Miniaturized Ku wave band down-conversion receiving assembly

Abstract

The invention belongs to the technical field of frequency conversion receiving assemblies, and discloses a miniaturized Ku wave band down-conversion receiving assembly. According to the invention, a one-time frequency conversion structure is adopted, the circuit design is simplified, a bare chip micro-assembly process is adopted for assembly, multi-layer wiring is carried out on an HTCC substrate, the assembly volume is reduced, and the integration level is extremely high; according to the invention, external interconnection is realized through a BGA bonding pad by adopting a chip design concept and an SiP packaging technology, so that the occupied space of a connector and a cable is saved, and the size and the weight of a module in a multi-channel application scene are remarkably reduced; various intermediate-frequency filters are integrated, various instantaneous bandwidth requirements can be met, good universal design is achieved, and different radio-frequency and intermediate-frequency filters can be arranged to meet the requirements of different phased array radar receiving systems.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of frequency conversion receiving components, and in particular to a miniaturized Ku-band down-conversion receiving component. Background Art

[0002] With the development of miniaturized aerospace vehicles, there is a demand for miniaturized and highly integrated phased array radars. As an important component of the phased array radar receiving system, the miniaturized design of the frequency conversion channel is of great significance for achieving the miniaturization, lightness and low cost of the radar system.

[0003] At present, the commonly used frequency conversion components are secondary frequency conversion structures, the frequency conversion link is relatively complex, and the traditional component structure is used, which is large in size and weight. It is difficult to realize the miniaturization design of phased array radars when the demand for high-integration miniaturization applications is gradually increasing. With the development of circuit design technology, microelectronics technology and packaging technology, the miniaturization design of frequency conversion channels has become possible. Summary of the invention

[0004] The purpose of the present invention is to provide a miniaturized Ku-band down-conversion receiving component. Aiming at the problems of the prior art that the frequency conversion link is relatively complex, the size and weight are large, based on the primary frequency conversion circuit structure, HTCC (high temperature co-fired ceramic) material, and SiP (system-level packaging) technology, a miniaturized Ku-band down-conversion receiving component is realized. The present invention integrates dynamic expansion, RF pre-selection filtering, down-conversion, intermediate frequency bandwidth switching and other functions in a single package, which can realize the miniaturization of the frequency conversion channel, thereby improving the performance and reliability of the radar system and reducing its cost and complexity.

[0005] To achieve the above object, the present invention provides a miniaturized Ku-band down-conversion receiving component, including a radio frequency link, a mixing link, and an intermediate frequency link; The radio frequency link comprises a plurality of digitally controlled attenuators, a plurality of radio frequency amplifiers and a radio frequency filter group, the input end of the first digitally controlled attenuator is connected to the radio frequency input signal, and the first digitally controlled attenuator, the first radio frequency amplifier, the second digitally controlled attenuator, the radio frequency filter group and the second radio frequency amplifier are connected in series in sequence; The mixing chain includes a local oscillator amplifier, a mixer and a bridge, the output end of the second radio frequency amplifier is connected to the first input end of the mixer, the input end of the local oscillator amplifier is connected to the local oscillator input signal, the output end of the local oscillator amplifier is connected to the second input end of the mixer, and the output end of the mixer is connected to the input end of the bridge; The intermediate frequency link includes several intermediate frequency filters, several intermediate frequency amplifiers and an intermediate frequency filter group. The output end of the bridge is connected to the input end of the intermediate frequency filter. The first intermediate frequency filter, the first intermediate frequency amplifier, the intermediate frequency filter group, the second intermediate frequency amplifier and the second intermediate frequency filter are connected in series in sequence.

[0006] Furthermore, the mixer in the mixing link is an image rejection mixer.

[0007] Furthermore, the intermediate frequency link also includes a temperature compensator, which is arranged between the first intermediate frequency amplifier and the intermediate frequency filter group. The first intermediate frequency amplifier, the temperature compensator, and the intermediate frequency filter group are connected in series in sequence.

[0008] Furthermore, the intermediate frequency link also includes a third digitally controlled attenuator, which is arranged between the temperature compensator and the intermediate frequency filter group, and the temperature compensator, the third digitally controlled attenuator, and the intermediate frequency filter group are connected in series in sequence.

