Parameter processing method of multi-layer multi-cavity wallboard

Abstract

The embodiment of the invention relates to a parameter processing method of a multi-layer multi-cavity wallboard. The parameter processing method comprises the following steps: calculating an equivalent heat conductivity coefficient of a cavity core layer; calculating theoretical heat transfer coefficients of wallboards with different configuration parameters according to the equivalent cavity diameter and the cavity unit height; fitting to obtain a first relational expression between the equivalent cavity diameter and the height of the cavity unit; performing prefabrication according to the height of the prepared cavity unit and the prepared equivalent cavity diameter to obtain a to-be-tested wallboard; acquiring an actually measured heat transfer coefficient of the wallboard to be measured; determining a second relational expression between the actually measured heat transfer coefficient and the theoretical heat transfer coefficient; according to the second relational expression, the theoretical heat transfer coefficient is corrected, and the actual heat transfer coefficient is determined; according to the actual heat transfer coefficient and the first relational expression, the current cavity unit height and the current equivalent cavity diameter are determined; and according to the current cavity unit height and the current equivalent cavity diameter, determining a first design parameter of the cavity unit in the cavity core layer and determining a second design parameter of the two layers of panels, so as to carry out wallboard design through the first design parameter and the second design parameter.

Description

Technical Field

[0001] The invention relates to the technical field of data processing, and in particular to a parameter processing method for a multi-layer multi-cavity wallboard. Background Art

[0002] At present, most of the external wall thermal insulation measures must be reconstructed after the main structure is completed, which has significant defects such as low construction efficiency, damage to the main structure, and short service life. It is difficult to meet the current large-scale and high-growth construction needs in my country. It is urgent to explore multifunctional and high-performance wall panels that integrate decoration, load-bearing (filling), and thermal insulation to meet personalized needs. Summary of the invention

[0003] The purpose of the present invention is to provide a parameter processing method for a multi-layer multi-cavity wallboard in view of the defects in the prior art, so as to solve the problems in the prior art.

[0004] To achieve the above object, the present invention provides a parameter processing method for a multi-layer multi-cavity wall panel in a first aspect, comprising: The equivalent thermal conductivity of the cavity core layer is calculated according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels; the equivalent thermal conductivity of the radiation thermal conductivity is related to the equivalent cavity diameter of the cavity unit and the cavity unit height; According to the equivalent thermal conductivity of the cavity core layer, the theoretical heat transfer coefficient of the wall panels with different configuration parameters is calculated; According to different equivalent cavity diameters, different cavity unit heights and corresponding theoretical heat transfer coefficients, a first relationship between the equivalent cavity diameter and the cavity unit height is obtained by fitting; According to the first relationship, determine the prepared cavity unit height and the prepared equivalent cavity diameter of the pre-prepared wallboard, and perform pre-preparation according to the prepared cavity unit height and the prepared equivalent cavity diameter to obtain the wallboard to be tested; Obtaining the measured heat transfer coefficient of the wall panel to be tested; Determine a second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient; According to the second relationship, the theoretical heat transfer coefficient is corrected to determine the actual heat transfer coefficient; Determine a current cavity unit height and a current equivalent cavity diameter according to the actual heat transfer coefficient and the first relationship; According to the current cavity unit height and the current equivalent cavity diameter, the first design parameters of the cavity unit in the cavity core layer and the second design parameters of the two-layer panel are determined, so as to design the wall panel according to the first design parameters and the second design parameters.

[0005] In a possible implementation, the calculation of the equivalent thermal conductivity of the cavity core layer according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels specifically includes: Calculate the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall and the thermal conductivity of the solid part material of the cavity core layer to obtain a first product; The second product is obtained by subtracting the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall from 1 and the thermal conductivity of the gas medium inside the cavity core layer; Calculating the sum of the first product, the second product and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels to obtain the equivalent thermal conductivity of the cavity core layer; The equivalent thermal conductivity coefficient of the radiation thermal conductivity between the two panels is obtained by multiplying the product of the intermediate parameter, the Stefan-Boltzmann constant, the average temperature of the cavity core layer, and the height of the insulation cavity by 4; The intermediate parameter is obtained by adding the second constant to the power of the first constant to the ratio of the cavity unit height to the equivalent cavity diameter of the cavity unit, multiplying the third constant power of the emissivity of the cavity layer by the fourth constant power of the sum of the ratio and 1, and then multiplying by the fifth constant.

[0006] In a possible implementation, obtaining the measured heat transfer coefficient of the wallboard to be measured specifically includes: The measured heat transfer coefficient of the prepared wall panels was tested by a guarded hot box test under steady-state heat transfer conditions.

[0007] In a possible implementation, the fitting of the first relationship between the equivalent cavity diameter and the cavity unit height according to different equivalent cavity diameters, different cavity unit heights and corresponding wallboard theoretical heat transfer coefficients specifically includes: Determine the equivalent cavity diameter of a cavity unit and determine the height of a cavity unit, and calculate a theoretical heat transfer coefficient of a wall panel until the change of the obtained theoretical heat transfer coefficient tends to converge; According to multiple sets of equivalent cavity diameters, cavity unit heights and wall panel theoretical heat transfer coefficients, the first relationship is obtained by fitting.

[0008] In a possible implementation, the second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient specifically includes: According to the prepared cavity unit height and the corresponding prepared equivalent cavity diameter, the corresponding wall panel theoretical heat transfer coefficient is calculated; The ratio of the measured heat transfer coefficient to the theoretical heat transfer coefficient is calculated, and the ratio is used as a second relationship; wherein the measured heat transfer coefficient is the heat transfer coefficient of the wall panel measured under a steady-state heat transfer state.

