Vibration processing method and apparatus, electronic device, and storage medium

Abstract

The application discloses a vibration processing method and device, electronic equipment and storage medium, relates to the technical field of structure optimization and data analysis processing, and the method comprises the following steps: performing modal analysis on a three-dimensional model of a product structure comprising a piezoelectric component to obtain a target modal vibration mode diagram; performing harmonic response sweep analysis on a natural frequency range locked according to the target modal vibration mode diagram to obtain a resonance frequency range; if a preset electromechanical parameter excitation frequency is in the resonance frequency range, performing transient dynamics analysis according to the excitation frequency to determine whether the product surface amplitude and acceleration meet the expected requirements, and if yes, performing vibration processing according to the target electromechanical parameters determined according to the excitation frequency and the target product structure determined according to the product structure. The application can quickly obtain a structure product and electromechanical input parameters meeting the touch effect, effectively reduces the research and development design cycle and test cost of a coupled touch product, and enables users to have a better product touch feeling.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device structure optimization data analysis processing, and particularly relates to a vibration processing method and device, an electronic device and a storage medium 。 BACKGROUND

[0002] An electronic vibration device will have different degrees of vibration response under the piezoelectric effect of a piezoelectric ceramic, and will have different vibration effects under different voltage excitation frequencies. Different structural forms under the same voltage excitation frequency also have a greater impact on the touch feeling.

[0003] Generally, the natural frequency of a product containing a piezoelectric component (such as a piezoelectric ceramic) and the entire product is usually high. When the product is developed, it is difficult to determine the iterative effect of the electro-mechanical coupling, and thus it is difficult to quickly determine suitable electro-mechanical parameters (such as voltage excitation frequency). The product cannot be quickly adjusted according to suitable electro-mechanical input parameters, so that the user can have a better product touch and touch experience when touching the product.

[0004] The above content is only used to assist in understanding the technical solutions of the present application, and does not represent the acknowledgement of the above content as prior art 。 SUMMARY

[0005] The main purpose of the present application is to provide a vibration processing method, device, electronic device and storage medium, which aims to solve the technical problem of how to quickly and accurately determine the product structure and electro-mechanical parameters, so that the user has a better product touch when touching the product adjusted according to the determined electro-mechanical parameters and product structure.

[0006] To achieve the above purpose, the present application provides a vibration processing method, which comprises the following steps:

[0007] Performing modal analysis on a three-dimensional model of a product structure containing a piezoelectric component to obtain a target modal vibration mode diagram;

[0008] Locking the natural frequency range of the product structure according to the target modal vibration mode diagram, and performing harmonic response sweep analysis on the natural frequency range to obtain a resonance band frequency range;

[0009] Determining whether the excitation frequency in the preset electro-mechanical parameters is in the resonance band frequency range;

[0010] If the excitation frequency is in the resonance band frequency range, performing transient dynamics analysis according to the excitation frequency to obtain the change relationship between the surface amplitude and the acceleration with time, and determining whether the surface amplitude and the acceleration meet the expected requirements according to the change relationship;

[0011] If the expected requirement is met, the excitation frequency is determined as a target frequency, the product structure is determined as a target product structure, and vibration processing is performed according to the target frequency and the target product structure.

[0012] Optionally, the step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain a target modal mode chart comprises:

[0013] Performing modal analysis on the three-dimensional model to obtain a modal mode chart;

[0014] Detecting a modal mode in the modal mode chart to determine whether there is a matching modal mode matching the preset product mode;

[0015] If the matching modal mode exists, detecting whether the frequency of the matching modal mode matches the multiple of the excitation frequency in the preset electro-mechanical parameter;

[0016] If the frequency of the matching modal mode matches the multiple of the excitation frequency in the preset electro-mechanical parameter, the modal mode chart is determined as a target modal mode chart.

[0017] Optionally, after the step of determining whether there is a matching modal mode matching the preset product mode, comprising:

[0018] If the matching modal mode does not exist, optimizing the structure and / or constraint form of the product structure to obtain a first product structure;

[0019] According to the first product structure, the step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component is executed until it is detected that there is a matching modal mode matching the preset product mode in the latest modal mode chart.

[0020] Optionally, after the step of detecting whether the frequency of the matching modal mode matches the multiple of the excitation frequency in the preset electro-mechanical parameter, comprising:

[0021] If the frequency of the matching modal mode does not match the multiple of the excitation frequency, optimizing the structure and / or constraint form of the product structure to obtain a second product structure;

[0022] According to the second product structure, the step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component is executed until it is detected that the frequency of the latest matching modal mode matches the multiple of the excitation frequency.

[0023] Optionally, the step of determining whether the excitation frequency in the preset electro-mechanical parameter is in the resonance band frequency range comprises:

[0024] determining a maximum amplitude of the resonance band frequency range, and detecting whether a frequency corresponding to the maximum amplitude matches a multiple of the excitation frequency;

[0025] if the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, determining that the excitation frequency is in the resonance band frequency range;

[0026] if the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency, determining that the excitation frequency is not in the resonance band frequency range.

[0027] Optionally, after the step of determining whether the excitation frequency in the preset electro-mechanical parameters is in the resonance band frequency range, the method comprises:

[0028] if the excitation frequency is not in the resonance band frequency range, optimizing a structure and / or a constraint form of the product structure to obtain a third product structure;

[0029] performing the step of modal analysis on the three-dimensional model of the product structure containing the piezoelectric component according to the third product structure until the excitation frequency is detected to be in a latest resonance band frequency range.

[0030] Optionally, after the step of determining whether the surface amplitude and the acceleration meet the expected requirement according to the change relationship, the method comprises:

[0031] if the expected requirement is not met, determining a preset frequency range and an input voltage parameter in the preset electro-mechanical parameters, wherein the excitation frequency is in the preset frequency range;

[0032] updating an input parameter to be used for transient dynamics analysis according to the preset frequency range and / or the input voltage parameter, wherein the input parameter comprises an excitation frequency and an input voltage corresponding to the excitation frequency.

[0033] In addition, to achieve the above object, the application further provides a vibration processing device, comprising:

[0034] a modal analysis module, configured to perform modal analysis on a three-dimensional model of a product structure containing a piezoelectric component to obtain a target modal mode shape diagram;

[0035] a harmonic response sweep analysis module, configured to lock a natural frequency range of the product structure according to the target modal mode shape diagram, and perform harmonic response sweep analysis on the natural frequency range to obtain a resonance band frequency range;

[0036] a determination module, configured to determine whether an excitation frequency in preset electro-mechanical parameters is in the resonance band frequency range;

[0037] a transient dynamics analysis module, configured to, if the excitation frequency is in the resonance band frequency range, perform transient dynamics analysis according to the excitation frequency to obtain a change relationship of surface amplitude and acceleration varying with time, and determine whether the surface amplitude and the acceleration meet expected requirements according to the change relationship;

[0038] a determination module, configured to, if the excitation frequency meets the expected requirements, determine the excitation frequency as a target frequency, determine the product structure as a target product structure, and perform vibration processing according to the target excitation frequency and the target product structure.

