An airborne universal health management unit and device based on domestic MCU

Abstract

The present invention discloses an airborne universal health management unit and device based on a domestic MCU, belonging to the field of airborne platform health management, comprising: a domestic MCU chip, an external input clock, a FLASH module, a temperature sensor and a CAN interface chip; the external input clock, the FLASH module, the temperature sensor and the CAN interface chip are respectively connected to the domestic MCU chip, and the domestic MCU chip provides external peripheral interface resources. The present invention has the advantages of strong versatility, high flexibility, low cost and small size.

Description

Technical Field

[0001] The present invention relates to the field of airborne platform health management, and more specifically, to an airborne universal health management unit and device based on a domestically produced MCU. Background Art

[0002] The current development of airborne avionics systems has put forward higher requirements for the standardization, integration and localization of hardware design. While highly integrated hardware circuits improve product performance, they are also accompanied by problems such as increased failure rate, strong comprehensiveness of failures, high complexity, and difficulty in locating. How to monitor and manage the working status of hardware more accurately and stably is one of the key concerns in the field of airborne platform health management.

[0003] The avionics system usually contains one or more modules, which generally involve multiple suppliers. Different modules have great differences in architecture, functions and core indicators. When designing the module-level health management circuit, the overall unit often collects the BIT information reporting capabilities of all modules, and then drafts the software protocol requirements and sends them to the manufacturer. The designer carries out relevant software and hardware design according to their own design habits. This leads to the selection of core components in the design of the health management unit within the same system. The software design architecture is diverse and not universal, the software and hardware design costs are high, and the time for drafting the software protocol in the early stage is long. On the other hand, the deviation in the understanding of the design requirements by each design unit will introduce some individual errors during the system joint test. It is easy to have the situation that the health information collection is normal during the debugging of a single module, but the health information cannot be correctly reported after the system is installed, and even the normal operation of the system is affected, which is time-consuming and laborious to troubleshoot. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an airborne universal health management unit and device based on a domestic MCU, which has the advantages of strong versatility, high flexibility, low cost and small size.

[0005] The object of the present invention is achieved through the following solutions:

[0006] An airborne universal health management unit based on a domestic MCU, comprising:

[0007] Domestic MCU chip, external input clock, FLASH module, temperature sensor and CAN interface chip; the external input clock, FLASH module, temperature sensor and CAN interface chip are respectively connected to the domestic MCU chip, and the domestic MCU chip provides external peripheral interface resources. This solution is a universal module-level health management solution for airborne avionics systems, which can be flexibly deployed on modules.

[0008] Furthermore, the domestically produced MCU chip is specifically a HHDM600VEL7 chip, which has 6 UART serial ports, 20 AD voltage acquisitions, 16 GPIO discrete signals and 8 MARK address interfaces. Compared with health management units using DSP architecture or CPU architecture, this solution is more secure, can reduce hardware costs by more than 30%, and has a smaller circuit size.

[0009] Furthermore, a health management software program based on an embedded operating system is configured on the domestic MCU chip. The software program adopts a layered structure, including four layers from bottom to top: BSP layer, embedded operating system layer, interface driver and application layer; the BSP layer provides power-on boot, kernel architecture and interface driver firmware library functions; the operating system layer provides the task scheduling, synchronization mechanism, interrupt processing basic functions and a streamlined shell required by the MCU embedded operating system; the driver layer provides encapsulation of device drivers related to the health management unit; the application layer implements the business needs of the health management unit. The health management software of this solution combines the hardware resources of the health management unit to realize the collection, processing, storage and reporting of health information such as voltage, temperature, chip working status, etc. in the module, and also supports the setting, storage and loading of inherent information such as the module's electronic tags, maintenance logs, default parameters, etc. At the same time, it has good scalability and flexibility, and supports users to upgrade the boot program and user program online through the CAN bus.

[0010] Furthermore, the CAN interface chip includes two CAN bus transceiver paths, and the data between the CAN buses is transmitted and received in accordance with the ICD file format, and the ICD file is prepared according to the maximum management capacity of the health management unit. This solution has good versatility, can achieve the standardization of the protocol content of the management bus, and effectively reduce the probability of errors introduced by the independent development of each module.

[0011] Furthermore, the MCU chip also includes a JTAG interface, which is used for debugging and program burning through a JLink emulator.

[0012] Furthermore, the MCU chip also includes an RS232 debugging serial port, through which debugging information is monitored and electronic tag information is set.

[0013] Furthermore, the temperature sensor is specifically an LC423A temperature sensor chip, and each temperature sensor simultaneously collects the temperature in the 3-way module, and the collection end connects the temperature collection pin of the device that needs to collect temperature to the input end of the temperature sensor.

