A semiconductor packaging structure with electromagnetic shielding function

Abstract

This invention discloses a semiconductor packaging structure with electromagnetic shielding function, including a substrate, a copper layer on the top of the substrate, an electromagnetic shielding frame on the outside of the substrate, and a heat sink for accelerating internal heat dissipation that can be detachably installed on the outside of the electromagnetic shielding frame. A semiconductor chip is disposed inside the substrate, and conductive bumps are equidistantly arranged on the top of the semiconductor chip. This semiconductor packaging structure adopts a multi-layer composite material semiconductor packaging structure. The innermost layer is the semiconductor chip, which uses a high thermal conductivity metal to directly contact the back of the chip to help dissipate heat. The second layer is a thin electromagnetic shielding layer made of conductive metal, which provides effective electromagnetic shielding function. The outer layers are made of conductive plastic or ceramic, which are connected to the external circuit and further shield electromagnetic interference. The metal layer is mainly used to shield electromagnetic interference, and the ceramic layer is used to support the structure and provide heat dissipation function, so as to achieve the effect of heat dissipation of semiconductor while performing electromagnetic shielding.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a semiconductor packaging structure with electromagnetic shielding function. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: Wafers from the front-end wafer fabrication process are diced into small dies. The diced dies are then glued onto islands on the corresponding substrate (lead frame). Ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resin are used to connect the bonding pads of the dies to the corresponding leads on the substrate, forming the required circuit. The individual dies are then encapsulated and protected with a plastic shell. After encapsulation, a series of operations are performed. After packaging, finished product testing is conducted, typically involving incoming inspection, testing, and packaging, before finally being stored and shipped.

[0003] Currently, in semiconductor packaging, a shielding cover is typically used for electromagnetic shielding. However, the shielding effect is poor, making it easy for external electromagnetic fields to affect the semiconductor device and causing electromagnetic radiation leakage. Using an electromagnetic shielding cover increases the size of the packaged semiconductor. Furthermore, most existing semiconductor packages consider electromagnetic shielding functions, adding more shielding layers, which affects the heat dissipation of the semiconductor device. Excessive internal heat can shorten the lifespan of the semiconductor. Therefore, we propose a semiconductor packaging structure with electromagnetic shielding function. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor packaging structure with electromagnetic shielding function to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging structure with electromagnetic shielding function, comprising a substrate, a copper layer disposed on the top of the substrate, an electromagnetic shielding frame disposed on the outside of the substrate, and a heat sink for accelerating internal heat dissipation detachably mounted on the outside of the electromagnetic shielding frame, a semiconductor chip disposed inside the substrate, and conductive bumps disposed at equal intervals on the top of the semiconductor chip, the ends of the conductive bumps passing through the substrate, an electromagnetic shielding layer disposed inside the substrate at the bottom of the semiconductor chip, and a conductive ceramic layer for connecting to an external circuit disposed at the bottom of the electromagnetic shielding layer, an adapter plate connected to the top of the substrate, and leads disposed at equal intervals at both ends of the top of the adapter plate, and electrical contact bumps disposed at equal intervals at the bottom of the adapter plate, with the electrical contact bumps contacting the conductive bumps.

[0006] Preferably, the top of the copper layer has equidistant connecting grooves, the conductive bumps are located inside the connecting grooves, the top of the substrate has equidistant mounting grooves, the conductive bumps are located inside the mounting grooves, an electromagnetic shielding sheet is disposed in the mounting grooves, and the top of the electromagnetic shielding sheet has a circular hole, the conductive bumps are located inside the circular hole of the electromagnetic shielding sheet, and micro fins are equidistantly disposed on the top of the electromagnetic shielding sheet outside the conductive bumps.

[0007] Preferably, the heat sink has first heat dissipation fins evenly spaced on all four side walls, a vertically oriented communication opening at the bottom of the heat sink, and second heat dissipation fins evenly spaced within the communication opening. The bottom end of the electromagnetic shielding frame is snapped into the heat sink, and screw holes are symmetrically opened at all four ends of the bottom of the heat sink. The heat sink and the electromagnetic shielding frame are fixed together by screws, and one end of the second heat dissipation fin located inside the communication opening contacts the bottom of the substrate.

