Semiconductor packaging structure with electromagnetic shielding function

Abstract

The invention discloses a semiconductor packaging structure with an electromagnetic shielding function, and the structure comprises a substrate, the top of the substrate is provided with a copper layer, the exterior of the substrate is cooperatively provided with an electromagnetic shielding frame, the exterior of the electromagnetic shielding frame is detachably provided with a heat dissipation rack used for accelerating the internal heat dissipation, and the interior of the substrate is provided with a semiconductor chip. The top of the semiconductor chip is provided with conductive bumps at equal intervals, the semiconductor packaging structure adopts a multi-layer composite material semiconductor packaging structure, the innermost layer is the semiconductor chip and adopts high-thermal-conductivity metal to directly contact the back surface of the chip so as to help the chip to dissipate heat, and the second layer is the electromagnetic shielding layer with relatively thin thickness and is made of conductive metal; an effective electromagnetic shielding function is provided, the external layer is made of conductive plastic or ceramic, is connected with an external circuit and further shields electromagnetic interference, the metal layer is mainly used for shielding the electromagnetic interference, the ceramic layer is used for supporting the structure and providing a heat dissipation function, and the effect of semiconductor heat dissipation is achieved while electromagnetic shielding is carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging structure with electromagnetic shielding function. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins are used to connect the bonding pads (BondPad) of the chip to the corresponding leads (Lead) of the substrate to form the required circuit; then the independent chips are packaged and protected with plastic shells. After the plastic packaging, a series of operations are required. After the packaging is completed, the finished product is tested, usually after the incoming inspection, test and packaging processes, and finally put into storage for shipment.

[0003] At present, when semiconductor packaging is performed, a shielding cover is usually set up for electromagnetic shielding. The shielding effect is poor, which can easily cause external electromagnetics to affect the semiconductor device and easily cause electromagnetic radiation to leak out. The use of an electromagnetic shielding cover for shielding increases the volume of the semiconductor packaged. In addition, most of the existing semiconductor packages take the electromagnetic shielding function into consideration and add more shielding layers, which affects the heat dissipation of the semiconductor device. Excessive internal heat will shorten the service life of the semiconductor. For this reason, we propose a semiconductor packaging structure with electromagnetic shielding function. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor packaging structure with electromagnetic shielding function to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor packaging structure with electromagnetic shielding function, comprising a substrate, a copper layer is arranged on the top of the substrate, an electromagnetic shielding frame is arranged on the outside of the substrate, and a heat dissipation frame for accelerating internal heat dissipation is detachably installed on the outside of the electromagnetic shielding frame, a semiconductor chip is arranged in the substrate, and conductive bumps are arranged equidistantly on the top of the semiconductor chip, and the ends of the conductive bumps pass through the substrate, an electromagnetic shielding layer is arranged at the bottom of the semiconductor chip in the substrate, and a conductive ceramic layer for connecting to an external circuit is arranged at the bottom of the electromagnetic shielding layer, an adapter board is connected to the top of the substrate, and leads are arranged equidistantly at both ends of the top of the adapter board, and power connection bumps are arranged equidistantly at the bottom of the adapter board, and the power connection bumps are in contact with the conductive bumps.

[0006] Preferably, connecting grooves are equidistantly provided on the top of the copper layer, the conductive bumps are located inside the connecting grooves, mounting grooves are equidistantly provided on the top of the substrate, the conductive bumps are located inside the mounting grooves, an electromagnetic shielding sheet is provided in the mounting groove, a circular hole is provided on the top of the electromagnetic shielding sheet, the conductive bumps are located inside the circular hole of the electromagnetic shielding sheet, and micro-fins are equidistantly provided on the top of the electromagnetic shielding sheet and outside the conductive bumps.

[0007] Preferably, the four side walls of the heat sink are equidistantly provided with first heat dissipating fins, the bottom of the heat sink is provided with a vertical connecting port, and second heat dissipating fins are equidistantly provided in the connecting port, the bottom end of the electromagnetic shielding frame is clamped in the heat sink, screw holes are symmetrically provided at four ends of the bottom of the heat sink, the heat sink and the electromagnetic shielding frame are fixedly connected by screws, and one end of the second heat dissipating fin located inside the connecting port is in contact with the bottom of the substrate.

