PCB screen printing configuration method and device and computer equipment

Abstract

The invention relates to a PCB screen printing configuration method and device and computer equipment. The method comprises the following steps: determining the type of each silk screen required to be equipped on the PCB; based on a pre-constructed placement rule of different types of silk-screens, determining structured parameters of each silk-screen required to be configured for the PCB; optimizing the structured parameters of each silk screen required to be configured on the PCB to obtain each initial configuration silk screen of the PCB; and on the basis of the spatial position relationship between each initial configuration silk screen of the PCB and the body corresponding to the initial configuration silk screen and the spatial position relationship between each initial configuration silk screen of the PCB, performing global adjustment on each initial configuration silk screen to obtain each final configuration silk screen of the PCB. By the adoption of the method, the problems that an existing PCB silk-screen configuration method does not support automatic silk-screen arrangement of brand new design, the application range is small, and complex and diversified scene and service requirements cannot be met can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB design, and in particular to a PCB screen printing configuration method, device and computer equipment. Background Art

[0002] With the development of electronic technology, PCB design has gradually received more attention. As an important part of PCB design, PCB silk screen printing is responsible for product production traceability and test verification support. Therefore, the accuracy of silk screen placement is particularly important.

[0003] The existing PCB silk screen configuration method is mainly based on the historical silk screen design information to complete the adjustment of silk screen characters, or, by obtaining the device body coordinates to achieve the placement of PCB position number silk screen and size. Among them, the adjustment of silk screen characters based on historical silk screen design information is mainly based on the historical silk screen design information, and the relevant attributes of the current silk screen characters, to move the current silk screen characters to complete the adjustment of the silk screen characters. However, this PCB silk screen configuration method does not support the automatic silk screen layout of new designs. The method of obtaining the device body coordinates to achieve the placement of PCB position number silk screen and size only solves the silk screen information such as the position number and package of the silk screen adjustment, and does not systematically solve all the factors affected by the silk screen. The application scope is small and cannot meet complex and diverse scenarios and business needs.

[0004] The existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs. No effective solution has been proposed yet. Summary of the invention

[0005] Based on this, it is necessary to provide a PCB screen printing configuration method, device and computer equipment to address the above technical problems.

[0006] In a first aspect, the present application provides a PCB screen printing configuration method. The method comprises the following steps: Determine the types of silk screens that the PCB board needs to be equipped with; Determining structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the types of each of the silk screens that the PCB board needs to be equipped with and pre-constructed placement rules of different types of silk screens; Optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with, and obtaining the optimized parameters of each of the silk screens that the PCB board needs to be equipped with; Using the optimization parameters of each of the silk screens that the PCB board needs to be equipped with, setting the initial configuration of each of the silk screens that the PCB board needs to be equipped with, and obtaining each initial configuration silk screen of the PCB board; Based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the main body corresponding to the initial configuration silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, each of the initial configuration silk screens is globally adjusted to obtain each of the final configuration silk screens of the PCB board.

[0007] In one embodiment, optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with includes the following steps: The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each of the silk screens that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

[0008] In one embodiment, the particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each screen printing that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each screen printing that the PCB board needs to be equipped with, including the following steps: Based on the multi-dimensional structured parameters of each of the silk screens that the PCB board needs to be equipped with, a particle swarm parameter in the particle swarm algorithm is constructed, and a rule of the particle swarm parameter in the particle swarm algorithm is defined; wherein the rule of the particle swarm parameter includes solving a convergence range and an adjustment speed; By using the defined particle swarm parameter rules, the dimension-reduced parameters of each of the silk screens that the PCB board needs to be equipped with are optimized and solved to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

[0009] In one embodiment, the rule for defining the particle swarm parameters in the particle swarm algorithm comprises the following steps: Based on the size of the silk-screen body structure and the error range of the preset silk-screen position, determining the solution convergence range of the particle swarm parameter in the particle swarm algorithm; Based on the size of the main structure of the silk screen, the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined.

[0010] In one embodiment, based on each of the initial configuration silk screens of the PCB board, the spatial position relationship between the bodies corresponding to the initial configuration silk screens, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, each of the initial configuration silk screens is globally adjusted to obtain each of the final configuration silk screens of the PCB board, including the following steps: Based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, determine whether there is intersection and ambiguity between each of the initial configuration silk screens of the PCB board; By introducing a genetic penalty function, the crossover and ambiguity between the initial configuration silk screens of the PCB board are adjusted to obtain the final configuration silk screens of the PCB board.

[0011] In one embodiment, the determining whether there is intersection and ambiguity between the initial configuration silk screens of the PCB board based on the spatial position relationship between the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screens, and the spatial position relationship between the initial configuration silk screens of the PCB board, comprises the following steps: For each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, a bounding box is defined respectively to obtain a first bounding box and a second bounding box of the PCB board; the first bounding box is the bounding box of the initial configuration silk screen, and the second bounding box is the bounding box of the body corresponding to the initial configuration silk screen; Based on the consistency of the relative positions between the first boundary boxes and the second boundary boxes, determining whether there is an intersection between the initial configuration silk screens of the PCB board; Determine the direction vector and distance between each of the initial configuration silk screens of the PCB board based on the spatial position relationship between each of the initial configuration silk screens of the PCB board; Based on the direction vector angles and distances between each of the initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold, it is determined whether there is ambiguity between each of the initial configuration silk screens of the PCB board; the preset ambiguous angle threshold is an angle value used to determine whether the angle between the direction vectors of the two silk screens meets the ambiguity judgment requirement; the preset ambiguous distance threshold is a distance value used to determine whether the distance between the two silk screens meets the ambiguity requirement.

[0012] In one embodiment, the method of introducing a genetic penalty function to adjust the situation where there are crossovers and ambiguities between the initial configuration screens of the PCB board to obtain the final configuration screens of the PCB board includes the following steps: Based on the intersection determination results between the initial configuration silk screens of the PCB board, constructing a silk screen intersection penalty function; Based on the ambiguity determination results between the initial configuration silk screens of the PCB board, construct a silk screen ambiguity penalty function; The silk screen cross penalty function and the silk screen ambiguity penalty function are used to optimize the parameters of each of the initial configuration silk screens of the PCB board to obtain each of the final configuration silk screens of the PCB board.

[0013] In one embodiment, the step of determining the types of silk screens that the PCB board needs to be equipped with includes the following steps: Based on the PCB board and the configuration information corresponding to the PCB board, the types of each of the silk screens that the PCB board needs to be equipped with are determined; the configuration information includes a circuit diagram and text information.

[0014] In one embodiment, the types of silk screen include pad and via silk screen, text silk screen and device silk screen; the determining the types of silk screens that the PCB needs to be equipped with based on the PCB board and the configuration information corresponding to the PCB board comprises the following steps: Based on the pads and vias that need to be equipped with silk screen printing in the PCB board, determine the pads and via silk screen printing that need to be equipped on the PCB board; Based on the text information in the configuration information corresponding to the PCB board, determine the text silk screen that the PCB board needs to be equipped with; the text silk screen includes high-frequency signal silk screen, device identification silk screen, process or production device silk screen, package silk screen and network label silk screen; Based on the circuit diagram in the configuration information corresponding to the PCB board, determine the device silk screen that the PCB board needs to be equipped with; the device silk screen includes the device position number silk screen.

[0015] In one embodiment, the text screen printing includes high-frequency signal screen printing; the method further includes the following steps: Based on the material codes in the text information, determine the materials to be included in the PCB board; Using a preset simulation signal database, simulating each of the materials to be equipped in the PCB board, and determining the materials in the PCB board having high-frequency signals; Based on the material having high-frequency signals in the PCB board, the high-frequency signal silk screen to be provided in the PCB board is determined.

