Automatic design method, device and equipment for gold finger etching lead protection film

Abstract

The invention discloses a golden finger etching lead protection film automatic design method, device and equipment, and the method comprises the steps: copying a preset golden finger bonding pad in a circuit layer, outputting a first circuit layer, stretching the golden finger bonding pad in the first circuit layer for a first distance in a direction close to the edge of a PCB, and obtaining a second circuit layer; copying the second circuit layer to obtain a third circuit layer, extending a golden finger bonding pad of the third circuit layer to the edge of the PCB or exceeding the edge of the PCB, and adjusting the width of the bonding pad; overlapping the appearance layer on the third circuit layer in a negative mode, outputting a fourth circuit layer, obtaining a fifth circuit layer through negative integration, and combining the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer; according to the first circuit layer, the sixth circuit layer and set parameters, automatically completing manufacturing of a golden finger area layer, a protection lead pattern layer, a gold plating finger pattern layer, an etching lead pattern layer and a wet film screen board file.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB, and in particular to a method, a device and equipment for automatically designing a gold finger etching lead protection film. Background Art

[0002] In the PCB design and manufacturing industry, PCB gold fingers refer to inserting a section of the PCB circuit board into the connector card slot, using the connector's insertion foot as the circuit board's outbound storage, and making the pad or copper contact with the pins at the corresponding position to achieve electrical connection. PCB gold fingers are widely used, such as the connection between computer motherboards and peripherals (graphics cards, memory sticks, network cards, sound cards, etc.), communications of digital devices, connection contacts of industrial machinery, and optoelectronic products (communications and networks).

[0003] PCB gold fingers need to meet the following requirements: first, they need to have good electrical conductivity and be able to effectively transmit signals and currents; second, they need to have good corrosion resistance and be able to resist oxidation and corrosion; finally, they also need to have good mechanical strength and be able to withstand plugging and unplugging and pressure. Based on these considerations, gold fingers currently need to be plated with thick gold to meet these requirements.

[0004] However, the design of PCB gold fingers represented by optoelectronic products is long and short. According to the previous process, the whole board is electroplated with gold and then the circuit is etched. This method only plates the surface of the gold finger with gold. After etching, the copper on the side will be exposed, which will affect the connection reliability, wear resistance and signal transmission. According to the conventional equal-length gold fingers, adding leads from the outer end of the gold finger and electroplating gold after etching the circuit will affect the length of the gold finger and also affect the signal transmission. To solve this problem, it is necessary to perform the etching lead process to etch the outer lead after the gold-plated finger. The newly added etching lead process requires the engineering to make additional protective films to assist in production and processing.

[0005] Generally speaking, the gold finger etching lead file includes four protection film files. The existing implementation method is to manually separate and produce each protection film file separately. This production method is not only time-consuming, but also separates and produces each protection film file separately. It is also easy for the files to have deviations due to production, which affects the quality of the final PCB gold finger. Summary of the invention

[0006] In view of the above problems, the purpose of the embodiments of the present invention is to provide a method, device and equipment for automatically designing a gold finger etching lead protection film to improve the above problems.

[0007] In a first aspect, an embodiment of the present invention provides a method for automatically designing a gold finger etching lead protection film, which comprises:

[0008] S1, copying the predetermined gold finger pads in the circuit layer, outputting the first circuit layer, and stretching the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain the second circuit layer;

[0009] S2, duplicating the second circuit layer to obtain a third circuit layer, extending the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjusting the pad width to be less than or equal to the width of the gold finger pads of the second circuit layer;

[0010] S3, superimposing the outer shape layer of a predetermined shape onto the third circuit layer in a negative manner, outputting a fourth circuit layer, and then deleting the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative, to obtain a fifth circuit layer, and finally merging the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer, completing the circuit layer lead design;

[0011] S4, automatically completing the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and obtaining the gold finger etching lead protection film.

