Pipeline and method for conveying liquid for semiconductor in winter and semiconductor liquid supply system

Abstract

The invention discloses a winter conveying pipeline and method for liquid for a semiconductor and a semiconductor liquid supply system, belongs to the technical field of chemical liquid conveying, and aims to solve the problem that in the prior art, the temperature of chemical liquid in a conveying pipeline in winter is greatly reduced. The winter conveying pipeline comprises a thermal insulation pipe, a liquid pipe, a plurality of heat supply pipes and a fluid supply unit, wherein the liquid pipe and the heat supply pipes are arranged in the thermal insulation pipe, and the fluid supply unit supplies high-temperature fluid to the heat supply pipes. The heat insulation pipe is arranged on the outer wall of the liquid pipe in a sleeving mode, a gap is formed between the heat insulation pipe and the liquid pipe, the gap between the heat insulation pipe and the liquid pipe serves as a containing space of the heat supply pipe, the heat supply pipe is arranged in the containing space and surrounds the liquid pipe, the side wall of the liquid pipe makes direct contact with the side wall of the heat supply pipe, and a gap is formed between the heat supply pipe and the heat insulation pipe. The liquid conveying device can be used for conveying liquid for semiconductors in winter.

Description

Technical Field

[0001] The invention belongs to the technical field of chemical liquid transportation, and in particular relates to a winter transportation pipeline and method for semiconductor liquid, and a semiconductor liquid supply system. Background Art

[0002] With the development of science and technology in recent years, the domestic semiconductor industry has developed rapidly, and a large number of chemical liquid supply systems are needed in the semiconductor industry.

[0003] The supply of chemical liquids usually requires the use of a delivery pipeline, that is, the liquid supply system in the chemical liquid supply plant (CCSS) is connected to the semiconductor process equipment in the production plant (Fab) through a delivery pipeline.

[0004] However, in the semiconductor process, the temperature control requirements for chemical liquids are relatively high, usually 20 to 26°C, and in the prior art, the temperature control only uses a simple insulation cover to wrap the conveying pipeline. Especially in winter, the outdoor environment is very low, which can easily cause the temperature of the chemical liquid in the conveying pipeline to drop too much, affecting the subsequent semiconductor process. Summary of the invention

[0005] In view of the above analysis, the present invention aims to provide a winter delivery pipeline and method for semiconductor liquid, and a semiconductor liquid supply system, so as to solve the problem of excessive temperature drop of chemical liquid in the delivery pipeline in winter in the prior art.

[0006] The purpose of the present invention is mainly achieved through the following technical solutions.

[0007] The present invention provides a winter delivery pipeline for semiconductor liquid, comprising a thermal insulation pipe, a liquid pipe and a plurality of heating pipes arranged in the thermal insulation pipe, and a fluid supply unit for supplying high-temperature fluid to the heating pipes;

[0008] The insulation tube is sleeved on the outer wall of the liquid tube and there is a gap between the two. The gap between the insulation tube and the liquid tube serves as a accommodating space for the heating pipe. The heating pipe is arranged in the accommodating space and surrounds the liquid tube. The side wall of the liquid tube is in direct contact with the side wall of the heating pipe, and there is a gap between the heating pipe and the insulation tube.

[0009] Furthermore, the thermal insulation pipe comprises a rigid pipe and a thermal insulation sleeve wrapping the rigid pipe.

[0010] Furthermore, the thickness of the insulation sleeve is calculated using the following formula:

[0011]

[0012] Where:

[0013] Q is the heat flow, W;

[0014] k is the thermal conductivity of the insulation sleeve, W / (m·k);

[0015] A is the surface area of ​​the insulation sleeve, m 2 ;

[0016] T1 is the inner surface temperature of the insulation sleeve, °C;

[0017] T2 is the outer surface temperature of the insulation sleeve, °C;

[0018] d is the thickness of the insulation sleeve, m.

[0019] Furthermore, the material of the insulation sleeve is one of polyurethane, glass wool or rock wool.

[0020] Furthermore, the insulation sleeve includes a plurality of insulation sections connected in sequence along the liquid flow direction, and two adjacent insulation sections are detachably connected.