[0008] Preferably, each of the corresponding two side walls of the electromagnetic shielding frame is symmetrically and integrally provided with a fixing rod, and a sliding plate is slidably provided inside the fixing rod. A sliding rod is fixedly connected to the top of the sliding plate, and the top of the sliding rod slides through the fixing rod. A spring is sleeved on the outer side of the sliding rod between the top of the inner wall of the fixing rod and the top of the sliding plate. Pull plates are fixedly connected to the top of the two sliding rods on one side of the electromagnetic shielding frame, and a pull handle is provided on the top of the pull plates. Each of the corresponding two side walls of the adapter plate is symmetrically and integrally provided with a protruding plate, and a slot is opened at the end of the protruding plate. The sliding rod is engaged in the slot, and the protruding plate is located between the pull plate and the fixing rod.

[0009] Preferably, the top of the convex plate is symmetrically provided with fixing holes outside the slot, and the bottom of the pull plate is symmetrically provided with fixing rods outside the slide rod, and the fixing rods are engaged inside the fixing holes.

[0010] Preferably, the electromagnetic shielding frame has a connecting protrusion integrally provided at each of the four bottom corners, and the second heat dissipation fin is located above the connecting protrusion.

[0011] Preferably, the substrate includes a base plate, the top of which is integrally provided with a fixing groove. The semiconductor chip, electromagnetic shielding layer, and conductive ceramic layer are all disposed in the fixing groove. The top of the fixing groove is connected to a top cover. The bottom of the top cover is provided with a fixing frame, which is snapped into the outside of the fixing groove. The four inner walls of the fixing frame at the bottom of the top cover are symmetrically provided with locking plates. The four side walls of the fixing groove are symmetrically provided with snap-fit ​​grooves, and the locking plates are snapped into the snap-fit ​​grooves.

[0012] Preferably, a fastening knob is provided in the middle of each of the four side walls of the top cover, and a threaded hole is provided in the middle of each of the four side walls of the fixing groove, with the end of the fastening knob threaded into the threaded hole.

[0013] Preferably, the electromagnetic shielding frame is provided with locking plates at both the top and bottom, and the two locking plates respectively lock the top and bottom of the substrate.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. This invention employs a multi-layer composite semiconductor packaging structure. The innermost layer is a semiconductor chip, which is directly in contact with the back of the chip using a high thermal conductivity metal to help dissipate heat. The second layer is a thin electromagnetic shielding layer made of conductive metal, providing effective electromagnetic shielding. The outer layers are made of conductive plastic or ceramic, which are connected to external circuits and further shield electromagnetic interference. The metal layer is mainly used to shield electromagnetic interference, while the ceramic layer is used to support the structure and provide heat dissipation. This achieves the effect of heat dissipation for the semiconductor while providing electromagnetic shielding.

[0016] 2. This invention embeds multiple electromagnetic shielding sheets into the substrate. These shielding sheets are made of metal-based materials and placed at specific locations on the packaging substrate (such as input / output interfaces). The electromagnetic shielding sheets can effectively block the entry of external electromagnetic waves and prevent electromagnetic waves generated by the chip from interfering with the external environment. The heat sink and shielding sheets are integrated, and heat dissipation can be achieved through the thermal conductivity of the electromagnetic shielding sheets, avoiding the need for additional space in traditional heat dissipation solutions.

[0017] 3. The electromagnetic shielding frame of the present invention has a detachable heat sink frame with multiple heat sink fins, which can effectively increase the heat dissipation area. The design of the first and second heat sink fins accelerates the conduction and dissipation of heat, which helps to improve the heat dissipation efficiency of semiconductor chips.

[0018] 4. The detachable connection between the adapter plate and the base plate of this invention, combined with mechanisms such as pull plates, fixing rods, and sliding rods, simplifies the installation and maintenance process, making it easy to replace or upgrade the adapter plate, thus improving the flexibility and maintainability of the equipment. The detachable connection between the electromagnetic shielding frame and the heat sink is fixed with screws, allowing the entire encapsulation module to be easily disassembled when needed, facilitating maintenance and upgrades.