[0008] Preferably, the corresponding side walls of the electromagnetic shielding frame are symmetrically and integrally provided with fixing rods, and a slide plate is slidably provided inside the fixing rod, a sliding rod is fixedly connected to the top of the slide plate, and the top of the sliding rod slides through the fixing rod, a spring is sleeved on the outside of the sliding rod between the top of the inner wall of the fixing rod and the top of the slide plate, a pull plate is fixedly connected to the top of the two sliding rods on one side of the electromagnetic shielding frame, and a pull handle is provided on the top of the pull plate, the corresponding side walls of the adapter plate are symmetrically and integrally provided with convex plates, and a slot is provided at the end of the convex plate, the sliding rod is clamped in the slot, and the convex plate is located between the pull plate and the fixing rod.

[0009] Preferably, the top of the convex plate is located outside the card slot and is symmetrically provided with fixing holes, the bottom of the pull plate is located outside the slide rod and is symmetrically provided with fixing rods, and the fixing rods are clamped in the fixing holes.

[0010] Preferably, four corners of the bottom of the electromagnetic shielding frame are integrally provided with connecting protrusions, and the second heat dissipation fins are located above the connecting protrusions.

[0011] Preferably, the substrate includes a bottom plate, the top of the bottom plate is integrally provided with a fixing groove, the semiconductor chip, the electromagnetic shielding layer and the conductive ceramic layer are all arranged in the fixing groove, the top of the fixing groove is connected to an upper cover, the bottom of the upper cover is provided with a fixing frame, and the fixing frame is clamped to the outside of the fixing groove, the four inner walls of the fixing frame at the bottom of the upper cover are symmetrically and integrally provided with a clamping plate, the four side walls of the fixing groove are symmetrically provided with clamping grooves, and the card board is clamped in the clamping groove.

[0012] Preferably, fastening knobs are provided in the middle of the four side walls of the upper cover, threaded holes are provided in the middle of the four side walls of the fixing groove, and ends of the fastening knobs are threadedly connected in the threaded holes.

[0013] Preferably, the top and the bottom of the electromagnetic shielding frame are both provided with clamping plates, and the two clamping plates are respectively clamped with the top and the bottom of the substrate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The present invention adopts a semiconductor packaging structure of a multi-layer composite material. The innermost layer is a semiconductor chip. A high thermal conductivity metal is used to directly contact the back of the chip to help the chip dissipate heat. The second layer is a thinner electromagnetic shielding layer made of conductive metal to provide an effective electromagnetic shielding function. The outer layer is made of conductive plastic or ceramic, which is connected to the external circuit and further shields electromagnetic interference. The metal layer is mainly used to shield electromagnetic interference, and the ceramic layer is used to support the structure and provide heat dissipation function, thereby achieving the effect of heat dissipation of the semiconductor while performing electromagnetic shielding.

[0016] 2. The present invention embeds multiple electromagnetic shielding sheets in the substrate. These shielding sheets are made of metal-based materials and are placed at specific positions of the packaging substrate (such as input and output interfaces). The electromagnetic shielding sheets can effectively block the entry of external electromagnetic waves and prevent the electromagnetic waves generated by the chip from interfering with the external environment. The heat sink and the shielding sheet are integrated, and heat can be dissipated simultaneously through the thermal conductivity of the electromagnetic shielding sheet, avoiding the situation where traditional heat dissipation solutions occupy additional space.

[0017] 3. The heat sink that can be detachably installed on the outside of the electromagnetic shielding frame of the present invention is equipped with multiple heat sink fins, which can effectively increase the heat dissipation area. The design of the first heat sink fin and the second heat sink fin accelerates the conduction and dissipation of heat, which helps to improve the heat dissipation efficiency of the semiconductor chip.

[0018] 4. The detachable connection between the adapter plate and the base plate of the present invention, combined with the pull plate, fixed rod, sliding rod and other mechanisms, simplifies the installation and maintenance process, so that the adapter plate can be easily replaced or upgraded, and the flexibility and maintainability of the equipment are improved. The detachable connection between the electromagnetic shielding frame and the heat dissipation frame is fixed by screws, so that the entire packaging module can be easily disassembled when needed, which is convenient for maintenance and upgrading.

