at one end of the connecting rod 214, and the bottom surface of the clamping plate 215 is flush with the top surface of the material frame 203, and a connecting plate 216 is provided at the other end of the connecting rod 214, and a transverse bar 217 is provided on the side of the connecting plate 216, and the transverse bar 217 is passed through the convex plate 218, and the convex plate 218 is installed on the transverse plate 212, and the end of the transverse bar 217 is provided with The second retaining ring 219 and the cross bar 217 are sleeved with a second spring 220, and the two ends of the second spring 220 are respectively abutted against the convex plate 218 and the second retaining ring 219, and are always in a compressed state. Under the action of the second spring 220, the card plate 215 always has a tendency to move toward the inner side of the load-bearing plate 202, so that at least a part of the card plate 215 is located in the area of ​​the load-bearing plate 202, thereby realizing the limiting of the packaging box in the material frame 203. When it is necessary to lift the packaging box in the material frame 203, it is only necessary to apply external force to the connecting rod 214 to move the card plate 215 out of the area of ​​the load-bearing plate 202.

[0032] Specifically, the transfer mechanism 300 also includes two support plates 304 located below the workbench 100, the upper ends of the support plates 304 are located in the through grooves 101 and are flush with the top surface of the workbench 100 to avoid blocking the smooth movement of the packaging box on the workbench 100, the inner sides of the support plates 304 are connected to the moving end of the first horizontal linear mechanism, the first horizontal linear mechanism is installed below the workbench 100, and the outer sides of the support plates 304 are provided with push rods 305, and the push rods 305 are located below the lifting plates 303. When it is necessary to lift the packaging box in the material frame 203, the support plates 304 are driven to move toward the carrying plate 201 through the first horizontal linear mechanism, so that the push rods 305 abut against the second retaining ring 219, and the cross bar 217 is forced to move, and the second spring 220 is further compressed. At this time, the card plate 215 can be moved out of the area of ​​the carrying plate 202, releasing the limit on the packaging box, and then the lifting plate 303 is moved upward to lift the packaging box.

[0033] More specifically, in order to ensure that the lifting plate 303 can smoothly lift the packaging box in the material frame 203, a groove 221 is provided on one side of the material frame 203. After the card plate 215 is moved out, at least a portion of the lifting plate 303 is located in the groove 221, so that the packaging box can be lifted.

[0034] Specifically, the support plate 304 is provided with a limiting groove 306 arranged in the vertical direction and penetrating the upper end, the lifting plate 303 is slidably fitted in the limiting groove 306, and the lifting plate 303 is provided with a guide groove 307 along its length direction, and a movable plate 308 is slidably fitted in the guide groove 307, and the movable plate 308 is connected to the movable end of the first vertical lifting mechanism, so as to ensure that the lifting plate 303 can move horizontally synchronously with the ejector rod 305 while the lifting plate 303 can move upward independently. The first vertical lifting mechanism is installed under the workbench 100. When the support plate 304 moves toward the carrier plate 202, the lifting plate 303 moves synchronously with the ejector rod 305. When the clamping plate 215 is moved out of the area of ​​the carrier plate 202, a part of the lifting plate 303 is located in the groove 221. At this time, through The first vertical lifting mechanism drives the movable plate 308 to move upward, and the packaging box in the material frame 203 is lifted. When the lifting plate 303 is at the top of its travel, it is located in the through slot 101, and the top surface is flush with the top surface of the workbench 100, so that the packaging box at the bottom can also be smoothly pushed onto the workbench 100, and then the lifting plate 303 is reset and the rotating frame 201 is rotated; when the packaging box carrying the chip package is transferred to the material frame 202, the lifting plate 303 is driven by the first vertical lifting mechanism to move downward intermittently. After the material frame 203 is loaded with a sufficient number of packaging boxes, the lifting plate 303 is retracted. At this time, the rotating frame 201 is driven to rotate, so that the packaging box can be transferred and the empty material frame 203 is located on one side of the workbench 100.

[0035] Specifically, the length of the mobile frame 301 is smaller than the distance between the outer sides of the rotating frames 201, so as to avoid interference when one of the rotating frames 201 rotates, and the top surface of the mobile frame 301 is connected to the moving end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame 309, the support frame 309 is connected to the moving end of the second horizontal linear mechanism, and the second horizontal linear mechanism is installed above the workbench 100. When the packaging box of the chip package is transferred to another material frame 203, the second vertical lifting mechanism drives the movable frame 301 to move downward, so that the push plate 302 located at the end of the movable frame 301 is located outside the material frame 203. At this time, the second horizontal linear mechanism drives the support frame 309 to move along the width direction of the workbench 100, so that the packaging box can be transferred from the material frame 203 to the workbench 100, and the chip package located on one side of the workbench 100 is also pushed to another material frame 203, and this cycle can be repeated.