[0019] 5. The fixing groove on the plate of this invention, combined with the snap-fit ​​structure of the top cover and the fastening knob design, can stably encapsulate the semiconductor chip and the electromagnetic shielding layer, ensuring the stability and sealing of the encapsulation structure during long-term use. The snap-fit ​​design between the snap plate on the top cover and the snap-fit ​​groove of the fixing groove makes the encapsulation more secure and easier to disassemble, reducing the complexity of production and maintenance.

[0020] 6. The introduction of the conductive ceramic layer in this invention improves the stability of electrical connections and provides good thermal conductivity, enhancing the heat dissipation capacity and electrical performance of the entire system. The overall structural design is simple and easy to mass-produce and assemble. At the same time, the interchangeability and disassembly between the modules greatly simplify the product testing and maintenance process. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the unfolded structure of the substrate component of the present invention;

[0022] Figure 2 This is a schematic diagram of the unfolded structure of the present invention;

[0023] Figure 3 This is an exploded view of the overall structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the electromagnetic shielding frame structure of the present invention;

[0025] Figure 5 This is an enlarged structural schematic diagram of point A in the present invention;

[0026] Figure 6 This is an enlarged structural schematic diagram of section B of the present invention;

[0027] Figure 7 This is an enlarged structural schematic diagram of point C in the present invention;

[0028] Figure 8 This is a schematic diagram of the overall structure of the present invention;

[0029] Figure 9 This is a schematic diagram of the heat sink connection structure of the present invention;

[0030] Figure 10 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 11 This is a schematic diagram of the adapter plate structure of the present invention;

[0032] Figure 12 This is a schematic diagram of the pull plate structure of the present invention;

[0033] Figure 13 This is a schematic diagram of the substrate connection structure of the present invention.

[0034] In the diagram: 1. Substrate; 2. Copper layer; 3. Semiconductor chip; 4. Electromagnetic shielding layer; 5. Conductive ceramic layer; 6. Conductive bump; 7. Mounting groove; 8. Electromagnetic shielding sheet; 9. Micro fin; 10. Connecting groove; 11. Electromagnetic shielding frame; 12. Adapter plate; 13. Lead wire; 14. Heat sink; 15. First heat sink fin; 16. Connecting port; 17. Second heat sink fin; 18. Power connection bump; 19. Protruding plate; 20. Slot; 21. Fixing rod; 22. Slide plate; 23. Slide rod; 24. Spring; 25. Fixing lever; 26. Fixing hole; 27. Pull plate; 28. Pull handle; 29. ​​Clamping plate; 30. Connecting bump; 31. Base plate; 32. Fixing groove; 33. Clamping groove; 34. Top cover; 35. Clamping plate; 36. Fastening knob; 37. Threaded hole. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figure 1 , Figure 2 , Figure 3 , Figure 8 and Figure 11 The present invention provides a technical solution: a semiconductor packaging structure with electromagnetic shielding function, including a substrate 1, a copper layer 2 disposed on the top of the substrate 1, an electromagnetic shielding frame 11 disposed on the outside of the substrate 1, and a heat sink 14 for accelerating internal heat dissipation detachably installed on the outside of the electromagnetic shielding frame 11.

[0037] It should be noted that a carbon nanotube coating is arranged on the inner wall of the electromagnetic shielding frame 11, which can reduce electromagnetic interference and enhance signal stability and transmission quality. The heat sink 14 that can be detachably installed on the outside of the electromagnetic shielding frame 11 is equipped with multiple heat sink fins, which can effectively increase the heat dissipation area. The design of the first heat sink fin 15 and the second heat sink fin 17 accelerates the conduction and dissipation of heat, which helps to improve the heat dissipation efficiency of the semiconductor chip 3.

[0038] A semiconductor chip 3 is disposed inside the substrate 1, and conductive bumps 6 are disposed at equal intervals on the top of the semiconductor chip 3. The ends of the conductive bumps 6 pass through the substrate 1. An electromagnetic shielding layer 4 is disposed inside the substrate 1 at the bottom of the semiconductor chip 3, and a conductive ceramic layer 5 for connecting to an external circuit is disposed at the bottom of the electromagnetic shielding layer 4. An adapter plate 12 is connected to the top of the substrate 1, and leads 13 are disposed at equal intervals at both ends of the top of the adapter plate 12. Electrical contact bumps 18 are disposed at equal intervals at the bottom of the adapter plate 12, and the electrical contact bumps 18 are in contact with the conductive bumps 6.

