Evaporation source and evaporation device

Abstract

The present invention discloses an evaporation source and an evaporation device, which relate to the field of vacuum evaporation technology, wherein the evaporation source is used to coat a substrate located below the evaporation source, and the evaporation source comprises a shell, a plurality of reaction material tanks and a vacuum pumping component. The shell forms a gas source chamber, and the shell is provided with a nozzle connected to the gas source chamber; each of the reaction material tanks is connected to the gas source chamber through a transport channel, and each of the transport channels is provided with a first valve for connecting or disconnecting the transport channel, and the reaction material tanks are used to heat the coating material; the vacuum pumping component is respectively connected to a plurality of the reaction material tanks, and is used to vacuum the reaction material tanks. The evaporation source and evaporation device provided by the present invention are intended to optimize the method of replenishing the coating material during evaporation, improve the purity of the coating material, so as to improve the production efficiency and the quality of the evaporated film layer, and reduce the production cost.

Description

Technical Field

[0001] The present invention relates to the field of vacuum evaporation technology, and in particular to an evaporation source and an evaporation device. Background Art

[0002] Vacuum evaporation refers to heating the coating material under certain vacuum conditions by means of resistance, electron beam, radio frequency induction, arc, laser, etc., so that it vaporizes into gaseous particles with a certain amount of energy. Since the density of air gas decreases with the increase of vacuum degree, the gaseous particles have a larger free path in a vacuum environment and will move freely and quickly to the surface of the substrate to form a thin film. During the evaporation process, a part of the gaseous particles are adsorbed on the surface of the substrate to form crystal nuclei. As the coating material continues to evaporate, the crystal nuclei deposited on the surface of the substrate gradually increase and connect, eventually forming a continuous thin film.

[0003] In the prior art, the evaporation device generally adopts a bottom-up evaporation deposition method. In this method, the gas source chamber is used to sublimate the coating material into a gas state, the transmission device is used to transport the substrate, the gas source chamber is located below the rotating device, that is, the coating material is located below the substrate, and the gaseous coating material is sprayed through the nozzle, passes through the transmission device, and is deposited on the substrate to finally complete the coating.

[0004] However, in the bottom-up evaporation method, the existence of the transmission device will partially block the rising path of the steam, resulting in only a small amount of coating material being deposited on the substrate each time. The coating material in the reaction tank will soon be used up. In order to meet production needs, the evaporation device must be frequently paused to add coating material to the reaction tank. This destroys the vacuum environment of the evaporation device, reduces production efficiency, and increases production costs. In addition, new impurities may be introduced during the filling and degassing process, resulting in poor quality of the final evaporated film layer. Summary of the invention

[0005] The main purpose of the present invention is to propose an evaporation source and an evaporation device, aiming to optimize the method of replenishing coating materials during evaporation, improve the purity of the coating materials, thereby improving production efficiency and the quality of the evaporated film layer, and reducing production costs.

[0006] To achieve the above object, the present invention provides an evaporation source for coating a substrate located below the evaporation source, wherein the evaporation source comprises:

[0007] A shell, wherein the shell is formed with an air source chamber, and the shell is provided with a nozzle connected to the air source chamber;

[0008] A plurality of reaction material tanks, each of which is connected to the gas source chamber via a transport channel, and each of which is provided with a first valve for connecting or disconnecting the transport channel, and the reaction material tanks are used to heat the coating material; and

[0009] A vacuum pumping component is connected to the plurality of reaction tanks respectively and is used for vacuuming the reaction tanks.

[0010] In one embodiment, each of the transport channels includes a sublimation tube connecting the gas source chamber and the reaction tank, and a heating plate disposed outside the sublimation tube, wherein the heating plate is used to heat the sublimation tube.

[0011] In one embodiment, the shell includes a protective shell and a mixing channel arranged in the protective shell, the mixing channel includes a main body and a plurality of flared parts connected to the main body, the gas source chamber is formed in the main body and the flared parts, the nozzle is arranged in the main body, each of the sublimation tubes is connected to one of the flared parts, and the end face area of ​​the flared part close to the sublimation tube is smaller than the end face area away from the sublimation tube.

[0012] In one embodiment, a portion of the expanded portion is inserted into the sublimation tube to form a protrusion protruding from the inner wall of the sublimation tube.

[0013] In one embodiment, a baffle is provided between the main body and the flared portion, and the baffle is used to connect or disconnect the main body and the flared portion.