[0012] Preferably, in step S1, the gold finger pads of the circuit layer are selected and defined as predetermined attributes, so as to select and copy the predetermined gold finger pads through the predetermined attributes; and the first distance is 4 to 8 mil.

[0013] Preferably, in step S2, when adjusting the width of the gold finger pads of the third circuit layer, it is determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil smaller than the gold finger pads of the second circuit layer; if not greater, the width of the gold finger pads of the third circuit layer is set to be equal to the width of the gold finger pads of the second circuit layer.

[0014] Preferably, in step S3, before merging the fifth circuit layer, the fifth circuit layer is further extended outward by a second distance.

[0015] Preferably, step S4 comprises:

[0016] Determine the first gold finger pad area according to the first circuit layer, fill the first gold finger pad area with copper foil as a whole to form a second gold finger pad layer, and then extend the second gold finger pad layer to the edge of the PCB board to the third distance outside the board according to the shape to form a gold finger area layer.

[0017] Preferably, step S4 further includes:

[0018] The gold finger pads of the first circuit layer are copied to the sixth circuit layer, and the first dimension is enlarged as a whole, and the two sides are extended to the second distance outside the board, and then the whole is moved into the board as a whole by the first dimension, and then the gold finger area layer is copied to form a graphic layer, and the graphic layer and the sixth circuit layer are superimposed with negative properties, and the negative properties are integrated to obtain a protective lead graphic layer; the first dimension is the gold finger spacing value;

[0019] The protected lead pattern layer is copied to the seventh circuit layer, and the seventh circuit layer is moved a fourth distance inwardly of the board to obtain an etched lead pattern layer.

[0020] Preferably, step S4 further includes:

[0021] The gold finger pads of the first circuit layer are copied to obtain a new layer of gold finger pads, the new layer of gold finger pads are enlarged as a whole, and the two sides are extended to the edge of the PCB board to obtain a gold-plated finger graphic layer.

[0022] Preferably, step S4 further includes:

[0023] Copy the gold finger area layer to the eighth circuit layer and enlarge it as a whole to complete the production of the wet film stencil file.

[0024] In a second aspect, an embodiment of the present invention further provides a device for automatically designing a gold finger etching lead protection film, which includes:

[0025] The stretching unit is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain the second circuit layer;

[0026] A width adjustment unit, used for duplicating the second circuit layer to obtain a third circuit layer, extending the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjusting the pad width to make the width less than or equal to the width of the gold finger pads of the second circuit layer;

[0027] A lead design unit is used to superimpose the outer shape layer of a predetermined shape onto the third circuit layer in a negative manner, output a fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative to obtain a fifth circuit layer, and finally merge the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer, thereby completing the circuit layer lead design;

[0028] The film design unit is used to automatically complete the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters to obtain the gold finger etching lead protection film.

[0029] In a third aspect, an embodiment of the present invention further provides an automatic design device for a gold finger etched lead protection film, which includes a memory and a processor, wherein the memory stores a computer program, and the computer program can be executed by the processor to implement the automatic design method for a gold finger etched lead protection film as described above.

[0030] To sum up, in this embodiment, the circuit layer lead design can be generated by defining the gold finger and the appearance graphics. Based on the circuit layer lead design, taking into account the correlation between the protection film files, the automatic design generation of the gold finger etching lead protection film can be realized based on the circuit layer lead design through the set parameters. In this way, the etched lead gold finger file can be processed quickly and automatically, the CAM processing efficiency is improved, the file production errors caused by human operation are avoided, and the production scrap rate is reduced.

[0031] In addition, in this embodiment, since the production of the entire file is transparent and traceable, it can be converted into a script later to realize automatic production of auxiliary files, further improving the efficiency of engineering CAM.

[0032] Furthermore, the files processed by engineering CAM are closer to production needs and can better and faster etch out non-customer-designed leads in electroplating, reducing production scrap rates and improving quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 It is a flow chart of the method for automatically designing a gold finger etching lead protection film provided by the first embodiment of the present invention.