[0036] Specifically, one side of the bottom plate 402 is sleeved on the vertical rod 404, and the vertical rod 404 is installed at the bottom of the workbench 100. A third retaining ring 405 is provided at the lower end of the vertical rod 404, and a third spring 406 is sleeved on the vertical rod 404. The two ends of the third spring 406 are respectively abutted against the third retaining ring 405 and the bottom plate 402, and are always in a compressed state. Under the action of the third spring 406, the bottom plate 402 always has a tendency to move upward, so that the bottom plate 401 abuts against the bottom surface of the workbench 100, and the spacer 403 passes through the top surface of the workbench 100. The packaging boxes on the workbench 100 are respectively located between two adjacent spacer blocks 403 to limit the two sides of the packaging box. When the packaging box needs to be moved, the push plate 302 moves downward, and the push plate 302 will abut against the top of the spacer block 403, forcing the spacer block 403 to move downward until the top surface of the spacer block 403 is flush with the top surface of the workbench 100, and the third spring 406 is further compressed to avoid affecting the smooth movement of the packaging box. After the push plate 302 moves upward, the spacer block 403 will move upward under the action of the third spring 406.

[0037] Specifically, in order to prevent the packaging box from sliding down due to the vibration of the equipment when it is located above the material frame 203, a limiting plate 407 is provided at both ends of the top of one of the baffles 401. The limiting plate 407 is L-shaped, and when the limiting plate 407 is in a horizontal state, its bottom surface is flush with the top surface of the workbench 100 and contacts with the open end surface of the material frame 203. The inner side of the short end of the limiting plate 407 is flush with the inner wall of the material frame 203 in the length direction, and the inner side of the long end is flush with the inner side of the limiting plate 407 and the inner wall of the material frame 203 in the width direction. 6 and the limit plate 407 realize the limitation of the two ends and the outside of the packaging box, and can ensure its smooth movement while fully packaging and limiting the packaging box, and the long end of the limit plate 407 is installed on the rotating shaft 408, and the rotating shaft 408 is rotatably installed on the baffle 401 and connected to the output end of the power equipment, and the power equipment is installed on the workbench 100. When the rotating frame 201 rotates, the rotating shaft 408 is driven to rotate by the power equipment, so that the limit plate 407 rotates upward until it is completely located in the area of ​​the workbench 100, so as to avoid affecting the smooth rotation of the rotating frame 401.

[0038] Specifically, a through hole 409 is provided on the side of the other baffle 401 , and the through hole 409 is aligned with the opening of one of the packaging boxes for passing the chip package.

[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip package packaging device, characterized in that: include: A workbench (100) is used to place packaging boxes, wherein the packaging boxes are arranged at intervals along the width direction of the workbench (100) when placed, and through slots (101) are provided at one end through both sides of the workbench (100) in the length direction; The bearing mechanism (200) comprises two rotating frames (201) respectively arranged on both sides of the workbench (100) in the length direction and rotating around their own central axis, the axis being parallel to the width direction of the workbench (100), a plurality of bearing plates (202) arranged at intervals along the circumferential direction are arranged on the circumference of the rotating frame (201), a material frame (203) with an opening at the top is placed on the bearing plate (202), and a plurality of packaging boxes are arranged in the material frame (203) along its height direction; The transfer mechanism (300) comprises a movable frame (301) respectively arranged on the upper and lower sides of the workbench (100) and two lifting plates (303) respectively located below the through slot (101); the movable frame (301) and the lifting plates (303) are arranged to reciprocate vertically and in the width direction of the workbench (100); a plurality of push plates (302) arranged at intervals are arranged at the bottom of the movable frame (301) along its length direction, and are used to push the packaging box to move along the width direction of the workbench (100); when in use, when the material frame (203) is in a horizontal state, at least a portion of the lifting plates (303) is located in the material frame (203) and is used to lift the packaging box; The limiting mechanism (400) comprises two baffles (401) respectively arranged at both ends of the workbench (100) in the length direction, and used for limiting the end of the packaging box; a plurality of bottom plates (402) are arranged to move in the vertical direction and the length direction is parallel to the width direction of the workbench (100) between the baffles (401); the bottom plate (402) is located below the workbench (100), and a plurality of spacers (403) are arranged at intervals on the top surface along the length direction; when in use, the spacers (403) pass through the workbench (100) and are used for limiting the two sides of the packaging box.

