Electrical base assembly, camera module and manufacturing method thereof

Abstract

The invention provides an electrical base assembly, a camera module and a manufacturing method thereof, the electrical base assembly comprises a structure base, the structure base is provided with at least one installation opening, at least one control part is arranged corresponding to the installation opening, the control part further comprises at least one circuit board, at least a plurality of connection points are arranged on the surface of the circuit board, and the at least one connection point is arranged on the surface of the circuit board. The circuit part comprises a metal branch, the metal branch is provided with a plurality of connecting ends, and the connecting ends of at least part of the metal branch correspond to the surface of the circuit board and are overlapped with the projections of the connecting points of the circuit board in the spatial position.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and more specifically to an electrical base assembly, a camera module and a manufacturing method thereof. Background Art

[0002] With the rapid development of mobile electronic devices, especially smartphones and tablets, camera modules have become an indispensable core component of these devices. Users have an increasing demand for camera modules, requiring not only high resolution and high performance, but also miniaturization, lightness and compact design. In this context, camera modules have become a key technology to meet these needs because they can achieve telephoto shooting and reduce size by folding the optical path. However, traditional camera modules usually use independent circuit boards for conduction. This design takes up relatively large space, and the installation position and method of the circuit board are complicated, which limits the further miniaturization and integration of the camera module. At the same time, it is easy to cause circuit damage during the assembly process of the circuit board and the base or housing.

[0003] In addition, with the development of camera module technology, its application in smart phones, security monitoring, drones, autonomous driving and other fields is becoming more and more extensive, and the resolution, dynamic range and night vision capabilities continue to improve. Multi-camera combination design has become the mainstream, and the combination of wide-angle, ultra-wide-angle, telephoto and macro lenses can improve shooting flexibility and image quality. AI algorithm integration realizes scene recognition, autofocus, beauty and other functions, which improves user experience. However, the number and complexity of the structural parts (such as bases, brackets) and electronic devices (such as circuit boards, driver chips, etc.) of the camera module will increase, and the integration of the devices will directly affect a series of problems such as product size, assembly consistency and reliability. Summary of the invention

[0004] The present application aims to provide an electrical base assembly and a camera module thereof, wherein the circuit board is arranged on the outside of the electrical base, which can improve the welding yield and reduce the production cost.

[0005] The present application aims to provide an electrical base assembly and a camera module thereof, which simplify the welding process through a circuit board conduction solution, improve production efficiency and cost-effectiveness, so as to achieve higher circuit integration, smaller volume occupancy and higher reliability.

[0006] The present application aims to provide an electrical base assembly and a camera module thereof to meet the requirements of mobile electronic devices for miniaturization and high performance of camera modules.

[0007] Specifically, the present application arranges the electrical components of the control part such as the circuit board and the driver chip on the outside or outer surface of the electrical base, and installs them after the electrical base is injection molded, thereby reducing the risk of deformation of the control part, improving the assembly flatness of the circuit board and the driver chip, and reducing the difficulty of installation. In addition, the connection point of the control part overlaps with the connection end projection of the circuit component, reducing the difficulty of conducting the connection and improving the production yield.

[0008] The present application provides an electrical base assembly, comprising: a structural base, the structural base having at least one mounting opening, at least one control unit being arranged corresponding to the mounting opening, the control unit further comprising at least one circuit board, at least a plurality of connection points being arranged on the surface of the circuit board, and a circuit unit comprising a metal branch, the metal branch having a plurality of connection ends, at least some of the connection ends of the metal branch corresponding to the surface of the circuit board and overlapping with the connection points of the circuit board in terms of spatial position.

[0009] The present application provides a camera module, which further includes a lens assembly, a photosensitive assembly and an optical path turning assembly.

[0010] The present application provides a camera module, which further includes a shell and further includes a bracket. The bracket has an avoidance area, and the avoidance area corresponds to the photosensitive component.

[0011] The present application also provides a method for manufacturing an electrical base assembly, comprising the following steps:

[0012] S1: providing a circuit part, the circuit part comprising a metal branch, the metal branch having a plurality of connection ends, and forming a structural base by injection molding on the circuit part, wherein the structural base has at least one mounting opening, the mounting opening is located on a side wall of the structural base, and at least part of the connection ends are exposed at the mounting opening;

[0013] S2: Provide a control part, and install the control part on the side wall through the installation opening, wherein the control part includes a circuit board, the edge of the circuit board has a plurality of connection points, and the connection points and the connection ends of at least part of the metal branches overlap and are conductive in spatial position.

[0014] Furthermore, in the manufacturing method of the electrical base assembly:

[0015] In S1: the circuit portion is injection molded to form a first injection molded portion, and the second injection molded portion is further injection molded around the first injection molded portion and the circuit portion to form the structural base.

[0016] Furthermore, the manufacturing method of the electrical base assembly further comprises the following steps:

[0017] S3: The first injection molding part includes a first mounting part, a second mounting part and a third mounting part formed on the side wall, wherein the second mounting part and the third mounting part are positioned opposite to each other and the mounting opening is located at the third mounting part; and the coil of the electronic component is installed on the first mounting part and the second mounting part.

[0018] In S3, the control unit is installed on the third installation portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The objectives, technical solutions and beneficial effects of the invention described above can be achieved through the following drawings:

[0020] Figure 1 A schematic diagram of the three-dimensional structure of a camera module of the present application.

[0021] Figure 2 This is a schematic structural diagram of a shell separation of a camera module in the present application.

[0022] Figure 3 This is a structural schematic diagram of another perspective of a camera module shell separation in the present application.

[0023] Figure 4 The present invention discloses a schematic diagram of the structure of an electrical base of a camera module with a circuit board and a coil.

[0024] Figure 5 This is a structural schematic diagram of an electrical base of a camera module of the present application from another perspective.

[0025] Figure 6 This is a schematic diagram of the structure of an electrical base of a camera module in the present application.

[0026] Figure 7 for Figure 4 A magnified view of the outer part at A.

[0027] Figure 8 for Figure 4 Magnified view of the inner part at A.

[0028] Fig.9A A schematic diagram of an implementation method of assembling a control unit of a camera module of the present application.

