A cooling control device and method

Abstract

This invention discloses a cooling control device and method. The device includes a thermoelectric cooling module, an absorption cooling module, a heat conduction module, and a temperature control module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed within the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module. The temperature control module is used to acquire target parameters and control the input current intensity of the thermoelectric cooling module based on the target parameters. The cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to reduce the body temperature of a critical location of the target object. The target parameters include the body temperature of the critical location of the target object.

Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and more specifically to a cooling control device and method. Background Technology

[0002] In today's fast-paced life, the need for temperature regulation is increasingly prominent, whether in outdoor sports, high-temperature work environments, or the sweltering heat of daily life. Rapid and effective localized cooling solutions are crucial for improving comfort and health.

[0003] Existing technologies often employ thermoelectric or absorption refrigeration to cool the human body. However, traditional thermoelectric refrigeration technologies have low energy conversion efficiency, typically between 5% and 8%, resulting in the loss of most electrical energy as heat, which limits the system's cooling efficiency and energy utilization efficiency. Absorption refrigeration technology relies on an external heat source to drive the refrigerant circulation, which limits its application range, especially for portable cooling systems, where obtaining a stable and suitable heat source to drive refrigeration is a major challenge.

[0004] Therefore, there is an urgent need to provide a new local cooling solution to address the aforementioned technical deficiencies. Summary of the Invention

[0005] The purpose of this invention is to provide a cooling control device and method that can solve the above-mentioned problems in the prior art.

[0006] One aspect of the present invention provides a cooling control device, characterized in that the device comprises: a thermoelectric refrigeration module, an absorption refrigeration module, a heat conduction module, and a temperature control module; one end of the heat conduction module is connected to the hot end of the thermoelectric refrigeration module, and the other end is disposed in the absorption refrigeration module, so as to conduct the heat generated by the hot end to the generator of the absorption refrigeration module;

[0007] The temperature control module is used to collect target parameters and control the input current intensity of the thermoelectric cooling module based on the target parameters; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to reduce the body temperature of the key location of the target object; the target parameters include the body temperature of the key location of the target object.

[0008] Optionally, the temperature control module includes: a sensor and a microcontroller; the sensor is connected to the microcontroller;

[0009] The sensor is used to collect the target parameters and send them to the microcontroller; the microcontroller is used to generate a control voltage based on the target parameters, and the control voltage is used to control the input current intensity of the thermoelectric cooling module.

[0010] Optionally, when the microcontroller generates the control voltage based on the target parameters, it is specifically used to:

[0011] Obtain the first relation table stored in the microcontroller and the historical preferences of the target object;

[0012] The target parameters and historical preferences are analyzed based on a preset cooling algorithm to obtain a cooling strategy; wherein, the cooling strategy includes the desired body temperature at key locations of the target object;

[0013] Select voltage values ​​that match the cooling strategy from the first relationship table;

[0014] The generated value is the control voltage of the selected voltage value.

[0015] Optionally, the sensor is further configured to: after the microcontroller generates a control voltage with a value equal to the selected voltage value, acquire the target parameter in real time, and send the acquired target parameter to the microcontroller.

[0016] The microcontroller is also used for:

[0017] Determine whether the body temperature of the key location of the target object contained in the target parameter is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy;

[0018] If so, a control voltage is generated to make the input current intensity of the thermoelectric cooling module zero;

[0019] If not, then receive the latest target parameters collected by the sensor, and return to execute the step of determining whether the body temperature of the key location of the target object contained in the target parameters is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy.

[0020] Optionally, the device further includes a power supply module, which is connected to the microcontroller and the thermoelectric cooling module respectively;

[0021] The microcontroller is used to transmit the control voltage to the power supply module; the power supply module is used to determine the current intensity output by the power supply module based on the control voltage, and transmit the current of the corresponding intensity to the thermoelectric cooling module.