[0014] Furthermore, the temperature sensor is specifically a transistor access temperature sensor, which reports temperature information to the MCU chip through the I2C interface, and the health management software configured in the MCU chip reads the reported temperature information.

[0015] Furthermore, the CAN interface chip specifically includes a SM65HVD230D chip.

[0016] An airborne universal health management device based on a domestic MCU, comprising a health management unit as described in any of the above items, and the health management unit is transplanted into the circuit design of the device, and the required peripheral interface is used to collect and report on-board health information according to the actual needs inside the module; the health management unit is used for a single module in the device to operate independently, or for multiple modules in the device, and data exchange is carried out through the CAN bus interconnection.

[0017] The beneficial effects of the present invention include:

[0018] (1) The present invention has strong versatility and high flexibility. By combining a domestic MCU chip with a small number of peripheral chips and the health management software resident on the MCU, a set of universal health management units is realized, providing a unified health management implementation solution for different hardware modules in the same avionics subsystem, and realizing the reception, monitoring and processing of health information through CAN bus interconnection, which can effectively reduce individual faults, reduce the workload of software development, and improve the efficiency of system joint testing and the stability of health management function operation.

[0019] (2) The present invention has a rich health information collection interface. In the embodiment, it provides up to 2 CAN bus interfaces, 6 temperature collection interfaces, 6 UART serial ports, 20 AD voltage collection interfaces, 16 GPIO discrete signals, 8 MARK address interfaces, etc. The collection types are wide and the number of collection channels is large, which is sufficient to cover the health management collection needs of various modules.

[0020] (3) The present invention is domestically produced, low-cost, and small in size. It adopts a domestically produced design. The core chip is a domestically produced MCU chip, which has higher security. Compared with conventional DSP architecture or ARM architecture, the cost can be reduced by more than 30%. The chip size is also smaller, which can save space within the board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 is a structural block diagram of a health management unit according to an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the architecture of a main control module using the health management unit provided in an embodiment of the present invention;

[0024] Figure 3 It is a schematic diagram of the architecture of a system (multi-module) using the health management unit provided by an embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of the architecture of the health management software provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] All features disclosed in all embodiments in this specification, or steps in all methods or processes implicitly disclosed, except for mutually exclusive features and / or steps, can be combined and / or expanded or replaced in any manner.

[0027] In view of the situation in the background, the inventors of the present invention believe that it is necessary to develop an onboard health management unit with high versatility, high reliability, rich peripheral resources and low cost, which can be compatible with the health information collection needs of different architecture modules with rich peripheral resources, and can use a unified standard protocol to send, receive, monitor and manage health information between modules in the system.

[0028] Specifically, the demand for health management of modules in the avionics system of an aircraft platform, such as Figure 1 As shown, a universal health management unit based on a domestic MCU is provided, including: a domestic MCU chip, an external input clock, a FLASH module, a temperature sensor and a CAN interface chip; the external input clock, the FLASH module, the temperature sensor and the CAN interface chip are respectively connected to the domestic MCU chip, and the domestic MCU chip provides external peripheral interface resources. This solution is a universal module-level health management solution for airborne avionics systems, which can be flexibly deployed on the module.

[0029] Among them, in response to the airborne avionics system's demand for module health management, it provides up to 6 temperature acquisition interfaces, 6 UART serial ports, 20 AD voltage acquisition interfaces, 16 GPIO discrete signals, 8 MARK address interfaces for BIT information collection within the module, and provides two CAN buses to the outside. The health management units between modules are interconnected through the CAN bus. The health management unit that serves as the CAN master node (master control module) can collect information from other health management units that serve as CAN slave nodes.

[0030] It should be further explained that the normal operation of the health management unit requires an external 25MHz clock as the main working clock, a SPI interface FLASH is used to store the health management program, and a 3.3V module power supply is used to power the health management unit.

[0031] It is further explained that the health management unit provides up to 6 temperature acquisition interfaces, which are implemented by 2 temperature sensor chips (LC423A produced by China Electronics 47 Institute can be selected). Each temperature sensor can simultaneously collect the temperature of 3 modules. The acquisition end connects the temperature acquisition pin (DXP / DXN) of the device that needs to collect temperature to the input end of the temperature sensor, or places a transistor on the side of the chip to connect to the temperature sensor. The temperature sensor reports the temperature information to the MCU chip through the I2C interface. The health management software resident in the MCU is responsible for reading the reported temperature information. When designing the module, the number of temperature acquisition channels actually required can be selected.

