Coupler and electronic device

Abstract

The embodiment of the present application discloses a coupler and an electronic device, wherein the coupler may include: a ground layer, a plurality of dielectric layers, and a main transmission line and a coupling line coupled to each other. The main transmission line includes a plurality of first signal lines arranged in a stacked manner. In this arrangement, the main transmission line can be arranged as a multi-layer signal line structure to ensure the flow and impedance performance of the main transmission line and improve the directivity of the coupler. And / or, the coupling line may include a plurality of second signal lines arranged in a stacked manner. In this arrangement, the coupling line can be arranged as a multi-layer signal line structure to improve the directivity of the coupler.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a coupler and an electronic device. Background Art

[0002] Directional couplers are widely used in communication systems. For example, they can be used in radar, navigation, and positioning systems. When the transmitter power is large, the directional coupler can monitor the power of the signal source in real time to ensure the normal operation of the system and improve the stability of the loop.

[0003] Directivity is an important design parameter of directional couplers. High directivity means high power control accuracy. For conventional microstrip couplers, in large current and low-frequency power application scenarios, in order to ensure the current capacity, the routing width of the main transmission line is too wide, resulting in impedance mismatch, which obviously affects the directivity. Summary of the invention

[0004] Embodiments of the present application provide a coupler and an electronic device to improve the directivity of the coupler.

[0005] In the first aspect, an embodiment of the present application provides a coupler, which may include: a ground layer, multiple dielectric layers, and a main transmission line and a coupling line coupled to each other. Multiple dielectric layers are stacked on the ground layer. Among them, the main transmission line can be arranged in a multi-layer signal line structure, and the coupling line can be arranged in a single-layer signal line structure, that is, the coupling line can be arranged in a single layer, and the main transmission line may include multiple first signal lines arranged in a stacked manner, and at least one dielectric layer of multiple dielectric layers is arranged between two adjacent first signal lines among the multiple first signal lines, and the multiple first signal lines are interconnected through first dielectric through holes that penetrate the dielectric layers to achieve electrical connection. In this way, the main transmission line can be arranged as a multi-layer signal line structure to ensure the current flow and impedance performance of the main transmission line and improve the directionality of the coupler.

[0006] In some possible implementations, the coupler provided in the embodiments of the present application may be a directional coupler.

[0007] In some possible implementations, the plurality of first signal lines may include the first signal line 1 to the Nth first signal line in a direction from the ground layer to the plurality of dielectric layers, where N is an integer and N≥2. The Nth first signal line may be disposed on the side of the plurality of dielectric layers away from the ground layer, so that the first signal line farthest from the ground layer among the plurality of first signal lines may be disposed on all dielectric layers. Alternatively, the Nth first signal line may be disposed between two adjacent dielectric layers among the plurality of dielectric layers, so that all the first signal lines are retracted into the dielectric layer.

[0008] In some possible implementations, the coupling line may be disposed on the same layer as any one of the plurality of first signal lines, thereby reducing the process flow.

[0009] In some possible implementations, at least one dielectric layer among the plurality of dielectric layers is disposed between the plurality of first signal lines and the ground layer, thereby achieving insulation between the first signal lines and the ground layer.

[0010] In some possible implementations, at least one dielectric layer among the plurality of dielectric layers is disposed between the coupling line and the ground layer, thereby achieving insulation between the coupling line and the ground layer.

[0011] In some possible implementations, the ground layer can be a whole-surface structure, so that the ground layer covers the dielectric layer in its entirety, so that the coupler realizes a microstrip line working mode. Alternatively, the ground layer can also include: a hollow area and a main body area, so that the ground layer covers a part of the dielectric layer, and the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main body area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer, so that the coupler realizes a working mode similar to an equivalent coplanar waveguide or anisoplanar waveguide.