[0029] Fig. 9B A schematic diagram of an implementation method of assembling an electrical base and a control unit of a camera module of the present application.

[0030] Fig. 10A This is a schematic diagram of an implementation method of assembling an electrical base and a control unit of a camera module of the present application.

[0031] Fig. 10BThis is a schematic diagram of an implementation method of assembling an electrical base and a control unit of a camera module of the present application.

[0032] Fig.11A This is a schematic diagram of an implementation method of assembling an electrical base and a control unit of a camera module of the present application.

[0033] Fig. 11B This is a schematic diagram of an implementation method of assembling an electrical base and a control unit of a camera module of the present application.

[0034] Fig.12 This is a schematic diagram of the circuit portion of a camera module of the present application.

[0035] Fig.13 A schematic diagram showing the circuit portion of a camera module according to the present application from another perspective.

[0036] Fig.14 for Fig.12 Enlarged view of the dorsal view at D.

[0037] Description of main symbols

[0038] 1. Electrical base assembly; 2. Camera module; 10. Shell; 11. Shell; 111. Shell cover wall; 112. Shell side wall; 113. Bending portion; 114. Buckle hole; 12. Bracket; 121. Avoidance area; 122. Avoidance area connection portion; 101. Cover portion; 102. Side wall portion; 103. Installation space; 104. Light inlet; 105. Light outlet; 106. Inner surface; 107. Outer surface; 108. Spacing space; 109. Protective film; 20. Electrical base; 200. Structural base; 201. Accommodation space; 202. Peripheral side wall; 203. Installation window; 204. Installation frame ; 2041, mounting foot; 205, buckle; 206, bottom wall; 207, inner side wall; 2071, first side wall; 2072, second side wall; 2073, third side wall; 208, mounting area; 2081, mounting opening; 21, first injection molding part; 210, mounting part; 211, first mounting part; 2111, first peripheral wall; 2112, first bottom plate; 212, second mounting part; 2121, second peripheral wall; 2122, second bottom plate; 213, third mounting part; 2131, third peripheral wall; 22, second injection molding part; 221, prism base; 222, lens base; 3 0, circuit unit; 301, port; 3011, first port; 3012, second port; 31, metal branch; 310, connection end; 311, first branch; 3111, first connection end; 3112, first extension section; 312, second branch; 3121, second connection end; 3122, second extension section; 3123, second connection section; 313, third branch; 3131, third connection end; 3132, third extension section; 3133, third connection section; 314, fourth branch; 3141, fourth connection end; 3142, fourth extension section; 3143, fourth connection section; 315, branch circuit Container; 40, control unit; 41, circuit board; 411, electronic component; 412, conductive medium; 413, first surface; 414, second surface; 42, driving chip; 43, connection point; 431, first connection point; 432, second connection point; 433, third connection point; 434, fourth connection point; 50, electronic component; 51, first electronic component; 511, first anti-shake coil; 512, second anti-shake coil; 52, second electronic component; 521, focus coil; 60, lens component; 70, photosensitive component; 71, mounting seat; 72, connecting plate; 73, connecting belt; 80, optical path turning component. DETAILED DESCRIPTION

[0039] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0040] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0041] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0042] The terms "including" and "having" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0043] It should be noted that, as used in this application, the terms "substantially", "approximately" and similar terms are used as terms to express approximation rather than as terms to express degree, and are intended to account for the inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0044] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] Please also see Figures 1 to 3A specific embodiment of the present application provides an electrical base assembly 1 and a camera module 2, wherein the electrical base assembly 1 includes an electrical base 20, a circuit unit 30, a control unit 40 and an electronic assembly 50, and the camera module 2 includes a housing 10, a lens assembly 60, a photosensitive assembly 70 and at least one optical path turning assembly 80, wherein the circuit unit 30 is used to achieve electrical conduction between the electrical base 20, the photosensitive assembly 70, the control unit 40 and the optical path turning assembly 80. The housing 10 includes a shell 11 and a bracket 12, wherein the bracket 12 is a four-sided three-dimensional frame structure with a central hollow, and at least one shell 11 is disposed on the bracket 12 and covers at least part of the central hollow portion of the bracket 12. In some optional embodiments, the shell 11 has a shell side wall 112 extending downward and is surrounded by the four-sided three-dimensional frame of the bracket 12, and the main body of the shell 11 is located in the central hollow portion of the bracket 12. In some optional embodiments, the housing 11 has at least one light inlet 104 for receiving light and corresponding to the light path turning component 80 .

[0046] In one embodiment of the production and manufacturing of the shell 10 of the present application, the shell 11 and the bracket 12 of the shell 10 are integrally formed, that is, the shell 11 and the bracket 12 are integrally formed using the same material, wherein the material can be a high-strength plastic material or a metal material.

[0047] In some optional embodiments, the shell 11 and the bracket 12 of the housing 10 are integrally formed, that is, the material used to produce the two is the same material, and the molding can be achieved through multiple molding processes. In some embodiments, the structural connection between the shell 11 and the bracket 12 can be an integrated connection in a physical sense, that is, the shell 11 and the bracket 12 can be a whole in structure, but can be made of different materials, such as being processed as a whole through an embedded injection molding process.

[0048] In one embodiment of the production and manufacture of the shell 10 of the present application, the shell 11 and the bracket 12 are made of the same metal material, and the shell 10 is formed in one piece using a metal material molding process. Specifically, it can be achieved by a variety of molding processes such as integrated die casting, metal casting, metal forging, metal stamping, powder metallurgy, metal injection molding (MIM), stretching or secondary stretching. Among them, the metal materials that can be used include but are not limited to metal materials such as steel-containing materials, aluminum alloys, phosphor bronze, titanium alloys, iron-based materials, zinc alloys, magnesium alloys, tin-based alloys and copper alloys. In particular, the steel-containing material can be but is not limited to stainless steel, SPCC (Steel Plate Cold Commercial, cold-rolled carbon steel sheet), etc.