[0009] In a possible implementation, the correcting the theoretical heat transfer coefficient of the wallboard according to the second relationship to determine the actual heat transfer coefficient specifically includes: The theoretical heat transfer coefficient is corrected by multiplying the second relationship by the theoretical heat transfer coefficient to determine the actual heat transfer coefficient.

[0010] In a possible implementation, the first design parameter includes a current cavity unit height and a current equivalent cavity diameter, the second design parameter includes a panel thickness, and determining the first design parameter of the cavity unit in the cavity core layer and determining the second design parameter of the two-layer panel according to the current cavity unit height and the current equivalent cavity diameter specifically includes: according to , calculate the cavity concrete volume in each flat cavity; where d is the cavity wall thickness of the cavity unit, D is the equivalent cavity diameter, H is the current cavity unit height, and n is the number of panel layers; according to Calculate the concrete volume of the panel per square meter of the wall; where L is the thickness of the panel; according to Calculate the total concrete volume per square meter of multi-layer and multi-cavity walls; It is the total concrete volume of multi-layer and multi-cavity walls per square meter.

[0011] In a possible implementation, the fitting of the first relationship between the equivalent cavity diameter and the cavity unit height according to different equivalent cavity diameters, different cavity unit heights and corresponding wallboard theoretical heat transfer coefficients specifically includes: When it is the first type of wallboard, the first relationship is D 1,sweet =147*exp(-(H+L) / 151)+144; where D 1,sweet is the equivalent cavity diameter of the first type of wall panel, H is the cavity unit height, and L is the panel thickness; When it is the second type of wallboard, the first relationship is D 2,sweet =147*exp(-(H+L) / 151)+84; where D 2,sweet is the equivalent cavity diameter of the second type of wall panel.

[0012] In a possible implementation, the cavity core layer is filled with a lightweight high thermal resistance material or a high thermal enthalpy phase change energy storage material, the lightweight high thermal resistance material includes a polyurethane foaming agent; the high thermal enthalpy phase change energy storage material includes paraffin, and the high thermal enthalpy phase change energy storage material is encapsulated by a polymer material.

[0013] In a possible implementation, the cavity core layer includes a plurality of core columns, and two cross sections of the core columns are respectively connected to two layers of panels; and the cross-sectional diameter of the core columns is not less than 10% of the equivalent cavity diameter.

[0014] In a second aspect, the present invention provides a device including a memory and a processor, wherein the memory is used to store programs, and the processor is used to execute any method described in the first aspect.

[0015] In a third aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, any method described in the first aspect is performed.

[0016] By applying the parameter processing method of the multi-layer and multi-cavity wall panel provided by the present invention, the equivalent thermal conductivity of the cavity core layer can be calculated according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels; the equivalent thermal conductivity of the radiation thermal conductivity is related to the equivalent cavity diameter and the cavity unit height of the cavity unit; according to different equivalent cavity diameters and different cavity unit heights, the theoretical heat transfer coefficients of different wall panels are calculated; according to different equivalent cavity diameters, different cavity unit heights and the corresponding theoretical heat transfer coefficients of the wall panels, the first relationship between the equivalent cavity diameter and the cavity unit height is fitted; according to the first relationship, the prepared cavity unit height and the prepared equivalent cavity diameter of the pre-prepared wall panel are determined, and the prepared cavity unit height and the prepared equivalent cavity diameter are calculated according to the prepared cavity unit height and the prepared equivalent cavity diameter. Pre-preparation, obtain the wall panel to be tested; obtain the measured heat transfer coefficient of the wall panel to be tested; determine the second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient; according to the second relationship, correct the theoretical heat transfer coefficient to determine the actual heat transfer coefficient; according to the actual heat transfer coefficient and the first relationship, determine the current cavity unit height and the current equivalent cavity diameter; according to the current cavity unit height and the current equivalent cavity diameter, determine the first design parameters of the cavity unit in the cavity core layer and the second design parameters of the two-layer panel, so as to design the wall panel according to the first design parameters and the second design parameters. The wall panel designed according to the design parameters ensures that the thermal insulation performance meets the requirements, and can meet different thermal insulation requirements by adjusting the cavity unit height and the equivalent cavity diameter, as well as the number of layers, so as to realize the adjustment of the thermal insulation performance of different walls, which greatly ensures the personalized requirements of the thermal insulation performance of the wall. Furthermore, the equivalent cavity diameter and cavity unit height of the present application are correlated with the total concrete volume of the wall, the total concrete volume of the panel and the total concrete volume of the cavity, thereby ensuring that the load-bearing capacity and thermal insulation capacity of the wall are taken into account. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1One of the flow charts of the parameter processing method of the multi-layer multi-cavity wallboard provided by the embodiment of the present invention; FIG2 (A) is a schematic diagram of a multi-layer multi-cavity wallboard provided by the present invention; FIG2(B) is an enlarged schematic diagram of the cavity unit in FIG2(A); FIG2(C) is a schematic diagram of the equivalent cavity diameter and cavity height of the cavity unit in FIG2(B); Figure 3 (A) is a schematic diagram of the cavity unit and the core column; FIG3 (B) is an enlarged schematic diagram of the cavity unit and the core column in FIG3 (A); Figure 4 It is a schematic diagram of the variation of the theoretical heat transfer coefficient of the first type of wall panel with the cavity height (i.e., wall thickness) and the equivalent cavity diameter; Figure 5 It is a schematic diagram showing the variation of the theoretical heat transfer coefficient of the second type of wall panel with the cavity height (i.e., wall thickness) and the equivalent cavity diameter; Figure 6 It is a schematic diagram of the variation law of the sweet value of the wall panel cavity diameter with the wall thickness and the fitting curve; Figure 7 (A) is a schematic diagram of 4 panels + 3 honeycombs when the wall thickness is 240 mm; Figure 7 (B) is a schematic diagram of a wall with a thickness of 350mm4 panels + 3 honeycombs; Figure 7 (C) is a schematic diagram of the panel + 3 honeycomb of W-12 when the panel thickness is 50 mm; Figure 7 (D) is a schematic diagram of the W-123 honeycomb of W-12 when the panel thickness is 45 mm; Figure 7 (E) is a schematic diagram of 4 panels + 3 honeycombs of W-24 when the panel thickness is 45 mm and the equivalent cavity diameter is 110 mm; Figure 7 (F) is a schematic diagram of 5 panels + 4 honeycombs of W-37 when the panel thickness is 45 mm and the equivalent cavity diameter is 115 mm; Figure 7 (G) is a schematic diagram of 6 panels + 5 honeycombs of W49 when the panel thickness is 45 mm and the equivalent cavity diameters are 110 mm and 120 mm respectively; Figure 8 This is one of the schematic diagrams of the process for manufacturing multi-layer and multi-cavity wall panels; Fig. 9 This is the second schematic diagram of the process for manufacturing multi-layer multi-cavity wall panels; Fig.10 Based on Figure 8 One of the schematic diagrams of the multi-layer multi-cavity wallboard prepared by the method described; Fig.11 Based on Figure 8 The second schematic diagram of the multi-layer multi-cavity wall panel prepared by the method described. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments.

