High temperature resistant reactive polyurethane hot melt adhesive for electronic products and preparation method thereof

Abstract

The present invention discloses a high temperature resistant reactive polyurethane hot melt adhesive for electronic products, characterized in that, calculated by weight, it includes the following components: polyphenylene ether polyol: 10-40 parts; polyether polyol: 20-40 parts; crystalline polyester polyol: 20-40 parts; thermoplastic resin: 5-20 parts; tackifying resin: 1-10 parts; antioxidant: 0.2-2 parts; diisocyanate: 10-30 parts; catalyst: 0.1-3 parts; silane coupling agent: 0.1-3 parts. The present invention also discloses its preparation method. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products prepared by the present invention has good bonding strength (greater than 1.5Mpa) at a high temperature of 110°C, and also has a good bonding effect (greater than 5.4Mpa) after high temperature aging at 120°C, which can adapt to the use of high temperature bonding application scenarios of electronic products, has good performance and is easy to process to obtain mass industrial production products.

Description

Technical Field

[0001] The invention relates to a reactive polyurethane hot melt adhesive, and in particular to a high temperature resistant reactive polyurethane hot melt adhesive for electronic products and a preparation method thereof. Background Art

[0002] Reactive polyurethane hot melt adhesive (PUR) is a type of reactive hot melt adhesive that melts when heated and then solidifies through chemical reactions with moisture in the air or active groups on the surface of the bonded material. It has the characteristics of fast bonding and high bonding strength. It is widely used in the fields of mobile phone screen assembly, casing and battery bonding and fixation, smart glasses structure assembly, etc.

[0003] As the global greenhouse effect intensifies, the outdoor temperature in Africa and the desert areas of the Middle East gradually rises in summer, reaching as high as 60-70℃. Therefore, electronic products in this region require better temperature resistance, especially the structural adhesives of electronic products, which require higher temperature resistance. Reactive polyurethane, as the structural adhesive of electronic products, also requires better high temperature resistance to meet the product needs of this region.

[0004] In general electronic product applications, PUR usually has good flexibility and good rework performance. When mechanical stripping and debonding fail, consider heating the bonding part to 120℃ to remove the glue. The heat resistance is slightly poor, so when bonding some products that are exposed to high temperatures, it cannot meet the heat resistance requirements well, especially when the temperature is above 100℃, and no PUR can meet the application. At present, the PUR products with good heat resistance in the market have a bonding strength of about 2-3Mpa at 80℃, and there is no product that reaches more than 2Mpa above 90℃.

[0005] However, some traditional high-temperature resistant reactive polyurethane hot melt adhesives (PUR) in other fields are difficult to process and dispense due to their high viscosity. They cannot be applied on narrow frames in the application field of electronic products and cannot be used. Summary of the invention

[0006] In order to overcome the above-mentioned defects of the prior art, the object of the present invention is to provide a high temperature resistant reactive polyurethane hot melt adhesive for electronic products and a preparation method thereof.

[0007] In order to achieve the purpose of the invention, the technical solution adopted is:

[0008] A high temperature resistant reactive polyurethane hot melt adhesive for electronic products, calculated by weight, comprises the following components:

[0009] Polyphenylene ether polyol: 10-40 parts;

[0010] Polyether polyol: 20-40 parts;

[0011] Crystalline polyester polyol: 20-40 parts;

[0012] Thermoplastic resin: 5-20 parts;

[0013] Tackifying resin: 1-10 parts;

[0014] Antioxidant: 0.2-2 parts;

[0015] Diisocyanate: 10-30 parts;

[0016] Catalyst: 0.1-3 parts;

[0017] Silane coupling agent: 0.1-3 parts;

[0018] The polyphenylene ether polyol is a double-terminated hydroxyl polyphenylene ether as shown in the following structural formula 1;

[0019]

[0020] Formula 1;

[0021] The polyether polyol is any one or more of polyoxypropylene glycol, polytetramethylene oxide ether glycol or ethylene oxide-propylene oxide copolyether polyol;

[0022] The crystalline polyester polyol is any one or more of polyethylene glycol adipate or polyhexylene glycol adipate.

[0023] In a preferred embodiment of the present invention, the hydroxyl content of the double-terminated hydroxyl polyphenylene ether is 50-60.