[0049] In an optional embodiment of the present application, a method for manufacturing a housing 10 is described in detail, which is particularly suitable for producing a lightweight and structurally stable camera module housing. Specifically, aluminum alloy, especially aluminum-magnesium alloy, is preferred as a manufacturing material, which is widely recognized for its light weight and high strength. By adopting aluminum alloy integrated die-casting technology, the housing 11 and the bracket 12 can be formed into a complete housing 10 at one time. Such a process not only simplifies the production process, but also maximizes cost-effectiveness by reducing material usage and processing steps. Furthermore, the excellent mechanical properties of aluminum alloy, including its high strength and good toughness, enable the final produced housing 10 to have excellent mechanical strength and durability while maintaining lightness. The integrated design also allows the optional embodiment to consider the integration of multiple functions at the design stage, further improving the functionality and integration of the housing 10, so that the camera module has been significantly improved in terms of space utilization and operating efficiency. It can be understood that this manufacturing method not only optimizes the physical properties of the product, but also reduces the manufacturing cost by reducing the production links, providing an economical and efficient solution for the large-scale production of camera modules.

[0050] In the present application, the housing 10 includes a cover portion 101 and a side wall portion 102. The cover portion 101 can cover at least a portion of the internal structure of the camera module 2, and the side wall portion 102 is suitable for surrounding at least a portion of the periphery of the structural base 200. Further, at least one protective film 109 is disposed at a top edge position on one side of the cover portion 101. The top edge of the side of the cover portion 101 is a side away from the light outlet 105 and close to the light inlet 104. The protective film 109 is used to cover the light inlet 104. Figure 3 As shown, in some optional embodiments, a spacing space 108 may be formed between the shell 11 and the bracket 12, and the photosensitive component 70 is disposed in the installation space 103 of the shell 10 and may be exposed through the spacing space 108 to reduce the risk of interference when assembling the shell 10 and the photosensitive component 70 and other devices.

[0051] Understandably, reference Figure 3 As shown, in the present application, the housing 11 further includes a housing cover wall 111, at least two housing side walls 112, a bending portion 113 and a plurality of snap holes 114. The bending portion 113 connects the housing cover wall 111 and the housing side wall 112 which are perpendicular to each other, the housing cover wall 111 is limitedly extended in the horizontal direction to be a rectangular plane, and the housing side wall 112 extends in a direction perpendicular to the surface where the housing cover wall 111 is located. It can be understood that the housing cover wall 111 and the housing side wall 112 are connected at both ends of the inclined plane of the bending portion 113 to form the housing 11 as a whole. Figure 2As shown, a plurality of snap holes 114 are formed on the shell side wall 112, which can be used to reduce molding stress when the shell 11 is injection molded or molded on the bracket 12. In some optional embodiments, the shape of the snap hole 114 can be adapted to the buckle 205 for fixation.

[0052] In the present application, the shell 10 has an inner surface 106 and an outer surface 107, the inner surface 106 is the inner side facing the inside of the camera module 2, and the outer surface 107 is the outer side facing the outside of the camera module 2, and an inner connection structure is formed between the inner surface 106 and at least one internal structure of the camera module 2. When the shell 10 and the structural base 200 are fixed, the inner connection structure is formed between the inner surface 106 and the structural base 200, so that the camera module 2 forms a whole. The inner surface 106 is defined by the inner surface of the outer shell 11 and the inner surface of the bracket 12, and the outer surface 107 is defined by the outer surface of the outer shell 11 and the outer surface of the bracket 12. Among them, the light inlet 104 is a square opening hollowed out by the outer surface 107 at the top of the outer shell cover wall 111. The light inlet 104 is located at an end of the cover portion 101 away from the partition space 108 , and the light outlet 105 is located at an end of the cover portion 101 close to the partition space 108 .

[0053] refer to Figures 4 to 8 In the present application, the electrical base 20 is designed as a peripheral structure for arranging electrical components therein, and coils, lenses, brakes, circuit elements, etc. are arranged or installed inside. The electrical base 20 further includes a structural base 200, a first injection molding part 21, and a second injection molding part 22. The electrical base 20 can be assembled with the housing 10 to form a complete peripheral frame of the camera module 2, which is used for protection or further installation. The electrical base 20 forms at least one receiving space 201, and the receiving space 201 can further be used to arrange the lens assembly 60 and the optical path turning assembly 80 and the first anti-shake coil 511, the second anti-shake coil 512, the focus coil 521, and related sensing elements in the receiving space 201. The first injection molding part 21 is used to form the relevant installation part of the electrical components required by the camera module 2 and is coated with at least part of the circuit part 30. The structural base 200 is mainly used to form at least part of the installation area for the internal components of some camera modules 2.

[0054] The first injection molding part 21 includes a mounting part 210 and a fixing part (not shown). In some embodiments, the electrical base 20 is not limited to being formed by one injection molding, but can be formed by multiple injection molding. In an optional embodiment, the second injection molding part 22 is further formed by injection molding based on the injection molding of the first injection molding part 21.

[0055] It can be understood that in this embodiment, the structural base 200 is a hollow structure in the middle surrounded by at least three side walls and sealed at the bottom, and the extension direction of the three side walls is perpendicular to the plane where the bottom is located. The structural base 200 includes at least three peripheral side walls 202, wherein the peripheral side walls 202 are the side walls of the structural base 200 facing the outside of the camera module 2, and the inner peripheral side wall 207 is the inner side wall of the structural base 200 relative to the peripheral side wall 202. Further, the rectangular hollow receiving space 201 formed by the structural base 200 is surrounded by the inner peripheral side wall 207. The bottom of the structural base 200 is sealed by a roughly rectangular bottom wall 206, that is, the rectangular hollow receiving space 201 of the structural base 200 for electrical components is composed of at least three inner peripheral side walls 207 and the bottom wall 206. It can be understood that the plurality of buckles 205 are distributed on the outer surface of the peripheral side wall 202 . In some optional embodiments, the contours of the plurality of buckles 205 match the plurality of buckle holes 114 , that is, the plurality of buckles 205 and the plurality of buckle holes 114 can be buckled together.

