Surface mount module

Abstract

The invention relates to the technical field of module packaging, and discloses a surface mounting module. The surface mounting module comprises a first substrate, a first chip, a clamping piece, a second chip, a second substrate, a first pin and a second pin. The first chip is arranged on one side of the first substrate and is electrically connected with the first substrate; the clamping piece is arranged on the side, away from the first substrate, of the first chip and electrically connected with the first chip. The second chip is arranged on one side, deviating from the first chip, of the clamping piece and is electrically connected with the clamping piece; the second substrate is arranged on one side, deviating from the clamping piece, of the second chip and is electrically connected with the second chip; the first pin is arranged on the edge of the first substrate on the same side as the first chip, and the first pin is electrically connected with the first chip through the first substrate; the second pin is arranged between the first substrate and the second substrate. According to the surface-mounted module provided by the invention, the current can be longitudinally conducted, the path is short, the area is large, the stray inductance is lower, the electric stress and loss of the surface-mounted module can be reduced, and the power is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of module packaging technology, and in particular to surface mount modules. Background Art

[0002] Surface mount modules are a key component in the field of modern electronic manufacturing and play an indispensable role in the development of electronic equipment. From the appearance, it can be used as a part of many tiny electronic components, integrated on the surface of a printed circuit board (PCB). The surface mount module is installed on the PCB through a special process. Its core advantage lies in miniaturization. The size and weight of the components are extremely small. A large number of components can be accommodated on a limited PCB area, which greatly reduces the size of electronic devices. Products such as smart phones and tablets can become thin and portable. The surface mount module has made an indispensable contribution. In terms of performance, due to the short connection path between the surface mount module and the PCB, the signal transmission speed is fast and the loss is small, which significantly improves the operating speed and processing power of electronic equipment. Moreover, it has high reliability. Automated equipment is used for mounting and welding in the production process. The process is mature and stable, which reduces the problems of false welding and leaking welding that may occur due to manual welding, and reduces the probability of equipment failure. Surface mount modules are almost everywhere. In the field of consumer electronics, it makes products more functional; in communication equipment, it helps to achieve high-speed and large-capacity signal transmission; in the field of automotive electronics, it improves the stability of equipment; in industrial control, it also enhances the performance and reliability of equipment, driving electronic equipment in various industries to continuously develop in a more advanced direction.

[0003] Surface mount modules usually consist of components such as chips, substrates, lead frames, bonding wires, pins, etc., and are plastic-sealed to form an overall structure with certain functions. In the existing surface mount module packaging form, the chips are on the same plane, and the current loop is transversely conducted through the bonding wires or clips on the front. The overall loop has a high inductance and high electrical stress, which affects the power of the mount module. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a surface mount module, reduce the inductance and electrical stress of the overall circuit, and improve the power of the mount module.

[0005] In order to solve the above technical problems, the embodiment of the present application provides a surface mount module, which includes a first substrate, a first chip, a clip, a second chip, a second substrate, a first pin and a second pin. The first chip is arranged on one side of the first substrate and is electrically connected to the first substrate; the clip is arranged on the side of the first chip away from the first substrate and is electrically connected to the first chip; the second chip is arranged on the side of the clip away from the first chip and is electrically connected to the clip; the second substrate is arranged on the side of the second chip away from the clip and is electrically connected to the second chip; the first pin is arranged on the edge of the first substrate on the same side as the first chip, and the first pin is electrically connected to the first chip through the first substrate; the second pin is arranged between the first substrate and the second substrate, and is arranged opposite to the first pin; the signals of the first chip and the second chip are longitudinally transmitted through the clip.

[0006] The surface mount module provided in the embodiment of the present application is achieved by stacking a first substrate, a first chip, a clip, a second chip and a second substrate in an upper and lower manner, and electrically connecting the upper and lower structures, so that current can be conducted vertically, with a short path, a large area and lower inductance, which is beneficial for the surface mount module to reduce electrical stress and loss and improve power.

[0007] In some implementations, there are multiple first chips and multiple second chips, and there are multiple first pin numbers and multiple second pin numbers.

[0008] In some embodiments, a portion of the second pins are connected to the clip, and another portion of the second pins are connected to the second substrate.

[0009] In some embodiments, the second pin is connected to the clip in an integrally formed manner, the number of the clip is one, and the length of the clip increases as the number of the first chip and the second chip increases.

