Semiconductor industry sewage efficient treatment device and process thereof

Abstract

The invention discloses an efficient semiconductor industry sewage treatment device, and particularly relates to the technical field of semiconductor industry sewage treatment equipment.The efficient semiconductor industry sewage treatment device comprises a sedimentation tank, a sludge scraping mechanism is fixedly mounted in the sedimentation tank and comprises a second mounting frame, and a reciprocating lead screw is rotatably mounted between the second mounting frame and a tank body; and the second mounting block is in threaded connection with the outer wall of the reciprocating screw rod, and an adjusting mechanism is arranged on the outer wall of the second mounting block. According to the efficient sewage treatment device for the semiconductor industry, two movement tracks of the adjusting mechanism drive the scraper to be adjusted twice, so that the scraper is in contact with a first pressing contact switch, the angle of the scraper is adjusted to be parallel to the bottom of the tank body, the scraper is parallel to the water surface in the return process, and disturbance of the scraper to water flow is reduced; when the adjusting mechanism extrudes the second pressure touch switch from left to right, the scraper blade performs angle adjustment to be tightly attached to the bottom of the tank body, and then sludge is discharged from the tank body through the scraper blade and the rubber plate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor industry wastewater treatment equipment, and in particular to a semiconductor industry wastewater high-efficiency treatment device. Background Art

[0002] In the semiconductor industry, the field of wastewater treatment equipment technology focuses on treating and purifying complex wastewater generated from various stages of the manufacturing process, which often contains high concentrations of chemicals, heavy metals, and organic pollutants. In order to meet this challenge, the technology in this field continues to advance, covering the entire process from pretreatment to final discharge or reuse.

[0003] Sedimentation tanks play an important role in the semiconductor industry wastewater treatment process. Sedimentation tanks are a type of treatment structure that uses gravity sedimentation to remove suspended particles with a density greater than that of water from water. In the semiconductor wastewater treatment process, the primary sedimentation tank is usually located after the pretreatment stage and is used to remove suspended solids and some organic matter in the water. If these substances enter the subsequent treatment unit directly, they may cause shock loads to the biological treatment system or affect the treatment effect. Through sedimentation, larger particles of inorganic impurities and some organic matter that is easy to precipitate can be effectively separated, reducing the burden on subsequent treatment units.

[0004] In the prior art, a chain sludge discharger is usually used to discharge impurities deposited at the bottom of the sedimentation tank. Although this meets the use requirements to a certain extent, it is found in actual use that in order not to stir the water flow inside the sedimentation tank during the return process, the chain sludge discharger scraper is usually set above the water surface in the return section, resulting in the chain sludge discharger being too large and occupying too much position inside the sedimentation tank, which makes it impossible to set a large number of auxiliary sedimentation equipment such as inclined pipes inside the sedimentation tank, which makes the sedimentation tank unable to efficiently treat sewage. Moreover, the sedimentation tank usually only has a sedimentation effect and does not have the function of mixing flocculants. It relies on a longer residence time and a larger surface area to ensure sufficient sedimentation time, which makes it occupy a large area and the amount of water that can be treated per unit time is limited, resulting in low efficiency. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the sedimentation tank in the prior art usually only has the sedimentation function, does not have the function of mixing flocculants, and relies on a long residence time and a large surface area to ensure sufficient sedimentation time, which makes it occupy a large area, and the amount of water that can be treated per unit time is limited, and there is a problem of low efficiency. A semiconductor industrial wastewater efficient treatment device is proposed. The scraper in the device will automatically fold during the return process to reduce the impact on the water flow, and the displacement process always remains in a straight line. The small footprint provides a lot of space for adding other auxiliary sedimentation components, thereby achieving the purpose of efficient sedimentation.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor industrial wastewater efficient treatment device is designed, comprising a sedimentation tank, a liquid inlet mechanism is fixedly installed on one side of the sedimentation tank, an overflow mechanism is fixedly installed on the side of the sedimentation tank away from the liquid inlet mechanism, an auxiliary sedimentation mechanism is fixedly installed inside the sedimentation tank, a mud scraping mechanism is fixedly installed inside the sedimentation tank, the sedimentation tank comprises a tank body, a collecting trough is provided on the side of the tank body close to the liquid inlet mechanism, a plurality of mud discharge pipes are fixedly installed on the side of the tank body close to the liquid inlet mechanism, the mud scraping mechanism comprises a second mounting frame, the second mounting frame is fixedly installed on the top of the tank body, a second motor is fixedly installed on one side of the second mounting frame, a reciprocating screw is fixedly connected to one side of the output shaft of the second motor through a coupling, and the reciprocating screw is rotatably mounted on the second mounting frame and the tank body. A baffle is fixedly installed on the top of the second mounting frame, and the baffle is arranged on the top of the reciprocating screw rod, and a second mounting block is slidably installed on the bottom of the baffle, and the second mounting block is threadedly connected to the outer wall of the reciprocating screw rod, and a scraper is rotatably installed on the bottom of the second mounting block, and an adjustment mechanism is arranged on the outer wall of the second mounting block, and the adjustment mechanism includes a first protrusion and a second protrusion, the first protrusion is fixedly installed on the top of the second mounting block, and the second protrusion is fixedly installed on the top of the scraper, the first protrusion is slidably installed on one side of the baffle, and a telescopic component is rotatably installed on one side of the first protrusion, one end of the telescopic component is rotatably installed on one side of the second protrusion, a first pressure touch switch is arranged on one side of the baffle, and a second pressure touch switch is also arranged on the baffle.

