Memory module connector, mainboard and computing device

Abstract

The embodiment of the invention provides a memory module connector and computing equipment. The memory module connector comprises a connector body, the connector body is provided with a first side wall and a second side wall, the extension direction of the first side wall intersects with the extension direction of the second side wall, the first side wall is configured to be connected with a mainboard, the second side wall is provided with a plurality of slots, and the slots are configured to allow memory modules to be inserted therein; the plurality of slots are arranged side by side along the extension direction of the second side wall. According to the embodiment of the invention, the setting density of the memory module can be improved, and the occupation of the server space is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a memory module connector, a motherboard, and a computing device. Background Art

[0002] With the rapid development of information technology, memory modules have become one of the core components in server systems. The performance, capacity and integration of memory modules directly affect the overall performance of the server system. Generally, a server includes a memory module and a central processing unit (CPU), and the memory module can interact with the CPU. As the size of the CPU increases with performance, higher requirements are placed on the high density of the memory module. Summary of the invention

[0003] The embodiments of the present application provide a memory module connector, a mainboard, and a computing device, which can improve the setting density of the memory module and reduce the space occupied by the server.

[0004] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0005] In a first aspect, an embodiment of the present application provides a memory module connector, comprising:

[0006] The connector body has a first side wall and a second side wall, the extension direction of the first side wall intersects with the extension direction of the second side wall, the first side wall is configured to be connected to the motherboard, the second side wall is provided with a plurality of slots, the slots are configured for the memory module to be inserted; the plurality of slots are arranged side by side along the extension direction of the second side wall.

[0007] The memory module connector provided in the embodiment of the present application has a connector body with a first side wall and a second side wall, and the extension direction of the first side wall and the extension direction of the second side wall intersect each other; in this way, the first side wall can be connected to the mainboard, and a plurality of slots are arranged on the second side wall, in which the memory modules are inserted, and the plurality of slots are arranged side by side along the extension direction of the second side wall; in this way, after the memory module is set on the mainboard through the memory module connector, the plurality of memory modules are arranged along the extension direction of the second side wall, and the memory modules are arranged in the space of the side wall intersecting with the mainboard. Even if the volume of the CPU on the mainboard increases and occupies the lateral space of the mainboard, it will not affect the number of arranged memory modules, thereby improving the setting density of the memory modules and reducing the occupation of server space.

[0008] In one implementation, a first slot among the plurality of slots is connected to a first wiring, and the first wiring is conducted to the first side wall; a second slot among the plurality of slots is connected to a second wiring, and the second wiring is conducted to the first side wall; the first slot and the second slot are any two adjacent slots among the plurality of slots;

[0009] There is a first distance between the first slot and the second slot, and there is a second distance between the first routing line and the second routing line on the first side wall, and the second distance is smaller than the first distance.

[0010] In the embodiment of the present application, a first slot among the plurality of slots is connected to a first wiring, and the first wiring is conducted to the first side wall, so that a memory module inserted in the first slot is connected to the mainboard through the first wiring and the first side wall. A second slot among the plurality of slots is connected to a second wiring, and the second wiring is conducted to the first side wall, so that a memory module inserted in the second slot is connected to the mainboard through the second wiring and the first side wall.

[0011] In addition, there is a first spacing between the first slot and the second slot, and there is a second spacing between the first wiring and the second wiring on the first side wall, and the second spacing is set to be smaller than the first spacing. In this way, the space required for arranging the wiring connecting multiple memory modules to the motherboard can be reduced. That is, the space of the side wall intersecting with the motherboard in the server can be fully utilized to arrange the memory module, reducing the space occupied by the memory module on the motherboard. When the CPU volume increases, the number of memory modules set on the motherboard can be ensured, the setting density of the memory module is improved, and the occupation of the server space is reduced.

[0012] In addition, the first slot and the second slot are any two adjacent slots among the multiple slots. In this way, the distance between the wires corresponding to any two adjacent slots among the multiple slots is smaller than the distance between the slots. In this way, the space of the mainboard required for the wires to be connected to the mainboard is smaller than the space required for the arrangement of multiple slots, and the space of the side wall intersecting with the mainboard in the server can be fully utilized to arrange the memory module. The space occupied by the memory module on the mainboard is reduced, and when the CPU volume increases, the number of memory modules set on the mainboard can be ensured, the setting density of the memory module is improved, and the space occupied by the server is reduced.

[0013] In one implementation, any one of the first routing and the second routing includes:

[0014] A first sub-line is conductively connected to one side wall of the slot;

[0015] The second sub-routing is connected to the other side wall of the slot; the first sub-routing and the second sub-routing have a third spacing on the first side wall, and the third spacing is less than or equal to the opening width of the slot.

[0016] In the embodiment of the present application, any one of the first routing and the second routing is set to include a first sub-routing and a second sub-routing, the first sub-routing is connected to one side wall of the slot, and the second sub-routing is connected to the other side wall of the slot. In this way, the first sub-routing can contact the pins on one side of the memory module, and the second sub-routing can contact the pins on the other side of the memory module; it is convenient for the pins on both sides of the memory module to be connected to the motherboard. The first sub-routing and the second sub-routing have a third spacing on the first side wall, and the third spacing is less than or equal to the opening width of the slot. In this way, the spacing between the two routings connected to the pins on both sides of the memory module can be reduced, thereby reducing the space required for the routing connected to the memory module to be arranged on the first side wall, that is, reducing the space required for the routing to be arranged on the motherboard. The space occupied by the memory module on the motherboard is reduced, and the number of memory modules set on the motherboard can be ensured when the CPU volume increases.

[0017] In one implementation, the second side wall includes two second side walls, and the two second side walls are located opposite to each other on two sides of the first side wall.

[0018] In some examples of the embodiments of the present application, slots are provided on both second side walls of the connector body, so that the number of memory modules that can be plugged into the connector body can be increased, and the space of the side walls intersecting with the motherboard in the server can be fully utilized to arrange the memory modules.

[0019] In one implementation, there is a fourth spacing between the two second side walls at sides away from the first side wall, there is a fifth spacing between the two second side walls at sides connected to the first side wall, and the fourth spacing is less than or equal to the fifth spacing.