[0022] Optionally, when determining the output current intensity of the power supply module based on the control voltage, the power supply module is specifically used for:

[0023] Obtain the second relation table stored within the power supply module;

[0024] Select the current intensity that matches the control voltage from the second relationship table and output the current with the corresponding intensity.

[0025] Optionally, the device further includes: an integrated control module connected to the microcontroller;

[0026] The integrated control module is used to receive external parameter adjustment instructions and send the parameter adjustment instructions to the microcontroller; the microcontroller is also used to generate a new control voltage based on the parameter adjustment instructions.

[0027] Optionally, the device further includes: a housing containing the various modules included in the device; wherein the housing is made of a flexible material.

[0028] Optionally, the target parameters may further include: the activity status of the target object, the heart rate of the target object, and the ambient temperature of the target object.

[0029] Another aspect of the present invention provides a cooling control method, the method comprising:

[0030] Obtain the target parameters;

[0031] The input current intensity of the cooling module is determined based on the target parameters, so that a current of the corresponding intensity is input to the cooling module;

[0032] The target parameters include the body temperature of key locations of the target object; the cooling module includes a thermoelectric cooling module, an absorption cooling module, and a heat conduction module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed in the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to lower the body temperature of key locations of the target object.

[0033] Another aspect of the present invention provides a computer device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the cooling control method described in any of the above embodiments.

[0034] Another aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the cooling control method described in any of the above embodiments.

[0035] The cooling control device and method provided by this invention combine thermoelectric refrigeration technology and absorption refrigeration technology. The heat energy generated by thermoelectric refrigeration drives the absorption refrigeration cycle to achieve a dual cooling effect. In addition, for precise control, a temperature control module is also set up. The temperature control module collects target parameters including the body temperature of key locations of the target object, and controls the input current intensity of the thermoelectric refrigeration module based on the target parameters. The thermoelectric refrigeration module generates corresponding heat and cold based on the input current. The heat then causes the absorption refrigeration module to generate corresponding cold. Thus, the body temperature of key locations of the target object is precisely reduced by the cold generated by the cold end of the thermoelectric refrigeration module and the cold generated by the absorption refrigeration module. Attached Figure Description

[0036] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0037] Figure 1 A structural diagram of the cooling control device provided in Embodiment 1 of the present invention is shown;

[0038] Figure 2 A schematic diagram of the cooling control process provided in Embodiment 1 of the present invention is shown;

[0039] Figure 3 A flowchart of the cooling control method provided in Embodiment 2 of the present invention is shown;

[0040] Figure 4 A block diagram of a computer device suitable for implementing a cooling control method, provided in Embodiment 3 of the present invention, is shown. Detailed Implementation

[0041] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0042] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0043] Example 1

[0044] The inventors discovered that thermoelectric refrigeration technology has a relatively low energy conversion efficiency, typically ranging from 5% to 8%. This means that a significant amount of electrical energy is converted into heat and cannot be effectively utilized, resulting in the loss of most electrical energy as heat. Furthermore, the cooling capacity of thermoelectric refrigeration is limited by its heat dissipation efficiency, and its cooling effect is somewhat restricted under high heat loads. Absorption refrigeration, on the other hand, utilizes chemical reactions rather than mechanical compression to achieve cooling, relying on an external heat source to drive the evaporation and condensation of the refrigerant. This limits its application range, especially for portable cooling systems, where obtaining a stable and suitable heat source to drive refrigeration is a major challenge. Based on this, the inventors considered using the waste heat released by thermoelectric refrigeration as a heat source for absorption refrigeration, effectively utilizing the waste heat generated by thermoelectric refrigeration. Combining the two can significantly increase energy efficiency. Therefore, the inventors proposed a cooling control device that utilizes the synergistic effect of thermoelectric cooling and absorption cooling. When the thermoelectric cooling module is working, direct current reaches the module, generating cooling at the cold end. Through an efficient heat exchange design, this cooling is rapidly transferred to the skin contact surface, initiating the cooling process. Simultaneously, the high-temperature heat generated at the hot end is transferred to the absorption cooling stage. The heat released from the hot end of the thermoelectric cooling module serves as the driving force for the absorption cooling cycle, inputting into the absorption cooling module. This heat is used to evaporate the absorbent, driving the physicochemical process and generating cooling in the absorption cycle. This cooling is also directed to the critical parts of the target object requiring cooling through an optimized heat exchange path, enhancing the overall cooling effect. By using the waste heat generated at the hot end of the thermoelectric cooling module as the driving heat source for the absorption cooling cycle, energy complementarity and efficient utilization of the two cooling technologies are achieved. Furthermore, the built-in temperature control module monitors the local skin temperature in real time and automatically adjusts the cooling mode to ensure the cooling effect remains within a comfortable and safe range.

