Frame adhesive core device for chip packaging

Abstract

The application relates to a frame core sticking device for chip packaging, which comprises a conveying belt, a smearing mechanism arranged above the conveying belt and used for brushing glue on a lead frame, and a pressing mechanism used for assembling a chip and the lead frame, and belongs to the technical field of chip packaging. The frame core sticking device for chip packaging does not need accurate positioning when placing the chip, can simultaneously position multiple chips through the movement of a power plate, saves time, does not cause damage to the corners of the chip during positioning, can quickly and accurately position the chip, improves the efficiency of lead frame core sticking, has strong movement stability in each dimension, improves the production efficiency of semiconductors, can stably fix the chip on the lead frame, and improves the accuracy of lead frame core sticking.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a chip packaging frame bonding device. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials such as gold, aluminum, and copper wires to achieve electrical connection between the internal circuit leads of the chip and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires. Most semiconductor integrated circuits require the use of lead frames, making it an important basic material in the electronics and information industry.

[0003] After the lead frame is manufactured, the chip is bonded to the lead frame using solder paste. During the manufacturing process, the chip is small, so it is inconvenient to bond it to the lead frame using conventional methods. In addition, multiple chips often need to be bonded to the lead frame. Therefore, how to improve the chip bonding efficiency of the lead frame is a challenge. However, most existing lead frames require flipping the chip during chip loading, which can easily lead to inaccurate chip positioning. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a chip packaging frame bonding device, which solves the problems mentioned above.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a chip packaging frame bonding device, comprising a conveyor belt, an applicator for applying adhesive to the lead frame and a pressing mechanism for assembling the chip and lead frame, wherein the surface of the conveyor belt is connected to a loading template for loading the lead frame, the pressing mechanism includes a frame, a lower pressure plate driven by a drive mechanism is mounted on the surface of the frame, and two chip loading platforms fixed together and driven by a motor are slidably mounted on the surface of the frame. The inner cavity of each chip loading platform has a placement slot for placing chips. A receiving plate for receiving chips is fixedly connected to the top of the frame, located below the chip loading platform on the left side. A power plate driven by a cylinder is fixedly connected to one side of the chip loading platform. A connecting plate extending into the inner cavity of the chip loading platform is fixedly connected to one side of the power plate. The inner cavity of the chip loading platform has an embedded groove communicating with the placement slot. A support plate extending into the inner cavity of the placement slot is fixedly connected to one side of the connecting plate. Positioning blocks extending into the placement slot and the inner cavity of the embedded groove are fixedly connected to both sides of the support plate by return springs, respectively. A guide slope is provided on one side of the positioning block, and a snap-fit ​​groove adapted to the chip is provided on the surface of the positioning block. A guide rod is fixedly connected to the inner cavity of the slot. The inner cavity of the positioning block has a guide groove adapted to the guide rod. In use, a robot arm places the chip into the placement slot in the inner cavity of the chip loading stage located above the receiving plate. At this time, the chip falls above the receiving plate and is placed. Then, the power plate is driven by a cylinder to move, which drives the connecting plate to move. The connecting plate drives the positioning block to move towards the chip. The side guide slope of the positioning block contacts the chip, pushing the chip into the slot for positioning. At the same time, the guide rod is inserted into the guide groove, and the forced stretching of the positioning block to move to both sides can prevent the contact force on the chip when the guide slope contacts the chip. Excessive size can cause chipping. The guide rod's oblique movement allows for quick insertion of the chip into the slot, followed by pushing it into the abutment slot for positioning. Precise positioning is not required when placing the chip; the movement of the power board can simultaneously position multiple chips, saving time and preventing damage to the chip's edges. After positioning, both chip loading platforms move to the right, feeding the right-side platform while the left-side platform moves below the suction cup. The pressure plate lowers the suction cup to adsorb the chip, and the power board retracts, resetting the positioning block. The reset spring then contracts, causing the positioning block to retract as well.

[0006] As a further aspect of the present invention: a receiving groove is provided on one side of the placement groove and disposed in the inner cavity of the chip loading platform. The bottom of the receiving groove is flush with the bottom of the chip loading platform, and the top of the receiving groove is located below the surface of the chip loading platform. The placement groove is disposed through the surface of the chip loading platform. The chip end can be inserted through the receiving groove, so that the top of the chip is limited. Even if it is subjected to suction, it will not detach and rise above the chip loading platform. Under the obstruction, it will separate from the suction cup and fall below.

