Conductive adhesive, preparation method, LED lamp bead packaging process and LED lamp bead

Abstract

The present invention discloses a conductive adhesive, a preparation method, a packaging process of an LED lamp bead and an LED lamp bead. The conductive adhesive includes a bonding conductive adhesive, wherein the raw material components of the bonding conductive adhesive include at least a first raw material and a conductive powder having a density greater than the first raw material, wherein the first raw material is one of epoxy resin, silicone resin, polyurethane and acrylic resin; the conductive adhesive also includes white particles mixed in the bonding conductive adhesive, wherein when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder; when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material. The surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white, and when the surface light irradiated to the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

Description

Technical Field

[0001] The present invention relates to the technical field of conductive adhesives, and in particular to a conductive adhesive, a preparation method, a packaging process for LED lamp beads, and LED lamp beads. Background Art

[0002] When LED (Light Emitting Diode) lamp beads are packaged, the LED chip is connected to the pad by bonding the LED chip to the pad, and the LED chip is fixedly mounted on the pad after baking and curing.

[0003] At present, the conductive adhesive after baking and curing is gray-brown. Therefore, the surface of the solder in the LED lamp beads encapsulated with the existing conductive adhesive is gray-brown. When the light irradiated to the solder surface on the pad after the LED chip is lit is reflected, the reflection efficiency is low, which reduces the brightness of the LED lamp beads.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a conductive adhesive, a preparation method, a packaging process for LED lamp beads and LED lamp beads, so as to solve the problem that the surface of the solder on the pad in the LED lamp beads packaged in the prior art is gray-brown, and when the gray-brown color reflects the surface light of the solder on the pad after the LED chip is lit, the reflection efficiency is low, thereby reducing the brightness of the LED lamp beads.

[0006] The technical solution adopted by the present invention to solve the technical problem is: a conductive adhesive is used for packaging LED lamp beads, the conductive adhesive includes bonding conductive adhesive, the raw material components of the bonding conductive adhesive include at least a first raw material and a conductive powder with a density greater than the first raw material, the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin;

[0007] The conductive adhesive further includes white particles mixed in the bonding conductive adhesive;

[0008] Wherein, when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder;

[0009] When the first raw material is opaque, the true density of the white particles is lower than the density of the first raw material.

[0010] According to a further configuration of the present invention, the weight of the white particles is 2-5% of the weight of the conductive powder in the conductive adhesive.

[0011] According to a further configuration of the present invention, the viscosity of the conductive adhesive is 6000-8700 mPa·s.

[0012] In a further configuration of the present invention, the white particles are white hollow glass microspheres or white resin microspheres.

[0013] The present invention also provides a method for preparing the conductive adhesive as described above, wherein the conductive adhesive includes a bonding conductive adhesive, wherein the raw material components of the bonding conductive adhesive include at least a first raw material and a conductive powder, wherein the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin, and the preparation method includes:

[0014] Adding white particles to the bonding conductive adhesive, wherein when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder, and when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material;

[0015] The bonding conductive adhesive to which the white particles are added is stirred alternately in a clockwise direction and a counterclockwise direction.

[0016] According to a further configuration of the present invention, the bonding conductive adhesive to which the white particles are added is stirred for 5-8 minutes.

[0017] The present invention also provides a packaging process for LED lamp beads using the conductive adhesive as described above, the packaging process comprising:

[0018] Providing a substrate provided with a solder pad;

[0019] Applying conductive glue on the pads of the substrate;

[0020] Placing the LED chip on the conductive glue on the pad of the substrate;

[0021] Baking the substrate with the LED chip within a first temperature range for a first time;

[0022] The substrate baked in the first temperature range is baked in the second temperature range for a second time.

[0023] According to a further configuration of the present invention, the first temperature ranges from 60 to 80° C., and the first time ranges from 10 to 30 minutes.

[0024] According to a further configuration of the present invention, the second temperature range is 150-185° C., and the second time range is 1.5-2.5 hours.

[0025] The present invention also provides an LED lamp bead, which is manufactured by the LED lamp bead packaging process described above.

