Surface muon beam intensity measurement system, method, and storage medium

Abstract

The application discloses a surface muon beam intensity measurement system, method and storage medium, and belongs to the field of beam measurement. The beam intensity measurement system comprises a first detection unit and a second detection unit, which are distributed in parallel to enable the surface muon beam to pass through in turn. A signal acquisition unit is connected with the first detection unit and the second detection unit, and is used for reading corresponding pulse signals of the two. A processing unit is connected with the signal acquisition unit, and is used for fitting the pulse signals corresponding to the first detection unit and the second detection unit to obtain a first fitting signal and a second fitting signal; based on the first fitting signal and the second fitting signal, the signal components of the background positrons and the signal components of the muons are determined; and based on the first fitting signal, the second fitting signal and a reference charge amount, the number of the background positrons and the number of the muons are determined. The application can not only accurately measure the beam intensity of the surface muon beam, but also obtain the content of the background positrons.

Description

Technical Field

[0001] This invention relates to the field of beam measurement, and more specifically to a beam intensity measurement system, method, and storage medium for surface muon beams. Background Technology

[0002] Muon beams generated by high-power proton accelerator target firing can be divided into surface muon beams, decay muon beams, and cloud muon beams. In surface muon beams, there are usually a large number of background positrons with the same momentum as muons. The beam intensity and background positron content of surface muon beams are key parameters for evaluating the performance of muon beams. They not only reflect the working status of beamline equipment, but also provide a reference for the design of muon beam terminal spectrometers.

[0003] In accelerators, inductive methods, such as Faraday cups, are commonly used for beam intensity measurement, which requires high beam intensity. However, since muon beams are secondary beams with relatively weak beam intensity, inductive beam measurement schemes are not feasible. For measuring the intensity of weak beams, a common technique is to use detectors with fast time responses to count the signal pulses. However, thousands or even tens of thousands of muons from a surface muon beam can reach the detector within 100 nanoseconds, causing detector buildup and making it impossible to count the signal pulses.

[0004] Therefore, in existing technologies, the indirect method is mainly used to measure the beam intensity of pulsed surface muon beams. This method involves stopping the muon beam with a sample and allowing it to decay and generate positrons. A positron counter is placed next to the sample. By optimizing the sensitive cell size of the positron counter and the distance between the counter and the sample, signal accumulation in the positron counter can be prevented, thus allowing for the counting and measurement of positrons generated by muon decay. Then, through Monte Carlo simulation, the relationship between the positron counter and the beam intensity is obtained. Finally, the beam intensity of the muon beam is deduced from the experimentally obtained positron count. The indirect method for measuring the beam intensity of pulsed muon beams requires precise Monte Carlo simulation results. However, because the solid angle of positrons emitted from different positions varies, point muons or uniformly distributed surface muons are typically used as input parameters in the simulation. This may lead to deviations between the simulation results and the actual situation, thereby reducing the accuracy of the measured beam intensity. Furthermore, since the background positron content directly affects the experimental results during terminal experiments, the indirect measurement method cannot obtain the background positron content in the beam. Therefore, there is an urgent need for a method that can accurately measure the beam intensity of the surface muon beam and obtain the background positron content. Summary of the Invention

[0005] This application provides a beam current intensity measurement system, method, and storage medium for surface muon beams, which can accurately measure the beam current intensity of surface muon beams and obtain the background positron content. The technical solution is as follows:

[0006] In a first aspect, a beam intensity measurement system for a surface muon beam is provided, comprising:

[0007] A first detection unit and a second detection unit are arranged in parallel so that the surface muon beam can pass through the first detection unit and the second detection unit in sequence. The surface muon beam includes background positrons and muons.

[0008] A signal acquisition unit is connected to the first detection unit and the second detection unit respectively, and the signal acquisition unit is used to read the pulse signals corresponding to the first detection unit and the second detection unit respectively.

[0009] A processing unit, connected to the signal acquisition unit, is configured to: acquire multiple pulse signals corresponding to the first detection unit read by the signal acquisition unit, and multiple pulse signals corresponding to the second detection unit read by the signal acquisition unit; fit the multiple pulse signals corresponding to the first detection unit to obtain a first fitted signal; fit the multiple pulse signals corresponding to the second detection unit to obtain a second fitted signal; determine the signal components of background positrons and muons in the surface muon bundle based on the first fitted signal and the second fitted signal; and determine the number of background positrons and muons in the surface muon bundle based on the first fitted signal, the second fitted signal, and a reference charge, wherein the reference charge is obtained based on prior measurements of cosmic rays.

[0010] Optionally, the first detection unit includes a first plastic scintillator and a first photodetector; the first plastic scintillator is optically coupled to the first photodetector, and the first photodetector is used to detect beam particles on the first plastic scintillator;

[0011] The second detection unit includes a second plastic scintillator and a second photodetector; the second plastic scintillator is optically coupled to the second photodetector, and the second photodetector is used to detect beam particles on the second plastic scintillator.

