A method, device, medium and equipment for improving dispensing quality

By creating a dispensing simulation model and determining the target simulation parameters, the problem of poor dispensing quality in the existing technology is solved, and the bonding quality of adjacent structural parts of the camera module and the overall product quality are improved.

CN119760994APending Publication Date: 2025-04-04KUNSHAN Q TECH CO LTD
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Patent Information

Application Number
CN202411818749.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

In the prior art, due to the inability to ensure dispensing quality, the bonding quality of adjacent structural parts of the camera module is poor, affecting the quality of the entire camera module product.

Method used

By creating a dispensing simulation model, simulate the impact of preset size bubbles in the dispensing process, obtain each set of simulation parameters and simulate it, and determine the target simulation parameters as actual dispensing parameters to ensure the dispensing quality.

Benefits of technology

Through the target simulation parameters determined by the simulation model, the glue breakage problem caused by bubbles can be effectively avoided in the actual dispensing process, and the bonding quality of adjacent structural parts of the camera module can be improved, thereby improving the overall quality of the entire camera module product.

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Abstract

The present invention provides a method, device, medium and equipment for improving the quality of glue dispensing, and the method comprises: creating a glue dispensing simulation model; bubbles of preset size exist in the glue dispensing simulation model; obtaining each group of simulation parameters, simulating the glue dispensing simulation model under each group of simulation parameters, and outputting corresponding simulation results; the simulation parameters comprise: glue dispensing pressure and glue flow speed; determining target simulation parameters from each group of simulation parameters based on the simulation results, and dispensing glue on components to be bonded with the target simulation parameters as actual glue dispensing parameters; in this way, by creating a glue dispensing simulation model, defining bubbles in the simulation model, and then simulating the glue dispensing simulation model to determine the target simulation parameters; then, during actual glue dispensing, even if there are bubbles in the glue in the needle tube, appropriate actual glue dispensing parameters can be set according to the simulation results to ensure the quality of glue dispensing, thereby improving the bonding quality of adjacent structural parts of the camera module and improving the overall quality of the camera module product.
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Description

Technical Field

[0001] The present application relates to the technical field of camera module assembly, and in particular to a method, device, medium and equipment for improving glue dispensing quality. Background Art

[0002] At present, in the mobile phone camera industry and other electronic semiconductor industries, in order to pursue lightweight and stable products, it is necessary to fix the lens assembly to the voice coil motor during the assembly process of the camera module. Although the lens and the voice coil motor are assembled and fixed with threads, the gap between the two needs to be reinforced with glue to improve the stability of the entire camera module. Therefore, the adjacent structural parts of the lens and the voice coil motor are fixed with glue.

[0003] The working principle of the dispensing equipment used in the camera module is to use air pressure to press the glue in the needle tube out, and cooperate with the movement of the placement platform below to draw a line of glue on the surface of the bonded parts. However, there are often bubbles in the glue in the needle tube, which often causes the glue line to be disconnected during the glue application, affecting the dispensing quality, thereby affecting the bonding quality of the adjacent structural parts of the lens and the voice coil motor, and even causing the quality of the entire camera module product to be abnormal. Summary of the invention

[0004] In response to the problems existing in the prior art, the embodiments of the present invention provide a method, device, medium and equipment for improving the quality of glue dispensing, so as to solve or partially solve the technical problem in the prior art that when bonding adjacent structural parts of a camera module, the quality of glue dispensing cannot be ensured, thereby affecting the bonding quality and further affecting the product quality of the camera module.

[0005] A first aspect of the present invention provides a method for improving dispensing quality, the method comprising:

[0006] Creating a dispensing simulation model; wherein bubbles of a preset size exist in the dispensing simulation model;

[0007] Acquire each set of simulation parameters, simulate the dispensing simulation model under each set of simulation parameters, and output corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed;

[0008] Based on the simulation results, target simulation parameters are determined from the groups of simulation parameters, and the target simulation parameters are used as actual dispensing parameters to dispense glue on the components to be bonded; the simulation results corresponding to the target simulation parameters are results that meet the dispensing quality requirements.

[0009] In the above scheme, the step of creating a dispensing simulation model includes:

[0010] Creating a 3D fluid model, wherein bubbles, glue, and air of preset sizes exist in the 3D fluid model;

[0011] Based on the relative positions of the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model, the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model are combined to obtain the dispensing simulation model.