[0021] Furthermore, the liquid pipe includes a corrosion-resistant layer and a thermal insulation pipe group sleeved on the outer wall of the corrosion-resistant layer.

[0022] Furthermore, the insulation pipe group includes an insulation inner pipe and an insulation outer pipe. The insulation outer pipe is sleeved on the outer wall of the insulation inner pipe, and there is a gap between the insulation inner pipe and the insulation outer pipe.

[0023] Furthermore, a plurality of spacers are provided in the heat-insulating inner tube, and the plurality of spacers are arranged in sequence along the axial direction of the liquid tube, and projections of the plurality of spacers on the radial plane of the liquid tube do not overlap.

[0024] The present invention also provides a method for conveying semiconductor liquid in winter, using the above semiconductor liquid conveying pipeline in winter, the winter conveying method comprises the following steps:

[0025] When the temperature of the liquid in the liquid pipe is lower than the temperature threshold, the fluid supply unit is turned on;

[0026] The fluid supply unit introduces high-temperature fluid into the heating pipe;

[0027] The heat in the high-temperature fluid is directly transferred to the liquid through the side walls of the heating tube and the liquid tube, thereby heating the liquid.

[0028] The present invention also provides a semiconductor liquid supply system, including a winter delivery pipeline for the semiconductor liquid.

[0029] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0030] A) The winter transportation pipeline for semiconductor liquid provided by the present invention replaces the existing simple insulation sleeve with a combination of an insulation pipe and a heating pipe to insulate and heat the liquid pipe, thereby being able to more safely, economically and effectively ensure the temperature of the semiconductor liquid during outdoor transportation in winter. It has a simple structure and is easy to use.

[0031] B) The winter transportation pipeline for semiconductor liquid provided by the present invention has a heating pipe added, and the side wall of the liquid pipe is in direct contact with the side wall of the heating pipe. When the temperature of the liquid in the liquid pipe is lower than the temperature threshold, the fluid supply unit can be turned on, and the fluid supply unit passes high-temperature fluid into the heating pipe. The heat in the high-temperature fluid is directly transferred to the liquid through the heating pipe and the side wall of the liquid pipe, thereby effectively heating the liquid. At the same time, since a plurality of heating pipes are arranged around the liquid pipe along the circumference of the liquid pipe, the liquid pipe can be heated from multiple directions, thereby ensuring the uniformity of the liquid temperature in the liquid pipe.

[0032] C) The winter transportation pipeline for semiconductor liquid provided by the present invention has a gap between the heating pipe and the insulation pipe, and since the thermal conductivity of air is relatively low, air insulation can be formed on the outer wall of the liquid pipe. In this way, the winter transportation pipeline has multiple functions such as air insulation, insulation by insulation sleeve and heating pipe heating, so as to cope with the impact of high temperature weather on the liquid temperature.

[0033] In the present invention, the above-mentioned technical solutions can also be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present invention will be described in the subsequent description, and some advantages can become obvious from the description, or can be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the contents particularly pointed out in the embodiments of the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like components throughout the drawings.

[0035] Figure 1 A schematic diagram of the structure of a semiconductor liquid delivery pipeline in winter provided in Embodiment 1 of the present invention;

[0036] Figure 2 A schematic diagram of the shape of a leakage groove in a semiconductor liquid delivery pipeline in winter provided by the first embodiment of the present invention;

[0037] Figure 3 A schematic diagram of the structure of a liquid pipe in a winter delivery pipeline for semiconductor liquid provided in the first embodiment of the present invention, wherein the cold shrink ring is not in contact with the contact sensor;

[0038] Figure 4 A vertical axial cross-sectional view of a liquid pipe in a winter delivery pipeline for semiconductor liquid provided in the first embodiment of the present invention, wherein the cold shrink ring is in contact with the contact sensor;

[0039] Figure 5 This is a flow chart of a method for transporting semiconductor liquid in winter provided in Embodiment 2 of the present invention.