[0012] Optionally, the muons in the surface muon bundle will remain in the first plastic scintillator due to kinetic energy loss. The beam particles on the first plastic scintillator detected by the first photodetector include muons, background positrons and Michell electrons. The Michell electrons are generated by the decay of muons and can move to the second plastic scintillator.

[0013] The beam particles detected by the second photodetector on the second plastic scintillator include background positrons and Michell electrons.

[0014] Optionally, the processing unit is specifically used for:

[0015] Based on the signal components of the second fitted signal and the Michel electrons in the second plastic scintillator, the signal components of the background positrons in the surface muon bundle are determined.

[0016] Based on the first fitted signal, the signal components of Michel electrons in the first plastic scintillator, and the signal components of background positrons in the surface muon bundle, the signal components of muons in the surface muon bundle are determined.

[0017] Optionally, the processing unit is specifically used for:

[0018] Based on the second fitted signal, the signal composition of Michel electrons in the second plastic scintillator, and the reference charge, the number of background positrons in the surface muon bundle is determined;

[0019] The number of muons in the surface muon bundle is determined based on the first fitted signal, the signal components of Michel electrons in the first plastic scintillator, the second fitted signal, the signal components of Michel electrons in the second plastic scintillator, and the reference charge.

[0020] Optionally, the processing unit is specifically used for:

[0021] Integrating the second fitted signal yields the second charge quantity;

[0022] The third charge quantity is obtained by integrating the signal component of the Michell electrons in the second plastic scintillator.

[0023] The number of background positrons in the surface muon beam is determined based on the second charge, the third charge, and the reference charge.

[0024] Optionally, the processing unit is specifically used for:

[0025] Integrate the first fitted signal to obtain the first charge quantity;

[0026] Integrating the signal component of the Michell electrons in the first plastic scintillator yields the fourth charge quantity;

[0027] The number of muons in the surface muon bundle is determined based on the first charge, the second charge, the third charge, the fourth charge, and the reference charge.

[0028] Optionally, the beam intensity measurement system further includes:

[0029] A light-shielding unit is provided, in which both the first detection unit and the second detection unit are located; the light-shielding unit has a window, the window being oriented relative to the end from which the surface muon beam originates, so that the surface muon beam can reach the first plastic scintillator and the second plastic scintillator;

[0030] A power supply unit is connected to the first photodetector and the second photodetector and is used to supply power to the first photodetector and the second photodetector.

[0031] On the other hand, a method for measuring the beam intensity of a surface muon beam is provided, applied to a processing unit in a beam intensity measurement system for a surface muon beam. The beam intensity measurement system includes a first detection unit and a second detection unit arranged in parallel to allow the surface muon beam to pass through sequentially. The method includes:

[0032] Acquire multiple pulse signals corresponding to the first detection unit and multiple pulse signals corresponding to the second detection unit;

[0033] The first fitted signal is obtained by fitting multiple pulse signals corresponding to the first detection unit.

[0034] The second pulse signal is obtained by fitting multiple pulse signals corresponding to the second detection unit.

[0035] Based on the first fitted signal and the second fitted signal, the signal components of background positrons and muons in the surface muon bundle are determined.

[0036] Based on the first fitted signal, the second fitted signal, and the reference charge, the number of background positrons and the number of muons in the surface muon beam are determined, wherein the reference charge is obtained in advance based on cosmic rays.

[0037] On the other hand, a computer-readable storage medium is provided, on which a computer program is stored, which is executed by a processor to implement the steps of the surface muon beam current intensity measurement method described above.

[0038] On the other hand, a computer program product is provided, the computer program product including a computer program and / or instructions, which, when executed by a processor, implement the steps of the surface muon beam current intensity measurement method described above.

[0039] The technical solutions provided in this application can bring at least the following beneficial effects:

[0040] The surface muon beam intensity measurement system in this embodiment includes a first detection unit and a second detection unit. The surface muon beam passes through the first and second detection units sequentially, enabling the signal acquisition unit to acquire multiple pulse signals corresponding to the first and second detection units, and then fit these signals to obtain a first fitted signal and a second fitted signal. This improves the accuracy of subsequent measurements, specifically, it obtains accurate signal components of background positrons, muons, the number of background positrons, and the number of muons in the surface muon beam, thereby improving the accuracy of beam intensity measurement. Therefore, the technical solution provided in this embodiment can accurately measure the beam intensity of the surface muon beam and obtain the background positron content. Attached Figure Description

[0041] Figure 1 A schematic diagram of the structure of a surface muon beam current intensity measurement system provided in this application embodiment;

[0042] Figure 2 A schematic diagram of another surface muon beam intensity measurement system provided in this application embodiment;

[0043] Figure 3 A schematic diagram of the structure of another surface muon beam intensity measurement system provided in an embodiment of this application;

[0044] Figure 4 A flowchart illustrating a method for measuring the beam intensity of a surface muon beam, provided in an embodiment of this application. Detailed Implementation

[0045] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0046] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0047] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0048] Before providing a detailed explanation of the surface muon beam intensity measurement system and beam intensity measurement method provided in the embodiments of this application, the terminology involved in the embodiments of this application will be explained first.