[0016] In one embodiment, the placement rules of different types of silk screens include at least one of basic silk screen placement rules, high-frequency signal silk screen placement rules, pad and via silk screen placement rules, and process or production device silk screen placement rules; the basic silk screen placement rules include device position number silk screen placement rules, device identification silk screen placement rules, package silk screen placement rules, and network label silk screen placement rules.

[0017] In a second aspect, the present application also provides a PCB screen printing configuration device. The device comprises: A type determination module is used to determine the types of silk screens that the PCB board needs to be equipped with; A parameter determination module, used to determine the structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the types of each of the silk screens that the PCB board needs to be equipped with and the pre-constructed placement rules of different types of silk screens; An optimization module, used for optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with, and obtaining the optimized parameters of each of the silk screens that the PCB board needs to be equipped with; A screen printing setting module, used to set the initial configuration of each screen printing that needs to be equipped on the PCB board by using the optimization parameters of each screen printing that needs to be equipped on the PCB board, and obtain each initial configuration screen printing of the PCB board; and an adjustment module, for globally adjusting each of the initial configuration silk screens of the PCB board based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, so as to obtain each of the final configuration silk screens of the PCB board.

[0018] In a third aspect, the present application further provides a computer device, wherein the computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the PCB screen printing configuration method described in the first aspect is implemented.

[0019] The above-mentioned PCB silk screen configuration method, device and computer equipment, through the pre-constructed placement rules of different types of silk screens, can determine the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with when the types of silk screens that the PCB board needs to be equipped with are determined. It reduces the dimension of the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with by classifying the silk screens and determining the placement rules of silk screens of different classifications, and then optimizes the structural parameters of the silk screen after the dimension reduction to obtain the optimized parameters of each silk screen, and obtains each initial configuration silk screen of the PCB board according to the optimized parameters of each silk screen. Because the silk screen at this time only reduces the dimension and optimizes the parameters based on a single silk screen, there may be problems such as intersection and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration silk screen to obtain the final configuration of each silk screen of the PCB board. This method supports the automatic silk screen arrangement of a new design, and is applicable to multiple types of silk screens in a variety of scenarios, and has universality. The solution solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0020] Details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A hardware structure block diagram of a terminal for a PCB screen printing configuration method provided in an embodiment of the present application; Figure 2 A flowchart of a PCB screen printing configuration method provided in one embodiment of the present application; Figure 3 This is a schematic diagram of a PCB silk screen configuration result provided by an embodiment of the present application; Figure 4 A flowchart of a PCB screen printing configuration method provided in a preferred embodiment of the present application; Figure 5 This is a structural block diagram of a PCB screen printing configuration device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to more clearly understand the purpose, technical solutions and advantages of the present application, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments.

[0023] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the general meaning understood by people with general skills in the technical field to which this application belongs. The words "one", "a", "the", "these" and the like in this application do not indicate a quantitative limitation, and they may be singular or plural. The terms "include", "comprise", "have" and any variants thereof involved in this application are intended to cover non-exclusive inclusions; for example, a process, method and system, product or device comprising a series of steps or modules (units) is not limited to the listed steps or modules (units), but may include unlisted steps or modules (units), or may include other steps or modules (units) inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" may mean: A exists alone, A and B exist at the same time, and B exists alone. Generally, the character " / " indicates that the objects associated with each other are in an "or" relationship. The terms "first", "second", "third", etc. in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0024] The method embodiment provided in this embodiment can be executed in a terminal, a computer or a similar computing device. For example, running on a terminal, Figure 1 : is a hardware structure block diagram of the terminal of the PCB screen printing configuration method of this embodiment. Figure 1 As shown, the terminal may include one or more ( Figure 1 Only one is shown in the figure) a processor 102 and a memory 104 for storing data, wherein the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA. The above terminal may also include a transmission device 106 and an input and output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is for illustration only and does not limit the structure of the above terminal. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations shown.

[0025] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the PCB screen printing configuration method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0026] The transmission device 106 is used to receive or send data via a network. The above network includes a wireless network provided by the communication provider of the terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (Radio Frequency, referred to as RF) module, which is used to communicate with the Internet wirelessly.

[0027] In this embodiment, a PCB screen printing configuration method is provided. Figure 2 Schematic diagram of the PCB screen printing configuration method of this embodiment. Figure 2 As shown, the process includes the following steps: Step S210, determining the types of silk screens that the PCB board needs to be equipped with.

[0028] Silk screen printing, also known as screen printing, is a printing technology that uses a silk screen as a printing plate. The basic principle is to scrape ink or pigment on the silk screen and then transfer the ink or pigment to the printing material through pressure to form patterns, letters, numbers or words. Silk screen printing is usually used to formulate useful information on PCB (Printed Circuit Board) boards. It can be used to mark component values, part numbers, polarity and other information during the assembly process. It can also include version, manufacturer and other information.

[0029] In this step, the types of silk screen printing may include pad and via silk screen printing, text silk screen printing and device silk screen printing, etc. Among them, the text silk screen printing includes high-frequency signal silk screen printing, process or production device silk screen printing, package silk screen printing and network label silk screen printing, etc.

[0030] The above-mentioned determination of the types of silk screens that the PCB board needs to be equipped with can be based on the PCB board and the configuration information corresponding to the PCB board to determine the types of silk screens that the PCB board needs to be equipped with. Among them, the configuration information corresponding to the above-mentioned PCB board includes the circuit diagram and text information corresponding to the PCB board. The above-mentioned text information may include device identification, text information of device packaging, network label, material code, production or process device text information, etc.

[0031] The above-mentioned device identification is used to identify the chip name, interface type, and coding instructions for matching multiple identical interface identifications with functions. The above-mentioned text information of the device package includes the two-dimensional structural dimension information of the device package, the pin marking information of the device, the positive and negative marking information, the multi-pin marking information, etc. Among them, the two-dimensional structural dimension information of the device package includes the body size information, pad size information and spacing information of the device package, etc. The above-mentioned network label is used to identify different interface device pin networks for easy wiring or debugging. The above-mentioned material code is a unique code for the material, which is used to identify its position and characteristics in the design. Specifically, it can be a short text or symbol to identify one or more of the material, product name, specification or category. The above-mentioned production or process device text information includes one or more of the CODE code, manufacturer's logo, serial number, batch number, warnings and regulations, PCB board unique identification number, company logo, version number, date code, product special requirements, and other standards or logo printing.

[0032] Step S220, based on the types of silk screens that the PCB board needs to be equipped with and the pre-built placement rules of different types of silk screens, determine the structural parameters of each silk screen that the PCB board needs to be equipped with.

[0033] The above-mentioned pre-constructed placement rules of different types of silk screens may be the placement rules corresponding to the pre-constructed types of silk screens. Specifically, the above-mentioned placement rules may include one or more of the basic silk screen placement rules, high-frequency signal silk screen placement rules, pad and via silk screen placement rules, and process or production device silk screen placement rules. The above-mentioned basic silk screen placement rules may include one or more of the device bit number silk screen placement rules, device identification silk screen placement rules, package silk screen placement rules, and network label silk screen placement rules.

[0034] The structured information in the above-mentioned pre-constructed placement rules of different types of silk screens may include one or more of the silk screen body, silk screen layer, interference area, optimization initial value, optimization position range, optimization target, silk screen direction, silk screen size, whether there is an associated position, whether it is allowed to be out of plane with the device, and silk screen optimization value.

[0035] Among them, the structured information SI in the pre-built placement rules of different types of silk screen printing can be expressed as: SI= [SA SL SIA OI OP OT SD SS AP DA OV]; Among them: SA represents the silk screen body area, SL represents the silk screen layer, SIA represents the silk screen interference area, SD represents the silk screen direction, SS represents the silk screen size, AP represents whether there is an associated position, DA represents whether it is allowed to be out of plane with the device, OI represents the individual optimization initial value, OP represents the optimization position range, OT represents the optimization target, and OV represents the silk screen optimization value.