[0035] Figure 2 It is a schematic diagram of an operation interface provided by an embodiment of the present invention.

[0036] Figure 3 It is a schematic diagram of the first circuit layer provided by an embodiment of the present invention.

[0037] Figure 4 It is a schematic diagram of the fourth circuit layer provided by an embodiment of the present invention.

[0038] Figure 5 and Figure 6 Schematic diagram of forming the gold finger area layer.

[0039] Figure 7 and Figure 8A schematic diagram of forming a protective lead pattern layer.

[0040] Fig. 9 Schematic diagram of etching the lead pattern layer.

[0041] Fig.10 Schematic diagram of the gold-plated finger graphic layer.

[0042] Fig.11 A schematic diagram of a wet film stencil file.

[0043] Fig.12 It is a schematic diagram of the structure of a device for automatically designing a gold finger etching lead protection film provided by a second embodiment of the present invention. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figure 1 The first embodiment of the present invention provides a method for automatically designing a gold finger etched lead protection film, which can be executed by a gold finger etched lead protection film automatic design device (hereinafter referred to as the design device), and in particular, directed by one or more processors in the design device to implement the following steps:

[0046] S1, copying the predetermined gold finger pads in the circuit layer, outputting the first circuit layer, and stretching the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain the second circuit layer.

[0047] In this embodiment, the design device may be a computing device with data processing capabilities, such as a desktop computer, a laptop computer, a tablet computer or a workstation, etc., and the present invention does not make specific limitations. In terms of hardware, generally, the design device at least includes a processor, a display, a processor and a bus interface, etc. In terms of software, the design device is installed with an operating system and corresponding application software or scripts to implement the functions required by this embodiment.

[0048] In this embodiment, it is first necessary to copy the predetermined gold finger pads in the circuit layer and output the first circuit layer. In order to improve the efficiency of copying and selecting the predetermined gold finger pads, the gold finger pads in the circuit layer can be selected and defined as the "gold finger pad" attribute, so that the gold finger pads can be copied at one time by selecting the attribute.

[0049] In addition, you can also choose the etching direction of the gold finger, such as Figure 2 shown.

[0050] In this embodiment, the predetermined gold finger pad output in the duplicate circuit layer is as follows: Figure 3 After the first circuit layer is formed, the gold finger pads in the gold finger area 1 in the first circuit layer are stretched a first distance toward the edge of the PCB board to which the ends thereof point, so as to obtain a second circuit layer.

[0051] In this embodiment, in particular, the first distance can be 4 to 8 mils. Extending the first distance before making the lead is mainly due to some deviations during etching. If the gold finger pad is not extended, lead residues may be generated after etching, affecting the appearance.

[0052] like Figure 4 As shown, Figure 4 In the figure, the first extension region 2 having the same width as the gold finger pad is the extended portion.

[0053] S2, copy the second circuit layer to obtain a third circuit layer, extend the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjust the pad width so that its width is less than or equal to the width of the gold finger pads of the second circuit layer.

[0054] This step is mainly for making leads. When extending, it is necessary to ensure that all gold finger pads extend to the edge of the board along their length, and the long fingers can exceed the edge of the board.

[0055] In this embodiment, when adjusting the width of the gold finger pads of the third circuit layer, it is first determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil smaller than the gold finger pads of the second circuit layer; if not greater, the width of the gold finger pads of the third circuit layer is set to be equal to the width of the gold finger pads of the second circuit layer.

[0056] Considering that the width of a general gold finger is greater than 16 mil, the preset value is set to 16 mil.

[0057] like Figure 4 As shown, Figure 4 In the figure, the second extension area 3 with a smaller width is a part of the gold finger pad of the third circuit layer after the width is adjusted.

[0058] S3, superimpose the outer shape layer of a predetermined shape on the third circuit layer in a negative manner, output the fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative to obtain the fifth circuit layer, and finally merge the first circuit layer, the second circuit layer and the fifth circuit layer to form the sixth circuit layer, and complete the circuit layer lead design.