[0012] In the above solution, the creating of the 3D fluid model includes:

[0013] Adding an air domain component to the periphery of the glue component, and combining the air domain component and the glue component into a geometric body by using Boolean operations;

[0014] Meshing the geometric body to obtain glue mesh units and air mesh units;

[0015] Based on the preset bubble size and bubble position, a corresponding number of glue grid units at the corresponding position are set as air grid units to form the 3D fluid model.

[0016] In the above scheme, before simulating the dispensing simulation model under each set of simulation parameters, the method further includes:

[0017] Obtain the material type, material parameters and simulation type of each component of the dispensing simulation model, and set simulation constraints.

[0018] In the above solution, determining the target simulation parameter from each group of simulation parameters based on the simulation result includes:

[0019] For any of the simulation results, it is determined whether there is glue breakage in the simulation result. If it is determined that there is no glue breakage, the corresponding simulation parameter is determined as the target simulation parameter.

[0020] In the above solution, determining the target simulation parameter from each group of simulation parameters based on the simulation result includes:

[0021] For any of the simulation results, determining whether there is glue breakage in the simulation result;

[0022] If it is determined that there is glue breakage, it is further determined whether the current glue length is less than the preset glue breakage length threshold. If it is determined that the current glue breakage length is less than the glue breakage length threshold, the corresponding simulation parameter is determined as the target parameter.

[0023] A second aspect of the present invention provides a device for improving dispensing quality, the device comprising:

[0024] A creation unit, used for creating a dispensing simulation model; bubbles of a preset size exist in the dispensing simulation model;

[0025] A simulation unit, used to obtain each set of simulation parameters, simulate the dispensing simulation model under each set of simulation parameters, and output corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed;

[0026] A determination unit is used to determine target simulation parameters from each group of simulation parameters based on the simulation results, and to perform glue dispensing on the components to be bonded using the target simulation parameters as actual glue dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet glue dispensing quality requirements.

[0027] In the above solution, the creation unit is specifically used for:

[0028] Creating a 3D fluid model, wherein bubbles, glue, and air of preset sizes exist in the 3D fluid model;

[0029] The dispensing simulation model is obtained by combining the position coordinates of the 3D needle model, the 3D valve model, the 3D placement platform model and the 3D fluid model.

[0030] According to a third aspect of the present invention, a computer-readable storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, the steps of any one of the methods described in the first aspect are implemented.

[0031] According to a fourth aspect of the present invention, a computer device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of any one of the methods described in the first aspect are implemented.

[0032] The present invention provides a method, device, medium and equipment for improving the quality of glue dispensing, the method comprising: creating a glue dispensing simulation model; bubbles of preset size exist in the glue dispensing simulation model; obtaining each group of simulation parameters, simulating the glue dispensing simulation model under each group of simulation parameters, and outputting corresponding simulation results; the simulation parameters include: glue dispensing pressure and glue flow speed; determining target simulation parameters from each group of simulation parameters based on the simulation results, and dispensing glue on the components to be bonded with the target simulation parameters as actual glue dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet the glue dispensing quality requirements; in this way, by creating a glue dispensing simulation model, bubbles are set in the simulation model, and then the glue dispensing simulation model is simulated to determine the target simulation parameters; then during actual glue dispensing, even if there are bubbles in the glue in the syringe, appropriate actual glue dispensing parameters can be set according to the simulation results to ensure the glue dispensing quality, thereby improving the bonding quality of adjacent structural parts of the camera module and improving the overall quality of the camera module product. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0034] Figure 1 A schematic flow chart of a method for improving dispensing quality according to an embodiment of the present invention is shown;

[0035] Figure 2 A schematic diagram of a 3D model structure of a dispensing device according to an embodiment of the present invention is shown;

[0036] Figure 3 A simplified 3D model structure diagram of a dispensing device according to an embodiment of the present invention is shown;

[0037] Figure 4 A schematic diagram of a glue component received when creating a fluid model according to an embodiment of the present invention is shown;

[0038] Figure 5 A schematic diagram of a fluid model according to an embodiment of the present invention is shown;

[0039] Figure 6 A schematic diagram showing meshing of a fluid model according to an embodiment of the present invention is shown;

[0040] Figure 7 A schematic diagram of a glue grid unit and an air grid unit according to an embodiment of the present invention is shown;

[0041] Figure 8 A schematic diagram of a dispensing simulation model according to an embodiment of the present invention is shown;

[0042] Fig. 9 A schematic diagram of the structure of a device for improving dispensing quality according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0043] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0044] The present invention provides a method for improving the quality of dispensing glue, such as Figure 1 As shown, the method comprises the following steps:

[0045] Step S110, creating a dispensing simulation model; bubbles of a preset size exist in the dispensing simulation model.

