Elastic interposer and its conductive means

Abstract

The present disclosure provides an elastic interposer, including a flexible substrate and a conductive device. The flexible substrate includes a plurality of circuits, first ends of the circuits are exposed to a first surface of the flexible substrate, and second ends of the circuits are exposed to a second surface of the flexible substrate. The first ends of the circuits are in a first pattern on the first surface, and the second ends of the circuits are in a second pattern on the second surface, the first pattern being different from the second pattern. The conductive device includes a first flexible conductive member and a second flexible conductive member. The first flexible conductive member is disposed on the first surface of the flexible substrate and includes a plurality of first elastic conductive portions. The first elastic conductive portions are electrically connected to the first ends of the circuits. The second flexible conductive member is disposed on the second surface of the flexible substrate and includes a plurality of second elastic conductive portions. The second elastic conductive portions are electrically connected to the second ends of the circuits.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a flexible interposer. In particular, the present disclosure relates to a soft flexible interposer and its conductive device. BACKGROUND

[0002] Various integrated circuit chips need to be electrically tested during the manufacturing process. When the object to be tested needs to be tested with high frequency signals, the shorter the signal transmission path, the more reliable the test results. In the prior art, space transformation substrates or pogo pins are often used to transmit high frequency test signals between the object to be tested and the circuit board.

[0003] However, due to the limitations of the inherent mechanical properties, it is not easy to further reduce the size of the pogo pin, and therefore it is difficult to provide a shorter signal transmission path. In addition, due to the process difficulty and cost considerations, it is also difficult to provide a shorter signal transmission path using a space transformation substrate. Furthermore, since the existing space transformation substrates are made of hard materials, the flexibility and flexibility they can provide are limited, and therefore it is easy to cause damage to the object to be tested when contacting the object to be tested. Accordingly, how to provide a structure with a short signal transmission path and high flexibility to stably transmit high frequency test signals between the object to be tested and the circuit board is a problem that needs to be solved in the art.

[0004] The foregoing "background" description is for the purpose of generally presenting the context of the disclosure. The subject matter of the foregoing "background" description is not admitted to be prior art to the present disclosure, and is not construed as being prior art to the present disclosure, and should not be considered as being part of the prior art that is already known to those skilled in the art. SUMMARY

[0005] Therefore, the purpose of the present disclosure is to provide a relatively short conductive path and a flexible interposer with high flexibility and high flexibility.

[0006] An embodiment of the present disclosure provides a flexible interposer, comprising a flexible substrate and a conductive device. The flexible substrate comprises a plurality of circuits. First ends of the circuits are exposed on a first surface of the flexible substrate, and second ends of the circuits are exposed on a second surface of the flexible substrate. The first ends of the circuits are in a first pattern on the first surface, and the second ends of the circuits are in a second pattern on the second surface, the first pattern being different from the second pattern. The conductive device comprises a first flexible conductive member and a second flexible conductive member. The first flexible conductive member is disposed on the first surface of the flexible substrate and comprises a plurality of first flexible conductive portions. First ends of the first flexible conductive portions are exposed on a third surface of the first flexible conductive member, and second ends of the first flexible conductive portions are exposed on a fourth surface of the first flexible conductive member and electrically connected to the first ends of the circuits. The second flexible conductive member is disposed on the second surface of the flexible substrate and comprises a plurality of second flexible conductive portions. First ends of the second flexible conductive portions are exposed on a fifth surface of the second flexible conductive member and electrically connected to the second ends of the circuits, and second ends of the second flexible conductive portions are exposed on a sixth surface of the second flexible conductive member.

[0007] Another embodiment of the present disclosure provides a conductive device of a flexible interposer, comprising a first flexible conductive member and a second flexible conductive member. The first flexible conductive member is disposed on a first surface of a flexible substrate and comprises a first flexible body and a plurality of first flexible conductive portions. The first flexible conductive portions are disposed on the first flexible body and electrically connected to first ends of a plurality of circuits of the flexible substrate. The second flexible conductive member is disposed on a second surface of the flexible substrate and comprises a second flexible body and a plurality of second flexible conductive portions. The second flexible conductive portions are disposed on the second flexible body and electrically connected to second ends of the circuits of the flexible substrate. The first ends of the circuits are exposed on the first surface and in a first pattern on the first surface, and the second ends of the circuits are exposed on the second surface and in a second pattern on the second surface, the first pattern being different from the second pattern.

[0008] Accordingly, since the elements of the flexible interposer of the present disclosure are all flexible, the overall flexibility and flexibility can be greatly improved, and the two flexible conductive members of the conductive device of the present disclosure can be made in a way of filling metal conductive portions in sheet-like flexible insulating materials (e.g., conductive paste), to provide a relatively short conductive path between the object to be tested and the circuit board.