[0020] In some examples of the embodiments of the present application, there is a fourth spacing between the two second side walls facing away from the first side wall, and there is a fifth spacing between the two second side walls connected to the first side wall, and the fourth spacing is set to be less than or equal to the fifth spacing. In this way, after the memory module is inserted into the slot, the side of the memory module away from the connector body is flush or has a pyramid-like cone structure, which facilitates the removal of the memory module from the slot.

[0021] In one implementation, the connector body includes:

[0022] The routing layer is provided with a first notch, and the first routing line and the second routing line are arranged in the routing layer;

[0023] The insulating layer is provided with a second notch, and the insulating layer is located on both sides of the wiring layer; the first notch and the second notch form a slot.

[0024] In the embodiment of the present application, a first notch is provided in the routing layer, and the first routing line and the second routing line are arranged in the routing layer, so as to facilitate the arrangement of the first routing line and the second routing line. An insulating layer is provided on both sides of the routing layer, and a second notch is provided in the insulating layer. The second notch and the first notch form a slot, so as to facilitate the processing and forming of the connector body, facilitate the setting of the slot, and improve the processing efficiency of the connector body.

[0025] In one implementation, the routing layer includes multiple layers, and insulating layers are provided on both sides of each routing layer in the multiple routing layers.

[0026] By setting up multiple routing layers, the routing lines on the multiple routing layers are connected to multiple pins on the memory module. Insulation layers are set on both sides of each routing layer to avoid mutual interference between the routing lines of each routing layer, which facilitates signal transmission.

[0027] In one implementation, a depth direction of the slot is consistent with an extension direction of the first side wall.

[0028] In some examples of the embodiments of the present application, the depth direction of the slot is set to be consistent with the first side wall, so that the slot is easily set. In addition, when installing the memory module, it can be installed by first inserting it obliquely and then pressing it down, which is convenient for stable installation of the memory module.

[0029] In one implementation, the opening of the slot is inclined in a direction away from the first side wall.

[0030] In some examples of the embodiments of the present application, the opening of the slot is tilted in a direction away from the first side wall. Thus, after the memory module is inserted into the slot, the end of the memory module away from the slot is tilted in a direction away from the first side wall, which facilitates the insertion and removal of the memory module.

[0031] In a second aspect, an embodiment of the present application provides a mainboard, including:

[0032] substrate;

[0033] As for the memory module connector provided in any one of the aforementioned embodiments or implementations, the memory module connector is connected to the substrate.

[0034] In some implementations, the mainboard includes:

[0035] substrate;

[0036] A board-end connector is connected to the substrate, and the board-end connector has a connection terminal;

[0037] In the memory module connector provided by any one of the aforementioned embodiments or implementations, the first wiring and the second wiring of the first side wall of the memory module connector are connected to the connection terminal.

[0038] The motherboard provided in the embodiment of the present application is connected to the substrate by arranging a board-end connector, and the board-end connector has a connection terminal, and the connection terminal can be connected to the first wiring and the second wiring of the first side wall. In this way, it is convenient to connect and disassemble the memory module connector to the motherboard, and it is convenient to maintain the memory module, thereby reducing the maintenance cost of maintaining the memory module.

[0039] In one implementation, the board-side connector is provided with a terminal contact spring, and the terminal contact spring is in contact with the first trace and the second trace.

[0040] In some examples of the embodiments of the present application, a terminal contact spring is provided on the board-side connector, and the terminal contact spring contacts the first trace and the second trace. In this way, the stability of the electrical signal connection between the connector body and the board-side connector can be improved, and the stability of the connection between the memory module and the motherboard can be improved.

[0041] In one implementation, a groove is provided on a side of the board-end connector facing the connector body, and the terminal contact spring is located in the groove.

[0042] In some examples of the embodiments of the present application, a groove is set on the side of the board-end connector facing the connector body, and the terminal contact spring is set in the groove. In this way, the groove can protect the terminal spring when it enters and exits, and the terminal contact spring can be prevented from being bent and deformed by lateral force.

[0043] In one implementation, the first side wall is disposed in the groove, one of the board end connector and the first side wall is provided with a guide column, and the other of the board end connector and the first side wall is provided with a guide groove, and the guide column is inserted into the guide groove.

[0044] In an embodiment of the present application, a guide column is provided on one of the board-end connector and the first side wall, and a guide groove is provided on the other of the board-end connector and the first side wall; in this way, when the connector body is installed to the board-end connector, the guide column can be inserted into the guide groove, thereby facilitating the positioning and docking of the connector body and the board-end connector, thereby improving the installation efficiency of the connector body.

[0045] In one implementation, a solder ball is provided on a side of the board-end connector facing away from the connector body, and the solder ball is connected to the connection terminal; the solder ball is configured to be connected to the mainboard.

[0046] In the embodiment of the present application, a solder ball is provided on one side of the board-side connector body, and the solder ball is connected to the connection terminal. In this way, the board-side connector can be connected to the mainboard by welding, which can improve the stability of the connection between the board-side connector and the mainboard.

[0047] On the third aspect, an embodiment of the present application provides a computing device, including a motherboard, a processor and a memory module provided in the aforementioned embodiment of the present application, the processor is arranged on the mainboard, the memory module is arranged in the slot of the memory module connector, and the projection of the memory module on the mainboard is misaligned with the processor.

[0048] In the embodiment of the present application, by setting the projection of the memory module on the mainboard to be offset from the processor, the memory module can be prevented from blocking the processor, thereby facilitating the installation of the memory module and the processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 This is a structural schematic diagram of the cooperation between the memory module connector and the mainboard provided in some embodiments of the present application;

[0050] Figure 2 is a schematic diagram of the internal structure of a memory module connector provided in some embodiments of the present application;

[0051] Figure 3 yes Figure 2 A partial enlarged view of point A in the middle;

[0052] Figure 4 It is a structural schematic diagram of the cooperation between the memory module connector and the memory module provided in some embodiments of the present application;

[0053] Figure 5 is a schematic diagram of the exploded structure of a memory module connector provided in some embodiments of the present application;

[0054] Figure 6 is a top view of a memory module connector provided in some embodiments of the present application;

[0055] Figure 7 It is a structural schematic diagram of the cooperation between the memory module connector and the board-end connector provided in some embodiments of the present application.

