A semiconductor chip electrical connection device based on multi-layer structure

Abstract

The present invention discloses a semiconductor chip electrical connection device based on a multilayer structure, comprising a first circuit board, a second circuit board and a chip, wherein a plurality of conductive seats are installed on the first circuit board, and positioning ports are vertically provided on the conductive seats, and conductive sheets are embeddedly installed on the surface of the second circuit board facing the conductive seats, and positioning plates are installed on the pins of the chip, and the positioning plates are arranged through the positioning ports, and positioning grooves are provided on the outer side of the support plate, and the end of the positioning plate away from the chip protrudes to form a positioning part, and the positioning part is inserted into the positioning groove, and a plurality of conductive columns are embeddedly installed on the outer side of the support plate. The present invention has a simple structure, and can directly realize the conduction between the first circuit board and the second circuit board while fixing the two circuit boards, without wiring; after the side plate is connected to the support plate, the first circuit board and the second circuit board can be fixed together synchronously, and the connection stability between the chip, the conductive seat, the conductive rod and the conductive sheet can also be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and in particular to a semiconductor chip electrical connection device based on a multi-layer structure. Background Art

[0002] A semiconductor chip is a semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. The working principle of a semiconductor chip is based on the electronic properties of semiconductor materials, integrated circuit design at the microscopic level, and system architecture at the macroscopic level.

[0003] At present, semiconductor chips are generally installed on circuit boards, but the installation between circuit boards generally requires welding, which is cumbersome and difficult to disassemble later. Once multiple circuit boards are designed and stacked, another circuit board is generally connected to the circuit board with the semiconductor chip through a wire so that both circuit boards have data processing functions. However, the connection through wires will cause wiring difficulties, and the two circuit boards need to be fixed independently, affecting the overall installation efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a semiconductor chip electrical connection device based on a multi-layer structure, which can connect the first circuit board and the second circuit board in parallel through a support plate and a side plate, and directly complete the conduction between the first circuit board and the second circuit board, so as to solve the problems raised in the above background technology.

[0005] The present invention is realized through the following technical scheme: a semiconductor chip electrical connection device based on a multi-layer structure, comprising a first circuit board, a second circuit board and a chip, wherein the first circuit board and the second circuit board are arranged in parallel one above the other, and a plurality of conductive seats are installed in a rectangular structure on the first circuit board, and positioning holes are vertically provided on the conductive seats, and conductive sheets are embeddedly installed on the surface of the second circuit board opposite to the conductive seats, and the chip is placed on the first circuit board, and the pins of the chip are opposite to the conductive seats and contacted with them, and positioning plates are installed on the pins, and the positioning plates are arranged through the positioning holes, and a plurality of support plates are installed between the first circuit board and the second circuit board, and positioning grooves are provided on the outer sides of the support plates, and the ends of the positioning plates away from the chips are protruding to form positioning parts, and the positioning parts are inserted into the positioning grooves, and a plurality of conductive columns are embeddedly installed on the outer sides of the support plates, and one end of the conductive column is arranged to abut against the positioning part, and the other end is arranged to abut against the conductive sheet on the second circuit board.

[0006] As a preferred technical solution, both ends of the multiple support plates are provided with side plates connecting the first circuit board and the second circuit board, both sides of the first circuit board and the second circuit board are provided with slots, both sides of the side plates are protruded to form insertion parts, and the insertion parts are inserted into the slots, and both end surfaces of the support plates are provided with limiting grooves, and the inner wall surfaces of the limiting grooves are provided with first screw holes, and the inner side surfaces of the side plates are protruded to form limiting parts opposite to the limiting grooves, and the limiting parts are inserted into the limiting grooves, and the limiting parts are provided with second screw holes that pass through the limiting parts and the side plates, and fixing bolts are threadedly connected in the first screw holes and the second screw holes.