[0008] Furthermore, a rubber plate is fixedly mounted on one side of the scraper.

[0009] Furthermore, the liquid inlet mechanism includes a first liquid inlet cavity, the cross-section of the first liquid inlet cavity is an isosceles trapezoid, a second liquid inlet cavity is fixedly installed on the upper bottom of the first liquid inlet cavity, a sewage inlet pipe is fixedly connected to one side of the second liquid inlet cavity, a flocculant inlet pipe is fixedly connected to the side of the second liquid inlet cavity away from the sewage inlet pipe, a first diverter plate is fixedly installed on the upper bottom of the first liquid inlet cavity, a second diverter plate is fixedly installed on the lower bottom of the first liquid inlet cavity, a number of spoilers are fixedly installed inside the first liquid inlet cavity, and a number of the spoilers are staggeredly installed inside the first liquid inlet cavity, and the cross-section of the spoilers is a herringbone.

[0010] Furthermore, a first baffle is slidably installed inside the pool body, the first baffle is arranged on one side of the second diverter plate, and the cross section of the first baffle is an obtuse-angled broken line shape.

[0011] Furthermore, a second baffle is slidably mounted inside the pool body, and the second baffle is arranged on a side of the first baffle away from the second diverter plate.

[0012] Furthermore, the overflow mechanism includes an overflow weir, a light transmittance sensor is fixedly installed on one side of the overflow weir, the overflow weir is slidably installed on the top of the pool body, a first mounting frame is fixedly installed inside the overflow weir, a first motor is fixedly installed on the top of the first mounting frame, the bottom of the output shaft of the first motor is fixedly connected with a screw through a coupling, the outer wall of the screw is threadedly connected with a first mounting block, the first mounting block is slidably installed inside the first mounting frame, a water baffle is fixedly installed on one side of the first mounting block, a plurality of comb teeth are fixedly installed on the top of the water baffle, the water baffle is slidably installed inside the overflow weir, and a drainage channel is fixedly installed on the side of the pool body away from the overflow weir.

[0013] Furthermore, a filter screen is slidably installed on the top of the pool body, and the filter screen is arranged between the overflow weir and the drainage channel.

[0014] Furthermore, the auxiliary sedimentation mechanism includes a plurality of inclined tube assemblies, mounting rods, mounting seats, and support columns. A plurality of the support columns are fixedly installed inside the sedimentation tank, a plurality of the mounting seats are fixedly installed on both sides of the inner wall of the tank body, a mounting sleeve is rotatably installed on the outer wall of the mounting rod, the mounting sleeve is movably installed on the top of the inclined tube assembly through bolts, the mounting rod is rotatably installed inside the inclined tube assembly through the mounting sleeve, a hook is fixedly installed on the bottom of the mounting rod, a second displacement groove is provided on the top of the mounting seat, a locking groove is provided inside the mounting seat, the hook passes through the second displacement groove and is rotatably installed inside the locking groove, and a first displacement groove is provided inside the inclined tube assembly.

[0015] Furthermore, the auxiliary sedimentation mechanism also includes a plurality of limit bars, which are fixedly installed on both sides of the inner wall of the pool body. Limit grooves are provided on both sides of the inclined tube assembly. The cross-sections of the limit grooves and the limit bars are the same. The inclined tube assembly is slidably installed inside the pool body through the limit grooves and the limit bars.