[0039] It should be noted that the lead 13 in the package adopts an advanced integrated design, which can provide electrical connection and effectively combine with the shielding layer to further improve the electromagnetic interference suppression effect. The copper layer 2 on the top of the substrate 1 and the electromagnetic shielding frame 11 on the periphery effectively shield external electromagnetic interference and prevent electromagnetic radiation leakage generated by the semiconductor chip 3. The copper layer 2 and the electromagnetic shielding frame 11 work together to significantly improve the overall electromagnetic compatibility performance. The detachable connection between the adapter board 12 and the substrate 1 simplifies the installation and maintenance process, making it easy to replace or upgrade the adapter board 12, thus improving the flexibility and maintainability of the equipment.

[0040] Please see Figure 5 The top of the copper layer 2 is provided with equidistant connecting grooves 10, and the conductive bumps 6 are located inside the connecting grooves 10. The top of the substrate 1 is provided with equidistant mounting grooves 7, and the conductive bumps 6 are located inside the mounting grooves 7. An electromagnetic shielding sheet 8 is provided inside the mounting grooves 7, and a round hole is provided on the top of the electromagnetic shielding sheet 8. The conductive bumps 6 are located inside the round hole of the electromagnetic shielding sheet 8. Micro fins 9 are provided equidistantly on the top of the electromagnetic shielding sheet 8 outside the conductive bumps 6.

[0041] It should be noted that the micro fins 9 in the mounting groove 7 at the top of the substrate 1 help to improve heat exchange efficiency, further optimize the heat dissipation effect of the semiconductor device, and ensure the temperature control stability of the semiconductor chip 3 when operating at high power. After the adapter plate 12 is connected to the substrate 1, the power-connecting bump 18 at the bottom of the adapter plate 12 contacts the conductive bump 6 on the substrate 1, and the multiple micro fins 9 on the electromagnetic shielding sheet 8 can accelerate the heat dissipation of the semiconductor chip 3, ensuring the temperature control stability of the semiconductor chip 3 when operating at high power.

[0042] Please see Figure 9 and Figure 10The heat sink 14 has first heat sink fins 15 evenly spaced on its four side walls. The bottom of the heat sink 14 has a vertically oriented connecting port 16, and second heat sink fins 17 are evenly spaced inside the connecting port 16. The bottom end of the electromagnetic shielding frame 11 is snapped into the heat sink 14. Screw holes are symmetrically opened at the four ends of the bottom of the heat sink 14. The heat sink 14 and the electromagnetic shielding frame 11 are fixed together by screws. The end of the second heat sink fin 17 located inside the connecting port 16 is in contact with the bottom of the substrate 1.

[0043] It should be noted that the electromagnetic shielding frame 11 is detachably connected to the heat sink 14. When installing the heat sink 14, the bottom end of the electromagnetic shielding frame 11 is directly snapped into the heat sink 14. After connection, it is reinforced and fixed with screws. The first heat dissipation fins 15 on the four side walls of the heat sink 14 can achieve the effect of heat dissipation, and the multiple second heat dissipation fins 17 in the connecting port 16 at the bottom of the heat sink 14 are in contact with the bottom of the substrate 1, which accelerates the heat dissipation of semiconductor devices. The detachable connection between the electromagnetic shielding frame 11 and the heat sink 14 is fixed with screws, so that the entire packaging module can be easily disassembled when needed, which is convenient for maintenance and upgrades.