[0009] Furthermore, it also includes a cover plate, a metal frame, an HTCC substrate, a BGA pad, and solder balls; The radio frequency link, the mixing frequency link and the intermediate frequency link are arranged on the upper surface of the HTCC substrate, and a metal frame is arranged between the radio frequency link, the mixing frequency link and the intermediate frequency link for shielding, one end of the metal frame is welded to the upper surface of the HTCC substrate, and the other end of the metal frame is welded to the cover plate for airtight packaging; A BGA pad is arranged on the lower surface of the HTCC substrate, and a radio frequency link, a mixing frequency link and an intermediate frequency link are connected to the BGA pad on the lower surface of the HTCC substrate, and solder balls are planted on the BGA pad.

[0010] Furthermore, the radio frequency link, the mixing frequency link and the intermediate frequency link are bonded to the upper surface of the HTCC substrate by means of conductive adhesive.

[0011] Furthermore, it also includes gold wires, and the radio frequency link, the mixing frequency link and the intermediate frequency link are connected to the BGA pads on the lower surface of the HTCC substrate through multi-layer wiring and metallized vias using the gold wires.

[0012] Furthermore, the other end of the metal enclosure is hermetically sealed with the cover plate by parallel seam welding.

[0013] Furthermore, the solder balls implanted on the BGA pads are high-lead solder balls.

[0014] Beneficial effects: The present invention provides a miniaturized Ku-band down-conversion receiving component, which adopts a single-frequency conversion structure, simplifies circuit design, adopts a bare chip micro-assembly process for assembly, performs multi-layer wiring on an HTCC substrate, reduces the size of the component, and has an extremely high degree of integration; the present invention adopts a chip design concept and SiP packaging technology to achieve external interconnection through BGA, saves the space occupied by connectors and cables, and significantly reduces the size and weight of the module in multi-channel application scenarios; the present invention integrates a variety of intermediate frequency filters, can meet a variety of instantaneous bandwidth requirements, has a good universal design, and can also be equipped with different radio frequency and intermediate frequency filters to meet the requirements of different phased array radar receiving systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a principle block diagram of a miniaturized Ku-band down-conversion receiving component involved in an embodiment of the present invention; Figure 2 It is a device layout diagram of a miniaturized Ku-band down-conversion receiving component involved in an embodiment of the present invention (without the cover plate); Figure 3 is a cross-sectional view of a miniaturized Ku-band down-conversion receiving component according to an embodiment of the present invention; Figure 4 is a front view of a miniaturized Ku-band down-conversion receiving component according to an embodiment of the present invention; Figure 5 It is a bottom view of a miniaturized Ku-band down-conversion receiving component involved in an embodiment of the present invention.

[0016] Among them: 101 is a digitally controlled attenuator; 102 is an RF amplifier; 103 is an RF filter group; 104 is a local oscillator amplifier; 105 is an image rejection mixer; 106 is a bridge; 107 is an intermediate frequency filter; 108 is an intermediate frequency amplifier; 109 is a temperature compensator; 110 is an intermediate frequency filter group; 301 is a cover plate; 302 is a metal frame; 303 is a device that can be seen from the cross section of the frequency conversion component; 304 is a gold wire; 305 is a HTCC substrate; 306 is a high-lead solder ball. DETAILED DESCRIPTION

[0017] The preferred mechanism and implementation method of the present invention are further described below in conjunction with the accompanying drawings and specific implementation methods.

[0018] like Figures 1 to 5 As shown, an embodiment of the present invention discloses a technical solution for a miniaturized Ku-band down-conversion receiving component. Example 1