[0059] In this embodiment, the outer shape layer 4 is used to define the outer shape of the PCB board. The outer shape layer 4 is superimposed on the third circuit layer in a negative manner to obtain the following: Figure 4 The fourth circuit layer shown is then negatively deleted by integrating the fourth circuit layer outside the outer layer to obtain the fifth circuit layer.

[0060] like Figure 5 As shown, after obtaining the fifth circuit layer, the end is copied and extended a certain distance toward the corresponding board edge to form an extended gold finger lead 5. This part of the extended gold finger lead is mainly used for connecting the main lead. The main lead outside the board can be connected to the power supply, thereby delivering current to each branch lead to realize electroplating.

[0061] The certain distance here may be 2 mm, and of course may be adjusted according to actual needs, such as being set to between 1.5 and 3 mm, which is not specifically limited in the present invention.

[0062] In this embodiment, the first circuit layer, the second circuit layer and the fifth circuit layer can be combined to form a sixth circuit layer after being superimposed, thereby completing the circuit layer lead design.

[0063] S4, automatically completing the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and then obtaining the gold finger etching lead protection film.

[0064] In this embodiment, multiple protection patterns (protection films) are required in the process of processing and generating gold fingers. After obtaining the sixth circuit layer designed as the circuit layer lead, this embodiment can automatically generate various films based on the first circuit layer and the sixth circuit layer.

[0065] First, for the gold finger area layer:

[0066] like Figure 5 and Figure 6 As shown, the gold finger region layer 6 is mainly used to cover the region where the gold finger is located, so that processing can be performed after covering.

[0067] The gold finger area layer 6 can be automatically generated by the following steps:

[0068] Step 1: Duplicate the gold finger pads of the first circuit layer to form the first gold finger pad layer;

[0069] Step 2: Select the gold finger pad layer in the first gold finger pad layer, determine the size of the gold finger pad area, and fill the area with copper foil to form a second gold finger pad layer;

[0070] Step 3: Extend the second gold finger pad layer to the outside of the board in three directions along the edge of the board according to the shape, integrate this layer, and form the gold finger area layer 6.

[0071] Among them, Figure 5 For example, the three directions of the board edge include the direction in which the lead extends and two directions perpendicular to the extending direction.

[0072] The distance extending outside the board may be 0.3 mm, and may also be other similar values, such as between 0.1-0.5 mm, which is not specifically limited in the present invention.

[0073] Then, for the protection lead pattern layer:

[0074] like Figure 7 and Figure 8 As shown, the protection lead pattern layer 7 can be automatically generated by the following steps:

[0075] Step 1: Copy the gold finger of the first circuit layer to the sixth circuit layer, and increase the Xmil (Xmil is the gold finger spacing value) as a whole, extend both sides to 1mm outside the board, and then move Xmil as a whole into the board.

[0076] Step 2: Copy the gold finger area layer to create a graphic layer, and overlay the sixth line layer with negative attributes.

[0077] Step 3: Integrate the negative property to form the protective lead pattern layer.

[0078] Among them, Figure 7 and Figure 8 As shown, the in-board covering part 8 of the protective lead pattern layer 7 is flush with the gold finger before processing, that is, it covers 6 mils. The value h2 of the short finger side larger than the single side of the finger is half of the distance h1 between the two gold fingers. The remaining distance is used as the distance covering the long finger. The distance between the gold fingers needs to be guaranteed to be above 6 mils.

[0079] Next, for etching the lead pattern:

[0080] like Fig. 9 As shown, the etching lead pattern 9 is used to implement etching of the leads, and covers other parts except the leads.

[0081] The etching lead pattern 9 can be automatically generated by the following steps:

[0082] Duplicate the protective lead pattern layer by one layer, and copy and move it to the gold finger area 1 by 4 to 8 mil to obtain the etched lead pattern layer 9.