[0009] The foregoing has outlined rather broadly the technical features of the technology of the present disclosure in order that the detailed description of the present disclosure that follows can be better understood. Additional technical features and advantages of the present disclosure will be described below. The present disclosure can best be understood by referring to the following description in conjunction with the accompanying drawings. Use of the same reference numerals in different drawings indicates similar but not necessarily identical elements. BRIEF DESCRIPTION OF DRAWINGS

[0010] The disclosure will be more fully understood with reference to the following detailed description when taken in conjunction with the accompanying drawings, in which like reference numerals designate similar elements.

[0011] Figure 1A is a schematic view of a flexible interposer of some embodiments of the present disclosure.

[0012] Figure 1B is a schematic view of a flexible interposer of some embodiments of the present disclosure.

[0013] Figure 1C is a top view of a flexible substrate of some embodiments of the present disclosure.

[0014] Figure 1D is a bottom view of a flexible substrate of some embodiments of the present disclosure.

[0015] Figure 2A is a schematic view of a flexible interposer of some embodiments of the present disclosure.

[0016] Figure 2B is a schematic view of a flexible interposer of some embodiments of the present disclosure.

[0017] Figure 2C is a bottom view of a first flexible conductive member of some embodiments of the present disclosure.

[0018] Figure 2D is a top view of a flexible substrate of some embodiments of the present disclosure.

[0019] Figure 2E is a bottom view of a flexible substrate of some embodiments of the present disclosure.

[0020] Figure 2F is a top view of a second flexible conductive member of some embodiments of the present disclosure.

[0021] Figure 2G is a magnified schematic view of a first flexible conductive member of a conductive device of some embodiments of the present disclosure.

[0022] Figure 2HFIG. 1 is a schematic view of a conductive device according to some embodiments of the present disclosure.

[0023] Wherein, the reference numerals are explained as follows:

[0024] 1: elastic interposer

[0025] 11: flexible substrate

[0026] 11S1: first surface

[0027] 11S2: second surface

[0028] 111: circuit

[0029] 111A: first end

[0030] 111B: second end

[0031] 13: conductive device

[0032] 131: first flexible conductive member

[0033] 131C: first elastic conductive portion

[0034] 133: second flexible conductive member

[0035] 133C: second elastic conductive portion

[0036] 91: object to be measured

[0037] 913: contact point

[0038] 93: rigid substrate

[0039] 931: contact point

[0040] A1: unit area

[0041] 2: elastic interposer

[0042] 21: flexible substrate

[0043] 21S1: first surface

[0044] 21S2: second surface

[0045] 211: circuit

[0046] 211A: first end

[0047] 211B: second end

[0048] 23: conductive device

[0049] 231: first flexible conductive member

[0050] 231C: first elastic conductive portion

[0051] 231C1: first end

[0052] 231C2: second end

[0053] 231S1: third surface

[0054] 231S2: fourth surface

[0055] 2311: first soft body

[0056] 233: second soft conductive member

[0057] 233C: second elastic conductive portion

[0058] 233C1: first end

[0059] 233C2: second end

[0060] 233S1: fifth surface

[0061] 233S2: sixth surface

[0062] 2331: second soft body

[0063] 81: object to be measured

[0064] 813: contact point

[0065] 83: hard substrate

[0066] 831: contact point

[0067] A2: unit area

[0068] V2: unit volume

[0069] P21: first pattern

[0070] P22: second pattern

[0071] P23: third pattern

[0072] P24: fourth pattern DETAILED DESCRIPTION

[0073] The following description of the present disclosure accompanied by the drawings incorporated therein and forming a part of the specification, illustrate embodiments of the present disclosure, however, the present disclosure is not limited to the embodiments. In addition, the following embodiments can be appropriately integrated to complete another embodiment.

[0074] "An embodiment," "one embodiment," "an example embodiment," "one example embodiment," "another embodiment," "another example embodiment," and the like as used herein means that a particular implementation can include a particular feature, structure, or characteristic, but every implementation can not necessarily include the particular feature, structure, or characteristic. Furthermore, repeated use of "in one embodiment" does not necessarily refer to the same embodiment, although it can.

[0075] For the purposes of this disclosure the terms "coupled" and "connected," along with their derivatives, can be used. It should be understood that these terms are not intended as synonyms for each other. Rather, particular embodiments can be directed to particular implementations of one or more technologies described herein.

[0076] It should be understood that the following disclosure provides many different embodiments, or examples, for implementing different characteristics of the application. Each of the embodiments or examples can provide for a different way to implement an aspect of the application. Of course, it is contemplated that the application can be practiced without some or all of these specific details. In other instances, well known methods, procedures, components, and networks have not been described in detail so as not to unnecessarily obscure aspects of the application. The application is not limited to the embodiments described and illustrated herein, but can be practiced with modification and alteration within the scope of the appended claims.