[0056] The structural base 200 further includes a mounting frame 204 , which is a quadrilateral frame structure, and at least two mounting legs 2041 are placed above the left and right sides of the mounting frame 204 . Furthermore, the quadrilateral structure formed by the mounting frame 204 encloses a mounting window 203 .

[0057] It can be understood that in the present application, at least part of the connecting plate 72 of the photosensitive component 70 is accommodated in the frame structure of the mounting seat 71. Among them, a connecting strip 73 can be extended from the end side of the connecting plate 72 for conducting with other external electronic devices or circuit components.

[0058] In this embodiment, the structural base 200 is a three-dimensional frame structure, and the structural base 200 includes an inner peripheral side wall 207, and the inner peripheral side wall 207 further includes a first side wall 2071 and a third side wall 2073 extending in a vertical direction from the bottom wall 206 and arranged opposite to each other, and the inner peripheral side wall 207 also includes a second side wall 2072, and the second side wall 2072 and the bottom wall 206, the first side wall 2071 and the third side wall 2073 are all arranged vertically and face the opposite side of the installation frame 204, that is, the second side wall 2072 faces the installation window 203. The first side wall 2071, the second side wall 2072 and the third side wall 2073 are connected in sequence.

[0059] In the present application, the first injection molding part 21 further includes a first mounting part 211, a second mounting part 212 and a third mounting part 213. The first mounting part 211 is located on the second side wall 2072, and the first mounting part 211 includes a first peripheral wall 2111 and a first bottom plate 2112. The second mounting part 212 is located on the third side wall 2073, and the second mounting part 212 includes a second peripheral wall 2121 and a second bottom plate 2122. The third mounting part 213 is disposed on the first side wall 2071, and the third mounting part 213 includes a third peripheral wall 2131.

[0060] In some embodiments, part of the structure base 200 is further injection molded by the second injection molding part 22 on the basis of the first injection molding part 21, the electrical components, and the remaining circuit part 30 and other related electrical components. Specifically, the second injection molding part 22 is further injection molded to form a prism base 221 and a lens base 222 during the injection molding process. The prism base 221 and the lens base 222 are used to form a space for accommodating at least part of the lens assembly 60 and the optical path turning assembly 80.

[0061] In this application, see Figures 2 to 13 As shown, the outer peripheral side wall 202 of the structural base 200 is designed with a special mounting opening 2081. It can be understood that the mounting opening 2081 is a square structure adapted to the control unit 40. The mounting opening 2081 first selects a square mounting structure, but in more embodiments, the shape of the mounting opening 2081 is not limited, and is mainly determined by the shape change of the control unit 40.

[0062] Further, the mounting opening 2081 is used to mount the circuit board 41 to the side wall of the structural base 200. Specifically, the circuit board 41 is disposed on the side wall of the structural base 200 through the mounting opening 2081 and is electrically connected to at least a portion of the circuit portion 30 inside the structural base 200. The connection end 310 of a portion of the metal branch 31 of the circuit portion 30 corresponds to the surface of the circuit board 41 and overlaps with the connection point 43 of the circuit board 41 in spatial position, so as to achieve precise one-to-one alignment and facilitate conductive connection.

[0063] In this embodiment, at least one control unit 40 is disposed in the mounting opening 2081 corresponding to the electrical base 20, and at least part of the connection points 43 of the control unit 40 corresponding to the electrical base 20 are injection molded to form the third mounting portion 213. Specifically, the mounting opening 2081 is a rectangular window. Further, the control unit 40 includes at least one circuit board 41 and at least one driving chip 42 disposed on the circuit board 41 and a plurality of connection points 43 corresponding to the connection terminals 310, and the circuit board 41 is placed in the center of the window frame of the mounting opening 2081.

[0064] In this application, see Figures 2 to 13 As shown, the third mounting portion 213 has a third peripheral wall 2131, which is formed by the first injection molding. The thickness of the third peripheral wall 2131 is greater than the thickness of the control portion 40, and is used to accommodate the control portion 40 in the window frame of the mounting opening 2081 to avoid external collision damage. The peripheral wall formed by the third peripheral wall 2131 is the rectangular window frame of the mounting opening 2081, that is, the rectangular window frame of the mounting opening 2081 is surrounded by the third peripheral wall 2131.

[0065] refer to Figures 9A-11B As shown, the structural base 200 has a mounting area 208, and a mounting opening 2081 is further formed in the mounting area 208. The mounting opening 2081 is used to mount the circuit board 41. The circuit board 41 has a first surface 413 and a second surface 414 opposite to each other along the direction in which the main plane extends. The main plane means the surface on which the circuit board 41 is routed and provided for surface attachment. The first surface 413 faces the outside of the structural base 200, while the second surface 414 faces the inside of the structural base 200.

[0066] refer to Fig.9A As shown, the driver chip 42 is disposed on the second surface 414 , and a plurality of connection points 43 are disposed on the second surface 414 . In some optional embodiments, the connection points 43 are arranged on the periphery of the second surface 414 and surround the driver chip 42 .

[0067] refer to Fig. 9B As shown, the driver chip 42 is disposed on the first surface 413, and a plurality of connection points 43 are disposed on the second surface 414. In some optional embodiments, the connection points 43 are arranged on the periphery of the second surface 414. This solution can provide more arrangement positions of the connection points 43, and in some solutions, the connection points 43 can be arranged for line expansion to further improve the conduction efficiency.

[0068] The metal branch 31 of the circuit portion 30 has a plurality of connection ends 310 extending to positions corresponding to the connection points 43 of the second surface 414 .

[0069] Furthermore, the installation area 208 of the structural base 200 is closed, that is, the part of the installation area 208 facing the inner side of the structural base 200 is closed to further isolate the external dirt from entering. At the same time, in some optional embodiments, the connection end 310 can be arranged for line expansion in the area corresponding to the connection point 43, that is, the conduction area for electrically connecting the connection point 43 and the connection end 310 is further expanded to better improve the conduction efficiency and yield.

[0070] refer to Fig. 10A As shown, the driver chip 42 is disposed on the first surface 413, and a plurality of connection points 43 are disposed on the first surface 413. In some optional embodiments, the connection points 43 are arranged on the periphery of the first surface 413 and surround the driver chip 42. The metal branch 31 of the circuit portion 30 has a plurality of connection ends 310 extending to the corresponding positions of the connection points 43 on the first surface 413.