[0056] Description of reference numerals:

[0057] 100-motherboard; 200-CPU; 300-memory module; 400-memory module connector;

[0058] 210-bracket; 410-connector body; 411-first side wall; 412-second side wall; 413-slot; 414-first routing; 415-second routing; 416-routing layer; 417-insulating layer; 420-board connector; 421-connecting terminal; 422-groove; 423-soldering tin ball;

[0059] 4111 - guide groove; 4141 - first sub-routing; 4142 - second sub-routing; 4161 - first notch; 4171 - second notch; 4211 - first sub-connecting terminal; 4212 - second sub-connecting terminal; 4213 - terminal contact spring; 4221 - guide column. DETAILED DESCRIPTION

[0060] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present application.

[0061] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific implementation methods disclosed below.

[0062] In the description of the present application, it should be understood that the terms "upper", "lower", "horizontal", "bottom", "inner", "outer" (if any) and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the present application, unless otherwise clearly specified and limited, a first feature being "upper" or "lower" than a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0063] In this application, unless otherwise clearly specified and limited, the terms "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. However, if it is indicated as a direct connection, it means that the two connected entities are not connected through an intermediate structure, but are only connected to form a whole through a connecting structure. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0064] In this application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0065] With the rapid development of information technology, memory modules play an increasingly important role in computing devices. As one of the core components of computing devices, the performance, capacity and integration of memory modules directly affect the overall performance of computing devices.

[0066] In some examples, the computing device may include a server.

[0067] In some examples, the computing device may include a whole cabinet server, an artificial intelligence (AI) server, or a graphics processing unit (GPU) server. AI servers and GPU servers need to process a large amount of data and have a large memory requirement.

[0068] In some examples, the computing device may include a high performance computer. High performance computing (HPC) generally requires a large amount of memory to support complex computing tasks.

[0069] In some examples, the computing device may include a workstation. Workstations typically require large amounts of memory to run complex design and simulation software.

[0070] In some examples, the computing device may include an embedded system, which usually needs to achieve high efficiency and stable computing in a limited space.

[0071] In some examples of the embodiments of the present application, for ease of explanation, a computing device is taken as a server as a specific example. In some examples, the server may include a frame (in some examples, it may also be referred to as a chassis). A storage space may be formed in the frame. The storage space may be configured to accommodate electronic components. The electronic components accommodated in the storage space may include a motherboard. The motherboard may be fixedly connected to the frame. For example, the motherboard may be fixed to the frame by components such as bolts, screws, or screws. In some examples, a central processing unit CPU may be provided on the motherboard. In some examples, in order to improve the processing performance of the server, a plurality of CPUs may be provided on the motherboard. The plurality of CPUs may be arranged side by side along the width direction of the motherboard. In addition, a plurality of memory modules may be provided on the motherboard. The memory module may, for example, include a dual in-line memory module (Dual In-line Memory Module, referred to as DIMM).

[0072] Figure 1 This is a structural schematic diagram of the cooperation between the memory module connector and the mainboard provided in some embodiments of the present application.

[0073] Reference Figure 1 As shown, in some examples of the embodiments of the present application, a memory module connector 400 is provided. The memory module connector 400 may include a connector body 410. The connector body 410 has a first side wall 411 and a second side wall 412, and the extension direction of the first side wall 411 intersects with the extension direction of the second side wall 412. The first side wall 411 is configured to be connected to the motherboard 100, and the second side wall 412 is provided with a plurality of slots 413, and the slots 413 are configured to be inserted into the memory module 300; the plurality of slots 413 are arranged side by side along the extension direction of the second side wall 412. In this way, the insertion position of the memory module 300 is set on the second side wall 412 of the connector body 410, and the memory module 300 is arranged using the space of the side wall intersecting with the motherboard 100. Even if the volume of the CPU 200 increases and occupies the lateral space of the motherboard 100, it will not affect the number of memory modules 300, which can increase the setting density of the memory module 300 and reduce the occupation of the server space.

[0074] As the amount of information processing data increases, the processing performance requirements for CPU 200 are getting higher and higher. In order to improve the processing performance of CPU 200, the size of CPU 200 increases. The space that CPU 200 needs to occupy on the motherboard 100 is getting larger and larger. By adopting the memory module connector of the embodiment of the present application, it is possible to effectively solve the problem that the space in the server cannot be arranged with the corresponding memory module 300 due to the increase in the size of the CPU.

[0075] For some examples, refer to Figure 1 As shown, some embodiments of the present application provide a memory module connector 400. The memory module connector 400 may include a connector body 410.

[0076] For some examples, refer to Figure 1 As shown, the connector body 410 may have a first side wall 411. The first side wall 411 may be configured to be connected to the mainboard 100.

[0077] In some examples, the first side wall 411 may be directly connected to the mainboard 100 . For example, the first side wall 411 may be provided with pins or pads. The pins or pads are connected to circuit traces on the mainboard 100 .

[0078] In some examples, the connector body 410 can be connected to the mainboard 100 by means of screws, bolts, or threaded rods.

[0079] In some examples, the connector body 410 can be snap-fitted and connected to the mainboard 100 by means of a lock, a snap, or the like.

[0080] In some examples, the connector body 410 may be soldered to the mainboard 100 .

[0081] It is understandable that in some other examples of the embodiment of the present application, the connector body 410 may also be connected to the mainboard 100 in other ways, as long as the connector body 410 is stably connected to the mainboard 100.

[0082] In some examples, the connector body 410 may have a second side wall 412. The extension direction of the second side wall 412 may intersect with the extension direction of the first side wall 411.

[0083] In some examples, the first side wall 411 may be a side wall parallel or approximately parallel to the connector body 410 and the mainboard 100. The extension direction of the second side wall 412 may intersect with the mainboard 100. For example, the mainboard 100 may be disposed on the bottom wall of the server frame, and the second side wall 412 may extend from the mainboard 100 toward the opening of the server frame.

[0084] In some examples, a certain angle may be formed between the second side wall 412 and the first side wall 411 , so that the second side wall 412 extends toward the opening direction of the server frame relative to the first side wall 411 .

[0085] For some examples, refer to Figure 1 As shown, the second side wall 412 may be perpendicular to the first side wall 411 .

[0086] For some examples, refer to Figure 1 As shown, the second side wall 412 may be provided with a plurality of slots 413 arranged side by side. The slots 413 may be configured to be inserted with the memory module 300 .

[0087] In some examples, the inner wall of the slot 413 may be provided with a spring piece that cooperates with the pins of the memory module 300. When the memory module 300 is inserted into the slot 413, the spring piece in the slot 413 may contact the pins of the memory module 300.