[0020] Figure 1 A flow chart of a parameter processing method for a multi-layer multi-cavity wall panel provided in an embodiment of the present invention, wherein the multi-layer multi-cavity wall panel comprises a cavity core layer and at least two panels, and the cavity core layer is disposed between the two panels. The cavity core layer is filled with a lightweight high thermal resistance material or a high thermal enthalpy phase change energy storage material, and the lightweight high thermal resistance material comprises a polyurethane foaming agent to block heat convection and heat radiation of the cavity air; the high thermal enthalpy phase change energy storage material comprises paraffin, and the paraffin is encapsulated by a polymer material, which can reduce the impact of outdoor temperature fluctuations on the indoor thermal environment through phase change. The following is combined with Figure 1 , the technical solution of the present invention is described with a specific embodiment. As shown in FIG1 , the present application includes the following steps: Step 110, calculating the equivalent thermal conductivity of the cavity core layer according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels; Among them, the equivalent thermal conductivity of radiation thermal conductivity is related to the equivalent cavity diameter of the cavity unit and the cavity unit height.

[0021] The multi-layer multi-cavity wall shown in Figures 2 (A)-2 (C) is composed of two layers of high-strength surface layers sandwiching a cavity core layer. The multi-layer multi-cavity wall panel includes two layers of panels, and the cavity core layer is composed of multiple cavity units. The cavity unit refers to a hexagonal unit, the equivalent cavity diameter refers to the length of the diagonal of the hexagon, and the cavity wall thickness refers to the wall thickness of the cavity unit. As shown in Figures 3 (A) and 3 (B), the cavity core layer includes multiple core columns, and the two cross sections of the core column are respectively connected to the two layers of panels; the cross-sectional diameter of the core column is not less than 10% of the equivalent cavity diameter. By setting this ratio, the cross-sectional area of ​​the core column is increased, and the stress concentration in this part is reduced, thereby improving the overall bearing capacity. The heat flow transfer mode of the wall includes three parts: ① heat conduction through the solid part of the cavity core layer; ② radiation conduction between the two surface layers; ③ conduction through the gas medium in the cavity core layer. Taking the above three heat transfer modes into consideration, the equivalent thermal conductivity of the cavity core layer can be calculated by the following method: Calculate the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall and the thermal conductivity of the solid part material of the cavity core layer to obtain a first product; The second product is obtained by subtracting the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall from 1 and the thermal conductivity of the gas medium inside the cavity core layer; The sum of the first product, the second product and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels is calculated to obtain the equivalent thermal conductivity of the cavity core layer.

[0022] The equivalent thermal conductivity coefficient of the radiation thermal conductivity between the two panels is obtained by multiplying the product of the intermediate parameter, the Stefan-Boltzmann constant, the average temperature of the cavity core layer, and the height of the insulation cavity by 4; The intermediate parameter is obtained by adding the second constant to the power of the first constant to the ratio of the cavity unit height to the equivalent cavity diameter of the cavity unit, multiplying the third constant power of the emissivity of the cavity layer by the fourth constant power of the sum of the ratio and 1, and then multiplying by the fifth constant.

[0023] Specifically, the equivalent thermal conductivity of the cavity core layer can be calculated by the following formula:

[0024] Among them, k e is the equivalent thermal conductivity of the cavity core layer, k1 is the thermal conductivity of the solid part of the cavity core layer, k2 is the thermal conductivity of the gas medium inside the cavity core layer, k3 is the equivalent thermal conductivity of the radiation thermal conductivity between the two panels, A0 is the cross-sectional area of ​​the cavity core layer wall, and A is the total cross-sectional area of ​​the cavity core layer wall.

[0025] according to Calculate the equivalent thermal conductivity of the radiation thermal conductivity between the two panels, where σ is the Stefan-Boltzmann constant, ξ is the intermediate parameter, and Tavg is the average temperature of the cavity core. Calculate the intermediate parameters; where η=H / D, D is the equivalent cavity diameter of the cavity unit, ε is the emissivity of the cavity core layer, H is the cavity unit height, the first constant is 0.3, the second constant is -0.69, the third constant is 1.63, the fourth constant is -0.89, and the fifth constant is 0.664.

[0026] It is found through trial calculation that the cavity wall thickness d of the cavity unit has little effect on the theoretical heat transfer coefficient of the wall. Therefore, the following mainly calculates and discusses the theoretical heat transfer coefficient of the wall with different equivalent cavity diameters D and different cavity unit heights H.