[0049] Muon: Also known as muon, its mass is between that of a proton and an electron, and its half-life is 2.2 microseconds.

[0050] Beam intensity: Beam intensity refers to the density of particles passing through a point per unit area of ​​a particle beam per unit time. In particle physics, accelerator physics, and other fields, beam intensity is an important physical quantity that directly relates to the acceleration, transmission, and interaction of particle beams with matter.

[0051] Plastic scintillators are solid solutions of organic scintillating materials in plastics. They can be used to detect α, β, γ, fast neutrons, protons, cosmic rays, and fission fragments. They are easy to process into various shapes and have advantages such as non-hygroscopicity, stable performance, radiation resistance, short scintillation decay time, and low price.

[0052] Cosmic rays are high-energy particle streams originating from outer space, primarily composed of protons, alpha particles (helium nuclei), and other heavy nuclei, as well as small amounts of electrons and antimatter particles such as positrons and antiprotons. Cosmic rays pass through the atmosphere and are showered, with muons and electrons being the main particles reaching the Earth's surface.

[0053] The beam intensity measurement system for surface muon bundles provided in this application will now be described in detail.

[0054] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a beam intensity measurement system provided in an embodiment of this application. Please refer to it. Figure 1The beam intensity measurement system includes a first detection unit 1, a second detection unit 2, a signal acquisition unit 3, and a processing unit 4. The first detection unit 1 and the second detection unit 2 are distributed in parallel so that the surface muon beam can pass through the first detection unit 1 and the second detection unit 2 in sequence. The surface muon beam includes background positrons and muons. The signal acquisition unit 3 is connected to the first detection unit 1 and the second detection unit 2 respectively. The signal acquisition unit 3 is used to read the pulse signals corresponding to the first detection unit 1 and the second detection unit 2 respectively. The processing unit 4 is connected to the signal acquisition unit 3 and is used to acquire multiple pulse signals corresponding to the first detection unit 1 and multiple pulse signals corresponding to the second detection unit 2 read by the signal acquisition unit 3. The processing unit 4 fits the multiple pulse signals corresponding to the first detection unit 1 to obtain a first fitted signal and fits the multiple pulse signals corresponding to the second detection unit 2 to obtain a second fitted signal. Then, based on the first fitted signal and the second fitted signal, the signal components of the background positrons and muons in the surface muon beam are determined. After that, based on the first fitted signal, the second fitted signal, and the reference charge, the number of background positrons and the number of muons in the surface muon beam are determined. The reference charge is obtained based on cosmic rays measured in advance.

[0055] from Figure 1 As can be seen, since the first detection unit 1 and the second detection unit 2 are distributed in parallel, and the surface muon beam is emitted from the side closest to the first detection unit 1, after the surface muon beam is emitted, the surface muon beam can pass through the first detection unit 1 and the second detection unit 2 in sequence.

[0056] Furthermore, the signal acquisition unit 3 is connected to the first detection unit 1. Therefore, when the surface muon beam passes through the first detection unit 1, the signal acquisition unit 3 can read the pulse signal corresponding to the first detection unit 1. Similarly, the signal acquisition unit 3 is also connected to the second detection unit 2. Therefore, when the surface muon beam passes through the second detection unit 2, the signal acquisition unit 3 can read the pulse signal corresponding to the second detection unit 2.

[0057] It should be noted that the signal acquisition unit 3 can be a high-precision waveform sampling and readout electronics system, which can improve the accuracy of the readout pulse signal. Alternatively, in application, the signal acquisition unit 3 can also be other signal acquisition devices, which is not limited in this embodiment.

[0058] The processing unit 4 is connected to the signal acquisition unit 3. Thus, after the signal acquisition unit 3 reads the pulse signals corresponding to the first detection unit 1 and the second detection unit 2, the signal acquisition unit 3 can send the read pulse signals to the processing unit 4 so that the processing unit 4 can perform subsequent operations based on the received pulse signals.

[0059] In some embodiments, to improve the accuracy of the measured beam intensity of the surface muon bundle, multiple surface muon bundles to be measured can be emitted. These bundles will then pass through the first detection unit 1 and the second detection unit 2 multiple times, allowing the signal acquisition unit 3 to read multiple pulse signals corresponding to the first detection unit 1 and the second detection unit 2. The processing unit 4 can then acquire the multiple pulse signals corresponding to the first detection unit 1 and fit them to obtain a first fitted signal for the first detection unit 1. Similarly, the processing unit 4 can also acquire the multiple pulse signals corresponding to the second detection unit 2 and fit them to obtain a second fitted signal for the second detection unit 2.