[0007] As a further aspect of the present invention: the bottom of the lower pressure plate is fixedly connected to a suction cup that communicates with an external air source. The diameter of the suction cup is smaller than the minimum inner diameter of the placement groove. The lower pressure plate moves up and down, driving the suction cup to move up and down. The chip can be first adsorbed and positioned, and then pressed down to press it onto the solder paste on the lead frame.

[0008] As a further aspect of the present invention: the coating mechanism includes a fixed plate, on the surface of which a glue storage frame driven by a motor is mounted for lifting. Storage slots are provided on both sides of the glue storage frame. Coating grooves corresponding to the placement slots are provided on the surface of the glue storage frame. Injection ports located between the placement slots are provided on the surface of the glue storage frame. These injection ports are connected to an external solder paste supply mechanism via pipes. A scraper driven by a power mechanism is slidably connected to the top of the glue storage frame. During use, the glue storage frame moves downwards and presses against the top of the lead frame, then glue is injected through the injection ports. The scraper then moves left and right back and forth to coat the solder paste onto the top of the lead frame through the coating grooves. Excess solder paste is pushed into the storage slots on both sides for storage. The coated lead frame is then conveyed by a conveyor belt to a suction cup. The suction cup presses down to attach the chip to the top of the lead frame. The process is then repeated.

[0009] As a further aspect of the present invention: multiple placement slots are provided and are evenly distributed on the surface of the chip loading platform; multiple suction cups are provided and correspond one-to-one with the placement slots.

[0010] As a further aspect of the present invention: the top of the receiving plate is provided with a protrusion adapted to the placement groove, and the surface of the receiving plate other than the protrusion does not abut against the bottom of the chip loading platform.

[0011] As a further aspect of the present invention: the embedded groove is disposed in the inner cavity of the chip loading stage.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. This invention eliminates the need for precise chip placement. Multiple chips can be positioned simultaneously simply by the movement of the power board, saving time and preventing damage to chip edges during positioning. After positioning, both chip loading platforms move to the right simultaneously, feeding the right-side platform while the left-side platform moves below the suction cup. The pressure plate lowers the suction cup to adsorb the chip, enabling rapid and precise chip placement and positioning, improving lead frame bonding efficiency. The invention also exhibits strong stability in all dimensions, enhancing semiconductor production efficiency and ensuring stable chip mounting on the lead frame, thus improving lead frame bonding accuracy.

[0014] 2. In this invention, the end of the chip can be inserted by setting the abutment groove, so that the top of the chip is limited and will not be lifted up above the chip loading platform even when subjected to suction force. Under the obstruction, it will separate from the suction cup and fall below.

[0015] 3. In this invention, solder paste is injected through the injection port, and then the solder paste is applied to the top of the lead frame through the coating tank by the reciprocating motion of the scraper. Excess solder paste is then pushed into the storage tanks on both sides for storage. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention;

[0017] Figure 2 This is a top view of the chip loading platform of the present invention;

[0018] Figure 3 For the present invention Figure 2 A magnified view of a section at point A in the middle;

[0019] Figure 4 This is a top view of the chip loading platform in the clamping state of the present invention;

[0020] Figure 5 For the present invention Figure 4 A magnified view of a section at point B in the middle;

[0021] Figure 6 This is a top view of the adhesive storage frame of the present invention.

[0022] In the diagram: 1. Conveyor belt; 2. Loading template; 3. Lead wire frame; 4. Frame; 5. Chip loading platform; 6. Placement slot; 7. Suction cup; 8. Power board; 9. Connecting plate; 11. Guide chute; 12. Guide rod; 13. Support plate; 14. Return spring; 15. Snap-fit ​​slot; 16. Guide slope; 17. Chip; 18. Fixing plate; 19. Glue storage frame; 20. Storage slot; 21. Glue application slot; 22. Glue injection port; 23. Positioning block; 24. Receiving plate; 25. Lower pressure plate; 26. Abutment groove; 27. Glue scraper. Detailed Implementation