[0039] In addition, to achieve the above object, the present application further provides an electronic device, which comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, and the computer program is configured to implement the steps of the vibration processing method.

[0040] In addition, to achieve the above object, the present application further provides a storage medium, which is a computer readable storage medium, and the storage medium stores a computer program, and the computer program is executed by a processor to implement the steps of the vibration processing method.

[0041] In the present application, by performing modal analysis on a three-dimensional model diagram of a preset product structure containing a piezoelectric component, a target modal mode diagram is obtained, and a natural frequency range is locked according to the target modal mode diagram, and a resonance band frequency range is obtained by performing harmonic response sweep analysis on the natural frequency range, and when an excitation frequency in the preset electro-mechanical parameters is in the resonance band frequency range, transient dynamics analysis is performed on the excitation frequency, a change relationship of surface amplitude and acceleration varying with time is obtained, and when the surface amplitude and the acceleration meet expected requirements according to the change relationship, a target electro-mechanical parameter is determined according to the excitation frequency, a target product structure is determined according to the product structure, and then vibration processing is performed according to the target electro-mechanical parameter and the target product structure. Thus, the electro-mechanical parameter is closely related to the natural frequency of the product, i.e., the voltage excitation frequency is determined according to the natural frequency of the product, thereby avoiding the phenomenon that the voltage excitation frequency cannot be accurately determined due to the iteration influence of the electro-mechanical coupling effect, and realizing fast and accurate determination of the electro-mechanical parameter. The product structure can also be quickly optimized and adjusted to obtain a product structure corresponding to a desired vibration mode, and then the product corresponding to the target electro-mechanical parameter of the target product structure can be adjusted and set, so that when the user touches the product after the adjustment, the user has a better product touch feeling when touching the product adjusted according to the determined electro-mechanical parameter. BRIEF DESCRIPTION OF DRAWINGS

[0042] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application.

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the accompanying drawings required by the embodiments or the prior art description will be briefly introduced as follows. Obviously, those skilled in the art can obtain other drawings from these drawings without any creative effort.

[0044] Figure 1 A flowchart provided for the first embodiment of the vibration processing method of the present application;

[0045] Figure 2 A three-dimensional model diagram provided for the first embodiment of the vibration processing method of the present application;

[0046] Figure 3 A complete flowchart of the vibration processing method of the present application;

[0047] Figure 4 A longitudinal vibration mode shape diagram of the preset model modal analysis in the vibration processing method of the present application;

[0048] Figure 5 A longitudinal vibration mode shape diagram after adjusting the structural material parameters in the vibration processing method of the present application;

[0049] Figure 6 An amplitude frequency diagram in the vibration processing method of the present application;

[0050] Figure 7 An amplitude time curve diagram obtained from the transient dynamics analysis in the vibration processing method of the present application

[0051] Figure 8 A module architecture diagram of the vibration processing device of the present application;

[0052] Figure 9 A device structure diagram of the hardware running environment involved in the vibration processing method in the embodiments of the present application.

[0053] The object implementation, functional features and advantages of the present application will be further explained with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0054] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application, and are not used to limit the present application.

[0055] In order to better understand the technical solutions of the present application, the following will be described in detail in combination with the drawings in the specification and specific embodiments.

[0056] In this embodiment, to assist in understanding the vibration processing method in this embodiment, the following is explained in conjunction with the dynamic equation of the self-excited vibration of the damping system.

[0057] Optionally, the formula corresponding to the dynamic equation of the self-excited vibration of the damping system can be as shown in the following formula (I).

[0058]

[0059] Wherein, m is the mass matrix of the system, which can include the structural mass of the preset product structure. c is the viscous damping coefficient of the system. k is the stiffness matrix of the system, which can include the stiffness of the preset product structure. x represents the displacement vector. And represents the velocity and acceleration vectors. 0 can represent that the external force vector acting on the system is 0. The system in this embodiment can be a system corresponding to a product corresponding to a preset product structure with a piezoelectric component. That is, the component architecture of the system can include the preset product structure with the piezoelectric component.

[0060] Optionally, under the action of no external force, the natural frequency corresponding to the preset product structure can be calculated by using the following formula (II).

[0061]

[0062] Wherein, ω is the natural frequency.

[0063] Optionally, the natural frequency, damping ratio and modal shape of the system corresponding to the preset product structure at different orders can be obtained by modal analysis. By changing the physical parameters such as stiffness, mass or constraint position of the preset product structure, a modal shape and frequency closer to the preset can be obtained. The natural frequency and modal shape of the system can have different degrees of influence on the amplitude and acceleration of the structure vibration, so the physical parameters of the touch surface can be obtained through a series of analysis and iterative optimization in the product research and development design stage, and then the selection of the electro-mechanical input parameters can be provided as a reference basis to improve the actual trigger vibration feeling of the product.

[0064] Based on this, the embodiment of the application provides a vibration processing method, referring to Figure 1 , Figure 1 is a flowchart of the first embodiment of the vibration processing method of the application.

[0065] In this embodiment, the vibration processing method includes steps S10-S50.

[0066] Step S10, performing modal analysis on a three-dimensional model diagram of a preset product structure containing a piezoelectric component to obtain a target modal shape diagram;

[0067] Optionally, the preset product structure containing the piezoelectric component can be a product structure of a system device that needs to be provided with the piezoelectric component, such as a product structure of various electronic devices (such as smart phones, computers, etc.). For example, a product structure of a VR (virtual reality) device, a product structure of an AR (augmented reality) device, a product structure of an XR (extended reality) device, etc. The piezoelectric component can include a piezoelectric ceramic.

[0068] Optionally, the three-dimensional model can include a structure model of the preset product structure. When constructing the product structure conceptual model, the structure model of the preset product structure can be constructed, which includes all key components and connection modes, and specifies correct material properties, physical parameters, such as product structure stiffness and product structure mass, etc. for each part in the structure model. Boundary conditions are set to define the fixed points, support points and constraint conditions of the system corresponding to the preset product structure in actual work, etc. to ensure the authenticity and reliability of the structure model contained in the three-dimensional model diagram. Optionally, the three-dimensional model diagram of the preset product structure containing the piezoelectric component in the present embodiment can be as shown in Figure 2

[0069] Optionally, the modal analysis can be an analysis step for identifying the natural frequency and modal shape of the system corresponding to the preset product structure. The modal shape diagram can include the natural frequency and the modal shape corresponding thereto. Optionally, the vibration mode of the system at different natural frequencies and the modal shape corresponding to the vibration mode can be displayed through the modal shape diagram. The vibration mode can be an up-down vibration mode, a left-right vibration mode, a front-back vibration mode, etc.

