A method, device, computing equipment and medium for calibrating laser processing distance

Abstract

The present disclosure provides a method, device, computing equipment and medium for laser processing distance calibration, which belongs to the field of laser processing technology; the method includes: processing a first test hole at a first position of a calibration piece, moving the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is the position difference between the first position and the first calibration position; processing a second test hole at a second position of the calibration piece, moving the calibration piece based on the processing distance, and obtaining a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; compensating the processing distance according to the relative position difference between the first calibration position and the second calibration position. The processing distance is compensated by relative position deviation to compensate for the offset of the moving axis of the machine tool, thereby improving the calibration accuracy of the processing distance without improving the accuracy of the machine tool axis, and further improving the processing accuracy of the workpiece.

Description

Technical Field

[0001] The present disclosure relates to the field of laser processing technology, and in particular to a method, device, computing equipment and medium for laser processing distance calibration. Background Art

[0002] Compared with traditional machining processes, laser processing has the advantages of less pollution to the workpiece, concentrated energy, small heat-affected area, small processable hole diameter, and good consistency of processing effect, which makes people pay more and more attention to laser processing equipment. In particular, considering the advantages of laser in processing tiny and complex holes, the application field of laser processing technology has become more extensive.

[0003] In laser processing equipment, workpiece positioning needs to be more precise. Considering the limitations of the human eye, the visual positioning system is currently the main one. The visual positioning of laser equipment is mainly composed of computers, optical systems, image acquisition cards, cameras, etc. The visual positioning technology mainly uses the camera to capture the edge points of the workpiece to form a specific outline, thereby simulating and calculating the machine tool coordinates of the center point of the workpiece. The existing visual positioning system is mainly affected by the accuracy of the camera. On the basis of not increasing the cost of the machine tool, the current positioning accuracy of the camera to capture the workpiece is about 10 microns. Summary of the invention

[0004] The present disclosure provides a method, device, computing equipment and medium for laser processing distance calibration. The technical solution of the present disclosure is implemented as follows: In a first aspect, the present disclosure provides a method for laser processing distance calibration, the method comprising: Processing a first test hole at a first position of the calibration piece, and moving the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is a position difference between the first position and the first calibration position; Processing a second test hole at a second position of the calibration piece, moving the calibration piece based on the processing distance, and obtaining a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The processing distance is compensated according to a relative position difference between the first calibrated position and the second calibrated position.

[0005] In a second aspect, the present disclosure provides a device for laser processing distance calibration, the device comprising: a first measuring part, a second measuring part, and a compensation part, wherein: A first measuring part is configured to process a first test hole at a first position of a calibration piece, and move the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is a position difference between the first position and the first calibration position; a second measuring part, configured to process a second test hole at a second position of the calibration piece, move the calibration piece based on the processing distance, and obtain a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The compensation part is configured to compensate the processing distance according to the relative position difference between the first calibration position and the second calibration position.

[0006] In a third aspect, the present disclosure provides a computing device, comprising: a processor and a memory; the processor is used to execute instructions stored in the memory to implement the laser processing distance calibration method described in the first aspect.

[0007] In a fourth aspect, the present disclosure provides a computer-readable storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the method for laser processing distance calibration as described in the first aspect.

[0008] The present disclosure provides a method, device, computing equipment and medium for laser processing distance calibration. The method includes: processing a first test hole at a first position of a calibration piece, moving the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is the position difference between the first position and the first calibration position; processing a second test hole at a second position of the calibration piece, moving the calibration piece based on the processing distance, and obtaining a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; compensating the processing distance according to the relative position difference between the first calibration position and the second calibration position. The processing distance is compensated by the relative position deviation between the first calibration position and the second calibration position, so as to compensate for the offset of the moving axis of the machine tool, thereby improving the calibration accuracy of the processing distance without improving the measurement accuracy of the machine tool, and further improving the processing accuracy of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of an exemplary workpiece processing position provided in the present disclosure.

[0010] Figure 2 A schematic flow chart of a method for laser processing distance calibration provided in the present invention.

[0011] Figure 3A schematic diagram of the test hole position based on a machine tool coordinate system is provided in the present invention.

[0012] Figure 4 A schematic diagram of the test hole position based on the calibration part coordinate system provided in the present invention.

[0013] Figure 5 A schematic diagram of the composition of a laser processing distance calibration device provided in the present invention.