[0024] In a preferred embodiment of the present invention, the double-terminated hydroxyl polyphenylene ether is prepared by the following method:

[0025] Add 2,6-dimethylphenol, 2,2',4,4'-tetramethylbisphenol A and butyl acetate into a reaction kettle and stir, then add CuCl and 4-dimethylaminopyridine, introduce oxygen, heat to 30-50°C and keep warm for 3-5h, then add acetic acid, then add saturated salt water into the reaction solution for separation, and filter out the brick red insoluble solid;

[0026] After filtration, the liquid was dripped into a large amount of methanol to obtain an off-white precipitate. The solid was filtered, washed with a methanol solution and dried to obtain a white double-terminated hydroxyl polyphenylene ether.

[0027] The added ratio of 2,6-dimethylphenol, 2,2',4,4'-tetramethylbisphenol A, CuCl and 4-dimethylaminopyridine is 1000-1200:90-110:12-15:20-30.

[0028] In a preferred embodiment of the present invention, the thermoplastic resin is acrylic resin.

[0029] In a preferred embodiment of the present invention, the tackifying resin is any one or more of rosin, terpene resin or EVA resin.

[0030] In a preferred embodiment of the present invention, the antioxidant is any one or more of pentaerythritol 1010, octadecyl propionate 1076 or triphosphite 168.

[0031] In a preferred embodiment of the present invention, the diisocyanate is any one or more of diphenylmethane diisocyanate MDI, hydrogenated diphenylmethane diisocyanate HMDI, isophorone diisocyanate IPDI or paraphenylene diisocyanate TDI.

[0032] In a preferred embodiment of the present invention, the catalyst is any one or more of organic bismuth, triethylenediamine, triethanolamine or bismorpholine diethyl ether.

[0033] In a preferred embodiment of the present invention, the silane coupling agent is any one or more of γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane or γ-aminopropyltrimethoxysilane.

[0034] A method for preparing a high temperature resistant reactive polyurethane hot melt adhesive for electronic products comprises the following steps:

[0035] The first step is to add the polyphenylene ether polyol and polyether polyol into a reaction kettle and then heat it to 140-150° C.;

[0036] The second step is to add the thermoplastic resin, antioxidant and tackifying resin to the reaction product of the first step, vacuum dehydrate for 1-3 hours, and cool to 70-80° C.;

[0037] The third step is to add the diisocyanate to the reaction product of the second step, and pass nitrogen protection, and keep the temperature at 100-110° C. for 1-3 hours;

[0038] The fourth step is to add a catalyst and a silane coupling agent to the reaction product of the fourth step, and stir for 0.5-2 hours to obtain the high temperature resistant reactive polyurethane hot melt adhesive for electronic products.

[0039] The beneficial effects of the present invention are:

[0040] The high-temperature resistant reactive polyurethane hot melt adhesive for electronic products prepared by the present invention has good bonding strength (greater than 1.5Mpa) at a high temperature of 110°C, and also has a good bonding effect (greater than 5.4Mpa) after high-temperature aging at 120°C. It can adapt to the use of high-temperature bonding application scenarios of electronic products, has good performance and is easy to process to obtain mass industrial production products. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical scheme and advantages of the present invention more clear, the present invention is further described in detail by examples below. However, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the scope of the present invention.

[0042] Preparation of polyphenylene ether

[0043] 11 kg of 2,6-dimethylphenol and 1 kg of 2,2',4,4'-tetramethylbisphenol A butyl acetate were added to the reactor and stirred, and then 130 g of CuCl and 260 g of 4-dimethylaminopyridine were added, oxygen was introduced, the temperature was raised to 40°C and kept warm for 4 hours, and then acetic acid was added, and then the reaction solution was added to saturated salt water for liquid separation, and the brick red insoluble solid was filtered out. After filtration, the liquid was dripped into a large amount of methanol to obtain an off-white precipitate, and the solid was filtered, washed with a methanol solution and dried to obtain a polyphenylene ether polyol product 1.

[0044] Example 1

[0045] Add 20 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 30 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0046] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0047] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0048] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0049] The thermoplastic resin in this embodiment is acrylic resin.

[0050] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0051] The tackifying resin in this embodiment is rosin.

[0052] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0053] The catalyst in this embodiment is bismorpholine diethyl ether.

