77GHZ millimeter wave automobile radar PCB processing method

Abstract

The embodiment of the invention discloses a 77GHZ millimeter wave automobile radar PCB processing method, and relates to the technical field of printed circuit substrates, and the method comprises the steps: obtaining a PCB, carrying out the browning copper reduction processing of the PCB, carrying out the laser drilling processing through a laser drilling technology, and carrying out the hole filling electroplating processing of the laser drilling; manufacturing an inner-layer circuit, performing automatic optical detection on the inner-layer circuit, performing lamination treatment on the multi-layer board, performing mechanical drilling treatment again, performing copper deposition and electroplating treatment, performing special polishing treatment on surface copper, manufacturing an outer-layer circuit and performing automatic optical detection; and carrying out line PAD position gain compensation increase and pattern plating or etching treatment on the outer layer line, printing a solder mask layer, carrying out post-baking treatment on the solder mask layer, and then carrying out gold immersion treatment to obtain the processed PCB. High-quality, high-reliability and high-performance production of the circuit board is achieved, and therefore the problems that in the prior art, the process is tedious, the manufacturing quality is poor and the manufacturing cost is high can be effectively solved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit substrates, and in particular to a method for processing a 77 GHz millimeter wave automobile radar PCB board. Background Art

[0002] In the production process of 77GHz millimeter wave automotive radar PCB board, the existing technology mainly relies on traditional processing methods. This method usually includes mechanical drilling of the inner layer L1-L2 thin core board (high-frequency layer with thickness ≤ 0.25mm) and then plasma treatment, and then a series of complex steps such as wet degumming, copper deposition, board plating, negative film dry film, negative film plating, hole point grinding, inner layer circuit production, inner layer etching, AO I (automatic optical inspection) and browning. After that, it is pressed with other FR4 layers.

[0003] However, this method has many disadvantages. First, due to the cumbersome process, especially when the thickness of the thin plate is less than 0.25mm, the plate is prone to folding during the copper deposition and plate plating of the gantry line, and the addition of edge strips may cause uneven copper plating. Secondly, this method greatly increases the production cost and involves multiple steps and multiple materials. Furthermore, the sharp angle of the outer antenna element square PAD is difficult to meet the accuracy requirement of 90°±3°, and the copper reduction surface uniformity of the DES copper reduction process is also poor, and the extreme difference may exceed 8UM, which leads to the etching factor and the sharpness of the antenna right angle cannot meet the requirements. In addition, the size of the line width burrs is also uneven during high-frequency line etching, which affects the signal integrity quality and performance of the product.

[0004] Therefore, a 77GHZ millimeter-wave automotive radar PCB board processing method is needed that can ensure the right-angle sharpness of the outer antenna square PDA and the high-frequency circuit processing accuracy, and has a simple process and high production efficiency. Summary of the invention

[0005] The embodiments of the present invention provide a 77 GHZ millimeter wave automotive radar PCB board processing method to solve the problems of cumbersome processes, poor manufacturing quality and high production costs in the prior art. The technical solution is as follows:

[0006] According to one aspect of the present invention, a 77 GHZ millimeter wave automotive radar PCB board processing method comprises: obtaining a PCB board, performing a browning and copper reduction treatment on the PCB board, performing a laser drilling treatment using a laser drilling technology, and performing a hole-filling and electroplating treatment on the laser drilled holes; making an inner layer circuit, performing an automated optical inspection on the inner layer circuit, laminating the inner layer core board material and performing a mechanical drilling treatment again to obtain a basic circuit board; performing copper deposition and electroplating treatment on the basic circuit board, performing a special polishing treatment on the surface copper, making an outer layer circuit and performing an automated optical inspection; performing special gain compensation on the circuit PAD positions of the positive and negative films of the outer layer circuit, performing a pattern plating and a negative film acid etching treatment, printing a solder mask layer, performing a post-baking treatment on the solder mask layer, and then performing an immersion gold treatment to obtain a processed PCB board.

[0007] In one of the embodiments, the obtaining of PCB board materials and the browning and copper reduction treatment of the PCB board materials are achieved by the following steps: the copper clad board is cut by a cutting machine to obtain a copper core board, and the copper core board is browned and copper reduced by using a browning solution.