[0045] Specifically, Figure 1 A structural diagram of the cooling control device provided in Embodiment 1 of the present invention is shown. Figure 1As shown, the cooling control device includes: a thermoelectric refrigeration module, an absorption refrigeration module, a heat conduction module, and a temperature control module; one end of the heat conduction module is connected to the hot end of the thermoelectric refrigeration module, and the other end is disposed in the absorption refrigeration module, so as to conduct the heat generated by the hot end to the generator of the absorption refrigeration module;

[0046] The temperature control module is used to collect target parameters and control the input current intensity of the thermoelectric cooling module based on the target parameters; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to reduce the body temperature of the key location of the target object; the target parameters include the body temperature of the key location of the target object.

[0047] The thermoelectric cooling module uses PN-type semiconductor materials. When energized, it generates a thermal-cooling effect across the thermocouple. The cold end is used to remove heat from the critical parts of the target object, while the hot end is used to drive absorption cooling.

[0048] Absorption refrigeration modules utilize the waste heat from thermoelectric refrigeration modules to evaporate the absorbent. Through cyclic absorption and regeneration, the refrigerant is condensed and evaporated, enhancing the overall refrigeration effect.

[0049] Users can activate the cooling mode via the physical control button on the cooling control device or its paired smart device. After activation, the cooling control device automatically performs a simple self-test to confirm that all modules are in normal working order.

[0050] The temperature control module includes a sensor and a microcontroller; the sensor is connected to the microcontroller; wherein the sensor is used to collect the target parameter and send the target parameter to the microcontroller; the microcontroller is used to generate a control voltage based on the target parameter, and the control voltage is used to control the input current intensity of the thermoelectric cooling module.

[0051] The sensor is used to monitor the skin temperature of key areas requiring cooling on the target object in real time, as well as the current ambient temperature. It also collects data on the target object's physical activity and heart rate to more accurately determine cooling needs. In other words, the target parameters also include: the target object's activity level, heart rate, and ambient temperature.

[0052] When generating a control voltage based on the target parameters, the microcontroller is specifically used for:

[0053] Obtain the first relation table stored in the microcontroller and the historical preferences of the target object;

[0054] The target parameters and historical preferences are analyzed based on a preset cooling algorithm to obtain a cooling strategy; wherein, the cooling strategy includes the desired body temperature at key locations of the target object;

[0055] Select voltage values ​​that match the cooling strategy from the first relationship table;

[0056] The generated value is the control voltage of the selected voltage value.

[0057] The microcontroller pre-stores a first relationship table, the historical preferences of the target object, and the cooling algorithm analysis. The first relationship table includes multiple first matching relationships, each of which is a cooling strategy and a voltage value matching relationship.

[0058] When calculating a cooling strategy for a target object, the pre-installed cooling algorithm in the microcontroller analyzes the collected temperature data, current environmental conditions, and activity status, and combines this with the target object's historical preferences to calculate the optimal cooling strategy. A specific cooling strategy can be calculated using existing methods.

[0059] Historical preferences refer to the system's memory of the target user's past usage patterns, such as a preference for lower skin temperature settings when working in hot environments or a need for rapid cooling after exercise. Collecting ambient temperature data aims to adjust the temperature setting to adapt to changes in external temperature and prevent discomfort from excessive cooling. Collecting the target user's activity level and heart rate helps analyze their physical activity level, such as exercise or sweating, and then adaptively adjusts the cooling intensity to maintain comfort.