[0012] In the second aspect, the embodiment of the present application also provides a coupler, which may include: a ground layer, multiple dielectric layers, and a main transmission line and a coupling line coupled to each other. Multiple dielectric layers are stacked on the ground layer. Among them, not only can the main transmission line be arranged with a multi-layer signal line structure, but the coupling line can also be arranged with a multi-layer signal line structure, that is, the main transmission line can include multiple first signal lines arranged in a stacked manner, and at least one dielectric layer of multiple dielectric layers is arranged between two adjacent first signal lines among the multiple first signal lines, and the multiple first signal lines are interconnected through the first dielectric through-holes penetrating the dielectric layers to achieve electrical connection. And, the coupling line may include multiple second signal lines arranged in a stacked manner, and at least one dielectric layer of multiple dielectric layers is arranged between two adjacent second signal lines among the multiple second signal lines, and the multiple second signal lines are interconnected through the second dielectric through-holes penetrating the dielectric layers to achieve electrical connection. In this way, the main transmission line and the coupling line can be respectively arranged as a multi-layer signal line structure to ensure the flow and impedance performance of the main transmission line and improve the directivity of the coupler.

[0013] In some possible implementations, the plurality of first signal lines may include the first signal line 1 to the Nth first signal line in a direction from the ground layer to the plurality of dielectric layers, where N is an integer and N≥2. The Nth first signal line may be disposed on the side of the plurality of dielectric layers away from the ground layer, so that the first signal line farthest from the ground layer among the plurality of first signal lines may be disposed on all dielectric layers. Alternatively, the Nth first signal line may be disposed between two adjacent dielectric layers among the plurality of dielectric layers, so that all the first signal lines are retracted into the dielectric layer.

[0014] In some possible implementations, the plurality of second signal lines may include the first second signal line to the Mth second signal line in a direction from the ground layer to the plurality of dielectric layers, where M is an integer and M≥2. The Mth second signal line may be disposed on the side of the plurality of dielectric layers away from the ground layer, so that the second signal line farthest from the ground layer among the plurality of second signal lines is disposed on all dielectric layers. Alternatively, the Mth second signal line may be disposed between two adjacent dielectric layers among the plurality of dielectric layers, so that all the second signal lines are retracted into the dielectric layer.

[0015] In some possible implementations, M=N can be made, that is, the number of the plurality of first signal lines is set to be the same as the number of the plurality of second signal lines, and a second signal line among the plurality of second signal lines is set at the same layer as a corresponding first signal line among the plurality of first signal lines, thereby further reducing the process preparation flow.

[0016] In some possible implementations, at least one dielectric layer among a plurality of dielectric layers may be disposed between the plurality of first signal lines and the ground layer, so that insulation can be achieved between the main transmission line and the ground layer.

[0017] In some possible implementations, at least one dielectric layer among the plurality of dielectric layers is disposed between the plurality of second signal lines and the ground layer, thereby achieving insulation between the coupling line and the ground layer.

[0018] In some possible implementations, the ground layer can be a whole-surface structure, so that the ground layer covers the dielectric layer in its entirety, so that the coupler realizes a microstrip line working mode. Alternatively, the ground layer can also include: a hollow area and a main body area, so that the ground layer covers a part of the dielectric layer, and the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main body area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer, so that the coupler realizes a working mode similar to an equivalent coplanar waveguide or anisoplanar waveguide.

[0019] In a third aspect, an embodiment of the present application further provides a coupler, which may include: a ground layer, multiple dielectric layers, and a main transmission line and a coupling line coupled to each other. Multiple dielectric layers are stacked on the ground layer. Among them, the main transmission line may also be arranged with a single-layer signal line structure, and the coupling line may be arranged with a multi-layer signal line structure, then the main transmission line is arranged in a single layer, and the coupling line may include multiple second signal lines arranged in a stacked manner, and at least one dielectric layer of multiple dielectric layers is arranged between two adjacent second signal lines among the multiple second signal lines, and the multiple second signal lines are interconnected through second dielectric through holes that penetrate the dielectric layers to achieve electrical connection. In this way, the main transmission line and the coupling line can be respectively arranged as multi-layer signal line structures to ensure the current flow and impedance performance of the main transmission line and improve the directionality of the coupler.

[0020] In some possible implementations, the plurality of second signal lines may include the first second signal line to the Mth second signal line in a direction from the ground layer to the plurality of dielectric layers, where M is an integer and M≥2. The Mth second signal line may be disposed on the side of the plurality of dielectric layers away from the ground layer, so that the second signal line farthest from the ground layer among the plurality of second signal lines is disposed on all dielectric layers. Alternatively, the Mth second signal line may be disposed between two adjacent dielectric layers among the plurality of dielectric layers, so that all the second signal lines are retracted into the dielectric layer.