[0026] The beneficial effects of the present invention are:

[0027] The present invention discloses a conductive adhesive, a preparation method, a packaging process for LED lamp beads and LED lamp beads. The conductive adhesive comprises an adhesive conductive adhesive, wherein the raw material components of the adhesive conductive adhesive at least comprise a first raw material and a conductive powder, wherein the first raw material is one of epoxy resin, silicone resin, polyurethane and acrylic resin; the conductive adhesive further comprises white particles mixed in the adhesive conductive adhesive, wherein when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder; when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material and the density of the conductive powder. In the technical solution of the present invention, when the first raw material is transparent, since the true density of the white particles is at least less than the density of the conductive powder, the white layer formed by the white particles after the conductive adhesive is baked and solidified is located between the conductive powder and the first raw material, or the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. When the first raw material is opaque, since the true density of the white particles is less than the density of the first raw material, the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. It can be seen that when the light irradiated to the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary personnel in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0029] Figure 1 The present invention is a flow chart of the method for preparing the conductive adhesive.

[0030] Figure 2 It is a flow chart of the packaging process of the LED lamp bead of the present invention. DETAILED DESCRIPTION

[0031] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the device or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0032] The present invention provides a conductive adhesive for packaging LED lamp beads. The conductive adhesive may include bonding conductive adhesive and white particles mixed in the bonding conductive adhesive; wherein the raw material components of the bonding conductive adhesive include at least a first raw material and a conductive powder having a density greater than that of the first raw material; the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin; wherein, when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder; when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material and the density of the conductive powder.

[0033] Specifically, when preparing the conductive adhesive, an adhesive conductive adhesive can be provided, wherein the adhesive conductive adhesive contains epoxy resin and conductive powder with a density greater than that of the epoxy resin; thereafter, white particles with a true density less than that of the epoxy resin are added to the adhesive conductive adhesive, and the adhesive conductive adhesive is stirred, wherein the stirring is carried out in a clockwise and counterclockwise alternating manner, and the stirring time is 5-8 minutes, which is specifically determined according to the stirring conditions (stirring until the white particles and the adhesive conductive adhesive are fully mixed).

[0034] Of course, when the epoxy resin is transparent, white particles having a density less than that of the conductive powder but greater than that of the epoxy resin may also be added to the conductive adhesive.

[0035] Furthermore, the epoxy resin can also be a silicone resin, a polyurethane, or an acrylic resin. When the epoxy resin is a silicone resin, a polyurethane, or an acrylic resin, the preparation process of the conductive adhesive is the same as the process of preparing the conductive adhesive using the bonding conductive adhesive containing the epoxy resin and the conductive powder, and will not be repeated here.

[0036] The bonding conductive adhesive containing epoxy resin and conductive powder can be the bonding conductive adhesive disclosed in the application document CN104332214A. Of course, it can also be a bonding conductive adhesive whose other components contain epoxy resin and conductive powder or a bonding conductive adhesive whose components contain one of silicone resin, polyurethane, acrylic resin and conductive powder.

[0037] The conductive powder may be silver powder, tin powder or the like which is applied to the conductive adhesive and meets the above requirements, and no further limitation is given here.

[0038] In this embodiment, when the first raw material is transparent, since the true density of the white particles is at least less than the density of the conductive powder, the white layer formed by the white particles after the conductive glue is baked and solidified is located between the conductive powder and the first raw material (the true density of the white particles is less than the density of the conductive powder, but greater than the density of the first raw material), or the white layer formed by the white particles is located above the first raw material (the true density of the white particles is less than the density of the first raw material), and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive glue is white. When the first raw material is opaque, since the true density of the white particles is less than the density of the first raw material, the white layer formed by the white particles is located above the first raw material, and the surface of the solder (conductive glue) on the pad in the LED lamp bead encapsulated with the conductive glue is white. It can be seen that when the light irradiated to the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

[0039] In some embodiments, the weight of the white particles is 2% to 5% of the weight of the conductive powder in the conductive adhesive.

[0040] When adding white particles, if the weight of added is too little, the coverage area of ​​the white layer formed by the white particles after baking and curing will be small, and the surface of the solder of the pad cannot be completely white. If the weight of added is too much, the thickness of the white layer formed by the white particles after baking and curing will be too thick, affecting the electrical and thermal conductivity. Therefore, when adding white particles, the weight of the conductive powder in the adhesive conductive adhesive is used as a reference to avoid the problem that the coverage area of ​​the white layer formed by the white particles above the adhesive conductive adhesive after baking and curing is small, or the thickness of the white layer formed by the white particles after baking and curing is too thick.