[0032] It is further explained that the health management unit provides up to 20 channels of AD voltage collection, which is realized by the ADC interface of the MCU chip itself. The module samples the voltage to be collected through the preset voltage divider resistor, and the sampled value is input into the ADC interface of the MCU. The health management unit software restores the gain according to the size of the preset voltage divider resistor to obtain the collected voltage value. When designing the module, the voltage divider resistor can be selected according to the actual number of voltage collection channels required.

[0033] It is further explained that the health management unit provides up to 6 UART communication serial ports, which are implemented by the UART interface of the MCU chip itself, and support full-duplex asynchronous communication with a maximum rate of up to 4.5Mbps. These communication serial ports are usually connected to integrated circuit chips such as processors inside the module. The minimum system where the processor is located can collect BIT information that can be reported by itself (such as processor status, DDR status, FLASH status, EMMC status, high-speed interface status, etc.), and send this part of the information to the MCU chip according to the serial port protocol frame. The health management software can parse these serial port data.

[0034] It is further explained that the health management unit provides up to 16 GPIO discrete signals, which are implemented by the GPIO interface of the MCU chip itself, and can support the acquisition of discrete signals. They can be used to collect the status of hardware circuits in the module that indicate status through discrete levels, and the health management software can obtain the collected discrete levels.

[0035] It should be further explained that the 8-way MARK address provided by the health management unit is implemented by the GPIO pins of the MCU chip itself. In the system, each module has an independent MARK address to distinguish the physical location of the module in the system. The address is also synchronously collected by the health management unit as the CAN bus node ID of the module.

[0036] It should be further explained that the 2-channel CAN bus interface provided by the health management unit is realized by connecting 2 CAN bus interface chips externally to the MCU chip (SM65HVD230D produced by Shenzhen Guowei). The health management units of different modules are interconnected through the external CAN bus to form a maintenance bus based on the CAN protocol. Each CAN bus slave node can collect the health management information within the module and report all of it to the CAN master node through the CAN bus for unified management.

[0037] It is further explained that the health management unit as the CAN master node can use an SPI interface to connect to the SPI interface of the main processor in the module, and the main processor monitors and processes the collected BIT information of each node.

[0038] It is further explained that the debugging interface of the health management unit includes a JTAG interface, an LED light, a debugging serial port, etc.

[0039] It should be further explained that the JTAG interface is the debugging interface of the MCU chip. It is brought out through the debugging pin and can be connected to an external JLINK emulator for debugging and program downloading. The LED light is a breathing light, which can visually indicate the working status of the MCU chip and preliminarily determine whether the health management software residing on the MCU chip is started and running normally. The debugging serial port is a debugging printing serial port, which displays the key printing information of the MCU chip, and can also perform some debugging command operations through the shell window.

[0040] The hardware design of the health management unit of the present invention is described in detail above. The specific functions need to be implemented by the health management unit software resident on the MCU chip. It should be noted that whether it is a master node or a slave node of the CAN, the software and hardware of the health management unit are a set, and only the health management unit as the CAN master node will use the SPI interface.

[0041] It is further explained that the health management software includes BSP, a streamlined embedded operating system, an interface driver and an application layer. Among them, BSP and the operating system are the underlying boot programs, which configure power-on boot, task scheduling, synchronization mechanism, interrupt processing, etc.

[0042] The driver layer mainly involves the internal and external drivers of the MCU chip, providing data transmission and reception capabilities for the hardware interface, including:

[0043] (1) I2C driver: collect temperature information;

[0044] (2) SPI drive: The CAN master node module communicates with the main processor in the module through the SPI interface. The main processor is the MASTER and the MCU chip is the SLAVE. When the main processor sends data to the MCU chip, the main processor performs bus arbitration. The MCU chip directly moves the received data from the SPI peripheral to the memory through DMA. After completion, an interrupt is generated and processed. When the MCU chip needs to send data to the main processor, the MCU chip interrupts the main processor through GPIO. The main processor performs bus arbitration. The MCU chip moves the data to be sent in the memory to the SPI peripheral through DMA, and the main processor reads the data.

[0045] (3) ADC driver: collect voltage information through DMA transmission;

[0046] (4) UART driver: realize BIT information collection serial port, baud rate is 115200pbs, ​​1 start bit, 8 data bits, no parity bit, 1 stop bit; use software FIFO+

[0047] Data transmission and reception are realized by interruption mode, and the transmission and reception FIFO size is 1024 bytes;

[0048] (5) GPIO driver: filtering and collecting discrete state information;

[0049] (6) CAN driver: realizes the reception and transmission of communication messages of CAN2.0B extended frames, uses interrupts to realize the data transmission completion and reception response mechanism, and realizes the main redundant switching mechanism;

[0050] (7) FLASH drive: It is divided into internal FLASH drive and external FLASH drive. In addition to realizing the conventional read, write, and erase functions, it also realizes the storage of default parameters, electronic labels, maintenance logs and other information. It also performs wear leveling processing on frequently written data.