[0021] In some possible implementations, the main transmission line and any second signal line among the plurality of second signal lines may be arranged on the same layer to reduce the process preparation flow.

[0022] In some possible implementations, at least one dielectric layer among a plurality of dielectric layers may be disposed between the plurality of second signal lines and the ground layer, so that the coupling lines can be insulated from the ground layer respectively.

[0023] In some possible implementations, at least one dielectric layer among the plurality of dielectric layers is disposed between the main transmission line and the ground layer, thereby achieving insulation between the main transmission line and the ground layer.

[0024] In some possible implementations, the ground layer can be a whole-surface structure, so that the ground layer covers the dielectric layer in its entirety, so that the coupler realizes a microstrip line working mode. Alternatively, the ground layer can also include: a hollow area and a main body area, so that the ground layer covers a part of the dielectric layer, and the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main body area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer, so that the coupler realizes a working mode similar to an equivalent coplanar waveguide or anisoplanar waveguide.

[0025] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising: a circuit board and a coupler, wherein the coupler is disposed on the circuit board and connected to the circuit board. The coupler may be a coupler as in the first aspect or various embodiments of the first aspect. Since the above-mentioned coupler has good directionality, the performance of the electronic device including the above-mentioned coupler is also good. Furthermore, the principle of solving the problem by the electronic device is similar to that of the above-mentioned coupler, so the implementation of the electronic device can refer to the implementation of the above-mentioned coupler, and the repeated parts will not be repeated. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of a top view of a coupler provided in one embodiment of the present application;

[0027] Figure 2a for Figure 1 A schematic cross-sectional view of the coupler along the AA' direction is shown;

[0028] Figure 2b for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0029] Figure 2c for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0030] Figure 3a for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0031] Figure 3b for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0032] Figure 4a for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0033] Figure 4b for Figure 1 Another schematic cross-sectional view of the coupler along the AA' direction is shown;

[0034] Figure 4c for Figure 1 The shown diagram is another cross-sectional structural diagram of the coupler along the AA' direction.

[0035] Reference numerals:

[0036] 100-ground layer; 110-hollow area; 120-main area; 200-main transmission line; 210-first signal line 1; 220-second signal line 2; 230-third signal line 300-coupling line; 310-first signal line 1; 320-second signal line 2; 330-third signal line 3; 410 / 420 / 430 / 440-dielectric layer; GK1-first dielectric through hole; GK2-second dielectric through hole; F1-direction. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The specific operating method in the method embodiment can also be applied to the device embodiment or the system embodiment. It should be noted that in the description of the present application, "at least one" refers to one or more, wherein multiple refers to two or more. In view of this, "multiple" can also be understood as "at least two" in the embodiment of the present application. "And / or" describes the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / ", unless otherwise specified, generally indicates that the related objects before and after are in an "or" relationship. In addition, it should be understood that in the description of the present application, words such as "first" and "second" are only used to distinguish the purpose of description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order.

[0038] It should be pointed out that in the embodiments of the present application, "connection" may refer to electrical connection, and the connection between two electrical components may be a direct or indirect connection between the two electrical components. For example, the connection between A and B may be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components, such as A and B connection, or A and C direct connection, C and B direct connection, and A and B are connected through C. In the embodiments of the present application, "coupling" may refer to the coupling between two windings through an electromagnetic field, that is, the two windings can transmit electrical energy through an electromagnetic field, which mainly includes the energy conversion process of electrical energy-magnetic field potential energy-electrical energy.

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0040] The coupler provided in the embodiment of the present application can be a directional coupler. In addition, the coupler provided in the embodiment of the present application can be widely used in the coupler part of various electronic devices. Since the directionality of the coupler provided in the embodiment of the present application is high, the signal coupling accuracy of the electronic device with the coupler is also high. Exemplarily, the electronic device includes but is not limited to semiconductor process processing equipment, and the coupler is, for example, applied to the radio frequency generator (RFG) in the semiconductor process processing equipment, the radio frequency matcher (RFM) or the coupler part in the signal detection system. The semiconductor process processing equipment includes but is not limited to chemical vapor deposition (CVD) equipment, physical vapor deposition (PVD) equipment and etching (Etch) equipment. It is understandable that the coupler proposed in the embodiment of the present application is intended to include but is not limited to application in these and any other suitable types of electronic devices.