[0083] Next, for the gold-plated finger graphic layer:

[0084] like Fig.10 As shown, since the gold-plated gold fingers need to be removed later (the gold-plated gold fingers cannot be etched away, and only the gold fingers need to be gold-plated, not the leads), it is necessary to design a gold-plated finger pattern layer 10, which is used to cover other parts except the gold fingers.

[0085] The gold-plated finger pattern layer 10 can be automatically generated by the following steps:

[0086] Step 1: Copy the gold finger pads of the first circuit layer to a new layer of gold finger pads;

[0087] Step 2: Increase the overall thickness of the new layer of gold finger pads by 4 to 8 mils and extend both sides to the edge of the board to obtain the following: Fig.10 The gold-plated finger pattern layer 10 is shown.

[0088] Finally, for the wet film stencil file:

[0089] like Fig.11 As shown, the gold finger area layer 6 is copied to a new layer, and the whole is enlarged by 2 mm to obtain the wet film area 11, and the wet film stencil file layer is completed.

[0090] To sum up, in this embodiment, the circuit layer lead design can be generated by defining the gold finger and the appearance graphics. Based on the circuit layer lead design, taking into account the correlation between the protection film files, the automatic design generation of the gold finger etching lead protection film can be realized based on the circuit layer lead design through the set parameters. In this way, the etched lead gold finger file can be processed quickly and automatically, the CAM processing efficiency is improved, the file production errors caused by human operation are avoided, and the production scrap rate is reduced.

[0091] In addition, in this embodiment, since the production of the entire file is transparent and traceable, it can be converted into a script later to realize automatic production of auxiliary files, further improving the efficiency of engineering CAM.

[0092] Furthermore, the files processed by engineering CAM are closer to production needs and can better and faster etch out non-customer-designed leads in electroplating, reducing production scrap rates and improving quality.

[0093] See also Fig.12 The second embodiment of the present invention further provides a device for automatically designing a gold finger etching lead protection film, which includes:

[0094] The stretching unit 210 is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain a second circuit layer;

[0095] The width adjustment unit 220 is used to copy the second circuit layer to obtain a third circuit layer, extend the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjust the pad width to make its width less than or equal to the width of the gold finger pads of the second circuit layer;

[0096] The lead design unit 230 is used to superimpose the outer shape layer of a predetermined shape on the third circuit layer in a negative manner, output a fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative to obtain a fifth circuit layer, and finally merge the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer, thereby completing the circuit layer lead design;

[0097] The film design unit 240 is used to automatically complete the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters to obtain the gold finger etching lead protection film.

[0098] The third embodiment of the present invention also provides a gold finger etched lead protection film automatic design device, which includes a memory and a processor, wherein the memory stores a computer program, and the computer program can be executed by the processor to implement the gold finger etched lead protection film automatic design method as described above.

[0099] The technical features of the above-described embodiments may be arbitrarily combined, and the execution order of the method steps is not limited. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for automatically designing a gold finger etching lead protection film, characterized in that: include: S1, copying the predetermined gold finger pads in the circuit layer, outputting the first circuit layer, and stretching the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain the second circuit layer; S2, duplicating the second circuit layer to obtain a third circuit layer, extending the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjusting the pad width to be less than or equal to the width of the gold finger pads of the second circuit layer; S3, superimposing the outer shape layer of a predetermined shape onto the third circuit layer in a negative manner, outputting a fourth circuit layer, and then deleting the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative, to obtain a fifth circuit layer, and finally merging the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer, completing the circuit layer lead design; S4, automatically completing the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and obtaining the gold finger etching lead protection film.

2. The method for automatically designing a gold finger etching lead protection film according to claim 1, characterized in that: In step S1, the gold finger pads of the circuit layer are selected and defined as predetermined attributes, so as to select and copy the predetermined gold finger pads through the predetermined attributes; the first distance is 4 to 8 mils.