[0088] For some examples, refer to Figure 1 As shown, the plurality of slots 413 may be arranged along the extension direction of the second side wall 412 (eg Figure 1 The first side wall 411 may extend in the direction of Figure 1 The direction of arrangement is shown on the x-axis.

[0089] The memory module connector 400 provided in the embodiment of the present application has a connector body having a first side wall 411 and a second side wall 412 whose extension directions intersect with each other; thus, the first side wall 411 can be connected to the mainboard 100, and the extension direction of the second side wall 412 intersects with the mainboard 100; and a plurality of slots 413 arranged side by side are arranged on the second side wall 412 along the extension direction of the second side wall 412. Thus, the memory module 300 is arranged in the space intersecting with the mainboard 100, and even if the volume of the CPU on the mainboard increases and occupies the horizontal space of the mainboard 100, the number of memory modules 300 arranged will not be affected, and the setting density of the memory module 300 can be increased, and the occupation of the server space can be reduced.

[0090] For some examples, refer to Figure 1 As shown, the width of the plurality of slots 413 arranged side by side (eg Figure 1 The distance shown in h) is greater than the width of the memory module 300 (eg Figure 1 In this way, after arranging a plurality of memory modules 300 side by side on the second side wall 412, the space required for arranging the memory modules 300 on the motherboard 100 can be reduced.

[0091] Figure 2 This is a schematic diagram of the internal structure of a memory module connector provided in some embodiments of the present application.

[0092] For some examples, refer to Figure 2 As shown, the second side wall 412 can be inclined relative to the first side wall 411. The second side wall 412 and the first side wall 411 form an angle less than 90°. In this way, after the memory module 300 is inserted into the slot 413, in the direction perpendicular to the motherboard 100 (for example, Figure 1 In the direction shown by the y-axis, the multiple memory modules 300 are staggered away from one side of the connector body, which facilitates the insertion and removal of the memory modules 300.

[0093] For some examples, refer to Figure 2 As shown, a first slot among the plurality of slots 413 is connected to a first wiring 414. The first wiring 414 may be connected to a spring sheet on an inner wall of the first slot.

[0094] In some examples, the first slot may be any one of the plurality of slots 413 .

[0095] In some examples, the first trace 414 can be formed in the connector body by deposition or etching. The arrangement of the first trace 414 in the connector body 410 can be the same or similar to the arrangement of traces in a printed circuit board, which will not be described in detail in the present embodiment.

[0096] In some examples, the first wiring 414 may be connected to the first side wall 411. In other words, the first wiring 414 may connect the spring sheet on the inner wall of the first slot to the first side wall 411.

[0097] In some examples, a solder ball array (not shown) may be provided on the first side wall 411. The first trace 414 may be connected to a first solder ball in the solder ball array, thereby achieving conduction between the first solder ball and the first slot.

[0098] In some examples, a pin array (not shown) may be provided on the first side wall 411. The first trace 414 may be connected to a first pin in the pin array, thereby achieving conduction between the first pin and the first slot.

[0099] For some examples, refer to Figure 2 As shown, a second slot among the plurality of slots 413 is connected with a second wiring 415. The second wiring 415 may be connected to a spring sheet on the inner wall of the second slot.

[0100] In some examples, the second slot may be any slot 413 among the plurality of slots 413 except the first slot.

[0101] In some examples, the second wiring 415 can be connected to the first side wall 411. In other words, the second wiring 415 can connect the spring sheet on the inner wall of the second slot to the first side wall 411.

[0102] In some examples, the second routing line 415 may be arranged in the same, similar or similar manner as the first routing line 414. For details, reference may be made to the detailed description of the first routing line 414 in the foregoing embodiment of the present application, which will not be described in detail in the embodiment of the present application.

[0103] Figure 3 yes Figure 2 A magnified partial view of point A in the middle.

[0104] For some examples, refer to Figure 2 and Figure 3 As shown, there may be a first distance L3 between the first slot and the second slot. It should be noted that the first distance L3 may be the distance between the center of the first slot and the center of the second slot.

[0105] For some examples, refer to Figure 2 and Figure 3 As shown, the first wiring 414 and the second wiring 415 have a second interval L4 on the first side wall 411 .

[0106] In some examples, the second spacing L4 is smaller than the first spacing L3. In this way, by setting the spacing between the first slot and the second slot on the second side wall 412 to the first spacing L3, it is ensured that there is sufficient plugging and unplugging space between two adjacent memory modules 300. By setting the second spacing L4 on the first side wall 411 to be smaller than the first spacing L3, the distance between the wiring of two adjacent memory modules 300 on the first side wall 411 can be reduced, that is, the spacing between the connection between the two adjacent memory modules 300 and the mainboard 100 is reduced, thereby reducing the space occupied by the memory module 300 on the mainboard 100.

[0107] In the embodiment of the present application, there is a first spacing between the first slot and the second slot, and the first wiring 414 and the second wiring 415 have a second spacing on the first side wall 411, and the second spacing is set to be smaller than the first spacing. In this way, the space required for the wiring arrangement connecting the multiple memory modules 300 to the mainboard 100 can be reduced. That is, the space in the server that intersects with the mainboard 100 can be fully utilized to arrange the memory module 300, reducing the space occupied by the memory module on the mainboard 100. When the volume of the CPU 200 increases, the number of memory modules on the mainboard 100 can be ensured, the setting density of the memory module 300 is increased, and the occupation of the server space is reduced.

[0108] For some examples, refer to Figure 2 and Figure 3 As shown, the first slot and the second slot may be any two adjacent slots 413 among the plurality of slots 413 .

[0109] For some examples, refer to Figure 2 As shown, eight slots 413 may be arranged along the second side wall 412, and the first slot may be a slot 413 closest to the first side wall 411 among the eight slots 413. The second slot may be a slot 413 adjacent to the first slot.

[0110] It can be understood that the first slot can be any slot 413 among the eight slots 413. The second slot can be a slot 413 adjacent to the first slot.

[0111] That is, in some embodiments of the present application, the first distance L3 may be the minimum distance between two slots 413. In some examples of the embodiments of the present application, the second distance L4 is set to be smaller than the minimum distance between two slots 413, so that the space occupied by the mainboard 100 for the wiring to connect to the mainboard 100 is smaller than the space occupied by the arrangement of multiple slots 413.