[0014] In one embodiment, the main body includes a top wall and a bottom wall arranged opposite to the top wall, the nozzle is arranged on the bottom wall, and the temperature of the top wall is higher than the temperature of the bottom wall.

[0015] In one embodiment, the shell is connected to the vacuum pumping assembly so that the vacuum degree at the nozzle is greater than the vacuum degree at the reaction tank.

[0016] In one embodiment, a second valve is provided between the vacuum pumping component and the reaction tank, and the second valve is used to connect or disconnect the vacuum pumping component and the reaction tank.

[0017] The present invention further provides an evaporation device, the evaporation device comprising:

[0018] A base body, wherein the base body is provided with a spraying chamber and a conveying surface located in the spraying chamber, the conveying surface is used to convey the substrate, and the base body is provided with a through opening for the nozzle to extend into the spraying chamber; and

[0019] The above-mentioned evaporation source is arranged on the base, the nozzle of the evaporation source is opposite to the conveying surface, and the nozzle is used to spray the coating material to the side of the substrate facing away from the conveying surface.

[0020] In one embodiment, the seat body includes a bottom plate and a cover plate arranged opposite to the bottom plate, the through opening is arranged on the cover plate, the bottom plate is provided with a frame, and a plurality of rollers rotatably arranged on the frame, and the surfaces of the plurality of rollers form the conveying surface.

[0021] The technical solution of the present invention realizes the continuous supply of coating material through the vacuum pumping component and the first valve. When one reaction tank is performing evaporation, other reaction tanks can be prepared for adding materials at the same time. When the coating material is about to be exhausted, it is immediately switched to the next prepared reaction tank, thereby ensuring the uninterrupted evaporation process. In this way, the problem of destroying the vacuum environment of the evaporation device when adding materials is solved, the production efficiency is improved, the cost is reduced, and the introduction of impurities can be reduced, thereby improving the quality of the evaporation film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of an embodiment of an evaporation source provided by the present invention;

[0024] Figure 2 A schematic structural diagram of an embodiment of a vapor deposition device provided by the present invention;

[0025] Figure 3 for Figure 2 A schematic structural diagram of the evaporation device from another perspective.

[0026] Description of Figure Numbers:

[0027] 100, evaporation source; 1, shell; 11, protective shell; 12, mixing channel; 121, main body; 1211, top wall; 1212, bottom wall; 1213, nozzle; 122, flaring portion; 1221, protrusion; 123, gas source chamber; 124, baffle; 13, support seat; 2, reaction trough; 21, second valve; 3, transportation channel; 31, first valve; 32, sublimation tube; 4, vacuum assembly; 41, switch; 200, evaporation device; 5, seat; 51, bottom plate; 52, cover plate; 53, spraying chamber; 531, roller; 5311, conveying surface; 6, substrate; 7, coating material.

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] Vacuum evaporation refers to heating the coating material under certain vacuum conditions by means of resistance, electron beam, radio frequency induction, arc, laser, etc., so that it vaporizes into gaseous particles with a certain amount of energy. Since the density of air gas decreases with the increase of vacuum degree, the gaseous particles have a larger free path in a vacuum environment and will move freely and quickly to the surface of the substrate to form a thin film. During the evaporation process, a part of the gaseous particles are adsorbed on the surface of the substrate to form crystal nuclei. As the coating material continues to evaporate, the crystal nuclei deposited on the surface of the substrate gradually increase and connect, eventually forming a continuous thin film.

[0033] In the prior art, the evaporation device generally adopts a bottom-up evaporation deposition method, in which the coating material is located below the substrate, and the coating material is sublimated by heating to become gas, and the vapor rises and is deposited on the substrate.

[0034] However, in the bottom-up evaporation method, the existence of the transmission device will partially block the rising path of the steam, resulting in only a small amount of coating material being deposited on the substrate each time. The coating material in the reaction tank will soon be used up. In order to meet production needs, the evaporation device must be frequently paused to add coating material to the reaction tank. This destroys the vacuum environment of the evaporation device, reduces production efficiency, and increases production costs. In addition, new impurities may be introduced during the filling and degassing process, resulting in poor quality of the final evaporated film layer.

[0035] The present invention proposes an evaporation source 100 and an evaporation device 200, which are intended to optimize the method of replenishing the coating material 7 during evaporation, improve the purity of the coating material, thereby improving production efficiency and the quality of the evaporated film layer, and reducing production costs.