[0016] In order to solve the above technical problems, the present invention also proposes a process for efficient treatment of semiconductor industrial wastewater, which is used in the semiconductor industrial wastewater efficient treatment device, comprising the following steps:

[0017] Step 1: Mix the sewage and coagulant through the liquid inlet mechanism installed on one side of the sedimentation tank and reduce the flow rate of the mixed liquid;

[0018] Step 2: Accelerate the sludge sedimentation of the mixed sewage in the sedimentation tank through the auxiliary sedimentation mechanism;

[0019] Step 3: Push the sludge inside the sedimentation tank to the collection tank through the sludge scraping mechanism, and then discharge it through the sludge discharge pipe;

[0020] Step 4: Control the overflow height of the clear liquid through the overflow mechanism so that the sedimentation liquid inside the sedimentation tank can maintain the best sedimentation environment to maximize the ability to remove suspended solids.

[0021] Compared with the prior art, the beneficial effects of the present invention are: the device for efficiently treating wastewater in the semiconductor industry;

[0022] (1) The present invention enables the adjustment mechanism and the scraper to move back and forth at the bottom of the pool body through the coordination of the parts between the scraper mechanism. During this process, when the adjustment mechanism reaches the end of the stroke and contacts the first pressure touch switch, the scraper is adjusted to be parallel to the bottom of the pool body, so that the scraper is parallel to the water surface during the return process to reduce the disturbance of the scraper to the water flow. During the displacement process, it always remains in a straight line, and occupies a small area, providing a large amount of space for adding other auxiliary sedimentation components, thereby achieving the purpose of efficient sedimentation. When the adjustment mechanism squeezes the second pressure touch switch from left to right, the scraper is adjusted to be close to the bottom of the pool body, and then the sludge is discharged from the pool body through the scraper and the rubber plate. During this process, the scraper is always close to the bottom of the pool body through the rubber plate to ensure the sludge discharge efficiency;

[0023] (2) The present invention uses the second liquid inlet chamber to cause convection between the sewage and the flocculant inside, which is mixed evenly while slowing down the water flow. In this process, the first diverter plate and the second diverter plate are used to assist in enhancing the slow flow and mixing performance of the liquid inlet mechanism, thereby reducing the impact of the water flow on the water flow inside the tank body and preventing the water flow from being too large to raise dust at the bottom of the tank body. Then, the second baffle plate is used to limit the mixed liquid to only pass through the auxiliary sedimentation mechanism and flow to the scraper mechanism, thereby ensuring the sedimentation efficiency.

[0024] (3) The present invention detects the turbidity of the liquid on one side of the overflow weir through a light transmittance sensor, and then controls the operation of the first motor according to the turbidity. Through the cooperation between the first mounting frame, the screw rod, and the first mounting block, the height of the water baffle and the comb teeth can be controlled when the first motor is running, thereby achieving the purpose of controlling the overflow height through parameters such as turbidity. In this process, the overflow liquid is filtered through a filter screen to ensure the clarity of the liquid discharged through the overflow mechanism;

[0025] (4) The present invention supports the inclined tube assembly inside the tank body by means of a support column. By removing the installation sleeve from the top of the inclined tube assembly, the installation rod can be removed from the interior of the inclined tube assembly through the cooperation between the hook and the first displacement groove, so that the installation rod can be reused. In summary, the present device has the advantage of rapid maintenance of the inclined tube assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a cross-sectional view of the overall structure of the present invention;

[0029] Figure 3 It is a structural schematic diagram of the mud scraping mechanism of the present invention;

[0030] Figure 4 It is a structural schematic diagram of the regulating mechanism of the present invention;

[0031] Figure 5 It is a structural schematic diagram of the liquid inlet mechanism of the present invention;

[0032] Figure 6 It is a structural schematic diagram of the overflow mechanism of the present invention;

[0033] Figure 7 It is a partial structural cross-sectional view of the overflow mechanism of the present invention;

[0034] Figure 8 It is a structural schematic diagram of the auxiliary sedimentation mechanism of the present invention;

[0035] Fig. 9 It is a partial structural cross-sectional view of the auxiliary sedimentation mechanism of the present invention;

[0036] Fig.10 It is a partial structural cross-sectional view of the auxiliary sedimentation mechanism of the present invention;

[0037] Fig.11 The present invention is a process flow chart of a semiconductor industry wastewater efficient treatment device according to one embodiment.

