Structural circuit integrated equipment
By using additive manufacturing technology to print and mold fan circuit lines on the outer surface of the electronic device housing, the problem of large space occupied by wires is solved, and space compression and equipment aesthetics are improved.
Patent Information
- Application Number
- CN202411934806.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-04-04
AI Technical Summary
In existing electronic devices, wires occupy a large space and have poor aesthetics, which affects the normal operation of the internal electronic devices of the electronic devices.
Additive manufacturing technology is used to print fan circuit lines on the outer surface of the shell, and mold them in one piece with the shell, fan and connector to optimize the wire arrangement and reduce space occupation.
Through integrated design, the internal wire arrangement of the structural circuit is optimized, space occupation is compressed, and the aesthetics of the equipment and the normal operation of electronic devices are improved.
Smart Images

Figure CN119767599A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of additive manufacturing, and in particular to a structural circuit integrated device. Background Art
[0002] Electronic devices are the basic components of radar products, and the multifunctional structure is the trend of electronic devices towards lightness and miniaturization. Currently, the housing of electronic devices is connected to the fans, sensors and other electronic devices installed on them through external wires, and the wiring harness can only be bundled and organized by cable ties.
[0003] Although the wire harnesses are bundled, more wire harnesses occupy more space in the housing and have poor aesthetics; moreover, the wound and bundled wires are prone to form an inductive structure, which affects the electronic devices in the electronic equipment. Summary of the invention
[0004] The technical problem to be solved by the present invention is how to reduce the space occupied by wires of electronic equipment.
[0005] The technical solution of the present invention to solve the above technical problems is as follows: a structural circuit integrated device, including a shell, a fan, a connector and a fan circuit line, the fan circuit line and the shell are integrally formed by additive manufacturing, the fan and the connector are fixedly connected to the shell, and the two ends of the fan circuit line are electrically connected to the fan and the connector respectively.
[0006] The beneficial effects of the present invention are as follows: the structural circuit integrated device uses additive manufacturing to print the fan circuit line on the outer surface of the shell, which can be used to power the fan on the device, optimize the wiring arrangement inside the structural circuit integrated device, and compress the internal space of the structural circuit integrated device. Among them, the fan is used to dissipate heat for the shell and the electronic devices installed inside it, and the connector is used to connect to an external power source.
[0007] Based on the above technical solution, the present invention can also be improved as follows.
[0008] Furthermore, it also includes a sensor and a sensor circuit line, wherein the sensor and the sensor circuit line are integrally formed with the shell by additive manufacturing, and two ends of the sensor circuit line are electrically connected to the sensor and the connector respectively.
[0009] The beneficial effects of adopting the above further solution are: the sensor and the sensor circuit line are integrally formed with the housing, the sensor is manufactured by additive manufacturing, and the structural signal detection effect is optimized. The signals of all sensors are connected and transmitted with external devices through connectors.
[0010] Furthermore, there are a plurality of sensors, and the plurality of sensors are distributed at intervals in a plurality of detection areas of the shell.
[0011] The beneficial effect of adopting the above further solution is: using multiple sensors to detect the area that needs to be detected, for example, detecting signals such as strain or temperature.
[0012] Furthermore, the sensor is a strain sensor or a thermocouple sensor.
[0013] Furthermore, the sensor circuit line and the fan circuit line are arranged side by side at one end connected to the connector.
[0014] The beneficial effect of adopting the above further solution is that the ends of the sensor circuit line and the fan circuit line are arranged side by side, the circuits are arranged neatly, and the space occupied by the circuits is reduced.
[0015] Furthermore, the inner wall of the shell has a plurality of topologically optimized weight-reducing grooves.
[0016] The beneficial effect of adopting the above further solution is: using the topology optimization method to optimize the design of the shell, while ensuring the stiffness and strength requirements of the structure, the structural material is removed to reduce the weight of the structure.
[0017] Furthermore, a plurality of slots are provided in the shell.
[0018] The beneficial effect of adopting the above further solution is that a plurality of slots are provided in the housing to facilitate installation of components such as circuit boards in the housing.
[0019] Furthermore, an integrated cooling channel is formed in the shell.