[0008] In one embodiment, laser drilling processing using laser drilling technology is achieved through the following steps: laser drilling is performed on the high-frequency thin core board layer to form a controlled depth blind hole on the copper sheet with the hole diameter, depth, and bottom residual copper layer thickness being all set values.

[0009] In one of the embodiments, the electroplating treatment for filling laser drilled holes is achieved by the following steps: the plate after drilling is subjected to hole metallization treatment to form a conductive layer in the substrate area in the middle of the plate, so that the thickness of the copper layer is a set value; the plate after copper deposition is subjected to electroplating to fill the laser holes with thickened copper, and the surface copper is thickened to a set range to achieve conductivity between layers.

[0010] In one of the embodiments, the inner layer circuit is manufactured and the automatic optical inspection of the inner layer circuit is achieved by the following steps: a dry film is attached to the board surface, and after the film is aligned, ultraviolet light is irradiated on the exposure machine to make the dry film not shielded by the film react to form the desired circuit pattern on the board surface; the film not irradiated by light is dissolved by the developer, the exposed copper is etched away by the acid etching solution, and the film is removed by the film stripping section to obtain the inner layer circuit pattern.

[0011] In one of the embodiments, the inner core board material is laminated and then mechanically drilled again to obtain a basic circuit board through the following steps: the inner core board material is laminated by stacking and prepreg to obtain a multi-layer board, when the temperature reaches a set value, the resin of the semi-preg flows and solidifies to bond the multi-layer board; through holes are drilled in the multi-layer board by mechanical drilling, and the inner layer is connected to other layers by copper deposition and board plating.

[0012] In one embodiment, the base circuit board is subjected to copper deposition and electroplating treatments, and the surface copper is subjected to special polishing treatments through the following steps: the mechanically drilled through holes are subjected to hole metallization treatments to form a conductive layer in the substrate area in the middle of the plate, and the surface copper layer of the plate after copper deposition is thickened by electroplating to make the copper thickness within a set range.

[0013] In one embodiment, the outer layer circuit is produced and the automated optical inspection is performed by the following steps: a dry film is attached to the board surface, and after alignment with a film, ultraviolet light is irradiated on an exposure machine to make the dry film not masked by the film react and form the required circuit pattern on the board surface; the film not irradiated by light is dissolved by the developing section under the action of the developer to obtain the area requiring acid etching.

[0014] In one of the embodiments, the line PAD position increase gain compensation and pattern plating or etching treatment of the outer layer circuit is achieved by the following steps: the line PAD position increase gain compensation of the outer layer circuit is performed in an equilateral square according to the distance from the right-angled top of the antenna square PAD to the quadrilateral top angle; the copper layer is corroded by chemical solutions, and the dry film is removed after the etching is completed to obtain the outer layer circuit pattern.

[0015] In one of the embodiments, printing a solder resist layer, post-baking the solder resist layer, and then performing an immersion gold treatment to obtain a processed PCB board is achieved by the following steps: using a silk screen to leak-print the solder resist mud on the board surface and pre-baking to remove volatilization to form a semi-cured film layer, printing the solder resist layer through in-position exposure, solder resist film cross-linking reaction and alkaline solution development, and depositing a metal nickel layer and a gold layer on the copper surface through a chemical replacement reaction to obtain a processed PCB board.

[0016] The beneficial effects brought by the technical solution provided by the present invention are:

[0017] In the above technical scheme, the present invention adopts browning and copper reduction treatment, which not only enhances the surface adhesion of the PCB board, but also effectively reduces the thickness of the copper layer, ensures that the laser technology is used for drilling to solve the problem of residual glue at the bottom, and combines the hole filling electroplating technology to ensure the uniformity and conductivity of the copper layer on the hole wall, improves the reliability and stability of the circuit board, and optimizes the performance of the antenna by adding gain compensation at the line PAD position, ensuring the accuracy and sensitivity of the millimeter wave radar. The insulation and heat resistance of the circuit board are further enhanced by printing the solder mask and performing post-baking treatment, while the immersion gold treatment improves the oxidation resistance and conductivity of the circuit board, prolongs the service life of the product, and realizes the high-quality, high-reliability and high-performance production of the circuit board, thereby effectively solving the problems of cumbersome processes, poor manufacturing quality and high production costs in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0019] Figure 1 The figure is a schematic structural diagram of a method for processing a 77 GHZ millimeter wave automotive radar PCB board according to an exemplary embodiment. DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be interpreted as limiting the present invention.