[0038] In the figure: 1. sedimentation tank; 101. tank body; 102. collecting tank; 103. mud discharge pipe; 104. first baffle; 105. second baffle; 106. drainage channel; 2. liquid inlet mechanism; 201. first liquid inlet cavity; 202. second liquid inlet cavity; 203. sewage liquid inlet pipe; 204. flocculant liquid inlet pipe; 205. first diverter plate; 206. spoiler; 207. second diverter plate; 3. overflow mechanism; 301. overflow weir; 302. light transmittance sensor; 303. first mounting bracket; 304. first motor; 305. screw; 306. first mounting block; 307. water baffle; 308. comb teeth; 309. filter; 4. auxiliary sedimentation Mechanism; 401, oblique tube assembly; 402, mounting rod; 403, mounting seat; 404, support column; 405, mounting sleeve; 406, hook; 407, first displacement slot; 408, second displacement slot; 409, locking slot; 410, limit slot; 411, limit strip; 5, mud scraping mechanism; 501, second mounting frame; 502, second motor; 503, reciprocating screw rod; 504, second mounting block; 505, scraper; 506, adjustment mechanism; 5061, first protrusion; 5062, telescopic assembly; 5063, second protrusion; 5064, first pressure touch switch; 5065, second pressure touch switch; 507, rubber plate; 508, blocking cover. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The structural features of the present invention are now described in detail with reference to the accompanying drawings.

[0043] A semiconductor industrial wastewater efficient treatment device comprises a sludge scraping mechanism 5 and an adjusting mechanism 506. The sludge scraping mechanism 5 cooperates with the adjusting mechanism 506 to adjust the angle of a scraper 505 to be perpendicular to and flattened with a tank body 101, so that the scraper 505 cooperates with a rubber plate 507 to discharge the sludge from the tank body 101. During this process, the rubber plate 507 is used to keep the scraper 505 always close to the bottom of the tank body 101 to ensure the sludge discharge efficiency. Then, during the return process, the scraper 505 is adjusted to be parallel to the tank body 101 by the adjusting mechanism 506 and automatically folded to reduce the impact on the water flow. The displacement process is always kept in a straight line, and a small footprint provides a large amount of space for adding other auxiliary sedimentation components, thereby achieving the purpose of efficient sedimentation.

[0044] See also Figure 1-4The present invention provides a technical solution: a semiconductor industrial wastewater efficient treatment device, comprising a sedimentation tank 1, a liquid inlet mechanism 2 is fixedly installed on one side of the sedimentation tank 1, an overflow mechanism 3 is fixedly installed on the side of the sedimentation tank 1 away from the liquid inlet mechanism 2, an auxiliary sedimentation mechanism 4 is fixedly installed inside the sedimentation tank 1, a mud scraping mechanism 5 is fixedly installed inside the sedimentation tank 1, the sedimentation tank 1 comprises a tank body 101, a collecting trough 102 is provided on the side of the tank body 101 close to the liquid inlet mechanism 2, a plurality of mud discharge pipes 103 are fixedly installed on the side of the tank body 101 close to the liquid inlet mechanism 2, the mud scraping mechanism 5 comprises a second mounting frame 501, the second mounting frame 501 is fixedly installed on the top of the tank body 101, a second motor 502 is fixedly installed on one side of the second mounting frame 501, a reciprocating screw rod 503 is fixedly connected to one side of the output shaft of the second motor 502 through a coupling, the reciprocating screw rod 503 is rotatably installed between the second mounting frame 501 and the tank body 101, and a baffle 5 is fixedly installed on the top of the second mounting frame 501 08, a stopper 508 is arranged on the top of the reciprocating screw rod 503, a second mounting block 504 is slidably mounted on the bottom of the stopper 508, the second mounting block 504 is threadedly connected to the outer wall of the reciprocating screw rod 503, a scraper 505 is rotatably mounted on the bottom of the second mounting block 504, an adjustment mechanism 506 is arranged on the outer wall of the second mounting block 504, the adjustment mechanism 506 includes a first protrusion 5061 and a second protrusion 5063, the first protrusion 5061 is fixedly mounted on the top of the second mounting block 504 The second protrusion 5063 is fixedly mounted on the top of the scraper 505, the first protrusion 5061 is slidably mounted on one side of the blocking cover 508, a telescopic component 5062 is rotatably mounted on one side of the first protrusion 5061, one end of the telescopic component 5062 is rotatably mounted on one side of the second protrusion 5063, a first pressure touch switch 5064 is arranged on one side of the blocking cover 508, a second pressure touch switch 5065 is also arranged on the blocking cover 508, and a rubber plate 507 is fixedly mounted on one side of the scraper 505;