[0077] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0078] The elastic interposer of the embodiments of the present disclosure includes a flexible substrate and a conductive device. The conductive device has two flexible conductive members. One of the two flexible conductive members is disposed on one side of the flexible substrate and is used to connect circuit contacts of the flexible substrate and circuit contacts of a device under test. The other flexible conductive member is disposed on the other side of the flexible substrate and is used to connect the circuit contacts of the flexible substrate and circuit contacts of a circuit board. Accordingly, since the flexible substrate and the flexible conductive members of the elastic interposer are flexible, the overall flexibility and softness can be greatly improved. Thus, the impact caused by various physical contacts can be absorbed and buffered to reduce damage to the device under test. In addition, the flexible conductive members are made of a sheet-like flexible insulating material filled with metal conductive parts (for example, conductive paste). This effectively reduces the overall thickness of the elastic interposer and provides a relatively short conductive path between the device under test and the circuit board. The detailed structure and description are as follows.

[0079] Reference Figure 1A and Figure 1B . Figure 1A is a schematic diagram of an elastic interposer 1 of some embodiments of the present disclosure. Figure 1B is another schematic diagram of an elastic interposer 1 of some embodiments of the present disclosure. Specifically, the elastic interposer 1 includes a flexible substrate 11 and a conductive device 13. The flexible substrate 11 includes a plurality of circuits 111 and has a first side 11S1 and a second side 11S2. The conductive device 13 includes a first flexible conductive member 131 and a second flexible conductive member 133. The first flexible conductive member 131 is disposed on the first side 11S1 of the flexible substrate 11 and includes a plurality of first elastic conductive parts 131C. The second flexible conductive member 133 is disposed on the second side 11S2 of the flexible substrate 11 and includes a plurality of second elastic conductive parts 133C. In some embodiments, the first elastic conductive parts 131C can be flexible, and the second elastic conductive parts 133C can also be flexible.

[0080] In some embodiments, the circuits 111 of the flexible substrate 11 have first ends 111A and second ends 111B. The first ends 111A of the circuits 111 are exposed on the first side 11S1 of the flexible substrate 11 and are electrically connected to the first elastic conductive parts 131C of the first flexible conductive member 131. The second ends 111B of the circuits 111 are exposed on the second side 11S2 of the flexible substrate 11 and are electrically connected to the second elastic conductive parts 133C of the second flexible conductive member 133.

[0081] Reference Figure 1C and Figure 1D . Figure 1C is a top view of the flexible substrate 11 of some embodiments of the present disclosure. Figure 1Dis a bottom view of the flexible substrate 11 of some embodiments of the present disclosure. In some embodiments, the first ends 111A of the circuit 111 present a first pattern on the first surface 11S1 of the flexible substrate 11, and the second ends 111B of the circuit 111 present a second pattern on the second surface 11S2 of the flexible substrate 11, the first pattern being different from the second pattern. In other words, the layout and traces of the circuit 111 change from the first ends 111A to the second ends 111B through the flexible substrate 11, and thus the first pattern presented by the first ends 111A on the first surface 11S1 is different from the second pattern presented by the second ends 111B on the second surface 11S2.

[0082] In some embodiments, the density of the first ends 111A of the circuit 111 in a unit area A1 is greater than the density of the second ends 111B of the circuit 111 in the same unit area A1. In other words, the density of the first ends 111A of the circuit 111 is denser in the unit area A1 of the same area range size, and the density of the second ends 111B of the circuit 111 is sparser in the unit area A1 of the same area range size.

[0083] In some embodiments, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern. In some embodiments, excluding the more extreme (farther from the center or more edge) first ends 111A in the first pattern and excluding the more extreme (farther from the center or more edge) second ends 111B in the second pattern, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern. In some embodiments, excluding the dummy contacts in the first pattern and excluding the dummy contacts in the second pattern, the minimum distance between any two first ends 111A in the first pattern is smaller than the minimum distance between any two second ends 111B in the second pattern.

[0084] In some embodiments, the first elastic conductive part 131C of the first flexible conductive member 131 is further used to electrically contact a plurality of contacts 913 of a device under test 91, and the second elastic conductive part 133C of the second flexible conductive member 133 is further used to electrically contact a plurality of contacts 931 of a rigid substrate 93. In this way, the electric path generated by the circuit 111, the first elastic conductive part 131C, and the second elastic conductive part 133C of the elastic interposer 1 can be used to transmit a test signal (for example, a high-frequency test signal) between the device under test 91 and the rigid substrate 93.

[0085] Reference Figure 2A and Figure 2B . Figure 2A is a schematic view of an elastic interposer 2 of some embodiments of the present disclosure. Figure 2Bis another schematic view of an elastic interposer 2 of some embodiments of the present disclosure. Specifically, the elastic interposer 2 includes a flexible substrate 21 and a conductive device 23. The flexible substrate 21 includes a plurality of circuits 211 and has a first surface 21S1 and a second surface 21S2. For example, the flexible substrate 21 can be a flexible circuit board and the plurality of circuits 211 can be conductive traces within the flexible circuit board.