[0021] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "one", "said", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present disclosure refers to the presence of the features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0022] To this end, the present invention provides a 77GHZ millimeter wave automobile radar PCB board processing method, which solves the problem of residual glue at the bottom by using browning copper reduction treatment and ensuring laser technology for drilling treatment, combines hole filling electroplating technology, and adds gain compensation at the line PAD position to achieve high-quality, high-reliability and high-performance production of circuit boards, effectively solving the problems of cumbersome processes, poor manufacturing quality and high production costs in the prior art. A 77GHZ millimeter wave automobile radar PCB board processing method in an embodiment of the present invention can be applied to a variety of scenarios, such as 77GHZ millimeter wave automobile radar PCB board processing, etc.

[0023] See also Figure 1 The embodiment of the present invention provides a 77GHZ millimeter wave automobile radar PCB board processing method.

[0024] In the following method embodiments, for ease of description, the execution subject of each step of the method is taken as an electronic device as an example for illustration, but this does not constitute a specific limitation.

[0025] like Figure 1 As shown, the method may include the following steps:

[0026] Step 110, obtaining a PCB board, performing a browning and copper reduction treatment on the PCB board, performing a laser drilling treatment using a laser drilling technology, and performing a hole-filling and electroplating treatment on the laser-drilled holes.

[0027] In a possible implementation, the copper clad laminate is cut by a cutting machine to obtain a copper core laminate, and a browning solution is used to perform a browning treatment on the copper core laminate to reduce copper.

[0028] In a possible implementation, a high-frequency thin core board layer is laser drilled on a copper sheet to form a depth-controlled blind hole whose hole diameter, depth, and bottom residual copper layer thickness are all set values.

[0029] In one possible implementation, the plate after drilling is subjected to hole metallization treatment to form a conductive layer in the substrate area in the middle of the plate, so that the thickness of the copper layer is a set value, and the plate after copper deposition is subjected to laser copper filling by electroplating, and the surface copper is thickened to a set range to allow conduction between layers.

[0030] Step 130, making inner layer circuits, performing automated optical inspection on the inner layer circuits, laminating the inner layer core material and performing mechanical drilling again to obtain a basic circuit board.

[0031] In one possible implementation, a dry film is attached to the board surface, and after the film is aligned, ultraviolet light is irradiated on an exposure machine to react with the dry film not masked by the film, forming the desired circuit pattern on the board surface, dissolving the film not irradiated by light with a developer, etching away the exposed copper with an acidic etching solution, and removing the film with a film stripping section to obtain the inner layer circuit pattern.

[0032] In one possible implementation, a multilayer board is obtained by stacking and laminating the inner core board material with a semi-cured sheet. When the temperature reaches a set value, the resin of the semi-cured sheet flows and solidifies to bond the multilayer boards. Through holes are drilled in the multilayer board by mechanical drilling, and the inner layer is connected to other layers by copper deposition and board plating.

[0033] Step 150, copper deposition and electroplating are performed on the base circuit board, and the surface copper is specially polished, and the outer layer circuit is produced and automated optical inspection is performed.

[0034] In one possible implementation, the through holes drilled mechanically are metallized to form a conductive layer in the substrate area in the middle of the board, and the copper layer of the board after copper deposition is thickened by electroplating so that the copper thickness is within a set range.

[0035] In one possible implementation, a dry film is pasted on the board surface, and after alignment with the film, ultraviolet light is used on an exposure machine to cause the dry film not masked by the film to react and form the required circuit pattern on the board surface. The film not irradiated by light is dissolved by the developing section under the action of the developer to obtain the area requiring acid etching.

[0036] Step 170, special gain compensation is performed on the circuit PAD positions of the positive film and the negative film of the outer layer circuit, and pattern plating and negative film acid etching are performed, and the solder mask layer is printed and post-baked and gold-immersion treated to obtain a processed PCB board.

[0037] In one possible implementation, the PAD position of the outer layer circuit is increased to compensate for gain according to the distance from the right-angled top of the antenna PAD to the top corner of the quadrilateral in an equilateral square. The copper layer is etched by chemical solutions, and the dry film is removed after etching to obtain the outer layer circuit pattern.