[0045] Through the cooperation among the second mounting frame 501, the second motor 502, the blocking cover 508, and the second mounting block 504, the second motor 502 drives the second mounting block 504 and the scraper 505 to move back and forth at the bottom of the pool body 101 when it is running. During this process, when the first protrusion 5061 reaches the end of the stroke and contacts the first pressure touch switch 5064, the first pressure touch switch 5064 will control the telescopic component 5062 to extend. Under the cooperation among the first protrusion 5061, the telescopic component 5062, and the second protrusion 5063, the scraper 505 is parallel to the bottom of the pool body 101, so that the scraper 505 is parallel to the water surface during the return process to reduce the disturbance of the scraper 505 to the water flow. When the first protrusion 5061 squeezes the second pressure touch switch 5065 from left to right, the second pressure touch switch 5065 controls the telescopic component 5062 to extend. Component 5062 contracts, and when the first protrusion 5061 squeezes the second pressure touch switch 5065 from right to left, the second pressure touch switch 5065 is not triggered, so that the scraper 505 is pressed against the bottom of the pool body 101 when the second mounting block 504 moves to the end of the stroke of the reciprocating screw rod 503, and then the sludge is pushed from the right side of the pool body 101 to the collecting tank 102 through the scraper 505 and the rubber plate 507. The sludge is collected by the collecting tank 102 and discharged through the sludge discharge pipe 103. In this process, the rubber plate 507 is used to keep the scraper 505 always pressed against the bottom of the pool body 101 to ensure the sludge discharge efficiency. In summary, the scraper 505 of the equipment will automatically fold during the return process to reduce the impact on the water flow, and the displacement process is always kept in a straight line, which occupies a small area and provides a lot of space for adding other auxiliary sedimentation components, thereby achieving the purpose of efficient sedimentation.

[0046] See also Figure 1-5 The present invention provides a technical solution: a semiconductor industrial wastewater efficient treatment device, wherein the liquid inlet mechanism 2 comprises a first liquid inlet chamber 201, the cross section of the first liquid inlet chamber 201 is an isosceles trapezoid, the upper bottom of the first liquid inlet chamber 201 is fixedly installed with a second liquid inlet chamber 202, one side of the second liquid inlet chamber 202 is fixedly connected with a sewage liquid inlet pipe 203, the side of the second liquid inlet chamber 202 away from the sewage liquid inlet pipe 203 is fixedly connected with a flocculant liquid inlet pipe 204, the upper bottom of the first liquid inlet chamber 201 is fixedly installed with a first diverter plate 205, the lower bottom of the first liquid inlet chamber 201 is fixedly installed with a first diverter plate 206, and the lower bottom of the first liquid inlet chamber 201 is fixedly installed with a second diverter plate 207. A second flow divider 207 is installed, a flow disruptor 206 is fixedly installed inside the first liquid inlet chamber 201, and the flow disruptor 206 is staggered inside the first liquid inlet chamber 201. The cross section of the flow disruptor 206 is a herringbone shape. A first baffle 104 is slidably installed inside the pool body 101, and the first baffle 104 is arranged on one side of the second flow divider 207. The cross section of the first baffle 104 is an obtuse-angled broken line type. A second baffle 105 is slidably installed inside the pool body 101, and the second baffle 105 is arranged on the side of the first baffle 104 away from the second flow divider 207;

[0047] The sewage and flocculant enter the second liquid inlet chamber 202 through the sewage inlet pipe 203 and the flocculant inlet pipe 204, and convection is generated in the second liquid inlet chamber 202, which slows down the water flow while mixing evenly. The mixed liquid flows into the first liquid inlet chamber 201 through the first diverter plate 205. Because the flow channel inside the first liquid inlet chamber 201 gradually becomes larger, and with the cooperation of the interference flow plate 206, the mixed liquid is further mixed evenly while the flow rate is further reduced. In this process, the first diverter plate 205 and the second diverter plate 207 are used to assist in enhancing the slow flow and mixing performance of the liquid inlet mechanism 2, and the mixed liquid is After being discharged through the second diverter plate 207, the combined liquid hits the first baffle 104 to change the flow direction, thereby reducing the impact of the water flow on the water flow inside the tank body 101 and preventing the water flow from being too large to lift up the dust at the bottom of the tank body 101. Then, the second baffle 105 limits the mixed liquid to only pass through the auxiliary sedimentation mechanism 4 to flow to the scraper mechanism 5 to ensure the sedimentation efficiency. In summary, the equipment has the ability to perform multi-stage buffering on the incoming water flow, reduce the impact of the water flow on the sedimentation process, and improve the sedimentation efficiency. At the same time, the flocculant is mixed through the water flow's own flow rate without the need for an additional power source, thereby improving the sedimentation efficiency while reducing energy consumption and maintenance costs.