[0070] Optionally, after the three-dimensional model diagram of the preset product structure containing the piezoelectric component is constructed, the preset electrical parameters corresponding to the system also need to be determined. The preset electrical parameters are parameters for the electrical part of the product corresponding to the preset product structure. The preset electrical parameters can include voltage amplitude (such as 220V, 380V, etc.), frequency range (such as 50Hz-60Hz), etc. so as to perform subsequent harmonic response sweep analysis and / or transient analysis according to the preset electrical parameters.

[0071] Optionally, the three-dimensional model (i.e. the structure model) of the product structure containing the piezoelectric component can be subjected to modal analysis to determine all possible vibration modes of the system and the modal shape of each vibration mode at the respective natural frequency. And construct a target modal shape diagram according to the natural frequency and the modal shape. Optionally, when constructing the target modal shape diagram, the target modal shape diagram can be simulated according to the finite element analysis method or other numerical simulation software.

[0072] ​Step S20, according to the target modal vibration mode chart, locking the natural frequency range of the product structure, performing harmonic response sweep analysis on the natural frequency range, and obtaining the resonance band frequency range;

[0073] Optionally, each natural frequency contained in the target modal vibration mode chart can be compared with the preset frequency of the product structure to check whether the natural frequency corresponding to the target modal vibration mode is close to the preset frequency or has a multiple relationship. If the natural frequency corresponding to the target modal vibration mode is close to the preset frequency or has a multiple relationship, the maximum natural frequency and the minimum natural frequency among the natural frequencies contained in the target modal vibration mode chart can be determined as the natural frequency range.

[0074] Optionally, the resonance band frequency range can be a structure resonance band range or a probability range of resonance, that is, a frequency interval in which the product corresponding to the preset product structure is likely to cause resonance.

[0075] Optionally, the natural frequency range can be subjected to harmonic response sweep analysis to determine the response of the system to different frequency inputs, and then the frequency interval that is likely to cause resonance, i.e., the resonance band frequency range, can be found.

[0076] Optionally, when performing harmonic response sweep analysis, the excitation signal of the natural frequency range can be set according to the preset electrodynamic parameters, and the excitation can be gradually increased at each natural frequency in the natural frequency range to obtain and record the first response data of the system. The first response data of the system is analyzed to identify which natural frequency is likely to cause the system resonance corresponding to the product vibration direction, and the maximum amplitude at the natural frequency that is likely to cause the system resonance corresponding to the product vibration direction is recorded. The resonance band frequency range is determined according to the natural frequency that is likely to cause the system resonance.

[0077] Step S30, judging whether the excitation frequency in the preset electrodynamic parameters is in the resonance band frequency range;

[0078] Optionally, the preset electrodynamic parameters can be electrodynamic parameters estimated and predicted by the user in advance, including a frequency range, a voltage amplitude, etc. Any preset frequency in the frequency range can be selected as the excitation frequency.

[0079] Optionally, it can be judged whether the excitation frequency is in the resonance band frequency range, and different operations are performed according to different judgment results.

[0080] In a feasible embodiment, in step S30, the step of judging whether the excitation frequency in the preset electrodynamic parameters is in the resonance band frequency range includes steps a10-a30.

[0081] Step a10, determining the maximum amplitude of the resonance band frequency range, and detecting whether the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency;

[0082] If the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, it is determined that the excitation frequency is in the resonance band frequency range.

[0083] If the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency, it is determined that the excitation frequency is not in the resonance band frequency range.

[0084] Optionally, the maximum amplitude corresponding to the main mode of vibration can be determined in the resonance band frequency range, and the maximum amplitude corresponding to the main mode of vibration is taken as the maximum amplitude of the resonance band frequency range. The main mode of vibration is the main mode of vibration corresponding to the preset main mode of vibration of the system, that is, the main mode of vibration of the system product corresponding to the preset product structure. For example, the modal vibration mode based on the up-and-down vibration of the system. The frequency corresponding to the maximum amplitude can be determined in the graph obtained by the harmonic response sweep analysis.

[0085] Optionally, it can be detected whether the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency. Optionally, it can be detected whether the frequency corresponding to the maximum amplitude is close to or has a multiple relationship with the excitation frequency. If the frequency corresponding to the maximum amplitude is close to or has a multiple relationship with the excitation frequency, it is determined that the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, and it is determined that the excitation frequency is in the resonance band frequency range. Conversely, it is determined that the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency, and it is determined that the excitation frequency is not in the resonance band frequency range.

[0086] Optionally, the absolute difference between the frequency corresponding to the maximum amplitude and the excitation frequency or the multiple of the excitation frequency can be calculated. If the absolute difference is less than or equal to a threshold value set in advance, it is determined that the frequency corresponding to the maximum amplitude is close to the excitation frequency. If the absolute difference is greater than a threshold value set in advance, it is determined that the two are not close to each other, and it can be determined whether the frequency corresponding to the maximum amplitude has a multiple relationship with the excitation frequency, such as twice, three times, etc. If there is a multiple relationship, it is determined that the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, and it is determined that the excitation frequency is in the resonance band frequency range. If there is no multiple relationship, it is determined that the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency, and it is determined that the excitation frequency is not in the resonance band frequency range.

[0087] In the embodiment, by determining the maximum amplitude of the resonance band frequency range, and determining that the excitation frequency is in the resonance band frequency range when the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, and determining that the excitation frequency is not in the resonance band frequency range when the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency. Further, effective detection of whether the excitation frequency is in the resonance band frequency range can be achieved.

[0088] Further, in a feasible embodiment, after the step of determining whether the excitation frequency in the preset electrodynamic parameter is in the resonance band frequency range in step S30, steps b10-b20 are included.

[0089] Step b10, if the excitation frequency is not in the resonance band frequency range, optimizing the structure and / or constraint form of the product structure to obtain a third product structure;

[0090] Step b20, performing the step of modal analysis on the three-dimensional model of the product structure containing the piezoelectric component according to the third product structure until detecting that the excitation frequency is in the latest resonance band frequency range.

[0091] Optionally, if it is determined that the excitation frequency is not in the resonance band frequency range, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structure size, material or constraint form of the product structure for optimization iteration to obtain a new product structure, which is taken as the third product structure.

[0092] Optionally, optimizing the constraint form of the product structure can include optimizing and updating at least one of the position constraint, size constraint and shape constraint of the product structure.