[0086] In some embodiments, the conductive device 23 includes a first flexible conductive member 231 and a second flexible conductive member 233. The first flexible conductive member 231 has a third surface 231S1 and a fourth surface 231S2, and the second flexible conductive member 233 has a fifth surface 233S1 and a sixth surface 233S2. The first flexible conductive member 231 includes a first flexible body 2311 and a plurality of first elastic conductive portions 231C. The first flexible conductive member 231 is disposed on the first surface 21S1 of the flexible substrate 21, and the fourth surface 231S2 of the first flexible conductive member 231 is bonded to the first surface 21S1 of the flexible substrate 21. The second flexible conductive member 233 includes a second flexible body 2311 and a plurality of second elastic conductive portions 233C. The second flexible conductive member 233 is disposed on the second surface 21S2 of the flexible substrate 21, and the fifth surface 233S1 of the second flexible conductive member 233 is bonded to the second surface 21S2 of the flexible substrate 21. In some embodiments, the first elastic conductive portions 231C can be flexible, and the second elastic conductive portions 233C can also be flexible.

[0087] In some embodiments, the plurality of first elastic conductive portions 231C of the first flexible conductive member 231 are disposed within the first flexible body 2311 and have first ends 231C1 and second ends 231C2. The first ends 231C1 and the second ends 231C2 of the plurality of first elastic conductive portions 231C are exposed to the third surface 231S1 and the fourth surface 231S2 of the first flexible body 2311, respectively. The plurality of second elastic conductive portions 233C of the second flexible conductive member 233 are disposed within the second flexible body 2331 and have first ends 233C1 and second ends 233C2. The first ends 233C1 and the second ends 233C2 of the plurality of second elastic conductive portions 233C are exposed to the fifth surface 233S1 and the sixth surface 233S2 of the second flexible body 2331, respectively.

[0088] In some embodiments, the circuit 211 of the flexible substrate 21 has a first end 211A and a second end 211B. The first end 211A of the circuit 211 is exposed to the first surface 21S1 of the flexible substrate 21 and is electrically connected to the second end 231C2 of the first elastic conductive portion 231C of the first flexible conductive member 231. The second end 211B of the circuit 211 is exposed to the second surface 21S2 of the flexible substrate 21 and is electrically connected to the first end 233C1 of the second elastic conductive portion 233C of the second flexible conductive member 233.

[0089] In some embodiments, the first end 231C1 of the first elastic conductive portion 231C of the first flexible conductive member 231 is further electrically connected to a plurality of contacts 813 of a device under test 81, and the second end 233C2 of the second elastic conductive portion 233C of the second flexible conductive member 233 is further electrically connected to a plurality of contacts 831 of a rigid substrate 83. In this way, the circuit 211, the first elastic conductive portion 231C, and the second elastic conductive portion 233C of the elastic interposer 2 can be used to transmit a test signal (e.g., a high-frequency test signal) between the device under test 81 and the rigid substrate 83.

[0090] In some embodiments, when the device under test 81 contacts the first end 231C1 of the first elastic conductive portion 231C, the flexible substrate 21, the first flexible conductive member 231, and the second flexible conductive member 233 are deformed together based on the force applied when the device under test 81 is contacted. In other words, the elastic interposer 2 of the present disclosure can buffer the force applied when the device under test 81 is contacted and maintain good electrical contact through the flexible elements. On the other hand, when the rigid substrate 83 contacts the second end 233C2 of the second elastic conductive portion 233C, the flexible substrate 21, the first flexible conductive member 231, and the second flexible conductive member 233 are deformed together based on the force applied when the rigid substrate 83 is contacted. In other words, the elastic interposer 2 of the present disclosure can buffer the force applied when the rigid substrate 83 is contacted and maintain good electrical contact through the flexible elements.

[0091] In some embodiments, because the size (e.g., the size of the test surface) of the device under test 81 is different from (e.g., smaller than) the size (e.g., the size of the test surface) of the rigid substrate 83, the size (e.g., the area size of the contact with the device under test) of the first flexible conductive member 231 corresponding to the device under test 81 is different from (e.g., smaller than) the size (e.g., the area size of the contact with the rigid substrate) of the second flexible conductive member 233 corresponding to the rigid substrate 83.

[0092] Further, the average interval of the plurality of contacts 813 of the DUT 81 is smaller than the average interval of the plurality of contacts 831 of the rigid substrate 83, in other words, the density per unit area of the plurality of contacts 813 of the DUT 81 is greater than the density per unit area of the plurality of contacts 831 of the rigid substrate 83. Therefore, the plurality of contacts 831 of the rigid substrate 83 having a larger average interval or a smaller density per unit area needs to be corresponded to the plurality of contacts 813 of the DUT 81 having a smaller average interval or a greater density per unit area through the circuit 211 of the flexible substrate 21, and an electrical connection is generated through the corresponding first flexible conductive member 231 (between the flexible substrate 21 and the DUT 81) and the second flexible conductive member 233 (between the flexible substrate 21 and the rigid substrate 83).