[0060] In addition, in some embodiments, the processing unit 4 can determine a relatively stable segment among the multiple pulse signals corresponding to the first detection unit 1 as a fitting interval, so as to obtain a first fitting signal based on the fitting interval; similarly, the processing unit 4 can also determine a relatively stable segment among the multiple pulse signals corresponding to the second detection unit 2 as a fitting interval, so as to obtain a second fitting signal based on the fitting interval.

[0061] After obtaining the first and second fitted signals, processing unit 4 can determine the signal components of background positrons and muons in the surface muon beam based on the first and second fitted signals. Then, it can also determine the number of background positrons and muons based on the first and second fitted signals and the reference charge. In this way, the beam intensity of the surface muon beam can be accurately measured, and the content of background positrons can be obtained.

[0062] In some embodiments, the reference charge is based on prior measurements of cosmic rays. With the first detection unit 1 and the second detection unit 2 being identical and operating at the same voltage, cosmic ray particles are allowed to pass sequentially through the first detection unit 1 and the second detection unit 2. The signals of the cosmic rays corresponding to the first detection unit 1 and the second detection unit 2 acquired by the signal acquisition unit 3 are identical. Therefore, the signal acquisition unit 3 can acquire the cosmic ray signal and send it to the processing unit 4. The signal processing unit 4 can then integrate the cosmic ray signal to obtain the reference charge. After obtaining the reference charge, the processing unit 4 can store it, enabling subsequent calculations based on the reference charge.

[0063] In some embodiments, please refer to Figure 2The first detection unit 1 includes a first plastic scintillator 11 and a first photodetector 12; the first plastic scintillator 11 is optically coupled to the first photodetector 12, and the first photodetector 12 is used to detect beam particles on the first plastic scintillator 11; the second detection unit 2 includes a second plastic scintillator 21 and a second photodetector 22; the second plastic scintillator 21 is optically coupled to the second photodetector 22, and the second photodetector 22 is used to detect beam particles on the second plastic scintillator 21.

[0064] The parameters of the first plastic scintillator 11 and the second plastic scintillator 21 are identical, and their dimensions must be sufficient to cover the beam spot to avoid affecting subsequent measurement results due to insufficient coverage of the beam spot. For example, the length and width of both the first plastic scintillator 11 and the second plastic scintillator 21 are 150 mm. Furthermore, the relevant parameters of the first photodetector 12 and the second photodetector 22 must also be identical.

[0065] In addition, in some embodiments, in order to improve the light collection efficiency of the first photodetector 12 and the second photodetector 22, a reflective layer can be wrapped around the first plastic scintillator 11 and the second plastic scintillator 21, and silicone grease can be used to optically couple the first plastic scintillator 11 and the first photodetector 12, and silicone grease can be used to optically couple the second plastic scintillator 21 and the second photodetector 22.

[0066] It should be noted that the first photodetector 12 and the second photodetector 22 described above can be PMTs (photomultiplier tubes). A PMT is a special vacuum tube that is sensitive to ultraviolet, visible, and near-infrared light, and it can amplify the incoming light signal, thereby enabling the light signal to be measured. Alternatively, in applications, the first photodetector 12 and the second photodetector 22 can also be other components. The above description uses silicone grease to optically couple the plastic scintillator and the photodetector. Alternatively, in applications, the plastic scintillator and the photodetector can be optically coupled in other ways. In other words, the embodiments of this application do not limit the type of photodetector or the method of optical coupling.

[0067] In some embodiments, muons remain in the first plastic scintillator 11 due to kinetic energy loss. The beam particles detected by the first photodetector 12 on the first plastic scintillator 11 include muons, background positrons, and Michel electrons. Michel electrons are generated by the decay of muons and can move to the second plastic scintillator 21. The beam particles detected by the second photodetector 22 on the second plastic scintillator 21 include background positrons and Michel electrons.

[0068] In other words, since the surface muon beam includes muons, and the muons lose all their kinetic energy during the ionization process and remain in the first plastic scintillator 11, they will not reach the second plastic scintillator 21. Therefore, the beam particles on the first plastic scintillator 11 detected by the first photodetector 12 include muons, while the beam particles on the second plastic scintillator 21 detected by the second photodetector 22 will not include muons.

[0069] Furthermore, since the background positrons in the surface muon beam can be approximated as minimal ionized particles, they have strong penetrating power and will pass through the first plastic scintillator 11 and the second plastic scintillator 21, depositing some energy in both. Therefore, the beam particles detected by the first photodetector 12 on the first plastic scintillator 11 will include background positrons, and the beam particles detected by the second photodetector 22 on the second plastic scintillator 21 will also include background positrons.