[0093] Optionally, when optimizing the structure of the product structure, the mass or stiffness of the product structure can be adjusted. Optionally, according to the above formula (two), the natural frequency is closely related to the mass and stiffness of the product structure, so after adjusting the mass or stiffness of the product structure, the corresponding natural frequency is updated, and the analysis results of modal analysis, harmonic response sweep analysis and transient analysis are updated, so that the final surface amplitude and acceleration meeting the expected requirements can be obtained by adjusting the mass or stiffness of the product structure.

[0094] Optionally, the resonance band frequency ranges corresponding to different product structures can be different from each other. Therefore, after obtaining the third product structure, the step process of step S10 can be performed on the third product structure until detecting that the excitation frequency is in the latest resonance band frequency range. The latest resonance band frequency range is the resonance band frequency range corresponding to the product structure after optimization.

[0095] In this embodiment, by optimizing the structure and / or constraint form of the product structure when the excitation frequency is not in the resonance band frequency range to obtain a third product structure, and then performing the above step S20 according to the third product structure until detecting that the excitation frequency is in the latest resonance band frequency range, the effectiveness of the determined product structure can be guaranteed.

[0096] Step S40, if in the resonance band frequency range, performing transient dynamics analysis according to the excitation frequency to obtain a change relationship of the surface amplitude and acceleration with time, and determining whether the surface amplitude and acceleration meet the expected requirements according to the change relationship;

[0097] Optionally, when the excitation frequency is determined to be in the resonance band frequency range, a transient dynamic analysis can be performed on the excitation frequency. In the transient dynamic analysis, the excitation frequency in the preset electro-mechanical parameters can be used as an input condition to apply a transient excitation to the system, such as a step function or a pulse signal. The response of the system over time can be detected, and a time response curve can be generated based on the detection result. Optionally, the time response curve can include a displacement-time curve, an acceleration-time curve, a velocity-time curve, etc. The result analysis is performed based on the generated time response curve to determine the variation relationship between the surface amplitude and the acceleration over time. Optionally, the surface amplitude can be the maximum displacement amplitude of the surface nodes or key positions of the system under a certain excitation. Optionally, the maximum value of the displacement at different time points in the time response curve can be used as the surface amplitude.

[0098] Optionally, after determining the variation relationship, the surface amplitude and the acceleration can be checked based on the variation relationship to determine whether the expected requirements are met. Optionally, the expected requirements can be the standard requirements set by the user in advance, and different requirements can be set for the surface amplitude and the acceleration according to different scenarios.

[0099] Optionally, a preset time range corresponding to the time response curve can be determined. The surface amplitude and the acceleration in the preset time range are checked to determine whether they meet the expected requirements.

[0100] The surface amplitude and the acceleration can be subjected to overall evaluation, key time point evaluation, peak value evaluation, and frequency component evaluation. When at least one of the overall evaluation, the key time point evaluation, the peak value evaluation, and the frequency component evaluation passes, it can be determined that the surface amplitude and the acceleration meet the expected requirements.

[0101] Optionally, in the overall evaluation, it is determined according to the variation relationship whether the maximum value of each surface amplitude in the time response curve is less than a first preset amplitude threshold (such as 1 μm) and whether the minimum value of each surface amplitude is greater than a second preset amplitude threshold (such as 0.1 μm). According to the variation relationship, it is determined whether the maximum value of each acceleration in the time response curve is less than a first preset acceleration threshold and whether the minimum value of each acceleration is greater than a second preset acceleration threshold. If the maximum value of each surface amplitude is less than the first preset amplitude threshold and the minimum value is greater than the second preset amplitude threshold, and the maximum value of each acceleration is less than the first preset acceleration threshold and the minimum value is greater than the second preset acceleration threshold, it can be determined that the overall evaluation result passes.

[0102] Optionally, when the critical time point evaluation is performed, a steady state response time point in the time response curve is determined, and whether the surface amplitude and acceleration at the steady state response time point are within an expected range (such as less than a first preset threshold and greater than a second preset threshold) is determined. If the surface amplitude and acceleration are within the expected range, the critical time point evaluation result is determined to be passed.

[0103] Optionally, when the peak evaluation is performed, whether the surface amplitude and acceleration corresponding to the peak (the values corresponding to the wave crest and trough) in the time response curve are within an expected range is determined, and if they are within the expected range, the critical time point evaluation result is determined to be passed.

[0104] Optionally, when the frequency component evaluation is performed, Fourier transform can be performed on the time response data of each surface amplitude and acceleration in the time response curve, the frequency components are analyzed, and if the main frequencies are distributed within an expected range, the frequency component evaluation result is determined to be passed.

[0105] In a feasible embodiment, after the step of determining whether the surface amplitude and acceleration meet the expected requirements according to the change relationship in step S40, steps S60-S70 are included.

[0106] In step S60, if the expected requirements are not met, a preset frequency range and an input voltage parameter in the preset electrodynamic parameters are determined, wherein the excitation frequency is within the preset frequency range.

[0107] In step S70, the input parameters for the transient dynamics analysis are updated according to the preset frequency range and / or the input voltage parameter, wherein the input parameters include the excitation frequency and the input voltage corresponding to the excitation frequency.

[0108] Optionally, if the check determines that the surface amplitude and acceleration do not meet the expected requirements, a preset frequency range in the preset electrodynamic parameters can be determined. The preset frequency range is a frequency range determined in advance. A new preset frequency can be selected in the frequency range as a new excitation frequency. When the new excitation frequency is within the resonance band frequency range, transient dynamics analysis is performed on the new excitation frequency, the change relationship of the surface amplitude and acceleration with time is obtained again, and whether the surface amplitude and acceleration meet the expected requirements is determined according to the change relationship. If the expected requirements are not met, the next new excitation frequency needs to be selected from the frequency range again, and the step of performing transient dynamics analysis on the new excitation frequency when the new excitation frequency is within the resonance band frequency range is executed. Until the surface amplitude and acceleration meet the expected requirements are detected.

[0109] Optionally, since the input voltage affects the surface amplitude and the excitation frequency affects the acceleration when performing the transient dynamics analysis, the surface amplitude obtained when performing the transient dynamics analysis is different when the input voltage is different, and the acceleration obtained when performing the transient dynamics analysis is different when the excitation frequency is different. Therefore, the input voltage can be adjusted, and the transient dynamics analysis of the excitation frequency is performed until the surface amplitude and the acceleration meet the expected requirements.

[0110] In this embodiment, by updating the input parameters to be analyzed for transient dynamics according to the preset frequency range and input voltage parameters when the surface amplitude and the acceleration do not meet the expected requirements, until the surface amplitude and the acceleration meet the expected requirements, the final required electrodynamic parameters can be determined according to the input parameters, and the effectiveness of the finally determined electrodynamic parameters is guaranteed.