[0019] A miniaturized Ku-band down-conversion receiving component in this embodiment includes a radio frequency link, a mixing link, and an intermediate frequency link to realize the down-conversion function of the Ku-band signal; The radio frequency link includes a plurality of digitally controlled attenuators 101, a plurality of radio frequency amplifiers 102 and a radio frequency filter group 103, the input end of the first digitally controlled attenuator 101 is connected to the radio frequency input signal, and the first digitally controlled attenuator 101, the first radio frequency amplifier 102, the second digitally controlled attenuator 101, the radio frequency filter group 103 and the second radio frequency amplifier 102 are connected in series in sequence; The digitally controlled attenuator 101 completes the dynamic expansion function, the RF filter group 103 implements the pre-selection filter for the RF, the RF amplifier 102 implements the amplification of the RF signal, and amplifies the signal filtered by the RF filter group 103 and sends it to the mixer for mixing. In order to realize the functions of signal amplification, dynamic expansion and pre-selection filtering, amplifiers, digitally controlled attenuators and RF filter groups are necessary, but the above number is not necessarily required. More chips can also be used for implementation, but the size will be affected; if fewer amplifiers and digitally controlled attenuators are used, the link performance and the scalability of the dynamic expansion range will be affected. Among them, the RF filter group is the minimum number.

[0020] The mixing link includes a local oscillator amplifier 104, an image suppression mixer 105 and a bridge 106, the output terminal of the second radio frequency amplifier 102 is connected to the first input terminal of the image suppression mixer, the input terminal of the local oscillator amplifier 104 is connected to the local oscillator input signal, the output terminal of the local oscillator amplifier is connected to the second input terminal of the image suppression mixer 105, and the output terminal of the image suppression mixer 105 is connected to the input terminal of the bridge 106; The local oscillator amplifier 104 amplifies the externally input local oscillator signal to a power that meets the requirements of the mixer, thereby reducing the demand for local oscillator power in multi-channel applications; a miniaturized Ku-band down-conversion receiving component of the present invention realizes mixing of the radio frequency signal and the local oscillator signal through the image frequency suppression mixer 105 and the bridge 106, thereby achieving the purpose of improving the image frequency suppression of the primary frequency conversion component.

[0021] The intermediate frequency link includes a plurality of intermediate frequency filters 107, a plurality of intermediate frequency amplifiers 108, a temperature compensator 109 and an intermediate frequency filter group 110, the output end of the bridge 106 is connected to the input end of the intermediate frequency filter 107, the first intermediate frequency filter 107, the first intermediate frequency amplifier 108, the temperature compensator 109, the third digitally controlled attenuator 101, the intermediate frequency filter group 110, the second intermediate frequency amplifier 108 and the second intermediate frequency filter 107 are connected in series in sequence; The intermediate frequency filter 107 filters out the out-of-band spurious signals after mixing, the intermediate frequency amplifier 108 amplifies the intermediate frequency signal after mixing, the temperature compensator 109 provides gain compensation under high and low temperatures, the third digitally controlled attenuator 101 provides dynamic expansion, and the intermediate frequency filter group 110 realizes the switching function of different intermediate frequency bandwidths. Example 2

[0022] The connection method of this embodiment is basically the same as that of the first embodiment, except that it further includes a cover plate 301, a metal frame 302, an HTCC substrate 305, a BGA pad, a high-lead solder ball 306, and a gold wire 304; The RF link, the mixer link and the intermediate frequency link are bonded to the upper surface of the HTCC substrate 305 by conductive adhesive, and a metal enclosure 302 is arranged between the RF link, the mixer link and the intermediate frequency link to achieve shielding and improve the isolation between different links; one end of the metal enclosure 302 is welded to the upper surface of the HTCC substrate 305, and the other end of the metal enclosure 302 is welded to the cover plate 301 by parallel seam welding to achieve airtight packaging; A BGA pad is provided on the lower surface of the HTCC substrate 305. The RF link, the mixing link and the intermediate frequency link are connected to the BGA pad on the lower surface of the HTCC substrate 305 by gold wires 304 through multi-layer wiring and metallized vias. A high-lead solder ball 306 is planted on the BGA pad to achieve interconnection with the outside.

[0023] The present invention adopts single-frequency conversion to simplify the circuit structure. The mixer adopts an image frequency suppression mixer, which can still achieve image frequency suppression of more than 50dBc under the condition of using a small-size chip filter. In terms of structure, the components abandon the traditional component form and adopt SiP packaging technology to integrate a single channel into a miniaturized package. The external interface adopts BGA (ball grid array) to replace the traditional pluggable connector, saving the space occupied by the connector and the cable.