[0046] In one embodiment, creating a dispensing simulation model includes:

[0047] Create a 3D fluid model with bubbles, glue and air of preset sizes;

[0048] Based on the relative positions of the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model, the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model are combined to obtain the dispensing simulation model.

[0049] Specifically, before creating the dispensing simulation model, the present invention needs to first create a 3D model of the dispensing device based on a 3D modeling software, such as Figure 2 As shown, the 3D model of the glue dispensing equipment includes: a 3D needle tube assembly 21, a 3D needle head assembly 22 and a 3D placement platform assembly 23, the 3D needle head assembly 22 is connected and located below the 3D needle tube assembly 21, and is used for drawing glue; a glue assembly 24 is placed in the 3D needle tube assembly 21 and the 3D needle head assembly 22, wherein the glue dispensing position of the 3D needle head assembly 22 is located at the connection position between the lens of the camera module and the voice coil motor.

[0050] It should be noted that after the 3D model of the dispensing equipment is created, the coordinates of each component in the 3D model are fixed, and the relative positional relationship between the components is also fixed.

[0051] Generally speaking, if there are bubbles inside the glue, the bubbles will eventually reach the needle assembly 22 over time. Therefore, when analyzing the effect of bubbles on the dispensing quality, the present invention only needs to analyze the bubbles in the needle assembly 22, and then the 3D model of the dispensing equipment needs to be simplified. Figure 3 As shown, the present invention can retain the 3D needle assembly 22 and the 3D placement platform assembly 23, and add a 3D valve assembly 25 on the upper part of the 3D needle assembly 22, and the 3D valve assembly 25 is used to provide dispensing pressure.

[0052] Then, a 3D fluid model is created to simulate the scene where there are bubbles in the glue. The 3D fluid model contains bubbles, glue and air of preset sizes.

[0053] In one embodiment, creating a 3D fluid model includes:

[0054] Add an air domain component to the periphery of the glue component, and use Boolean operations to combine the air domain component and the glue component into a geometric body;

[0055] Meshing the geometric body to obtain glue mesh cells and air mesh cells;

[0056] Based on the preset bubble size and bubble position, a corresponding number of glue grid cells at the corresponding position are set as air grid cells to form a 3D fluid model.

[0057] Specifically, in the actual dispensing scene, the glue is fluid and will flow around. In the 3D modeling software, such as Figure 4 As shown, the newly imported glue component 24 can be received in a new modeling interface, such as Figure 5 As shown, an air domain component 42 is added to the periphery of the glue component 24, and the glue component 24 and the air domain component 42 are combined by Boolean operation, and finally as shown in Figure 5 As shown, a 3D fluid model is formed. Among them, Boolean operation refers to the operation of generating new geometric features or geometric bodies by adding, subtracting or intersecting two or more geometric bodies in geometric modeling features. The glue component represents the glue in the real dispensing device, and the air domain component represents the air in the real dispensing device.

[0058] from Figure 5 It can be seen that the 3D fluid model is actually a geometric body. In order to clearly distinguish the glue and air domains in the 3D fluid model, each component in the 3D fluid model needs to be defined. For example, in the property interface of the simulation software, the required components can be added or deleted according to the needs. Therefore, component 1 and component 2 can be added in the property interface of the simulation software. Component 1 can be set as the glue component of the 3D fluid model, and component 2 can be set as the air domain component in the 3D fluid model.

[0059] Then import this geometry into the meshing software and use the meshing software to mesh the geometry. The meshed 3D fluid model is as follows: Figure 6 shown.

[0060] In this way, after the geometry is meshed, the reference Figure 7 , a glue grid unit 71 and an air grid unit 72 can be obtained.

[0061] Then, based on the received component movement command, the glue grid unit 61 is removed, which is equivalent to the presence of bubbles in the original continuous glue. Figure 7 As shown in the mark 73 in.