[0014] Figure 6 A schematic diagram of a computing device structure provided for the present invention. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the present disclosure to clearly describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present disclosure are within the scope of protection of the present disclosure.

[0016] The terms "first", "second", etc. in the specification and claims of the present disclosure are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the present disclosure can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. The technical solution in the present disclosure will be clearly and completely described below in conjunction with the drawings in the present disclosure.

[0017] With the development of science and technology, workpieces have higher requirements for workpiece positioning accuracy. Excellent workpiece positioning accuracy and processing distance can ensure that the concentricity deviation error between the laser processing point and the workpiece itself is small, making the workpiece positioning accuracy within 5 microns or even within 3 microns. Figure 1 FIG. 1 is a schematic diagram of an exemplary workpiece processing position. For example, when a concentric hole needs to be processed on a circular workpiece 101, the center position of the circular workpiece 101 needs to be measured at the positioning point A. Figure 1 The dotted line in the middle shows the center position of the circular workpiece 101. Then the circular workpiece 101 is moved to the processing point B, as shown in FIG. Figure 1The position of the circular workpiece 101 shown by the solid line. A concentric circle 102 is processed based on the center position of the circular workpiece 101 shown by the solid line. During the workpiece processing process, the positioning accuracy of the workpiece itself and the relative position difference between the positioning point and the processing point, that is, the accurate control of the processing distance D, are key links in the workpiece processing process, which will directly affect the processing accuracy and finished product yield of the workpiece. In some examples, the processing distance D can be described based on the machine tool coordinate system. For example, the coordinate axis of the machine tool coordinate system is set to be consistent with the moving axis of the machine tool, and the X-axis of the machine tool coordinate system is defined as the horizontal axis direction of the machine tool, and the workbench or tool head of the machine tool moves left and right along the horizontal axis. The Y-axis of the machine tool coordinate system is perpendicular to the X-axis and basically consistent with the longitudinal axis of the machine tool. The workbench or tool head of the machine tool moves forward and backward along the longitudinal axis. The Z-axis of the machine tool coordinate system is perpendicular to the XY plane, and the workbench or tool head of the machine tool moves up and down along this axis. The origin of the machine tool coordinate system is at a fixed position of the machine tool, and all other positions are determined relative to this origin. In the machine tool coordinate system, such as Figure 1 As shown, the processing distance D can be described by the processing distance transverse component Dx and the processing distance longitudinal component Dy.

[0018] The movement of the workpiece on the machine tool table is assisted by the machine tool moving axis. Due to the insufficient accuracy of the machine tool moving axis or the error in verticality, when the workpiece is moved from the positioning point to the processing point, there will be an error in the processing distance, making the workpiece processing positioning accuracy fail to meet the requirements. Figure 2 As shown, the present disclosure provides a method for laser processing distance calibration, which can compensate for the processing distance when the workpiece moves without increasing the cost of the machine tool, and perform high-precision movement control of the workpiece from the positioning point to the processing point. The method includes steps S201 to S203.

[0019] S201: machining a first test hole at a first position of a calibration piece, and moving the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a machining distance of the first test hole, wherein the machining distance is a position difference between the first position and the first calibration position; The calibration piece in the present disclosure is a test piece used to measure processing distance, surface flatness, and uniform thickness. The first test hole is processed at the first position of the calibration piece, and the first position can be the center position of the first test hole. The positioning point is a position on the machine tool used to measure the workpiece or the test hole to obtain the calibration position of the workpiece or the test hole, such as the geometric center point as the calibration position. For the test hole being a circular hole, the center point of the circular hole is usually used as the calibration position of the circular hole. The first calibration position of the first test hole can be the position of the center point of the first test hole measured at the positioning point. The processing distance is the position difference between the first position and the first calibration position.