[0010] In some embodiments, the area where the clip contacts the first chip is smaller than the welding area of ​​the first chip, the area where the clip contacts the second chip is smaller than the welding area of ​​the second chip, and the thickness of the clip is greater than the thickness of the second pin.

[0011] In some embodiments, the surface mount module also includes a plastic package, which covers a portion of the first pin, a portion of the second pin, a portion of the first substrate, a portion of the second substrate, the entire first chip, the entire second chip, and the entire clip, and exposes two surfaces of the first substrate and the second substrate that are far away from each other.

[0012] In some embodiments, when the first chip is fixed on the first substrate, a filler is disposed in the gap between the edge of the first chip and the first substrate to balance the plastic packaging pressure, and the filler is made of the same material as the plastic packaging body.

[0013] In some embodiments, the first pin and the second pin are both bent, and one end of the first pin protruding from the plastic package and one end of the second pin protruding from the plastic package are both flush with a side of the first substrate facing away from the first chip.

[0014] In some embodiments, the first substrate includes a first circuit board, a first insulating plate, and a first metal plate in sequence along the direction from the second substrate to the first substrate; and / or the second substrate includes a second circuit board, a second insulating plate, and a second metal plate in sequence along the direction from the first substrate to the second substrate.

[0015] In some embodiments, the first chip is disposed on the first substrate by welding, sintering, or pressing; and / or the clip is connected to the first chip and the second chip respectively by welding, sintering, or pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 is a side cross-sectional view of a surface mount module provided in some embodiments of the present application;

[0018] Figure 2 is a schematic diagram of a three-dimensional structure of a surface mount module provided in some embodiments of the present application;

[0019] Figure 3 It is a schematic diagram of the side structure of the second pin of the surface mount module provided in some embodiments of the present application;

[0020] Figure 4 is a top view of a surface mount module provided in some embodiments of the present application.

[0021] Explanation of the reference numerals: 11-first substrate; 111-first circuit board; 112-first insulating plate; 113-first metal plate; 12-first chip; 13-clip; 14-second chip; 15-second substrate; 151-first circuit board; 152-first insulating plate; 153-first metal plate; 16-first pin; 17-second pin; 18-plastic package; 19-filler. DETAILED DESCRIPTION

[0022] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not constitute any limitation, and the various embodiments can be combined with each other and referenced to each other without contradiction.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0024] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0025] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0026] Surface mount modules are a key component in the field of modern electronic manufacturing and play an indispensable role in the development of electronic equipment. From the appearance, it can be integrated on the surface of a printed circuit board (PCB) as part of many tiny electronic components. The surface mount module is installed on the PCB through a special process. Its core advantage lies in miniaturization. The size and weight of the components are extremely small. A large number of components can be accommodated on a limited PCB area, which greatly reduces the size of electronic devices. Products such as smartphones and tablets can become thin and portable. The surface mount module has made an indispensable contribution. In terms of performance, due to the short connection path between the surface mount module and the PCB, the signal transmission speed is fast and the loss is small, which significantly improves the operating speed and processing power of electronic equipment. Moreover, it has high reliability. Automated equipment is used for mounting and welding in the production process. The process is mature and stable, which reduces the problems of false welding and leaking welding that may occur due to manual welding, and reduces the probability of equipment failure. Surface mount modules are almost everywhere. In the field of consumer electronics, it makes products more functional; in communication equipment, it helps to achieve high-speed and large-capacity signal transmission; in the field of automotive electronics, it improves the stability of equipment; in industrial control, it also enhances the performance and reliability of equipment, driving electronic equipment in various industries to continuously develop in a more advanced direction.

[0027] Surface mount modules usually consist of components such as chips, substrates, lead frames, bonding wires, pins, etc., and are plastic-sealed to form an overall structure with certain functions. In the existing surface mount module packaging form, the chips are on the same plane, and the current loop is transversely conducted through the bonding wires or clips on the front. The overall loop has a high inductance and high electrical stress, which affects the power of the mount module.

[0028] In order to solve the problem that the chips in the existing surface mount module are in the same plane, the current loop is transversely conducted through the bonding wires or clips on the front, the overall loop has high inductance, high electrical stress, and affects the power of the mount module. Some embodiments of the present application provide a surface mount module, which is stacked up and down by a first substrate, a first chip, a clip, a second chip, and a second substrate, and the upper and lower structures are electrically connected, so that the current can be conducted longitudinally, the path is short, the area is large, and the inductance is lower, which is beneficial for the surface mount module to reduce electrical stress and loss and improve power.