[0054] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0055] Example 2

[0056] Add 10 parts of polyphenylene ether polyol, 30 parts of polyether polyol and 30 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0057] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0058] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0059] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0060] The thermoplastic resin in this embodiment is acrylic resin.

[0061] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0062] The tackifying resin in this embodiment is rosin.

[0063] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0064] The catalyst in this embodiment is bismorpholine diethyl ether.

[0065] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0066] Example 3

[0067] Add 30 parts of polyphenylene ether polyol, 10 parts of polyether polyol and 30 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0068] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0069] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0070] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0071] The thermoplastic resin in this embodiment is acrylic resin.

[0072] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0073] The tackifying resin in this embodiment is rosin.

[0074] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0075] The catalyst in this embodiment is bismorpholine diethyl ether.

[0076] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0077] Example 4

[0078] Add 40 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 10 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0079] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0080] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0081] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0082] The thermoplastic resin in this embodiment is acrylic resin.

[0083] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0084] The tackifying resin in this embodiment is rosin.

[0085] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0086] The catalyst in this embodiment is bismorpholine diethyl ether.

[0087] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0088] Example 5

[0089] Add 40 parts of polyphenylene ether polyol, 10 parts of polyether polyol and 10 parts of crystalline polyester polyol into a reactor, heat to 140-150°C, add 20 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0090] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0091] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0092] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0093] The thermoplastic resin in this embodiment is acrylic resin.

[0094] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0095] The tackifying resin in this embodiment is rosin.

[0096] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0097] The catalyst in this embodiment is bismorpholine diethyl ether.

[0098] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0099] Example 6

[0100] Add 20 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 20 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 20 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0101] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0102] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0103] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0104] The thermoplastic resin in this embodiment is acrylic resin.

[0105] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0106] The tackifying resin in this embodiment is rosin.

[0107] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0108] The catalyst in this embodiment is bismorpholine diethyl ether.

[0109] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0110] Example 7

[0111] Add 20 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 25 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 15 parts of MDI, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0112] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0113] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0114] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0115] The thermoplastic resin in this embodiment is acrylic resin.

[0116] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0117] The tackifying resin in this embodiment is rosin.

[0118] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0119] The catalyst in this embodiment is bismorpholine diethyl ether.

[0120] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0121] Example 8

[0122] Add 20 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 20 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 20 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 8 hours to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0123] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0124] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0125] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0126] The thermoplastic resin in this embodiment is acrylic resin.

[0127] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0128] The tackifying resin in this embodiment is rosin.

[0129] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0130] The catalyst in this embodiment is bismorpholine diethyl ether.

[0131] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0132] Example 9

[0133] Add 10 parts of polyphenylene ether polyol, 20 parts of polyether polyol and 20 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 30 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for 1 hour to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0134] The polyphenylene ether polyol in this embodiment is polyphenylene ether polyol product 1.

[0135] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0136] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0137] The thermoplastic resin in this embodiment is acrylic resin.

[0138] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0139] The tackifying resin in this embodiment is rosin.

[0140] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0141] The catalyst in this embodiment is bismorpholine diethyl ether.

[0142] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0143] Comparative Example 1

[0144] Add 20 parts of polyester polyol, 20 parts of polyether polyol and 30 parts of crystalline polyester polyol into a reactor, heat up to 140-150°C, add 10 parts of thermoplastic resin, 0.2 parts of antioxidant and 2 parts of tackifying resin, vacuum dehydrate for 1 hour, cool to 70-80°C, add 10 parts of diisocyanate, pass nitrogen for protection, keep warm at 100-110°C for 1 hour, add 0.1 parts of catalyst and 1 part of silane coupling agent, stir for half an hour to obtain high temperature resistant reactive polyurethane hot melt adhesive.

[0145] The polyester polyol in this embodiment is TEPANPOLPDP-70 polyester polyol.

[0146] The polyether polyol in this embodiment is polyoxypropylene glycol.

[0147] The crystalline polyester polyol in this embodiment is polyethylene glycol adipate.

[0148] The thermoplastic resin in this embodiment is acrylic resin.

[0149] The antioxidant in this embodiment is pentaerythritol ester 1010.

[0150] The tackifying resin in this embodiment is rosin.

[0151] The diisocyanate in this embodiment is diphenylmethane diisocyanate MDI.