[0020] S202: machining a second test hole at a second position of the calibration piece, moving the calibration piece based on the machining distance, and obtaining a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The second test hole has the same shape and size as the first test hole. The second position is marked in the same way as the first position, and can be the center position of the second test hole. The second test hole is processed at the second position of the calibration piece, and the second test hole cannot completely overlap with the first test hole on the calibration piece, and the relative distance between the two should not affect the measurement of the calibration position of the second test hole. Take the test hole as a circular hole as an example, that is, the distance between the first position and the second position is greater than the radius of the first test hole or the second test hole, so as to ensure that the measurement of the center point of the second test hole is not affected. In some examples, the distance between the first position and the second position is greater than the sum of the radii of the first test hole and the second test hole, so that there is no overlapping part between the contours of the first test hole and the second test hole. After processing the second test hole, the calibration piece is moved according to the processing distance, and the second calibration position of the second test hole is measured. The second calibration position of the second test hole can be the position of the center point of the second test hole. It should be noted that although S202 moves according to the processing distance measured in step S201, due to the existence of movement control errors, there is a certain difference between the actual movement distance and the processing distance measured in step S201, which leads to an error in the distance between the first calibrated position relative to the first position and the distance between the second calibrated position relative to the second position.

[0021] S203: Compensating the processing distance according to the relative position difference between the first calibrated position and the second calibrated position.

[0022] It should be noted that the processing distance is compensated according to the relative position difference between the first calibration position and the second calibration position. Specifically, since there is an error between the distance of the first calibration position relative to the first position and the distance of the second calibration position relative to the second position, it can be understood that there is a difference between the position difference of the second calibration position relative to the first calibration position and the position difference of the second position relative to the first position, so the processing distance can be compensated according to the difference. Specifically, the lateral component of the processing distance can be compensated by the lateral deviation between the first calibration position and the second calibration position, and the longitudinal component of the processing distance can be compensated by the lateral deviation between the first calibration position and the second calibration position.

[0023] It should also be noted that there may be multiple second test holes, and the above operation is repeated for each second test hole to complete multiple compensations of the processing distance, thereby obtaining a higher processing distance calibration accuracy.

[0024] It can be understood that due to the error in the movement process of the calibration part, the deviation in the movement process is compensated according to the deviation between the measured relative position of the second calibration position and the first calibration position relative to the relative position of the second position and the first position, so as to improve the calibration accuracy of the processing distance without improving the measurement accuracy of the machine tool, and further achieve the processing accuracy of the workpiece. Since the calibration process of the processing distance is carried out on the machine tool, it avoids disassembling and assembling the workpiece from the machine tool multiple times, saves the time of the disassembly and assembly process, avoids the introduction of errors caused by disassembly and assembly, simplifies the calibration process, and shortens the calibration process time of the processing distance.

[0025] For the above technical solution, in some examples, the first calibrated position of the first test hole is obtained, and the first calibrated position of the first test hole can be measured by a contact probe.

[0026] The contact probe measuring device has a high-precision trigger probe that can reach below the micron level, with high flexibility and accuracy. The contact measuring device obtains the edge contour of the workpiece through the contact probe and the surface of the workpiece at multiple points, calculates the machine tool coordinates of the center position of the workpiece, and completes the positioning of the workpiece itself. Specifically, there is a closed active circuit inside the probe, which can be connected to a special trigger mechanism. When the probe produces a small swing, it will cause the circuit state to change and send out an acoustic and optical signal to indicate the working state of the probe. The core principle is that there is a highly sensitive switch sensor in the contact measuring device. When the probe contacts the workpiece itself, the sensor sends a switch signal, which is transmitted to the control system. The control system processes the data in the grating counter and finally transmits it to the measurement software. In actual measurement, since the calibration piece has a certain thickness, the first test hole has a certain depth. The contact probe can be installed on the Z axis of the machine tool and move up and down inside the test hole, so that the circular hole can be measured at different depths of the test hole. Taking the test hole as a circular hole as an example, the contact probe is inserted into the test hole to a certain depth, the edge of the first test hole is touched at this depth, the edge contour of the circular hole is drawn, and the center position of the circular hole is further calculated. The use of contact probes to measure the workpiece positioning in machine tool processing makes the positioning accuracy of the workpiece itself higher.

[0027] In some examples, for the above technical solution, to obtain the first calibration position of the first test hole, the target detection depth with the highest repeatability accuracy can be first determined on the calibration piece, and then the first test hole is detected based on the target detection depth to obtain the first calibration position. Similarly, to obtain the second calibration position of the second test hole, the second test hole can also be detected based on the target detection depth to obtain the second calibration position.