[0040] Reference numerals:

[0041] 1-insulation tube; 2-liquid tube; 201-corrosion resistant layer; 202-insulation inner tube; 203-insulation outer tube; 204-shrink ring; 205-contact sensor; 3-heating tube; 4-leakage detector; 5-leakage tank. DETAILED DESCRIPTION

[0042] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0043] Embodiment 1

[0044] This embodiment provides a winter delivery pipeline for semiconductor liquid, see Figure 1 , including an insulation tube 1, a liquid tube 2 and a plurality of heating tubes 3 arranged in the insulation tube 1, and a fluid supply unit for supplying high-temperature fluid (temperature is 28-30°C) to the heating tube 3. The plurality of heating tubes 3 are arranged around the liquid tube 2 along the circumference of the liquid tube 2. That is to say, the insulation tube 1 is sleeved on the outer wall of the liquid tube 2 and there is a gap between the two, which serves as an accommodating space for the heating tube 3. The heating tube 3 is arranged in the accommodating space and surrounds the liquid tube 2. The side wall of the liquid tube 2 is in direct contact with the side wall of the heating tube 3, and there is a gap between the heating tube 3 and the insulation tube 1.

[0045] Compared with the prior art, the winter transportation pipeline for semiconductor liquid provided in this embodiment replaces the existing simple insulation sleeve with a combination of an insulation tube 1 and a heating tube 3 to insulate and heat the liquid tube 2, thereby being able to more safely, economically and effectively ensure the temperature of the semiconductor liquid during outdoor transportation in winter, with a simple structure and easy practical use.

[0046] Specifically, on the one hand, by adding the heating pipe 3, the side wall of the liquid pipe 2 is in direct contact with the side wall of the heating pipe 3. When the temperature of the liquid in the liquid pipe 2 is lower than the temperature threshold (for example, 20°C), the fluid supply unit can be turned on, and the fluid supply unit passes high-temperature fluid into the heating pipe 3. The heat in the high-temperature fluid is directly transferred to the liquid through the heating pipe 3 and the side wall of the liquid pipe 2, thereby effectively heating the liquid. At the same time, since multiple heating pipes 3 are arranged around the liquid pipe 2 along the circumference of the liquid pipe 2, the liquid pipe 2 can be heated from multiple directions, thereby ensuring the uniformity of the liquid temperature in the liquid pipe 2.

[0047] On the other hand, since there is a gap between the heating pipe 3 and the insulation pipe 1, and since the thermal conductivity of air is low, air insulation can be formed on the outer wall of the liquid pipe 2. In this way, the above-mentioned winter transportation pipeline has multiple functions such as air insulation, insulation by insulation sleeve and heating of the heating pipe 3, so as to cope with the impact of high temperature weather on the liquid temperature.

[0048] Specifically, the thermal insulation pipe 1 includes a rigid pipe and a thermal insulation sleeve (eg, plastic-rubber thermal insulation cotton) wrapping the rigid pipe.

[0049] Exemplarily, the material of the insulation sleeve is one of polyurethane, glass wool or rock wool.

[0050] Considering that the insulation sleeve is the main insulation structure, its thickness is the key to determine the overall insulation performance of the insulation pipe 1. The thickness d of the insulation sleeve is calculated using the following formula:

[0051]

[0052] Where:

[0053] Q is the heat flow, W;

[0054] k is the thermal conductivity of the insulation sleeve, W / (m·k);

[0055] A is the surface area of ​​the insulation sleeve, m 2 ;

[0056] T1 is the inner surface temperature of the insulation sleeve, °C;

[0057] T2 is the outer surface temperature of the insulation sleeve, °C;

[0058] d is the thickness of the insulation sleeve, m.

[0059] It should be noted that the following meteorological conditions and process parameters are taken as an example:

[0060] The outdoor temperature in winter (T2) is -9°C, the required liquid temperature (T1) is 23°C, the insulation sleeve is made of polyurethane material with a thermal conductivity of K = 0.035W / (m·K), and the required heat flux Q is 100W. Through reverse calculation, the thickness of the insulation sleeve can be obtained as d≈35.5mm. In practical applications, it can be rounded up to 40mm for design.

[0061] It is worth noting that since the insulation cover needs to be exposed to the outdoor environment for a long time, it is easy to be damaged. In order to facilitate the replacement of the insulation cover, the insulation cover includes a plurality of insulation sections connected in sequence along the liquid flow direction, and two adjacent insulation sections are detachably connected, for example, by buckles or bolts. In this way, during the replacement of the insulation cover, the damaged insulation section can be separated from the adjacent insulation section, and the damaged insulation section can be removed for replacement.