[0007] As a preferred technical solution, the conductive column protrudes from one end surface toward the first circuit board to form a blocking portion, the positioning portion is arranged in an "L"-shaped structure, one end of the positioning portion is inserted into the positioning groove, and the other end is arranged to abut against the inner side surface of the blocking portion.

[0008] As a preferred technical solution, the conductive seat, the positioning plate, the conductive column and the conductive sheet are all made of metal materials.

[0009] As a preferred technical solution, the support plates are made of insulating plastic material, grooves are provided at both ends of the support plates near the side plates, and the top and bottom surfaces of the support plates are respectively arranged to abut against the opposite surfaces of the first circuit board and the second circuit board.

[0010] As a preferred technical solution, the outer side surface of the inserting portion is arranged flush with the opposite sides of the first circuit board and the second circuit board respectively.

[0011] As a preferred technical solution, the inner side surfaces of the side plates are arranged to abut against the end surfaces of the support plate, the first circuit board and the second circuit board.

[0012] As a preferred technical solution, the length and width of the cross section of the positioning plate match the length and width of the cross section of the positioning opening.

[0013] The beneficial effects of the present invention are:

[0014] 1. The positioning plate on the chip can be arranged through the positioning port, and after the support plate is arranged between the first circuit board and the second circuit board, the positioning part can be inserted into the positioning groove of the support plate, and the chip, the conductive seat, the conductive rod and the conductive sheet are connected, so that the first circuit board and the second circuit board can use the chip at the same time without wiring;

[0015] 2. After the side plate is connected to the support plate, the first circuit board and the second circuit board can be fixed together synchronously, and the connection stability between the chip, the conductive seat, the conductive rod and the conductive sheet can be ensured. At the same time, the support plate can play a supporting role, which can ensure the distance between the first circuit board and the second circuit board and avoid affecting the heat dissipation;

[0016] 3. By being able to quickly assemble the first circuit board, the second circuit board and the wiring therebetween, the convenience of the overall assembly is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 is a side view of the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the present invention after removing any side plate;

[0021] Figure 4 It is a schematic diagram of the structure of the present invention after removing the first circuit board;

[0022] Figure 5 A bottom view of the first circuit board and chip of the present invention;

[0023] Figure 6 This is a schematic diagram of the structure of the present invention after the chip is disassembled;

[0024] Figure 7 It is a schematic structural diagram of the second circuit board of the present invention.

[0025] Among them, 1. first circuit board; 2. second circuit board; 3. chip; 4. side panel; 5. plug-in part; 6. fixing bolt; 7. support plate; 8. positioning groove; 9. positioning part; 10. conductive column; 11. slot; 12. limiting groove; 13. first screw hole; 14. blocking part; 15. positioning plate; 16. conductive sheet; 17. conductive seat; 18. limiting part; 19. positioning port. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0028] Any feature disclosed in this specification (including any additional claims, abstract and drawings), unless otherwise stated, may be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0029] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, a semiconductor chip electrical connection device based on a multi-layer structure of the present invention comprises a first circuit board 1, a second circuit board 2 and a chip 3, wherein the first circuit board 1 and the second circuit board 2 are arranged in parallel one above the other, and a plurality of conductive seats 17 are installed on the first circuit board 1 in a rectangular structure, and positioning holes 19 are vertically arranged on the conductive seats 17, and conductive sheets 16 are embeddedly installed on the surface of the second circuit board 2 opposite to the conductive seats 17, and the chip 3 is placed on the first circuit board 1, and the pins of the chip 3 are opposite to the conductive seats 17 and are arranged in contact with them, and positioning plates 15 are installed on the pins, and the positioning plates 15 are arranged through the positioning holes 19, and a plurality of support plates 7 are installed between the first circuit board 1 and the second circuit board 2, and positioning grooves 8 are arranged on the outer surfaces of the support plates 7, and the ends of the positioning plates 15 away from the chip 3 are protruding to form positioning portions 9, and the positioning portions 9 are inserted into the positioning grooves 8, and a plurality of conductive pillars 10 are embeddedly installed on the outer surfaces of the support plates 7, and one end of the conductive pillars 10 is arranged to abut against the positioning portion 9, and the other end is arranged to abut against the conductive sheet 16 on the second circuit board 2.