[0111] Step S50, if the expected requirements are met, the target electrodynamic parameters are determined according to the excitation frequency, the target product structure is determined according to the product structure, and the vibration processing is performed according to the target electrodynamic parameters and the target product structure.

[0112] Optionally, if it is determined that the surface amplitude and the acceleration meet the expected requirements, the voltage excitation frequency can be directly determined according to the excitation frequency, such as the frequency within 10% of the upper and lower limits of the excitation frequency as the voltage excitation frequency. Or the frequency within 20% of the upper and lower limits of the excitation frequency as the voltage excitation frequency.

[0113] Optionally, after the voltage excitation frequency is determined, the preset electrodynamic parameters can be updated and adjusted according to the voltage excitation frequency to obtain target electrodynamic parameters to assist the user to select appropriate electrodynamic parameters. Optionally, the target electrodynamic parameters can also include the input voltage determined when the transient dynamics analysis of the excitation frequency is performed.

[0114] Optionally, the current product structure can also be used as the target product structure. And the product corresponding to the target product structure can be vibrated according to the electrodynamic parameters, so that the user can perceive a more obvious vibration feeling.

[0115] In the embodiment, the target modal shape diagram is obtained by performing modal analysis on the three-dimensional model diagram of the preset product structure containing the piezoelectric component, the resonance band frequency range is obtained by performing harmonic response sweep analysis on the inherent frequency range locked according to the target modal shape diagram, the surface amplitude and acceleration change relationship with time is obtained by performing transient dynamics analysis on the excitation frequency when the excitation frequency in the preset electro-mechanical parameter is in the resonance band frequency range, and the target electro-mechanical parameter is determined according to the excitation frequency when the surface amplitude and acceleration meet the expected requirements according to the change relationship, the target product structure is determined according to the product structure, and then the vibration treatment is performed according to the target electro-mechanical parameter and the target product structure. Further, the electro-mechanical parameter is closely related to the inherent frequency of the product, that is, the voltage excitation frequency is determined according to the inherent frequency of the product, thereby avoiding the phenomenon that the voltage excitation frequency cannot be accurately determined due to the iteration influence of the electro-mechanical coupling effect, and realizing the rapid and accurate determination of the electro-mechanical parameter. The product structure can also be quickly optimized and adjusted to obtain the product structure corresponding to the desired vibration mode, and then the product has good product touch after the user touches the product after adjusting and setting the product corresponding to the target electro-mechanical parameter.

[0116] Based on the first embodiment of the present application, the second embodiment of the present application is proposed. In the second embodiment of the present application, the same or similar contents as the above embodiments can be referred to the above introduction, and will not be described in detail. On this basis, in step S10, the three-dimensional model of the product structure containing the piezoelectric component is modal analyzed to obtain the target modal shape diagram, and the step includes steps c10-c40.

[0117] Step c10, modal analysis is performed on the three-dimensional model to obtain a modal shape diagram;

[0118] Step c20, the modal shape in the modal shape diagram is detected to determine whether there is a matching modal shape matching the preset product shape;

[0119] Optionally, when the three-dimensional model of the product structure containing the piezoelectric component is modal analyzed, the three-dimensional model can be meshed to obtain a finite element model, and the finite element model is modal analyzed by a preset modal analysis unit (such as a unit with finite element analysis software function) to obtain a modal shape diagram containing a plurality of inherent frequencies and a modal shape corresponding to each inherent frequency.

[0120] Optionally, the modal shape diagram can be a low-order modal shape diagram, such as a modal shape diagram including the first six orders. Optionally, the first several orders of modal shapes in the modal shape diagram can be detected, such as the first six orders of modal shapes. It is determined whether there is a modal shape (i.e., a matching modal shape) matching the preset product vibration mode. Optionally, the preset product vibration mode can be a vibration mode of a main vibration direction of the product, such as a longitudinal vibration, etc.

[0121] Further, in a feasible embodiment, after the step of determining whether there is a matching modal shape matching the preset product vibration mode in step c20, steps d10-d20 are included.

[0122] Step d10, if there is no matching modal shape, optimizing the structure and / or constraint form of the product structure to obtain a first product structure;

[0123] Step d20, performing the step of modal analysis on the three-dimensional model of the product structure including the piezoelectric component according to the first product structure until it is detected that there is a matching modal shape matching the preset product vibration mode in the latest modal shape diagram.

[0124] Optionally, if there is no matching modal shape matching the preset product vibration mode in the modal shape diagram, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structure size, material, or constraint form (such as position constraint, size constraint, and shape constraint of the product structure, etc.) of the product structure for optimization iteration to obtain a new product structure, which is taken as the first product structure.

[0125] Optionally, after obtaining the first product structure, the step S10 in the above embodiment can be continuously performed until it is detected that there is a matching modal shape matching the preset product vibration mode in the latest modal shape diagram, and then the subsequent steps can be continuously performed, such as step c30.

[0126] In this embodiment, by detecting that there is no matching modal shape matching the preset product vibration mode in the modal shape diagram, the structure and / or constraint form of the product structure can be optimized to obtain a first product structure, and the step of modal analysis is performed according to the first product structure until it is detected that there is a matching modal shape matching the preset product vibration mode in the modal shape diagram, so that the product structure can be optimized in time to obtain a product structure meeting the user's demand.

[0127] Step c30, if there is a matching modal shape, detecting whether the frequency of the matching modal shape matches the multiple frequency of the excitation frequency in the preset electromechanical parameter;

[0128] Optionally, if there is a matching modal shape in the modal shape diagram that matches the preset product modal shape, the frequency of the matching modal shape in the modal shape diagram can be determined, such as determining the frequency corresponding to the maximum amplitude in the matching modal shape, and detecting whether the frequency matches the multiple of the excitation frequency in the preset electro-mechanical parameters.

[0129] Optionally, it can be detected whether the frequency corresponding to the maximum amplitude in the matching modal shape is close to the excitation frequency or has a multiple frequency relationship. If the frequency is close to the excitation frequency or has a multiple frequency relationship, it can be determined that the frequency of the matching modal shape matches the multiple of the excitation frequency. Otherwise, the frequency of the matching modal shape does not match the multiple of the excitation frequency.

[0130] Optionally, the absolute difference between the frequency corresponding to the maximum amplitude in the matching modal shape and the excitation frequency can be calculated. If the absolute difference is less than or equal to a pre-set threshold, it is determined that the frequency is close to the excitation frequency. If the absolute difference is greater than a pre-set threshold, it can be determined that the two are not close. It can be determined whether the frequency corresponding to the maximum amplitude in the matching modal shape has a multiple frequency relationship with the excitation frequency, such as twice, three times, etc. If there is a multiple frequency relationship, it can be determined that the frequency of the matching modal shape matches the multiple of the excitation frequency. If there is no multiple frequency relationship, it can be determined that the frequency of the matching modal shape does not match the multiple of the excitation frequency.