[0041] Figure 1 This is a schematic diagram of a top view of a coupler provided in one embodiment of the present application. Figure 2a for Figure 1 A schematic cross-sectional view of the coupler along the AA' direction is shown. Figure 2b for Figure 1 Another cross-sectional structural diagram of the coupler along the AA' direction is shown, Figure 2c for Figure 1 The schematic diagram of another cross-sectional structure of the coupler shown in the figure is along the AA' direction. Figure 1 to Figure 2c , the coupler may include: a ground layer 100, a dielectric layer (eg, Figure 2a and Figure 2b 410~430, Figure 2c 410-440), the main transmission line 200 and the coupling line 300. The main transmission line 200 and the coupling line 300 are parallel to each other and arranged at intervals, so that the main transmission line 200 and the coupling line 300 can be coupled to each other.

[0042] Exemplarily, the coupler may be arranged on a circuit board (e.g., a printed circuit board (PCB)), the main transmission line 200 has an input end and an output end, the coupling line 300 has a coupling end and an isolation end, the input end and the coupling end may be arranged on the same side, and the output end and the isolation end may be arranged on the same side. In some examples, the coupled object signal (e.g., a radio frequency signal) is transmitted on the main transmission line 200, and the energy (e.g., current, voltage) of the coupled object signal (e.g., radio frequency signal) is coupled and collected through the coupling line 300. The coupling end may be connected to a signal detection circuit, and the radio frequency signal coupled and collected by the coupling line 300 is input into the signal detection circuit through the coupling end, and analyzed by the signal detection circuit.

[0043] In the present application, the main transmission line can be arranged in a multi-layer signal line structure, and the coupling line can be arranged in a single-layer signal line structure. Figure 1 to Figure 2c , dielectric layer (e.g., Figure 2a and Figure 2b 410~430, Figure 2c 410-440) are stacked on the ground layer 100. In addition, the main transmission line 200 includes: first signal lines 210-230 stacked, and the first signal lines 210-230 are interconnected to achieve electrical connection. In this way, the main transmission line 200 can be set as a multi-layer signal line structure to ensure the flow and impedance performance of the main transmission line 200 and improve the directivity of the coupler.

[0044] The coupler provided in the embodiment of the present application can achieve directional coupling, especially under high-power conditions in frequency bands such as middle frequency (MF), high frequency (HF), and very high frequency (VHF), to solve the adverse effects of impedance mismatch of large through-current signal lines on the directivity of the coupler, and improve the directivity of the coupler. In addition, it is also possible to achieve synchronous dielectric loading or glue filling of distributed adjustable capacitors with a coupling degree of more than 20dB over a wide band, improve the dielectric constant and distributed capacitance characteristics, and optimize the natural heat dissipation characteristics.

[0045] In addition, the coupler provided in the embodiment of the present application sets the main transmission line 200 as a multi-layer signal line structure, increases the RF coupling path, and realizes multi-path coupling, which can improve the coupling degree, reduce the size of the low-frequency coupler, and realize the low-frequency miniaturization of the coupler. It can also avoid the adverse effects of safety distance under RF high-power and high-voltage conditions.

[0046] For example, refer to Figure 2a to Figure 2cIn the direction from the ground layer 100 to the dielectric layer 410 (i.e., the direction indicated by the arrow F1), the main transmission line 200 includes: a first first signal line 210, a second first signal line 220, and a third first signal line 230 that are stacked. Among them, a dielectric layer 410 is arranged between the first first signal line 210 and the ground layer 100, a dielectric layer 420 is arranged between the first first signal line 210 and the second first signal line 220, and a dielectric layer 430 is arranged between the second first signal line 220 and the third first signal line 230. In order to achieve electrical connection, corresponding first dielectric through holes GK1 are respectively provided on the dielectric layers 420 and 430. The first first signal line 210 and the second first signal line 220 are interconnected through the first dielectric through hole GK1 of the dielectric layer 420 to achieve electrical connection, and the second first signal line 220 and the third first signal line 230 are interconnected through the first dielectric through hole GK1 of the dielectric layer 430 to achieve electrical connection.