[0060] Based on the analyzed cooling strategy, the microcontroller generates a precise control voltage, which in turn instructs the power supply module to output a DC current of appropriate strength.

[0061] The device further includes a power supply module, which is connected to the microcontroller and the thermoelectric cooling module respectively; wherein the microcontroller is used to transmit the control voltage to the power supply module; the power supply module is used to determine the current intensity output by the power supply module based on the control voltage, and transmit the current of the corresponding intensity to the thermoelectric cooling module.

[0062] Specifically, the power supply module has a built-in rechargeable battery and power management unit. The power supply module is used to provide DC power to the thermoelectric cooling module. By controlling the intensity of the DC power input to the thermoelectric cooling module, the amount of heat and cold generated by the thermoelectric cooling module can be adjusted.

[0063] When determining the output current intensity of the power supply module based on the control voltage, the power supply module is specifically used for:

[0064] Obtain the second relation table stored within the power supply module;

[0065] Select the current intensity that matches the control voltage from the second relationship table and output the current with the corresponding intensity.

[0066] The power supply module pre-stores a second relationship table, which includes multiple second matching relationships. Each second matching relationship is a specific value of a control voltage and a matching relationship of a current intensity.

[0067] After receiving the control voltage, the power supply module adjusts the intensity of its output current based on the control voltage. The current intensity is directly related to the cooling effect of the thermoelectric cooling module. Precise current control ensures fine-tuning of the cooling capacity within the required range, avoiding energy waste or overcooling.

[0068] The sensor is also used to: after the microcontroller generates a control voltage with a value equal to the selected voltage value, to collect target parameters in real time and send the real-time collected target parameters to the microcontroller;

[0069] The microcontroller is also used for:

[0070] Determine whether the body temperature of the key location of the target object contained in the target parameter is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy;

[0071] If so, a control voltage is generated to make the input current intensity of the thermoelectric cooling module zero;

[0072] If not, then receive the latest target parameters collected by the sensor, and return to execute the step of determining whether the body temperature of the key location of the target object contained in the target parameters is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy.

[0073] Once the body temperature at the target object's critical location drops to the desired temperature, the cooling operation can be stopped to ensure the object's comfort. At this point, the microcontroller generates a control voltage to reduce the input current of the thermoelectric cooling module to zero, which also reduces the output current of the power supply module to zero. This control voltage is then transmitted back to the power supply module, causing it to output zero current (DC). In other words, the power supply module stops supplying power to the thermoelectric cooling module, which no longer generates heat or cold. Consequently, the absorption cooling module also stops generating cold, thus stopping the cooling operation of the cooling control device.

[0074] The device further includes: an integrated control module connected to the microcontroller;

[0075] The integrated control module is used to receive external parameter adjustment instructions and send the parameter adjustment instructions to the microcontroller; the microcontroller is also used to generate a new control voltage based on the parameter adjustment instructions.

[0076] Users can connect to the integrated control module via Bluetooth or Wi-Fi through an app on their smart devices to check the current cooling status at any time and modify preset temperature parameters according to their personal preferences. It supports users to flexibly change the heat regulation mode, such as setting a lower or higher cooling point temperature and adjusting the cooling rate. It also supports energy-saving mode selection, providing an energy-saving mode option to reduce energy consumption during off-peak hours or when there is only a slight cooling need.

[0077] The integrated control module feeds back external parameter adjustment commands to the microcontroller in real time, triggering new calculation and control processes to dynamically adjust cooling capacity and efficiency. This enables personalized and real-time temperature control, ensuring rapid response and accurate adjustment of the cooling control device. Through the integration of wireless communication technology with smart devices, users can not only remotely monitor system status but also flexibly adjust cooling parameters according to personal preferences, enhancing the device's intelligence and improving user experience and system management convenience.