[0048] See also Figure 1-7 The present invention provides a technical solution: a semiconductor industrial wastewater efficient treatment device, the overflow mechanism 3 includes an overflow weir 301, a light transmittance sensor 302 is fixedly installed on one side of the overflow weir 301, the overflow weir 301 is slidably installed on the top of the tank body 101, a first mounting frame 303 is fixedly installed inside the overflow weir 301, a first motor 304 is fixedly installed on the top of the first mounting frame 303, the bottom of the output shaft of the first motor 304 is fixedly connected to a screw 305 through a coupling, and the outer wall of the screw 305 is threaded A first mounting block 306 is connected, the first mounting block 306 is slidably mounted inside the first mounting frame 303, a water baffle 307 is fixedly mounted on one side of the first mounting block 306, a plurality of comb teeth 308 are fixedly mounted on the top of the water baffle 307, the water baffle 307 is slidably mounted inside the overflow weir 301, a drainage channel 106 is fixedly mounted on one side of the pool body 101 away from the overflow weir 301, a filter screen 309 is slidably mounted on the top of the pool body 101, and the filter screen 309 is arranged between the overflow weir 301 and the drainage channel 106;

[0049] The turbidity of the liquid on one side of the overflow weir 301 is detected by the light transmittance sensor 302, and then the operation of the first motor 304 is controlled according to the turbidity. Through the cooperation between the first mounting frame 303, the screw 305, and the first mounting block 306, the height of the water baffle 307 and the comb teeth 308 can be controlled when the first motor 304 is running, thereby achieving the purpose of controlling the overflow height by parameters such as turbidity. In this process, the overflow liquid is filtered by the filter screen 309 to ensure the clarity of the liquid discharged through the overflow mechanism 3. In summary, when the suspended matter concentration or water quality in the sewage changes, the device can change the effective water depth by changing the water baffle 307, thereby adapting to different water inlet conditions, and can maintain the best sedimentation environment to maximize the ability to remove suspended solids.

[0050] See also Figure 1-10 The present invention provides a technical solution: a semiconductor industrial wastewater efficient treatment device, the auxiliary sedimentation mechanism 4 includes a plurality of inclined tube components 401, a mounting rod 402, a mounting seat 403, and a support column 404, wherein the plurality of support columns 404 are fixedly mounted inside the sedimentation tank 1, and the plurality of mounting seats 403 are fixedly mounted on both sides of the inner wall of the tank body 101, and a mounting sleeve 405 is rotatably mounted on the outer wall of the mounting rod 402, and the mounting sleeve 405 is movably mounted on the top of the inclined tube component 401 by bolts, and the mounting rod 402 is rotatably mounted inside the inclined tube component 401 by the mounting sleeve 405, and a hook 406 is fixedly mounted on the bottom of the mounting rod 402, A second displacement groove 408 is provided on the top of the mounting seat 403, a locking groove 409 is provided inside the mounting seat 403, a first displacement groove 407 is provided inside the inclined tube assembly 401, a hook 406 penetrates the second displacement groove 408 and is rotatably installed inside the locking groove 409, the auxiliary sedimentation mechanism 4 also includes a plurality of limit bars 411, and the plurality of limit bars 411 are fixedly installed on both sides of the inner wall of the tank body 101, and limit grooves 410 are provided on both sides of the inclined tube assembly 401, and the cross sections of the limit grooves 410 and the limit bars 411 are the same, and the inclined tube assembly 401 is slidably installed inside the tank body 101 through the limit grooves 410 and the limit bars 411;

[0051] The inclined tube assembly 401 is supported inside the pool body 101 by the support column 404, the hook 406 is inserted into the locking groove 409 through the second displacement groove 408, and then the installation rod 402 is rotated to fix the inclined tube assembly 401 on the top of the mounting seat 403 in a misaligned manner with the hook 406 and the second displacement groove 408. When the inclined tube assembly 401 needs to be maintained, it is only necessary to rotate the installation rod 402 to align the hook 406 with the second displacement groove 408, and the hook 406 can be pulled out from the inside of the mounting seat 403, and finally the inclined tube assembly 401 can be taken out from the inside of the pool body 101 by pulling the installation rod 402, and at the same time, by taking the installation sleeve 405 out of the top of the inclined tube assembly 401, the installation rod 402 can be taken out from the inside of the inclined tube assembly 401 by the cooperation between the hook 406 and the first displacement groove 407, so that the installation rod 402 can be reused. In summary, the device has the advantage of quick maintenance of the inclined tube assembly 401.