[0019] 5. The fixing groove on the board of the present invention, combined with the snap-fit ​​structure and the fastening knob design of the upper cover, can stably encapsulate the semiconductor chip and the electromagnetic shielding layer, ensuring the stability and sealing of the packaging structure in long-term use. The snap-fit ​​design between the card plate on the upper cover and the snap-fit ​​groove of the fixing groove makes the packaging more secure and easy to disassemble, reducing the complexity of production and maintenance.

[0020] 6. The introduction of the conductive ceramic layer of the present invention improves the stability of the electrical connection, while providing good thermal conductivity, enhancing the heat dissipation capacity and electrical performance of the entire system. The overall structural design is simple and convenient for large-scale production and assembly. At the same time, the interchangeability and disassembly between the modules greatly simplifies the product testing and maintenance process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of an expanded view of a substrate component of the present invention;

[0022] Figure 2 It is a schematic diagram of the structure of the expanded view of the present invention;

[0023] Figure 3 It is a schematic diagram of the overall exploded view structure of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of the electromagnetic shielding frame of the present invention;

[0025] Figure 5 This is a schematic structural diagram of the enlarged view of point A of the present invention;

[0026] Figure 6 It is a schematic structural diagram of the enlarged view of point B of the present invention;

[0027] Figure 7 It is a schematic structural diagram of the enlarged view of position C of the present invention;

[0028] Figure 8 It is a schematic diagram of the overall structure of the present invention;

[0029] Fig. 9 It is a schematic diagram of the heat dissipation frame connection structure of the present invention;

[0030] Fig.10 It is a schematic diagram of the overall structure of the present invention;

[0031] Fig.11 It is a schematic diagram of the structure of the adapter plate of the present invention;

[0032] Fig.12 It is a schematic diagram of the pull plate structure of the present invention;

[0033] Fig.13 It is a schematic diagram of the substrate connection structure of the present invention.

[0034] In the figure: 1, substrate; 2, copper layer; 3, semiconductor chip; 4, electromagnetic shielding layer; 5, conductive ceramic layer; 6, conductive bump; 7, mounting groove; 8, electromagnetic shielding sheet; 9, micro fin; 10, connecting groove; 11, electromagnetic shielding frame; 12, adapter plate; 13, lead; 14, heat sink; 15, first heat dissipation fin; 16, connecting port; 17, second heat dissipation fin; 18, power connection bump; 19, convex plate; 20, card slot; 21, fixing rod; 22, slide plate; 23, slide rod; 24, spring; 25, fixing card rod; 26, fixing hole; 27, pull plate; 28, pull handle; 29, clamping plate; 30, connecting bump; 31, bottom plate; 32, fixing groove; 33, clamping groove; 34, upper cover; 35, card plate; 36, tightening knob; 37, threaded hole. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figure 1 , Figure 2 , Figure 3 , Figure 8 and Fig.11 The present invention provides a technical solution: a semiconductor packaging structure with electromagnetic shielding function, including a substrate 1, a copper layer 2 is arranged on the top of the substrate 1, an electromagnetic shielding frame 11 is arranged on the outside of the substrate 1, and a heat dissipation frame 14 for accelerating internal heat dissipation is detachably installed on the outside of the electromagnetic shielding frame 11.

[0037] It should be noted that a carbon nanotube coating is arranged on the inner wall of the electromagnetic shielding frame 11, which can reduce electromagnetic interference and enhance signal stability and transmission quality. The heat sink 14 that can be detachably installed on the outside of the electromagnetic shielding frame 11 is equipped with multiple heat sinks, which can effectively increase the heat dissipation area. The design of the first heat sink fin 15 and the second heat sink fin 17 accelerates the conduction and dissipation of heat, which helps to improve the heat dissipation efficiency of the semiconductor chip 3.