[0131] Further, in a possible embodiment, after the step of detecting whether the frequency of the matching modal shape matches the multiple of the excitation frequency in the preset electro-mechanical parameters in step d30, steps e10-e30 are included.

[0132] Step e10, if the frequency of the matching modal shape does not match the multiple of the excitation frequency, the structure and / or constraint form of the product structure is optimized to obtain a second product structure.

[0133] Step e20, performing the step of modal analysis on the three-dimensional model of the product structure containing the piezoelectric assembly according to the second product structure until the frequency of the latest matching modal shape matches the multiple of the excitation frequency.

[0134] Optionally, if the frequency of the matching modal shape does not match the multiple of the excitation frequency, it is determined that the structure and / or constraint form of the product structure needs to be optimized, such as changing the structure size, material or constraint form (such as position constraint, size constraint and shape constraint of the product structure, etc.) of the product structure for optimization iteration to obtain a new product structure, which is taken as the second product structure.

[0135] Optionally, after the second product structure is obtained, the step S10 in the above embodiment can be continuously executed until the frequency of the matching modal shape and the multiple frequency of the excitation frequency are matched, and the subsequent steps are continuously executed.

[0136] In the embodiment, when it is detected that the frequency of the matching modal shape and the multiple frequency of the excitation frequency in the detected modal shape diagram are not matched, the structure and / or constraint form of the product structure can be optimized to obtain a second product structure, and the step of performing modal analysis according to the second product structure is executed until the frequency of the matching modal shape and the multiple frequency of the excitation frequency in the modal shape diagram are matched, so that the product structure can be optimized in time to obtain a product structure meeting the user's demand.

[0137] In step c40, if the frequency of the matching modal shape and the multiple frequency of the excitation frequency in the preset electrodynamic parameter are matched, it is determined that the modal shape diagram is the target modal shape diagram.

[0138] Optionally, if it is detected that the frequency of the matching modal shape and the multiple frequency of the excitation frequency in the preset electrodynamic parameter are matched, it can be determined that the modal shape diagram is the target modal shape diagram, and the step S20 in the above embodiment is continuously executed until the target electrodynamic parameter and the target product structure meeting the user's demand are determined, and then the vibration processing is performed according to the target electrodynamic parameter and the target product structure.

[0139] In the embodiment, by performing modal analysis on the three-dimensional model, the modal shape diagram is obtained, and when there is a matching modal shape matching the preset product shape in the modal shape diagram, and the frequency of the matching modal shape and the multiple frequency of the excitation frequency in the preset electrodynamic parameter are matched, it is determined that the modal shape diagram is the target modal shape diagram, so that the effectiveness of the determined target modal shape diagram is ensured.

[0140] In addition, in order to assist understanding of the overall flow of the vibration processing method in the embodiment, the following is exemplarily illustrated.

[0141] For example, as shown in FIG. 1, the product structure 1 is a three-dimensional model, and the product structure 1 is subjected to vibration processing. Figure 3As shown, first, the electronic component conceptual model and parameter setting are determined, and a physical model, such as a three-dimensional model of a product structure containing a piezoelectric component, is constructed, and then modal analysis is performed on the three-dimensional model to obtain a target modal shape diagram, and it is checked whether the low-order modal shape in the target modal shape diagram contains a first modal shape corresponding to the main vibration direction of the product. If not, the form of the structural constraint is adjusted, the product structure is updated, and modal analysis is performed again on the three-dimensional model of the new product structure. If yes, it is checked whether the main modal frequency in the target modal shape diagram is close to the preset frequency times the frequency. If not, it is determined that the two do not match, and the structural mass or stiffness is adjusted, the product structure is updated, and modal analysis is performed again on the three-dimensional model of the new product structure. If yes, harmonic response analysis (i.e., harmonic response sweep analysis) is performed on the natural frequency range locked according to the target modal shape diagram, and it is detected whether the peak value corresponds to a frequency close to the preset frequency or the frequency times the frequency. If not, the structural mass or stiffness is adjusted, the product structure is updated, and modal analysis is performed again on the three-dimensional model of the new product structure. If yes, transient dynamics analysis is performed. And it is detected whether the dynamics parameters meet the expectations (such as whether the surface amplitude and acceleration meet the expected requirements). If not, the input voltage and frequency (i.e., the excitation frequency) are adjusted and transient dynamics analysis is performed again. If yes, the structural model is output. At this time, the product structure corresponding to the output structural model can be taken as the target product structure, the excitation frequency can be taken as the determined target electromechanical parameter, and the product constructed according to the target product structure can be vibrated according to the target electromechanical parameter, so that the user has a good touch when touching the product.

[0142] In addition, for example Figures 4-7 As shown, if it is determined that the excitation frequency in the preset electromechanical parameter is 240Hz, and the preset voltage (i.e., the input voltage when performing transient dynamics analysis) is 75V. As shown Figure 4 As shown, if the product structure containing the piezoelectric component is a cover plate, the material of the cover plate is an aluminum alloy material, and the modal analysis of the three-dimensional model of the cover plate obtains a frequency corresponding to a longitudinal vibration mode of 1518Hz. Among them, the longitudinal vibration mode is the preset product mode. It can be seen that the frequency corresponding to the longitudinal vibration mode is far from the excitation frequency. Therefore, the structure or the form of the constraint of the product structure can be optimized, such as changing the material of the cover plate from an aluminum alloy material to an injection-molded PBT material, and performing thinning processing, to obtain a three-dimensional model as shown Figure 5 As shown Figure 5 As shown, the modal analysis of the three-dimensional model obtains a frequency corresponding to a longitudinal vibration mode of 477.8Hz, which is relatively close to the excitation frequency and close to the frequency times the frequency. Therefore, the natural frequency range of the cover plate can be locked according to the target modal shape diagram obtained by the modal analysis at this time, and harmonic response sweep analysis is performed on the natural frequency range to obtain a three-dimensional model as shown Figure 6The amplitude frequency diagram shown in the figure determines the resonance band frequency range, and when it is determined that the excitation frequency is in the resonance band frequency range, the transient dynamics analysis is performed on the excitation frequency, as shown in Figure 7 As shown, the surface amplitude curve is extracted to determine the relationship between the surface amplitude and acceleration and time, and it is determined according to the transformation relationship whether the surface amplitude and acceleration meet the expected requirements. If yes, the Figure 5 The product structure of the cover plate corresponding to the three-dimensional model shown is determined as the final target product structure. The excitation frequency is determined as the final excitation frequency in the target electrodynamic parameters. In order to vibrate the cover plate designed according to the target product structure according to the target electrodynamic parameters, the user has a better product touch when touching the cover plate.