[0036] For example, the structured information of the above pre-built device bit number silk screen placement rule can be: SA: device number silk screen; SL: default is the device side; SIA: the entire board area, including devices, pads, windows and other interference areas; OI: device frame area; OP: a certain distance around the device, 50mil-200mil is recommended, such as dense areas can increase the distance but need to be indicated; OT: device body; SD: from left to right or from bottom to top, the back silk screen needs to be mirrored; SS: normal size, 25mil-30mil is recommended; AP: yes; DA: no; OV: none.

[0037] The structured information of the above pre-built device identification silk screen placement rule can be: SA: device identification silk screen; SL: default is the device side; SIA: the entire board area, including devices, pads, windows and other interference areas; OI: device frame area; OP: a certain distance around the device, 50mil-200mil is recommended, such as dense areas can increase the distance but need to be indicated; OT: device body; SD: from left to right or from bottom to top, the back screen needs to be mirrored; SS: slightly larger than normal text, recommended to be more than 60mil; AP: yes; DA: no; OV: none.

[0038] For pin silk screen, it needs to be placed close to the device pin and as far as possible outside the device body. The silk screen directions of multiple pins of the same device should be kept consistent. Therefore, the structured information of the above pre-built package silk screen placement rules can be: SA: Text silk screen of device package; SL: Same side, back side or double side can be selected; SIA: The whole board area, including devices, pads, windows and other interference areas; OI: Device frame area; OP: A certain distance around the device, 50mil-200mil is recommended; OT: Device pins; SD: From left to right or from bottom to top, the back silk screen needs to be mirrored; SS: Normal size, 25mil-30mil or more is recommended; AP: Yes; DA: Yes; OV: No.

[0039] Generally, for different interface device pin networks, in order to facilitate wiring or debugging, the network signal silk screen is placed on the same side or back of the device, close to the pin, outside the device body, and the silk screen placement direction is kept consistent as much as possible. Therefore, the structured information of the above pre-constructed network label silk screen placement rules can be: SA: Text silk screen of device package; SL: Same side, back side or double side can be selected; SIA: The whole board area, including devices, pads, windows and other interference areas; OI: Device frame area; OP: A certain distance around the device, 50mil-200mil is recommended; OT: Device pins; SD: From left to right or from bottom to top, the back silk screen needs to be mirrored; SS: Normal size, 25mil-30mil or more is recommended; AP: Yes; DA: Yes; OV: No.

[0040] When pre-building the high-frequency signal silk screen placement rules, the high-frequency signal is obtained through the material, and then the PCB network signal link is obtained. Among them, the above-mentioned acquisition of the PCB network signal link can extract the signal link information from the PCB design file. The signal link refers to the path for the signal to be transmitted from one point (such as the pin of a chip) to another point (such as the pin or test point of another chip). This usually includes elements such as signal lines (Cline) and vias (Via). The process of defining the obtained PCB network signal link as an ordered dictionary structure T is: T = {"Key_num:Value"}; Among them, the Key_num type is Cline or Via and contains a digital identifier. Cline can include electrical characteristics such as line width, line length, impedance, etc., and Via can include information such as the diameter, depth, and connected layer of the via. The digital identifier is used to distinguish different instances of the same type (signal line or via) to ensure the uniqueness of each key. Value is the attribute field information of Cline or Via.

[0041] If there is high-frequency information on the PCB board and the link structure is at the TOP layer or BOT layer, it is necessary to obtain the structural information and convert it into geometric position information. At this time, the structured information of the constructed high-frequency signal silk screen placement rule can be: SA: None; SL: Actual level; SIA: TOP / BOTTOM geometric position of high-frequency information; OI: None; OP: None; OT: None; SD: None; SS: None; AP: None; DA: Yes; OV: None.

[0042] The structured information of the above pre-built pad and via silkscreen placement rules can be: SA: None; SL: Actual level; SIA: Hole structure automated test pad; OI: None; OP: None; OT: None; SD: None; SS: None; AP: None; DA: Yes; OV: None.

[0043] The structured information of the above-mentioned pre-built process or production device silk screen placement rules can be: SA: silk screen body area; SL: TOP / BOT or agreed level; SIA: the entire board area, including devices, pads, windows and other interference areas; OI: near the center point of the non-interference area in the plane; OP: None; OT: within the entire board; SD: from left to right or from bottom to top, the back screen needs to be mirrored; SS: None; AP: None; DA: Yes; OV: None.

[0044] The above-mentioned method of determining the structural parameters of each silk screen that the PCB board needs to be equipped with based on the types of each silk screen that the PCB board needs to be equipped with and the pre-constructed placement rules of different types of silk screens can be based on the types of each silk screen that the PCB board needs to be equipped with, determining the placement rules of silk screens corresponding to the types of silk screens that need to be equipped, and then determining the structural parameters of each silk screen that the PCB board needs to be equipped with based on the structured information of the placement rules of silk screens corresponding to the types of silk screens that need to be equipped.

[0045] Step S230, optimizing the structural parameters of each silk screen that needs to be equipped on the PCB board, and obtaining the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0046] In this step, the structural parameters of each silk screen that needs to be equipped on the PCB board are optimized to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board. The particle swarm algorithm can be used to optimize the multi-dimensional structural parameters of each silk screen that needs to be equipped on the PCB board to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0047] Step S240, using the optimization parameters of each silk screen that the PCB board needs to be equipped with, setting the initial configuration of each silk screen that the PCB board needs to be equipped with, and obtaining each initial configuration silk screen of the PCB board.

[0048] Step S250, based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, globally adjust each initial configuration silk screen to obtain each final configuration silk screen of the PCB board.

[0049] After optimizing the structural parameters of each silk screen that the PCB needs to be equipped with, and obtaining the optimized parameters of each silk screen that the PCB needs to be equipped with, the silk screen is placed in the corresponding spatial position, but there may be problems such as the silk screen position being reversed, the order being incorrect, and the relative position of the silk screen relative to the main body being inconsistent. In addition, the relationship between the silk screens may cause ambiguity in the silk screen text. Therefore, it is necessary to globally adjust each initial configuration silk screen to solve the above problems. The main body corresponding to the above silk screen can be the component corresponding to the silk screen.

[0050] The above-mentioned global adjustment of each initial configuration silk screen to obtain each final configuration silk screen of the PCB board can be achieved by introducing a genetic penalty function to adjust the crossover and ambiguity of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board. The above-mentioned genetic penalty function can be a method of adding a penalty term to the objective function to punish solutions that do not meet the constraints, thereby guiding the search process to a feasible solution. Specifically, it can be by constructing a silk screen cross penalty function and a silk screen ambiguity penalty function, and then using the silk screen cross penalty function and the silk screen ambiguity penalty function to target optimize the parameters of each initial configuration silk screen of the PCB board to obtain each final configuration silk screen of the PCB board.

[0051] The above steps S210 to S250, through the pre-constructed placement rules of different types of silk screens, can determine the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with when the types of silk screens that the PCB board needs to be equipped with are determined. The structural parameters corresponding to each silk screen that the PCB board needs to be equipped with are reduced in dimension by classifying the silk screens and determining the placement rules of silk screens of different classifications, and then the structural parameters of the silk screens after the dimension reduction are optimized to obtain the optimized parameters of each silk screen, and the initial configuration silk screens of the PCB board are obtained according to the optimized parameters of each silk screen. Because the silk screen at this time only performs dimensionality reduction and optimization of parameters based on a single silk screen, there may be problems such as intersection and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration silk screen to obtain the final configuration of each silk screen of the PCB board. This method supports the automatic silk screen arrangement of a new design, and is applicable to multiple types of silk screens in a variety of scenarios, and has universality. The solution solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0052] In one embodiment, step S230, optimizing the structural parameters of each silk screen that needs to be equipped on the PCB board to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board, includes: Step S232, using a particle swarm algorithm, optimizing and solving the multi-dimensional structural parameters of each silk screen that the PCB board needs to be equipped with, and obtaining the optimized parameters of each silk screen that the PCB board needs to be equipped with.