[0028] It should be noted that, since the probe is spherical, there may be a large deviation when detecting the geometric center of the test hole at a depth close to both ends of the test hole. Therefore, selecting an appropriate depth to detect the geometric center coordinates of the test hole can improve the positioning accuracy of the test hole. In the present disclosure, the repeatability accuracy is used to describe the consistency and stability of the geometric center coordinates of the test hole measured multiple times at a certain depth in the test hole, and the degree of deviation of the geometric center coordinates measured multiple times can be used for evaluation. By screening the depth that meets the preset conditions of repeatability accuracy as the target detection depth, for example, selecting the candidate detection depth with the highest repeatability accuracy to detect the calibration position of the test hole, the measurement accuracy of the calibration position of the test hole can be improved.

[0029] In some examples, to determine the target detection depth with the highest repeatability positioning accuracy on the calibration piece, multiple candidate detection depths can be first selected according to a set step size in any test hole on the calibration piece; at each candidate detection depth, multiple positionings are performed, and the repeatability positioning accuracy of each candidate detection depth is determined; and the candidate detection depth with the highest repeatability positioning accuracy is used as the target detection depth.

[0030] It should be noted that the test hole used to select the target detection depth can be the first test hole or any test hole on the calibration piece. When selecting the target detection depth, the detection depth can be sampled from one end of the test hole according to the set step length to obtain the candidate detection depth. For each candidate detection depth, the center coordinates of the test hole are detected multiple times at the candidate detection depth, and the repeat positioning accuracy is calculated based on the multiple detection results. The candidate detection depth with the highest repeat positioning accuracy is selected as the target detection depth. In some examples, the thickness of the calibration piece can be selected to match the probe diameter to reduce the number of candidate detection depths, reduce the determination time of the target detection depth, and thus improve the calibration efficiency of the processing distance. For example, when the probe diameter is 0.5mm, a calibration piece with a thickness of 1mm can be selected and the step length is set to 0.1mm. It can be understood that the size of the test hole is related to the number of touches when the geometric center coordinates of the test hole are detected each time. The larger the test hole, the more touches are required to draw the outline of the test hole, and the longer the positioning time is. Therefore, in some examples, the size of the test hole matches the probe diameter to avoid making the center positioning process of the test hole too time-consuming. For example, for a probe with a diameter of 0.5 mm, when the test hole is a circular hole, the diameter of the circular hole can be selected to be 2 mm or 2.3 mm.

[0031] for Figure 2 In the technical solution shown, in some examples, a second test hole is machined at a second position of the calibration piece. In some examples, the calibration piece can be moved along a first coordinate axis of a horizontal movement axis of a machine tool based on the first position to select a second position, and then a second test hole is machined at the second position.

[0032] On the calibration piece, based on the first position, the first coordinate axis of the horizontal movement axis of the machine tool is moved to select the second position. It can be understood that the second position can be selected based on the first position along the X-axis movement of the machine tool coordinate axis, such as Figure 3 The second test hole 302 shown along the X-axis direction is selected based on the position of the first test hole 301 along the X-axis; it can also be selected based on the first position along the Y-axis of the machine tool coordinate axis, such as Figure 3 The position of the second test hole 303 shown along the Y-axis direction is selected based on the position of the first test hole 301 along the Y-axis.

[0033] In some examples, compensating the processing distance according to the relative position difference between the first calibrated position and the second calibrated position includes: Compensating the machining distance according to the difference between the coordinate values ​​of the first calibrated position and the second calibrated position on the second coordinate axis of the machine tool coordinate system; The second coordinate axis and the first coordinate axis share the same origin and are arranged vertically.

[0034] It is understandable that, ideally, when the second position is selected based on the first position along the X-axis movement of the machine tool coordinate axis, the first position and the second position have the same Y-axis value in the coordinates of the machine tool coordinate axis, and accordingly, ideally, the Y value of the first calibrated position is the same as that of the second calibrated position. However, when the accuracy of the machine tool moving axis is not enough, there is a deviation between the Y value of the first calibrated position and the second calibrated position, and the processing distance can be compensated based on the deviation to make up for the problem that the machine tool moving axis is not vertical. Similarly, it is understandable that when the second position is selected based on the first position along the Y-axis movement of the machine tool coordinate axis, the processing distance can be compensated by the X value deviation between the first calibrated position and the second calibrated position. The second position is selected by moving along the first coordinate axis of the horizontal moving axis of the machine tool based on the first position, and the processing distance is compensated according to the difference in coordinate values ​​between the first calibrated position and the second calibrated position on the second coordinate axis along the machine tool coordinate system. The processing distance is compensated in one direction each time, which simplifies the calibration process, avoids compensating for both the X-axis direction and the Y-axis direction of the processing distance in one compensation, avoids back and forth adjustments, and improves the calibration efficiency.