[0027] Step 120, calculating different theoretical heat transfer coefficients of wall panels according to the equivalent thermal conductivity of the cavity core layer.

[0028] Specifically, different materials are selected, and different equivalent cavity diameters and cavity unit heights are assigned to determine the equivalent thermal conductivity of the cavity core layer. Then, according to the equivalent cavity diameter, cavity unit height and equivalent thermal conductivity of the cavity core layer, refer to Article 3.4 of GB50176-2016 to calculate the theoretical heat transfer coefficient of the multi-layer multi-cavity wall panel. In this application, three wall substrates, ultra-high performance concrete (UHPC), self-compacting concrete (SCC) and glass fiber reinforced gypsum (GRG), can be used as examples for wall panel design. The values ​​of material thermal conductivity and wall panel structural dimensions are shown in Table 1. The first type of wall panel surface material uses UHPC as the surface layer substrate and SCC as the cavity substrate; the second type of wall panel surface layer and cavity substrate both use GRG; the cavity wall thickness and surface layer thickness of both types of wall panels use the values ​​in Table 1. The unit of thermal conductivity is W / (m·K).

[0029] Table 1

[0030] The multi-layer multi-cavity wall with 2 surface layers + 1 cavity layer was initially selected for calculation. The theoretical heat transfer coefficient of the first type of wall panel (surface layer UHPC + cavity SCC) is shown in Table 2, with the unit of W / (m 2 ·K).

[0031] Table 2

[0032] Among them, the wall thickness includes the sum of the cavity unit height and the panel thickness. When there are multiple layers of panels, the panel thickness refers to the sum of the thicknesses of the multiple layers of panels. When there are multiple layers of cavity units, the cavity unit height refers to the sum of the heights of the multiple layers of cavity units. As for the number of panels and the number of cavity units in this application, they can be set according to actual needs, and this application does not limit this.

[0033] The obtained variation law of the theoretical heat transfer coefficient of the first type of wall panel (surface UHPC + cavity SCC) with wall thickness and equivalent cavity diameter can be found in Figure 4 ,from Figure 4It can be seen that the theoretical heat transfer coefficient of the wall gradually decreases with the increase of the cavity unit height and equivalent cavity diameter; for a 120mm thick wall, after the equivalent cavity diameter of the cavity unit increases to 210mm, the change of the equivalent cavity diameter has no significant effect on the theoretical heat transfer coefficient of the wall; for a 240mm thick wall, after the equivalent cavity diameter of the cavity unit increases to 180mm, the change of the equivalent cavity diameter has no significant effect on the theoretical heat transfer coefficient of the wall; for a wall thicker than 370mm, after the equivalent cavity diameter of the cavity unit increases to 150mm, the change of the equivalent cavity diameter has no significant effect on the heat transfer coefficient of the wall; for walls with different equivalent cavity diameters of cavity units, after the wall thickness increases to 370mm, the change of the wall thickness has no significant effect on the heat transfer coefficient of the wall. It can be found that whether increasing the panel thickness or increasing the equivalent cavity diameter can significantly reduce the heat transfer coefficient of the wall panel, but there is also a certain gain limit. For the first type of wall panels, when the wall thickness exceeds 370mm and the cavity diameter exceeds 210mm, further increasing the wall thickness and equivalent cavity diameter will have a very limited effect on the theoretical heat transfer coefficient of the wall panels. Instead, it will increase the weight of the wall panels (increase the wall thickness) and reduce the bearing capacity of the wall panels (increase the cavity diameter). Therefore, for the first type of wall panels, it is recommended to adjust the heat transfer coefficient of the wall panels within the wall thickness of 370mm and the cavity diameter of 200mm according to the requirements of thermal insulation performance. In the following, these two size limits are referred to as the "sweet value of wall thickness" and "sweet value of cavity diameter" respectively.

[0034] The calculation results of the second type of wall panels (surface GRG + cavity GRG) are shown in Table 3. Table 3 shows the theoretical heat transfer coefficient of the second type of wall panels, in units of W / (m 2 ·K).

[0035] Table 3

[0036] The second type of wall panel (surface GRG + cavity GRG) theoretical heat transfer coefficient changes with the cavity unit height (i.e. wall thickness) and equivalent cavity diameter as shown below: Figure 5 As shown. With the increase of panel thickness and equivalent cavity diameter, the change trend of the theoretical heat transfer coefficient of the second type of wall panels is different from that of the first type of wall panels. When the second type of wall panels exceeds the wall thickness sweet value and cavity diameter sweet value, the increase in wall thickness and equivalent cavity diameter will cause an increase in the theoretical heat transfer coefficient of the wall panels. At the same time, the wall thickness sweet values ​​of the two types of wall panels are similar, both at around 370mm, but the cavity diameter sweet value of the second type of wall panels is only about 50% of that of the first type of wall panels. This shows that the cavity diameter sweet value of the wall panel is greatly affected by the thermal conductivity of the substrate, and the two are approximately in direct proportion. A larger substrate thermal conductivity means a larger cavity diameter sweet value.

[0037] Step 130, fitting a first relationship between the equivalent cavity diameter and the cavity unit height according to different equivalent cavity diameters, different cavity unit heights and corresponding wallboard theoretical heat transfer coefficients; The law of the cavity diameter sweet value of the two types of wall panels changing with the wall thickness is as follows Figure 6 As shown in the figure, it can be seen that the cavity diameter sweetness of the two types of wall panels gradually decreases with the increase of wall thickness. By fitting the test data, the first relationship between the equivalent cavity diameter of the two types of wall panels and the cavity unit height can be obtained.