[0047] In some examples, reference Figure 2a , the third first signal line 230 is arranged above all dielectric layers, that is, the third first signal line 230 is arranged on the side of the dielectric layer 430 away from the ground layer 100. In addition, the coupling line 300 is arranged on the same layer as the third first signal line 230, so that the coupling line 300 is also arranged above all dielectric layers. And, the ground layer 100 is arranged to cover the entire surface of the dielectric layer 410. With this arrangement, the working mode of the coupler can be: microstrip line multilayer coupling mode, which not only satisfies the through-current and impedance control, but also can increase the coupling path and achieve miniaturization. In addition, the same preparation process can be used to form the third first signal line 230 and the coupling line 300, thereby reducing the process preparation flow.

[0048] In some other examples, reference Figure 2b, the third first signal line 230 is arranged above all dielectric layers, the coupling line 300 is arranged in the same layer as the second first signal line 220, and the coupling line 300 is arranged between dielectric layers 420 and 430. In addition, the ground layer 100 includes: a hollow area 110 and a main body area 120, the hollow area 110 exposes a part of the dielectric layer 410, and the orthographic projection of the hollow area 110 on the dielectric layer 410 covers the orthographic projection of the main transmission line 200 on the dielectric layer 410. The main body area 120 covers the rest of the dielectric layer 410, and the orthographic projection of the main body area 120 on the dielectric layer 410 covers the orthographic projection of the coupling line 300 on the dielectric layer 410. With this arrangement, the working mode of the coupler can be: similar to an equivalent coplanar waveguide (or anisoplanar waveguide), the ground layer 100 is provided with a hollow area 110, the flow capacity of the main transmission line 200 is optimized, and the equivalent mode is changed to achieve multi-layer equivalent coplanar waveguide coupling. In addition, the second first signal line 220 and the coupling line 300 can be formed by the same preparation process, which reduces the process preparation flow.

[0049] In some other examples, reference Figure 2c , the third first signal line 230 is arranged between the dielectric layers 430 and 440, and the coupling line 300 is arranged in the same layer as the second first signal line 220, so that the coupling line 300 is arranged between the dielectric layers 420 and 430. In addition, the ground layer 100 has a hollow area 110 and a main area 120. With this arrangement, the working mode of the coupler can be: dielectric uniform heteroplanar waveguide, the main transmission line 200 is moved inwardly into the dielectric layer, the phase velocity balance can be adjusted, and the directivity can be further improved. In addition, the overall equivalent dielectric constant can be improved through the coupling of the full inner layer dielectric uniform heteroplanar waveguide, and the coupling and directivity can be enhanced.

[0050] The present application does not limit the number of the first signal lines, for example, the number may be 2, 3, 4, 5 or more. Figure 2a to Figure 2c The three first signal lines are used as an example for illustration. In addition, the present application does not limit the number of dielectric layers provided between the first first signal line and the ground layer, for example, it can be 1 layer, 2 layers, 3 layers, 4 layers, 5 layers or more layers. Figure 2a to Figure 2c Only one dielectric layer is taken as an example for description.

[0051] The present application does not limit the material of the ground layer. Exemplarily, the material of the ground layer includes but is not limited to metal materials, such as one or a combination of molybdenum, gold, and platinum. The present application does not limit the material of the first signal line. Exemplarily, the material of the first signal line includes but is not limited to metal materials, such as one or a combination of molybdenum, gold, and platinum. In addition, the present application does not limit the material of the dielectric layer. Exemplarily, the material of the dielectric layer includes but is not limited to one or a combination of nitride materials, oxide materials, and oxynitride materials.

[0052] Figure 3a for Figure 1 Another cross-sectional structural diagram of the coupler along the AA' direction is shown, Figure 3b for Figure 1 The schematic diagram of another cross-sectional structure of the coupler shown in the figure is along the AA' direction. Figure 3a and Figure 3b , the coupler may include: a ground layer 100, a dielectric layer (eg, Figure 3a 410~430, Figure 3b 410-440 in the figure), the main transmission line 200 and the coupling line 300. This embodiment is a modification of the implementation in the above embodiment. Only the differences between this embodiment and the above embodiment are described below, and the similarities are not repeated here.