[0062] As for the structure of the liquid pipe 2 , specifically, it includes a corrosion-resistant layer 201 and a thermal insulation pipe group sleeved on the outer wall of the corrosion-resistant layer 201 .

[0063] In order to be able to further adjust the insulation performance according to the temperature of the liquid pipe 2, the structure of the insulation pipe group, specifically, includes an insulation inner pipe 202, an insulation outer pipe 203, a shrink ring 204, a contact sensor 205 and a heating controller. The shrink ring 204 and the insulation outer pipe 203 are sequentially sleeved on the outer wall of the insulation inner pipe 202 from the inside to the outside. There is a gap between the insulation inner pipe 202 and the insulation outer pipe 203, and the gap serves as a temperature adjustment chamber. The temperature adjustment chamber is connected to the fluid supply unit. There is a gap between the shrink ring 204 and the insulation inner pipe 202. The contact sensor 205 The sensor is arranged in the gap between the shrink ring 204 and the insulation inner tube 202, the detection end of the contact sensor faces the shrink ring 204 and there is a small gap between the shrink ring 204, the shrink ring 204 corresponds to the position of the contact sensor 205, the outer ring surface of the shrink ring 204 and the contact sensor 205 have a small gap, the contact sensor 205 is connected to the heating controller, the heating controller is used to control the opening and closing of the fluid supply unit according to the contact signal of the contact sensor 205, and then control whether the high-temperature fluid is passed into the heating pipe 3 and the temperature regulating cavity. In this way, the structure of the above-mentioned insulation pipe group can make the shrink ring 204 contact or not contact the contact sensor 205 at different temperatures according to the temperature of the liquid, using the principle that the shrink ring 204 has the property of thermal expansion and contraction, so that the shrink ring 204 can be in contact with or not in contact with the contact sensor 205 at different temperatures, so that the temperature of the liquid can be regulated by the heating pipe 3 and the temperature regulating cavity, without having to pass the high-temperature fluid into the heating pipe 3 and the temperature regulating cavity all the time.

[0064] Specifically, when the temperature of the liquid in the liquid pipe 2 is not lower than the temperature threshold (for example, 20° C.), there is a small gap between the inner ring surface of the shrink ring 204 and the contact sensor 205, and the fluid supply unit is in a closed state. Figure 3When the temperature of the liquid in the liquid pipe 2 is lower than the temperature threshold (for example, 20°C), the thermal expansion and contraction ring 204 will contract, and the inner ring surface of the contraction ring 204 will contact the contact sensor 205. The contact sensor 205 sends a contact signal to the heating controller. The heating controller controls the fluid supply unit to pass high-temperature fluid into the temperature regulating chamber and the heating pipe 3. The temperature regulating chamber can directly heat the liquid through the insulation inner pipe 202, and the heating pipe 3 heats the liquid through the insulation outer pipe 203 and the insulation inner pipe 202. See Figure 4 In addition, since the thermal expansion and contraction ring 204 will shrink, the gap between the thermal expansion and contraction ring 204 and the insulation outer tube 203 will increase, which is convenient for the supply of high-temperature liquid.

[0065] It should be noted that in actual applications, after the heating controller receives the contact signal, it can continue to introduce high-temperature fluid into the temperature adjustment chamber and the heating pipe 3 for a period of time (for example, 8 to 15 minutes), and then suspend the supply of high-temperature fluid.

[0066] Exemplarily, the material of the shrink ring 204 is selected from materials with a large thermal expansion coefficient, such as Cu60Zn40, FeNi22Cr3, FeNi20Mn6, FeNi13Mn7 or Mn72Cr18Ni10 alloy.

[0067] In practical applications, for large-flow liquid transportation, the diameter of the liquid pipe 2 will be very large. During the liquid transportation process, there may be a problem of uneven internal temperature, that is, the temperature near the wall of the liquid pipe 2 is higher, and the temperature in the middle of the liquid pipe 2 is lower. If only the temperature near the wall of the liquid pipe 2 exceeds the threshold, there is actually no need to open the fluid supply unit. In order to improve the temperature uniformity of the liquid in the liquid pipe 2, the above-mentioned insulation inner tube 202 is provided with a plurality of spacers, and the plurality of spacers are arranged in sequence along the axial direction of the liquid pipe 2, and the projections of the plurality of spacers on the radial plane of the liquid pipe 2 do not overlap. In this way, by setting a plurality of spacers, the disturbance of the liquid during the transportation process can be increased, and the temperature uniformity of the liquid in the liquid pipe 2 can be improved.

