Hybrid chip temperature control method

Abstract

The invention belongs to the field of integrated circuit design and thermal management. The invention discloses a hybrid chip temperature control method, which integrates active predictive thermal management and reactive thermal management, not only can consider the perspectiveness of the predictive thermal management, but also can consider the preciseness of the reactive thermal management, and can maximally control the temperature of a chip under the condition of ensuring the performance of the chip. The temperature of the intelligent control chip does not exceed a temperature threshold value; the invention discloses a hybrid chip temperature control system, which is composed of the hybrid chip temperature control method, a system-on-chip and an instruction temporary storage module, and distributes different tasks to a fixed component within a chip operation cycle to form a set of complete intelligent temperature control system.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit design and thermal management, and in particular to a hybrid temperature control method for a chip. Background Art

[0002] With the advancement of integrated circuit technology, the requirements for chip power consumption performance are getting higher and higher, but too high performance often leads to too high chip temperature, which accelerates the aging of the chip and causes irreversible physical damage. Therefore, how to ensure that the chip temperature does not exceed the threshold while pursuing performance has always received widespread attention.

[0003] In the related art, whether it is the dynamic voltage frequency (DvFS) or the reactive dynamic thermal management method of task migration, the temperature distribution is first obtained within the current operating time period, and the temperature is compared with the temperature threshold before deciding whether to perform thermal management. There is a certain hysteresis. If the peak power consumption comes, the temperature distribution after the operating time period will greatly exceed the temperature threshold, resulting in physical damage to the chip.

[0004] Active predictive thermal management can predict to a certain extent whether the temperature distribution at the next moment will exceed the threshold, thereby adjusting the voltage and frequency in advance to avoid physical damage to the chip. However, due to the existence of errors in the prediction model, there may still be problems after the operating time period, resulting in physical damage to the chip. Summary of the invention

[0005] The present application provides a chip thermal management method to solve the hysteresis problem of the reactive thermal management method and the error problem of the active thermal management method in the related art, and realize hybrid temperature control of the chip, so that the chip always works under the temperature threshold.

[0006] To achieve the above objectives, the present application proposes a chip thermal management method, including the following contents:

[0007] 1. A temperature prediction model based on a specific chip, which inputs the temperature distribution of the current state and the instruction information of the current chip, and outputs the predicted temperature distribution of the next state.

[0008] 2. Active predictive dynamic thermal management based on the temperature prediction model can determine whether dynamic voltage and frequency adjustment is required based on the temperature distribution of the next state predicted by the temperature prediction model.

[0009] 3. If it is determined that dynamic voltage and frequency are required, the chip will run according to the adjusted instruction information; otherwise, the chip will run according to the previous instruction information without change.

[0010] 4. After the chip has been running for a certain period of time according to the instruction information, it will obtain a new temperature distribution. This temperature distribution will be input into the reactive dynamic thermal management module to adjust the instruction information for the next running period. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0012] Figure 1 A structural diagram of a hybrid chip temperature control method provided according to the present application;

[0013] Figure 2 This is the internal structure diagram of the active predictive thermal management module;

[0014] Figure 3 The present invention provides a flow chart of a hybrid chip temperature control method according to the present application. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the present invention.

[0016] The embodiment of the present invention constructs a hybrid chip temperature control system, such as Figure 1 As shown, it includes a system-on-chip (SOC), an instruction temporary storage module, an active predictive thermal management module, and a reactive thermal management module. Step one refers to the system-on-chip (SOC) transmitting the current state instruction information to the instruction temporary storage module; step two refers to the instruction temporary storage module transmitting the current state instruction information stored therein to the active predictive thermal management module; step three refers to the active predictive thermal management module transmitting the optimized instruction information to the system-on-chip (SOC), so that it runs according to the optimized instruction information; step four refers to the instruction temporary storage module transmitting the instruction information currently stored therein to the reactive thermal management module; step five refers to the reactive thermal management module transmitting the optimized instruction information to the system-on-chip (SOC), so that it runs according to the optimized instruction information.