[0036] See also Figures 1 to 3 In one embodiment of the present invention, the evaporation source 100 is used to coat a substrate 6 located below the evaporation source 100. The evaporation source 100 includes a housing 1, a plurality of reaction tanks 2, and a vacuum pumping assembly 4. The housing 1 is formed with a gas source chamber 123, and the housing 1 is provided with a nozzle 1213 connected to the gas source chamber 123. Each reaction tank 2 is connected to the gas source chamber 123 through a transport channel 3, and each transport channel 3 is provided with a first valve 31 for connecting or disconnecting the transport channel 3. The reaction tank 2 is used to heat the coating material 7. The vacuum pumping assembly 4 is respectively connected to the plurality of reaction tanks 2, and is used to vacuum the reaction tanks 2.

[0037] The technical solution of the present invention realizes the continuous supply of the coating material 7 through the vacuum assembly 4 and the first valve 31. When one reaction tank 2 is performing evaporation, other tanks can be prepared for feeding at the same time. When the coating material 7 is about to be exhausted, it is immediately switched to the next prepared reaction tank 2, thereby ensuring the uninterrupted evaporation process. In this way, the problem of destroying the vacuum environment of the evaporation device 200 when adding materials is solved, the production efficiency is improved, the cost is reduced, and the introduction of impurities can be reduced, thereby improving the quality of the evaporated film layer.

[0038] It should be noted that, in this embodiment, the evaporation source 100 is located above the substrate 6, that is, the nozzle 1213 sprays the coating material 7 from the top to the bottom to be deposited on the substrate 6 below. At this time, since there is no shielding of the transmission device, most of the coating material 7 can be deposited on the substrate 6, thereby improving the deposition efficiency of the coating material 7. If the evaporation source 100 in the prior art is directly moved above the substrate 6, since the reaction tank 2 is also located in the vacuum gas source chamber 123, the gas source chamber 123 is large in volume and heavy in weight, which will generate a large pressure on the base 5 below.

[0039] Therefore, in order to solve the above problem, the present application connects the reaction tank 2 with the gas source chamber 123 through the transport channel 3, so that the reaction tank 2 is located outside the gas source chamber 123. At this time, the base 5 below only needs to support the gas source chamber 123 formed by the shell 1, and the reaction tank 2 can be installed on other carriers.

[0040] It is understandable that in order to ensure the vacuum environment when the reaction tank 2 supplies the gas source chamber 123, the reaction tank 2 also needs to be directly connected to the vacuum assembly 4, so as to evacuate the interior of the reaction tank 2 after the sublimation of the coating material 7 is completed. In addition, in order to ensure that the coating material 7 does not enter the gas source chamber 123 during the sublimation of the coating material 7, a first valve 31 is also provided on the transport channel 3. When the coating material 7 becomes gaseous, the first valve 31 is opened to allow the coating material 7 to enter the gas source chamber 123. A heating wire can be provided at the bottom of the reaction tank 2 to heat the coating material 7 in the reaction tank 2 until it becomes gaseous.

[0041] It is understandable that during the vacuuming process, it is necessary to monitor the vacuum degree in the reaction tank 2 in real time to ensure that the coating material 7 reaches the preset requirements of production. Therefore, a vacuum gauge is required to be set in the pipeline connecting the reaction tank 2 and the vacuuming component 4. It is understandable that after the coating material 7 in a reaction tank 2 is used up, the lid of the reaction tank 2 needs to be opened to add new coating material 7. However, the reaction tank 2 is in a vacuum state at this time, and it is not easy to open the lid. Therefore, a breaker valve is required to be set in the pipeline connecting the reaction tank 2 and the vacuuming component 4.

[0042] See also Figure 1 and Figure 2 In one embodiment, a second valve 21 is provided between the vacuum pumping component 4 and the reaction tank 2 , and the second valve 21 is used to connect or disconnect the vacuum pumping component 4 and the reaction tank 2 .

[0043] In this embodiment, in order to control the timing of vacuuming the reaction tank 2, a second valve 21 is provided in the pipeline connecting the reaction tank 2 and the vacuuming component 4. When the coating material 7 in a certain reaction tank 2 is completely sublimated and the gaseous coating material 7 is ready to be introduced into the gas source chamber 123 for evaporation, the second valve 21 will be opened, and the vacuuming component 4 will start to work, and the residual gas and impurities in the reaction tank 2 will be extracted to ensure the vacuum environment during evaporation.