[0070] Since the half-life of a muon is 2.2 microseconds, the muons remaining in the first plastic scintillator 11 will decay to produce Michell electrons. The Michell electrons move randomly, thus causing energy deposition in both the first and second plastic scintillators 11 and 21. Therefore, the beam particles detected by the first photodetector 12 on the first plastic scintillator 11 will include Michell electrons, and the beam particles detected by the second photodetector 22 on the second plastic scintillator 21 will also include Michell electrons.

[0071] It should be noted that the thickness of the first plastic scintillator 11 and the second plastic scintillator 21 should be sufficient to ensure that muons can remain inside the first plastic scintillator 11 and that background positrons can pass through. For example, the thickness of both the first plastic scintillator 11 and the second plastic scintillator 21 is 10 mm. This application embodiment does not limit the thickness of the first plastic scintillator 11 and the second plastic scintillator 21.

[0072] Continuing the above description, the energy deposited in the first plastic scintillator 11 is converted into photons and transmitted to the first photodetector 12, thereby enabling the signal acquisition unit 3 to acquire the pulse signal corresponding to the first detection unit 1; similarly, the energy deposited in the second plastic scintillator 21 is also converted into photons and transmitted to the second photodetector 22, thereby enabling the signal acquisition unit 3 to acquire the pulse signal corresponding to the second detection unit 2.

[0073] In some embodiments, the processing unit 4 may determine the signal composition of the background positron based on the second fitted signal and the signal composition of the Michel electrons in the second plastic scintillator 21; and determine the signal composition of the muon based on the first fitted signal, the signal composition of the Michel electrons in the first plastic scintillator 11, and the signal composition of the background positrons.

[0074] As described above, the beam particles on the first plastic scintillator 11 include muons, background positrons, and Michell electrons, while the beam particles on the second plastic scintillator 21 include background positrons and Michell electrons. Therefore, the first fitted signal includes signal components of muons, background positrons, and Michell electrons, and the second fitted signal includes signal components of background positrons and Michell electrons. Furthermore, the signal components of Michell electrons can be directly obtained based on the normalization function and the exponential decay function corresponding to the second fitted signal, and the exponential decay function corresponding to the second fitted signal can be directly obtained based on the second fitted signal. In other words, the signal components of Michell electrons in the second plastic scintillator 21 can be directly obtained. Therefore, the signal components of background positrons in the surface muon beam can be determined by subtracting the signal components of Michell electrons in the second plastic scintillator 21 from the second fitted signal.

[0075] As an example, the signal component of the Michell electrons in the second plastic scintillator 21 can be represented by the following formula (1);

[0076] f M2 (T)=f Beam (t)*f 2D (t) (1)

[0077] Among them, f M2 (T) represents the signal component of the Michell electrons in the second plastic scintillator 21, f Beam (t) represents the normalization function, f 2D (t) represents the exponential decay function corresponding to the second fitted signal.

[0078] Then, the signal component of the background positrons in the surface muon bundle can be represented by the following formula (2);

[0079]

[0080] in, f2(t) represents the signal component of the background positrons, and f2(t) represents the second fitted signal.

[0081] Since background positrons can be approximated as the smallest ions, their energy deposition in the first plastic scintillator 11 is similar to that in the second plastic scintillator 21. Furthermore, the signal components of Michelle electrons in the first plastic scintillator 11 and the second plastic scintillator 21 are similar and can be directly obtained. Therefore, the signal components of muons in the surface muon bundle can be determined by subtracting the signal components of Michelle electrons in the first plastic scintillator 11 from the first fitted signal, and then subtracting the signal components of background positrons from the second fitted signal.

[0082] Continuing with the above example, the signal components of Michell electrons in the first plastic scintillator 11 are similar to those of Michell electrons in the second plastic scintillator 21, and can be represented by the following formula (3);

[0083] f M1 (t)= f Beam (t) * f 1D (t) (3)

[0084] Among them, f M1 (t) represents the signal component of the Michell electrons in the first plastic scintillator 11, f 1D (t) represents the exponential decay function corresponding to the first fitted signal.

[0085] Then, the signal components of muons in the surface muon bundle can be represented by the following formula (4);

[0086]

[0087] in, Let f1(t) represent the signal component of the muon, and let f1(t) represent the first fitted signal.

[0088] In some embodiments, the processing unit 4 may also determine the number of background positrons based on the second fitted signal, the signal composition of Michel electrons in the second plastic scintillator 21, and the reference charge, and determine the number of muons based on the first fitted signal, the signal composition of Michel electrons in the first plastic scintillator 11, the second fitted signal, the signal composition of Michel electrons in the second plastic scintillator 21, and the reference charge.