[0038] A semiconductor chip 3 is arranged in the substrate 1, and conductive bumps 6 are equidistantly arranged on the top of the semiconductor chip 3, and the ends of the conductive bumps 6 pass through the substrate 1. An electromagnetic shielding layer 4 is arranged at the bottom of the semiconductor chip 3 in the substrate 1, and a conductive ceramic layer 5 for connecting to an external circuit is arranged at the bottom of the electromagnetic shielding layer 4. An adapter board 12 is connected to the top of the substrate 1, and leads 13 are equidistantly arranged at both ends of the top of the adapter board 12, and power connection bumps 18 are equidistantly arranged at the bottom of the adapter board 12, and the power connection bumps 18 are in contact with the conductive bumps 6.

[0039] It should be noted that the lead 13 in the package adopts an advanced integrated design, which can not only provide electrical connection, but also can be effectively combined with the shielding layer to further enhance the electromagnetic interference suppression effect. The copper layer 2 on the top of the substrate 1 and the electromagnetic shielding frame 11 arranged on the periphery effectively shield external electromagnetic interference, while preventing the leakage of electromagnetic radiation generated by the semiconductor chip 3. The copper layer 2 and the electromagnetic shielding frame 11 work together to significantly improve the overall electromagnetic compatibility performance. The detachable connection between the adapter board 12 and the substrate 1 simplifies the installation and maintenance process, so that the adapter board 12 can be easily replaced or upgraded, thereby improving the flexibility and maintainability of the equipment.

[0040] See also Figure 5 The top of the copper layer 2 is provided with connecting grooves 10 at equal intervals, and the conductive bumps 6 are located inside the connecting grooves 10. The top of the substrate 1 is provided with mounting grooves 7 at equal intervals, and the conductive bumps 6 are located inside the mounting grooves 7. An electromagnetic shielding sheet 8 is arranged in the mounting groove 7, and a circular hole is provided on the top of the electromagnetic shielding sheet 8, and the conductive bumps 6 are located in the circular hole of the electromagnetic shielding sheet 8. Micro-fins 9 are arranged on the outside of the conductive bumps 6 at equal intervals on the top of the electromagnetic shielding sheet 8.

[0041] It should be noted that the micro-fins 9 in the mounting groove 7 at the top of the substrate 1 help to improve the heat exchange efficiency, further optimize the heat dissipation effect of the semiconductor device, and ensure the temperature control stability of the semiconductor chip 3 during high-power operation. After the adapter board 12 is connected to the substrate 1, the power connection bumps 18 at the bottom of the adapter board 12 are in contact with the conductive bumps 6 on the substrate 1, and the multiple micro-fins 9 on the electromagnetic shielding sheet 8 can accelerate the heat dissipation of the semiconductor chip 3, ensuring the temperature control stability of the semiconductor chip 3 during high-power operation.

[0042] See also Fig. 9 and Fig.10The four side walls of the heat sink 14 are equidistantly provided with first heat dissipation fins 15, the bottom of the heat sink 14 is provided with a vertical communication port 16, and the communication port 16 is equidistantly provided with second heat dissipation fins 17, the bottom end of the electromagnetic shielding frame 11 is clamped in the heat sink 14, the four ends of the bottom of the heat sink 14 are symmetrically provided with screw holes, the heat sink 14 and the electromagnetic shielding frame 11 are fixedly connected by screws, and one end of the second heat dissipation fin 17 located inside the communication port 16 contacts the bottom of the substrate 1.

[0043] It should be noted that the electromagnetic shielding frame 11 is detachably connected to the heat sink 14 on the outside. When installing the heat sink 14, the bottom end of the electromagnetic shielding frame 11 is directly inserted into the heat sink 14 and fixed with screws after connection. The first heat dissipation fins 15 on the four side walls of the heat sink 14 can dissipate heat, and the multiple second heat dissipation fins 17 in the connecting port 16 at the bottom of the heat sink 14 are in contact with the bottom of the substrate 1 to accelerate the heat dissipation of the semiconductor device. The disassembly connection method between the electromagnetic shielding frame 11 and the heat sink 14 is fixed with screws, so that the entire packaging module can be easily disassembled when needed, which is convenient for maintenance and upgrading.