[0053] In the present application, not only the main transmission line 200 can be configured with a multi-layer signal line structure, but also the coupling line 300 can be configured with a multi-layer signal line structure. Figure 3a and Figure 3b In the direction from the ground layer 100 to the dielectric layer 410 (i.e., the direction indicated by the arrow F1), the main transmission line 200 includes: a first first signal line 210, a second first signal line 220, and a third first signal line 230 that are stacked. The coupling line 300 includes: a first second signal line 310, a second second signal line 320, and a third second signal line 330 that are stacked. Among them, the first first signal line 210 and the first second signal line 310 are arranged on the same layer, the second first signal line 220 and the second second signal line 320 are arranged on the same layer, and the third first signal line 230 and the third second signal line 330 are arranged on the same layer, which can also reduce the process preparation flow. In addition, the dielectric layers 420 and 430 are provided with corresponding first dielectric through holes GK1 and second dielectric through holes GK2, respectively. The first first signal line 210 and the second first signal line 220 are interconnected and electrically connected through the first dielectric through hole GK1 of the dielectric layer 420, and the second first signal line 220 and the third first signal line 230 are interconnected and electrically connected through the first dielectric through hole GK1 of the dielectric layer 430. The first second signal line 310 and the second second signal line 320 are interconnected and electrically connected through the second dielectric through hole GK2 of the dielectric layer 420, and the second second signal line 320 and the third second signal line 330 are interconnected and electrically connected through the second dielectric through hole GK2 of the dielectric layer 430.

[0054] In some examples, reference Figure 3a, the third first signal line 230 and the third second signal line 330 are arranged above all dielectric layers, that is, the third first signal line 230 and the third second signal line 330 are arranged on the side of the dielectric layer 430 away from the ground layer 100, and the ground layer 100 is arranged to cover the entire surface of the dielectric layer 410. With this arrangement, the working mode of the coupler can be: microstrip line multilayer coupling mode, which not only satisfies the through-current and impedance control, but also increases the coupling path and realizes miniaturization. In addition, the same preparation process can be used to form the third first signal line 230 and the coupling line 300, reducing the process preparation flow.

[0055] In some other examples, reference Figure 3b , the third first signal line 230 and the third second signal line 330 are arranged between the dielectric layers 430 and 440, and the ground layer 100 has a hollow area 110 and a main area 120. With this arrangement, the working mode of the coupler can be: dielectric uniform heteroplanar waveguide, the main transmission line 200 and the coupling line 300 are moved inwardly into the dielectric layer, the phase velocity balance can be adjusted, and the directivity can be further improved. In addition, the overall equivalent dielectric constant can be improved through the coupling of the full inner layer dielectric uniform heteroplanar waveguide, and the coupling and directivity can be enhanced.

[0056] The present application does not limit the number of the second signal lines, for example, the number of the second signal lines may be 2, 3, 4, 5 or more. Figure 3a and Figure 3b Only three second signal lines are taken as an example for description.

[0057] Figure 4a for Figure 1 Another cross-sectional structural diagram of the coupler along the AA' direction is shown, Figure 4b for Figure 1 Another cross-sectional structural diagram of the coupler along the AA' direction is shown, Figure 4c for Figure 1 The schematic diagram of another cross-sectional structure of the coupler shown in the figure is along the AA' direction. Figures 4a to 4c , the coupler may include: a ground layer 100, a dielectric layer (eg, Figure 4a and Figure 4b 410~430, Figure 4c 410-440 in the figure), the main transmission line 200 and the coupling line 300. This embodiment is a modification of the implementation in the above embodiment. Only the differences between this embodiment and the above embodiment are described below, and the similarities are not repeated here.

[0058] In the present application, the main transmission line 200 may be configured as a single-layer signal line structure, and the coupling line 300 may be configured as a multi-layer signal line structure. Figures 4a to 4cIn the direction from the ground layer 100 to the dielectric layer 410 (i.e., the direction indicated by the arrow F1), the coupling line 300 includes: a first second signal line 310, a second second signal line 320, and a third second signal line 330 which are stacked. The dielectric layers 420 and 430 are provided with corresponding second dielectric through holes GK2, respectively. The first second signal line 310 and the second second signal line 320 are connected to each other through the second dielectric through hole GK2 of the dielectric layer 420 to realize electrical connection, and the second second signal line 320 and the third second signal line 330 are connected to each other through the second dielectric through hole GK2 of the dielectric layer 430 to realize electrical connection.