[0038] Specifically, the equivalent cavity diameter of a cavity unit and the height of a cavity unit can be determined, and a theoretical heat transfer coefficient can be calculated until the change of the obtained theoretical heat transfer coefficient tends to converge; the convergence at this time is a tendency to stability, and the first relationship is fitted based on multiple sets of equivalent cavity diameters, cavity unit heights and wall panel theoretical heat transfer coefficients.

[0039] When it is the first type of wall panel, the first relationship is D 1,sweet =147*exp(-(H+L) / 151)+144; where D 1,sweet is the equivalent cavity diameter of the first type of wall panel, H is the cavity unit height, and L is the panel thickness; When it is the second type of wall panel, the first relationship is D 2,sweet =147*exp(-(H+L) / 151)+84; where D 2,sweet is the equivalent cavity diameter of the second type of wall panel.

[0040] It can be understood that L here refers to the sum of the thickness of all panels, and H refers to the sum of the equivalent unit heights of all layers. As for the specific number of panels and cavity core layers, this application does not limit this.

[0041] Step 140, determining the prepared cavity unit height and the prepared equivalent cavity diameter of the pre-prepared wallboard according to the first relationship, and performing pre-preparation according to the prepared cavity unit height and the prepared equivalent cavity diameter to obtain the wallboard to be tested; Specifically, taking the first type of wallboard as an example, based on the first relationship, the prepared equivalent cavity diameter and the prepared cavity unit height are determined. At this time, the prepared equivalent cavity diameter refers to the equivalent cavity diameter of the pre-prepared wallboard, and the prepared cavity unit height refers to the cavity unit height of the pre-prepared wallboard. The wallboard to be tested is the wallboard after the pre-prepared wallboard is prepared. The cavity units in the cavity core layer of 2 surface layers + 1 with a cavity diameter sweet value of 200mm and a wall thickness sweet value of 250mm are prepared respectively, the cavity wall thickness and the panel thickness are both 10mm, and the cavity unit height is 50mm.

[0042] Specifically, according to the variation law of the theoretical heat transfer coefficient of the single-layer, multi-layer, multi-cavity wall with the wall thickness and equivalent cavity diameter, the cavity is designed according to the equivalent cavity diameter of the cavity unit with different wall thicknesses. The wall design parameters and theoretical heat transfer coefficient are shown in Table 4 (the design parameters not listed are the same as those in Table 1). Table 4 shows the design parameters and theoretical heat transfer coefficients of multi-layer, multi-cavity walls with different thicknesses.

[0043] Table 4

[0044] Table 5 lists the requirements for exterior wall heat transfer coefficients in current residential building energy-saving design standards.

[0045] Table 5

[0046] By comparing Table 5, it can be found that for the first type of wall panels, walls with a wall thickness exceeding 490mm and an equivalent cavity diameter of the cavity unit exceeding 150mm can meet the exterior wall heat transfer coefficient requirements of the energy-saving design standard for residential buildings (energy saving 75%) (DB13(J) 185-2020); for the second type of wall panels, walls with a wall thickness exceeding 120mm and an equivalent cavity diameter exceeding 210mm can meet the exterior wall heat transfer coefficient requirements of the energy-saving design standard for residential buildings (energy saving 75%) (DB13(J) 185-2020), and when the wall thickness is greater than 120mm, the wall with an equivalent cavity diameter of the cavity unit less than 210mm can still meet the exterior wall heat transfer coefficient requirements of DB13(J) 185.

[0047] Step 150, obtaining the measured heat transfer coefficient of the wall panel to be tested; Specifically, after the wall panel to be tested is prepared, the measured heat transfer coefficient of the prepared wall panel is tested by a protective heat box test under a steady-state heat transfer state. The test results are shown in Table 6, which is a protective heat box test result table.

[0048] Table 6

[0049] Step 160, determining a second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient; Specifically, the corresponding theoretical heat transfer coefficient of the wall panel is calculated according to the prepared cavity unit height and the corresponding prepared equivalent cavity diameter; the ratio of the measured heat transfer coefficient to the theoretical heat transfer coefficient is calculated, and the ratio is used as the second relationship; wherein the measured heat transfer coefficient is the heat transfer coefficient of the wall panel to be measured under a steady-state heat transfer state.

[0050] Specifically, the calculated value in Table 6 is the theoretical heat transfer coefficient calculated in step 110. It can be seen from Table 6 that the measured value of the measured heat transfer coefficient of the wallboard to be tested is approximately 0.6 times the theoretical heat transfer coefficient calculated in step 110. The calculated value and the measured value in Table 6 are fitted to obtain a second relationship. Considering the test error and sufficient heat transfer performance reserve, the second relationship can be expressed as the ratio of the measured heat transfer coefficient to the theoretical heat transfer coefficient.

[0051] Step 170, correcting the theoretical heat transfer coefficient according to the second relationship to determine the actual heat transfer coefficient; Specifically, the theoretical heat transfer coefficient is corrected by multiplying the second relationship by the theoretical heat transfer coefficient, so that the corrected theoretical heat transfer coefficient is used as the actual heat transfer coefficient.

[0052] Step 180, determining the current cavity unit height and the current equivalent cavity diameter according to the actual heat transfer coefficient and the first relationship; Specifically, after determining the actual heat transfer coefficient, the actual heat transfer coefficient can be substituted into step 120 to re-determine the equivalent cavity diameter and the cavity unit height, and the equivalent cavity diameter determined at this time is used as the current equivalent cavity diameter, and the cavity unit height determined at this time is used as the equivalent cavity unit height, and the wall thickness value is determined based on the determined cavity unit height and the panel thickness of the wall panel currently to be prepared.

[0053] Step 190, determining first design parameters of the cavity units in the cavity core layer and second design parameters of the two-layer panel according to the current cavity unit height and the current equivalent cavity diameter, so as to design the wall panel according to the first design parameters and the second design parameters.