[0035] For the above example, the method further includes: determining an offset between the first position and the second position; and compensating the processing distance based on the offset.

[0036] It should be noted that since the second position is selected based on the movement axis of the first position along the machine tool coordinate system, due to the machine tool movement accuracy problem, the actual offset between the second position and the first position also deviates from the expected offset. Therefore, based on the offset compensation processing distance, the offset between the first position and the second position can be measured with high precision, and the difference between the offset and the theoretical control distance can be calculated to compensate for the processing distance.

[0037] In some examples, determining the offset between the first position and the second position includes: obtaining a first coordinate of the first position in a calibration part coordinate system, and a second coordinate of the second position in the calibration part coordinate system; taking the coordinate difference between the first coordinate and the second coordinate as the offset; wherein the coordinate axes of the calibration part coordinate system and the machine tool coordinate system have the same direction.

[0038] Specifically, the calibration coordinate axis with the same direction as the machine tool coordinate axis can be marked on the calibration piece, and the intersection of the coordinate axes is the origin, such as Figure 4 As shown, the X' axis of the calibration part coordinate system corresponds to the X axis of the machine tool coordinate system, and the Y' axis of the calibration part coordinate system corresponds to the Y axis of the machine tool coordinate system. Remove the calibration part, obtain the first coordinate of the first position in the calibration part coordinate system, and the second coordinate of the second position in the calibration part coordinate system through the two-dimensional measuring instrument, and use the coordinate difference between the first coordinate and the second coordinate as the offset. By analyzing the difference between the offset and the expected offset, the processing distance is compensated. For example, the expected offset between the first position and the second position is , the actual offset between the first position and the second position is measured with high precision. ,according to Compensate for machining distance.

[0039] It should be noted that the coordinates of the first position and the second position in the calibration part coordinate system can be measured by a two-dimensional measuring instrument. The two-dimensional measuring instrument converts the optical signal into a digital signal to record the image and the grating scale to record the displacement parameters through a CCD (Charge-Coupled Device) optical sensor, and then uses the processing software to draw and measure according to the recorded data, with high measurement accuracy. When measuring the calibration part by a two-dimensional measuring instrument, the calibration part is removed from the machine tool, and the coordinate values ​​of the first position and the second position in the calibration part coordinate system are measured by the two-dimensional measuring instrument, and then the relative position difference is calculated as the offset. The processing distance is compensated by the difference between the relative position difference in the calibration part coordinate system and the expected offset.

[0040] For the above example, when the second position is selected based on the first position moving along the first coordinate axis of the machine tool coordinate system, it can be understood that the first coordinate axis of the machine tool coordinate system is set corresponding to the first coordinate axis of the calibration part coordinate system, and the processing distance can be compensated according to the difference between the first position and the second position on the second coordinate axis of the calibration part coordinate system.

[0041] It can be understood that when the second position is selected based on the first position along the Y-axis movement of the machine tool coordinate system, the processing distance can be compensated by the difference between the first position and the second position based on the X'-axis value of the calibration part coordinate system. When the second position is selected based on the first position along the X-axis movement of the machine tool coordinate system, the processing distance can be compensated by the difference between the first position and the second position based on the Y'-axis value of the calibration part coordinate system. By compensating for the processing distance with higher-precision measurement by the two-dimensional measuring instrument, the calibration accuracy of the processing distance can be improved without improving the measurement accuracy of the machine tool. Since the calibration part needs to be removed from the machine tool workbench for measurement using a two-dimensional measuring instrument, it will inevitably lead to an increase in the complexity of the operation. The present disclosure can achieve a higher calibration accuracy and shorten the calibration process of the processing distance by performing a preliminary calibration of the processing distance based on the machine tool and compensating again using the two-dimensional measuring instrument.