[0112] In some examples of the embodiments of the present application, the first slot and the second slot are any two adjacent slots 413 among the multiple slots 413. In this way, the distance between the wires corresponding to any two adjacent slots 413 among the multiple slots 413 is smaller than the distance between the slots 413. In this way, the space of the mainboard 100 that the wires need to occupy when connecting to the mainboard 100 is smaller than the space that the multiple slots 413 need to occupy, and the space that intersects with the mainboard 100 in the server can be fully utilized to arrange the memory module 300. The space occupied by the memory module on the mainboard 100 is reduced, and the number of memory modules set on the mainboard 100 can be ensured when the volume of the CPU 200 increases.

[0113] For some examples, refer to Figure 3 As shown, any one of the first routing line 414 and the second routing line 415 may include a first sub-routing line 4141. The first sub-routing line 4141 may be in conduction with a side wall of one side of the slot 413.

[0114] In some examples, as described in detail in the above embodiments of the present application, the inner wall of the slot 413 may be provided with a spring. It is understood that pins may be provided on both sides of the memory module 300. Therefore, springs may be provided on both inner walls of the slot 413. The first sub-line 4141 may be connected to the spring on one side of the side wall.

[0115] For some examples, refer to Figure 3 As shown, any one of the first routing 414 and the second routing 415 may include a second sub-routing 4142. The second sub-routing 4142 may be in conduction with the other side wall of the slot 413. In other words, the second sub-routing 4142 may be in conduction with the spring of the other side wall of the slot 413.

[0116] In some examples, the first sub-routing 4141 and the second sub-routing 4142 have a third interval L5 on the first sidewall 411 . The third interval L5 may be less than or equal to an opening width of the slot 413 .

[0117] It is understood that in some examples, the opening width of the slot 413 may be the same, equal or similar to the thickness of the memory module 300. In other words, the third spacing L5 may be less than or equal to the thickness of the memory module 300. In this way, relative to the arrangement of the memory module 300 on the mainboard 100, the space of the mainboard 100 required for the connection between the pins of the memory module 300 and the mainboard 100 can be reduced.

[0118] In the embodiment of the present application, any one of the first routing 414 and the second routing 415 is configured to include a first sub-routing 4141 and a second sub-routing 4142, wherein the first sub-routing 4141 is connected to one side wall of the slot 413, and the second sub-routing 4142 is connected to the other side wall of the slot 413. In this way, the first sub-routing 4141 can contact the pins on one side of the memory module 300, and the second sub-routing 4142 can contact the pins on the other side of the memory module 300; it is convenient for the pins on both sides of the memory module 300 to be connected to the motherboard 100. The first sub-routing 4141 and the second sub-routing 4142 have a third spacing on the first side wall 411, and the third spacing is less than or equal to the opening width of the slot 413. In this way, the spacing between the two wires connected to the pins on both sides of the memory module 300 can be reduced, thereby reducing the space required for arranging the wires connected to the memory module 300 on the first side wall 411, that is, reducing the space required for arranging the wires on the motherboard 100. The space occupied by the memory module on the motherboard 100 is reduced, and the number of memory modules set on the motherboard 100 can be ensured when the volume of the CPU 200 increases.

[0119] For some examples, refer to Figure 1 and Figure 2 As shown, the second sidewall 412 may include two second sidewalls 412 . The two second sidewalls 412 may be located opposite to each other on both sides of the first sidewall 411 .

[0120] That is, in some examples of the embodiments of the present application, slots 413 may be provided on both second side walls 412. In this way, the slots 413 on both side walls of a connector body 410 may be fully utilized, and the number of memory modules 300 connected to the connector body 410 may be increased.

[0121] In some examples, 32 memory modules 300 are provided on the mainboard 100. Eight slots 413 can be provided on any one of the two second side walls 412. That is, 16 memory modules 300 can be inserted into one connector body 410.

[0122] It can be understood that in some examples of the embodiments of the present application, the distance between two adjacent slots 413 is set according to the distance at which the spring in the slot 413 of the connector body 410 can stably rebound, and the height of the frame, and the embodiments of the present application do not limit this.

[0123] In addition, it should be noted that in some embodiments of the present application, the number of memory modules 300 can be reduced, for example, the number of memory modules 300 is 4. In the aforementioned embodiments of the present application, the case of 8 memory modules 300 is only used as a specific example, and does not limit the number of memory modules 300 and the applicable scope of the memory module connector 400.

[0124] In some specific examples, the connector body 410 can be disposed between two CPUs 200. In this way, the space required for 16 memory modules 300 between the two CPUs 200 can be reduced, and the number of memory modules 300 can be ensured when the volume of the CPU 200 increases.

[0125] It can be understood that in some examples of the embodiments of the present application, the number of memory modules 300 is only used as some specific examples for illustration, and does not limit the specific number of memory modules 300.

[0126] In some examples of the embodiments of the present application, slots 413 are provided on both second side walls 412 of the connector body 410. In this way, the number of memory modules 300 that can be inserted into the connector body 410 can be increased, and the space on the side of the server that intersects with the motherboard 100 can be fully utilized to arrange the memory modules 300.

[0127] For some examples, refer to Figure 1 and Figure 2 As shown, there may be a fourth distance L6 between the two second side walls 412 on the sides facing away from the first side wall 411 .

[0128] For some examples, refer to Figure 1 and Figure 2 As shown, there is a fifth distance L7 between the two second side walls 412 and the side where the first side wall 411 intersects.

[0129] For some examples, refer to Figure 1 As shown, the fourth interval L6 may be equal to the fifth interval L7. That is, the cross section of the connector body 410 may be rectangular.

[0130] In some examples, in order to facilitate the insertion and removal of the memory module 300, the depth of the slot 413 on the second side wall 412 can be along Figure 2 The direction shown by the positive direction of the y-axis gradually increases. That is, the depth of a slot 413 far from the first side wall 411 may be greater than the depth of a slot 413 close to the first side wall 411.

[0131] In some examples, for ease of explanation, the first slot and the second slot are used as examples for illustration. The first slot can be located on the side of the second slot close to the first side wall 411. The first slot and the second slot can be any two adjacent slots 413 among the multiple slots 413. The depth of the second slot can be greater than the depth of the first slot. In this way, after the memory module 300 is inserted into the slot 413, the memory module 300 arranged on the second side wall 412 forms an inclined slope on the side away from the connector body 410. It is convenient for plugging and unplugging the memory module 300.