[0071] refer to Fig.11A As shown, the driver chip 42 is disposed on the second surface 414, and a plurality of connection points 43 are disposed on the first surface 413. In some optional embodiments, the connection points 43 are arranged on the periphery of the first surface 413 and surround the driver chip 42. The metal branch 31 of the circuit portion 30 has a plurality of connection ends 310 extending to the corresponding positions of the connection points 43 on the first surface 413.

[0072] For further reference, Fig. 10B and 11B As shown, the installation area 208 of the structural base 200 is closed, that is, the part of the installation area 208 facing the outside of the structural base 200 is closed to further isolate the external dirt from entering. At the same time, in some optional embodiments, the connection end 310 can be arranged for line expansion in the area corresponding to the connection point 43, that is, the conduction area between the connection point 43 and the connection end 310 is further expanded to better improve the conduction efficiency and yield.

[0073] In the present application, the connection point 43 of the circuit board 41 of the control unit 40 and at least one connection end 310 of the circuit unit 30 can be electrically connected to the surface by direct attachment. In some embodiments of the present application, the connection end 310 is implemented as a first connection end 3111, a second connection end 3121, a third connection end 3131 and a fourth connection end 3141. Further, the connection point 43 and the connection end 310 are connected through a conductive medium 412. It can be understood that this surface direct attachment connection method not only improves the stability of the electrical connection, but also has a higher tolerance for the manufacturing tolerance of parts and the quality of incoming materials, thereby reducing the defective rate in the production process. Specifically, in an optional embodiment, a variety of conduction technologies can be used, including solder paste welding technology, which uses special solder paste to accurately align and fix the chip with the circuit board 41, ensuring the reliability and long-term stability of the electrical connection. Conductive glue conduction technology can also be used, which uses the dual functions of bonding and conduction of conductive glue to fix the chip and realize the transmission of electrical signals. In addition, flip chip ball implantation is also an optional connection method, which realizes electrical connection by implanting tiny metal balls between the chip and the circuit board 41. This process is suitable for high-precision and high-density circuit design.

[0074] Furthermore, the circuit board 41 of the control unit 40 and any of the first connection terminal 3111, the second connection terminal 3121, the third connection terminal 3131 and the fourth connection terminal 3141 of the circuit unit 30 are electrically connected face to face by direct attachment, and finally the driving chip 42 disposed on the circuit board 41 can be electrically connected with electrical components such as coils and position sensing devices. It can be understood that such a configuration allows the driving chip 42 to control the current size and direction in the coil according to the feedback of the sensing structure to achieve precise motion control.

[0075] Specifically, the connection point 43 may be disposed on the first surface 413 or the second surface 414 of the circuit board 41. It is understandable that in some optional embodiments, the connection point 43 may be disposed on the same side as the driver chip 42 or on a different side from the driver chip 42.

[0076] Furthermore, the connection point 43 has a substrate structure with a relatively higher flatness or a larger line width than the circuit board 41, and can be processed by pre-routing or expanding the wiring layout, or by using an additive method or a semi-additive method to form a circuit board 41 with higher flatness and line accuracy. This facilitates the conduction consistency and yield rate to be higher when the circuit board 41 and the connection end 310 of the circuit unit 30 are connected.

[0077] In an optional embodiment, the driver chip 42 is placed toward the outside of the structural base 200, that is, in the present application, the driver chip 42 is placed on the first surface 413 of the circuit board 41. Compared with the traditional inwardly arranged chip, this design significantly reduces the risk of collision and contact between the internal components of the camera module 2 and the driver chip 42 and other electrical components during the assembly process, especially in the application scenario where the lens assembly and motor installation need to be performed inside the base in the present application. Since the motor itself has an active gap, the internal components are easy to touch the driver chip 42 during the activity or assembly process, so the present application effectively avoids this situation, thereby improving the reliability and efficiency of the assembly.

[0078] Furthermore, the present application achieves a dual improvement in cost-effectiveness and assembly convenience by utilizing the space of the structural base 200. Since the structural base 200 itself is relatively strong and thick, by designing a depression or groove in the area corresponding to the mounting portion 210, additional space is provided for the control unit 40, which saves materials and simplifies the assembly process. In some embodiments, the driver chip 42 can be completely exposed in the hollow groove (i.e., the corresponding mounting portion) of the structural base 200, and the anti-collision performance is enhanced by subsequent glue fixation. This design not only reduces the demand for internal space of the base, but also reduces the overall assembly cost, while improving the durability and stability of the product.

[0079] In the present application, the circuit board 41 may also be referred to as a printed circuit board (PCB) in the art. The circuit board 41 may be made of a rigid circuit board or a flexible circuit board, or a rigid-flexible composite circuit board. Rigid circuit boards are usually made of multiple layers of copper foil and insulating materials pressed together at high temperature, and have good mechanical strength and stability; while flexible circuit boards use flexible substrates, such as polyimide (PI), which are made through printing and etching processes and can adapt to complex spatial layouts. Composite circuit boards combine the advantages of rigid and flexible circuit boards and are suitable for application scenarios with special requirements for space and shape.

[0080] It can be understood that in this embodiment, the driver chip 42 can adopt a variety of different packaging technologies to adapt to different application requirements. For example, the driver chip 42 can be packaged in a dual in-line package (DIP), which is widely used because of its strong packaging, automated production, low cost, and the ability to be plugged into a circuit board using a socket. In addition, the driver chip 42 can also adopt a surface mount package (SMT), which allows the leads to be led out from the side of the package, so that the number of leads is large, up to more than sixty, which is very suitable for application scenarios requiring high-density integration.

[0081] Furthermore, in an optional embodiment, the bracket 12 further has an avoidance area 121 and an avoidance area connecting portion 122, wherein the avoidance area 121 corresponds to the area of ​​the photosensitive component 70, and the avoidance area 121 further avoids the photosensitive component 70 to reduce the risk of interference during assembly of the photosensitive component 70, and is further used to avoid the photosensitive component 70 including at least one connecting belt 73 from extending out.