[0068] From the perspective of processing and structural simplification, for example, the number of spacers is four, and along the direction of liquid flow, the four spacers are arranged in sequence with a deflection angle of 45° clockwise or counterclockwise. In this way, on the one hand, by limiting the number of spacers, the insulation inner tube 202 can be effectively simplified and the processing difficulty of the insulation inner tube 202 can be reduced; on the other hand, by limiting the relative angles of the four spacers, the maximum disturbance of the liquid can be achieved on the basis of using four spacers, thereby further improving the temperature uniformity of the liquid in the liquid tube 2.

[0069] Considering that the above-mentioned winter delivery pipeline needs to transport corrosive, toxic, flammable and explosive liquids for a long time, it will cause damage to the wall of the liquid pipe 2, and even liquid leakage. Once leakage occurs, it will cause serious property losses and even casualties. Therefore, the above-mentioned winter delivery pipeline also includes a leakage detector 4 arranged in the insulation tube 1 and located at the bottom of the insulation tube 1, a leakage controller connected to the leakage detector 4, and a leakage warning light connected to the leakage controller. If the liquid pipe 2 leaks, the liquid will flow into the insulation tube 1 and contact the leakage detector 4. The leakage detector 4 sends a leakage signal to the leakage controller. The leakage controller controls the leakage warning light to light up according to the leakage signal and sounds an alarm. In this way, by setting the leakage detector 4, the leakage controller and the leakage warning light connected in sequence, liquid leakage can be discovered in time.

[0070] It is worth noting that since the leakage detector 4 cannot completely cover the entire liquid tube 2, in order to use a limited leakage detector 4 to monitor the entire liquid tube 2, a leakage groove 5 is provided at the bottom of the above-mentioned insulation tube 1, and the leakage detector 4 is provided in the leakage groove 5. In this way, since the leakage groove 5 is the lowest point of the insulation tube 1, if the liquid tube 2 leaks, it will flow to the leakage groove 5 and come into contact with the leakage detector 4 in time.

[0071] In order to facilitate the collection of leaked liquid and improve the accuracy of leakage detection, the shape of the leakage groove 5 is, for example, a wave-shaped bottom along the length direction of the insulation tube 1, see Figure 2 That is, the bottom of the leakage tank 5 includes a plurality of leakage collection sections connected in sequence along the liquid flow direction, the shape of the leakage collection section is an inward concave arc, and the leakage detector 4 is arranged at the lowest point of the inward concave arc. In this way, the leakage tank 5 is divided into multiple sections, and a leakage sensor is arranged in each section. If leakage occurs somewhere in the liquid pipe 2, the operator can make a preliminary judgment on the leakage point according to the position of the liquid pipe 2 corresponding to the leakage sensor, so that the leakage point can be found more timely.

[0072] Exemplarily, the distance between two adjacent liquid leakage detectors 4 is 15-25 m (eg, 15 m, 18 m, 21 m, 23 m or 25 m).

[0073] It is understandable that in order to remove the leaking liquid in time, a leaking liquid discharge hole and a hole cover buckled on the leaking liquid discharge hole are also provided at the lowest point of the above-mentioned concave arc. In this way, once the leaking liquid detector 4 detects the leaking liquid, the hole cover can be opened so that the leaking liquid can be removed from the insulation tube 1 in time to prevent the leaking liquid from corroding other components.

[0074] Embodiment 2

[0075] This embodiment provides a method for delivering semiconductor liquid in winter, using the semiconductor liquid delivery pipeline provided in the first embodiment, see Figure 5 The winter transportation method comprises the following steps:

[0076] When the temperature of the liquid in the liquid pipe 2 is lower than the temperature threshold, the fluid supply unit is turned on;

[0077] The fluid supply unit introduces high-temperature fluid into the heat supply pipe 3;

[0078] The heat in the high-temperature fluid is directly transferred to the liquid through the heating pipe 3 and the side wall of the liquid pipe 2, thereby raising the temperature of the liquid.