[0093] In some embodiments, since the DUT 81 needs to be tested in a test socket (not shown), the size of the first flexible conductive member 231 corresponding to the DUT 81 (for example, the size of the contact surface with the DUT) needs to be less than or equal to the size of the test socket that can receive the DUT 81. Based on the above structure, in some embodiments, the area of the first flexible conductive member 231 in contact with the first surface 21S1 of the flexible substrate 21 is smaller than the area of the second flexible conductive member 233 in contact with the second surface 21S2 of the flexible substrate 21.

[0094] In some embodiments, since the area of a single contact 813 of the DUT 81 is smaller than the area of a single contact 831 of the rigid substrate 83, the following configurations are provided: (1) the first end 231C1 (corresponding to the contact 813) and the second end 231C2 of the first flexible conductive member 231C can have the same area; (2) the first end 233C1 and the second end 233C2 (corresponding to the contact 831) of the second flexible conductive member 233C can have the same area; and (3) in each circuit 211, the area of the first end 211A (corresponding to the second end 231C2 of the first flexible conductive member 231) can be smaller than the area of the corresponding second end 211B (corresponding to the first end 233C1 of the second flexible conductive member 233).

[0095] Based on the above configuration, since: (1) the contact area of the first end 211A of each circuit 211 and the second end 231C2 of the corresponding first flexible conductive member 231 is smaller than the contact area of the second end 211B of each circuit 211 and the first end 233C1 of the corresponding second flexible conductive member 233; and (2) the number of contacts of the first end 211A of each circuit 211 and the second end 231C2 of the corresponding first flexible conductive member 231 is equal to the number of contacts of the second end 211B of each circuit 211 and the first end 233C1 of the corresponding second flexible conductive member 233, the total contact area of the first end 211A of each circuit 211 and the second end 231C2 of the corresponding first flexible conductive member 231 is smaller than the total contact area of the second end 211B of each circuit 211 and the first end 233C1 of the corresponding second flexible conductive member 233, in other words, the area of the first flexible conductive member 231 in electrical contact with the first surface 21S1 of the flexible substrate 21 is smaller than the area of the second flexible conductive member 233 in electrical contact with the second surface 21S2 of the flexible substrate 21.

[0096] Reference is made to Figures 2C to 2F . Figure 2C is a bottom view of the first flexible conductive member 231 of some embodiments of the present disclosure. Figure 2D is a top view of the flexible substrate 21 of some embodiments of the present disclosure. Figure 2E is a bottom view of the flexible substrate 21 of some embodiments of the present disclosure. Figure 2F is a top view of the second flexible conductive member 233 of some embodiments of the present disclosure.

[0097] In some embodiments, the first end 211A of the circuit 211 presents a first pattern P21 on the first surface 21S1 of the flexible substrate 21, and the second end 211B of the circuit 211 presents a second pattern P22 on the second surface 21S2 of the flexible substrate 21, the first pattern P21 being different from the second pattern P22. In other words, the layout and traces of the circuit 211 change from the first end 211A to the second end 211B through the flexible substrate 21, and thus the first pattern P21 presented by the first end 211A on the first surface 21S1 is different from the second pattern P22 presented by the second end 211B on the second surface 21S2.

[0098] In some embodiments, the second ends 231C2 of the plurality of first elastic conductive portions 231C of the first flexible conductive member 231 are exposed to the fourth surface 231S2 of the first flexible body 231 and present a third pattern P23, and the first ends 233C1 of the plurality of second elastic conductive portions 233C of the second flexible conductive member 233 are exposed to the fifth surface 233S1 of the second flexible body 233 and present a second pattern P24.

[0099] In some embodiments, the first pattern P21 and the third pattern P23 are mirror images, and the first ends 211A of the plurality of circuits 211 and the second ends 231C2 of the plurality of first elastic conductive portions 231C are one-to-one corresponding. The second pattern P22 and the fourth pattern P24 are mirror images, and the second ends 211B of the plurality of circuits 211 and the first ends 233C1 of the plurality of second elastic conductive portions 233C are one-to-one corresponding.

[0100] In some embodiments, the point density of the first pattern P21 is greater than the point density of the second pattern P22 in the same area. Naturally, the third pattern P23 is different from the fourth pattern P24, and the point density of the third pattern P23 is greater than the point density of the fourth pattern P24.

[0101] Please refer to Figure 2D and 2E In some embodiments, the density of the first ends 211A of the circuits 211 in a unit area A2 is greater than the density of the second ends 211B of the circuits 211 in the same unit area A1. In other words, the density of the first ends 211A of the circuits 211 is denser, and the density of the second ends 211B of the circuits 211 is sparser in the same area range A2.