[0024] The invention has excellent telecommunication performance, small size, light weight, and good versatility. The size of a single channel of the invention is limited to 21mm×16mm×2.5mm, and the weight of a single channel is less than 10g. In the case of multi-channel application of radar system, compared with traditional frequency conversion components, the size of the invention is reduced by more than 50%, and the weight is reduced by more than 70%. It is very suitable for miniaturized phased array radar system, greatly improving the integration of phased array radar.

[0025] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A miniaturized Ku-band down-conversion receiving component, characterized in that: Including radio frequency link, mixing frequency link and intermediate frequency link; The radio frequency link comprises a plurality of digitally controlled attenuators, a plurality of radio frequency amplifiers and a radio frequency filter group, the input end of the first digitally controlled attenuator is connected to the radio frequency input signal, and the first digitally controlled attenuator, the first radio frequency amplifier, the second digitally controlled attenuator, the radio frequency filter group and the second radio frequency amplifier are connected in series in sequence; The mixing chain includes a local oscillator amplifier, a mixer and a bridge, the output end of the second radio frequency amplifier is connected to the first input end of the mixer, the input end of the local oscillator amplifier is connected to the local oscillator input signal, the output end of the local oscillator amplifier is connected to the second input end of the mixer, and the output end of the mixer is connected to the input end of the bridge; The intermediate frequency link includes several intermediate frequency filters, several intermediate frequency amplifiers and an intermediate frequency filter group. The output end of the bridge is connected to the input end of the intermediate frequency filter. The first intermediate frequency filter, the first intermediate frequency amplifier, the intermediate frequency filter group, the second intermediate frequency amplifier and the second intermediate frequency filter are connected in series in sequence.

2. A miniaturized Ku-band down-conversion receiving component according to claim 1, characterized in that: The mixer in the mixing chain is an image rejection mixer.

3. A miniaturized Ku-band down-conversion receiving component according to claim 1, characterized in that: The intermediate frequency link also includes a temperature compensator, which is arranged between the first intermediate frequency amplifier and the intermediate frequency filter group. The first intermediate frequency amplifier, the temperature compensator and the intermediate frequency filter group are connected in series in sequence.

4. A miniaturized Ku-band down-conversion receiving component according to claim 3, characterized in that: The intermediate frequency link also includes a third digitally controlled attenuator, which is arranged between the temperature compensator and the intermediate frequency filter group. The temperature compensator, the third digitally controlled attenuator and the intermediate frequency filter group are connected in series in sequence.

5. A miniaturized Ku-band down-conversion receiving component according to claim 1, characterized in that: It also includes cover plate, metal frame, HTCC substrate, BGA pad, and solder ball; The radio frequency link, the mixing frequency link and the intermediate frequency link are arranged on the upper surface of the HTCC substrate, and a metal frame is arranged between the radio frequency link, the mixing frequency link and the intermediate frequency link for shielding, one end of the metal frame is welded to the upper surface of the HTCC substrate, and the other end of the metal frame is welded to the cover plate for airtight packaging; A BGA pad is arranged on the lower surface of the HTCC substrate, and a radio frequency link, a mixing frequency link and an intermediate frequency link are connected to the BGA pad on the lower surface of the HTCC substrate, and solder balls are planted on the BGA pad.

6. A miniaturized Ku-band down-conversion receiving assembly according to claim 5, characterized in that: The radio frequency link, the mixing frequency link and the intermediate frequency link are bonded to the upper surface of the HTCC substrate by means of conductive adhesive.

7. A miniaturized Ku-band down-conversion receiving assembly according to claim 5, characterized in that: It also includes gold wires, and the radio frequency link, the mixing frequency link and the intermediate frequency link are connected to the BGA pads on the lower surface of the HTCC substrate through multi-layer wiring and metallized vias using the gold wires.

8. A miniaturized Ku-band down-conversion receiving assembly according to claim 5, characterized in that: The other end of the metal enclosure is hermetically sealed with the cover plate by parallel seam welding.

9. A miniaturized Ku-band down-conversion receiving assembly according to claim 5, characterized in that: The solder balls planted on the BGA pads are high-lead solder balls.

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