[0059] In some examples, reference Figure 4a , the third second signal line 330 is arranged above all dielectric layers, the main transmission line 200 and the third second signal line 330 are arranged in the same layer, and the ground layer 100 is arranged to cover the entire surface of the dielectric layer 410. With this arrangement, the working mode of the coupler can be: microstrip line multilayer coupling mode, which not only satisfies the through-current and impedance control, but also increases the coupling path and realizes miniaturization.

[0060] In some other examples, reference Figure 4b , the third second signal line 330 is arranged above all dielectric layers, the main transmission line 200 and the second second signal line 320 are arranged in the same layer, and the ground layer 100 includes: a hollow area 110 and a main body area 120. With this arrangement, the working mode of the coupler can be: similar to an equivalent coplanar waveguide (or anisoplanar waveguide), the ground layer 100 is provided with a hollow area 110, the flow capacity of the main transmission line 200 is optimized, and the equivalent mode is changed to achieve multi-layer equivalent coplanar waveguide coupling. In addition, the same preparation process can be used to form the main transmission line 200 and the second second signal line 320, thereby reducing the process preparation flow.

[0061] In some other examples, reference Figure 4c , the third second signal line 330 is arranged between the dielectric layers 430 and 440, the main transmission line 200 and the second second signal line 320 are arranged in the same layer, and the ground layer 100 has a hollow area 110 and a main area 120. With this arrangement, the working mode of the coupler can be: dielectric uniform heteroplanar waveguide, the main transmission line 200 is moved inwardly into the dielectric layer, the phase velocity balance can be adjusted, and the directivity can be further improved. In addition, the overall equivalent dielectric constant can be improved through the coupling of the full inner layer dielectric uniform heteroplanar waveguide, and the coupling and directivity can be enhanced.

[0062] The present application does not limit the number of dielectric layers provided between the first second signal line and the ground layer, for example, it may be 1 layer, 2 layers, 3 layers, 4 layers, 5 layers or more layers. Figure 2a to Figure 2c Only one dielectric layer is taken as an example for description.

[0063] In the second aspect, the present application also provides an electronic device, including a circuit board and a coupler in any of the above technical solutions, wherein the coupler is arranged on the circuit board, and the coupler is connected to the circuit board. Exemplarily, a signal detection circuit may be arranged on the circuit board, wherein the signal detection circuit is connected to the coupling end of the coupler, and the energy (such as current, voltage) of the coupled object (such as a radio frequency signal) is coupled and collected through the coupling line. The coupling end can be connected to the signal detection circuit, and the radio frequency signal collected by the coupling line is input into the signal detection circuit and analyzed by the signal detection circuit. In addition, the signal detection circuit also includes a first connector and a second connector, and the first connector and the second connector are respectively connected to the coupling end and the isolation end of the coupling line.

[0064] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. A coupler, characterized in that: include: A ground layer, a plurality of dielectric layers, and mutually coupled main transmission lines and coupling lines, wherein the plurality of dielectric layers are stacked on the ground layer; The main transmission line comprises: a plurality of first signal lines stacked in layers, at least one dielectric layer of the plurality of dielectric layers being disposed between two adjacent first signal lines of the plurality of first signal lines, and the plurality of first signal lines being interconnected via first dielectric through holes penetrating the dielectric layers; The coupling line single layer is arranged on any one of the plurality of dielectric layers.

2. The coupler according to claim 1, characterized in that In a direction from the ground layer to the plurality of dielectric layers, the plurality of first signal lines include a first signal line from the first to the Nth first signal lines, where N is an integer and N≥2; The Nth first signal line is disposed on a side of the plurality of dielectric layers away from the ground layer; or, the Nth first signal line is disposed between two adjacent dielectric layers among the plurality of dielectric layers.

3. The coupler according to claim 1 or 2, characterized in that: The coupling line is disposed in the same layer as any one of the plurality of first signal lines.

4. The coupler according to any one of claims 1 to 3, characterized in that: At least one of the plurality of dielectric layers is disposed between the plurality of first signal lines and the ground layer; and / or, At least one of the plurality of dielectric layers is disposed between the coupling line and the ground layer.