[0082] See also Figure 12 to Figure 14 In the present application, the circuit portion 30 includes a port 301 and a plurality of metal branches 31, the port 301 further includes a plurality of first ports 3011 and a plurality of second ports 3012, the plurality of metal branches 31 include a plurality of first branches 311, a plurality of second branches 312, a plurality of third branches 313, and a plurality of fourth branches 314. The first port 3011 and the second port 3012 are branch extension ports through which the first branch 311 and the second branch 312 are electrically connected to other electronic devices and extended to the outside, and are used to connect to an external circuit.

[0083] Specifically, the first side wall 2071 is embedded with a plurality of first branches 311, and the plurality of first branches 311 are arranged at intervals along the height direction of the side wall. Each first branch 311 includes a first connection end 3111. One end of the first connection end 3111 of the plurality of first branches 311 is correspondingly connected to the first connection point 431 on the connection point 43 by welding, and the other end forms a first port 3011 corresponding to the number thereof, and the first port 3011 is installed close to the side end of the mounting frame 204 and exposed to the outside of the peripheral side wall 202, and is used to connect with an external circuit (not marked). Specifically, the plurality of first ports 3011 and the plurality of first connection ends 3111 are correspondingly connected through a plurality of first extension sections 3112 that are opposite to each other. It can be understood that the first connection point 431 is fixed to a side edge of the circuit board 41 of the circuit board 41 close to the mounting frame 204, and is also fixed to the surface of the circuit board 41.

[0084] The second branch 312 and the first branch 311 are respectively arranged at opposite ends of the side of the installation frame 204, and a plurality of second connection terminals 3121 are arranged in a line interval and embedded in the first side wall 2071, and the port 301 is exposed to the installation opening 2081. Each second branch 312 includes a corresponding second extension section 3122, and the second extension sections 3122 of the second branches 312 are embedded in the bottom wall 206. The second branch 312 also includes a plurality of second connecting sections 3123, and the terminal ports of the plurality of second connecting sections 3123 constitute the corresponding number of second ports 3012, and the number of ports of the second ports 3012 is consistent with the number of ports of the second connection terminals 3121. The side end of the second port 3012 close to the installation frame 204 is exposed outside the peripheral side wall 202, parallel to the position of the first port 3011, and is used to connect with an external circuit (not shown). The second connection point 432 is fixed to the second side of the circuit board 41 which rotates counterclockwise around the circuit board 41 with the first connection point 431 as the starting point. It can be understood that the third connection point 433 is fixed to the third side of the circuit board 41 which rotates counterclockwise around the circuit board 41 with the first connection point 431 as the starting point; and the fourth connection point 434 is fixed to the fourth side of the circuit board 41 which rotates counterclockwise around the circuit board 41 with the first connection point 431 as the starting point.

[0085] The third branch 313 further includes a plurality of third connection ends 3131 and a plurality of third extension sections 3132. The third connection end 3131 is embedded in the first side wall 2071, and the plurality of third extension sections 3132 are respectively embedded in the bottom wall 206 and the second side wall 2072. It can be understood that the third connection end 3131, the third extension section 3132 and the third connecting section 3133 are connected in sequence to form a continuous path. The free end of the third connection end 3131 is welded and electrically connected to the third connection point 433 on the connection point 43. The third extension section 3132 connects the third connection end 3131 and the third connecting section 3133, and the other end of the third connecting section 3133 of at least part of the third branch 313 forms a welding end (not marked), which is used to be welded with the first sensing element (not marked) and the first anti-shake coil 511 on the second side wall 2072. There is a third connecting section 3133 which is electrically connected to the branch capacitor 315 and then electrically connected to the first sensing element.

[0086] The fourth branch 314 further includes a plurality of fourth connection ends 3141, a plurality of fourth extension sections 3142 and a plurality of fourth connecting sections 3143. The fourth connection ends 3141 are embedded in the first side wall 2071, and the plurality of fourth extension sections 3142 are respectively embedded in the bottom wall 206 and the third side wall 2073. The connecting ends of the plurality of fourth branches 314 are arranged at intervals and embedded in the first side wall 2071. The fourth connection ends 3141, the fourth extension sections 3142 and the fourth connecting sections 3143 are connected in sequence to form a continuous circuit path. The fourth connection ends 3141 of the plurality of fourth branches 314 are provided with welding feet (not shown) at their free ends, and these welding feet are used to be welded with the fourth connection points 434 on the connection points 43. At least some of the fourth connecting sections 3143 are provided with welding ends (not shown), and these welding ends are used to be welded with the second sensing element (not shown) and the focusing coil 521 on the third side wall 2073. It can be understood that at least part of the fourth connecting section 3143 also serves as at least part of the second weld, and the second weld formed by the fourth connecting section 3143 is parallel to the corresponding second weld formed by the at least part of the second connecting section 3123 in the vertical direction, that is, the second weld formed by the fourth connecting section 3143 is placed parallel and above the corresponding second weld formed by the at least part of the second connecting section 3123.

[0087] With the light outlet 105 as a reference, the photosensitive sensor (not marked) of the photosensitive component 70 faces the light outlet 105, and the first electronic component 51 of this embodiment is located on the opposite back side of the photosensitive component 70. The first sensing element (not marked) is used to sense the state of the photosensitive component 70 (for example, a prism) in real time. The driver chip 42 detects the positioning of the photosensitive component 70 from multiple angles based on the electrical signal provided by the first electronic component 51, and then determines the control parameters applied to the first anti-shake coil 511 based on the position information, including the magnitude and direction of the current, to control the current and drive the first anti-shake coil 511. At the same time, the position of the photosensitive component 70 is feedback-controlled using these determined control parameters to achieve control of the optical anti-shake function of the photosensitive component 70.

[0088] The second sensing element (not shown) is located opposite to the driving chip 42 and is responsible for detecting the position of the lens assembly 60. According to the position information obtained by the second sensing element, the second sensing element transmits a corresponding current to the corresponding focusing coil 521 to drive the lens to move, realize functions such as zooming or focusing, and then adjust the focal length or focal length.