[0132] For some examples, refer to Figure 2 As shown, the fourth interval L6 may be smaller than the fifth interval L7. That is, the cross section of the connector body 410 may be trapezoidal or conical.

[0133] In some examples of the embodiments of the present application, the fourth spacing L6 is set to be smaller than the fifth spacing L7. In this way, after the memory module 300 is inserted into the slot 413, a plurality of memory modules 300 arranged side by side form an inclined surface away from the second side wall 412, which facilitates the insertion and removal of the memory module 300.

[0134] In some examples of the embodiments of the present application, there is a fourth spacing between the two second side walls 412 on the side facing away from the first side wall 411, and there is a fifth spacing between the two second side walls 412 on the side connected to the first side wall 411, and the fourth spacing is set to be less than or equal to the fifth spacing. In this way, after the memory module 300 is inserted into the slot 413, the side of the memory module 300 facing away from the connector body 410 is flush or has a pyramid-like cone structure, which facilitates the removal of the memory module 300 from the slot 413.

[0135] For some examples, refer to Figure 2 As shown, the depth direction of the slot 413 may be consistent with the extension direction of the first side wall 411. In other words, the depth direction of the slot 413 may be parallel or approximately parallel to the first side wall 411.

[0136] In some examples, when installing the memory module 300 into the connector body 410 , the installation can be performed by first inserting it obliquely and then pressing it downward.

[0137] In some examples, the second side wall 412 may be provided with a buckle. When the memory module 300 is pressed down, the buckle may be buckled with a side of the memory module 300 facing away from the first side wall 411, thereby fixing the memory module 300.

[0138] In some examples of the embodiments of the present application, the depth direction of the slot 413 is set to be consistent with the first side wall 411, so that it is convenient to set the slot 413. In addition, when installing the memory module 300, it can be installed by first inserting it obliquely and then pressing it down, which is convenient for stable installation of the memory module 300.

[0139] Figure 4 It is a structural schematic diagram of the cooperation between the memory module connector and the memory module provided in some embodiments of the present application.

[0140] For some examples, refer to Figure 4As shown, the opening of the slot 413 may be inclined in a direction away from the first side wall 411. That is, along the depth direction of the slot 413, the distance between the bottom wall of the slot 413 and the first side wall 411 may be smaller than the distance between the opening of the slot 413 and the first side wall 411.

[0141] For some examples, refer to Figure 4 As shown, after the memory module 300 is inserted into the slot 413, the memory module 300 can be tilted relative to the first side wall 411 in a direction away from the first side wall 411. When the memory module 300 needs to be removed from the slot 413, the operator can conveniently insert and remove the memory module 300 from the opening of the server frame.

[0142] In some examples of the embodiments of the present application, the opening of the slot 413 is tilted in a direction away from the first side wall 411. In this way, after the memory module 300 is inserted into the slot 413, the end of the memory module 300 away from the slot 413 is tilted in a direction away from the first side wall 411, which facilitates the insertion and removal of the memory module 300.

[0143] Figure 5 It is a schematic diagram of the exploded structure of the memory module connector provided in some embodiments of the present application.

[0144] For some examples, refer to Figure 5 As shown, the connector body 410 may include a routing layer 416. The routing may be arranged in the routing layer 416. For example, the first routing 414 and the second routing 415 may be arranged in the routing layer 416.

[0145] In some examples, the routing layer 416 may be arranged by deposition or etching. Of course, the routing layer 416 may also be arranged by other methods, which are not limited in the present embodiment.

[0146] For some examples, refer to Figure 5 As shown, the wiring block may be provided with a first notch 4161. A spring connected to the pin of the memory module 300 may be provided in the first notch 4161.

[0147] For some examples, refer to Figure 5 As shown, the connector body 410 may include an insulating layer 417. The insulating layer 417 may be located on both sides of the wiring layer 416. That is, an insulating layer 417 is disposed on one side of the wiring layer 416, and an insulating layer 417 is also disposed on the other side of the wiring layer 416.

[0148] In some examples, the insulating layer 417 may be provided with a second notch 4171. The second notch 4171 may be aligned with the first notch 4161. The first notch 4161 and the second notch 4171 form a slot 413.

[0149] In some examples of the embodiments of the present application, the connector body 410 may be formed by stacking and buckling an insulating layer 417 , a routing layer 416 , and an insulating layer 417 .

[0150] In some examples, the routing layer 416 may be manufactured by stamping.

[0151] In some examples, the insulating layer 417 can be manufactured by stamping.

[0152] In some examples, the insulating layer 417 , the routing layer 416 , and the insulating layer 417 may be stacked and snapped together to form the connector body 410 .

[0153] In some examples, the stacking and snapping manner of the insulating layer 417, the routing layer 416, and the insulating layer 417 may be the same, close or similar to the stacking and snapping manner of the memory module connector 400 in the related art, and the embodiments of the present application will not elaborate on this.

[0154] In the embodiment of the present application, by providing a first notch 4161 in the routing layer 416 and laying out the first routing 414 and the second routing 415 in the routing layer 416, the first routing 414 and the second routing 415 are arranged. An insulating layer 417 is provided on both sides of the routing layer 416, and a second notch 4171 is provided in the insulating layer 417. The second notch 4171 and the first notch 4161 form a slot 413, which is convenient for processing and forming the connector body 410, and for setting the slot 413, thereby improving the processing efficiency of the connector body 410.

[0155] Figure 6 4 is a top view of a memory module connector provided in some embodiments of the present application. It should be noted that the memory module connector 400 has multiple layers. Figure 6 The dotted line in the middle is the omitted part, that is, Figure 7 Not all layers of the memory module 400 are shown.

[0156] Generally, the memory module 300 usually has a plurality of pins, and the plurality of pins are arranged along the length direction of the memory module 300. Figure 6 As shown, in some examples of the embodiments of the present application, the routing layer 416 may include multiple layers. Insulating layers 417 are provided on both sides of each routing layer 416 in the multiple routing layers 416 .

[0157] In some examples, the number of routing layers 416 can be set according to the number of pins of the memory module 300 .

[0158] In some examples, the number of pins of the memory module 300 is 288. Since pins are provided on both sides of the memory module 300, the number of pins on a single side of the memory module 300 is 144.