5. The coupler according to any one of claims 1 to 4, characterized in that: The ground layer is a whole-surface structure; or, The ground layer includes: a hollow area and a main area, the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer.

6. A coupler, characterized in that: include: A ground layer, a plurality of dielectric layers, and mutually coupled main transmission lines and coupling lines, wherein the plurality of dielectric layers are stacked on the ground layer; The main transmission line comprises: a plurality of first signal lines stacked in layers, at least one dielectric layer of the plurality of dielectric layers being arranged between two adjacent first signal lines of the plurality of first signal lines, and the plurality of first signal lines being interconnected via first dielectric through holes penetrating the dielectric layers; The coupling line includes: a plurality of second signal lines stacked in layers, at least one dielectric layer among the plurality of dielectric layers is arranged between two adjacent second signal lines among the plurality of second signal lines, and the plurality of second signal lines are interconnected through second dielectric through holes penetrating the dielectric layers.

7. The coupler according to claim 6, characterized in that In the direction from the ground layer to the plurality of dielectric layers, the plurality of first signal lines include the 1st first signal line to the Nth first signal line, where N is an integer and N≥2; the Nth first signal line is arranged on a side of the plurality of dielectric layers away from the ground layer; or, the Nth first signal line is arranged between two adjacent dielectric layers in the plurality of dielectric layers; and / or, In a direction from the ground layer to the plurality of dielectric layers, the plurality of second signal lines include the first second signal line to the Mth second signal line, where M is an integer and M≥2; The Mth second signal line is disposed on a side of the plurality of dielectric layers away from the ground layer; or, the Mth second signal line is disposed between two adjacent dielectric layers among the plurality of dielectric layers.

8. The coupler according to claim 6 or 7, characterized in that: The number of the plurality of first signal lines is the same as the number of the plurality of second signal lines, and one of the plurality of second signal lines is disposed on the same layer as a corresponding one of the plurality of first signal lines.

9. The coupler according to any one of claims 6 to 8, characterized in that: At least one of the plurality of dielectric layers is disposed between the plurality of first signal lines and the ground layer; and / or, At least one of the plurality of dielectric layers is disposed between the plurality of second signal lines and the ground layer.

10. The coupler according to any one of claims 6 to 9, characterized in that: The ground layer is a whole-surface structure; or, The ground layer includes: a hollow area and a main area, the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer.

11. A coupler, characterized in that: include: A ground layer, a plurality of dielectric layers, and mutually coupled main transmission lines and coupling lines, wherein the plurality of dielectric layers are stacked on the ground layer; The main transmission line single layer is arranged on any one of the plurality of dielectric layers; The coupling line includes: a plurality of second signal lines stacked in layers, at least one dielectric layer among the plurality of dielectric layers is arranged between two adjacent second signal lines among the plurality of second signal lines, and the plurality of second signal lines are interconnected through second dielectric through holes penetrating the dielectric layers.

12. The coupler according to claim 11, characterized in that In a direction from the ground layer to the plurality of dielectric layers, the plurality of second signal lines include the first second signal line to the Mth second signal line, where M is an integer and M≥2; The Mth second signal line is disposed on a side of the plurality of dielectric layers away from the ground layer; or, the Mth second signal line is disposed between two adjacent dielectric layers among the plurality of dielectric layers.

13. The coupler according to claim 11 or 12, characterized in that The main transmission line is disposed on the same layer as any one of the plurality of second signal lines.

14. The coupler according to any one of claims 11 to 13, characterized in that: At least one of the plurality of dielectric layers is disposed between the plurality of second signal lines and the ground layer; and / or, At least one of the plurality of dielectric layers is disposed between the main transmission line and the ground layer.

15. The coupler according to any one of claims 11 to 14, characterized in that: The ground layer is a whole-surface structure; or, The ground layer includes: a hollow area and a main area, the orthographic projection of the hollow area on the dielectric layer covers the orthographic projection of the main transmission line on the dielectric layer, and the orthographic projection of the main area on the dielectric layer covers the orthographic projection of the coupling line on the dielectric layer.

16. An electronic device, characterized in that: include: A circuit board and a coupler as claimed in any one of claims 1 to 15; The coupler is arranged on the circuit board, and the coupler is connected to the circuit board.

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