[0041] Specifically, when adding white particles to the adhesive conductive adhesive, the weight of the white particles can be 3% of the weight of the conductive powder in the adhesive conductive adhesive; of course, it can also be 4%, 2%, 2.5%, 5%, etc., of the weight of the conductive powder in the adhesive conductive adhesive, which is determined according to actual conditions, that is, to ensure that the thickness of the white layer formed by the white particles after baking and curing does not affect the conductive and thermal conductive properties of the LED lamp beads, and that the white layer formed by the white particles can cover the surface of the solder of the pad.

[0042] In some embodiments, the viscosity of the conductive adhesive is 6000-8700 mPa·s. When the conductive adhesive is selected, the viscosity of the conductive adhesive can be 6000 mPa·s, 6500 mPa·s, 7000 mPa·s, 7350 mPa·s, 7550 mPa·s, 8000 mPa·s, 8700 mPa·s, etc.

[0043] In this embodiment, when selecting the adhesive conductive adhesive, the viscosity of the adhesive conductive adhesive is related to the thickness and whiteness of the white layer formed by the white particles after curing, that is, the thickness of the white layer formed by the white particles does not affect the electrical and thermal conductivity of the LED lamp beads, and the white layer formed by the white particles can cover the surface of the solder of the pad. Technical personnel in this field can determine the viscosity of the adhesive conductive adhesive according to actual needs.

[0044] In some embodiments, the white particles are white hollow glass microspheres or white resin microspheres.

[0045] In this embodiment, when determining the white particles, it is necessary to determine them based on the first raw material. When the first raw material is transparent, the white particles can be white hollow glass microspheres or white resin microspheres, that is, the white layer formed by the white particles can cover the surface of the solder of the pad regardless of whether it is above the first raw material or between the first raw material and the conductive powder; when the first raw material is opaque, the white particles can be white resin microspheres or white hollow glass microspheres, but when the white particles are white resin microspheres, the density of the first raw material must be greater than the density of the white resin microspheres.

[0046] In one specific embodiment, the white particles are white hollow glass microspheres.

[0047] In some embodiments, Figure 1 As shown, the present invention also provides a method for preparing the conductive adhesive as described above, the conductive adhesive includes a bonding conductive adhesive, the raw material components of the bonding conductive adhesive include at least a first raw material and a conductive powder with a density greater than that of the first raw material, the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin, and the preparation method includes the steps of:

[0048] S1. Adding white particles to the bonding conductive adhesive, wherein when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder, and when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material;

[0049] S2. Stir the conductive adhesive with white particles alternately in clockwise and counterclockwise directions.

[0050] Specifically, when preparing the conductive adhesive, an adhesive conductive adhesive can be provided, wherein the adhesive conductive adhesive contains epoxy resin and conductive powder with a density greater than that of the epoxy resin; thereafter, white particles with a true density less than that of the epoxy resin are added to the adhesive conductive adhesive, and the adhesive conductive adhesive is stirred, wherein the stirring is carried out in a clockwise and counterclockwise alternating manner, and the stirring time is 5-8 minutes, which is specifically determined according to the stirring conditions (stirring until the white particles and the adhesive conductive adhesive are fully mixed).

[0051] Of course, when the epoxy resin is transparent, white particles having a density less than that of the conductive powder but greater than that of the epoxy resin may be added to the conductive adhesive.

[0052] Furthermore, the epoxy resin can also be a silicone resin, a polyurethane, or an acrylic resin. When the epoxy resin is a silicone resin, a polyurethane, or an acrylic resin, the preparation process of the conductive adhesive is the same as the process of preparing the conductive adhesive using the bonding conductive adhesive containing the epoxy resin and the conductive powder, and will not be repeated here.

[0053] In this embodiment, when the first raw material is transparent, since the true density of the white particles is at least lower than the density of the conductive powder, the white layer formed by the white particles after the conductive adhesive is baked and solidified is located between the conductive powder and the first raw material, or the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. When the first raw material is opaque, since the true density of the white particles is lower than the density of the first raw material, the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. It can be seen that when the light irradiated to the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

[0054] In some embodiments, Figure 2 As shown, the present invention also provides a packaging process for LED lamp beads using the conductive adhesive as described above, and the packaging process includes the steps of:

[0055] S100, providing a substrate provided with a pad;

[0056] S200, apply conductive glue on the pad of the substrate;

[0057] S300, placing the LED chip on the conductive glue on the pad of the substrate;

[0058] S400, baking the substrate on which the LED chip is placed within a first temperature range for a first time;

[0059] S500, baking the substrate baked in the first temperature range for a second time in the second temperature range.