3. The method for automatically designing a gold finger etching lead protection film according to claim 1, characterized in that: In step S2, when adjusting the width of the gold finger pads of the third circuit layer, it is determined whether the width of the gold finger pads of the second circuit layer is greater than a preset value; if greater, the width of the gold finger pads of the third circuit layer is set to be 1-3 mil smaller than the gold finger pads of the second circuit layer; If not, the width of the gold finger pads of the third circuit layer is set to be equal to the width of the gold finger pads of the second circuit layer.

4. The method for automatically designing a gold finger etching lead protection film according to claim 1, characterized in that: In step S3, before merging the fifth circuit layer, the fifth circuit layer is further extended outward by a second distance.

5. The method for automatically designing a gold finger etching lead protection film according to claim 4, characterized in that: Step S4 includes: Determine the first gold finger pad area according to the first circuit layer, fill the first gold finger pad area with copper foil as a whole to form a second gold finger pad layer, and then extend the second gold finger pad layer to the edge of the PCB board to the third distance outside the board according to the shape to form a gold finger area layer.

6. The method for automatically designing a gold finger etching lead protection film according to claim 5, characterized in that: Step S4 also includes: The gold finger pads of the first circuit layer are copied to the sixth circuit layer, and the first dimension is enlarged as a whole, and the two sides are extended to the second distance outside the board, and then the whole is moved into the board as a whole by the first dimension, and then the gold finger area layer is copied to form a graphic layer, and the graphic layer and the sixth circuit layer are superimposed with negative properties, and the negative properties are integrated to obtain a protective lead graphic layer; the first dimension is the gold finger spacing value; The protected lead pattern layer is copied to the seventh circuit layer, and the seventh circuit layer is moved a fourth distance inwardly of the board to obtain an etched lead pattern layer.

7. The method for automatically designing a gold finger etching lead protection film according to claim 5, characterized in that: Step S4 also includes: The gold finger pads of the first circuit layer are copied to obtain a new layer of gold finger pads, the new layer of gold finger pads are enlarged as a whole, and the two sides are extended to the edge of the PCB board to obtain a gold-plated finger graphic layer.

8. The method for automatically designing a gold finger etching lead protection film according to claim 5, characterized in that: Step S4 also includes: Copy the gold finger area layer to the eighth circuit layer and enlarge it as a whole to complete the production of the wet film stencil file.

9. An automatic design device for gold finger etching lead protection film, characterized in that: include: The stretching unit is used to copy the predetermined gold finger pads in the circuit layer, output the first circuit layer, and stretch the gold finger pads in the first circuit layer toward the edge of the PCB board by a first distance to obtain the second circuit layer; A width adjustment unit, used for duplicating the second circuit layer to obtain a third circuit layer, extending the gold finger pads of the third circuit layer to the edge of the PCB board or beyond the edge of the PCB board, and adjusting the pad width to make the width less than or equal to the width of the gold finger pads of the second circuit layer; A lead design unit is used to superimpose the outer shape layer of a predetermined shape onto the third circuit layer in a negative manner, output a fourth circuit layer, and then delete the pattern of the fourth circuit layer outside the outer shape layer by integrating the negative to obtain a fifth circuit layer, and finally merge the first circuit layer, the second circuit layer and the fifth circuit layer to form a sixth circuit layer, thereby completing the circuit layer lead design; The film design unit is used to automatically complete the production of the gold finger area layer, the protection lead pattern layer, the gold plated finger pattern layer, the etching lead pattern layer and the wet film stencil file according to the first circuit layer, the sixth circuit layer and the set parameters, and then obtain the gold finger etching lead protection film.

10. An automatic design device for gold finger etching lead protection film, characterized in that: It comprises a memory and a processor, wherein the memory stores a computer program, and the computer program can be executed by the processor to implement the automatic design method of the gold finger etching lead protection film as claimed in any one of claims 1 to 8.

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