[0044] Please see Figure 1 , Figure 6 , Figure 7 and Figure 12 The electromagnetic shielding frame 11 has a fixed rod 21 symmetrically and integrally provided on both sides of the corresponding side walls. A sliding plate 22 is slidably provided inside the fixed rod 21. A sliding rod 23 is fixedly connected to the top of the sliding plate 22. The top of the sliding rod 23 slides through the fixed rod 21. A spring 24 is sleeved between the top of the inner wall of the fixed rod 21 and the top of the sliding plate 22 on the outer side of the sliding rod 23. A pull plate 27 is fixedly connected to the top of the two sliding rods 23 on one side of the electromagnetic shielding frame 11. A pull handle 28 is provided on the top of the pull plate 27. The adapter plate 12 has a convex plate 19 symmetrically and integrally provided on both sides of the corresponding side walls. A slot 20 is opened at the end of the convex plate 19. The sliding rod 23 is engaged in the slot 20. The convex plate 19 is located between the pull plate 27 and the fixed rod 21.

[0045] It should be noted that, in the semiconductor packaging process of this invention, the conductive ceramic layer 5 is encapsulated at the bottom of the inner wall of the fixing groove 32, the electromagnetic shielding layer 4 is placed on top of the conductive ceramic layer 5, the semiconductor chip 3 is encapsulated on top of the electromagnetic shielding layer 4, and the upper cover 34 is connected to the fixing groove 32. During connection, the locking plate 35 on the upper cover 34 is engaged and locked into the locking groove 33 on the fixing groove 32. Then, the fastening knob 36 is tightened. After packaging, a substrate 1 is formed. The conductive bumps 6 on the semiconductor chip 3 are located on the outside of the substrate 1. Multiple mounting grooves 7 are opened on the top of the substrate 1, and the conductive bumps 6 are located in the mounting grooves 7. An electromagnetic shielding sheet 8 is provided in the mounting grooves 7. A circular hole is opened in the center of the electromagnetic shielding sheet 8, and the conductive bumps 6 are located in the circular hole of the electromagnetic shielding sheet 8. Multiple micro fins 9 on the electromagnetic shielding sheet 8 can increase the heat exchange area and facilitate the heat dissipation of the semiconductor. The copper layer 2 and the electromagnetic shielding frame 11 can further shield the electromagnetic field. The adapter plate 12 is detachably connected to the substrate 1. When the adapter plate 12 is connected to the substrate 1, the pull plates 27 on both sides of the substrate 1 are slid up, and then the protrusions 19 at both ends of the adapter plate 12 are placed between the fixing rod 21 and the pull plate 27, so that the sliding rod 23 is locked into the slot 20. Then the pull plate 27 is released, and the fixing rod 25 at the bottom of the pull plate 27 is locked into the fixing hole 26, so that the adapter plate 12 is firmly connected to the substrate 1. After the adapter plate 12 is connected to the substrate 1, the electrical contact protrusion 18 at the bottom of the adapter plate 12 contacts the conductive protrusion 6 on the substrate 1. It is detachably connected to the heat sink 14 outside the electromagnetic shielding frame 11. When installing the heat sink 14, the bottom end of the electromagnetic shielding frame 11 is directly locked into the heat sink 14. After connection, it is reinforced and fixed by screws. The first heat sink fins 15 on the four side walls of the heat sink 14 can play a heat dissipation role, and the multiple second heat sink fins 17 in the communication port 16 at the bottom of the heat sink 14 contact the bottom of the substrate 1, which accelerates the heat dissipation of the semiconductor device.

[0046] Please see Figure 6 and Figure 7 The top of the convex plate 19 is symmetrically provided with fixing holes 26 outside the slot 20, and the bottom of the pull plate 27 is symmetrically provided with fixing rods 25 outside the slide rod 23, and the fixing rods 25 are engaged inside the fixing holes 26.

[0047] It should be noted that after the adapter plate 12 is connected to the substrate 1, the protrusions 19 at both ends of the adapter plate 12 are located between the fixing rod 21 and the pull plate 27. The pull plate 27 only presses on the top of the protrusions 19, and the fixing clip 25 on the pull plate 27 is engaged with the fixing hole 26 on the fixing rod 21, so that the adapter plate 12 is stably connected to the top of the substrate 1, thereby ensuring the stability of the connection between the power-connecting protrusion 18 at the bottom of the adapter plate 12 and the conductive protrusion 6 on the substrate 1, and achieving a better connection effect.