[0078] The device further includes: a housing containing the various modules included in the device; wherein the housing is made of a flexible material.

[0079] By using a flexible shell material, the device seamlessly integrates portable wearable design with efficient thermal management, ensuring portability and comfort while maintaining a close fit to key areas of the target user. This also enhances heat exchange efficiency, enabling the device to achieve efficient cooling in a smaller form factor. The wearable design combined with efficient thermal management guarantees portability and comfort during extended wear, making it suitable for various scenarios such as outdoor sports, high-temperature work environments, and heat-sensitive individuals, thus increasing the device's accessibility and target audience.

[0080] The following details the specific process of the cooling control device cooling critical locations of the target object. For example... Figure 2As shown, the cooling control device is activated. The temperature control module's sensors collect target parameters of the target object, including the body temperature of key locations. The microcontroller of the temperature control module generates a control voltage based on the collected target parameters and transmits the control voltage to the power supply module. The power supply module determines the output DC current intensity based on the control voltage and transmits the corresponding current intensity to the thermoelectric cooling module. The thermoelectric cooling module generates corresponding cooling and heating based on the input current. Through a special setting between the thermoelectric cooling module and the absorption cooling module, the heat generated at the hot end of the thermoelectric cooling module can be conducted to the absorption cooling module, thereby enabling the absorption cooling module to also generate corresponding cooling. Finally, the body temperature of key locations of the target object is reduced based on the cooling generated at the cold end of the thermoelectric cooling module and the cooling generated by the absorption cooling module. Furthermore, the integrated control module can be connected to an external smart application via Bluetooth or Wi-Fi to adjust the cooling parameters.

[0081] Example 2

[0082] Embodiment 2 of the present invention also provides a cooling control method, which corresponds to Embodiment 1 above. The corresponding technical features and effects are not detailed in this embodiment; relevant aspects can be referred to Embodiment 1 above. Specifically, Figure 3 The flowchart of the cooling control method provided in Embodiment 2 of the present invention is shown. This cooling control method is applied to a microcontroller, such as... Figure 3 As shown, the method includes:

[0083] Step S1: Obtain the target parameters;

[0084] Step S2: Determine the input current intensity of the cooling module based on the target parameters, so as to input a current of the corresponding intensity to the cooling module;

[0085] The target parameters include the body temperature of key locations of the target object; the cooling module includes a thermoelectric cooling module, an absorption cooling module, and a heat conduction module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed in the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to lower the body temperature of key locations of the target object.

[0086] Optionally, acquiring target parameters includes: acquiring target parameters collected by the sensor;

[0087] Determining the input current intensity of the cooling module based on the target parameters, and inputting a current of corresponding intensity to the cooling module, includes:

[0088] Generate a control voltage based on the target parameters;

[0089] The control voltage is transmitted to the power supply module so that the power supply module determines the current intensity output by the power supply module based on the control voltage, and transmits the current of the corresponding intensity to the thermoelectric cooling module; wherein, the control voltage is used to control the input current intensity of the thermoelectric cooling module.

[0090] Optionally, generating a control voltage based on the target parameters includes:

[0091] Obtain the pre-stored first relation table and the historical preferences of the target object;

[0092] The target parameters and historical preferences are analyzed based on a preset cooling algorithm to obtain a cooling strategy; wherein, the cooling strategy includes the desired body temperature at key locations of the target object;

[0093] Select voltage values ​​that match the cooling strategy from the first relationship table;

[0094] The generated value is the control voltage of the selected voltage value.

[0095] Optionally, the method further includes:

[0096] After generating a control voltage that is the selected voltage value, the target parameters collected by the sensor in real time are obtained.

[0097] Determine whether the body temperature of the key location of the target object contained in the target parameter is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy;

[0098] If so, a control voltage is generated to make the input current intensity of the thermoelectric cooling module zero;

[0099] If not, then receive the latest target parameters collected by the sensor, and return to execute the step of determining whether the body temperature of the key location of the target object contained in the target parameters is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy.