[0143] In addition, the embodiment of the present application provides a vibration processing device, which is described with reference to Figure 8 The vibration processing device comprises:

[0144] The modal analysis module A10 is configured to perform modal analysis on the three-dimensional model of the product structure containing the piezoelectric component to obtain a target modal shape diagram.

[0145] The harmonic response sweep analysis module A20 is configured to lock the natural frequency range of the product structure according to the target modal shape diagram, perform harmonic response sweep analysis on the natural frequency range, and obtain a resonance band frequency range.

[0146] The judgment module A30 is configured to determine whether the excitation frequency in the preset electrodynamic parameters is in the resonance band frequency range.

[0147] The transient dynamics analysis module A40 is configured to, if in the resonance band frequency range, perform transient dynamics analysis according to the excitation frequency to obtain a relationship between the surface amplitude and acceleration and time, and determine whether the surface amplitude and acceleration meet the expected requirements according to the relationship.

[0148] The determination module A50 is configured to, if the expected requirements are met, determine the excitation frequency as a target frequency, determine the product structure as a target product structure, and perform vibration processing according to the target excitation frequency and the target product structure.

[0149] The vibration processing device provided by the present application adopts the vibration processing method in the above embodiment, which can solve the technical problem of how to quickly and accurately determine the product structure and the electrodynamic parameters, so that the user has a better product touch when touching the product adjusted according to the determined electrodynamic parameters and product structure. Compared with the prior art, the vibration processing device provided by the present application has the same beneficial effects as the vibration processing method provided by the above embodiment, and the other technical features in the vibration processing device are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0150] The present application provides an electronic device, comprising: at least one processor; and a memory connected with the at least one processor in communication; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the vibration processing method in the above embodiment one.

[0151] Reference is made below to Figure 9 which shows a structural schematic diagram of an electronic device suitable for implementing embodiments of the present application. The electronic device in embodiments of the present application can include, but is not limited to, mobile terminals such as mobile phones, notebook computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), and the like, and fixed terminals such as digital TVs, desktop computers, and the like. The device shown in the figure is merely an example and should not impose any limitation on the functions and use range of embodiments of the present application.

[0152] The electronic device can include a processing device 1001 (such as a central processor, a graphics processor, and the like) that can perform various appropriate actions and processes according to programs stored in a read-only memory (ROM) 1002 or programs loaded from a storage device 1003 into a random access memory (RAM) 1004. In the RAM 1004, various programs and data required for device operation are also stored. The processing device 1001, the ROM 1002, and the RAM 1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. In general, the following systems can be connected to the I / O interface 1006: input devices 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, and the like; output devices 1008 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, and the like; the storage device 1003 including, for example, a magnetic tape, a hard disk, and the like; and a communication device 1009. The communication device 1009 can allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. Although an electronic device with various systems is shown in the figure, it should be understood that all the systems shown are not required to be implemented or possessed. More or fewer systems can be alternatively implemented or possessed.

[0153] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program containing program codes for executing the method shown in the flowchart. In such embodiments, the computer program can be downloaded and installed from a network through a communication device, or installed from the storage device 1003, or installed from the ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiments disclosed in the present application are executed.

[0154] The electronic device provided by the present application adopts the vibration processing method in the above-mentioned embodiments, which can solve the technical problem of how to quickly and accurately determine the product structure and the electromechanical parameters, so that the user has a better product touch feeling when touching the product adjusted according to the determined electromechanical parameters and product structure. Compared with the prior art, the electronic device provided by the present application has the same beneficial effects as the vibration processing method provided by the above-mentioned embodiments, and other technical features in the electronic device are the same as the features disclosed in the previous embodiment method, which will not be repeated here.

[0155] It should be understood that various parts of the present application can be realized by hardware, software, firmware or a combination thereof. In the description of the above-mentioned embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0156] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0157] The present application provides a computer readable storage medium having stored thereon computer readable program instructions (i.e. computer program) for executing the vibration processing method in the above-mentioned embodiments.

[0158] The computer readable storage medium provided in the present application may, for example, be a U disk, but is not limited to an electric, magnetic, optical, electromagnetic, infrared, or semiconductor system, system, or device, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electric connection with one or more conductive wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present embodiment, the computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer readable storage medium can be transmitted in any suitable medium, including but not limited to an electric wire, an optical cable, an RF (Radio Frequency), and the like, or any suitable combination of the above.

[0159] The above computer readable storage medium can be contained in an electronic device, or can exist separately without being assembled into an electronic device.

[0160] The above computer readable storage medium carries one or more programs, which, when executed by the electronic device, enable the electronic device to perform the step flow of the above vibration processing method.

[0161] The computer program code for performing the operations of the present application can be written in one or more programming languages or combinations of the above, including an object-oriented programming language such as Java, Smalltalk, C++, and a conventional procedural programming language such as "C" language or similar programming languages. The program code can be executed entirely on a user computer, partially on a user computer, as a separate software package, partially on a user computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user computer through any kind of network, including a LAN (Local Area Network) or a WAN (Wide Area Network), or can be connected to an external computer (for example, through the Internet using an Internet service provider).

[0162] The flow and block diagrams in the drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flow and block diagrams can represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may be executed in the reverse order, depending on the functionality involved. It will also be noted that each block of the block diagrams and / or flowchart illustrations, and combinations thereof, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or combinations of hardware and software.

[0163] The modules involved in the embodiments of the present application can be implemented in software or in hardware. In some cases, the names of the modules do not constitute a limitation on the modules themselves.

[0164] The readable storage medium provided by the present application is a computer readable storage medium, which stores computer readable program instructions (i.e., a computer program) for executing the above vibration processing method, and can solve the technical problem of how to quickly and accurately determine the product structure and the electromechanical parameter, so that the user has a better product touch when touching the product adjusted according to the determined electromechanical parameter and product structure. Compared with the prior art, the computer readable storage medium provided by the present application has the same beneficial effects as the vibration processing method provided by the above embodiments, which will not be repeated here.

[0165] The present application also provides a computer program product, comprising a computer program, which is executed by a processor to implement the steps of the vibration processing method as described above.

[0166] The computer program product provided by the present application can solve the technical problem of how to quickly and accurately determine the product structure and the electromechanical parameter, so that the user has a better product touch when touching the product adjusted according to the determined electromechanical parameter and product structure. Compared with the prior art, the computer program product provided by the present application has the same beneficial effects as the vibration processing method provided by the above embodiments, which will not be repeated here.