[0102] In some embodiments, the minimum distance between any two first ends 211A in the first pattern P21 is less than the minimum distance between any two second ends 211B in the second pattern P22. In some embodiments, excluding the more extreme (far from the center or more edge) first ends 211A in the first pattern P21 and excluding the more extreme (far from the center or more edge) second ends 211B in the second pattern P22, the minimum distance between any two first ends 211A in the first pattern P21 is less than the minimum distance between any two second ends 211B in the second pattern P22. In some embodiments, excluding the pseudo contact points in the first pattern P21 and excluding the pseudo contact points in the second pattern P22, the minimum distance between any two first ends 211A in the first pattern P21 is less than the minimum distance between any two second ends 211B in the second pattern P22.

[0103] Please refer to Figure 2A , Figure 2C and Figure 2F In some embodiments, the density of the first elastic conductive portions 231C in a unit volume V2 is greater than the density of the second elastic conductive portions 233C in the unit volume V2. In other words, the arrangement density of the first elastic conductive portions 231C is denser, and the arrangement density of the second elastic conductive portions 233C is sparser in the same volume range V2.

[0104] Accordingly, by virtue of the aforementioned structural configuration, the elastic interposer 2 of the present disclosure can electrically connect the higher-density contacts on the DUT (e.g., an integrated circuit) to the lower-density contacts on the rigid substrate (e.g., a printed circuit board), thereby achieving a function of space transformation and generating an effective electrical path between the contacts of the DUT and the contacts of the rigid substrate.

[0105] Reference is made to Figure 2G and Figure 2H . Figure 2G is a magnified schematic view of a first soft conductive member 231 of a conductive device 23 of the present disclosure. Figure 2H is a magnified schematic view of a second soft conductive member 233 of the conductive device 23 of the present disclosure. In some embodiments, the first soft conductive member 231 is a conductive paste, and the first soft body 2311 is made of an adhesive material. In some embodiments, the fourth surface 231S2 of the first soft conductive member 231 is an adhesive material. In one embodiment, the fourth surface 231S2 of the first soft conductive member 231 is attached with a first adhesive layer (not shown). In the aforementioned embodiments, the purpose is to enable the first soft conductive member 231 to be detachably (or removably) fixed to the first surface 21S1 of the soft substrate 21. In some embodiments, when the first soft conductive member 231 is detached from the soft substrate 21, the first soft conductive member 231 and the first adhesive layer are integrally detached from the soft substrate 21. In other words, the first soft conductive member 231 and the first adhesive layer are considered as a whole and are simultaneously and integrally detached from the soft substrate 21.

[0106] In some embodiments, when the fourth surface 231S2 of the first soft conductive member 231 is attached with an adhesive layer, the first elastic conductive portion 231C is electrically connected to the first end 211A of the circuit 211 through the adhesive layer. For example, when the adhesive layer is disposed on the fourth surface 231S2 of the first soft conductive member 231, the second end 231C2 of the first elastic conductive portion 231C can be disposed so as to avoid being blocked by the adhesive layer, such that the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered when the first soft conductive member 231 is fixed to the soft substrate 21. For example, the first elastic conductive portion 231C can slightly protrude from the fourth surface 231S2, such that the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not hindered when the first soft conductive member 231 is fixed to the soft substrate 21.

[0107] In some embodiments, each first elastic conductive portion 231C includes a plurality of metal particles (e.g., gold-plated copper particles or gold-plated nickel particles) and is arranged in a columnar shape (e.g., a cylindrical shape, a square columnar shape, etc.) in the first soft body 2311. When the first soft conductive member 231 is adhered to the first surface 21S1 of the flexible substrate 21 through the first soft body 2311, the second end 231C2 of the first elastic conductive portion 231C is aligned with and electrically connected to the first end 211A of the circuit 211 of the flexible substrate 21.

[0108] Similarly, in some embodiments, the second soft conductive member 233 is conductive glue, and the second soft body 2331 is made of adhesive material. In some embodiments, the fifth surface 233S1 of the second soft conductive member 233 is adhesive material. In some embodiments, the fifth surface 233S1 of the first soft conductive member 231 is attached with a second adhesive layer (not shown). In the foregoing embodiments, the purpose is to enable the second soft conductive member 233 to be detachably (or removably) fixed to the second surface 21S2 of the flexible substrate 21. In some embodiments, when the second soft conductive member 233 is separated from the flexible substrate 21, the second soft conductive member 233 is integrally separated from the flexible substrate 21 together with the second adhesive layer. In other words, the second soft conductive member 233 and the second adhesive layer are considered as a whole and are separated from the flexible substrate 21 simultaneously and together.

[0109] In some embodiments, each second elastic conductive portion 233C includes a plurality of metal particles (e.g., gold-plated copper particles or gold-plated nickel particles) and is arranged in a columnar shape (e.g., a cylindrical shape, a square columnar shape, etc.) in the second soft body 2331. When the second soft conductive member 233 is adhered to the second surface 21S2 of the flexible substrate 21 through the second soft body 2331, the first end 233C1 of the second elastic conductive portion 233C is aligned with and electrically connected to the second end 211B of the circuit 211 of the flexible substrate 21.