[0044] See also Figure 1 and Figure 2 In one embodiment, each transport channel 3 includes a sublimation tube 32 connecting the gas source chamber 123 and the reaction tank 2, and a heating plate arranged on the outside of the sublimation tube 32, and the heating plate is used to heat the sublimation tube 32.

[0045] It can be understood that during the sublimation process of the coating material 7, although most of the coating material 7 can be converted into a gaseous state, there may still be a small amount of solid coating material 7 that is carried along by the gaseous coating material 7 and flows together. The sublimation tube 32 is used to further heat the coating material 7 to prevent these solid coating materials 7 from interfering with the evaporation process. This not only improves the utilization rate of the coating material 7, but also improves the quality of the evaporated film layer.

[0046] In addition, the sublimation tube 32 also achieves the screening of impurities in the coating material 7 through precise temperature control. Since different substances have different sublimation points, the temperature in the sublimation tube 32 is set to a specific range, which can ensure that the coating material 7 is completely sublimated, but at the same time, impurities with high sublimation points cannot be sublimated, so that those impurities adhere to the inner wall of the sublimation tube 32, thereby achieving the removal of impurities and further improving the quality of the evaporated film layer. It can be understood that since the temperature needs to be controlled, a thermocouple is also provided in the sublimation tube 32. Of course, in this embodiment, thermocouples can also be provided at other locations where temperature monitoring is required, which will not be described in detail later.

[0047] See also Figure 1 and Figure 2 In one embodiment, the shell 1 includes a protective shell 11 and a mixing channel 12 disposed in the protective shell 11, the mixing channel 12 includes a main body 121, and a plurality of flared portions 122 connected to the main body 121, a gas source chamber 123 is formed in the main body 121 and the flared portion 122, a nozzle 1213 is disposed in the main body 121, each sublimation tube 32 is connected to a flared portion 122, and the end surface area of ​​the flared portion 122 close to the sublimation tube 32 is smaller than the end surface area away from the sublimation tube 32.

[0048] In this embodiment, the protective shell 11 is used to protect the internal mixing channel 12 from interference from the external environment. The mixing channel 12 is connected to the sublimation tube 32 through the expansion portion 122, and the expansion portion 122 helps to guide the gaseous coating material 7 from the sublimation tube 32 into the mixing channel 12.

[0049] It can be understood that in order to facilitate replacement of the mixing channel 12 , the protective shell 11 can be configured as a detachable structure.

[0050] See also Figure 1 and Figure 2 In one embodiment, part of the expanded portion 122 is inserted into the sublimation tube 32 to form a protrusion 1221 protruding from the inner wall of the sublimation tube 32 .

[0051] In this embodiment, the expanded portion 122 is formed with a protrusion 1221 in the sublimation tube 32. When the gaseous coating material 7 passes through the protrusion 1221, it will be subject to a slight resistance and a change in direction, which will disturb the coating material 7, thereby making the distribution of the coating material 7 more uniform, avoiding the situation where the local concentration is too high or too low, and making the coating material 7 more uniform when it is sprayed out from the nozzle 1213, thereby improving the quality of the vapor-deposited film layer.

[0052] Secondly, the protrusion 1221 also plays a role in screening impurities. Since the coating material 7 may contain some impurities with a high sublimation point, these impurities are difficult to be completely converted into gas during the sublimation process. The protrusion 1221 becomes a barrier, which can prevent these impurities that are difficult to sublimate from entering the gas source chamber 123. Impurities will be attached to the surface of the protrusion 1221 or deposited on the inner wall of the sublimation tube 32, thereby avoiding affecting the quality of the evaporated film layer.

[0053] Optionally, in order to further improve the quality of the final vapor-deposited film layer, several groups of protrusions 1221 may be provided on the inner wall of the sublimation tube 32 along the extension direction of the sublimation tube 32 , thereby improving the cleaning effect of impurities.

[0054] It can be understood that the height and angle of the protrusion 1221 protruding from the inner wall of the sublimation tube 32 can be adjusted according to actual conditions and are not limited here.

[0055] See also Figure 1 and Figure 2 In one embodiment, a baffle 124 is provided between the main body 121 and the flared portion 122 , and the baffle 124 is used to connect or disconnect the main body 121 and the flared portion 122 .