[0053] Among them, the above-mentioned particle swarm algorithm is used to optimize and solve the multi-dimensional structured parameters of each silk screen that needs to be equipped on the PCB board, and obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board. It can be based on the multi-dimensional structured parameters of each silk screen that needs to be equipped on the PCB board, construct the particle swarm parameters in the particle swarm algorithm, and define the rules of the particle swarm parameters in the particle swarm algorithm, and then, using the rules of the defined particle swarm parameters, the parameters of the reduced dimensions of each silk screen that needs to be equipped on the PCB board are optimized and solved, and the optimized parameters of each silk screen that needs to be equipped on the PCB board are obtained. Among them, the above-mentioned multi-dimensional structured parameters can include at least two of the position, size, color, font, direction, etc.

[0054] Specifically, in one embodiment, step S232 uses a particle swarm algorithm to optimize and solve the multi-dimensional structural parameters of each silk screen that the PCB board needs to be equipped with, and obtains the optimized parameters of each silk screen that the PCB board needs to be equipped with, including: Step S2322, based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, construct the particle swarm parameters in the particle swarm algorithm, and define the rules of the particle swarm parameters in the particle swarm algorithm; wherein the rules of the particle swarm parameters include solving the convergence range and the adjustment speed.

[0055] In this embodiment, through step S210, the types of each silk screen that the PCB board needs to be equipped with are determined, and the types of each silk screen that the PCB board needs to be equipped with are divided, and in step S220, according to the types of each silk screen that the PCB board needs to be equipped with, and the pre-constructed placement rules of different types of silk screens, the structural parameters of each silk screen that the PCB board needs to be equipped with are determined, and the structural parameters of each silk screen that the PCB board needs to be equipped with are reduced to two dimensions of type and structural parameters corresponding to each type. Based on this, the multi-dimensional parameters of multiple types are 2-dimensional structures. Therefore, based on the multi-dimensional structural parameters of each silk screen that the PCB board needs to be equipped with, the particle swarm parameters in the particle swarm algorithm are constructed, and the dimension of the constructed particle parameters is 2-dimensional.

[0056] The above-mentioned multi-dimensional structured parameters of each silk screen that needs to be equipped on the PCB board are used to construct the particle swarm parameters in the particle swarm algorithm. In the particle swarm algorithm, a community composed of N particles is constructed, each particle represents a silk screen individual, and has a 2-dimensional position vector X i and the 2D velocity vector V i , for the particularity of silk screen adjustment. The position vector X of each particle i satisfy: ; Among them, i represents the index of the particle, represents the i-th particle, and X i1 and X i2 Represents the spatial position vector of the particle in 2D space.

[0057] The flight speed of the i-th particle (the velocity vector V i )satisfy: ; V i1 and V i2 Represents the velocity vector of the particle in 2D space.

[0058] Particles evolve by updating their velocity and position. The velocity V of the particle id The updating process can be expressed as: ; Among them, ω is the inertia factor, C1 and C2 are acceleration constants, which are used to control the speed of particles approaching individual extreme values ​​and global extreme values ​​respectively, and are set to dynamic values. Random(0,1) represents a random number in the interval [0, 1], and X id is the particle's position vector, P id is the individual extreme value of the i-th variable, P gd is the global optimal solution, and d is the number of iterations.

[0059] The particle's position X id The updating process can be expressed as: ; In the process of particle swarm optimization, the exploration and development behavior of particles can be controlled by dynamically adjusting the inertia factor ω and the acceleration constants C1 and C2 in the iteration. The above three parameters change dynamically and adjust the law. The overall optimization process satisfies the law that the inertia factor ω decreases, C1 decreases, and C2 increases. After a limited number of iterations, the three parameters are quickly optimized to speed up the overall tuning efficiency. Due to the particularity of silk screen tuning, the values ​​of a limited number of times will be lower than other optimizations. After a limited number of iterations, the above-mentioned speeding up the overall tuning efficiency can be to adjust the convergence requirements of the parameters according to the overall characteristics of the silk screen adjustment, so that it converges quickly on the basis of meeting the adjustment requirements. Specifically, it can be to use the rules of the defined particle swarm parameters to optimize and solve the parameters of the reduced dimensions of each silk screen that the PCB board needs to be equipped with, and obtain the optimized parameters of each silk screen that the PCB board needs to be equipped with.

[0060] Step S2324, using the defined particle swarm parameter rules, the reduced-dimensional parameters of each silk screen that the PCB board needs to be equipped with are optimized and solved to obtain the optimized parameters of each silk screen that the PCB board needs to be equipped with.

[0061] When the particle swarm parameters reach the convergence condition, the optimal solution of the particle swarm is obtained. In the optimal solution of the particle swarm, each particle corresponds to a multi-dimensional parameter of a silk screen. Therefore, the optimization parameters of each silk screen that the PCB board needs to be equipped with can be determined according to the optimal solution of the particle swarm.

[0062] In the above steps S2322 to S2324, based on the multi-dimensional structured parameters of each silk screen that needs to be equipped on the PCB board, the particle swarm parameters in the particle swarm algorithm are constructed, and the rules of the particle swarm parameters in the particle swarm algorithm are defined. Then, the reduced dimension parameters of each silk screen that needs to be equipped on the PCB board are optimized by using the defined rules of the particle swarm parameters in the particle swarm algorithm to obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board. The optimization of a single silk screen is performed by determining the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0063] In addition, in one embodiment, the rules for defining the particle swarm parameters in the particle swarm algorithm include: Step S1, based on the size of the silk-screen body structure and the preset error range of the silk-screen position, determine the solution convergence range of the particle swarm parameter in the particle swarm algorithm.

[0064] Since the placement requirement of the silk screen is not to solve to the minimum point, the convergence range of the solution can be adjusted according to the size of the main structure combined with the minimum error range to improve the overall algorithm optimization efficiency; in addition, the speed of the silk screen needs to be dynamically adjusted according to the main size of the silk screen structure during adjustment, so that the result is easy to converge.

[0065] Based on this, the rules of particle swarm parameters can be defined. Specifically, the convergence range of the particle swarm parameters in the particle swarm algorithm can be determined based on the size of the silk screen body structure and the error range of the preset silk screen position.

[0066] The solution convergence range of the particle swarm parameters in the particle swarm algorithm can be expressed as: ; Among them, ePoilon is the convergence condition tolerance, is the coordinate value of the initial center point of the screen printing. The initial value is the closest position between the corresponding particle and the device path. Silk screen information coordinates of each path for a single device. The coordinates of each path information of a single device body; is the coordinate value of the device center point, and o is the converged maximum offset dynamic parameter combined with the size of the silk-screen structure.

[0067] Step S2, based on the size of the silk-screen body structure, determining the adjustment speed of the particle swarm parameters in the particle swarm algorithm.

[0068] The above-mentioned screen-printed body structure size determines the adjustment speed of the particle swarm parameters in the particle swarm algorithm, which can be expressed as: ; Among them, vLimit is the speed range of adjustment, L x is the horizontal distance of the silk screen path, L y is the vertical distance of the silk-screen path, i represents the number of iterations, a and b represent the acceleration constants of the speed range in the horizontal and vertical directions of the silk-screen, respectively, which are dynamically adjusted according to the size of the device body.

[0069] It should be noted that this embodiment lists the parameter optimization rules of the most influential factors in the particle swarm, and new optimization rules can also be added according to actual scenarios, which are not specifically limited in this embodiment.