[0110] In an embodiment, when the fifth surface 233S1 of the second soft conductive member 233 is attached with an adhesive layer, the second elastic conductive portion 233C is electrically connected to the first end 211A of the circuit 211 through the adhesive layer. For example, when the adhesive layer is arranged on the fourth surface 231S2 of the first soft conductive member 231, the second end 231C2 of the first elastic conductive portion 231C can be arranged to avoid being blocked by the first elastic conductive portion 231C when the first soft conductive member 231 is fixed to the flexible substrate 21. For example, the first elastic conductive portion 231C can slightly protrude from the fourth surface 231S2 so that the electrical connection between the first elastic conductive portion 231C and the circuit 211 is not blocked when the first soft conductive member 231 is fixed to the flexible substrate 21.

[0111] In some embodiments, the average size of the first metal particles of the first elastic conductive portion 231C is different from the average size of the second metal particles of the second elastic conductive portion 233C. For example, the first metal particles of the first elastic conductive portion 231C are substantially circular, and each of the first metal particles has a first particle size. Essentially, each of the first metal particles has the same size, and the average size of the first metal particles is approximately the first particle size. The second metal particles of the second elastic conductive portion 233C are substantially circular, and each of the second metal particles has a second particle size. Essentially, each of the second metal particles has the same size, and the average size of the second metal particles is approximately the second particle size. In the aforementioned example, the average size of the first metal particles (i.e., the first particle size) is different from the average size of the second metal particles (i.e., the second particle size).

[0112] By the provision of the aforementioned conductive device 23, when the first flexible conductive member 231 and the second flexible conductive member 233 respectively contact the object 81 and the rigid substrate 83, the first flexible body 2311 of the first flexible conductive member 231 and the second flexible body 2331 of the second flexible conductive member 233 can absorb and buffer the force generated during contact, so as to effectively avoid damage. At the same time, the relatively short electrical path formed by the first elastic conductive portion 231C of the first flexible conductive member 231, the second elastic conductive portion 233C of the second flexible conductive member 233, and the circuit 211 of the contacted flexible substrate 21 can efficiently and correctly transmit the high-frequency test signal transmitted between the object 81 and the rigid substrate 83. In some embodiments, since the first flexible conductive member 231 and the second flexible conductive member 233 can be removed from the flexible substrate 21 and replaced, the use of the elastic interposer 2 will greatly improve the elasticity.

[0113] In some embodiments, the first flexible conductive member 231, the second flexible conductive member 233, and the flexible substrate 21 respectively have a first thickness, a second thickness, and a third thickness. To meet various different use situations or needs, the first thickness, the second thickness, and the third thickness can be adjusted to be the same, different, or partially the same.

[0114] It should be noted that in the aforementioned embodiments and related drawings, the arrangement of the circuits (e.g., the circuits 111, 211) in the flexible substrates (e.g., the flexible substrates 11, 21), the number of the conductive portions (e.g., the first elastic conductive portions 131C, 231C and the second elastic conductive portions 231C, 233C), and the first pattern, the second pattern, the third pattern, and the fourth pattern of the conductive portions or the circuits on each surface are merely examples, and are not intended to limit the embodiments of the present disclosure.

[0115] In summary, the flexible interposer and conductive device of the embodiments of this disclosure can absorb and buffer the impact from various physical contacts through the flexible conductive element, thereby reducing damage to the device under test (DUT) and the rigid substrate. Furthermore, the flexible interposer and conductive device of the embodiments of this disclosure utilize the relatively short electrical path generated by the circuitry of the flexible substrate and the conductive portion of the flexible conductive element to efficiently and accurately transmit high-frequency test signals between the DUT and the rigid substrate, and can avoid the use of conventional structures that solder the space conversion board to the rigid substrate, effectively reducing the impedance caused by the electrical path.

[0116] While this disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions, and alternatives may be made without departing from the spirit and scope of this disclosure as defined in the claims. For example, many of the processes described above may be implemented using different methods, and other processes or combinations thereof may be substituted for many of the processes described above.

[0117] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure of this publication that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used according to this disclosure. Therefore, such processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of the claims of this application.

Claims

1. A flexible intermediary layer, comprising: A flexible substrate containing multiple circuits, wherein, A first terminal of each of the plurality of circuits is exposed on a first surface of the flexible substrate, and a second terminal of each of the plurality of circuits is exposed on a second surface of the flexible substrate. The first terminal of the plurality of circuits has a first pattern on the first surface, and the second terminal of the plurality of circuits has a second pattern on the second surface, the first pattern being different from the second pattern; and A conductive device, comprising: A first flexible conductive element is disposed on a first surface of the flexible substrate and includes a plurality of first elastic conductive portions, wherein first ends of the plurality of first elastic conductive portions are exposed on a third surface of the first flexible conductive element, and second ends of the plurality of first elastic conductive portions are exposed on a fourth surface of the first flexible conductive element and electrically connected to the first terminals of the plurality of circuits; and A second flexible conductive element is disposed on the second surface of the flexible substrate and includes a plurality of second elastic conductive portions, wherein the first ends of the plurality of second elastic conductive portions are exposed on a fifth surface of the second flexible conductive element and electrically connected to the second ends of the plurality of circuits, and the second ends of the plurality of second elastic conductive portions are exposed on a sixth surface of the second flexible conductive element.