[0060] Specifically, when packaging LED lamp beads, the prepared conductive glue is added to the glue dispensing equipment, and the glue is dispensed on the pad of the substrate through the glue dispensing equipment. After dispensing, the LED chip is placed on the conductive glue on the pad. When placing it specifically, it is necessary to ensure that the pins of the LED chip correspond to the pads (that is, the positive electrode of the LED chip corresponds to the pad for supplying positive electricity, and the negative electrode of the LED chip corresponds to the pad for supplying negative electricity); further, the substrate with the LED chip is placed on the baking equipment, and the baking temperature of the baking equipment is adjusted to the first temperature range for baking, and the baking time is the first time; finally, the baking temperature of the baking equipment is adjusted to the second temperature range for secondary baking, and the baking time of the secondary baking is the second time.

[0061] In this embodiment, during the first baking (baking for the first time within the first temperature range), the purpose is to reduce the viscosity of the bonding conductive adhesive in the conductive adhesive so that the white particles mixed in the bonding conductive adhesive can float above the first raw material of the bonding conductive adhesive or between the first raw material and the conductive powder (when the density of the white particles is less than the density of the conductive powder but greater than the density of the first raw material, the white particles float between the conductive powder and the first raw material; when the density of the white particles is less than the density of the first raw material, the white particles float above the first raw material); then the second baking is performed, and the purpose of the second baking is baking and curing. When the white particles float between the first raw material and the conductive powder (when the first raw material is transparent), the white layer formed by the solidified white particles is located between the first raw material and the conductive powder. Since the first raw material is transparent, the surface of the solder on the pad is white at this time. When the white particles float on the first raw material, the white layer formed by the solidified white particles is located above the first raw material. At this time, the surface of the solder on the pad is still white. The white particles can be white hollow glass microspheres or white resin microspheres.

[0062] It can be seen that the surface of the solder on the pad in the LED lamp bead packaged using the LED lamp bead packaging process is white. When the light irradiated to the surface of the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

[0063] In some embodiments, the first temperature ranges from 60° C. to 80° C., and the first time ranges from 10 to 30 minutes.

[0064] Specifically, during the first baking, the baking temperature may be, but is not limited to, 60° C., 63° C., 70° C., 75° C., 80° C., etc., preferably 70° C. The baking time may be, but is not limited to, 10 minutes, 13 minutes, 15 minutes, 20 minutes, 25 minutes, 30 minutes, etc., preferably 20 minutes.

[0065] In some embodiments, the second temperature range is 150-185° C., and the second time range is 1.5-2.5 hours.

[0066] Specifically, during the second baking, the baking temperature may be, but is not limited to, 150° C., 165° C., 168° C., 170° C., 175° C., 180° C., 185° C., etc., preferably 175° C. The baking time may be, but is not limited to, 1.5 hours, 1.8 hours, 2 hours, 2.3 hours, 2.5 hours, etc., preferably two hours.

[0067] In some embodiments, the present invention further provides an LED lamp bead, which is made by the above-mentioned LED lamp bead packaging process; Figure 2 As shown, the packaging process includes the steps of:

[0068] S100, providing a substrate provided with a pad;

[0069] S200, apply conductive glue on the pad of the substrate;

[0070] S300, placing the LED chip on the conductive glue on the pad of the substrate;

[0071] S400, baking the substrate on which the LED chip is placed within a first temperature range for a first time;

[0072] S500, baking the substrate baked in the first temperature range for a second time in the second temperature range.

[0073] Specifically, when packaging LED lamp beads, the prepared conductive glue is added to the glue dispensing equipment, and the glue is dispensed on the pad of the substrate through the glue dispensing equipment. After dispensing, the LED chip is placed on the conductive glue on the pad. When placing it specifically, it is necessary to ensure that the pins of the LED chip correspond to the pads (that is, the positive electrode of the LED chip corresponds to the pad for supplying positive electricity, and the negative electrode of the LED chip corresponds to the pad for supplying negative electricity); further, the substrate with the LED chip is placed on the baking equipment, and the baking temperature of the baking equipment is adjusted to the first temperature range for baking, and the baking time is the first time; finally, the baking temperature of the baking equipment is adjusted to the second temperature range for secondary baking, and the baking time of the secondary baking is the second time.