[0042] The above method is described below through an embodiment. Select a calibration piece with a flat surface and a thickness of 1mm, and process a 2.3mm non-tapered circular hole under the laser processing equipment. Move the calibration piece under the contact probe, put the probe into the inner circle, touch the edge of the circular hole at multiple points to simulate the contour of the circular hole, and calculate the machine tool coordinates of the center point of the circular hole. When the probe is inserted from the surface of the circular hole, select every 0.1mm drop in the Z axis as a candidate detection depth, measure the circular hole at each candidate detection depth, and fit the machine tool coordinates of the center point of the circular hole. Perform multiple measurements for each candidate detection depth, calculate the repeatability accuracy corresponding to each candidate detection depth, and select the candidate detection depth with the highest repeatability accuracy as the target detection depth of the contact device probe.

[0043] like Figure 3 As shown, another calibration sheet 31 with a flat surface and a thickness of 1 mm is selected, and a round straight hole with a diameter of 2.3 mm is processed under the laser processing equipment, as shown in the first test hole 301 marked by the solid line in the figure, and the machine tool coordinates are recorded to obtain the first position Move it under the contact probe, and the calibration piece 31 moves to the position as shown in Figure 3 The first test hole 301 is moved to the position shown by the dotted line 31'. Figure 3 The probe is inserted into the circular hole according to the target detection depth confirmed in the previous step, and the machine tool coordinates of the center point of the circular hole shown in 301' are calculated by the probe touching the circular hole to obtain the first calibration position. , the first calibration position is subtracted from the first position to obtain the processing distance Then, the first calibration position is moved in the reverse direction to the machine tool processing point according to the processing distance, and then based on the position of the first test hole 301, a 2.3 mm round straight hole is processed by moving 3 mm along X. Figure 3 The second test hole 302 along the X-axis direction is shown, and the recorded machine tool coordinates are Based on the position of the first test hole 301, a 2.3 mm round straight hole is processed by moving 3 mm along the Y direction, that is, Figure 3 As shown in the second test hole 303 along the Y-axis direction, the recorded machine tool coordinates are The calibration piece is moved according to the processing distance, and the second test hole 302 along the X-axis direction reaches Figure 3 The position indicated by the dotted line 302' is reached along the Y-axis direction by the second test hole 303. Figure 3 The dotted line in the middle indicates the position 303'. According to the target detection depth, the probe is inserted into the circular hole to measure the machine tool coordinate points of the center of the circles indicated by 302' and 303' respectively. , .pass right To compensate through right It should be noted that the above compensation process can be performed multiple times to adjust the processing distance. Multiple compensation.

[0044] Furthermore, if Figure 4 As shown, a laser is used to process a calibration plate 31 with a calibration plate coordinate axis X' and a calibration plate coordinate axis in the same direction as the machine tool coordinate axis. After the calibration plate is removed, the center coordinates of the first test hole 301, the second test hole 302 along the X-axis direction, and the second test hole 303 along the Y-axis direction in the calibration plate coordinate system are measured by a two-dimensional measuring instrument. , , , calculate and Difference compensation ,calculate and Difference compensation , through multiple compensation, to achieve , Or controlled within the expected accuracy.

[0045] Furthermore, the processing distance after the above compensation is completed is verified by processing the workpiece to ensure the workpiece processing accuracy requirements. A test workpiece is selected and fixed on the machine tool, and the contact probe Z axis is lowered to the optimal depth to measure the outer circle contour, and the machine tool coordinates of the center of the test workpiece are calculated. Move to the laser processing head according to the completed compensated processing distance, and then process a cross and a circular ring parallel to the machine tool coordinate axis in the center of the workpiece. Measure whether the concentric distance between the circular ring and the outer circle of the workpiece meets the requirements, for example, less than 3 microns. If less than 3 microns, then start formal workpiece processing. If it is greater than 3 microns, it is necessary to judge the deviation value of X / Y and compensate for the processing distance, so that the concentric distance of the two circles is less than 3 microns.

[0046] Through the above method, the processing distance is compensated by the relative position deviation between the first calibration position and the second calibration position to compensate for the offset of the moving axis during the movement process, thereby improving the calibration accuracy of the processing distance without improving the accuracy of the moving axis of the machine tool, and shortening the calibration process of the processing distance. Taking full advantage of the high-precision and high-sensitivity contact probe, the offset measurement of the first position and the second position by the two-dimensional measuring instrument is used to further optimize the processing distance, so that the workpiece processing positioning accuracy on the laser processing equipment is within 3 microns, and the positioning accuracy is reduced. The verticality requirements of the X-axis, Y-axis, and Z-axis of the machine tool are reduced, and the cost of the machine tool is reduced. During the calibration process, by first determining the target detection depth of the calibration piece, selecting the calibration piece thickness and test hole size that match the detection probe, the calibration time of the processing distance is shortened and the calibration efficiency is improved.