[0089] As described above, the second fitted signal includes signal components of background positrons and Michell electrons. The Michell electron signal components are directly obtainable, and the reference charge is pre-acquired. Therefore, the number of background positrons can be determined first. Furthermore, the energy deposition of background positrons in the first plastic scintillator 11 and the energy deposition in the second plastic scintillator 21 are similar. Therefore, after determining the number of background positrons corresponding to the second fitted signal, it is assumed that the number of background positrons corresponding to the first fitted signal is the same as the number of background positrons corresponding to the second fitted signal. Thus, based on the number of background positrons corresponding to the second fitted signal, the first fitted signal, the signal components of Michell electrons in the first plastic scintillator 11, and the reference charge, the number of muons is determined.

[0090] In some embodiments, the processing unit 4 may determine the number of background positrons according to the following steps (1)-(3).

[0091] (1) Integrate the second fitted signal to obtain the second charge quantity.

[0092] As described above, the signal components of the second fitted signal include the signal components of background positrons and Michell electrons. Therefore, after integrating the second fitted signal, the resulting second charge includes the charge of background positrons and the charge of Michell electrons in the second plastic scintillator 21.

[0093] (2) Integrate the signal component of the Michel electrons in the second plastic scintillator 21 to obtain the third charge.

[0094] Continuing from the above description, since the signal component of the Michell electrons in the second plastic scintillator 21 can be directly obtained, the charge of the Michell electrons in the second plastic scintillator 21, i.e., the third charge, can be obtained by integrating it.

[0095] (3) Determine the number of background positrons based on the second charge, the third charge, and the reference charge.

[0096] Since the second charge is equal to the sum of the background positron's charge and the third charge, the charge of the background positron can be obtained by subtracting the third charge from the second charge. Furthermore, since cosmic rays are approximately the smallest ionized particles, their energy deposition within the second plastic scintillator 21 is consistent with the energy deposition of the background positrons within the second plastic scintillator 21. Therefore, the number of background positrons can be obtained by dividing the charge of the background positrons by the reference charge.

[0097] As an example, the number of background positrons can be determined according to the following formula (5);

[0098]

[0099] in, Q represents the number of background positrons. 2T Q represents the second charge quantity. 2M Q represents the third charge quantity. c This represents the reference charge.

[0100] In some embodiments, the processing unit 4 may also determine the number of muons according to the following steps (1)-(3).

[0101] (1) Integrate the first fitted signal to obtain the first charge.

[0102] As described above, the signal components of the first fitted signal include the signal components of muons, the signal components of background positrons, and the signal components of Michel electrons. Therefore, after integrating the first fitted signal, the first charge quantity obtained includes the charge quantity of muons, the charge quantity of background positrons, and the charge quantity of Michel electrons in the first plastic scintillator 11.

[0103] (2) Integrate the signal component of the Michel electrons in the first plastic scintillator 11 to obtain the fourth charge quantity.

[0104] Continuing from the above description, since the signal component of the Michell electrons in the first plastic scintillator 11 can be directly obtained, the charge of the Michell electrons in the first plastic scintillator 11, i.e., the fourth charge, can be obtained by integrating it.

[0105] (3) Determine the number of muons based on the first charge, the second charge, the third charge, the fourth charge and the reference charge.

[0106] Since the energy deposition of background positrons in the first plastic scintillator 11 and the energy deposition in the second plastic scintillator 21 are similar, the charge of background positrons in the first charge is the same as the charge of background positrons in the second charge, which is equal to the second charge minus the third charge.

[0107] Furthermore, the first charge is equal to the sum of the muon's charge, the background positron's charge, and the fourth charge. Therefore, the muon's charge can be obtained by subtracting the background positron's charge from the first charge and then subtracting the fourth charge. Also, since cosmic rays are approximately the smallest ionized particles, and the energy deposition of muons within the first plastic scintillator 11 is twice that of cosmic rays within the first plastic scintillator 11, the number of muons can be obtained by dividing the muon's charge by twice the reference charge.

[0108] As an example, the number of background positrons can be determined according to the following formula (6);

[0109]

[0110] in, Q represents the number of muons. 1T Q represents the first charge quantity. 1M Indicates the fourth charge quantity. Q represents the number of background positrons. 2T Q represents the second charge quantity. 2M Q represents the third charge quantity. c This represents the reference charge.

[0111] In some embodiments, please refer to Figure 3 The beam intensity measurement system also includes a light-shielding unit 5 and a power supply unit 6. The first detection unit 1 and the second detection unit 2 are both located within the light-shielding unit 5; the light-shielding unit 5 has a window 51, oriented relative to the end from which the surface muon beam originates, so that the surface muon beam can reach the first plastic scintillator 11 and the second plastic scintillator 21. The power supply unit 6 is connected to the first photodetector 12 and the second photodetector 22, and is used to supply power to the first photodetector 12 and the second photodetector 22.