[0030] In this embodiment, both ends of the multiple support plates 7 are provided with side panels 4 connecting the first circuit board 1 and the second circuit board 2, both sides of the first circuit board 1 and the second circuit board 2 are provided with slots 11, both sides of the side panels 4 are protruded to form insertion parts 5, and the insertion parts 5 are inserted into the slots 11, and both end surfaces of the support plates 7 are provided with limiting grooves 12, and the inner wall surface of the limiting groove 12 is provided with first screw holes 13, the inner side surfaces of the side panels 4 are protruded to form limiting parts 18 opposite to the limiting grooves 12, and the limiting parts 18 are inserted into the limiting grooves 12, and the limiting parts 18 are provided with second screw holes that penetrate the limiting parts 18 and the side panels 4, and the first screw holes 13 and the second screw holes are threadedly connected with fixing bolts 6.

[0031] In this embodiment, the conductive column 10 protrudes on one end surface toward the first circuit board 1 to form a blocking portion 14, and the positioning portion 9 is arranged in an "L"-shaped structure. One end of the positioning portion 9 is inserted into the positioning groove 8, and the other end is arranged to abut against the inner side surface of the blocking portion 14.

[0032] In this embodiment, the conductive seat 17, the positioning plate 15, the conductive column 10 and the conductive sheet 16 are all made of metal materials to ensure the conductivity between the conductive seat 17, the positioning plate 15, the conductive column 10 and the conductive sheet 16, so that the first circuit board and the second circuit board can directly use one chip without additional wiring.

[0033] In this embodiment, the support plates 7 are made of insulating plastic material, and grooves are provided at both ends of the support plates 7 near the side plates 4. The top surface and the bottom surface of the support plates 7 are respectively arranged to abut against the opposite surfaces of the first circuit board 1 and the second circuit board 2. The weight and cost of the support plates are reduced by the grooves, and the two ends of the second circuit board can be connected, thereby avoiding affecting the distribution and connection between subsequent electronic components.

[0034] In this embodiment, the outer side surface of the inserting portion 5 is flush with the opposite surfaces of the first circuit board 1 and the second circuit board 2, respectively, which can ensure the flatness of the upper and lower surfaces of the first circuit board and the second circuit board.

[0035] In this embodiment, the inner side surfaces of the side panels 4 are arranged to abut against the end surfaces of the support panel 7, the first circuit board 1 and the second circuit board 2, so that the side panels can press the support panel 7, the first circuit board 1 and the second circuit board 2 inwardly.

[0036] In this embodiment, the length and width of the cross section of the positioning plate 15 match the length and width of the cross section of the positioning opening 19, so that the positioning plate can be in close contact with the positioning opening to ensure the connection stability between the chip and the conductive seat.

[0037] During installation, the chip is placed on the first circuit board and contacts the conductive seat, and the positioning plate on the chip can be set through the positioning port, and the support plate can be set between the first circuit board and the second circuit board. After the support plate moves outward, the positioning part on the positioning plate can be inserted into the positioning groove on the outer side of the support plate. The positioning part can be positioned up and down by plugging and contact with the conductive column. The chip, the conductive block, the positioning plate, the conductive column and the conductive sheet of the second circuit board can be connected through the conductive column, so that the first circuit board and the second circuit board can use the chip at the same time without wiring, thus avoiding wiring difficulties;

[0038] After the support plate is placed, the limiting portion of the side plate can be inserted into the limiting groove of the support plate, and the inserting portion of the side plate can be inserted into the slot of the first circuit board and the second circuit board. The first circuit board and the second circuit board can be positioned up and down and laterally through the inserting portion and the slot, and as the fixing bolts are tightened, the first circuit board, the second circuit board and the support plate can be squeezed inward, so that the support plate, the first circuit board and the second circuit board are fixed as a whole, and the connection stability between the chip, the conductive seat, the conductive rod and the conductive sheet is ensured. At the same time, the support plate can play a supporting role, which can ensure the distance between the first circuit board and the second circuit board, avoiding affecting heat dissipation.