2. The chip package packaging device according to claim 1, characterized in that: Both ends of the carrying plate (202) in the length direction are provided with U-shaped parts (204), the material frame (203) is located between the U-shaped parts (204), and a side plate (205) is provided on the U-shaped part (204) away from the center of the rotating frame (201), and a clamping block (206) is penetrated through the side plate (205) and is movably arranged along the length direction of the carrying plate (202), one end of the clamping block (206) is arc-shaped, and the other end abuts against the top end of the material frame (203), and the inner side is flush with the inner wall of the end of the material frame (203).

3. The chip package packaging device according to claim 2, characterized in that: A support rod (207) is provided on the outside of the clamping block (206), the support rod (207) is inserted into a bracket (208), the bracket (208) is mounted on the side plate (205), a retaining ring (209) is provided on the support rod (207), the retaining ring (209) is located between the bracket (208) and the side plate (205), a first spring (210) is sleeved on the support rod (207), two ends of the first spring (210) respectively abut against the bracket (208) and the retaining ring (209), and are always in a compressed state, and a first retaining ring (211) is provided at the end of the support rod (207) for abutting against the outside of the bracket (208).

4. The chip package packaging device according to claim 1, characterized in that: A transverse plate (212) is provided on one side of the carrying plate (202) away from the workbench (100), and a slide groove (213) is provided on the transverse plate (212) along its length direction, and a connecting rod (214) is passed through the slide groove (213). A clamping plate (215) is provided at one end of the connecting rod (214), and the bottom surface of the clamping plate (215) is flush with the top surface of the material frame (203). A connecting plate (216) is provided at the other end of the connecting rod (214). A cross bar (217) is provided on the side of the connecting plate (216). The cross bar (217) is inserted into a convex plate (218). The convex plate (218) is mounted on the cross plate (212). A second retaining ring (219) is provided at the end of the cross bar (217). A second spring (220) is sleeved on the cross bar (217). Two ends of the second spring (220) respectively abut against the convex plate (218) and the second retaining ring (219), and are always in a compressed state.

5. The chip package packaging device according to claim 4, characterized in that: The transfer mechanism (300) further comprises two support plates (304) located below the workbench (100), the upper ends of the support plates (304) being located in the through grooves (101) and being flush with the top surface of the workbench (100), the inner sides of the support plates (304) being connected to the movable end of the first horizontal linear mechanism, the first horizontal linear mechanism being installed below the workbench (100), the outer sides of the support plates (304) being provided with a push rod (305), the push rod (305) being located below the lifting plate (303), and when in use, the push rod (305) abuts against the second retaining ring (219).

6. The chip package packaging device according to claim 5, characterized in that: The support plate (304) is provided with a limiting groove (306) arranged in the vertical direction and penetrating the upper end, the lifting plate (303) is slidably fitted in the limiting groove (306), the lifting plate (303) is provided with a guide groove (307) along its length direction, a movable plate (308) is slidably fitted in the guide groove (307), the movable plate (308) is connected to the movable end of the first vertical lifting mechanism, the first vertical lifting mechanism is installed below the workbench (100), a groove (221) is provided on one side of the material frame (203), and when in use, at least a portion of the lifting plate (303) is located in the groove (221).

7. The chip package packaging device according to claim 1, characterized in that: The length of the movable frame (301) is smaller than the distance between the outer sides of the rotating frame (201), and the top surface is connected to the movable end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame (309), the support frame (309) is connected to the movable end of the second horizontal linear mechanism, and the second horizontal linear mechanism is installed above the workbench (100).

8. The chip package packaging device according to claim 1, characterized in that: One side of the bottom plate (402) is sleeved on the vertical rod (404), and the vertical rod (404) is installed on the bottom of the workbench (100). A third retaining ring (405) is provided at the lower end of the vertical rod (404), and a third spring (406) is sleeved on the vertical rod (404). The two ends of the third spring (406) respectively abut against the third retaining ring (405) and the bottom plate (402), and are always in a compressed state. When in use, the push plate (302) abuts against the top of the spacer (403).

9. The chip package packaging device according to claim 1, characterized in that: One of the baffles (401) has limit plates (407) at both ends of its top, the limit plate (407) being L-shaped, with the inner side of the short end being flush with the inner wall of the material frame (203) in the length direction, and the inner side of the long end being flush with the inner side of the limit plate (407) and the inner wall of the material frame (203) in the width direction, the long end of the limit plate (407) being mounted on a rotating shaft (408), the rotating shaft (408) being rotatably mounted on the baffle (401) and connected to the output end of a power device, and the power device being mounted on the workbench (100).

10. The chip package packaging device according to claim 1, characterized in that: A through hole (409) is provided on the side of another baffle (401), and the through hole (409) is aligned with the opening of one of the packaging boxes and is used for passing the chip package.

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