[0020] The beneficial effect of adopting the above further solution is: using the additive manufacturing method, the integrated cooling channel and the shell are formed in one piece, which solves the difficulties in preparing the internal channel and the problem of water leakage.
[0021] Furthermore, the integrated cooling channel includes two end wall channels and two connecting channels, wherein two ends of one end wall channel are connected to two ends of another end wall channel through the two connecting channels.
[0022] The beneficial effect of adopting the above further solution is that the coolant in the two end wall flow channels absorbs the heat in the shell, and the coolant flows in the two end wall flow channels and the two connecting flow channels.
[0023] Further, the end wall flow channel includes an end wall liquid inlet flow channel, at least two end wall branch channels and an end wall liquid return flow channel, one end of the end wall liquid inlet flow channel is connected to one of the connecting flow channels, the other end of the end wall liquid inlet flow channel is connected to one end of at least two end wall branch channels, the other ends of at least two end wall branch channels are both connected to one end of the end wall liquid return flow channel, the other end of the end wall liquid return flow channel is connected to another connecting flow channel, one end of the end wall branch channel has a turning section, a branch block is provided in the turning section, and the other end of the end wall branch channel has a narrow mouth section, the width of the narrow mouth section is smaller than the width of the middle part of the end wall branch channel.
[0024] The beneficial effect of adopting the above further solution is: at least two end wall diversion channels are provided and a diversion block is provided at the turning section of the end wall diversion channel to divert the coolant flowing in from the end wall liquid inlet channel, thereby reducing the liquid turbulence phenomenon at the turning point. In addition, a narrow section with a smaller width is provided at the other end of the end wall diversion channel, which is beneficial to the flow of coolant inside the channel, increases the flow rate of coolant, and improves the heat exchange efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 A perspective view of a structural circuit integrated device of the present invention;
[0026] Figure 2 is a perspective view of a housing of the present invention;
[0027] Figure 3 This is a schematic diagram of the arrangement of the fan circuit line of the present invention;
[0028] Figure 4 It is a schematic diagram of the arrangement of sensor circuit lines of the present invention;
[0029] Figure 5 It is a cross-sectional view of the end wall flow channel of the present invention.
[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0031] 1. Shell; 2. Fan; 3. Connector; 4. Fan circuit line; 5. Sensor; 6. Sensor circuit line; 7. Topological optimization weight reduction groove; 8. Slot; 9. Integrated cooling channel; 91. End wall channel; 911. End wall liquid inlet channel; 912. End wall diverter channel; 913. End wall liquid return channel; 914. Diverter block; 915. Narrow mouth section; 92. Connecting channel. DETAILED DESCRIPTION
[0032] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0033] like Figure 1-Figure 5As shown, this embodiment provides a structural circuit integrated device, including a shell 1, a fan 2, a connector 3 and a fan circuit line 4, the fan circuit line 4 and the shell 1 are integrally formed by additive manufacturing, the fan 2 and the connector 3 are fixedly connected to the shell 1, and the two ends of the fan circuit line 4 are electrically connected to the fan 2 and the connector 3 respectively.
[0034] The structural circuit integrated device uses additive manufacturing to print the fan circuit line 4 on the outer surface of the shell 1, which can be used to power the fan 2 on the device, optimize the wiring arrangement inside the structural circuit integrated device, and compress the internal space of the structural circuit integrated device. Among them, the fan 2 is the heat dissipation of the shell 1 and the electronic devices installed therein, and the connector 3 is used to connect to the external power supply.
[0035] Specifically, a heat dissipation hole is provided on the housing 1 at a location corresponding to where the fan 2 is installed, and the fan 2 is installed outside the heat dissipation hole.
[0036] On the basis of the above technical solution, it also includes a sensor 5 and a sensor circuit line 6. The sensor 5 and the sensor circuit line 6 are integrally formed with the shell 1 by additive manufacturing, and the two ends of the sensor circuit line 6 are electrically connected to the sensor 5 and the connector 3 respectively.
[0037] The sensor 5 and the sensor circuit line 6 are integrally formed with the housing 1, and the sensor 5 is manufactured by additive manufacturing, which optimizes the structural signal detection effect. The signals of all sensors 5 are connected and transmitted with external devices through the connector 3.