[0038] In one possible implementation, solder mask is printed on the board surface with a silk screen, and volatilization is removed by pre-baking to form a semi-cured film layer. The solder mask layer is printed through the positioning exposure, cross-linking reaction of the solder mask and development of alkaline solution. Through chemical replacement reaction, a metal nickel layer and a gold layer are deposited on the copper surface to obtain a processed PCB board.

[0039] Through the above process, the embodiment of the present invention adopts browning and copper reduction treatment, which not only enhances the surface adhesion of the PCB board, but also effectively reduces the thickness of the copper layer, ensures that the laser technology is used for drilling to solve the problem of residual glue at the bottom, and combines the hole filling electroplating technology to ensure the uniformity and conductivity of the copper layer on the hole wall, thereby improving the reliability and stability of the circuit board. By adding gain compensation at the line PAD position, the performance of the antenna is optimized, and the accuracy and sensitivity of the millimeter wave radar are ensured. The insulation and heat resistance of the circuit board are further enhanced by printing the solder mask and performing post-baking treatment. The immersion gold treatment improves the oxidation resistance and conductivity of the circuit board, prolongs the service life of the product, and realizes the high-quality, high-reliability and high-performance production of the circuit board, thereby effectively solving the problems of cumbersome processes, poor manufacturing quality and high production costs in the prior art.

[0040] In one application scenario, the 77 GHZ millimeter wave automobile radar PCB board processing method of the present invention is used to process the PCB board.

[0041] Specifically, firstly, select PCB boards that meet the requirements as the basic materials for processing. These boards should have appropriate thickness, good conductivity and insulation to meet the working requirements of 77GHZ millimeter-wave automotive radar. Then, the obtained PCB boards are subjected to browning and copper reduction treatment. The purpose of this step is to remove part of the copper layer on the surface of the board by chemical methods and enhance its surface adhesion to facilitate subsequent processing. The thickness of the copper layer of the board after browning and copper reduction treatment should be controlled within a certain range to ensure the accuracy and stability of subsequent processing.

[0042] Furthermore, laser technology is used to drill holes in the plate. Compared with traditional mechanical drilling, laser drilling has higher precision and efficiency and can accurately form the required holes on the plate. At the same time, laser drilling can also reduce the breakage and deformation of the plate and improve the processing quality.

[0043] Furthermore, the plate after drilling is subjected to hole-filling electroplating treatment. The purpose of this step is to form a uniform copper plating layer in the hole to achieve conduction of the inner layer circuit. The hole-filling electroplating treatment should ensure that the plating thickness is uniform and flawless to ensure the smooth progress of subsequent processing.

[0044] Furthermore, inner-layer circuits are made on the plate after the hole-filling electroplating treatment. This step includes drawing circuit graphics, etching non-circuit parts and other processes. When making the inner-layer circuits, the accuracy and integrity of the circuit graphics should be ensured to meet the working requirements of the 77GHZ millimeter-wave automotive radar.

[0045] Furthermore, the inner layer circuits are subjected to automated optical inspection. The purpose of this step is to detect whether there are defects or errors in the circuit graphics through high-precision image processing technology. AOI inspection can detect and correct problems in a timely manner, thereby improving processing quality and efficiency.

[0046] Furthermore, the prepared inner layer circuit board material is laminated with other FR4 layers. The purpose of this step is to tightly combine the multi-layer boards together to form a complete PCB board structure, ensuring that the boards are firmly bonded and free of bubbles or cracks.

[0047] Furthermore, the laminated PCB board is subjected to mechanical drilling. The purpose of this step is to form the required through holes and blind holes on the PCB board to achieve electrical connection between different layers and ensure the accuracy and verticality of the hole positions to meet the requirements of subsequent processing.

[0048] Furthermore, an outer layer circuit is made on the PCB board after mechanical drilling, and a special compensation treatment is performed. The purpose of this step is to form the required circuit pattern on the outer layer circuit, and to ensure that the sharpness of the antenna side PAD reaches the accuracy requirement of 90°±3° through special compensation technology. The special compensation treatment should ensure the accuracy and stability of the compensation pattern to improve the reliability and service life of the product.

[0049] Among them, the distance from the right-angled top of the antenna square PAD to the top corner of the quadrilateral is 35-45um, and the squares are 75×75um, 85×85um and 95×95um respectively.