[0052] Example 1

[0053] See also Figure 1-10 First, the sewage and flocculant are introduced into the second liquid inlet chamber 202 through the sewage liquid inlet pipe 203 and the flocculant liquid inlet pipe 204, and convection is generated in the second liquid inlet chamber 202 to mix evenly while slowing down the water flow. The sewage water flow is buffered at multiple levels to reduce the influence of the water flow on the sedimentation process. Then, the sewage starts to rise from the sedimentation tank 1 in sequence through the auxiliary sedimentation mechanism 4. Since the scraping mechanism 5 is arranged at the bottom of the sedimentation tank 1, when there is a lot of silt at the bottom of the sedimentation tank 1, the second motor 502 is turned on to drive the scraper 505 to move back and forth at the bottom of the tank body 101. When the scraper 505 drives the adjustment mechanism 506 to adjust from left to right, the scraper 505 rotates and moves with the adjustment mechanism 506. The bottom of the sedimentation tank 1 is tightly attached, and then the scraper 505 and the rubber plate 507 are used to push the sludge from the right side of the tank body 101 to the collecting tank 102. The sludge is collected by the collecting tank 102 and discharged through the sludge discharge pipe 103. Finally, the scraper 505 is adjusted in angle by the adjustment mechanism 506 in the return process so that the scraper 505 is level with the tank body 101, reducing the impact of the scraper 505 on the water flow when it is reset. Then, the overflow mechanism 3 is used to change the effective water depth by changing the water retaining plate 307 according to parameters such as sewage turbidity, thereby adapting to different water inlet conditions, maintaining the best sedimentation environment, maximizing the ability to remove suspended solids, and completing the discharge of precipitated sewage.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor industrial wastewater efficient treatment device, comprising a sedimentation tank (1), a liquid inlet mechanism (2) fixedly installed on one side of the sedimentation tank (1), an overflow mechanism (3) fixedly installed on the side of the sedimentation tank (1) away from the liquid inlet mechanism (2), an auxiliary sedimentation mechanism (4) fixedly installed inside the sedimentation tank (1), and a mud scraping mechanism (5) fixedly installed inside the sedimentation tank (1), characterized in that: The sedimentation tank (1) comprises a tank body (101), a collecting tank (102) is provided on a side of the tank body (101) close to the liquid inlet mechanism (2), and a plurality of mud discharge pipes (103) are fixedly installed on a side of the tank body (101) close to the liquid inlet mechanism (2); The mud scraping mechanism (5) comprises a second mounting frame (501), the second mounting frame (501) is fixedly mounted on the top of the tank body (101), a second motor (502) is fixedly mounted on one side of the second mounting frame (501), a reciprocating screw (503) is fixedly connected to one side of the output shaft of the second motor (502) via a coupling, the reciprocating screw (503) is rotatably mounted between the second mounting frame (501) and the tank body (101), a blocking cover (508) is fixedly mounted on the top of the second mounting frame (501), the blocking cover (508) is arranged on the top of the reciprocating screw (503), a second mounting block (504) is slidably mounted on the bottom of the blocking cover (508), the second mounting block (504) is threadedly connected to the outer wall of the reciprocating screw (503), a scraper (505) is rotatably mounted on the bottom of the second mounting block (504), and an adjustment mechanism (506) is arranged on the outer wall of the second mounting block (504); The adjustment mechanism (506) comprises a first protrusion (5061) and a second protrusion (5063), wherein the first protrusion (5061) is fixedly mounted on the top of the second mounting block (504), and the second protrusion (5063) is fixedly mounted on the top of the scraper (505), the first protrusion (5061) is slidably mounted on one side of the blocking cover (508), a telescopic component (5062) is rotatably mounted on one side of the first protrusion (5061), and one end of the telescopic component (5062) is rotatably mounted on one side of the second protrusion (5063), a first pressure touch switch (5064) is arranged on one side of the blocking cover (508), and a second pressure touch switch (5065) is also arranged on the blocking cover (508).

2. A semiconductor industrial wastewater efficient treatment device according to claim 1, characterized in that: A rubber plate (507) is fixedly mounted on one side of the scraper (505).

3. The semiconductor industry wastewater efficient treatment device according to claim 1, characterized in that: The liquid inlet mechanism (2) comprises a first liquid inlet cavity (201), the cross section of the first liquid inlet cavity (201) is an isosceles trapezoid, a second liquid inlet cavity (202) is fixedly mounted on the upper bottom of the first liquid inlet cavity (201), a sewage liquid inlet pipe (203) is fixedly connected to one side of the second liquid inlet cavity (202), a flocculant liquid inlet pipe (204) is fixedly connected to the side of the second liquid inlet cavity (202) away from the sewage liquid inlet pipe (203), a first flow divider plate (205) is fixedly mounted on the upper bottom of the first liquid inlet cavity (201), a second flow divider plate (207) is fixedly mounted on the lower bottom of the first liquid inlet cavity (201), a plurality of flow spoilers (206) are fixedly mounted inside the first liquid inlet cavity (201), a plurality of the flow spoilers (206) are staggeredly mounted inside the first liquid inlet cavity (201), and the cross section of the flow spoilers (206) is a herringbone shape.