[0070] In the above steps S1 to S2, the solution convergence range of the particle swarm parameters in the particle swarm algorithm is determined by the main structure size of the silk screen and the error range of the preset silk screen position, and then the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined based on the main structure size of the silk screen. The rules of the particle swarm parameters in the particle swarm algorithm are defined by determining the solution convergence range and adjustment speed of the particle swarm parameters in the particle swarm algorithm, so as to realize the use of the defined particle swarm parameter rules, and optimize the parameters after dimensionality reduction of each silk screen that needs to be equipped on the PCB board, and obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board.

[0071] In one embodiment, step S250, based on each initial configuration silk screen of the PCB board, the spatial position relationship between the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, globally adjust each initial configuration silk screen to obtain each final configuration silk screen of the PCB board, including: Step S252, based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, determine whether there is any intersection and ambiguity between the initial configuration silk screens of the PCB board.

[0072] In this step, the existence of intersections between the initial configuration silk screens of the PCB board refers to the situation that the relative positions of the initial configuration silk screens of the PCB board and the corresponding bodies are inconsistent. The existence of ambiguity between the initial configuration silk screens of the PCB board refers to the situation that the direction vector angles between the initial configuration silk screens of the PCB board are less than the preset ambiguity angle threshold, and the distances between the two are less than the preset ambiguity distance threshold.

[0073] Step S254, by introducing a genetic penalty function, the crossover and ambiguity between the initial configuration silk screens of the PCB board are adjusted to obtain the final configuration silk screens of the PCB board.

[0074] In the above steps S252 to S254, based on the spatial position relationship between the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial position relationship between the initial configuration silk screens of the PCB board, it is determined whether there is intersection and ambiguity between the initial configuration silk screens of the PCB board, and by introducing a genetic penalty function, the position space is changed or particles are pushed away from unreasonable positions, and the situation where there is intersection and ambiguity in the initial configuration silk screens of the PCB board is adjusted to obtain the final configuration silk screens of the PCB board. By adjusting the situation where there is intersection and ambiguity in the initial configuration silk screens of the PCB board, the problem of intersection and ambiguity in the positions between the initial configuration silk screens of the PCB board is solved.

[0075] In addition, in one embodiment, step S252, based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, determines whether there is intersection and ambiguity between each initial configuration silk screen of the PCB board, including: Step S2522, for each initial configuration silk screen of the PCB board, and the main body corresponding to the initial configuration silk screen, respectively define a boundary box to obtain each first boundary box and second boundary box of the PCB board; the first boundary box is the boundary box of the initial configuration silk screen, and the second boundary box is the boundary box of the main body corresponding to the initial configuration silk screen.

[0076] The first boundary box is used to indicate the position of the silk screen, and the second boundary box is used to indicate the position of the body corresponding to the silk screen. The shape of the boundary box can be set to one of a rectangle, a square, etc., and can also be set to other shapes according to specific circumstances, which is not specifically limited in this embodiment. The size of the boundary box can be specifically set according to specific needs, which is not specifically limited in this embodiment.

[0077] Step S2524, based on the consistency of the relative positions between the first boundary boxes and the second boundary boxes, determine whether there is an intersection between the initial configuration silk screens of the PCB board.

[0078] The above relative position may include the first bounding box being located above, below, to the left, or to the right of the second bounding box.

[0079] Specifically, when the relative positions of the first bounding box and the second bounding box of any two silk screens are consistent, there is no intersection between the two silk screens, and when the relative positions of the first bounding box and the second bounding box of any two silk screens are inconsistent, there is an intersection between the two silk screens. By traversing all silk screen pairs, it is determined whether there is an intersection between the initial configuration silk screens of the PCB board.

[0080] Step S2526, based on the spatial position relationship between the initial configuration silk screens of the PCB board, determine the direction vector angles and distances between each pair of initial configuration silk screens of the PCB board.

[0081] In order to calculate the angle between the direction vectors of the two silk screens, it is necessary to determine the direction vectors of the two silk screens. To determine the direction vectors of the two silk screens, it is necessary to determine them based on the starting point and the ending point of the two silk screens.

[0082] The specific process can be exemplified as follows: For example, the two silk screens are the first silk screen and the second silk screen, the starting point of the first silk screen is P1, the ending point is P2, the starting point of the second silk screen is P3, and the ending point is P4. Among them, the coordinates of P1 are (x1, y1), the coordinates of P2 are (x2, y2), the coordinates of P3 are (x3, y3), and the coordinates of P4 are (x4, y4).

[0083] The calculation process of the direction vector V1 of the first screen printing is as follows: V1=P2-P1=(x2-x1,y2-y1); The calculation process of the direction vector V2 of the second screen printing is as follows: V2=P4-P3=(x4-x3, y4-y3); The calculation process of the angle θ between the direction vectors of the first screen printing and the second screen printing is as follows: ; in, is the magnitude of the direction vector V1, is the magnitude of the direction vector V2.

[0084] The distance d between the first silk screen and the second silk screen can be calculated by the Euclidean distance formula: ; Step S2528, based on the direction vector angles and distances between each pair of initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold, determine whether there is ambiguity between each initial configuration silk screen of the PCB board; the preset ambiguous angle threshold is an angle value used to determine whether the angle between the direction vectors of the two silk screens meets the ambiguity judgment requirement; the preset ambiguous distance threshold is a distance value used to determine whether the distance between the two silk screens meets the ambiguity requirement.

[0085] For example, the preset ambiguous angle threshold is 45°, and the preset ambiguous distance threshold is 30 mil. Then, only when the direction vector angle between the two silk screens is less than 45° and the distance is less than 30 mil, it is determined that there is ambiguity between the two silk screens. Otherwise, there is no ambiguity between the two silk screens.

[0086] This embodiment determines whether there is ambiguity between the initial configuration silk screens of the PCB board by traversing all silk screen pairs.

[0087] In the above steps S2522 to S2528, by determining whether there is intersection and ambiguity between the initial configuration silk screens of the PCB board, it is convenient to subsequently adjust the situation where there is intersection and ambiguity between the initial configuration silk screens of the PCB board by introducing a genetic penalty function, so as to obtain the final configuration silk screens of the PCB board.

[0088] Further, in one embodiment, step S254, by introducing a genetic penalty function, adjusting the crossover and ambiguity between the initial configuration screens of the PCB board to obtain the final configuration screens of the PCB board, includes: Step S2542, constructing a screen printing cross penalty function based on the cross determination results between the initial configuration screen printings of the PCB board.

[0089] Specifically, the process of constructing the screen printing cross penalty function P(x) based on the cross judgment results between the initial configuration screen printings of the PCB board is as follows: ; g(x) is a constraint rule, which here refers to the function for determining whether the silk screens are crossed or connected in series.

[0090] Step S2544, constructing a silk screen ambiguity penalty function based on the ambiguity determination results between the silk screens of the various initial configurations of the PCB board.

[0091] Based on the above ambiguity judgment results between the initial configuration silk screens of the PCB board, the process of constructing the silk screen ambiguity penalty function Q (x) is as follows: ; Step S2546, using the screen printing cross penalty function and the screen printing ambiguity penalty function, the parameters of each initial configuration screen printing of the PCB board are targeted for optimization to obtain each final configuration screen printing of the PCB board.

[0092] The specific optimization process is as follows: ; Among them, f(x) is the particle swarm optimization objective function, and F(x) is the overall optimization objective function.

[0093] In the above steps S2542 to S2546, by constructing a silk screen cross penalty function and a silk screen ambiguity penalty function, and using the silk screen cross penalty function and the silk screen ambiguity penalty function, the parameters of each initial configuration silk screen of the PCB board are optimized, the unreasonable positions between the silk screens are adjusted, and the final configuration silk screens of the PCB board are obtained.

[0094] In one embodiment, step S210, determining the types of screen printing that the PCB board needs to be equipped with includes: Step S212, based on the PCB board and the configuration information corresponding to the PCB board, determine the types of silk screens that the PCB board needs to be equipped with; the configuration information includes circuit diagrams and text information.