[0089] It can be understood that in the present application, the circuit board 41 is installed after the structural base 200 is manufactured. This can effectively prevent the circuit board 41 from being subjected to impact force during the injection molding process, thereby avoiding deformation or breakage, and ensuring that the flatness of the circuit board 41 is not affected.

[0090] The circuit board 41 is provided with a plurality of connection points 43, which match the connection ends 310 of each branch of the metal branch 31 to achieve a conductive connection between the circuit board 41 and the control unit 40. It can be understood that in order to install the circuit board 41, it is necessary to accurately align the connection points 43 on the circuit board 41 with the connection ends 310 of each metal branch 31, and then position the circuit board 41 to the installation area 208, and fix the connection points 43 and the connection ends 310 to ensure that the circuit board 41 is firmly installed on the peripheral side wall 202, and at the same time achieve a conductive connection with the circuit unit 30 and the corresponding electrical components.

[0091] It can be understood that in the specific implementation of the present application, the realization of the conductive connection involves a variety of technical solutions, including but not limited to brush tin connection, CSP packaging and BGA packaging. Brush tin connection is a traditional electronic connection method, and its implementation steps include stripping the wire and removing the oxide, and then using a soldering iron and solder to connect to ensure the stability and reliability of the circuit. CSP packaging technology, that is, chip-scale packaging, is known for its extreme miniaturization characteristics. The size of the package body usually does not exceed 20% of the size of the chip itself, effectively saving space and promoting the miniaturization of electronic products. BGA packaging technology, that is, ball grid array packaging, arranges spherical solder joints at the bottom of the chip to achieve connection with the circuit board. It has high density, high reliability and excellent heat dissipation performance, and is particularly suitable for chips with high integration and high power consumption. Preferably, the driver chip 42 and the circuit board 41 are mainly packaged and welded and fixed by BGA packaging technology; the circuit board 41 and the metal branch 31 are mainly welded and fixed by brush tin connection.

[0092] Furthermore, the circuit board 41 further includes a plurality of electronic components 411. In some embodiments, the plurality of electronic components 411 may be resistors, capacitors and other circuit-related electronic components, which may be used to further arrange the built-in circuit of the circuit board 41 into necessary electronic components for related circuits such as amplification circuits and reduction circuits. In some embodiments, the plurality of electronic components 411 may be positioned on the first surface 413 or the second surface 414 of the circuit board 41, and may be arranged on the same side or on the opposite side as the driver chip 42.

[0093] In the present application, the electronic component 50 includes a first electronic component 51 and a second electronic component 52. Specifically, the electronic component 50 is mainly composed of an electronic coil and some electronic devices. Further, the first electronic component 51 further includes a first anti-shake coil 511 and a second anti-shake coil 512, and the second electronic component 52 further includes a focus coil 521.

[0094] In the present application, the first injection molding part 21 forms the first mounting part 211 by the first injection molding, and the first mounting part 211 is used to fix part of the metal branch 31 and provide support for the part of the metal branch 31 fixed thereto. The first sensing element fixing end (not indicated) and the first anti-shake coil fixing end (not indicated) are not in the same plane as the part of the metal branch 31 located in the first mounting part 211, and the part of the metal branch 31 is covered by the first bottom plate 2112. In one embodiment, the first mounting part 211 can simultaneously install at least one first anti-shake coil 511 and at least two second anti-shake coils 512, and the first anti-shake coil 511 is located between at least two second anti-shake coils 512, wherein the first sensing element (not indicated) is fixed to the first sensing element fixing end and is electrically connected to the part of the metal branch 31. It can be understood that part of the swing sensing element (not indicated) is installed in the air avoidance area of ​​at least one second anti-shake coil 512. It can be understood that the first anti-shake coil 511 and the second anti-shake coil 512 respectively lead out positive and negative electrodes, which are connected to the fixed ends of the coils, and their projections do not overlap.

[0095] It can be understood that the first mounting portion 211 includes a first peripheral wall 2111 and a first bottom plate 2112, wherein the first bottom plate 2112 is an irregular plane bottom plate, and the metal branch 31 of this part is covered by the first bottom plate 2112 to form an insulating structure, and only the surface of the sensing fixed end (not marked) and the coil fixed end (not marked) are exposed for conductive connection. Specifically, the first peripheral wall 2111 is formed into an irregular wall portion by injection molding of the first injection molding portion 21, and further, the height of the first peripheral wall 2111 is higher than the height of the coil, and the first electronic component 51 is surrounded therein to form a protective structure.

[0096] It can be understood that the second mounting portion 212 is embedded in the third side wall 2073. Specifically, the specific implementation of the second mounting portion 212 is similar to that of the first mounting portion 211. Further, the second peripheral wall 2121 is also formed by the first injection molding. The height of the second peripheral wall 2121 is higher than the height of the focusing coil 521. The second peripheral wall 2121 surrounds the second electronic component 52 to form a protective structure. The second bottom plate 2122 is also an irregular plane bottom plate similar to the first bottom plate 2112. The second bottom plate 2122 covers the metal branch 31 of the second mounting portion 212.

[0097] It can be understood that the installation method of the first installation portion 211 and the second installation portion 212 can also refer to Figures 9A-11BThe first mounting portion 211 and the second mounting portion 212 can be implemented as a control portion 40, and further connected to the metal branch 31 of the circuit portion 30 through the first peripheral wall 2111 and the second peripheral wall 2121 in a face-to-face surface attachment manner, wherein the focus coil 521, the first anti-shake coil 511 and the second anti-shake coil 512 are preferably arranged on the inner surfaces of the first mounting portion 211 and the second mounting portion 212.

[0098] According to another aspect of the present application, the present application also provides a method for manufacturing an electrical base, which is used to place the control unit 40 on the side wall surface of the electrical base 20.