4. A semiconductor industrial wastewater efficient treatment device according to claim 3, characterized in that: A first baffle (104) is slidably mounted inside the pool body (101); the first baffle (104) is arranged on one side of the second diverter plate (207); and the cross section of the first baffle (104) is an obtuse-angled broken line shape.

5. The semiconductor industry wastewater efficient treatment device according to claim 3 is characterized in that: A second baffle (105) is slidably mounted inside the pool body (101), and the second baffle (105) is arranged on a side of the first baffle (104) away from the second diverter plate (207).

6. The semiconductor industry wastewater efficient treatment device according to claim 1 is characterized in that: The overflow mechanism (3) comprises an overflow weir (301), a light transmittance sensor (302) is fixedly mounted on one side of the overflow weir (301), the overflow weir (301) is slidably mounted on the top of the pool body (101), a first mounting frame (303) is fixedly mounted inside the overflow weir (301), a first motor (304) is fixedly mounted on the top of the first mounting frame (303), a screw (305) is fixedly connected to the bottom of the output shaft of the first motor (304) via a coupling, and the screw The outer wall of (305) is threadedly connected with a first mounting block (306), the first mounting block (306) is slidably mounted inside the first mounting frame (303), a water baffle (307) is fixedly mounted on one side of the first mounting block (306), a plurality of comb teeth (308) are fixedly mounted on the top of the water baffle (307), the water baffle (307) is slidably mounted inside the overflow weir (301), and a drainage channel (106) is fixedly mounted on the side of the pool body (101) away from the overflow weir (301).

7. A semiconductor industrial wastewater efficient treatment device according to claim 6, characterized in that: A filter screen (309) is slidably mounted on the top of the pool body (101), and the filter screen (309) is arranged between the overflow weir (301) and the drainage channel (106).

8. The semiconductor industry wastewater efficient treatment device according to claim 1 is characterized in that: The auxiliary sedimentation mechanism (4) comprises a plurality of inclined tube assemblies (401), a mounting rod (402), a mounting seat (403), and a support column (404), wherein a plurality of the support columns (404) are fixedly mounted inside the sedimentation tank (1), a plurality of the mounting seats (403) are fixedly mounted on both sides of the inner wall of the tank body (101), a mounting sleeve (405) is rotatably mounted on the outer wall of the mounting rod (402), and the mounting sleeve (405) is movably mounted on the top of the inclined tube assembly (401) by means of bolts, and the mounting rod (402) is fixedly mounted on the inner wall of the sedimentation tank (101). 02) is rotatably mounted inside the oblique tube assembly (401) through an installation sleeve (405); a hook (406) is fixedly mounted on the bottom of the installation rod (402); a second displacement groove (408) is provided on the top of the installation seat (403); a locking groove (409) is provided inside the installation seat (403); the hook (406) passes through the second displacement groove (408) and is rotatably mounted inside the locking groove (409); and a first displacement groove (407) is provided inside the oblique tube assembly (401).

9. The semiconductor industry wastewater efficient treatment device according to claim 8, characterized in that: The auxiliary sedimentation mechanism (4) further comprises a plurality of limit bars (411), wherein the plurality of limit bars (411) are fixedly mounted on both sides of the inner wall of the tank body (101), and limit grooves (410) are provided on both sides of the inclined tube assembly (401), wherein the limit grooves (410) and the limit bars (411) have the same cross-section, and the inclined tube assembly (401) is slidably mounted inside the tank body (101) via the limit grooves (410) and the limit bars (411).

10. A process for efficiently treating semiconductor industrial wastewater, used in a semiconductor industrial wastewater efficient treatment device as claimed in any one of claims 1 to 9, characterized in that: The steps include: Step 1: Mixing sewage and coagulant and reducing the flow rate of the mixed liquid through a liquid inlet mechanism (2) installed on one side of the sedimentation tank (1); Step 2: accelerating sludge sedimentation of the mixed sewage in the sedimentation tank (1) through the auxiliary sedimentation mechanism (4); Step 3: The sludge in the sedimentation tank (1) is pushed to the collection tank (102) by the sludge scraping mechanism (5), and then discharged from the sludge discharge pipe (103); Step 4: The overflow height of the clear liquid is controlled by the overflow mechanism (3) so that the sedimentation liquid inside the sedimentation tank (1) can maintain an optimal sedimentation environment to maximize the ability to remove suspended solids.

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