[0038] On the basis of the above technical solution, there are multiple sensors 5 , and the multiple sensors 5 are distributed at intervals in multiple detection areas of the shell 1 .
[0039] A plurality of sensors 5 are used to detect the area to be detected, for example, to detect signals such as strain or temperature.
[0040] Correspondingly, there are also multiple sensor circuit lines 6.
[0041] Specifically, the fan circuit line 4 and the sensor circuit line 6 are integrally formed with the housing 1 by means of electronic circuit additive manufacturing. A dielectric layer is first prepared on the housing 1, and then a conductive paste is used to prepare printed circuit lines in a linear form.
[0042] On the basis of the above technical solution, the sensor 5 is a strain sensor or a thermocouple sensor.
[0043] Specifically, among the multiple sensors 5 , some sensors 5 are strain sensors, and another part of the sensors 5 are thermocouple sensors. Further, other types of sensors may be provided to detect other parameters on the housing 1 .
[0044] On the basis of the above technical solution, the sensor circuit line 6 and the end of the fan circuit line 4 connected to the connector 3 are arranged side by side.
[0045] The ends of the sensor circuit line 6 and the fan circuit line 4 are arranged side by side, the circuits are arranged neatly, and the space occupied by the circuits is reduced.
[0046] Specifically, the plurality of sensor circuit lines 6 are first arranged side by side with the fan circuit lines 4 and extended to the side wall of the housing 1 where the corresponding sensors 5 are located, and then respectively extended to the corresponding sensors 5 and electrically connected to the sensors 5 .
[0047] On the basis of the above technical solution, the inner wall of the shell 1 has a plurality of topologically optimized weight-reducing grooves 7 .
[0048] The shell 1 is optimized by using the topological optimization method. While ensuring the rigidity and strength requirements of the structure, the structural materials are removed to reduce the weight of the structure.
[0049] On the basis of the above technical solution, a plurality of slots 8 are provided in the housing 1 .
[0050] The housing 1 is provided with a plurality of slots 8 to facilitate installation of components such as circuit boards in the housing 1 .
[0051] Optionally, the slot 8 is integrally formed with or fixedly connected to the housing 1 .
[0052] On the basis of the above technical solution, an integrated cooling channel 9 is formed in the shell 1 .
[0053] The integrated cooling channel 9 and the shell 1 are integrally formed by using additive manufacturing, which solves the difficulties in preparing the internal channel and the problem of water leakage.
[0054] Based on the above technical solution, the integrated cooling channel 9 includes two end wall channels 91 and two connecting channels 92 , wherein the two ends of one end wall channel 91 are connected to the two ends of the other end wall channel 91 through the two connecting channels 92 .
[0055] The coolant in the two end wall flow channels 91 absorbs the heat in the shell 1 , and the coolant flows in the two end wall flow channels 91 and the two connecting flow channels 92 .
[0056] Specifically, the two end wall flow channels 91 are respectively arranged on two opposite end walls of the housing 1, and the plurality of slots 8 are also arranged on the inner sides of the two opposite end walls. Figure 1 As shown, the two end wall flow channels 91 are respectively arranged on the top wall and the bottom wall of the shell 1.
[0057] Specifically, the integrated cooling channel 9 is filled with coolant, and the outer wall of the shell 1 is provided with a heat exchange outlet and a heat exchange inlet respectively connected to the two connecting channels 92, and the heat exchange outlet and the heat exchange inlet are connected to the external refrigeration system. After the coolant is cooled by the refrigeration system, it enters the integrated cooling channel 9 from the heat exchange inlet, flows in the integrated cooling channel 9, and absorbs heat to dissipate heat for the shell 1 and the internal electronic components, and then flows out from the heat exchange outlet to the refrigeration system for cooling, thereby forming a coolant cycle.
[0058] Based on the above technical solution, Figure 5 As shown, the end wall flow channel 91 includes an end wall liquid inlet flow channel 911, at least two end wall branch channels 912 and an end wall liquid return flow channel 913, one end of the end wall liquid inlet flow channel 911 is connected to one of the connecting flow channels 92, the other end of the end wall liquid inlet flow channel 911 is connected to one end of at least two of the end wall branch channels 912, the other ends of at least two of the end wall branch channels 912 are both connected to one end of the end wall liquid return flow channel 913, the other end of the end wall liquid return flow channel 913 is connected to another of the connecting flow channels 92, one end of the end wall branch channel 912 has a turning section, a diversion block 914 is provided in the turning section, the other end of the end wall branch channel 912 has a narrow mouth section 915, the width of the narrow mouth section 915 is smaller than the width of the middle part of the end wall branch channel 912.