[0023] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0024] Please see Figure 1-6This invention provides a technical solution: a chip packaging frame bonding device, including a conveyor belt 1, an applicator for applying adhesive to a lead frame 3 disposed above the conveyor belt 1, and a pressing mechanism for assembling a chip 17 and a lead frame 3. A loading template 2 for loading the lead frame 3 is driven to the surface of the conveyor belt 1. The pressing mechanism includes a frame 4, a lower pressure plate 25 driven by a drive mechanism is mounted on the surface of the frame 4, and two chip loading platforms 5 fixed together and driven by a motor are slidably mounted on the surface of the frame 4. The inner cavity of each chip loading platform 5 has a placement slot 6 for placing the chip 17. A device for pressing the chip 17 is fixedly connected to the top of the frame 4 below the left chip loading platform 5. A receiving plate 24 for receiving chip 17 is provided. A power plate 8 driven by a cylinder is fixedly connected to one side of the chip loading stage 5. A connecting plate 9 extending into the inner cavity of the chip loading stage 5 is fixedly connected to one side of the power plate 8. An embedded groove communicating with the placement slot 6 is opened in the inner cavity of the chip loading stage 5. A support plate 13 extending into the inner cavity of the placement slot 6 is fixedly connected to one side of the connecting plate 9. Positioning blocks 23 extending into the placement slot 6 and the inner cavity of the embedded groove are fixedly connected to both sides of the support plate 13 by return springs 14, respectively. A guide slope 16 is opened on one side of the positioning block 23. A snap-fit ​​groove 15 adapted to the chip 17 is opened on the surface of the positioning block 23. A guide rod 12 is fixedly connected to the inner cavity of the embedded groove. A guide rod 12 is fixedly connected to the inner cavity of the positioning block 23. The guide groove 11, adapted to the guide rod 12, is used in operation by a robotic arm to place the chip 17 into the placement slot 6 inside the chip loading platform 5 located above the receiving plate 24. At this time, the chip 17 falls onto the receiving plate 24 and is placed there. Then, the power plate 8 is driven by a cylinder to move, which in turn moves the connecting plate 9. The connecting plate 9 moves the positioning block 23 toward the chip 17. The side guide slope 16 of the positioning block 23 contacts the chip 17, pushing the chip 17 into the locking slot 15 for positioning. Simultaneously, the guide rod 12 is inserted into the guide groove 11, forcibly stretching the positioning block 23 to move to both sides. This prevents excessive contact force on the chip 17 when the guide slope 16 contacts it, which could cause chipping. The oblique movement of the guide rod 12 allows the chip 17 to be quickly inserted into the slot 15 and then pushed into the abutment slot 26 for positioning. When placing the chip 17, precise positioning is not required; the movement of the power plate 8 is sufficient to position multiple chips 17 simultaneously, saving time and preventing damage to the edges and corners of the chip 17 during positioning. After positioning, both chip loading platforms 5 move to the right simultaneously, feeding the chip loading platform 5 on the right. Meanwhile, the chip loading platform 5 on the left moves below the suction cup 7, and the pressure plate 25 drives the suction cup 7 to descend and adsorb the chip 17. Then, the power plate 8 retracts, causing the positioning block 23 to reset. At this time, the reset spring 14 contracts, causing the positioning block 23 to retract.

[0025] A receiving groove 26 is provided on one side of the placement groove 6 and is located in the inner cavity of the chip loading platform 5. The bottom of the receiving groove 26 is flush with the bottom of the chip loading platform 5, and the top of the receiving groove 26 is located below the surface of the chip loading platform 5. The placement groove 6 is provided through the surface of the chip loading platform 5. The end of the chip 17 can be inserted through the receiving groove 26, so that the top of the chip is limited. Even if it is subjected to suction, it will not fall off and rise above the chip loading platform 5. Under the cover, it will separate from the suction cup 7 and fall below.

[0026] The bottom of the pressure plate 25 is fixedly connected to a suction cup 7 that is connected to an external air source. The diameter of the suction cup 7 is smaller than the minimum inner diameter of the placement groove 6. The pressure plate 25 moves up and down, driving the suction cup 7 to move up and down. The chip 17 can be first adsorbed and positioned, and then pressed down to press it onto the solder paste on the lead frame 3.

[0027] The coating mechanism includes a fixed plate 18. A glue storage frame 19 driven by a motor is mounted on the surface of the fixed plate 18. Storage slots 20 are provided on both sides of the glue storage frame 19. The surface of the glue storage frame 19 has coating grooves 21 that correspond one-to-one with the positions of the placement slots 6. The surface of the glue storage frame 19 has injection ports 22 located between the placement slots 6. The injection ports 22 are connected to an external solder paste supply mechanism through pipes. A scraper 27 driven by a power mechanism is slidably connected to the top of the glue storage frame 19. In use, the glue storage frame 19 moves downward and presses down on the top of the lead frame 3. Then, glue is injected through the injection ports 22. Then, the scraper 27 moves left and right back and forth to spread the solder paste through the coating grooves 21 onto the top of the lead frame 3. Then, excess solder paste is pushed into the storage slots 20 on both sides for storage. Then, the coated lead frame 3 is conveyed by the conveyor belt 1 to the bottom of the suction cup 7. Then, the suction cup 7 presses down to stick the chip 17 onto the top of the lead frame 3. Then, the mechanism is reset and the above steps are repeated.