[0050] Furthermore, the outer layer circuit is electroplated and etched. The electroplating process is used to form a uniform copper plating layer on the circuit surface to improve the circuit's conductivity and corrosion resistance, and the etching process is used to remove the copper layer of the non-circuit part to form a complete circuit pattern. The electroplating and etching processes should ensure the accuracy and integrity of the circuit pattern to meet the working requirements of the 77GHZ millimeter wave automotive radar.

[0051] Furthermore, solder mask printing and post-baking are performed on the PCB board after electroplating and etching. The solder mask printing is used to form an insulating layer on the surface of the circuit to protect the circuit from erosion by the external environment, and the post-baking is used to enhance the adhesion and stability of the insulating layer.

[0052] Furthermore, the PCB board after solder mask printing and post-baking is subjected to immersion gold treatment. The purpose of this step is to form a layer of gold plating on the surface of the circuit to improve the conductivity and aesthetics of the circuit. The immersion gold treatment should ensure the uniformity and adhesion of the plating to meet the use requirements of the product.

[0053] After the immersion gold treatment is completed, normal post-processing is carried out, including cleaning, drying, cutting and other steps. The purpose of these steps is to remove stains and residues generated during the processing and make the PCB board reach the final use state.

[0054] In the above process, the embodiment of the present invention achieves cost savings and improved production efficiency by using laser drilling + hole filling to connect the inner thin core board. First, the L1-L2 layer is browned and copper is reduced, and then the inner layer circuit is produced by laser drilling and hole filling electroplating, without the need for traditional mechanical drilling, plasma degumming and other complex processes. When the outer layer circuit is produced, a special compensation process is used to directly compensate a square graphic to meet the precision requirement of square PAD sharpness of 90°±3°. In addition, the solution also ensures the copper thickness and uniformity of the antenna area through chemical copper reduction, spot plating technology and other means, improves product reliability and use accuracy, simplifies the production process, improves production efficiency and product quality, and provides a new solution for the processing of 77GHZ millimeter wave automotive radar PCB boards.

[0055] Compared with the related art, the present invention has the following beneficial effects:

[0056] 1. The present invention adopts browning and copper reduction treatment, which not only enhances the surface adhesion of the PCB board, but also effectively reduces the thickness of the copper layer, ensures that the laser technology is used for drilling to solve the problem of residual glue at the bottom, and combines the hole filling electroplating technology to ensure the uniformity and conductivity of the copper layer on the hole wall, thereby improving the reliability and stability of the circuit board. By adding gain compensation at the line PAD position, the performance of the antenna is optimized, and the accuracy and sensitivity of the millimeter wave radar are ensured. The insulation and heat resistance of the circuit board are further enhanced by printing the solder mask and performing post-baking treatment, while the immersion gold treatment improves the oxidation resistance and conductivity of the circuit board, prolongs the service life of the product, and realizes the production of high-quality, high-reliability and high-performance circuit boards, thereby effectively solving the problems of cumbersome processes, poor manufacturing quality and high production costs in the prior art.

[0057] 2. The present invention can improve the sharpness of the antenna and the line processing accuracy: through a special processing process, the sharpness of the outer antenna is ensured to be controlled at 90°±3°, and the line processing accuracy is within the tolerance of ±10%.

[0058] 3. The present invention can ensure the uniformity of copper reduction: a chemical method is used to reduce the copper on the antenna surface, thereby effectively controlling the uniformity of copper reduction and improving product quality.

[0059] 4. The present invention can control the copper thickness and uniformity of the antenna area: through the spot plating technology, the copper thickness and uniformity of the antenna area can be accurately controlled to meet high-precision requirements.

[0060] 5. The present invention can perform gain compensation on the antenna PAD position: perform gain compensation on the antenna PAD position to ensure the line width accuracy and sharpness of the antenna PAD surface and improve signal transmission performance.

[0061] 6. The present invention can shorten the product development time: the new processing method simplifies the traditional process, improves production efficiency, and thus shortens the product development cycle; it can save product development investment: the optimized process reduces unnecessary production steps, reduces production costs, and saves product development investment for the enterprise; it can enhance product reliability: the improvement of overall processing accuracy and quality assurance have significantly enhanced the reliability of the product.