[0095] The above-mentioned text information may include one or more of the text information of the device package, the network label, the material code, the device identification, and the text information of the production or process device, etc. The above-mentioned determination of the types of silk screens that the PCB board needs to be equipped with based on the PCB board and the configuration information corresponding to the PCB board may be based on the pads and vias that need to be equipped with silk screens in the PCB board, determining the pads and via silk screens that the PCB board needs to be equipped with, determining the text silk screens that the PCB board needs to be equipped with based on the text information in the configuration information corresponding to the PCB board, and determining the device silk screens that the PCB board needs to be equipped with based on the circuit diagram in the configuration information corresponding to the PCB board.

[0096] In addition, in one embodiment, the types of silk screen printing include pad and via silk screen printing, text silk screen printing and device silk screen printing; step S212, based on the PCB board and the configuration information corresponding to the PCB board, determines the types of each silk screen that the PCB board needs to be equipped with, including: Step S2122, based on the pads and vias that need to be equipped with silk screen printing in the PCB board, determine the pads and via silk screen printing that the PCB board needs to be equipped with.

[0097] There are generally two types of automated test pads, namely pads and vias. Among them, pads are used as device test points for manual or automated device testing; vias are used as test points through surface mount pad holes or through holes for automated testing. Automated testing itself generally does not add extra silk screen nodes, but due to its production test requirements, a steel mesh layer is generally added to protect the pads. For devices, since the body is larger than the pad, the automated test pad is placed in the general pad. For the hole structure automated test pad, a via structure with a steel mesh is obtained.

[0098] Among them, the steel mesh layer "Pastemask" is an important layer in PCB design. It is a key part of the soldering process for assembling surface mount devices (SMD). The role of the steel mesh is to prevent the solder paste from being applied to areas that should not be soldered when soldering SMD components. Solder paste is the material used to connect SMD components to PCB pads, and the Pastemask layer is like a "barrier" to ensure that the solder paste can only be applied to specific soldering areas. The design of the Pastemask layer is very important in the PCB manufacturing process because it directly affects the soldering quality and overall performance of SMD components. When designing a PCB, designers need to carefully consider the layout of the Pastemask layer and ensure that it matches other layers (such as pad layers, component layers, etc.) to ensure the accuracy and reliability of the soldering process.

[0099] In this step, the above-mentioned pads and vias that need to be equipped with silk screen in the PCB board are determined based on the pads and vias that need to be equipped with silk screen in the PCB board. The pads and vias that need to be equipped with silk screen in the PCB board can be determined based on the PCB board. Furthermore, based on the pads and vias that need to be equipped with silk screen in the PCB board, the pads and via silk screen that need to be equipped on the PCB board are determined.

[0100] Step S2124, based on the text information in the configuration information corresponding to the PCB board, determine the text silk screen that the PCB board needs to be equipped with; the text silk screen includes high-frequency signal silk screen, device identification silk screen, process or production device silk screen, package silk screen and network label silk screen.

[0101] Among them, the above-mentioned determination of the text silk screen that the PCB board needs to be equipped with based on the text information in the configuration information corresponding to the PCB board can be based on the text information of the device package in the text information to determine the package silk screen that the PCB board needs to be equipped with, based on the network label in the text information to determine the network label silk screen that the PCB board needs to be equipped with, based on the material code in the text information to determine the high-frequency signal silk screen that the PCB board needs to be equipped with, based on the device identification in the text information to determine the device identification silk screen that the PCB board needs to be equipped with, based on the production or process device text information in the text information to determine the process or production device silk screen that the PCB board needs to be equipped with, etc. It should be noted that other contents of the text information can also be set according to needs to determine other types of silk screens that the PCB board needs to be equipped with. The specific contents of the text information and the types of silk screens are not specifically limited in this embodiment.

[0102] Step S2126, based on the circuit diagram in the configuration information corresponding to the PCB board, determine the device silk screen that the PCB board needs to be equipped with; the device silk screen includes the device position number silk screen.

[0103] PCB contains multiple devices, and different devices correspond to different device names. The device names above use device numbers as unique identifiers to facilitate quick positioning of components during assembly, maintenance, and identification. The device numbers are usually represented by a combination of letters and numbers, with letters representing the type of components and numbers representing the number of components. For example, the device number of a resistor is R1, and the device number of a capacitor is C2.

[0104] In this step, the device silk screen that the PCB board needs to be equipped with is determined based on the circuit diagram in the configuration information corresponding to the PCB board. The device silk screen that the PCB board needs to be equipped with can be determined by reading the device bit numbers corresponding to different device names in the circuit diagram in the configuration information corresponding to the PCB board.

[0105] In the above steps S2122 to S2126, the types of silk screens that need to be equipped on the PCB board are determined based on the PCB board and the equipment information corresponding to the PCB board. The types of silk screens that need to be equipped on the PCB board are used to facilitate the subsequent determination of the structural parameters of the silk screens that need to be equipped on the PCB board according to the pre-constructed placement rules of different types of silk screens, so as to reduce the dimensionality of the structural parameters corresponding to the silk screens that need to be equipped on the PCB board to a two-dimensional space, so as to facilitate the subsequent optimization of the structural parameters of the silk screens after dimensionality reduction and obtain the optimized parameters of each silk screen.

[0106] Further, in one embodiment, the text screen printing includes high-frequency signal screen printing; the method further includes: Step S1, based on the material codes in the text information, determine the various materials to be equipped in the PCB board.

[0107] When performing PCB silk screen configuration, the silk screen material itself has a certain dielectric constant. When it is placed on the transmission path of high-frequency or radio frequency signals, it will change the reference material dielectric constant of the original signal. Because the wavelength of low-frequency signals is longer and the sensitivity to material properties is lower, this change is usually insensitive to low-frequency signals. However, for high-frequency signals, due to the shortened wavelength, the signal becomes extremely sensitive to changes in material properties, and changes in dielectric constants can lead to significant changes in signal transmission characteristics, such as impedance mismatch. Inconsistent impedance will cause a great waste of energy and increase in loss, and cannot be optimized at the algorithm level. Therefore, when performing PCB silk screen configuration, it is necessary to identify the high-frequency signal network, that is, to determine the materials with high-frequency signals in the PCB board. Specifically, the method for determining the materials with high-frequency signals in the PCB board can be based on the material code in the text information, determine the various materials to be equipped in the PCB board, and then use the preset simulation signal database to simulate the various materials to be equipped in the PCB board to determine the materials with high-frequency signals in the PCB board.

[0108] Because the material code is the unique code of the material, the various materials to be equipped in the PCB board can be determined through the material code in the text information.

[0109] Step S2, using a preset simulation signal database, simulates each material to be equipped in the PCB board to determine the material with high-frequency signal in the PCB board.

[0110] The preset simulation signal database may be a collection of signal data generated during various simulation experiments or simulation processes. The signal may include time series data of various physical quantities such as voltage, current, frequency, phase, etc. In addition, the simulation signal database may include information such as material code, material description, frequency range, application scenario, etc.

[0111] The preset simulation signal database is a pre-established material-based simulation signal database, which is used to input various materials to be equipped in the PCB board into the preset simulation signal database for simulation, and determine the materials with high-frequency signals in the PCB board. Specifically, the preset simulation signal database can be used to match various materials to be equipped in the PCB board to simulation signal data related to the current material, and determine them as materials with high-frequency signals in the PCB board.

[0112] Before using the preset simulation signal database to simulate various materials to be equipped in the PCB board and determine the materials with high-frequency signals in the PCB board, it is necessary to build a preset simulation signal database. The above-mentioned construction of the preset simulation signal database can be to identify the high-frequency signal network through devices such as radio frequency modules, identify the network path of the resistance, capacitance, and inductance devices of the high-frequency matching circuit, connect the high-frequency signal main loop in series, generate complete high-frequency signal network data, and then build a preset simulation signal database based on the complete high-frequency signal network data.