[0059] At least two end wall flow diversion channels 912 are provided, and a flow diversion block 914 is provided at the turning section of the end wall flow diversion channel 912 to divert the coolant flowing in from the end wall liquid inlet flow channel 911, thereby reducing the liquid turbulence phenomenon at the turning section. In addition, a narrow section 915 with a smaller width is provided at the other end of the end wall flow diversion channel 912, which is beneficial to the flow of the coolant inside the flow channel, increases the flow rate of the coolant, and improves the heat exchange efficiency.
[0060] Optional, such as Figure 5 As shown, a flow divider block 914 is provided in the turning section of one or more end wall flow dividers 912. The flow divider block 914 is integrally formed with the housing 1, and the flow divider block 914 divides the coolant flowing into the turning section into two branches with an angle greater than 90°, and the two branches merge into one end of the straight section in the middle of the end wall flow divider 912 with an angle less than 90°, thereby effectively reducing the turbulence in the turning section, and the two branches can merge smoothly.
[0061] In the description of the present invention, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.
[0062] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0063] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.
[0064] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A structural circuit integrated device, characterized in that: The invention comprises a housing (1), a fan (2), a connector (3) and a fan circuit line (4); the fan circuit line (4) and the housing (1) are integrally formed by means of additive manufacturing; the fan (2) and the connector (3) are both fixedly connected to the housing (1); and two ends of the fan circuit line (4) are electrically connected to the fan (2) and the connector (3) respectively.
2. A structural circuit integrated device according to claim 1, characterized in that: It also includes a sensor (5) and a sensor circuit line (6), wherein the sensor (5) and the sensor circuit line (6) are integrally formed with the housing (1) by means of additive manufacturing, and the two ends of the sensor circuit line (6) are electrically connected to the sensor (5) and the connector (3) respectively.
3. A structural circuit integrated device according to claim 2, characterized in that: There are a plurality of sensors (5), and the plurality of sensors (5) are distributed at intervals in a plurality of detection areas of the housing (1).
4. A structural circuit integrated device according to claim 3, characterized in that: The sensor (5) is a strain sensor or a thermocouple sensor.
5. The structural circuit integrated device according to claim 2, characterized in that: The sensor circuit line (6) and the fan circuit line (4) are arranged side by side at one end connected to the connector (3).
6. The structural circuit integrated device according to claim 1, characterized in that: The inner wall of the housing (1) is provided with a plurality of topologically optimized weight-reducing grooves (7).
7. The structural circuit integrated device according to claim 1, characterized in that: A plurality of slots (8) are arranged in the housing (1).
8. A structural circuit integrated device according to any one of claims 1 to 7, characterized in that: An integrated cooling channel (9) is formed in the shell (1).
9. The structural circuit integrated device according to claim 8, characterized in that: The integrated cooling flow channel (9) comprises two end wall flow channels (91) and two connecting flow channels (92), wherein two ends of one end wall flow channel (91) are connected to two ends of another end wall flow channel (91) through the two connecting flow channels (92).
10. The structural circuit integrated device according to claim 8, characterized in that: The end wall flow channel (91) comprises an end wall liquid inlet flow channel (911), at least two end wall branch flow channels (912) and an end wall liquid return flow channel (913); one end of the end wall liquid inlet flow channel (911) is connected to one of the connecting flow channels (92); the other end of the end wall liquid inlet flow channel (911) is connected to one end of at least two end wall branch flow channels (912); the other ends of at least two end wall branch flow channels (912) are both connected to one end of the end wall liquid return flow channel (913); the other end of the end wall liquid return flow channel (913) is connected to another connecting flow channel (92); one end of the end wall branch flow channel (912) has a turning section, in which a branch block (914) is provided; the other end of the end wall branch flow channel (912) has a narrow mouth section (915); the width of the narrow mouth section (915) is smaller than the width of the middle part of the end wall branch flow channel (912).