[0112] To avoid the influence of other photoelectrons in the environment on the measurement results of the beam intensity measurement system, the beam intensity measurement system may also include a light-shielding unit 5, which can surround the first detection unit 1 and the second detection unit 2.

[0113] Furthermore, in order to allow the surface muon beam to reach the first plastic scintillator 11 and the second plastic scintillator 21, the light-shielding unit 5 may also have a window 51 on the side near where the surface muon beam is emitted. Moreover, the window 51 may also contain aluminum foil for shielding, thereby preventing other photoelectrons in the environment from affecting the measurement results.

[0114] It should be noted that the light-shielding unit 5 can be an opaque dark box, or other components capable of providing light shielding. The power supply unit 6 can be a high-voltage system, or other power supply systems. This application embodiment does not limit this.

[0115] The surface muon beam intensity measurement system in this embodiment includes a first detection unit and a second detection unit. The surface muon beam passes through the first and second detection units sequentially, enabling the signal acquisition unit to acquire multiple pulse signals corresponding to the first and second detection units, and then fit these signals to obtain a first fitted signal and a second fitted signal. This improves the accuracy of subsequent measurements, specifically obtaining accurate signal components of background positrons, muons, the number of background positrons, and the number of muons in the surface muon beam, thus enhancing the accuracy of beam intensity measurement. Furthermore, the beam intensity measurement system also includes a light-shielding unit, with both the first and second detection units located within it. This prevents other photoelectrons in the environment from affecting the first and second detection units, further improving the accuracy of beam intensity measurement. In summary, the surface muon beam intensity measurement system provided in this embodiment can accurately measure both the beam intensity and the background positron content of the surface muon beam.

[0116] Next, the method for measuring the beam intensity of the surface muon beam provided in the embodiments of this application will be explained in detail.

[0117] Figure 4 This is a flowchart illustrating a method for measuring the beam intensity of a surface muon beam according to an embodiment of this application. The method is applied to a processing unit within a beam intensity measurement system for a surface muon beam. The beam intensity measurement system includes a first detection unit and a second detection unit arranged in parallel so that the surface muon beam emitted by the beam intensity measurement system can pass through them sequentially. Please refer to... Figure 4 The method includes the following steps:

[0118] Step 401: Acquire multiple pulse signals corresponding to the first detection unit and multiple pulse signals corresponding to the second detection unit.

[0119] The process of step 401 above has been described in detail above. Please refer to the relevant content above. It will not be repeated here.

[0120] Step 402: Fit multiple pulse signals corresponding to the first detection unit to obtain the first fitted signal.

[0121] The process of step 402 above has been described in detail above. Please refer to the relevant content above. It will not be repeated here.

[0122] Step 403: Fit the multiple pulse signals corresponding to the second detection unit to obtain the second fitted signal.

[0123] The process of step 403 above has been described in detail above. Please refer to the relevant content above. It will not be repeated here.

[0124] Step 404: Based on the first and second fitted signals, determine the signal components of background positrons and muons in the surface muon bundle.

[0125] The process of step 404 above has been described in detail above. Please refer to the relevant content above. It will not be repeated here.

[0126] Step 405: Based on the first fitted signal, the second fitted signal, and the reference charge, determine the number of background positrons and the number of muons in the surface muon beam. The reference charge is based on prior measurements of cosmic rays.

[0127] The process of step 405 above has been described in detail above. Please refer to the relevant content above. It will not be repeated here.

[0128] In this embodiment, by fitting multiple pulse signals corresponding to the first detection unit and multiple pulse signals corresponding to the second detection unit, a first fitted signal and a second fitted signal are obtained. This improves the accuracy of subsequent measurement processes, specifically, it obtains accurate signal components of background positrons, muons, the number of background positrons, and the number of muons in the surface muon beam. Therefore, the method provided in this embodiment can accurately measure both the beam intensity of the surface muon beam and the background positron content.