[0029] Combine the following Figure 1-4 The surface mount modules provided by some embodiments of the present application are described.

[0030] like Figure 1 and Figure 2As shown, some embodiments of the present application provide a surface mount module, which includes a first substrate 11, a first chip 12, a clip 13, a second chip 14, a second substrate 15, a first pin 16 and a second pin 17. The first chip 12 is arranged on one side of the first substrate 11 and is electrically connected to the first substrate 11; the clip 13 is arranged on the side of the first chip 12 away from the first substrate 11 and is electrically connected to the first chip 12; the second chip 14 is arranged on the side of the clip 13 away from the first chip 12 and is electrically connected to the clip 13; the second substrate 15 is arranged on the side of the second chip 14 away from the clip 13 and is electrically connected to the second chip 14; the first pin 16 is arranged on the edge of the first substrate 11 on the same side as the first chip 12, and the first pin 16 is electrically connected to the first chip 12 through the first substrate 11; the second pin 17 is arranged between the first substrate 11 and the second substrate 15, and is arranged opposite to the first pin 16; the signals of the first chip 12 and the second chip 14 are longitudinally conducted through the clip 13.

[0031] It should be noted that the first substrate 11 and the second substrate 15 can be functional substrates with insulation, heat dissipation and graphic circuit layers such as DBC (Direct Bonded Copper), DBA (Direct Bonded Aluminum), AMB (Active Metal Brazing), etc., and can be single-layer boards or two-layer or multi-layer boards. The first substrate 11 and the second substrate 15 are connected to the chip on one side thereof, and a circuit layer formed of a metal layer can be electrically connected to the chip to transmit signals. The first substrate 11 and the second substrate 15 also have a heat dissipation function, dissipating the heat generated by the chip to the surrounding environment. The first substrate 11 and the second substrate 15 also have an insulating function, isolating the electrical signals of the chip from being transmitted inside and at the pins. The first chip 12 can be fixed on the first substrate 11 by welding, sintering or crimping, and the second chip 14 can be fixed on the second substrate 15 by welding, sintering or crimping. The clip 13 can also be electrically connected to the first chip 12 and the second chip 14 by welding, sintering or crimping.

[0032] like Figure 1As shown, the first substrate 11 is at the bottom layer, the first chip 12 is fixed on the first substrate 11, the clip 13 is fixed on the first chip 12, the second chip 14 is fixed on the clip 13, and the second substrate 15 is fixed on the second chip 14. The first substrate 11, the first chip 12, the clip 13, the second chip 14 and the second substrate 15 are arranged from bottom to top in sequence. The connection between the first pin 16 and the first substrate 11 and the first chip 12 are located on the same plane. The first pin 16 can not only transmit the signal of the first chip 12, but also transmit the signal of the second chip 14 through the clip 13. The second pin 17 is connected to the clip 13 and is located on the other side opposite to the first pin 16, and transmits the signals of the first chip 12 and the second chip 14 through the clip 13.

[0033] The surface mount module provided in the embodiment of the present application is configured by stacking a first substrate 11, a first chip 12, a clip 13, a second chip 14 and a second substrate 15 in an upper and lower arrangement, and electrically connecting the upper and lower structures, so that current can be conducted vertically with a short path, a large area and lower inductance, which is beneficial for the surface mount module to reduce electrical stress and loss and improve power.

[0034] Experiments show that the stray inductance value of the traditional bonding structure surface mount module reaches 6.38nH (nanohenry, the abbreviation of the unit of inductance), the stray inductance value of the Clip structure surface mount module reaches 5.96nH, and the stray inductance value of the stacked structure surface mount module of the present application is the smallest, reaching 3.04nH. It can be seen that the stacked structure setting can effectively reduce the current density of the surface mount module, thereby reducing the stray inductance value and reducing its electrical stress.

[0035] In some embodiments of the present application, there are multiple first chips 12 and multiple second chips 14 , and there are multiple first pins 16 and multiple second pins 17 .