[0159] In some examples, the number of routing layers 416 can be 144 layers.

[0160] In some examples, the springs for fixing the memory module 300 in the slot 413 are usually metal springs. For ease of setting, the springs for fixing the memory module 300 can be set as the wiring layer 416. Therefore, in some examples, the number of the wiring layer 416 can be 147 layers.

[0161] In some examples, an insulating layer 417 may be disposed between two adjacent routing layers 416. There are 146 gaps between 147 routing layers 416, and 146 insulating layers 417 may be disposed. In addition, an insulating layer 417 may be disposed outside the two outermost routing layers 416. The number of insulating layers 417 may be 148.

[0162] In some examples, 148 layers of insulating layers 417 and 147 layers of wiring layers 416 may be formed by stamping. Then, one insulating layer 417, one wiring layer 416, and one insulating layer 417 are arranged and assembled to form the connector body 410.

[0163] By providing multiple routing layers 416, the routing lines on the multiple routing layers 416 are connected to multiple pins on the memory module 300. Insulating layers 417 are provided on both sides of each routing layer 416 to prevent the routing lines between the routing layers 416 from interfering with each other and facilitate signal transmission.

[0164] Figure 7 It is a structural schematic diagram of the cooperation between the memory module connector and the board-end connector provided in some embodiments of the present application.

[0165] In some examples, as described in detail in the foregoing embodiments of the present application, the first side wall 411 of the connector body 410 may be directly connected to the mainboard 100. For example, the first side wall 411 may be connected to the mainboard 100 by welding.

[0166] In some examples, the first side wall 411 may be fixedly connected to the mainboard 100 by bolts, screws, threaded rods, etc.

[0167] Of course, in some examples, the first side wall 411 may be snap-connected to the mainboard 100 by snap-connection.

[0168] In some examples, in order to facilitate maintenance of the memory module, it is convenient to remove the connector body 410 and the memory module 300 from the motherboard 100. Figure 7 As shown, the memory module connector 400 can be connected to the mainboard 100 via the board connector 420. The board connector 420 can be configured to be connected to the mainboard 100.

[0169] In some examples, the board connector 420 may be soldered to the mainboard 100 .

[0170] In some examples, the board connector 420 can be connected to the mainboard 100 via bolts, screws, or threaded rods.

[0171] In some examples, the board connector 420 can be snap-connected to the mainboard 100 .

[0172] For some examples, refer to Figure 7 As shown, the board-side connector 420 may have a connection terminal 421. The connection terminal 421 may be configured to be connected to the first trace 414 and the second trace 415 of the first side wall 411. For example, there may be a plurality of connection terminals 421, and the first trace 414 may be connected to the first connection terminal 421. The second trace 415 may be connected to the second connection terminal 421.

[0173] For some examples, refer to Figure 7 As shown, there may be 16 slots 413, so there may be 16 rows of connection terminals 421, and each row of connection terminals 421 corresponds to one slot 413. As described in detail in the above embodiments of the present application, each row of connection terminals 421 may have 144 connection terminals 421.

[0174] For some examples, refer to Figure 7 As shown, the connection terminal 421 may include a first sub-connection terminal 4211. The first sub-connection terminal 4211 may be connected to the first sub-wire 4141.

[0175] For some examples, refer to Figure 7 As shown, the connection terminal 421 may include a second sub-connection terminal 4212 . The second sub-connection terminal 4212 may be connected to the second sub-trace 4142 .

[0176] In the embodiment of the present application, the board-end connector 420 is connected to the mainboard 100, and the board-end connector 420 has a connection terminal 421, and the connection terminal 421 can be connected to the first wiring 414 and the second wiring 415 of the first side wall 411. In this way, it is convenient to connect and disassemble the memory module connector 400 with the mainboard 100, and it is convenient to maintain the memory module, which reduces the maintenance cost of maintaining the memory module.

[0177] For some examples, refer to Figure 7 As shown, the board connector 420 may be provided with a terminal contact spring 4213. The terminal contact spring 4213 may be configured to contact the first trace 414 and the second trace 415 of the first side wall 411.

[0178] In some examples, the terminal contact spring 4213 may be disposed on a side of the board connector 420 facing the connector body 410. When the connector body 410 is mounted on the board connector 420, the terminal contact spring 4213 may be connected to the first trace 414 and the second trace 415 on the first side wall 411. Thus, the memory module 300 is connected to the motherboard 100.

[0179] In some examples of the embodiments of the present application, by providing a terminal contact spring 4213 on the board-side connector 420, the terminal contact spring 4213 is configured to contact the first trace 414 and the second trace 415 of the first side wall 411. In this way, the stability of the electrical signal connection between the connector body 410 and the board-side connector 420 can be improved, and the stability of the connection between the memory module and the motherboard 100 can be improved.

[0180] In some examples, a groove 422 may be provided on a side of the board connector 420 facing the connector body 410. The connector body 410 may be installed in the groove 422 to achieve connection with the mainboard 100.

[0181] In some examples, the terminal contact spring 4213 may be located in the groove 422 . In this way, the terminal contact spring 4213 may be protected by the side wall of the groove 422 .

[0182] In some examples of the embodiments of the present application, a groove 422 is provided on the side of the board-end connector 420 facing the connector body 410, and the terminal contact spring 4213 is provided in the groove 422. In this way, the groove 422 can protect the terminal spring from entering and exiting, and the terminal contact spring 4213 can be prevented from being bent and deformed by lateral force.

[0183] For some examples, continue to refer to Figure 7 As shown, when the connector body 410 is installed on the board connector 420 , the first side wall 411 may be located in the groove 422 .

[0184] In some examples, one of the board connector 420 and the first side wall 411 may be provided with a guide post 4221 .

[0185] In some examples, the guide post 4221 may be disposed on the first side wall 411. The guide post 4221 may be fixedly connected to the first side wall 411. For example, after the multi-layer wiring layer 416 and the insulating layer 417 are snap-fitted and assembled to form the connector body 410, the guide post 4221 may be welded on the first side wall 411.

[0186] In some examples, the guide post 4221 may be disposed on the board connector 420. For example, the guide post 4221 may be disposed on the bottom wall of the groove 422.

[0187] In some examples, the other of the board connector 420 and the first side wall 411 may be provided with a guide groove 4111. The guide post 4221 may be inserted into the guide groove 4111.