[0056] In this embodiment, when a certain reaction tank 2 is undergoing evaporation, the corresponding baffle 124 will be opened automatically or manually to allow the coating material 7 to enter the main body 121 from the reaction tank 2 through the sublimation tube 32, and finally be sprayed out through the nozzle 1213 for coating. At the same time, all other baffles 124 that do not correspond to the reaction tank 2 that is feeding material will remain closed, disconnecting the connection between the main body 121 and the corresponding flared part 122, thereby preventing the coating material 7 from flowing into other unused sublimation tubes 32. It can be understood that when multiple reaction tanks 2 are loaded with the same coating material 7, when the coating material 7 flows into other unused sublimation tubes 32, it usually does not have a significant impact on the final coating effect. However, when performing coating of a composite film layer, since different coating materials 7 are contained in multiple reaction tanks 2, once different coating materials 7 enter the same sublimation tube 32, serious contamination will occur, affecting the structure and performance of the coating layer, thereby rendering the entire coating process ineffective and causing a decline in product quality.

[0057] See also Figure 1 and Figure 2 In one embodiment, the main body 121 includes a top wall 1211 and a bottom wall 1212 disposed opposite to the top wall 1211 , the nozzle 1213 is disposed on the bottom wall 1212 , and the temperature of the top wall 1211 is higher than that of the bottom wall 1212 .

[0058] In this embodiment, the temperature of the top wall 1211 is higher than the temperature of the bottom wall 1212 , thereby forming a temperature gradient inside the main body 121 , promoting the coating material 7 to flow from the top wall 1211 to the bottom wall 1212 , making it easier for the coating material 7 to be sprayed out from the nozzle 1213 .

[0059] Optionally, a support seat 13 is provided below the main body 121 to support the main body 121 and prevent the main body 121 from shaking.

[0060] See also Figure 1 and Figure 2 In one embodiment, the shell 1 is connected to the vacuum assembly 4 so that the vacuum degree at the nozzle 1213 is greater than the vacuum degree at the reaction tank 2.

[0061] In this embodiment, the housing 1 is also connected to the vacuum pumping assembly 4, and the vacuum pumping assembly 4 is used to pump a vacuum, so that the vacuum degree at the nozzle 1213 is greater than the vacuum degree at the reaction tank 2, so that a vacuum gradient is formed between the reaction tank 2 and the nozzle 1213, and the coating material 7 will naturally move along the direction of the vacuum gradient after being heated and sublimated in the reaction tank 2, that is, flow from the reaction tank 2 to the nozzle 1213. It can be understood that when the reaction tank 2 is arranged above the transmission device, the nozzle 1213 is located below the reaction tank 2, and the coating material 7 will first fill the gas source chamber 123 after sublimation, and then start to spray the coating material 7 through the nozzle 1213, so that after the evaporation stops, a lot of coating material 7 will remain in the gas source chamber 123, resulting in a waste of resources. Therefore, by setting the vacuum gradient, the coating material 7 is encouraged to flow directly to the nozzle 1213 after entering the gas source chamber 123 from the reaction tank 2, without having to fill the gas source chamber 123 before flowing to the nozzle 1213.

[0062] The vacuuming component 4 can be vacuumed by a pump, and accordingly, a switch 41 is provided on the pump to facilitate the control of starting and shutting down the pump.

[0063] Optionally, the housing 1 and the reaction tank 2 may also be evacuated by different pumps to facilitate control.

[0064] See also Figure 2 and Figure 3 The present invention further proposes a vapor deposition device 200, which includes a base body 5 and an evaporation source 100. The specific structure of the evaporation source 100 refers to the above embodiment. Since the vapor deposition device 200 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0065] The base body 5 is provided with a spraying chamber 53 and a conveying surface 5311 located in the spraying chamber 53. The conveying surface 5311 is used to convey the substrate 6. The base body 5 is provided with a through opening for the nozzle 1213 to extend into the spraying chamber 53. The evaporation source 100 is provided on the base body 5. The nozzle 1213 of the evaporation source 100 is opposite to the conveying surface 5311. The nozzle 1213 is used to spray the coating material 7 onto the side of the substrate 6 facing away from the conveying surface 5311.