[0036] It should be noted that if Figure 2 , Figure 3 and Figure 4 As shown, a plurality of first chips 12 and second chips 14 are provided, and the plurality of first chips 12 are on the same horizontal plane, and the plurality of second chips 14 are also on the same horizontal plane. This arrangement greatly increases the power of the surface mount module and can achieve more functions. The number of first chips 12, second chips 14, first pins 16, and second pins 17 can be consistent or inconsistent, and different numbers of chips and pin distributions can be reasonably designed according to different functions and different installation positions.

[0037] In some embodiments of the present application, a portion of the second pins 17 are connected to the clip 13 , and another portion of the second pins 17 are connected to the second substrate 15 .

[0038] Specifically, the pins can be divided into three categories. The first category is the first pin 16 installed on the first substrate 11 and electrically connected to the emitter (E pole) and the gate (G pole) of the first chip 12. The second category is the second pin 17 that is led out from the clip 13, integrally formed with the clip 13, and electrically connected to the collector (C pole) of the first chip 12 and the emitter of the second chip 14. The third category is another second pin 17 that is led out from the second substrate 15 and electrically connected to the collector of the second chip 14. The gate of the second chip 14 can be led out from the clip 13 or from the second substrate 15. Because different poles of the chip extend outward from the corresponding connected substrate, this requires that the second category of pins and the third category of pins must exist at the same time.

[0039] In some embodiments of the present application, the second pin 17 is connected to the clip 13 in an integrally formed manner, there is only one clip 13 , and the length of the clip 13 increases as the number of the first chip 12 and the second chip 14 increases.

[0040] It should be noted that the length of the clip 13 increases as the number of the first chip 12 and the second chip 14 increases, and the shape of the clip 13 changes as the shape of the chip changes. The integral clip 13 is more convenient to install, and only needs to be installed once. The second pin 17 is integrally formed with the clip 13 so that the pin and the clip 13 are integrated, so that they can be directly installed without additional welding steps.

[0041] In some embodiments of the present application, the contact area between the clip 13 and the first chip 12 is smaller than the welding area of ​​the first chip 12 , the contact area between the clip 13 and the second chip 14 is smaller than the welding area of ​​the second chip 14 , and the thickness of the clip 13 is greater than the thickness of the second pin 17 .

[0042] It should be noted that this height and area limitation is because there is a terminal area around the emitter of the chip, which cannot be contaminated by conductive objects.

[0043] In some embodiments of the present application, the surface mount module also includes a plastic package 18, which covers a portion of the first pin 16, a portion of the second pin 17, a portion of the first substrate 11, a portion of the second substrate 15, the entire first chip 12, the entire second chip 14, and the entire clip 13, and exposes two surfaces of the first substrate 11 and the second substrate 15 that are far away from each other.

[0044] It should be noted that the first substrate 11, the first chip 12, the clip 13, the second chip 14, the second substrate 15, the first pin 16 and the second pin 17 stacked up and down form an integral body 18 to be encapsulated, and then epoxy resin is poured in the mold to encapsulate it as a whole. The first pin 16 and the second pin 17 leak out of the encapsulation body 18, and play a role in conducting the first chip 12 and the second chip 14 to the peripheral device. The two surfaces of the first substrate 11 and the second substrate 15 that are far away from each other leak out of the encapsulation body 18, and play a role in heat conduction, and quickly conduct the heat of the first chip 12 and the second chip 14 to the surrounding environment.

[0045] In some embodiments of the present application, when the first chip 12 is fixed on the first substrate 11, a filler 19 is provided in the gap between the edge of the first chip 12 and the first substrate 11 to balance the molding pressure, and the filler 19 is the same as the molding material.

[0046] It should be noted that when the first chip 12 is fixed on the first substrate 11, it is necessary to fill the gap between the edge of the chip and the substrate with a filler 19 to balance the plastic packaging pressure. The filler 19 can be made of the same or different materials as the plastic packaging body 18. When the same material is used, the filler 19 is more compatible with the plastic packaging body 18, which is more conducive to the stable performance of the mounting module. If it is not filled during injection molding, it is possible that the plastic packaging material is not fully filled there. During curing, the shrinkage of the plastic packaging material will cause normal warping force, resulting in chip cracking.

[0047] In some embodiments of the present application, the first pin 16 and the second pin 17 are bent, and the end of the first pin 16 and the end of the second pin 17 exposed from the plastic package 18 are both flush with the side of the first substrate 11 away from the first chip 12.