[0113] For example, the above simulation signal database can be shown in Table 1: Table 1

[0114] Among them: "New Part Number" is the material code; "PIN Number" is the pin number; "XNet Name" is the network name, which is used to indicate the original network name of the pin and match the network name in the actual project; "BUS NAME" is the network group name; "Net Type" is the network type, which can be used to judge the subtype of the signal, and then different electrical templates can be applied to determine the simulation results; "Edge sampling" is edge sampling, which can be used to judge the actual operating rate of the signal; "Signal Type" is the signal protocol type, and the signal type of this network can be determined through this field. "Impedance" is the nominal impedance value of the signal, which is used as the basis for impedance analysis. "WI-FI" is a wireless local area network technology that allows electronic devices to connect to the network through wireless signals, thereby realizing data transmission and Internet access. It should be noted that depending on the simulation type, the field design will be adjusted according to the specific scenario. For example, when performing active simulation of signals and power supplies, classification fields for active device models can be added.

[0115] Step S3, based on the material with high-frequency signals in the PCB board, determine the high-frequency signal screen printing to be provided in the PCB board.

[0116] In the above steps S1 to S3, the various materials to be equipped in the PCB board are determined based on the material codes in the text information, and then, the various materials to be equipped in the PCB board are simulated using a preset simulation signal database, and the materials with high-frequency signals in the PCB board are determined based on the output signals in the simulation. Finally, based on the materials with high-frequency signals in the PCB board, the high-frequency signal silk screen to be equipped in the PCB board is determined.

[0117] Figure 3 Schematic diagram of PCB screen printing configuration results provided by an embodiment of the present application. Figure 3As shown, yellow is the device position number silk screen, white is the device identification silk screen, green is the package silk screen, and blue is the network label silk screen. This silk screen is currently placed on the back of the device.

[0118] The present embodiment is described and illustrated below through preferred embodiments.

[0119] Figure 4 1 is a flow chart of a PCB screen printing configuration method provided by a preferred embodiment of the present application. Figure 4 As shown, the PCB screen printing configuration method includes the following steps: Step S401, determining the types of silk screens that the PCB board needs to be equipped with; Step S402, determining structural parameters of each silk screen that the PCB board needs to be equipped with based on the types of each silk screen that the PCB board needs to be equipped with and the pre-built placement rules of different types of silk screens; Step S403, based on the multi-dimensional structured parameters of each silk screen that the PCB board needs to be equipped with, construct the particle swarm parameters in the particle swarm algorithm, and define the rules of the particle swarm parameters in the particle swarm algorithm; wherein the rules of the particle swarm parameters include solving the convergence range and the adjustment speed; Step S404, using the defined particle swarm parameter rules, optimizing and solving the dimension-reduced parameters of each silk screen that the PCB board needs to be equipped with, and obtaining the optimized parameters of each silk screen that the PCB board needs to be equipped with; Step S405, using the optimization parameters of each silk screen that the PCB board needs to be equipped with, setting the initial configuration of each silk screen that the PCB board needs to be equipped with, and obtaining each initial configuration silk screen of the PCB board; Step S406, based on the spatial position relationship between each initial configuration silk screen of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, determine whether there is intersection and ambiguity between each initial configuration silk screen of the PCB board; Step S407, constructing a screen printing cross penalty function based on the cross determination results between the screen printings of each initial configuration of the PCB board; Step S408, constructing a screen printing ambiguity penalty function based on the ambiguity determination results between the initial configuration screen printings of the PCB board; Step S409, using the screen printing cross penalty function and the screen printing ambiguity penalty function, target optimization is performed on the parameters of each initial configuration screen printing of the PCB board to obtain each final configuration screen printing of the PCB board.

[0120] The above steps S401 to S409, through the pre-constructed placement rules of different types of silk screens, can determine the structural parameters corresponding to each silk screen that the PCB board needs to be equipped with when the types of silk screens are determined. The structural parameters corresponding to each silk screen that the PCB board needs to be equipped with are reduced in dimension by classifying the silk screens and determining the placement rules of silk screens of different classifications, and then the structural parameters of the silk screens after the dimension reduction are optimized to obtain the optimized parameters of each silk screen, and the initial configuration silk screens of the PCB board are obtained according to the optimized parameters of each silk screen. Because the silk screen at this time only reduces the dimension and optimizes the parameters based on a single silk screen, there may be problems such as intersection and ambiguity between the silk screens. Therefore, it is necessary to globally adjust the initial configuration silk screen to obtain the final configuration of each silk screen of the PCB board. This method supports the automatic silk screen arrangement of a new design, and is applicable to multiple types of silk screens in a variety of scenarios, and has universality. The solution solves the problem that the existing PCB silk screen configuration method does not support the automatic silk screen layout of new designs, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0121] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0122] Based on the same inventive concept, a PCB screen printing configuration device is also provided in this embodiment, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. The terms "module", "unit", "subunit", etc. used below can implement a combination of software and / or hardware for a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0123] In one embodiment, Figure 5 : is a structural block diagram of a PCB screen printing configuration device provided in an embodiment of the present application, such as Figure 5 As shown, the PCB screen printing configuration device includes: A type determination module 51 is used to determine the types of silk screens that the PCB board needs to be equipped with; A parameter determination module 52, for determining structural parameters of each silk screen that the PCB needs to be equipped with based on the types of each silk screen that the PCB needs to be equipped with and the pre-built placement rules of different types of silk screens; The optimization module 53 is used to optimize the structural parameters of each silk screen that needs to be equipped on the PCB board, and obtain the optimized parameters of each silk screen that needs to be equipped on the PCB board; The screen printing setting module 54 is used to set the initial configuration of each screen printing required for the PCB board by using the optimized parameters of each screen printing required for the PCB board, and obtain each initial configuration screen printing of the PCB board; And an adjustment module 55 is used to globally adjust each initial configuration silk screen based on each initial configuration silk screen of the PCB board, the spatial position relationship between the body corresponding to the silk screen, and the spatial position relationship between each initial configuration silk screen of the PCB board, so as to obtain each final configuration silk screen of the PCB board.

[0124] The above-mentioned PCB screen printing configuration device, through the pre-constructed placement rules of different types of screen printing, can determine the structural parameters corresponding to each screen printing that the PCB board needs to be equipped with when the types of each screen printing that the PCB board needs to be equipped with are determined. It reduces the dimension of the structural parameters corresponding to each screen printing that the PCB board needs to be equipped with by classifying the screen printing and determining the placement rules of the screen printing of different classifications, and then optimizes the structural parameters of the screen printing after the dimension reduction to obtain the optimized parameters of each screen printing, and obtains each initial configuration screen printing of the PCB board according to the optimized parameters of each screen printing. Because the screen printing at this time only reduces the dimension and optimizes the parameters based on a single screen printing, there may be problems such as intersection and ambiguity between the screen printings. Therefore, it is necessary to globally adjust the initial configuration screen printing to obtain the final configuration of each screen printing of the PCB board. This method supports the arrangement of newly designed automated screen printing, and is applicable to multiple types of screen printing in various scenarios, and has universality. It solves the problem that the existing PCB screen printing configuration method does not support the arrangement of newly designed automated screen printing, has a small application range, and cannot meet complex and diverse scenarios and business needs.

[0125] It should be noted that the above modules can be functional modules or program modules, and can be implemented by software or hardware. For modules implemented by hardware, the above modules can be located in the same processor; or the above modules can be located in different processors in any combination.

[0126] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, any one of the PCB screen printing configuration methods in the above embodiments is implemented.