[0048] Please see Figure 9The electromagnetic shielding frame 11 has a connecting protrusion 30 integrally provided at each of the four bottom corners, and the second heat dissipation fin 17 is located above the connecting protrusion 30.

[0049] It should be noted that the connecting protrusions 30 at the four corners of the bottom of the electromagnetic shielding frame 11 can suspend the bottom of the substrate 1, so that the second heat dissipation fins 17 at the bottom of the substrate 1 are located above the support surface, thereby facilitating the dissipation of heat from the gaps between the connecting protrusions 30 and improving the heat dissipation effect.

[0050] Please see Figure 13 The substrate 1 includes a base plate 31. A fixing groove 32 is integrally provided on the top of the base plate 31. The semiconductor chip 3, the electromagnetic shielding layer 4, and the conductive ceramic layer 5 are all disposed in the fixing groove 32. A top cover 34 is connected to the top of the fixing groove 32. A fixing frame is provided at the bottom of the top cover 34 and is snapped into the outside of the fixing groove 32. A locking plate 35 is integrally provided symmetrically on the four inner walls of the fixing frame at the bottom of the top cover 34. A snap-fit ​​groove 33 is symmetrically opened on the four side walls of the fixing groove 32. The locking plate 35 is snapped into the snap-fit ​​groove 33.

[0051] It should be noted that the conductive ceramic layer 5 is encapsulated at the bottom of the inner wall of the fixing groove 32, the electromagnetic shielding layer 4 is placed on top of the conductive ceramic layer 5, the semiconductor chip 3 is encapsulated on top of the electromagnetic shielding layer 4, and the upper cover 34 is connected to the fixing groove 32. During connection, the locking plate 35 on the upper cover 34 is engaged and locked into the locking groove 33 on the fixing groove 32. Then, the fastening knob 36 is tightened. After encapsulation, the substrate 1 is formed. The locking design between the locking plate 35 on the upper cover 34 and the locking groove 33 on the fixing groove 32 makes the encapsulation more secure and easier to disassemble, reducing the complexity of production and maintenance.

[0052] Please see Figure 13 The top cover 34 has a fastening knob 36 in the middle of each of the four side walls, and the fixing groove 32 has a threaded hole 37 in the middle of each of the four side walls. The end of the fastening knob 36 is threaded into the threaded hole 37.

[0053] It should be noted that the fastening knob 36 reinforces the connection between the top cover 34 and the card plate 35.

[0054] Please see Figure 4 The top and bottom of the electromagnetic shielding frame 11 are provided with locking plates 29, and the two locking plates 29 respectively lock the top and bottom of the base plate 1.

[0055] It should be noted that the snap-fit ​​plate 29 is designed so that after the electromagnetic shielding frame 11 is connected to the substrate 1, the snap-fit ​​plate 29 can cover the top four ends of the copper layer 2 on the top of the substrate 1, so that the copper layer 2 and the electromagnetic shielding frame 11 can completely cover the substrate 1, preventing electromagnetic radiation from leaking out and achieving a better electromagnetic shielding effect.

[0056] In the description of this invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "both ends," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0057] Furthermore, the terms “first,” “second,” “third,” and “fourth” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as “first,” “second,” “third,” or “fourth” may explicitly or implicitly include at least one of those features.

[0058] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging structure with electromagnetic shielding function, characterized in that, The substrate (1) includes a copper layer (2) on its top, an electromagnetic shielding frame (11) on its outside, and a heat sink (14) for accelerating internal heat dissipation is detachably installed on the outside of the electromagnetic shielding frame (11). A semiconductor chip (3) is disposed inside the substrate (1), and conductive bumps (6) are equidistantly disposed on the top of the semiconductor chip (3). The ends of the conductive bumps (6) pass through the substrate (1). An electromagnetic shielding layer (4) is disposed inside the substrate (1) at the bottom of the semiconductor chip (3), and a conductive ceramic layer (5) for connecting to an external circuit is disposed at the bottom of the electromagnetic shielding layer (4). An adapter plate (12) is connected to the top of the substrate (1), and leads (13) are equidistantly disposed at both ends of the top of the adapter plate (12). Electrically connected bumps (18) are equidistantly disposed at the bottom of the adapter plate (12), and the electrically connected bumps (18) are in contact with the conductive bumps (6). The top of the copper layer (2) is provided with equidistant connecting grooves (10), the conductive bumps (6) are located inside the connecting grooves (10), the top of the substrate (1) is provided with equidistant mounting grooves (7), the conductive bumps (6) are located inside the mounting grooves (7), an electromagnetic shielding sheet (8) is provided inside the mounting grooves (7), and a round hole is provided on the top of the electromagnetic shielding sheet (8), the conductive bumps (6) are located inside the round hole of the electromagnetic shielding sheet (8), and micro fins (9) are provided equidistantly on the top of the electromagnetic shielding sheet (8) outside the conductive bumps (6).