[0048] It should be noted that if Figure 1 and Figure 2 As shown, the first pin 16 and the second pin 17 are bent in a Z shape, one end of which is in the plastic package 18 and electrically connected to the chip, and the other end of which is exposed outside the plastic package 18 and is connected to an external device to transmit the electrical signal of the chip. The end surfaces of the first pin 16 and the second pin 17 that are exposed outside the plastic package 18 are flush with the back surface of the first substrate 11, that is, Figure 1 As shown, the lower horizontal surface formed by the bending of the first pin 16 and the second pin 17 is flush with the bottom of the substrate. This flush arrangement ensures the stability of the installation during use.

[0049] In some embodiments of the present application, the first substrate 11 includes a first circuit board 111, a first insulating plate 112 and a first metal plate 113 in sequence along the direction from the second substrate 15 to the first substrate 11; and / or the second substrate 15 includes a second circuit board 151, a second insulating plate 152 and a second metal plate 153 in sequence along the direction from the first substrate 11 to the second substrate 15.

[0050] That is to say, the first substrate 11 is divided into three layers from the side where the first chip 12 is installed to the side where the first substrate 11 leaks out of the plastic package 18, namely the first circuit board 111 layer, the first insulating plate 112 layer and the first metal plate 113 layer. The first circuit board 111 is directly electrically connected to the first chip 12, and transmits the signal of the first chip 12 to the external device through the pin. The first insulating plate 112 isolates the signal of the first chip 12 so that it transmits the signal in a predetermined circuit to prevent the signal from being transmitted to the first metal plate 113 leaking out of the plastic package 18. The heat generated in the first chip 12 is transmitted to the first insulating plate 112 through the first circuit board 111, and then diffuses from the first metal plate 113 to the surrounding environment.

[0051] In addition, the second substrate 15 is divided into three layers from the side where the second chip 14 is installed to the side where the second substrate 15 leaks out of the plastic package 18, namely, the second circuit board 151 layer, the second insulating plate 152 layer and the second metal plate 153 layer. The second circuit board 151 is directly electrically connected to the second chip 14, and transmits the signal of the second chip 14 to the external device through the pin. The second insulating plate 152 isolates the signal of the second chip 14, so that it transmits the signal in a predetermined circuit, and prevents the signal from being transmitted to the second metal plate 153 leaking out of the plastic package 18. The heat generated in the second chip 14 is transmitted to the second insulating plate 152 through the second circuit board 151, and then diffuses from the second metal plate 153 to the surrounding environment. The first substrate 11 and the second substrate 15 are assembled in this way, so that the first substrate 11 and the second substrate 15 have the functions of insulation, heat dissipation and patterned circuit layer. This double-sided heat dissipation feature can conduct the heat generated by the first chip 12 and the second chip 14 upward or downward, and can fully dissipate the heat.

[0052] The traditional surface mount module plastic encapsulation mode requires an external insulating sheet or aluminum substrate to attach a heat sink due to the lack of internal insulation, which has low heat dissipation efficiency. Under the same power density, the traditional surface mount module has poor heat dissipation, the chip temperature is high, and it is easy to exceed the allowable operating temperature. The existing top heat dissipation mode only reduces the contact interface of the external insulation layer and reduces the contact thermal resistance, but has limited effect on improving power density, and the heat from the bottom soldered pins and substrate is difficult to dissipate. With the existing double-sided heat dissipation, the chip temperature can be controlled very low, but the working current of the chip itself is limited. The overall power of the surface mount module cannot be increased, so more chips need to be added to increase the power. Therefore, it is proposed that the stacked structure can accommodate twice the number of chips per unit area, and the use of double-sided heat dissipation can fully dissipate the heat. It can increase the power density of the surface mount module to twice the previous level.

[0053] The applicant measured the maximum temperature of the chip under different heat dissipation modes when working and when other influencing factors are the same. Experiments show that the maximum temperature of the TOLL chip with bottom heat dissipation is 130°C, the maximum temperature of the SPB module chip with top heat dissipation is 134.8°C, and the maximum temperature of the SPB double-sided heat dissipation module chip used in this application is 129.3°C. The TOLL chip and SPB module chip have only four chips, while the double-sided heat dissipation stacked structure of this application has eight chips. Under the same maximum operating current of a single chip, the chip power of the structure of this application is twice that of the other two structures, and the stacked double-sided heat dissipation can control the chip temperature to be similar to the other two structures. It shows that the stacked structure can achieve twice the power density of the other structures under the same device area. In the traditional TOLL or SPB bonding structure, the chip is welded on the carrier, the collector of the chip is connected to the carrier, and the emitter and gate are connected to the terminals through bonding wires.