[0062] The size of the bubble can be determined based on the number of removed glue grid units 61. The more removed glue grid units 61 are, the larger the bubble size is. Generally speaking, the bubble size can be set to 0.5 to 0.9 mm. Of course, the bubble size can also be set based on the actual glue dispensing equipment, which is not limited here.

[0063] As described above, after the 3D fluid model is created, bubbles, glue and air of preset sizes are set in the 3D fluid model.

[0064] Then the 3D needle assembly 22, the 3D placement platform assembly 23, the 3D valve assembly 25 and the 3D fluid model are imported into the simulation platform, and based on the relative positions of the 3D needle assembly 22, the 3D valve assembly 25, the 3D placement platform assembly 23 and the 3D fluid model, they are combined to obtain a dispensing simulation model.

[0065] It can be understood that in the simplified 3D model, the relative positions among the 3D needle assembly 22, the 3D valve assembly 25, and the 3D placement platform assembly 23 are fixed. Therefore, after being imported into the simulation platform, the positional relationship among the 3D needle assembly 22, the 3D valve assembly 25, and the 3D placement platform assembly 23 will not change.

[0066] Similarly, since the relative position relationship between the 3D needle assembly 22 and the glue assembly 24 is also fixed, the relative position between the glue assembly 24 and the air domain assembly 42 is also fixed, after the 3D needle assembly 22, the 3D valve assembly 25, the 3D placement platform assembly 23 and the 3D fluid model are imported into the simulation platform, each component can be combined in sequence based on its relative position with other components to form a dispensing simulation model.

[0067] Among them, the dispensing simulation model can be Figure 8 shown.

[0068] Step S111, obtaining each group of simulation parameters, simulating the dispensing simulation model under each group of simulation parameters, and outputting corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed.

[0069] After the dispensing simulation model is determined, the dispensing simulation model can be simulated under each set of simulation parameters.

[0070] However, it should be noted that before the simulation, before simulating the dispensing simulation model under each set of simulation parameters, the method further includes:

[0071] Get the material type, material parameters, and simulation type of each component of the dispensing simulation model, and set simulation constraints.

[0072] Specifically, during the simulation process, different materials need to be set to different types. Since both air and glue can flow, the present invention sets the material type to "Euler body".

[0073] Similarly, the material parameters corresponding to different components are also different. For the 3D needle assembly (hereinafter referred to as the needle assembly), the 3D placement platform assembly (hereinafter referred to as the placement platform assembly) and the 3D valve assembly (hereinafter referred to as the valve assembly), the material parameters include: density, Young's modulus and Poisson's ratio. Among them, the material parameters of the 3D needle assembly 22, the 3D placement platform assembly 23 and the 3D valve assembly 25 are shown in Table 1:

[0074] Table 1

[0075]

[0076] The material parameters of the 3D glue component 24 (referred to as glue component) are shown in Table 2:

[0077] Table 2

[0078]

[0079] Among them, EOS refers to the parameter value specified by the equation of state, which is the speed at which sound propagates in the glue, in m / s.

[0080] After the material parameters are set, the simulation type needs to be set. The glue path is drawn using a dispensing device, which belongs to dynamic analysis. Therefore, the present invention will determine the simulation type as the "display dynamic analysis" type.

[0081] It is understandable that if there are no corresponding constraints on the placement platform, the glue will penetrate the placement platform during the downward flow. Therefore, after the simulation type is set, it is also necessary to set corresponding constraints for the glue dispensing simulation model. The constraint is "general contact", which is mainly used to prevent the glue from penetrating the placement platform when it flows downward. Under the action of the constraints, the glue will remain on the placement platform after flowing to the placement platform, and then effective simulation can be performed.

[0082] After the above simulation conditions are determined and set, each set of simulation parameters can be obtained and the fluid can be redefined. The dispensing simulation model is simulated under each set of simulation parameters to output the corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed.

[0083] Specifically, the dispensing pressure can be achieved by applying pressure to the valve assembly, and the glue flow rate can be achieved by applying speed or displacement to the needle assembly.

[0084] In the present invention, multiple groups of simulation parameters may be preset, and the simulation parameters may be determined based on empirical parameters of an actual dispensing process, which is not limited herein.

[0085] Under each set of simulation parameters, the dispensing simulation model is simulated to obtain the corresponding simulation results, where the simulation results are the dispensing results.

[0086] Step S112, determining target simulation parameters from the groups of simulation parameters based on the simulation results, and dispensing the components to be bonded using the target simulation parameters as actual dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet the dispensing quality requirements.