[0074] In this embodiment, when the first baking is performed (baking for the first time within the first temperature range), its purpose is to reduce the viscosity of the bonding conductive adhesive in the conductive adhesive so that the white particles mixed in the bonding conductive adhesive can float above the first raw material or between the first raw material and the conductive metal powder; thereafter, a second baking is performed. The purpose of the second baking is to bake and solidify. The white layer formed by the solidified white particles covers the surface of the solder of the pad, so that the upper surface of the solder on the pad is white.

[0075] It can be seen that the surface of the solder on the pad in the LED lamp bead packaged using the LED lamp bead packaging process is white. When the light irradiated to the surface of the solder on the pad after the LED chip is lit is reflected, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

[0076] Here, it should be pointed out that the above description of the preparation method, the packaging process of the LED lamp bead and the LED lamp bead embodiment is similar to the description of the above conductive adhesive embodiment, and has similar beneficial effects as the above preparation method. For technical details not disclosed in the preparation method, the packaging process of the LED lamp bead and the LED lamp bead embodiment, please refer to the description of the conductive adhesive embodiment of the present invention for understanding.

[0077] In summary, the present invention provides a conductive adhesive, a preparation method, a packaging process for LED lamp beads, and LED lamp beads, which have the following beneficial effects:

[0078] When the first raw material is transparent, since the true density of the white particles is at least lower than the density of the conductive powder, the white layer formed by the white particles is located between the conductive powder and the first raw material after the conductive adhesive is baked and solidified, or the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. When the first raw material is opaque, since the true density of the white particles is lower than the density of the first raw material, the white layer formed by the white particles is located above the first raw material, and the surface of the solder on the pad in the LED lamp bead encapsulated with the conductive adhesive is white. It can be seen that when reflecting the light irradiated to the solder on the pad after the LED chip is lit, the reflection efficiency is high, thereby improving the brightness of the LED lamp bead.

[0079] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the coverage of the claims of the present invention.

Claims

1. A conductive adhesive for encapsulating LED lamp beads, characterized in that: The conductive adhesive includes an adhesive conductive adhesive, wherein the raw material components of the adhesive conductive adhesive include at least a first raw material and a conductive powder having a density greater than that of the first raw material, and the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin; The conductive adhesive further includes white particles mixed in the bonding conductive adhesive; Wherein, when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder; When the first raw material is opaque, the true density of the white particles is lower than the density of the first raw material.

2. The conductive adhesive according to claim 1, characterized in that: The weight of the white particles is 2-5% of the weight of the conductive powder in the conductive adhesive.

3. The conductive adhesive according to claim 1 or 2, characterized in that: The viscosity of the conductive adhesive is 6000-8700 mPa·s.

4. The conductive adhesive according to claim 1, characterized in that: The white particles are white hollow glass microspheres or white resin microspheres.

5. A method for preparing the conductive adhesive according to any one of claims 1 to 4, wherein the conductive adhesive comprises an adhesive conductive adhesive, the raw material components of the adhesive conductive adhesive at least include a first raw material and a conductive powder, the first raw material is one of epoxy resin, silicone resin, polyurethane, and acrylic resin, characterized in that: The preparation method comprises: Adding white particles to the bonding conductive adhesive, wherein when the first raw material is transparent, the true density of the white particles is at least less than the density of the conductive powder, and when the first raw material is opaque, the true density of the white particles is less than the density of the first raw material; The bonding conductive adhesive to which the white particles are added is stirred alternately in a clockwise direction and a counterclockwise direction.

6. The method for preparing the conductive adhesive according to claim 5, characterized in that: The bonding conductive adhesive with the white particles added thereto is stirred for 5-8 minutes.

7. A packaging process for LED lamp beads using the conductive adhesive as claimed in any one of claims 1 to 4, characterized in that: The packaging process comprises: Providing a substrate provided with a solder pad; Applying conductive glue on the pads of the substrate; Placing the LED chip on the conductive glue on the pad of the substrate; Baking the substrate with the LED chip within a first temperature range for a first time; The substrate baked in the first temperature range is baked in the second temperature range for a second time.

8. The packaging process of LED lamp beads according to claim 7, characterized in that: The first temperature ranges from 60 to 80° C., and the first time ranges from 10 to 30 minutes.

9. The packaging process of LED lamp beads according to claim 8, characterized in that: The second temperature range is 150-185° C., and the second time range is 1.5-2.5 hours.

10. An LED lamp bead, characterized in that: The LED lamp bead is made by the packaging process of the LED lamp bead as described in any one of claims 7 to 9.

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