2. The elastic intermediary layer as described in claim 1, wherein, The area of ​​the first flexible conductive element in electrical contact with the first surface of the flexible substrate is smaller than the area of ​​the second flexible conductive element in electrical contact with the second surface of the flexible substrate.

3. The elastic intermediary layer as described in claim 1, wherein, The second ends of the plurality of first elastic conductive portions are used to make electrical contact with a plurality of contacts of a test object, and the second ends of the plurality of second elastic conductive portions are used to make electrical contact with a plurality of contacts of a rigid substrate.

4. The elastic intermediary layer as described in claim 3, wherein, When the test object comes into contact with the first end of the plurality of first elastic conductive parts, the flexible substrate, the first flexible conductive element and the second flexible conductive element deform together based on the force exerted when the test object comes into contact.

5. The elastic intermediary layer as described in claim 1, wherein, The first flexible conductive element is detachably fixed to the first side of the flexible substrate, and the second flexible conductive element is detachably fixed to the second side of the flexible substrate.

6. The elastic interlayer as described in claim 5, further comprising a first adhesive layer and a second adhesive layer, wherein, The first adhesive layer is disposed between the first flexible conductive element and the flexible substrate, and the second adhesive layer is disposed between the second flexible conductive element and the flexible substrate.

7. The elastic intermediary layer as described in claim 6, wherein, The first adhesive layer and the first flexible conductive element are integrally separated from the flexible substrate, and the second adhesive layer and the second flexible conductive element are integrally separated from the flexible substrate.

8. The elastic intermediary layer as described in claim 6, wherein, The plurality of first elastic conductive portions pass through the first adhesive layer and are electrically connected to the first terminals of the plurality of circuits, and the plurality of second elastic conductive portions pass through the second adhesive layer and are electrically connected to the second terminals of the plurality of circuits.

9. The elastic intermediary layer as described in claim 1, wherein, The dimensions of the first flexible conductive element are different from those of the second flexible conductive element.

10. A conductive device with an elastic interlayer, the conductive device comprising: A first flexible conductive element is disposed on a first surface of a flexible substrate, comprising: The first soft subject; Multiple first elastic conductive portions are disposed on the first flexible body, wherein, The plurality of first elastic conductive portions are used to electrically connect the first terminals of a plurality of circuits on the flexible substrate; and a second flexible conductive member is disposed on a second surface of the flexible substrate, comprising: A second soft subject; A plurality of second elastic conductive portions are disposed on the second flexible body, wherein the plurality of second elastic conductive portions are used to electrically connect the second ends of the plurality of circuits of the flexible substrate; The first end of the plurality of circuits is exposed on the first surface and has a first pattern on the first surface, and the second end of the plurality of circuits is exposed on the second surface and has a second pattern on the second surface, wherein the first pattern is different from the second pattern.

11. The conductive device as claimed in claim 10, wherein, The plurality of first elastic conductive parts are disposed within the first flexible body, with the first end of the plurality of first elastic conductive parts exposed on a third surface of the first flexible body, and the second end of the plurality of first elastic conductive parts exposed on a fourth surface of the first flexible body.

12. The conductive device as claimed in claim 11, wherein, The plurality of second elastic conductive parts are disposed within the second flexible body, with the first end of the plurality of second elastic conductive parts exposed on a fifth surface of the second flexible body, and the second end of the plurality of second elastic conductive parts exposed on a sixth surface of the second flexible body.

13. The conductive device as claimed in claim 12, wherein, The second ends of the plurality of first elastic conductive portions are used to electrically connect to the first ends of the plurality of circuits of the flexible substrate, and the first ends of the plurality of second elastic conductive portions are used to electrically connect to the second ends of the plurality of circuits of the flexible substrate.

14. The conductive device as claimed in claim 13, wherein, The second ends of the plurality of first elastic conductive portions are exposed on the fourth surface of the first flexible body in a third pattern, and the first ends of the plurality of second elastic conductive portions are exposed on the fifth surface of the second flexible body in a fourth pattern, the third pattern being different from the fourth pattern.

15. The conductive device as claimed in claim 10, wherein, Each first elastic conductive portion is columnar within the first flexible body, and each second elastic conductive portion is columnar within the second flexible body.

16. The conductive device as claimed in claim 10, wherein, Each first elastic conductive part includes a plurality of first metal particles, and each second elastic conductive part includes a plurality of second metal particles.

17. The conductive device as claimed in claim 16, wherein, The average size of the plurality of first metal particles is different from the average size of the plurality of second metal particles.

18. The conductive device as claimed in claim 10, wherein, The first flexible conductive element and the second flexible conductive element are conductive adhesives.

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