[0087] In one embodiment, determining target simulation parameters from each group of simulation parameters based on the simulation results includes:

[0088] For any simulation result, it is determined whether there is glue break in the simulation result. If it is determined that there is no glue break, the corresponding simulation parameter is determined as the target simulation parameter.

[0089] Alternatively, the target simulation parameters are determined from each set of simulation parameters based on the simulation results, including:

[0090] For any simulation result, determine whether there is glue breakage in the simulation result;

[0091] If it is determined that there is glue breakage, it is further determined whether the current glue length is less than the preset glue breakage length threshold. If it is determined that the current glue breakage length is less than the glue breakage length threshold, the corresponding simulation parameter is determined as the target parameter.

[0092] Specifically, since each set of simulation parameters corresponds to a set of simulation results, if the simulation results meet the requirements of dispensing quality, it means that this set of simulation parameters is appropriate; if the simulation results do not meet the requirements of dispensing quality, it means that the corresponding simulation parameters are inappropriate. Therefore, the present invention can screen out target simulation parameters that meet the dispensing quality according to the simulation results.

[0093] In practical applications, when dispensing glue, a continuous glue path is a relatively ideal situation. Therefore, when there is no glue break in the simulation results, the corresponding simulation parameters can be used as target simulation parameters.

[0094] Of course, if glue breakage occurs, but the length of the break is short and will not affect the actual bonding quality, this situation also meets the requirements of glue dispensing quality.

[0095] Therefore, if the glue cut length is less than the glue cut length threshold, the corresponding simulation parameter can also be determined as the target parameter. The glue cut length can be set according to actual conditions, for example, it can be 0.5-0.8 mm.

[0096] In this way, by creating a dispensing simulation model, defining bubbles of preset sizes in the simulation model, and then simulating the dispensing simulation model to determine the target simulation parameters, during actual dispensing, even if there are bubbles in the glue in the syringe, appropriate actual dispensing parameters can be set according to the simulation results to ensure the quality of dispensing, thereby improving the bonding quality of adjacent structural parts of the camera module and improving the overall quality of the camera module product.

[0097] Based on the same inventive concept as in the above-mentioned embodiment, this embodiment also provides a device for improving the dispensing quality, such as Fig. 9 As shown, the device comprises:

[0098] A creation unit 91 is used to create a dispensing simulation model; there are bubbles of a preset size in the dispensing simulation model;

[0099] The simulation unit 92 is used to obtain each set of simulation parameters, simulate the dispensing simulation model under each set of simulation parameters, and output corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed;

[0100] The determination unit 93 is used to determine the target simulation parameters from the groups of simulation parameters based on the simulation results, and to perform glue dispensing on the components to be bonded using the target simulation parameters as actual glue dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet the glue dispensing quality requirements.

[0101] In one implementation, the creation unit 71 is specifically configured to:

[0102] Creating a 3D fluid model, wherein bubbles, glue, and air of preset sizes exist in the 3D fluid model;

[0103] The dispensing simulation model is obtained by combining the position coordinates of the 3D needle model, the 3D valve model, the 3D placement platform model and the 3D fluid model.

[0104] Since the device introduced in the embodiment of the present invention is a device used to implement the method for improving the dispensing quality of the embodiment of the present invention, based on the method introduced in the embodiment of the present invention, the person skilled in the art can understand the specific structure and deformation of the device, so it is not repeated here. All devices used in the method of the embodiment of the present invention belong to the scope of protection of the present invention.

[0105] Based on the same inventive concept, this embodiment provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any step of the method described above when executing the computer program.

[0106] Based on the same inventive concept, this embodiment provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of any of the methods described above are implemented.

[0107] Through one or more embodiments of the present invention, the present invention has the following beneficial effects or advantages:

[0108] The present invention provides a method, device, medium and equipment for improving the quality of glue dispensing, the method comprising: creating a glue dispensing simulation model; bubbles of preset size exist in the glue dispensing simulation model; obtaining each group of simulation parameters, simulating the glue dispensing simulation model under each group of simulation parameters, and outputting corresponding simulation results; the simulation parameters include: glue dispensing pressure and glue flow speed; determining target simulation parameters from each group of simulation parameters based on the simulation results, and dispensing glue on the components to be bonded with the target simulation parameters as actual glue dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet the glue dispensing quality requirements; in this way, by creating a glue dispensing simulation model, bubbles are set in the simulation model, and then the glue dispensing simulation model is simulated to determine the target simulation parameters; then during actual glue dispensing, even if there are bubbles in the glue in the syringe, appropriate actual glue dispensing parameters can be set according to the simulation results to ensure the glue dispensing quality, thereby improving the bonding quality of adjacent structural parts of the camera module and improving the overall quality of the camera module product.