[0167] The above merely illustrates some embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation, direct / indirect application in other related technical fields based on the technical concept of the present application, and using the content of the present application specification and drawings are included in the patent protection scope of the present application.

Claims

1. A method of vibrational processing, characterized by, The vibration processing method comprises the following steps: Performing modal analysis on a three-dimensional model of a product structure containing a piezoelectric component to obtain a target modal mode shape diagram; wherein, if the result of the modal analysis does not satisfy a first condition, optimizing the structure and / or constraint form of the product structure and re-performing modal analysis until a target modal mode shape satisfying the first condition is obtained; the first condition is that there is a matching modal mode shape matching a preset product mode shape, and the frequency of the matching modal mode shape matches the multiple frequency of an excitation frequency in preset electrodynamic parameters; the preset product mode shape is a mode shape of a main vibration direction of the product, and the target modal mode shape diagram is a low-order modal mode shape diagram of the first six orders; Locking an inherent frequency range of the product structure according to the target modal mode shape diagram, and performing harmonic response sweep analysis on the inherent frequency range to obtain a resonance band frequency range; Judging whether an excitation frequency in preset electrodynamic parameters is in the resonance band frequency range; wherein, if the excitation frequency is not in the resonance band frequency range, optimizing the structure and / or constraint form of the product structure to obtain a third product structure; performing the step of performing modal analysis on a three-dimensional model of a product structure containing a piezoelectric component according to the third product structure until it is detected that the excitation frequency is in the latest resonance band frequency range; If the excitation frequency is in the resonance band frequency range, performing transient dynamics analysis according to the excitation frequency to obtain a change relationship of surface amplitude and acceleration with time, and determining whether the surface amplitude and the acceleration satisfy an expected requirement according to the change relationship; wherein, if the expected requirement is not satisfied, updating the excitation frequency and the input voltage corresponding to the excitation frequency to be subjected to transient dynamics analysis according to a preset frequency range and / or input voltage parameter in the preset electrodynamic parameters, and re-performing the transient dynamics analysis; If the expected requirement is satisfied, determining a target electrodynamic parameter according to the excitation frequency, and determining a target product structure according to the product structure, and performing vibration processing according to the target electrodynamic parameter and the target product structure.

2. The vibrational treatment method of claim 1, wherein, The step of performing modal analysis on a three-dimensional model of a product structure containing a piezoelectric component to obtain a target modal mode shape diagram comprises: Performing modal analysis on the three-dimensional model to obtain a modal mode shape diagram; Detecting the modal mode shape in the modal mode shape diagram to determine whether there is a matching modal mode shape matching a preset product mode shape; If there is the matching modal mode shape, detecting whether the frequency of the matching modal mode shape matches the multiple frequency of an excitation frequency in preset electrodynamic parameters; If the frequency of the matching modal mode shape matches the multiple frequency of the excitation frequency in the preset electrodynamic parameters, determining that the modal mode shape diagram is a target modal mode shape diagram.

3. The vibrational treatment method of claim 2, wherein, After the step of determining whether there is a matching modal mode shape matching a preset product mode shape, comprising: If there is no matching modal mode shape, optimizing the structure and / or constraint form of the product structure to obtain a first product structure; The step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component according to the first product structure is performed until it is detected that there is a matching modal shape in the latest modal shape diagram that matches the preset product shape.

4. The vibrational treatment method of claim 2, wherein, The step of detecting whether the frequency of the matching modal shape matches a multiple of an excitation frequency in the preset electro-mechanical parameter is followed by: If the frequency of the matching modal shape does not match the multiple of the excitation frequency, the structure and / or constraint form of the product structure is optimized to obtain a second product structure; The step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component according to the second product structure is performed until it is detected that the frequency of the latest matching modal shape matches the multiple of the excitation frequency.

5. The vibrational treatment method of claim 1, wherein, The step of judging whether the excitation frequency in the preset electro-mechanical parameter is in the resonance band frequency range includes: Determining a maximum amplitude of the resonance band frequency range, and detecting whether the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency; If the frequency corresponding to the maximum amplitude matches the multiple of the excitation frequency, it is determined that the excitation frequency is in the resonance band frequency range; If the frequency corresponding to the maximum amplitude does not match the multiple of the excitation frequency, it is determined that the excitation frequency is not in the resonance band frequency range.

6. A vibration treatment apparatus characterised in that, The vibration processing device includes: A modal analysis module configured to perform modal analysis on a three-dimensional model of a product structure containing a piezoelectric component to obtain a target modal shape diagram; if the result of the modal analysis does not satisfy a first condition, the structure and / or constraint form of the product structure is optimized and the modal analysis is performed again until a target modal shape satisfying the first condition is obtained; the first condition is that there is a matching modal shape matching a preset product shape, and the frequency of the matching modal shape matches a multiple of an excitation frequency in a preset electro-mechanical parameter; the preset product shape is a shape of a main vibration direction of the product, and the target modal shape diagram is a low-order modal shape diagram of the first six orders; A harmonic response sweep analysis module configured to lock a natural frequency range of the product structure according to the target modal shape diagram, perform harmonic response sweep analysis on the natural frequency range, and obtain a resonance band frequency range; A judging module configured to judge whether an excitation frequency in a preset electro-mechanical parameter is in the resonance band frequency range; if the excitation frequency is not in the resonance band frequency range, the structure and / or constraint form of the product structure is optimized to obtain a third product structure; the step of performing modal analysis on the three-dimensional model of the product structure containing the piezoelectric component according to the third product structure is performed until it is detected that the excitation frequency is in the latest resonance band frequency range. The transient dynamics analysis module is configured to, if the resonance band frequency range is reached, perform transient dynamics analysis according to the excitation frequency to obtain a change relationship between surface amplitude and acceleration with time, and determine whether the surface amplitude and the acceleration meet expected requirements according to the change relationship; if the expected requirements are not met, the excitation frequency and the input voltage corresponding to the excitation frequency to be subjected to transient dynamics analysis are updated according to the preset frequency range and / or the input voltage parameter in the preset electrodynamic parameters, and the transient dynamics analysis is performed again. The determining module is configured to, if the expected requirements are met, determine that the excitation frequency is a target frequency, and that the product structure is a target product structure, and perform vibration processing according to the target frequency and the target product structure.

7. An electronic device, comprising: The electronic device comprises a memory, a processor, and a computer program stored on the memory and executable on the processor, and the computer program is configured to implement the steps of the vibration processing method according to any one of claims 1 to 5.

8. A storage medium, characterized by The storage medium is a computer readable storage medium, and the storage medium stores a computer program, and the computer program is executed by the processor to implement the steps of the vibration processing method according to any one of claims 1 to 5.

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