[0127] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0128] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0129] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A PCB screen printing configuration method, characterized in that: The method comprises: Determine the types of silk screens that the PCB board needs to be equipped with; Determining structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the types of each of the silk screens that the PCB board needs to be equipped with and pre-constructed placement rules of different types of silk screens; Optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with, and obtaining the optimized parameters of each of the silk screens that the PCB board needs to be equipped with; Using the optimization parameters of each of the silk screens that the PCB board needs to be equipped with, setting the initial configuration of each of the silk screens that the PCB board needs to be equipped with, and obtaining each initial configuration silk screen of the PCB board; Based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the main body corresponding to the initial configuration silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, each of the initial configuration silk screens is globally adjusted to obtain each of the final configuration silk screens of the PCB board.

2. The PCB screen printing configuration method according to claim 1, characterized in that: The optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with includes: The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each of the silk screens that the PCB board needs to be equipped with, so as to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

3. The PCB screen printing configuration method according to claim 2, characterized in that: The particle swarm algorithm is used to optimize and solve the multi-dimensional structural parameters of each screen printing that the PCB board needs to be equipped with, and the optimized parameters of each screen printing that the PCB board needs to be equipped with are obtained, including: Based on the multi-dimensional structured parameters of each of the silk screens that the PCB board needs to be equipped with, a particle swarm parameter in the particle swarm algorithm is constructed, and a rule of the particle swarm parameter in the particle swarm algorithm is defined; wherein the rule of the particle swarm parameter includes solving a convergence range and an adjustment speed; By using the defined particle swarm parameter rules, the dimension-reduced parameters of each of the silk screens that the PCB board needs to be equipped with are optimized and solved to obtain the optimized parameters of each of the silk screens that the PCB board needs to be equipped with.

4. The PCB screen printing configuration method according to claim 3, characterized in that: The rules for defining the particle swarm parameters in the particle swarm algorithm include: Based on the size of the silk-screen body structure and the error range of the preset silk-screen position, determining the solution convergence range of the particle swarm parameter in the particle swarm algorithm; Based on the size of the main structure of the silk screen, the adjustment speed of the particle swarm parameters in the particle swarm algorithm is determined.

5. The PCB screen printing configuration method according to claim 1, characterized in that: The method of globally adjusting each of the initial configuration silk screens based on each of the initial configuration silk screens of the PCB board, and obtaining each of the final configuration silk screens of the PCB board, comprises: Based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, determine whether there is intersection and ambiguity between each of the initial configuration silk screens of the PCB board; By introducing a genetic penalty function, the crossover and ambiguity between the initial configuration silk screens of the PCB board are adjusted to obtain the final configuration silk screens of the PCB board.

6. The PCB screen printing configuration method according to claim 5, characterized in that: The determining whether there is intersection and ambiguity between the initial configuration silk screens of the PCB board based on the spatial position relationship between the initial configuration silk screens of the PCB board and the bodies corresponding to the initial configuration silk screens, and the spatial position relationship between the initial configuration silk screens of the PCB board, includes: For each of the initial configuration silk screens of the PCB board and the body corresponding to the initial configuration silk screen, a bounding box is defined respectively to obtain a first bounding box and a second bounding box of the PCB board; the first bounding box is the bounding box of the initial configuration silk screen, and the second bounding box is the bounding box of the body corresponding to the initial configuration silk screen; Based on the consistency of the relative positions between the first boundary boxes and the second boundary boxes, determining whether there is an intersection between the initial configuration silk screens of the PCB board; Based on the spatial positional relationship between the initial configuration silk screens of the PCB board, determining the direction vector angles and distances between each of the initial configuration silk screens of the PCB board; Based on the direction vector angles and distances between each of the initial configuration silk screens of the PCB board, as well as a preset ambiguous angle threshold and a preset ambiguous distance threshold, it is determined whether there is ambiguity between each of the initial configuration silk screens of the PCB board; the preset ambiguous angle threshold is an angle value used to determine whether the angle between the direction vectors of the two silk screens meets the ambiguity judgment requirement; the preset ambiguous distance threshold is a distance value used to determine whether the distance between the two silk screens meets the ambiguity requirement.

7. The PCB screen printing configuration method according to claim 6, characterized in that: The method of introducing a genetic penalty function to adjust the situation where there are crossovers and ambiguities between the initial configuration screen prints of the PCB board to obtain the final configuration screen prints of the PCB board includes: Based on the intersection determination results between the initial configuration silk screens of the PCB board, constructing a silk screen intersection penalty function; Based on the ambiguity determination results between the initial configuration silk screens of the PCB board, construct a silk screen ambiguity penalty function; The silk screen cross penalty function and the silk screen ambiguity penalty function are used to optimize the parameters of each of the initial configuration silk screens of the PCB board to obtain each of the final configuration silk screens of the PCB board.

8. The PCB screen printing configuration method according to claim 1, characterized in that: Determining the types of silk screens that the PCB board needs to be equipped with includes: Based on the PCB board and the configuration information corresponding to the PCB board, the types of each of the silk screens that the PCB board needs to be equipped with are determined; the configuration information includes a circuit diagram and text information.

9. The PCB screen printing configuration method according to claim 8, characterized in that: The types of silk screen printing include pad and via silk screen printing, text silk screen printing and device silk screen printing; the determining the types of each silk screen printing that the PCB board needs to be equipped with based on the PCB board and the configuration information corresponding to the PCB board includes: Based on the pads and vias that need to be equipped with silk screen printing in the PCB board, determine the pads and via silk screen printing that need to be equipped on the PCB board; Based on the text information in the configuration information corresponding to the PCB board, determine the text silk screen that the PCB board needs to be equipped with; the text silk screen includes high-frequency signal silk screen, device identification silk screen, process or production device silk screen, package silk screen and network label silk screen; Based on the circuit diagram in the configuration information corresponding to the PCB board, determine the device silk screen that the PCB board needs to be equipped with; the device silk screen includes the device position number silk screen.

10. The PCB screen printing configuration method according to claim 9, characterized in that: The text screen printing includes high-frequency signal screen printing; the method further includes: Based on the material codes in the text information, determine the materials to be included in the PCB board; Using a preset simulation signal database, simulating each of the materials to be equipped in the PCB board, and determining the materials in the PCB board having high-frequency signals; Based on the material having high-frequency signals in the PCB board, the high-frequency signal silk screen to be provided in the PCB board is determined.

11. The PCB screen printing configuration method according to claim 1, characterized in that: The placement rules of different types of silk screen printing include at least one of basic silk screen printing placement rules, high-frequency signal silk screen printing placement rules, pad and via silk screen printing placement rules, and process or production device silk screen printing placement rules; the basic silk screen printing placement rules include device position number silk screen printing placement rules, device identification silk screen printing placement rules, package silk screen printing placement rules, and network label silk screen printing placement rules.

12. A PCB screen printing configuration device, characterized in that: The device comprises: A type determination module is used to determine the types of silk screens that the PCB board needs to be equipped with; A parameter determination module, used to determine the structural parameters of each of the silk screens that the PCB board needs to be equipped with based on the types of each of the silk screens that the PCB board needs to be equipped with and the pre-constructed placement rules of different types of silk screens; An optimization module, used for optimizing the structural parameters of each of the silk screens that the PCB board needs to be equipped with, and obtaining the optimized parameters of each of the silk screens that the PCB board needs to be equipped with; A screen printing setting module, used to set the initial configuration of each screen printing that needs to be equipped on the PCB board by using the optimization parameters of each screen printing that needs to be equipped on the PCB board, and obtain each initial configuration screen printing of the PCB board; and an adjustment module, for globally adjusting each of the initial configuration silk screens of the PCB board based on the spatial position relationship between each of the initial configuration silk screens of the PCB board and the body corresponding to the silk screen, and the spatial position relationship between each of the initial configuration silk screens of the PCB board, so as to obtain each of the final configuration silk screens of the PCB board.

13. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the PCB screen printing configuration method described in any one of claims 1 to 11 are implemented.

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