[0044] See also Figure 1 , Figure 6 , Figure 7 and Fig.12 The corresponding side walls of the electromagnetic shielding frame 11 are symmetrically and integrally provided with fixed rods 21, and a slide plate 22 is slidably provided in the fixed rod 21, a slide bar 23 is fixedly connected to the top of the slide plate 22, and the top of the slide bar 23 slides through the fixed rod 21, and a spring 24 is sleeved between the top of the inner wall of the fixed rod 21 and the top of the slide plate 22 on the outside of the slide bar 23, a pull plate 27 is fixedly connected to the top of the two slide bars 23 on one side of the electromagnetic shielding frame 11, and a pull handle 28 is provided on the top of the pull plate 27, the corresponding side walls of the adapter plate 12 are symmetrically and integrally provided with convex plates 19, and a slot 20 is opened at the end of the convex plate 19, the slide bar 23 is clamped in the slot 20, and the convex plate 19 is located between the pull plate 27 and the fixed rod 21.

[0045] It should be noted that, when the present invention performs semiconductor packaging, the conductive ceramic layer 5 is packaged at the bottom of the inner wall of the fixed groove 32, the electromagnetic shielding layer 4 is arranged on the top of the conductive ceramic layer 5, the semiconductor chip 3 is packaged on the top of the electromagnetic shielding layer 4, and the upper cover 34 is connected to the fixed groove 32. When connecting, the card plate 35 on the upper cover 34 is matched to be clamped into the inside of the clamping groove 33 on the fixed groove 32, and then the tightening knob 36 is tightened. After the packaging is completed, the substrate 1 is formed, the conductive bump 6 on the semiconductor chip 3 is located outside the substrate 1, and a plurality of mounting grooves 7 are opened on the top of the substrate 1. The conductive bump 6 is located in the mounting groove 7. An electromagnetic shielding sheet 8 is arranged in the mounting groove 7. A circular hole is opened in the center of the electromagnetic shielding sheet 8. The conductive bump 6 is located in the circular hole of the electromagnetic shielding sheet 8. The plurality of micro fins 9 on the electromagnetic shielding sheet 8 can increase the heat exchange area, which is convenient for the heat dissipation of the semiconductor. The arrangement of the copper layer 2 and the electromagnetic shielding frame 11 can further shield the electromagnetic. The adapter plate 12 is detachably connected to the substrate 1. When the adapter plate 12 is connected to the substrate 1, slide up the pull plates 27 on both sides of the substrate 1, and then place the convex plates 19 at both ends of the adapter plate 12 between the fixing rod 21 and the pull plate 27, so that the sliding rod 23 is clamped into the clamping groove 20, and then release the pull plate 27, and the fixing clamping rod 25 at the bottom of the pull plate 27 is clamped into the fixing hole 26, so that the adapter plate 12 is firmly connected to the substrate 1. After the adapter plate 12 is connected to the substrate 1, the power connection protrusion 18 at the bottom of the adapter plate 12 contacts the conductive protrusion 6 on the substrate 1, and the electromagnetic shielding frame 11 is detachably connected to the heat sink 14 outside. When installing the heat sink 14, the bottom end of the electromagnetic shielding frame 11 is directly clamped into the heat sink 14, and is reinforced and fixed by screws after connection. The first heat dissipation fins 15 on the four side walls of the heat sink 14 can achieve the effect of heat dissipation, and the multiple second heat dissipation fins 17 in the connecting port 16 at the bottom of the heat sink 14 contact the bottom of the substrate 1, thereby accelerating the heat dissipation of the semiconductor device.

[0046] See also Figure 6 and Figure 7 The top of the convex plate 19 is located outside the card slot 20 and symmetrically provided with fixing holes 26 , and the bottom of the pull plate 27 is located outside the slide rod 23 and symmetrically provided with fixing rods 25 , and the fixing rods 25 are clamped inside the fixing holes 26 .

[0047] It should be noted that after the adapter plate 12 is connected to the substrate 1, the protruding plates 19 at both ends of the adapter plate 12 are located between the fixing rod 21 and the pull plate 27, and the pull plate 27 is only pressed on the top of the protruding plates 19, while the fixing clamping rod 25 on the pull plate 27 is clamped in the fixing hole 26 on the fixing rod 21, so that the adapter plate 12 is firmly connected to the top of the substrate 1, thereby ensuring the stability of the connection between the power connection bump 18 at the bottom of the adapter plate 12 and the conductive bump 6 on the substrate 1, thereby achieving a better connection effect.