[0028] Multiple placement slots 6 are provided and are evenly distributed on the surface of the chip loading stage 5. Multiple suction cups 7 are provided and correspond one-to-one with the placement slots 6.

[0029] The top of the receiving plate 24 has a protrusion that matches the placement groove 6, and the surface of the receiving plate 24 other than the protrusion does not abut against the bottom of the chip loading platform 5.

[0030] The embedded slot is located inside the chip loading stage 5.

[0031] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A frame sticking core device of a chip package, comprising a conveying belt (1), a smearing mechanism arranged above the conveying belt (1) for brushing glue on a lead frame (3), and a press-fitting mechanism for assembling a chip (17) and the lead frame (3), and a loading template (2) for loading the lead frame (3) is drivingly connected to the surface of the conveying belt (1), characterized in that: the loading template (2) is provided with a plurality of loading grooves (4) arranged in a row, and the loading grooves (4) are arranged in a staggered manner. The pressing mechanism comprises a rack (4), the surface of the rack (4) is provided with a pressing plate (25) driven by a driving mechanism through surface lifting, the left and right surfaces of the rack (4) are provided with two chip loading tables (5) fixed together and driven by a motor through surface sliding, the inner cavity of the chip loading table (5) is provided with a placing groove (6) for placing a chip (17), the top of the rack (4) is fixedly connected with a receiving plate (24) below the left chip loading table (5) for receiving the chip (17), one side of the chip loading table (5) is fixedly connected with a power plate (8) driven by a gas cylinder, one side of the power plate (8) is fixedly connected with a connecting plate (9) extending into the inner cavity of the chip loading table (5), the inner cavity of the chip loading table (5) is provided with an embedded groove (6) in communication with the placing groove (6), one side of the connecting plate (9) is fixedly connected with a supporting plate (13) extending into the inner cavity of the placing groove (6), the supporting plate (13) is fixedly connected with a positioning block (23) extending into the inner cavities of the placing groove (6) and the embedded groove (6) through a reset spring (14) on both sides of the supporting plate (13), one side of the positioning block (23) is provided with a guide inclined surface (16), the surface of the positioning block (23) is provided with a clamping groove (15) matched with the chip (17), the inner cavity of the embedded groove (6) is fixedly connected with a guide rod (12), and the inner cavity of the positioning block (23) is provided with a guide inclined groove (11) matched with the guide rod (12).

2. The frame adhesive core device of a chip package according to claim 1, wherein: One side of the placing groove (6) is provided with an abutting groove (26) arranged in the inner cavity of the chip loading table (5), the bottom of the abutting groove (26) is flush with the bottom of the chip loading table (5), the top of the abutting groove (26) is below the surface of the chip loading table (5), and the placing groove (6) is arranged in the surface of the chip loading table (5) in a penetrating mode.

3. The frame adhesive core device for a chip package of claim 1, wherein: The bottom of the pressing plate (25) is fixedly connected with a suction disc (7) in communication with an external air source, and the diameter of the suction disc (7) is smaller than the minimum inner diameter of the placing groove (6).

4. The chip-encased frame adhesive core apparatus of claim 1, wherein: The smearing mechanism comprises a fixed plate (18), the surface of the fixed plate (18) is provided with a glue storage frame (19) driven by a motor through surface lifting, both sides of the glue storage frame (19) are provided with storage grooves (20), the surface of the glue storage frame (19) is provided with glue smearing grooves (21) corresponding to the positions of the placing grooves (6) one by one, the surface of the glue storage frame (19) is provided with glue injection openings (22) between the placing grooves (6), the glue injection openings (22) are in communication with an external solder paste supply mechanism through pipelines, and the top of the glue storage frame (19) is slidingly connected with a glue scraping plate (27) driven by a power mechanism.

5. The chip-encased frame-adhered core device of claim 3, wherein: A plurality of placing grooves (6) are arranged on the surface of the chip loading table (5) in a uniform distribution mode, and a plurality of suction discs (7) are arranged in one-to-one correspondence with the placing grooves (6).

6. The chip-encased frame adhesive core apparatus of claim 1, wherein: The top of the receiving plate (24) is provided with a protrusion matched with the placing groove (6), and the surface of the receiving plate (24) outside the protrusion is not in abutment with the bottom of the chip loading table (5).

7. The chip-encased frame-adhered core device of claim 1, wherein: The embedded groove (6) is arranged in the inner cavity of the chip loading table (5).

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