[0017] The specific composition of the active predictive thermal management is as follows: Figure 2As shown, it includes a temperature prediction model, a temperature arbitrator, and a dynamic thermal management method. Step 1.1 refers to the temperature prediction model passing the predicted temperature distribution of the next state to the temperature arbitrator; step 1.2 refers to when the temperature arbitrator determines that the temperature distribution of the next state will exceed the temperature threshold, passing an operation instruction to the dynamic thermal management method; step 1.3 refers to when the temperature arbitrator determines that the temperature distribution of the next state will not exceed the temperature threshold, entering another branch operation: keeping the original instruction information unchanged and running to complete an actual running time cycle.

[0018] The specific implementation steps of the present invention are as follows Figure 3 As shown:

[0019] 1. As shown in step 1, at the beginning of the current time period, the system-level chip passes the instructions of this period to the instruction temporary storage module;

[0020] 2. As shown in step 2, the instruction temporary storage module transmits the currently stored instruction to the active predictive thermal management module;

[0021] 3. The temperature prediction model inside the active predictive thermal management module reads the temperature distribution of the current state, the chip's floor plan, and the instruction information of the current state, and outputs the predicted temperature distribution of the chip after a complete time period;

[0022] 4. After the predicted temperature distribution is compared with the temperature threshold through the temperature arbitrator, a branch operation is performed:

[0023] 1) If the predicted temperature exceeds the threshold temperature, as shown in step 3 and step 1, the voltage frequency and other information are adjusted through dynamic thermal management, and the instruction information is returned to the system-on-chip (SOC), and the instruction information is temporarily stored in the instruction temporary storage module again;

[0024] 2) If the predicted temperature does not reach the threshold temperature, as shown in step 1.3, the chip maintains the current state unchanged.

[0025] 5. As shown in step 4, the chip reads the instruction information required for the current operation cycle from the instruction temporary storage, and runs an actual time cycle according to the instruction information to obtain the actual chip temperature distribution after one cycle;

[0026] 6. As shown in step five, the actual temperature distribution after a time period is passed to the reactive thermal management module, which optimizes the voltage frequency and other information of the chip, and passes the instruction information to the system-on-chip (SOC) as the initial instruction information of the chip in the next time period.

Claims

1. A hybrid system for controlling temperature during a chip operation cycle, characterized in that: It includes a system-on-chip (SOC), an instruction cache module, a predictive dynamic thermal management module, and a reactive dynamic thermal management module.

2. The predictive dynamic thermal management module according to claim 1, characterized in that: The predictive dynamic thermal management module includes a temperature distribution predictor, a temperature arbitrator, and dynamic voltage and frequency adjustment.

3. The thermal management method of the hybrid system according to claim 1, characterized in that: The current operation cycle includes the following steps: The system-on-chip (SOC) transmits the instruction information of the current state to the instruction temporary storage module; The instruction temporary storage module transmits the instruction information to the predictive dynamic thermal management module; The temperature distribution prediction model in the predictive dynamic thermal management module reads the instruction information and predicts the temperature distribution of the chip after the operation cycle; The temperature arbiter reads the predicted temperature distribution and performs branch operations; The reactive dynamic thermal management module reads the temperature distribution obtained in the previous step and the temperature threshold required by the user to perform dynamic thermal management.

4. The branching operation performed by the temperature arbitrator according to claim 3 is characterized in that: If the predicted temperature distribution exceeds the temperature threshold required by the user, dynamic voltage and frequency adjustment is performed, and the instruction information is returned to the system-on-chip (SOC), so that within the clock cycle, the chip runs for a time period according to the instruction information to obtain the temperature distribution of the next state; If the predicted temperature distribution does not exceed the temperature threshold required by the user, no dynamic operation is performed, and the instruction information is directly read from the instruction temporary storage module and runs for a time period to obtain the temperature distribution of the next state.

5. A thermal management system is obtained according to the method of claims 1 to 4, characterized in that A hybrid temperature control method is used to ensure that the temperature of the chip does not exceed the temperature threshold required by the user during the operation cycle.

6. The system according to claim 5, characterized in that A hybrid temperature control approach that combines predictive and reactive methods.

Images