[0188] In some examples, when the guide post 4221 is disposed on the first side wall 411 , the guide groove 4111 may be opened on the bottom wall of the groove 422 .

[0189] In some examples, when the guide post 4221 is disposed on the board connector 420 , the guide groove 4111 may be opened on the first side wall 411 .

[0190] In the embodiment of the present application, a guide column 4221 is provided on one of the board-end connector 420 and the first side wall 411, and a guide groove 4111 is provided on the other of the board-end connector 420 and the first side wall 411; thus, when the connector body 410 is installed to the board-end connector 420, the guide column 4221 can be inserted into the guide groove 4111, thereby facilitating the positioning and docking of the connector body and the board-end connector 420, and improving the installation efficiency of the connector body 410.

[0191] In some examples, the connector body 410 and the board-end connector 420 may be fixedly connected by screws, bolts or threaded rods.

[0192] In some examples, the connector body 410 and the board connector 420 can be buckled together by a lock, so that the connector body 410 is stably connected to the board connector 420. For example, a lock can be set on the board connector 420, and after the connector body 410 is installed on the board connector 420, the connector body 410 is locked by the lock.

[0193] For some examples, refer to Figure 7 As shown, a solder ball 423 may be provided on a side of the board connector 420 facing away from the connector body 410. The solder ball 423 may be connected to the connection terminal 421. The solder ball 423 may be configured to be connected to the mainboard 100.

[0194] In some examples, the first sub-connection terminal 4211 may be connected to a solder ball 423 , and the second sub-connection terminal 4212 may be connected to a solder ball 423 .

[0195] In the embodiment of the present application, a solder ball 423 is provided on one side of the connector body 410 of the board-side connector 420, and the solder ball 423 is connected to the connection terminal 421. In this way, the board-side connector 420 can be connected to the mainboard 100 by welding, which can improve the stability of the connection between the board-side connector 420 and the mainboard 100.

[0196] In some examples of the embodiments of the present application, the mainboard 100 may include a substrate. The substrate may be a printed circuit board (Process Control Block, PCB for short). The CPU 200 may be arranged on the substrate.

[0197] The mainboard 100 may include the memory module connector 400 provided in the aforementioned embodiment of the present application, and the memory module connector 400 is connected to the substrate.

[0198] It can be understood that in some examples of the embodiments of the present application, the connection method between the memory module connector 400 and the substrate can refer to the detailed description of the aforementioned embodiments of the present application, and the embodiments of the present application will not be repeated here.

[0199] In addition, the mainboard 100 provided in some examples of the embodiments of the present application has the same or corresponding technical features as the aforementioned embodiments of the present application, and therefore has the same or corresponding technical effects as the aforementioned embodiments of the present application, which will not be repeated in the embodiments of the present application.

[0200] In some examples, the embodiments of the present application further provide a computing device. The computing device may include the mainboard 100 provided in the aforementioned embodiments of the present application.

[0201] In some examples, a computing device may include a processor and a memory module 300 .

[0202] In some examples, the processor and the memory module 300 may be disposed on the mainboard 100. The memory module 300 may be disposed on the mainboard 100 through the memory module connector 400 described in detail in the previous embodiment of the present application. The projection of the memory module 300 on the mainboard 100 may be misaligned with the processor. In this way, the memory module 300 will not block the processor, which facilitates the installation of the processor and the setting of the memory module 300.

[0203] The implementation methods described above are only specific implementation methods of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solution of the present application should be included in the scope of protection of the present application.

Claims

1. A memory module connector, characterized in that: include: The connector body has a first side wall and a second side wall, the extension direction of the first side wall intersects with the extension direction of the second side wall, the first side wall is configured to be connected to the motherboard, and the second side wall is provided with a plurality of slots, and the slots are configured for inserting memory modules; the plurality of slots are arranged side by side along the extension direction of the second side wall.

2. The memory module connector according to claim 1, wherein: A first slot among the plurality of slots is connected to a first wiring, and the first wiring is conducted to the first side wall; a second slot among the plurality of slots is connected to a second wiring, and the second wiring is conducted to the first side wall; the first slot and the second slot are any two adjacent slots among the plurality of slots; There is a first distance between the first slot and the second slot, and there is a second distance between the first routing line and the second routing line on the first side wall, and the second distance is smaller than the first distance.

3. The memory module connector according to claim 2, characterized in that: Any one of the first routing line and the second routing line includes: A first sub-line is conductively connected to one side wall of the slot; The second sub-route is connected to the other side wall of the slot; the first sub-route and the second sub-route have a third spacing on the first side wall, and the third spacing is less than or equal to the opening width of the slot.

4. The memory module connector according to any one of claims 1 to 3, characterized in that: The second side walls include two, and the two second side walls are located opposite to each other on two sides of the first side wall.

5. The memory module connector according to claim 4, characterized in that: There is a fourth distance between the two second side walls at their sides away from the first side wall, and there is a fifth distance between the two second side walls at their sides connected to the first side wall, and the fourth distance is less than or equal to the fifth distance.

6. The memory module connector according to any one of claims 1 to 5, characterized in that: The depth direction of the slot is consistent with the extension direction of the first side wall.

7. The memory module connector according to any one of claims 1 to 6, characterized in that: The opening of the slot is inclined in a direction away from the first side wall.

8. A motherboard, characterized in that: include: substrate; A board-end connector connected to the substrate, wherein the board-end connector has a connecting terminal; The memory module connector according to any one of claims 1 to 7, wherein the first wiring and the second wiring of the first side wall of the memory module connector are connected to the connecting terminal.

9. The mainboard according to claim 8, characterized in that: The board-end connector is provided with a terminal contact spring, and the terminal contact spring is in contact with the first wiring and the second wiring; and / or, The board-end connector is provided with a groove on one side facing the connector body, the terminal contact spring is located in the groove, the first side wall is provided in the groove, one of the board-end connector and the first side wall is provided with a guide column, the other of the board-end connector and the first side wall is provided with a guide groove, and the guide column is inserted in the guide groove.

10. A computing device, characterized in that It comprises the mainboard, processor and memory module as described in claim 8 or 9, wherein the processor is arranged on the mainboard, the memory module is arranged in the slot of the memory module connector, and the projection of the memory module on the mainboard is misaligned with the processor.

Images