[0054] Among them, the first design parameter includes the current cavity unit height and the current equivalent cavity diameter, and the second design parameter includes the panel thickness, the number of panel layers, the cavity concrete volume per square cavity, the panel concrete volume per square wall, and the total concrete volume of multi-layer multi-cavity wall per square. The cross-sectional shape of the cavity unit in the multi-layer multi-cavity wall includes but is not limited to a circle, a rectangle, and a regular hexagon, and the cavity design parameters and the concrete volume of each square multi-layer multi-cavity wall must satisfy the following relationship.

[0055] according to , calculate the concrete volume of the cavity layer in each flat cavity; where d is the cavity wall thickness, D is the equivalent cavity diameter, H is the current cavity unit height, and n is the number of panel layers; 1000 represents the horizontal projection area of ​​the wall, and the unit is: mm 2 .

[0056] according to Calculate the concrete volume of the panel per square meter of the wall; where L is the thickness of the panel; according to Calculate the total concrete volume of multi-layer and multi-cavity walls per square meter; the total concrete volume of multi-layer and multi-cavity walls per square meter.

[0057] in, The total concrete volume of multi-layer and multi-cavity walls per square meter, in mm 3 ; The concrete volume of the panel per square meter of the wall, in mm 3 ; The volume of concrete in the cavity per square meter of the wall, in mm 3 ; The panel thickness L ranges from 1-60mm; the number of panel layers n ranges from 2-10 layers (rounded); the equivalent cavity diameter D, that is, the inner diameter of the cavity ranges from 10-720mm; the cavity wall thickness d ranges from 0.1-60mm; the cavity height H ranges from 1-720mm.

[0058] Figures 7 (A) to 7 (G) are schematic diagrams of multi-layer multi-cavity wall panels designed according to the parameters determined by the parameter processing method of the multi-layer multi-cavity wall panel of the present application. It can be seen from Figures 7 (A) to 7 (G) that, under the premise that the equivalent cavity diameter and the equivalent height of the cavity unit are determined, different thermal insulation effects can be achieved by adjusting the panel thickness and the number of panel layers. Under the premise that the panel thickness and the number of panel layers are determined, different thermal insulation effects can also be achieved by adjusting the equivalent cavity diameter and the cavity unit height. The specific design can be based on user needs to ensure the personalized setting of thermal insulation and heat insulation effects.

[0059] In one example, if Figure 8 As shown, Figure 8 Schematic diagram of multi-layer multi-cavity wallboard preparation based on parameter processing of multi-layer multi-cavity wallboard. Figure 8 In the figure, 1 represents the exterior wall panel, 2 represents the cavity layer, 3 represents the sandwich panel, 4 represents the second cavity layer, and 5 represents the interior wall panel. Figure 8 As shown, the following steps are included: Step 1: pouring the exterior wall panel 1 and roughening the inner side of the exterior wall panel 1; Step 2: pouring the first cavity layer 2, the top of the cavity layer 2 is a sealing thin layer, the thickness of the thin layer is ≤5mm, and the sealing thin layer is roughened; Step 3, casting the sandwich panel 3, and roughening the inner side of the sandwich panel 3; Step 4: pouring the second cavity layer 4, the top of the cavity layer 4 is a sealing thin layer, the thickness of the thin layer is ≤5mm, and the sealing thin layer is roughened; Step five: pouring the interior wall panels 5. The interior wall panels 5 can be customized in terms of materials, patterns and textures according to interior decoration requirements.

[0060] In another example, Fig. 9 As shown, the preparation process can be further optimized, and ribs can be added to the honeycomb-surface layer and honeycomb-honeycomb interlayer connections to improve the reliability of interlayer connections. Taking the preparation process of single-layer honeycomb (U-1 unit) and double-layer honeycomb (U-2) units as examples, the preparation process examples are given as follows: Step 1: Assemble the steel mold. The steel mold consists of four side panels, a bottom plate and several hollow honeycombs. The components are connected by bolts. Fig. 9The orange and red dots on the ribs are used to position the circular holes with a diameter of 20 mm × 10 mm. Step 2: First pouring: pour SCC into the steel mold, vibrate and compact it, and cover it with film and maintain it indoors for 24 hours; Step 3: demoulding for the first time, removing the steel molds one by one, and forming cylindrical convex ribs at the aforementioned "convex rib positioning" positions of the honeycomb nodes of the formed units, so as to form a reliable connection with the secondary pouring SCC; Step 4: Filling the honeycomb cavity with the foaming agent, and cutting the overflowed foaming agent flat along the large surface; Step 5: Secondary pouring: artificially roughen the secondary pouring contact surface, support the formwork along the side of the unit, and then cast SCC to form the panel (colored SCC can also be used to cast the surface layer); Step six, secondary demoulding, demoulding after 24 hours of indoor curing, and continuing indoor curing for 28 days.

[0061] In addition, after the U-1 unit is demoulded for the first time, the foaming agent is not filled. During the second pouring, the surface layer is cast by supporting the formwork and the contact surface of the formed unit is roughened. Before the initial setting of the surface concrete, the formed unit is buckled onto the surface concrete. Figure 10-11 The multi-layer multi-cavity wall panel includes a panel layer 10 and a cavity layer which are stacked in sequence. The cavity layer is provided with three layers, namely a first cavity layer 11, a second cavity layer 12 and a third cavity layer 13. Each cavity layer includes a plurality of cavity units 14 with a hexagonal cross-section, and the cavity unit is a heat-insulating cavity. The hexagonal cavity units are arranged in a honeycomb shape, and the cavity walls of the cavity units between two adjacent cavity layers are arranged in staggered ribs to achieve the best bearing effect. The panel layer and the cavity layer sealing layer are both based on concrete. In order to enhance the heat insulation effect of the panel layer and the cavity layer, the panel layer adopts ultra-high performance concrete, and the cavity layer adopts vitrified microsphere insulation concrete, wherein the ratio of the total volume of concrete used in the cavity layer to the total volume of concrete used in the panel layer ranges from 0.035 to 24.827.