[0099] The method comprises the following steps:

[0100] S1: Provide a circuit portion 30, the circuit portion 30 includes a plurality of metal branches 31, the plurality of metal branches 31 have a plurality of connection ends 310, and a structural base 200 is formed by injection molding on the circuit portion 30, wherein the structural base 200 has at least one mounting opening 2081, the mounting opening 2081 is located on a side wall of the structural base 200, and at least a portion of the connection ends 310 are exposed at the mounting opening 2081;

[0101] Furthermore, in S1 : the first injection-molded portion 21 is formed by injection molding on the circuit portion 30 , and the second injection-molded portion 22 is further formed by injection molding around the first injection-molded portion 21 and the circuit portion 30 , so as to form the structural base 200 .

[0102] S2: Provide a control unit 40, and install the control unit 40 on the side wall of the structural base 200 from the installation opening 2081, wherein the control unit 40 includes a circuit board 41, and the edge of the circuit board 41 has a plurality of connection points 43, and the connection points 43 and the connection ends 310 of at least part of the metal branches 31 overlap and are conductive in spatial position.

[0103] S3: The first injection molding part 21 includes a first mounting part 211, a second mounting part 212 and a third mounting part 213 formed on the side wall of the structural base 200, wherein the second mounting part 212 and the third mounting part 213 are positioned opposite to each other, and the mounting opening 2081 is located at the third mounting part 213; the coil of the electronic component 50 is installed on the first mounting part 211 and the second mounting part 212.

[0104] Furthermore, in S3 , the control unit 40 is installed on the third installation portion 213 .

[0105] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0106] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. An electrical base assembly, characterized in that: include: A structural base, wherein the structural base has at least one mounting opening, and the mounting opening is located on a side wall of the structural base; A control unit, the control unit is arranged on the side wall, corresponding to the mounting opening, the control unit further comprises at least one circuit board and a plurality of connection points, the connection points are arranged on the surface of the circuit board; The circuit portion includes a metal branch having a plurality of connection ends, at least some of the connection ends of the metal branch correspond to the surface of the circuit board and overlap with the connection points of the circuit board in spatial projection, and the connection ends are conductively connected to the connection points so that the circuit board is conductively connected to the circuit portion.

2. The electrical base assembly according to claim 1, characterized in that The connection point and the connection end are directly attached to each other to achieve surface-to-surface electrical connection.

3. The electrical base assembly according to claim 1, characterized in that The control unit further includes at least one driving chip, and the driving chip is electrically connected to the circuit board.

4. The electrical base assembly according to claim 3, characterized in that The circuit board is embedded in the installation opening of the structural base. The circuit board has a first surface and a second surface that are opposite to each other. The driving chip and the connection point are arranged on surfaces on opposite sides of the circuit board.

5. The electrical base assembly according to claim 3, characterized in that The circuit board is embedded in the installation opening of the structural base. The circuit board has a first surface and a second surface that are opposite to each other. The driving chip and the connection point are arranged on the surface of the same side of the circuit board.

6. The electrical base assembly according to claim 3, characterized in that The connection points are arranged on the periphery of the circuit board and surround the driving chip.

7. The electrical base assembly of claim 1, wherein: The structural base has a mounting area and forms the mounting opening, and a portion of the mounting area facing the inner side of the structural base is closed.

8. The electrical base assembly of claim 1, wherein: The structural base has a mounting area and forms the mounting opening, and a portion of the mounting area facing the outside of the structural base is closed.

9. The electrical base assembly of claim 1, wherein: The area of ​​the connection end corresponding to the connection point has a line expansion arrangement.

10. The electrical base assembly of claim 1, wherein: It also includes an electronic component, which is conductively connected to the control unit through the circuit unit, and the control unit controls the operation of the electronic component, wherein the electronic component includes a coil, and the coil and the control unit are arranged on different sides of the side wall.

11. The electrical base assembly of claim 10, wherein: It further includes a first injection molding part, which covers at least a portion of the circuit part. The first injection molding part further includes a third mounting part, which is arranged on the side wall, and the mounting opening is formed in the third mounting part.

12. The electrical base assembly of claim 11, wherein: The structural base further includes an inner peripheral side wall, the inner peripheral side wall includes a first side wall and a third side wall that are oppositely arranged, and the third mounting portion is arranged on the first side wall of the structural base.

13. The electrical base assembly of claim 12, wherein: The coil includes a focus coil, and the focus coil is disposed on the third side wall and is opposite to the control unit.

14. The electrical base assembly of claim 11, wherein: The third installation portion has a third peripheral wall, and the thickness of the third peripheral wall is greater than the thickness of the control portion.

15. A camera module, characterized in that: include: The electrical base assembly according to any one of claims 1 to 14; Lens assembly; Photosensitive components, and Optical path turning component.

16. The camera module according to claim 15, characterized in that: It further includes a shell, and the shell further includes a bracket, and the bracket has an avoidance area, and the avoidance area is used to avoid the extension of at least one connecting belt of the photosensitive component.

17. A method for manufacturing an electrical base assembly, characterized in that: The following steps are involved: S1: providing a circuit part, the circuit part comprising a metal branch, the metal branch having a plurality of connection ends, and forming a structural base by injection molding on the circuit part, wherein the structural base has at least one mounting opening, the mounting opening is located on a side wall of the structural base, and at least part of the connection ends are exposed at the mounting opening; S2: Provide a control part, and install the control part on the side wall through the installation opening, wherein the control part includes a circuit board, the edge of the circuit board has a plurality of connection points, and the connection points and the connection ends of at least part of the metal branches overlap and are conductive in spatial position.

18. The method for manufacturing an electrical base assembly according to claim 17, wherein: S1 further includes: forming a first injection-molded part by injection molding on the circuit part, and forming a second injection-molded part by further injection molding around the first injection-molded part and the circuit part to form the structural base.

19. The method for manufacturing an electrical base assembly according to any one of claims 17-18, characterized in that: The following steps are also included: S3: the first injection-molded portion includes a first mounting portion, a second mounting portion, and a third mounting portion formed on the side wall, wherein the second mounting portion and the third mounting portion are located opposite to each other, and the mounting opening is located at the third mounting portion; and The coil of the electronic component is mounted on the first mounting portion and the second mounting portion.

20. The method for manufacturing an electrical base assembly according to claim 19, wherein: S3 further includes: The control unit is mounted on the third mounting portion.

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