[0047] Based on the same inventive concept as the above technical solution, see Figure 5 , which shows a laser processing distance calibration device 500 provided by the present disclosure, the device 500 comprises: a first measuring part 501, a second measuring part 502, and a compensation part 503; wherein, The first measuring part 501 is configured to process a first test hole at a first position of the calibration piece, and move the calibration piece so that the first test hole coincides with the positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is a position difference between the first position and the first calibration position; The second measuring part 502 is configured to process a second test hole at a second position of the calibration piece, move the calibration piece based on the processing distance, and obtain a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The compensation part 503 is configured to compensate the processing distance according to the relative position difference between the first calibration position and the second calibration position.

[0048] In some examples, the second measuring part 502 is configured to move along a first coordinate axis of the machine tool coordinate system based on the first position on the calibration piece to select a second position; A second test hole is machined at a second location.

[0049] In some examples, the second measuring part 502 is configured to compensate the machining distance according to the difference between the coordinate values ​​of the first calibrated position and the second calibrated position along the second coordinate axis of the machine tool coordinate system; The second coordinate axis and the first coordinate axis share the same origin and are arranged vertically.

[0050] In some examples, the compensation portion 503 is configured to determine an offset between the first position and the second position; Compensates machining distance based on offset.

[0051] In some examples, the compensation part 503 is configured to obtain a first coordinate of the first position in the calibration object coordinate system, and a second coordinate of the second position in the calibration object coordinate system; The difference between the first coordinate and the second coordinate is used as an offset; The coordinate axes of the calibration part coordinate system and the machine tool coordinate system have the same direction.

[0052] In some examples, the first measuring part 501 is configured to determine the target detection depth with the highest repeatability positioning accuracy on the calibration piece; The first test hole is detected based on the target detection depth to obtain a first calibration position.

[0053] In some examples, the first measuring part 501 is configured to select a plurality of candidate detection depths in any test hole on the calibration piece according to a set step size; At each candidate detection depth, multiple positioning is performed, and the repeated positioning accuracy of each candidate detection depth is determined; The candidate detection depth with the highest repeated positioning accuracy is taken as the target detection depth.

[0054] In the embodiments of the present disclosure, each module can implement the method for laser processing distance calibration provided in the above method embodiments and can achieve the same technical effect. To avoid repetition, it will not be described here.

[0055] The present disclosure also provides a machine tool processing method, the method comprising: The processing distance is obtained according to the above-mentioned laser processing distance calibration method, wherein the laser processing distance calibration method can implement each process of the laser processing distance calibration method provided in the above-mentioned method embodiment, and can achieve the same technical effect. In order to avoid repetition, it will not be repeated here; the workpiece to be processed is processed according to the processing distance.

[0056] refer to Figure 6, which shows a block diagram of a computing device 60 provided by an exemplary embodiment of the present disclosure. In some examples, the computing device 60 has a communication function and can access a wired network or a wireless network. In some examples, the computing device 60 can receive data based on the wired network or wireless network accessed. It can be understood that the computing device 60 undertakes the calculation and processing work of the technical solution of the present disclosure, and the present disclosure does not limit this.

[0057] like Figure 6 As shown, the computing device 60 in the present disclosure may include one or more of the following components: a processor 610 and a memory 620 .

[0058] Optionally, the processor 610 uses various interfaces and lines to connect various parts of the entire computing device, and executes various functions of the computing device and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 620, and calling data stored in the memory 620. Optionally, the processor 610 can be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 610 can integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), a neural network processor (NPU), and a baseband chip. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content that needs to be displayed on the touch display; the NPU is used to implement artificial intelligence (AI) functions; and the baseband chip is used to process wireless communications. It is understandable that the above baseband chip may not be integrated into the processor 610, but may be implemented by a separate chip.

[0059] The memory 620 may include a random access memory (RAM) or a read-only memory (ROM). Optionally, the memory 620 includes a non-transitory computer-readable storage medium. The memory 620 may be used to store instructions, programs, codes, code sets, or instruction sets. The memory 620 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above various method embodiments, etc.; the data storage area may store data created according to the use of the computing device, etc.