[0048] See also Fig. 9The four corners of the bottom of the electromagnetic shielding frame 11 are integrally provided with connecting protrusions 30 , and the second heat dissipation fins 17 are located above the connecting protrusions 30 .

[0049] It should be noted that the connecting protrusions 30 arranged at the four corners of the bottom of the electromagnetic shielding frame 11 can suspend the bottom of the substrate 1, so that the second heat dissipation fins 17 at the bottom of the substrate 1 are located above the supporting surface, thereby facilitating heat dissipation from the gaps between the connecting protrusions 30 and improving the heat dissipation effect.

[0050] See also Fig.13 The substrate 1 includes a bottom plate 31, a fixing groove 32 is integrally provided on the top of the bottom plate 31, the semiconductor chip 3, the electromagnetic shielding layer 4 and the conductive ceramic layer 5 are all arranged in the fixing groove 32, the top of the fixing groove 32 is connected with an upper cover 34, a fixing frame is provided at the bottom of the upper cover 34, and the fixing frame is clamped on the outside of the fixing groove 32, the four inner walls of the fixing frame at the bottom of the upper cover 34 are symmetrically and integrally provided with a clamping plate 35, the four side walls of the fixing groove 32 are symmetrically provided with clamping grooves 33, and the clamping plate 35 is clamped in the clamping groove 33.

[0051] It should be noted that the conductive ceramic layer 5 is encapsulated at the bottom of the inner wall of the fixed groove 32, the electromagnetic shielding layer 4 is arranged on the top of the conductive ceramic layer 5, the semiconductor chip 3 is encapsulated on the top of the electromagnetic shielding layer 4, and the upper cover 34 is connected to the fixed groove 32. When connecting, the clamping plate 35 on the upper cover 34 is engaged with the clamping groove 33 on the fixed groove 32, and then the tightening knob 36 is tightened. After the packaging is completed, the substrate 1 is formed. The clamping design between the clamping plate 35 on the upper cover 34 and the clamping groove 33 of the fixed groove 32 makes the packaging more secure and easy to disassemble, reducing the complexity of production and maintenance.

[0052] See also Fig.13 A fastening knob 36 is provided in the middle of the four side walls of the upper cover 34 , a threaded hole 37 is opened in the middle of the four side walls of the fixing groove 32 , and the end of the fastening knob 36 is threadedly connected in the threaded hole 37 .

[0053] It should be noted that the provision of the tightening knob 36 strengthens the connection between the upper cover 34 and the clamping plate 35 .

[0054] See also Figure 4 The top and bottom of the electromagnetic shielding frame 11 are both provided with clamping plates 29 , and the two clamping plates 29 are respectively clamped with the top and bottom of the substrate 1 .

[0055] It should be noted that the setting of the clamping plate 29 enables the clamping plate 29 to wrap the top four ends of the copper layer 2 on the top of the substrate 1 after the electromagnetic shielding frame 11 is connected to the substrate 1, so that the copper layer 2 and the electromagnetic shielding frame 11 can completely wrap the substrate 1, preventing electromagnetic radiation from leaking and achieving a better electromagnetic shielding effect.

[0056] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0057] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0058] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging structure with electromagnetic shielding function, characterized in that: The invention comprises a substrate (1), a copper layer (2) is arranged on the top of the substrate (1), an electromagnetic shielding frame (11) is arranged on the outside of the substrate (1), and a heat dissipation frame (14) for accelerating internal heat dissipation is detachably installed on the outside of the electromagnetic shielding frame (11), a semiconductor chip (3) is arranged inside the substrate (1), and conductive bumps (6) are arranged equidistantly on the top of the semiconductor chip (3), and the ends of the conductive bumps (6) pass through the substrate (1), an electromagnetic shielding layer (4) is arranged at the bottom of the semiconductor chip (3) in the substrate (1), and a conductive ceramic layer (5) for connecting to an external circuit is arranged at the bottom of the electromagnetic shielding layer (4), an adapter board (12) is connected to the top of the substrate (1), and leads (13) are arranged equidistantly at both ends of the top of the adapter board (12), and power connection bumps (18) are arranged equidistantly on the bottom of the adapter board (12), and the power connection bumps (18) are in contact with the conductive bumps (6).