[0066] In this embodiment, the evaporation device 200 includes a protective shell 11 and a base body 5, wherein a gas source chamber 123 is formed in the protective shell 11, and a spraying chamber 53 is formed in the base body 5, and the nozzle 1213 is used to spray the coating material 7 in the gas source chamber 123 onto the substrate 6 located in the spraying chamber 53. Among them, the model, size and length of the nozzle 1213 can be replaced according to actual conditions and are not limited here. The conveying surface 5311 is used to transport the substrate 6, so that the substrate 6 is sprayed when passing under the nozzle 1213.

[0067] Optionally, the protective shell 11 and the base body 5 can be integrally formed.

[0068] See also Figure 2 and Figure 3 In one embodiment, the base body 5 includes a bottom plate 51 and a cover plate 52 arranged opposite to the bottom plate 51, the through opening is arranged on the cover plate 52, the bottom plate 51 is provided with a frame, and a plurality of rollers 531 rotatably arranged on the frame, and the surfaces of the plurality of rollers 531 form a conveying surface 5311.

[0069] In this embodiment, the evaporation device 200 realizes the transmission of the substrate 6 through the rollers 531. At this time, the coating material 7 is not only deposited on the substrate 6, but also passes through the rollers 531 and is deposited on the bottom plate 51. When a transmission belt is used for transmission, the substrate 6 will move under the drive of the transmission belt. At this time, the coating material 7 will also be deposited on the transmission belt. The coating material 7 left on the transmission belt will cause the subsequent substrate 6 to slip on the transmission belt, thereby affecting the coating effect of the subsequent substrate 6.

[0070] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An evaporation source for coating a substrate located below the evaporation source, characterized in that: The evaporation source comprises: A shell, wherein the shell is formed with an air source chamber, and the shell is provided with a nozzle connected to the air source chamber; A plurality of reaction material tanks, each of which is connected to the gas source chamber via a transport channel, and each of which is provided with a first valve for connecting or disconnecting the transport channel, and the reaction material tanks are used to heat the coating material; and A vacuum pumping component is connected to the plurality of reaction tanks respectively and is used for vacuuming the reaction tanks.

2. The evaporation source according to claim 1, characterized in that: Each of the transport channels comprises a sublimation tube connected to the gas source chamber and the reaction tank, and a heating plate arranged outside the sublimation tube, wherein the heating plate is used to heat the sublimation tube.

3. The evaporation source according to claim 2, characterized in that: The shell includes a protective shell and a mixing channel arranged in the protective shell, the mixing channel includes a main body and a plurality of flared parts connected to the main body, the gas source chamber is formed in the main body and the flared parts, the nozzle is arranged in the main body, each of the sublimation tubes is connected to one of the flared parts, and the end surface area of ​​the flared part close to the sublimation tube is smaller than the end surface area away from the sublimation tube.

4. The evaporation source according to claim 3, characterized in that: Part of the expanded portion is inserted into the sublimation tube to form a protrusion protruding from the inner wall of the sublimation tube.

5. The evaporation source according to claim 3, characterized in that: A baffle is provided between the main body and the flared portion, and the baffle is used to connect or disconnect the main body and the flared portion.

6. The evaporation source according to claim 5, characterized in that: The main body includes a top wall and a bottom wall arranged opposite to the top wall, the nozzle is arranged on the bottom wall, and the temperature of the top wall is higher than the temperature of the bottom wall.

7. The evaporation source according to claim 1, characterized in that: The shell is communicated with the vacuum pumping assembly so that the vacuum degree at the nozzle is greater than the vacuum degree at the reaction tank.

8. The evaporation source according to claim 1, characterized in that: A second valve is provided between the vacuum pumping component and the reaction tank, and the second valve is used to connect or disconnect the vacuum pumping component and the reaction tank.

9. A vapor deposition device, characterized in that: The evaporation device comprises: A base body, wherein the base body is provided with a spraying chamber and a conveying surface located in the spraying chamber, the conveying surface is used to convey the substrate, and the base body is provided with a through opening for the nozzle to extend into the spraying chamber; and The evaporation source according to any one of claims 1 to 8, wherein the evaporation source is disposed on the base, a nozzle of the evaporation source is opposite to the conveying surface, and the nozzle is used to spray the coating material onto a side of the substrate facing away from the conveying surface.

10. The evaporation device according to claim 9, characterized in that The seat body includes a bottom plate and a cover plate arranged opposite to the bottom plate, the through opening is arranged on the cover plate, the bottom plate is provided with a frame body and a plurality of rollers rotatably arranged on the frame body, and the surfaces of the plurality of rollers form the conveying surface.

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