[0062] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0063] The above descriptions are only some embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A 77GHZ millimeter wave automobile radar PCB board processing method, characterized in that: The method comprises the following steps: Obtain a PCB board, perform a browning and copper reduction treatment on the PCB board, perform a laser drilling treatment using a laser drilling technology, and perform a hole-filling and electroplating treatment on the laser-drilled holes; Making inner layer circuits, performing automated optical inspection on the inner layer circuits, laminating the inner layer core material and performing mechanical drilling again to obtain a basic circuit board; The basic circuit board is subjected to copper deposition and electroplating treatment, and the surface copper is subjected to special polishing treatment, and the outer layer circuit is manufactured and automated optical inspection is performed; Special gain compensation is performed on the circuit PAD positions of the positive film and the negative film of the outer layer circuit, and pattern plating and negative film acid etching are performed, a solder resist layer is printed, and the solder resist layer is post-baked and then subjected to immersion gold treatment to obtain a processed PCB board.

2. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The step of obtaining a PCB sheet and performing a browning and copper reduction treatment on the PCB sheet includes: The copper clad laminate is cut by a cutting machine to obtain a copper core board, and a browning solution is used to perform a browning and copper reduction treatment on the copper core board.

3. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The laser drilling process using the laser drilling technology includes: The high-frequency thin core board layer is laser drilled on the copper sheet to produce a depth-controlled blind hole with a hole diameter, depth, and bottom residual copper layer thickness that are all set values.

4. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The method of performing hole-filling electroplating treatment on the laser drilled hole comprises: The plate after drilling is subjected to hole metallization treatment so that a conductive layer is formed in the substrate area in the middle of the plate, and the thickness of the copper layer is a set value; The copper-plated board is electroplated to fill the laser holes with thickened copper, and the surface copper is thickened to a set range to make the layers conductive.

5. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The step of manufacturing the inner layer circuit and performing automated optical inspection on the inner layer circuit comprises: A dry film is pasted on the board surface, and after the film is aligned, ultraviolet light is irradiated on the exposure machine to make the dry film not covered by the film react, forming the required circuit pattern on the board surface; The film that is not exposed to light is dissolved by the developer, the exposed copper is etched away by the acid etching solution, and the film is removed by the film stripping section to obtain the inner layer circuit pattern.

6. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The method of laminating the inner core board material and performing mechanical drilling again to obtain the basic circuit board comprises: The inner core board material is laminated by stacking and prepreg to obtain a multi-layer board. When the temperature reaches the set value, the resin of the prepreg flows and solidifies to bond the multi-layer board. Through holes are drilled in the multilayer board by mechanical drilling, and the inner layer is connected to other layers by copper deposition and board plating.

7. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The base circuit board is subjected to copper deposition and electroplating treatment, and the surface copper is subjected to special polishing treatment, including: The through holes drilled mechanically are metallized to form a conductive layer in the substrate area in the middle of the board, and the surface copper layer of the board after copper deposition is thickened by electroplating so that the copper thickness is within a set range.

8. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The method of making the outer layer circuit and performing automated optical inspection comprises: Paste the dry film on the board surface, align it with the negative film, and then use ultraviolet light on the exposure machine to make the dry film not covered by the negative film react, forming the required circuit pattern on the board surface; In the developing section, the film that is not irradiated by light is dissolved under the action of the developer, obtaining the area that requires acid etching.

9. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The circuit PAD positions of the positive film and the negative film of the outer layer circuit are subjected to special gain compensation, and pattern plating and negative film acid etching treatment are performed, including: According to the distance from the right-angled top of the antenna PAD to the top angle of the quadrangle, the outer line is compensated for the line PAD position increase gain in an equilateral square; The copper layer is etched by chemical solutions, and the dry film is removed after etching to obtain the outer layer circuit pattern.

10. A 77 GHZ millimeter wave automobile radar PCB board processing method as claimed in claim 1, characterized in that: The printed solder resist layer is subjected to post-baking treatment and then to immersion gold treatment to obtain a processed PCB board, including: The solder mask is printed on the board surface with a silk screen and pre-baked to remove volatilization to form a semi-cured film layer. The solder mask layer is printed through in-place exposure, cross-linking reaction of the solder mask film and development of alkali solution. Through chemical replacement reaction, a layer of metal nickel and gold layers are deposited on the copper surface to obtain the processed PCB board.

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