2. A semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The copper layer (2) has connecting grooves (10) equidistantly formed on the top, the conductive protrusions (6) are located inside the connecting grooves (10), the substrate (1) has mounting grooves (7) equidistantly formed on the top, the conductive protrusions (6) are located inside the mounting grooves (7), an electromagnetic shielding sheet (8) is arranged inside the mounting groove (7), a circular hole is formed on the top of the electromagnetic shielding sheet (8), the conductive protrusions (6) are located inside the circular hole of the electromagnetic shielding sheet (8), and micro-fins (9) are equidistantly formed on the top of the electromagnetic shielding sheet (8) and outside the conductive protrusions (6).

3. The semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The four side walls of the heat sink (14) are equidistantly provided with first heat dissipation fins (15); the bottom of the heat sink (14) is provided with a vertical connecting opening (16), and second heat dissipation fins (17) are equidistantly provided in the connecting opening (16); the bottom end of the electromagnetic shielding frame (11) is snap-fitted into the heat sink (14); screw holes are symmetrically provided at the four ends of the bottom of the heat sink (14); the heat sink (14) and the electromagnetic shielding frame (11) are fixedly connected by screws; one end of the second heat dissipation fin (17) located inside the connecting opening (16) contacts the bottom of the substrate (1).

4. The semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The corresponding two side walls of the electromagnetic shielding frame (11) are symmetrically and integrally provided with a fixing rod (21), and a slide plate (22) is slidably provided inside the fixing rod (21), a sliding rod (23) is fixedly connected to the top of the slide plate (22), and the top of the sliding rod (23) slides through the fixing rod (21), a spring (24) is sleeved on the outer side of the sliding rod (23) between the top of the inner wall of the fixing rod (21) and the top of the slide plate (22), a pull plate (27) is fixedly connected to the top of the two sliding rods (23) on one side of the electromagnetic shielding frame (11), and a pull handle (28) is provided on the top of the pull plate (27), and a convex plate (19) is symmetrically and integrally provided on the corresponding two side walls of the adapter plate (12), and a slot (20) is provided at the end of the convex plate (19), the sliding rod (23) is clamped in the slot (20), and the convex plate (19) is located between the pull plate (27) and the fixing rod (21).

5. The semiconductor packaging structure with electromagnetic shielding function according to claim 4, characterized in that: The top of the convex plate (19) is located outside the card slot (20) and is symmetrically provided with a fixing hole (26); the bottom of the pull plate (27) is located outside the slide bar (23) and is symmetrically provided with a fixing clamping rod (25), and the fixing clamping rod (25) is clamped inside the fixing hole (26).

6. The semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The four corners of the bottom of the electromagnetic shielding frame (11) are integrally provided with connecting protrusions (30), and the second heat dissipation fins (17) are located above the connecting protrusions (30).

7. The semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The substrate (1) comprises a bottom plate (31), the top of the bottom plate (31) is integrally provided with a fixing groove (32), the semiconductor chip (3), the electromagnetic shielding layer (4) and the conductive ceramic layer (5) are all arranged in the fixing groove (32), the top of the fixing groove (32) is connected with an upper cover (34), the bottom of the upper cover (34) is provided with a fixing frame, and the fixing frame is clamped on the outside of the fixing groove (32), the four inner walls of the fixing frame at the bottom of the upper cover (34) are symmetrically integrally provided with a clamping plate (35), the four side walls of the fixing groove (32) are symmetrically provided with clamping grooves (33), and the clamping plate (35) is clamped in the clamping groove (33).

8. The semiconductor packaging structure with electromagnetic shielding function according to claim 7, characterized in that: The middle parts of the four side walls of the upper cover (34) are each provided with a fastening knob (36), the middle parts of the four side walls of the fixing groove (32) are each provided with a threaded hole (37), and the end of the fastening knob (36) is threadedly connected in the threaded hole (37).

9. The semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The top and bottom of the electromagnetic shielding frame (11) are both provided with clamping plates (29), and the two clamping plates (29) are respectively clamped to the top and bottom of the substrate (1).

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