[0129] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0130] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A beam intensity measurement system for a surface muon beam, characterized in that, include: A first detection unit and a second detection unit are arranged in parallel so that the surface muon beam can pass through the first detection unit and the second detection unit in sequence. The surface muon beam includes background positrons and muons. A signal acquisition unit is connected to the first detection unit and the second detection unit respectively, and the signal acquisition unit is used to read the pulse signals corresponding to the first detection unit and the second detection unit respectively. A processing unit, connected to the signal acquisition unit, is configured to: acquire multiple pulse signals corresponding to the first detection unit read by the signal acquisition unit, and multiple pulse signals corresponding to the second detection unit read by the signal acquisition unit; The first fitted signal is obtained by fitting multiple pulse signals corresponding to the first detection unit. The multiple pulse signals corresponding to the second detection unit are fitted to obtain a second fitted signal; based on the first fitted signal and the second fitted signal, the signal components of background positrons and muons in the surface muon beam are determined; based on the first fitted signal, the second fitted signal, and the reference charge, the number of background positrons and the number of muons in the surface muon beam are determined, wherein the reference charge is obtained based on prior measurements of cosmic rays; The first detection unit includes a first plastic scintillator and a first photodetector; the first plastic scintillator is optically coupled to the first photodetector, which is used to detect beam particles on the first plastic scintillator; the second detection unit includes a second plastic scintillator and a second photodetector; the second plastic scintillator is optically coupled to the second photodetector, which is used to detect beam particles on the second plastic scintillator; muons in the surface muon beam remain in the first plastic scintillator due to kinetic energy loss; the beam particles on the first plastic scintillator detected by the first photodetector include muons, background positrons, and Michell electrons, where the Michell electrons are generated by the decay of muons and can move to the second plastic scintillator; the beam particles on the second plastic scintillator detected by the second photodetector include background positrons and Michell electrons.

2. The beam intensity measurement system for surface muon beams as described in claim 1, characterized in that, The processing unit is specifically used for: Based on the signal components of the second fitted signal and the Michel electrons in the second plastic scintillator, the signal components of the background positrons in the surface muon bundle are determined. Based on the first fitted signal, the signal components of Michel electrons in the first plastic scintillator, and the signal components of background positrons in the surface muon bundle, the signal components of muons in the surface muon bundle are determined.

3. The beam intensity measurement system for surface muon beams as described in claim 2, characterized in that, The processing unit is specifically used for: Based on the second fitted signal, the signal composition of Michel electrons in the second plastic scintillator, and the reference charge, the number of background positrons in the surface muon bundle is determined; The number of muons in the surface muon bundle is determined based on the first fitted signal, the signal components of Michel electrons in the first plastic scintillator, the second fitted signal, the signal components of Michel electrons in the second plastic scintillator, and the reference charge.

4. The beam intensity measurement system for surface muon beams as described in claim 3, characterized in that, The processing unit is specifically used for: Integrating the second fitted signal yields the second charge quantity; The third charge quantity is obtained by integrating the signal component of the Michell electrons in the second plastic scintillator. The number of background positrons in the surface muon beam is determined based on the second charge, the third charge, and the reference charge.

5. The beam intensity measurement system for surface muon beams as described in claim 4, characterized in that, The processing unit is specifically used for: Integrate the first fitted signal to obtain the first charge quantity; Integrating the signal component of the Michell electrons in the first plastic scintillator yields the fourth charge quantity; The number of muons in the surface muon bundle is determined based on the first charge, the second charge, the third charge, the fourth charge, and the reference charge.

6. The beam intensity measurement system for surface muon beams as described in claim 1, characterized in that, The beam intensity measurement system also includes: A light-shielding unit is provided, in which both the first detection unit and the second detection unit are located; the light-shielding unit has a window, the window being oriented relative to the end from which the surface muon beam originates, so that the surface muon beam can reach the first plastic scintillator and the second plastic scintillator; A power supply unit is connected to the first photodetector and the second photodetector and is used to supply power to the first photodetector and the second photodetector.

7. A method for measuring the beam intensity of a surface muon beam, applied to a processing unit in a beam intensity measurement system for a surface muon beam, the beam intensity measurement system comprising a first detection unit and a second detection unit arranged in parallel to allow the surface muon beam to pass through sequentially; the method comprising: Acquire multiple pulse signals corresponding to the first detection unit and multiple pulse signals corresponding to the second detection unit; The first fitted signal is obtained by fitting multiple pulse signals corresponding to the first detection unit. The second pulse signal is obtained by fitting multiple pulse signals corresponding to the second detection unit. Based on the first fitted signal and the second fitted signal, the signal components of background positrons and muons in the surface muon bundle are determined. Based on the first fitted signal, the second fitted signal, and the reference charge, the number of background positrons and the number of muons in the surface muon beam are determined, wherein the reference charge is obtained in advance based on cosmic rays. The first detection unit includes a first plastic scintillator and a first photodetector; the first plastic scintillator is optically coupled to the first photodetector, which is used to detect beam particles on the first plastic scintillator; the second detection unit includes a second plastic scintillator and a second photodetector; the second plastic scintillator is optically coupled to the second photodetector, which is used to detect beam particles on the second plastic scintillator; muons in the surface muon beam remain in the first plastic scintillator due to kinetic energy loss; the beam particles on the first plastic scintillator detected by the first photodetector include muons, background positrons, and Michell electrons, where the Michell electrons are generated by the decay of muons and can move to the second plastic scintillator; the beam particles on the second plastic scintillator detected by the second photodetector include background positrons and Michell electrons.

8. A computer-readable storage medium, characterized in that, The medium stores a computer program that can be executed by a processor to implement the method as described in claim 7.

Images