[0100] Optionally, the power supply module determines the output current intensity based on the control voltage, including:

[0101] Obtain the second relation table stored within the power supply module;

[0102] Select the current intensity that matches the control voltage from the second relationship table and output the current with the corresponding intensity.

[0103] Optionally, the method further includes:

[0104] The system acquires external parameter adjustment commands received by the integrated control module and generates a new control voltage based on the parameter adjustment commands.

[0105] Optionally, the activity status of the target object, the heart rate of the target object, and the ambient temperature of the target object.

[0106] Example 3

[0107] Figure 4 A block diagram of a computer device suitable for implementing a cooling control method, according to Embodiment 3 of the present invention, is shown. In this embodiment, the computer device 400 may be a smartphone, tablet computer, laptop computer, desktop computer, rack server, blade server, tower server, or cabinet server (including independent servers or server clusters composed of multiple servers), etc., that executes a program. Figure 4 As shown, the computer device 400 in this embodiment includes, but is not limited to, a memory 401, a processor 402, and a network interface 403 that are communicatively connected to each other via a system bus. It should be noted that... Figure 4 Only a computer device 400 with components 401-403 is shown; however, it should be understood that it is not required to implement all of the components shown, and more or fewer components may be implemented instead.

[0108] In this embodiment, the memory 403 includes at least one type of computer-readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 401 may be an internal storage unit of the computer device 400, such as the hard disk or memory of the computer device 400. In other embodiments, the memory 401 may also be an external storage device of the computer device 400, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 400. Of course, the memory 401 may also include both the internal storage unit and the external storage device of the computer device 400. In this embodiment, the memory 401 is typically used to store the operating system and various application software installed on the computer device 400, such as the program code for a cooling control method, wherein the cooling control method includes:

[0109] Obtain the target parameters;

[0110] The input current intensity of the cooling module is determined based on the target parameters, so that a current of the corresponding intensity is input to the cooling module;

[0111] The target parameters include the body temperature of key locations of the target object; the cooling module includes a thermoelectric cooling module, an absorption cooling module, and a heat conduction module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed in the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to lower the body temperature of key locations of the target object.

[0112] In some embodiments, processor 402 may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other data processing chip. This processor 402 is typically used to control the overall operation of computer device 400. For example, it performs control and processing related to data interaction or communication with computer device 400. In this embodiment, processor 402 is used to run program code for a cooling control method stored in memory 401.

[0113] In this embodiment, the cooling control method stored in memory 401 can be further divided into one or more program modules and executed by one or more processors (processor 402 in this embodiment) to complete the present invention.

[0114] Network interface 403 may include a wireless network interface or a wired network interface, which is typically used to establish a communication link between computer device 400 and other computer devices. For example, network interface 403 is used to connect computer device 400 to an external terminal via a network, establishing a data transmission channel and communication link between computer device 400 and the external terminal. The network may be an intranet, the Internet, Global System for Mobile Communication (GSM), Wideband Code Division Multiple Access (WCDMA), 5G network, 4G network, Bluetooth, Wi-Fi, or other wireless or wired networks.

[0115] Example 4

[0116] This embodiment also provides a computer-readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, disk, optical disk, server, App application store, etc., which stores a computer program. When the computer program is executed by a processor, it implements the steps of a cooling control method, wherein the cooling control method includes:

[0117] Obtain the target parameters;

[0118] The input current intensity of the cooling module is determined based on the target parameters, so that a current of the corresponding intensity is input to the cooling module;

[0119] The target parameters include the body temperature of key locations of the target object; the cooling module includes a thermoelectric cooling module, an absorption cooling module, and a heat conduction module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed in the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to lower the body temperature of key locations of the target object.

[0120] Obviously, those skilled in the art should understand that the modules or steps of the above-described embodiments of the present invention can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the embodiments of the present invention are not limited to any particular hardware and software combination.