[0054] In some embodiments of the present application, the first chip 12 is disposed on the first substrate 11 by welding, sintering, or crimping; and / or the clip 13 is connected to the first chip 12 and the second chip 14 respectively by welding, sintering, or crimping.

[0055] It should be noted that welding, sintering, or pressing is a general way of chip installation, and the first chip 12, the clip 13, the second chip 14, the first substrate 11, and the second substrate 15 are installed in corresponding positions. Not only is the installation firm but also the electrical signal can be transmitted, and no additional gasket is required, and the heat transfer efficiency is higher.

[0056] In some embodiments of the present application, the material of the clip 13 is copper or molybdenum.

[0057] It should be noted that copper and molybdenum are materials with high thermal and electrical conductivity and a certain elasticity, which can not only meet the installation and fixation of the clip 13 and the electrical and thermal conductivity, but also make the first chip 12 and the second chip 14 have a certain elasticity, thereby playing a role in protecting the chips.

[0058] In some embodiments of the present application, the first pin 16 is a DC± terminal pin; and / or, the second pin 17 is an AC electrode terminal pin.

[0059] It should be noted that the DC± end and the AC electrode end are connected to external devices through different pins of the plastic package 18 and can transmit different signals.

[0060] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. Surface mount module, characterized in that, include: a first substrate; A first chip is disposed on one side of the first substrate and is electrically connected to the first substrate; a clip, disposed on a side of the first chip away from the first substrate and electrically connected to the first chip; A second chip is disposed on a side of the clip away from the first chip and is electrically connected to the clip; A second substrate, disposed on a side of the second chip away from the clip and electrically connected to the second chip; A first pin is arranged at an edge of the first substrate on the same side as the first chip, and the first pin is electrically connected to the first chip through the first substrate; A second pin is disposed between the first substrate and the second substrate and is disposed opposite to the first pin; Signals of the first chip and the second chip are vertically transmitted through the clip.

2. The surface mount module according to claim 1, characterized in that: There are multiple first chips and multiple second chips, and there are multiple first pins and multiple second pins.

3. The surface mount module according to claim 2, characterized in that: A portion of the second pins is connected to the clip, and another portion of the second pins is connected to the second substrate.

4. The surface mount module according to claim 3, characterized in that: The second pin is connected to the clip in an integrally formed manner. The number of the clip is one, and the length of the clip increases as the number of the first chip and the second chip increases.

5. The surface mount module according to claim 1, characterized in that: The contact area between the clip and the first chip is smaller than the welding area of ​​the first chip, the contact area between the clip and the second chip is smaller than the welding area of ​​the second chip, and the thickness of the clip is greater than the thickness of the second pin.

6. The surface mount module according to claim 1, characterized in that: It also includes a plastic package, which covers part of the first pin, part of the second pin, part of the first substrate, part of the second substrate, the entire first chip, the entire second chip, and the entire clip, and exposes two surfaces of the first substrate and the second substrate that are far away from each other.

7. The surface mount module according to claim 6, characterized in that: When the first chip is fixed on the first substrate, a filler is arranged in the gap between the edge of the first chip and the first substrate, and the filler is made of the same material as the plastic package.

8. The surface mount module according to claim 6, characterized in that: The first pin and the second pin are both bent, and one end of the first pin protruding from the plastic package body and one end of the second pin protruding from the plastic package body are both flush with a side of the first substrate facing away from the first chip.

9. The surface mount module according to claim 1, characterized in that: The first substrate includes a first circuit board, a first insulating board and a first metal board in sequence along the direction from the second substrate to the first substrate; and / or, The second substrate includes a second circuit board, a second insulating board and a second metal board in sequence along the direction from the first substrate to the second substrate.

10. The surface mount module according to claim 1, characterized in that: The first chip is arranged on the first substrate by welding, sintering or pressing; and / or, The clip is connected to the first chip and the second chip respectively by welding, sintering or pressing.

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