[0039] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope defined in the claims.

Claims

1. A semiconductor chip electrical connection device based on a multi-layer structure, characterized in that: The invention comprises a first circuit board (1), a second circuit board (2) and a chip (3), wherein the first circuit board (1) and the second circuit board (2) are arranged in parallel one above the other, a plurality of conductive seats (17) are installed on the first circuit board (1) in a rectangular structure, and positioning holes (19) are vertically arranged on the conductive seats (17), and conductive sheets (16) are embedded and installed on the surface of the second circuit board (2) facing the conductive seats (17), and the chip (3) is placed on the first circuit board (1), and the pins of the chip (3) are all opposite to the conductive seats (17) and are arranged in contact with the conductive seats, and positioning plates (15) are installed on the pins. ), the positioning plates (15) are all arranged through the positioning openings (19), a plurality of support plates (7) are installed between the first circuit board (1) and the second circuit board (2), the outer surfaces of the support plates (7) are all provided with positioning grooves (8), the ends of the positioning plates (15) away from the chip (3) are all protruding to form positioning parts (9), the positioning parts (9) are all inserted into the positioning grooves (8), and a plurality of conductive pillars (10) are all embedded and installed on the outer surfaces of the support plates (7), one end of the conductive pillars (10) is all arranged to abut against the positioning part (9), and the other end is all arranged to abut against the conductive sheet (16) on the second circuit board (2).

2. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: Both ends of the plurality of support plates (7) are provided with side plates (4) for connecting the first circuit board (1) and the second circuit board (2); both sides of the first circuit board (1) and the second circuit board (2) are provided with slots (11); both sides of the side plates (4) are protruded to form insertion parts (5); the insertion parts (5) are inserted into the slots (11); both end surfaces of the support plates (7) are provided with limit grooves (12); the inner wall surfaces of the limit grooves (12) are provided with first screw holes (13); the inner side surfaces of the side plates (4) are protruded to form limit parts (18) at positions corresponding to the limit grooves (12); the limit parts (18) are inserted into the limit grooves (12); the limit parts (18) are provided with second screw holes that penetrate the limit parts (18) and the side plates (4); and fixing bolts (6) are threadedly connected in the first screw holes (13) and the second screw holes.

3. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: The conductive pillars (10) are protruded on one end surface facing the first circuit board (1) to form a blocking portion (14), the positioning portions (9) are arranged in an "L"-shaped structure, one end of the positioning portion (9) is inserted into the positioning groove (8), and the other end is arranged to abut against the inner side surface of the blocking portion (14).

4. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: The conductive seat (17), the positioning plate (15), the conductive column (10) and the conductive sheet (16) are all made of metal material.

5. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: The support plates (7) are made of insulating plastic material. Both ends of the support plates (7) are provided with grooves near the side plates (4). The top surface and the bottom surface of the support plates (7) are respectively arranged to abut against the opposite surfaces of the first circuit board (1) and the second circuit board (2).

6. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: The outer side surface of the inserting portion (5) is arranged flush with the opposite sides of the first circuit board (1) and the second circuit board (2).

7. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 2, characterized in that: The inner side surfaces of the side plates (4) are arranged to abut against the end surfaces of the support plate (7), the first circuit board (1) and the second circuit board (2).

8. The semiconductor chip electrical connection device based on a multi-layer structure according to claim 1, characterized in that: The length and width of the cross section of the positioning plate (15) match the length and width of the cross section of the positioning opening (19).

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