[0152] The catalyst in this embodiment is bismorpholine diethyl ether.

[0153] The silane coupling agent in this embodiment is γ-glycidyloxypropyltrimethoxysilane.

[0154] The test results of various embodiments and comparative examples are shown in Table 1:

[0155] Table 1

[0156]

[0157] As can be seen from Table 1, Comparative Example 1 does not use the polyphenylene ether polyol of the present invention, but uses polyester polyol, and its conventional shear strength, high-temperature shear strength at 110°C, and shear strength after high-temperature aging at 120°C for 7D are not as good as those of the embodiments of the present invention.

[0158] The basic principles and main features of the invention and the advantages of the invention are shown and described above.

[0159] Those skilled in the art should understand that the present invention is not limited to the above-mentioned embodiments. The above-mentioned embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A high temperature resistant reactive polyurethane hot melt adhesive for electronic products, characterized in that: Calculated by weight, it includes the following components: Polyphenylene ether polyol: 10-40 parts; Polyether polyol: 20-40 parts; Crystalline polyester polyol: 20-40 parts; Thermoplastic resin: 5-20 parts; Tackifying resin: 1-10 parts; Antioxidant: 0.2-2 parts; Diisocyanate: 10-30 parts; Catalyst: 0.1-3 parts; Silane coupling agent: 0.1-3 parts; The polyphenylene ether polyol is a double-terminated hydroxyl polyphenylene ether as shown in the following structural formula 1; The polyether polyol is any one or more of polyoxypropylene glycol, polytetramethylene oxide ether glycol or ethylene oxide-propylene oxide copolyether polyol; The crystalline polyester polyol is any one or more of polyethylene glycol adipate or polyhexylene glycol adipate.

2. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The hydroxyl content of the double-terminated hydroxyl polyphenylene ether is 50-60.

3. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The double-terminated hydroxyl polyphenylene ether is prepared by the following method: Add 2,6-dimethylphenol, 2,2',4,4'-tetramethylbisphenol A and butyl acetate into a reaction kettle and stir, then add CuCl and 4-dimethylaminopyridine, introduce oxygen, heat to 30-50°C and keep warm for 3-5h, then add acetic acid, then add saturated salt water into the reaction solution for separation, and filter out the brick red insoluble solid; After filtration, the liquid was dripped into a large amount of methanol to obtain an off-white precipitate. The solid was filtered, washed with a methanol solution and dried to obtain a white double-terminated hydroxyl polyphenylene ether. The added ratio of 2,6-dimethylphenol, 2,2',4,4'-tetramethylbisphenol A, CuCl and 4-dimethylaminopyridine is 1000-1200:90-110:12-15:20-30.

4. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The thermoplastic resin is acrylic resin.

5. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The tackifying resin is any one or more of rosin, terpene resin or EVA resin.

6. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The antioxidant is any one or more of pentaerythritol 1010, octadecyl propionate 1076 or triphosphite 168.

7. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The diisocyanate is any one or more of diphenylmethane diisocyanate MDI, hydrogenated diphenylmethane diisocyanate HMDI, isophorone diisocyanate IPDI or paraphenylene diisocyanate TDI.

8. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The catalyst is any one or more of organic bismuth, triethylenediamine, triethanolamine or bismorpholine diethyl ether.

9. The high temperature resistant reactive polyurethane hot melt adhesive for electronic products according to claim 1, characterized in that: The silane coupling agent is any one or more of γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane or γ-aminopropyltrimethoxysilane.

10. A method for preparing a high temperature resistant reactive polyurethane hot melt adhesive for electronic products as claimed in any one of claims 1 to 9, characterized in that: The steps include: The first step is to add the polyphenylene ether polyol and polyether polyol into a reaction kettle and then heat it to 140-150° C.; The second step is to add the thermoplastic resin, antioxidant and tackifying resin to the reaction product of the first step, vacuum dehydrate for 1-3 hours, and cool to 70-80° C.; The third step is to add the diisocyanate to the reaction product of the second step, and pass nitrogen protection, and keep the temperature at 100-110° C. for 1-3 hours; The fourth step is to add a catalyst and a silane coupling agent to the reaction product of the fourth step, and stir for 0.5-2 hours to obtain the high temperature resistant reactive polyurethane hot melt adhesive for electronic products.

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