2. A semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The heat sink (14) has first heat sink fins (15) evenly spaced on its four side walls. The bottom of the heat sink (14) has a vertical connecting port (16) and second heat sink fins (17) evenly spaced inside the connecting port (16). The bottom end of the electromagnetic shielding frame (11) is snapped into the heat sink (14). The bottom of the heat sink (14) has screw holes symmetrically opened at all four ends. The heat sink (14) and the electromagnetic shielding frame (11) are fixed together by screws. One end of the second heat sink fin (17) inside the connecting port (16) is in contact with the bottom of the substrate (1).

3. A semiconductor packaging structure with electromagnetic shielding function according to claim 2, characterized in that: The electromagnetic shielding frame (11) has a fixed rod (21) symmetrically and integrally provided on both sides of the corresponding side walls. A sliding plate (22) is slidably provided inside the fixed rod (21). A sliding rod (23) is fixedly connected to the top of the sliding plate (22). The top of the sliding rod (23) slides through the fixed rod (21). A spring (24) is sleeved between the top of the inner wall of the fixed rod (21) and the top of the sliding plate (22) on the outside of the sliding rod (23). A pull plate (27) is fixedly connected to the top of the two sliding rods (23) on one side of the electromagnetic shielding frame (11). A pull handle (28) is provided on the top of the pull plate (27). A convex plate (19) is symmetrically and integrally provided on both sides of the corresponding side walls of the adapter plate (12). A slot (20) is provided at the end of the convex plate (19). The sliding rod (23) is engaged in the slot (20). The convex plate (19) is located between the pull plate (27) and the fixed rod (21).

4. A semiconductor packaging structure with electromagnetic shielding function according to claim 3, characterized in that: The top of the convex plate (19) is symmetrically provided with fixing holes (26) outside the slot (20), and the bottom of the pull plate (27) is symmetrically provided with fixing rods (25) outside the slide rod (23), and the fixing rods (25) are engaged inside the fixing holes (26).

5. A semiconductor packaging structure with electromagnetic shielding function according to claim 4, characterized in that: The electromagnetic shielding frame (11) has a connecting protrusion (30) integrally provided at each of the four bottom corners, and the second heat dissipation fin (17) is located above the connecting protrusion (30).

6. A semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The substrate (1) includes a base plate (31). A fixing groove (32) is integrally provided on the top of the base plate (31). The semiconductor chip (3), the electromagnetic shielding layer (4), and the conductive ceramic layer (5) are all disposed in the fixing groove (32). A top cover (34) is connected to the top of the fixing groove (32). A fixing frame is provided at the bottom of the top cover (34), and the fixing frame is snapped into the outside of the fixing groove (32). The four inner walls of the fixing frame at the bottom of the top cover (34) are symmetrically provided with a snap plate (35). The four side walls of the fixing groove (32) are symmetrically provided with snap-fit ​​grooves (33), and the snap plate (35) is snapped into the snap-fit ​​groove (33).

7. A semiconductor packaging structure with electromagnetic shielding function according to claim 6, characterized in that: The upper cover (34) has a fastening knob (36) in the middle of each of the four side walls, and the fixing groove (32) has a threaded hole (37) in the middle of each of the four side walls. The end of the fastening knob (36) is threaded into the threaded hole (37).

8. A semiconductor packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The top and bottom of the electromagnetic shielding frame (11) are provided with locking plates (29), and the two locking plates (29) respectively lock the top and bottom of the base plate (1).

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