[0121] It should be noted that the sequence numbers of the embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0122] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0123] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A cooling control device, characterized in that, The device includes: a thermoelectric refrigeration module, an absorption refrigeration module, a heat conduction module, and a temperature control module; one end of the heat conduction module is connected to the hot end of the thermoelectric refrigeration module, and the other end is disposed in the absorption refrigeration module, so as to conduct the heat generated by the hot end to the generator of the absorption refrigeration module; The temperature control module is used to collect target parameters and control the input current intensity of the thermoelectric cooling module based on the target parameters; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to reduce the body temperature of the key location of the target object; the target parameters include the body temperature of the key location of the target object.

2. The cooling control device according to claim 1, characterized in that, The temperature control module includes: a sensor and a microcontroller; the sensor is connected to the microcontroller. The sensor is used to collect the target parameters and send them to the microcontroller; the microcontroller is used to generate a control voltage based on the target parameters, and the control voltage is used to control the input current intensity of the thermoelectric cooling module.

3. The cooling control device according to claim 2, characterized in that, When generating a control voltage based on the target parameters, the microcontroller is specifically used for: Obtain the first relation table stored in the microcontroller and the historical preferences of the target object; The target parameters and historical preferences are analyzed based on a preset cooling algorithm to obtain a cooling strategy; wherein, the cooling strategy includes the desired body temperature at key locations of the target object; Select voltage values ​​that match the cooling strategy from the first relationship table; The generated value is the control voltage of the selected voltage value.

4. The cooling control device according to claim 3, characterized in that, The sensor is also used to: after the microcontroller generates a control voltage with a value equal to the selected voltage value, to collect target parameters in real time and send the real-time collected target parameters to the microcontroller; The microcontroller is also used for: Determine whether the body temperature of the key location of the target object contained in the target parameter is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy; If so, a control voltage is generated to make the input current intensity of the thermoelectric cooling module zero; If not, then receive the latest target parameters collected by the sensor, and return to execute the step of determining whether the body temperature of the key location of the target object contained in the target parameters is less than or equal to the body temperature to which the key location of the target object is expected to drop in the cooling strategy.

5. The cooling control device according to claim 2, characterized in that, The device further includes a power supply module, which is connected to the microcontroller and the thermoelectric cooling module respectively; The microcontroller is used to transmit the control voltage to the power supply module; the power supply module is used to determine the current intensity output by the power supply module based on the control voltage, and transmit the current of the corresponding intensity to the thermoelectric cooling module.

6. The cooling control device according to claim 5, characterized in that, When determining the output current intensity of the power supply module based on the control voltage, the power supply module is specifically used for: Obtain the second relation table stored within the power supply module; Select the current intensity that matches the control voltage from the second relationship table and output the current with the corresponding intensity.

7. The cooling control device according to claim 2, characterized in that, The device further includes: an integrated control module connected to the microcontroller; The integrated control module is used to receive external parameter adjustment instructions and send the parameter adjustment instructions to the microcontroller; the microcontroller is also used to generate a new control voltage based on the parameter adjustment instructions.

8. The cooling control device according to claim 1, characterized in that, The device further includes: a housing containing the various modules included in the device; wherein the housing is made of a flexible material.

9. The cooling control device according to any one of claims 1 to 8, characterized in that, The target parameters also include: the activity status of the target object, the heart rate of the target object, and the ambient temperature of the target object.

10. A cooling control method, characterized in that, The method includes: Obtain the target parameters; The input current intensity of the cooling module is determined based on the target parameters, so that a current of the corresponding intensity is input to the cooling module; The target parameters include the body temperature of key locations of the target object; the cooling module includes a thermoelectric cooling module, an absorption cooling module, and a heat conduction module. One end of the heat conduction module is connected to the hot end of the thermoelectric cooling module, and the other end is disposed in the absorption cooling module to conduct the heat generated by the hot end to the generator of the absorption cooling module; the cooling capacity generated by the cold end of the thermoelectric cooling module and the cooling capacity generated by the absorption cooling module are used to lower the body temperature of key locations of the target object.

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