[0062] It is understandable that the present application can first form the cavity and then fill it with material, or first position the cavity material and then use the cavity material as a mold to prepare the hollow wall. The implementation of the present application is not affected by the order of process preparation.

[0063] During preparation, the thickness L of the panel layer 10 is 10 mm, the cavity wall thickness d of the cavity unit 14 is 6 mm, the equivalent cavity D of the cavity unit is 365 mm, the total height of the cavity unit is also 365 mm, the cavity heights of the first cavity layer and the third cavity layer are 35 mm, and the cavity unit height of the second cavity layer is 295 mm. The formula in step 190 can be used to calculate that the ratio of the total volume of concrete used in the cavity layer to the total volume of concrete used in the panel layer is 0.302.

[0064] When the wall panels are used for insulation and filling, the cavity unit height of the second cavity layer 12 is 300 mm, the cavity unit height of the first cavity layer 11 and the third cavity layer 13 is optimally 45 mm, the thickness L of the panel layer 10 is 10 mm, the cavity wall thickness d of the cavity unit 14 is 6 mm, and the equivalent cavity diameter D is 180 mm. The formula in step 190 can be used to calculate that the ratio of the total volume of concrete used in the cavity layer to the total volume of concrete used in the panel layer is 0.66.

[0065] When the wall panel is used for insulation and load-bearing, the cavity unit height of the second cavity layer 12 is 97.5 mm, the cavity unit height of the first cavity layer 11 and the third cavity layer 13 is 30 mm, the thickness L of the panel layer 10 is 10 mm, the cavity wall thickness d of the insulation cavity 14 is 6 mm, and the equivalent cavity diameter D is 180 mm. The formula in the above step 190 can be used to calculate that the ratio of the total volume of concrete used in the cavity layer to the total volume of concrete used in the panel layer is 0.267.

[0066] By applying the parameter processing method of the multi-layer and multi-cavity wall panel provided by the present invention, the equivalent thermal conductivity of the cavity core layer can be calculated according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels; the equivalent thermal conductivity of the radiation thermal conductivity is related to the equivalent cavity diameter and the cavity unit height of the cavity unit; according to different equivalent cavity diameters and different cavity unit heights, the theoretical heat transfer coefficients of different wall panels are calculated; according to different equivalent cavity diameters, different cavity unit heights and the corresponding theoretical heat transfer coefficients, the first relationship between the equivalent cavity diameter and the cavity unit height is fitted; according to the first relationship, the prepared cavity unit height and the prepared equivalent cavity diameter of the pre-prepared wall panel are determined, and the prepared cavity unit height and the prepared equivalent cavity diameter are calculated according to the prepared cavity unit height and the prepared equivalent cavity diameter. Pre-preparation, obtain the wall panel to be tested; obtain the measured heat transfer coefficient of the wall panel to be tested; determine the second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient; according to the second relationship, correct the theoretical heat transfer to determine the actual heat transfer coefficient; according to the actual heat transfer coefficient and the first relationship, determine the current cavity unit height and the current equivalent cavity diameter; according to the current cavity unit height and the current equivalent cavity diameter, determine the first design parameters of the cavity unit in the cavity core layer and the second design parameters of the two-layer panel, so as to design the wall panel according to the first design parameters and the second design parameters. The wall panel designed according to the design parameters ensures that the thermal insulation performance meets the requirements, and can meet different thermal insulation requirements by adjusting the cavity unit height and the equivalent cavity diameter, as well as the number of layers, so as to realize the adjustment of the thermal insulation performance of different walls, which greatly ensures the personalized requirements of the thermal insulation performance of the wall. Furthermore, the equivalent cavity diameter and cavity unit height of the present application are correlated with the total concrete volume of the wall, the total concrete volume of the panel and the total concrete volume of the cavity, thereby ensuring that the load-bearing capacity and thermal insulation capacity of the wall are taken into account.

[0067] Embodiment 2 of the invention provides a device, including a memory and a processor, wherein the memory is used to store a program, and the memory can be connected to the processor via a bus. The memory can be a non-volatile memory, such as a hard disk drive and a flash memory, and the memory stores a software program and a device driver. The software program can perform various functions of the above method provided in the embodiment of the present invention; the device driver can be a network and interface driver. The processor is used to execute the software program, and when the software program is executed, the method provided in embodiment 1 of the present invention can be implemented.

[0068] Embodiment 3 of the present invention provides a computer program product including instructions. When the computer program product is run on a computer, the computer is enabled to execute the method provided in Embodiment 1 of the present invention.

[0069] Embodiment 4 of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method provided in Embodiment 1 of the present invention is implemented.

[0070] The professionals should further realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to the function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0071] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0072] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A parameter processing method for a multi-layer multi-cavity wall panel, the multi-layer multi-cavity wall panel comprising a cavity core layer and at least two face panels, the cavity core layer being arranged between the face panels, characterized in that: The method comprises: The equivalent thermal conductivity of the cavity core layer is calculated according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels; the equivalent thermal conductivity of the radiation thermal conductivity is related to the equivalent cavity diameter of the cavity unit and the cavity unit height; According to the equivalent thermal conductivity of the cavity core layer, the theoretical heat transfer coefficient of the wall panels with different configuration parameters is calculated; According to different equivalent cavity diameters, different cavity unit heights and corresponding theoretical heat transfer coefficients, a first relationship between the equivalent cavity diameter and the cavity unit height is obtained by fitting; According to the first relationship, determine the prepared cavity unit height and the prepared equivalent cavity diameter of the pre-prepared wallboard, and perform pre-preparation according to the prepared cavity unit height and the prepared equivalent cavity diameter to obtain the wallboard to be tested; Obtaining the measured heat transfer coefficient of the wall panel to be tested; Determine a second relationship between the measured heat transfer coefficient and the theoretical heat transfer coefficient; According to the second relationship, the theoretical heat transfer coefficient is corrected to determine the actual heat transfer coefficient; Determine a current cavity unit height and a current equivalent cavity diameter according to the actual heat transfer coefficient and the first relationship; According to the current cavity unit height and the current equivalent cavity diameter, the first design parameters of the cavity unit in the cavity core layer and the second design parameters of the two-layer panel are determined, so as to design the wall panel according to the first design parameters and the second design parameters.