[0051] Among them, the application layer realizes the core functions of health management, mainly including:

[0052] (1) BIT function: As a health management unit of the CAN slave node, it will be connected through ADC, IIC,

[0053] The UART and GPIO peripheral interface drivers obtain the module BIT information and perform CAN protocol framing according to the ICD format requirements, send it to the health management unit as the CAN master node, and report it to the main processor connected to it through the SPI interface, supporting three forms of BIT query and reporting mechanisms: startup, periodic, and maintenance;

[0054] (2) Electronic label: records the hardware serial number, production date, manufacturer and other information of the module to facilitate module management;

[0055] (3) Maintenance log: Receive and store maintenance logs issued by the system to facilitate the management of module status;

[0056] (4) Default parameters: Support the issuance and query of default parameters;

[0057] (5) CAN bus communication: data packetization and subpacketization are realized based on the CAN interface driver.

[0058] Timeout retransmission and other functions;

[0059] Online upgrade: Supports sending and receiving ICD for online upgrade via CAN bus, realizing online upgrade of boot program and application program.

[0060] In other embodiments, Figure 2 As shown, the main control module in an avionics system provided by the present invention uses the architecture schematic diagram of the health management unit. The module itself includes an FPGA chip, a ZYNQ chip, a CPU chip, two bus daughter cards, an optical module chip, a power supply unit, etc. The health management unit of the present invention is used to collect health information inside the module, and the resources used include:

[0061] Temperature collection: 2 channels. The temperature of the power chip inside the module and the temperature of the optical module are collected through the temperature sensor chip and reported to the health management unit through the I2C interface. The temperature of the processor can be reported by the processor itself, without the need to use the temperature collection function of the health management unit;

[0062] Voltage collection: 7 channels. The health management unit samples the module's 12V input and the 6-channel secondary voltage converted by the power chip through the ADC pin;

[0063] GPIO acquisition: 4 channels. The FPGA startup flag signal, the A-bus daughter card startup flag signal, and the optical module's receiving and sending status indication signals are all indicated by levels, and the health management unit collects their discrete states through GPIO pins;

[0064] UART acquisition: 2 channels. The ZYNQ unit and the B-bus daughter card are a minimum system with other peripheral devices. Therefore, the ZYQN unit and the B-bus daughter card first collect some status information inside the small system (DDR status, processor status, high-speed interface status, flash status, file system status, etc.), and then send it to the health management unit through the serial port protocol;

[0065] MARK address collection: used for health management program to distinguish CAN bus ID;

[0066] CAN bus: 2 channels. Communicate with other CAN bus slave nodes;

[0067] SPI interface: 1 channel. As the master node of CAN, it reports all health management information collected by the health management unit through the CAN bus to the CPU (master) through the SPI interface for judgment and processing. The slave node of CAN does not involve this interface;

[0068] In summary, the health information of all key chips in the module can be collected by the health management unit. Similarly, other functional modules can select the required collection interface according to actual needs.

[0069] Figure 3 The figure shows a structural block diagram of an avionics subsystem provided by an embodiment of the present invention using the health management unit. The subsystem consists of two control modules (main and standby) and several functional modules. Each module uses the health management unit to collect health information within the module, and also stores electronic tag information and control parameter information locally according to the status of each module. The modules are interconnected by CAN bus to form a maintenance bus network.

[0070] In a further implementation, the main control module and the backup control module serve as master nodes on the maintenance bus and serve as hot backups for each other. Under normal circumstances, the main control module works as the CAN master node, and the backup control module only communicates with the main control module to keep it alive. When the main control module is found to be abnormal, the backup control module will perform a master-slave switch and continue to operate as the master node.

[0071] In a further implementation, the CPU unit and the health management unit in the main control module cooperate to access all slave nodes through ICD, report and query BIT information, report and query electronic tag information, send maintenance logs, send online upgrade instructions, etc. Through these mechanisms, the main control module can effectively monitor the operating status of each functional module in the system, and warn, report and handle possible faults.

[0072] Figure 4It is a schematic diagram of the software architecture of the health management software resident in the health management unit in an embodiment of the present invention, which shows the software hierarchy more clearly.