[0060] In addition, those skilled in the art will appreciate that the structure of the computing device shown in the above figures does not constitute a limitation on the computing device, and the computing device may include more or fewer components than shown, or combine certain components, or arrange the components differently. For example, the computing device also includes a display screen, a camera assembly, a microphone, a speaker, a radio frequency circuit, an input unit, a sensor, an audio circuit, a WiFi module, a power supply, a Bluetooth module, and other components, which will not be described in detail here.

[0061] The present disclosure also provides a computer-readable storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the method for laser processing distance calibration for machine tool processing as described in the above embodiments.

[0062] The present disclosure also provides a computer program product, which includes computer instructions stored in a computer-readable storage medium; a processor of a computing device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computing device executes to implement the method of laser processing distance calibration for machine tool processing in the above-mentioned various embodiments.

[0063] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present disclosure can be implemented using hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any media that facilitates the transmission of computer programs from one place to another. Storage media can be any available media that can be accessed by a general or special-purpose computer.

[0064] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0065] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for laser processing distance calibration, characterized in that: The method comprises: Processing a first test hole at a first position of the calibration piece, and moving the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is a position difference between the first position and the first calibration position; Processing a second test hole at a second position of the calibration piece, moving the calibration piece based on the processing distance, and obtaining a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The processing distance is compensated according to a relative position difference between the first calibrated position and the second calibrated position.

2. The method according to claim 1, characterized in that: Processing a second test hole at a second position of the calibration piece includes: On the calibration piece, moving along a first coordinate axis of a machine tool coordinate system based on the first position to select a second position; A second test hole is machined at the second position.

3. The method according to claim 2, characterized in that The compensating the processing distance according to the relative position difference between the first calibrated position and the second calibrated position includes: Compensating the processing distance according to the difference between the coordinate values ​​of the first calibrated position and the second calibrated position on the second coordinate axis of the machine tool coordinate system; The second coordinate axis and the first coordinate axis share the same origin and are arranged vertically.

4. The method according to claim 2, characterized in that: The method further comprises: determining an offset between the first position and the second position; The machining distance is compensated based on the offset.

5. The method according to claim 4, characterized in that The determining the offset between the first position and the second position comprises: Acquire a first coordinate of the first position in a calibration object coordinate system, and a second coordinate of the second position in the calibration object coordinate system; Taking the coordinate difference between the first coordinate and the second coordinate as the offset; Wherein, the coordinate axis directions of the calibration part coordinate system and the machine tool coordinate system are the same.

6. The method according to claim 1, characterized in that The obtaining of the first calibrated position of the first test hole comprises: Determining the target detection depth with the highest repeatability accuracy on the calibration piece; The first test hole is detected based on the target detection depth to obtain the first calibration position.

7. The method according to claim 6, characterized in that Determining the target detection depth with the highest repeatability positioning accuracy on the calibration piece includes: Selecting a plurality of candidate detection depths in any test hole on the calibration piece according to a set step length; Performing multiple positioning at each candidate detection depth, and determining the repeated positioning accuracy of each candidate detection depth; The candidate detection depth with the highest repeated positioning accuracy is used as the target detection depth.

8. A device for laser processing distance calibration, characterized in that: The device comprises: a first measuring part, a second measuring part, and a compensation part, wherein: A first measuring part is configured to process a first test hole at a first position of a calibration piece, and move the calibration piece so that the first test hole coincides with a positioning point, so as to obtain a first calibration position and a processing distance of the first test hole, wherein the processing distance is a position difference between the first position and the first calibration position; a second measuring part, configured to process a second test hole at a second position of the calibration piece, move the calibration piece based on the processing distance, and obtain a second calibration position of the second test hole, wherein the first test hole and the second test hole have the same shape and size; The compensation part is configured to compensate the processing distance according to the relative position difference between the first calibration position and the second calibration position.

9. A computing device, characterized in that The computing device comprises: a processor and a memory; the processor is used to execute instructions stored in the memory to implement the method for laser processing distance calibration as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores at least one instruction, and the at least one instruction is used to be executed by a processor to implement the method for laser processing distance calibration as described in any one of claims 1 to 7.

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