2. The method according to claim 1, characterized in that The calculation of the equivalent thermal conductivity of the cavity core layer according to the thermal conductivity of the solid part material of the cavity core layer, the thermal conductivity of the gas medium inside the cavity core layer, the cross-sectional area of ​​the cavity core layer wall, the total cross-sectional area and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels specifically includes: Calculate the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall and the thermal conductivity of the solid part material of the cavity core layer to obtain a first product; The second product is obtained by subtracting the product of the ratio of the cross-sectional area of ​​the cavity core layer wall to the total cross-sectional area of ​​the cavity core layer wall from 1 and the thermal conductivity of the gas medium inside the cavity core layer; Calculating the sum of the first product, the second product and the equivalent thermal conductivity of the radiation thermal conductivity between the two panels to obtain the equivalent thermal conductivity of the cavity core layer; The equivalent thermal conductivity coefficient of the radiation thermal conductivity between the two panels is obtained by multiplying the product of the intermediate parameter, the Stefan-Boltzmann constant, the average temperature of the cavity core layer, and the height of the insulation cavity by 4; The intermediate parameter is obtained by adding the second constant to the power of the first constant to the ratio of the cavity unit height to the equivalent cavity diameter of the cavity unit, multiplying the third constant power of the emissivity of the cavity layer by the fourth constant power of the sum of the ratio and 1, and then multiplying by the fifth constant.

3. The method according to claim 1, characterized in that The first relationship between the equivalent cavity diameter and the cavity unit height is obtained by fitting according to different equivalent cavity diameters, different cavity unit heights and corresponding wallboard theoretical heat transfer coefficients, specifically including: Determine the equivalent cavity diameter of a cavity unit and determine the height of a cavity unit, and calculate a theoretical heat transfer coefficient of a wall panel until the change of the obtained theoretical heat transfer coefficient tends to converge; According to multiple sets of equivalent cavity diameters, cavity unit heights and wall panel theoretical heat transfer coefficients, the first relationship is obtained by fitting.

4. The method according to claim 1, characterized in that: The second relationship formula for determining the measured heat transfer coefficient and the theoretical heat transfer coefficient specifically includes: According to the prepared cavity unit height and the corresponding prepared equivalent cavity diameter, the corresponding wall panel theoretical heat transfer coefficient is calculated; The ratio of the measured heat transfer coefficient to the theoretical heat transfer coefficient is calculated, and the ratio is used as a second relationship; wherein the measured heat transfer coefficient is the heat transfer coefficient of the wall panel measured under a steady-state heat transfer state.

5. The method according to claim 1, characterized in that The step of correcting the wallboard theoretical heat transfer coefficient according to the second relationship to determine the actual heat transfer coefficient specifically includes: The theoretical heat transfer coefficient is corrected by multiplying the second relationship by the theoretical heat transfer coefficient to determine the actual heat transfer coefficient.

6. The method according to claim 1, characterized in that The first design parameter includes the current cavity unit height and the current equivalent cavity diameter, the second design parameter includes the panel thickness, and the first design parameter of the cavity unit in the cavity core layer and the second design parameter of the two-layer panel are determined according to the current cavity unit height and the current equivalent cavity diameter. Specifically, the method includes: according to , calculate the cavity concrete volume in each flat cavity; where d is the cavity wall thickness of the cavity unit, D is the equivalent cavity diameter, H is the current cavity unit height, and n is the number of panel layers; according to Calculate the concrete volume of the panel per square meter of the wall; where L is the thickness of the panel; according to Calculate the total concrete volume per square meter of multi-layer and multi-cavity walls; It is the total concrete volume of multi-layer and multi-cavity walls per square meter.

7. The method according to claim 1, characterized in that The first relationship between the equivalent cavity diameter and the cavity unit height is obtained by fitting according to different equivalent cavity diameters, different cavity unit heights and corresponding wallboard theoretical heat transfer coefficients, specifically including: When it is the first type of wallboard, the first relationship is D 1,sweet =147*exp(-(H+L) / 151)+144; where D 1,sweet is the equivalent cavity diameter of the first type of wall panel, H is the cavity unit height, and L is the panel thickness; When it is the second type of wallboard, the first relationship is D 2,sweet =147*exp(-(H+L) / 151)+84; where D 2,sweet is the equivalent cavity diameter of the second type of wall panel.

8. The method according to claim 1, characterized in that The core layer of the cavity is filled with a lightweight high thermal resistance material or a high thermal enthalpy phase change energy storage material, wherein the lightweight high thermal resistance material includes a polyurethane foaming agent; the high thermal enthalpy phase change energy storage material includes paraffin, and the high thermal enthalpy phase change energy storage material is encapsulated by a polymer material.

9. The method according to claim 1, characterized in that: The cavity core layer includes a plurality of core columns, and two cross sections of the core columns are respectively connected to two layers of panels; the cross-sectional semi-diameter of the core column is not less than 10% of the equivalent cavity diameter.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 9 is performed.

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