[0109] The algorithm and display provided herein are not inherently related to any particular computer, virtual system or other device. Various general purpose systems can also be used together with the teachings based on this. According to the above description, it is obvious that the structure required for constructing such systems. In addition, the present invention is not directed to any specific programming language either. It should be understood that various programming languages ​​can be utilized to realize the content of the present invention described herein, and the description of the above specific languages ​​is for disclosing the best mode of the present invention.

[0110] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0111] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0112] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition they may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this manner may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0113] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0114] The various component embodiments of the present invention can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all functions of some or all components in a gateway, proxy server, or system according to an embodiment of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and a computer program product) for executing part or all of the methods described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0115] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0116] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0117] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for improving dispensing quality, characterized in that: The method comprises: Creating a dispensing simulation model; wherein bubbles of a preset size exist in the dispensing simulation model; Acquire each set of simulation parameters, simulate the dispensing simulation model under each set of simulation parameters, and output corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed; Based on the simulation results, target simulation parameters are determined from the groups of simulation parameters, and the target simulation parameters are used as actual dispensing parameters to dispense glue on the components to be bonded; the simulation results corresponding to the target simulation parameters are results that meet the dispensing quality requirements.

2. The method according to claim 1, characterized in that The step of creating a dispensing simulation model comprises: Creating a 3D fluid model, wherein bubbles, glue, and air of preset sizes exist in the 3D fluid model; Based on the relative positions of the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model, the 3D needle assembly, the 3D valve assembly, the 3D placement platform assembly and the 3D fluid model are combined to obtain the dispensing simulation model.

3. The method according to claim 2, characterized in that The creating of the 3D fluid model comprises: Adding an air domain component to the periphery of the glue component, and combining the air domain component and the glue component into a geometric body by using Boolean operations; Meshing the geometric body to obtain glue mesh units and air mesh units; Based on the preset bubble size and bubble position, a corresponding number of the glue grid units at the corresponding position are set as the air grid units to form the 3D fluid model.

4. The method according to claim 1, characterized in that Before simulating the dispensing simulation model under each set of simulation parameters, the method further includes: Obtain the material type, material parameters and simulation type of each component of the dispensing simulation model, and set simulation constraints.

5. The method according to claim 1, characterized in that The determining target simulation parameters from the groups of simulation parameters based on the simulation results includes: For any of the simulation results, it is determined whether there is glue breakage in the simulation result. If it is determined that there is no glue breakage, the corresponding simulation parameter is determined as the target simulation parameter.

6. The method according to claim 1, characterized in that The determining target simulation parameters from the groups of simulation parameters based on the simulation results includes: For any of the simulation results, determining whether there is glue breakage in the simulation result; If it is determined that there is glue breakage, it is further determined whether the current glue length is less than the preset glue breakage length threshold. If it is determined that the current glue breakage length is less than the glue breakage length threshold, the corresponding simulation parameter is determined as the target parameter.

7. A device for improving the quality of glue dispensing, characterized in that: The device comprises: A creation unit, used for creating a dispensing simulation model; bubbles of a preset size exist in the dispensing simulation model; A simulation unit, used to obtain each set of simulation parameters, simulate the dispensing simulation model under each set of simulation parameters, and output corresponding simulation results; the simulation parameters include: dispensing pressure and glue flow speed; A determination unit is used to determine target simulation parameters from each group of simulation parameters based on the simulation results, and to perform glue dispensing on the components to be bonded using the target simulation parameters as actual glue dispensing parameters; the simulation results corresponding to the target simulation parameters are results that meet glue dispensing quality requirements.

8. The device according to claim 7, characterized in that The creation unit is specifically used for: Creating a 3D fluid model, wherein bubbles, glue, and air of preset sizes exist in the 3D fluid model; The dispensing simulation model is obtained by combining the position coordinates of the 3D needle model, the 3D valve model, the 3D placement platform model and the 3D fluid model.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the steps of the method according to any one of claims 1 to 6 are implemented.