[0079] Compared with the prior art, the beneficial effects of the winter delivery method for semiconductor liquid provided in this embodiment are basically the same as the beneficial effects of the winter delivery pipeline for semiconductor liquid provided in Example 1, and are not described in detail here.

[0080] Embodiment 3

[0081] This embodiment provides a semiconductor liquid supply system, including a liquid supply plant and a winter delivery pipeline connected to the liquid outlet of the liquid supply plant. The winter delivery pipeline is the winter delivery pipeline for semiconductor liquid provided in the first embodiment.

[0082] Compared with the prior art, the beneficial effects of the semiconductor liquid supply system provided in this embodiment are basically the same as the beneficial effects of the winter delivery pipeline for semiconductor liquid provided in Example 1, and are not described in detail here.

[0083] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A winter delivery pipeline for semiconductor liquid, characterized in that: It comprises a thermal insulation pipe, a liquid pipe and a plurality of heating pipes arranged in the thermal insulation pipe, and a fluid supply unit for supplying high-temperature fluid to the heating pipes; The insulation tube is sleeved on the outer wall of the liquid tube and there is a gap between the two. The gap between the insulation tube and the liquid tube serves as a accommodating space for the heating pipe. The heating pipe is arranged in the accommodating space and surrounds the liquid tube. The side wall of the liquid tube is in direct contact with the side wall of the heating pipe. There is a gap between the heating pipe and the insulation tube.

2. The winter delivery pipeline for semiconductor liquid according to claim 1, characterized in that: The thermal insulation pipe comprises a rigid pipe and a thermal insulation sleeve which wraps the rigid pipe.

3. The winter delivery pipeline for semiconductor liquid according to claim 2, characterized in that: The thickness of the insulation sleeve is calculated using the following formula: Where: Q is the heat flow, W; k is the thermal conductivity of the insulation sleeve, W / (m·k); A is the surface area of ​​the insulation sleeve, m 2 ; T1 is the inner surface temperature of the insulation sleeve, °C; T2 is the outer surface temperature of the insulation sleeve, °C; d is the thickness of the insulation sleeve, m.

4. The winter delivery pipeline for semiconductor liquid according to claim 2, characterized in that: The material of the thermal insulation sleeve is one of polyurethane, glass wool or rock wool.

5. The winter delivery pipeline for semiconductor liquid according to claim 2, characterized in that: The heat-insulating sleeve comprises a plurality of heat-insulating sections which are sequentially connected along the liquid flow direction, and two adjacent heat-insulating sections are detachably connected.

6. The winter delivery pipeline for semiconductor liquid according to claim 2, characterized in that: The liquid pipe comprises a corrosion-resistant layer and a thermal insulation pipe group sleeved on the outer wall of the corrosion-resistant layer.

7. The semiconductor liquid winter delivery pipeline according to claim 6, characterized in that: The thermal insulation pipe group comprises a thermal insulation inner pipe and a thermal insulation outer pipe. The thermal insulation outer pipe is sleeved on the outer wall of the thermal insulation inner pipe, and a gap is provided between the thermal insulation inner pipe and the thermal insulation outer pipe.

8. The winter transportation pipeline for semiconductor liquid according to claim 7, characterized in that: A plurality of spacers are arranged in the heat-insulating inner tube, and the plurality of spacers are arranged in sequence along the axial direction of the liquid tube, and the projections of the plurality of spacers on the radial plane of the liquid tube do not overlap.

9. A method for transporting semiconductor liquid in winter, characterized in that: Using the winter delivery pipeline for semiconductor liquid according to any one of claims 1 to 8, the winter delivery method comprises the following steps: When the temperature of the liquid in the liquid pipe is lower than the temperature threshold, the fluid supply unit is turned on; The fluid supply unit introduces high-temperature fluid into the heat supply pipe; The heat in the high-temperature fluid is directly transferred to the liquid through the side walls of the heating pipe and the liquid pipe, thereby heating the liquid.

10. A semiconductor liquid supply system, characterized in that: A winter transportation pipeline for semiconductor liquid comprising the semiconductor liquid according to any one of claims 1 to 8.

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