[0073] The present invention can provide a universal module-level health management solution for the modules inside the avionics system of the airborne platform. The design uses a domestic MCU chip as the processing core, runs a set of health management software based on the RT-Thread Nano embedded operating system, and cooperates with external CAN interface chips, temperature sensors and other peripherals to realize module health information collection, processing, storage and reporting; module electronic tag information storage and reporting; default parameters, working status information, maintenance log setting, storage and reporting; local and remote online upgrades; no less than 19 slave node CAN bus data forwarding and other functions.

[0074] The hardware of the present invention has achieved 100% localization, with higher safety performance, and compared with the common DSP architecture and CPU processor architecture, it has less resource waste, smaller circuit volume, lower cost, and better general characteristics. The hardware circuit of the present invention is rich in peripheral resources, with 6-way UART serial communication, 2-way CAN interface, 1-way SPI interface, 16-way GPIO interface, 8-way MARK discrete interface, 6-way temperature acquisition interface, and 20-way voltage acquisition. The UART serial port and GPIO interface of the health management unit can be selected inside the module according to actual needs to collect BIT information such as temperature, voltage, and working status of the core chip in the board. The health management units between modules are interconnected through the CAN bus. The health management unit as the CAN master node (main control module) can collect information from other health management units as CAN slave nodes, and complete the health management monitoring, arbitration and management of the entire system inside the main control module.

[0075] The rich peripheral resources and good versatility of the present invention meet the module-level health management requirements in the airborne avionics system, and improve the controllability, reliability and economy of the product with the design concept of localization, universalization and low cost.

[0076] The units involved in the embodiments of the present invention may be implemented by software or hardware, and the units described may also be arranged in a processor. The names of these units do not, in some cases, limit the units themselves.

[0077] According to one aspect of an embodiment of the present invention, a computer program product or a computer program is provided, the computer program product or the computer program includes a computer instruction, and the computer instruction is stored in a computer-readable storage medium. A processor of a computer device reads the computer instruction from the computer-readable storage medium, and the processor executes the computer instruction, so that the computer device executes the method provided in the above various optional implementations.

[0078] As another aspect, an embodiment of the present invention further provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or may exist independently without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the method described in the above embodiment.

Claims

1. An airborne universal health management unit based on a domestic MCU, characterized in that: include: Domestic MCU chip, external input clock, FLASH module, temperature sensor and CAN interface chip; the external input clock, FLASH module, temperature sensor and CAN interface chip are respectively connected to the domestic MCU chip, and the domestic MCU chip provides peripheral interface resources to the outside.

2. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The domestic MCU chip is specifically the HHDM600VEL7 chip, which has 6 UART serial ports, 20 AD voltage acquisitions, 16 GPIO discrete signals and 8 MARK address interfaces.

3. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: A health management software program based on an embedded operating system is configured on the domestic MCU chip. The software program adopts a layered structure, which includes four layers from bottom to top: a BSP layer, an embedded operating system layer, an interface driver layer, and an application layer; the BSP layer provides power-on boot, kernel architecture, and interface driver firmware library functions; the operating system layer provides task scheduling, synchronization mechanism, interrupt processing basic functions, and a streamlined shell required by the MCU embedded operating system; the driver layer provides encapsulation of device drivers related to the health management unit; The application layer implements the business requirements of the health management unit.

4. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The CAN interface chip includes two CAN bus transceiver paths, and data transmission and reception between the CAN buses are performed in accordance with the ICD file format, and the ICD file is formulated according to the maximum management capability of the health management unit.

5. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The MCU chip also includes a JTAG interface, which is used for debugging and program burning via a JLink emulator.

6. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The MCU chip also includes an RS232 debugging serial port, through which debugging information is monitored and electronic tag information is set.

7. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The temperature sensor is specifically an LC423A temperature sensor chip, and each temperature sensor simultaneously collects the temperature in the 3-way module, and the collection end connects the temperature collection pin of the device that needs to collect the temperature to the input end of the temperature sensor.

8. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The temperature sensor is specifically a transistor access temperature sensor, which reports temperature information to the MCU chip through the I2C interface, and the health management software configured in the MCU chip reads the reported temperature information.

9. The onboard universal health management unit based on domestic MCU according to claim 1 is characterized in that: The CAN interface chip specifically includes a SM65HVD230D chip.

10. An airborne universal health management device based on a domestic MCU, characterized in that: The health management unit comprises the health management unit as described in any one of claims 1 to 9, and the health management unit is transplanted into the circuit design of the device, and the required peripheral interface is used to collect and report the health information within the board according to the actual needs inside the module; the health management unit is used for a single module in the device to run independently, or for multiple modules in the device, and data exchange is carried out through the CAN bus interconnection.

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