Piezoelectric driving temperature-control flow velocity heat dissipation system and method

Abstract

The invention provides a heat dissipation system and method for controlling the flow velocity through piezoelectric driving. The heat dissipation system comprises a piezoelectric heat dissipation pump, a heat dissipation module and a liquid cooling box which are connected to form a circulation loop. The piezoelectric heat dissipation pump comprises a vibration assembly, a valve body assembly and a pump body shell. A variable-volume cavity is formed between the vibration assembly and the valve body assembly. The vibration of the vibration assembly changes the volume of the variable-volume cavity. An input cavity and an output cavity which are independent of each other are arranged in the pump body shell. The valve body assembly comprises a one-way valve upper plate, a middle-layer valve and a one-way valve lower plate which are sequentially stacked. According to the piezoelectric heat dissipation pump, the integrated design of a micro piezoelectric pump valve is achieved, control over cooling liquid is achieved, the traditional valve-pump separation type design is replaced, and the size of the piezoelectric micro pump is reduced; and meanwhile, the valve body assembly is integrated in the pump body shell, so that the airtightness and water tightness of the piezoelectric heat dissipation pump are good. In addition, the valve body assembly adopts a three-layer separable design, so that two reversely arranged one-way valves with compact structures are formed.

Description

Technical Field

[0001] The present invention is aimed at but not limited to the heat dissipation requirements of electronic components in satellites in the aerospace field, and relates to a piezoelectric driven temperature-controlled flow rate heat dissipation system and method. Background Art

[0002] In aerospace design, thermal management is critical for processing-intensive aerospace applications. In particular, with the development of satellite miniaturization and high integration, the limitations of traditional heat dissipation methods are becoming increasingly apparent. In this context, microfluidic heat dissipation technology has shown unique advantages. It removes heat through the flow of coolant and achieves precise temperature control. It can provide excellent heat dissipation in a limited space and is particularly suitable for precision instruments in spacecraft.

[0003] Recently, new intelligent microfluidic liquid cooling technology is gradually replacing traditional cooling technology and has been widely used in the cooling of high-power electronic devices in the fields of aerospace and electronic information. The traditional microfluidic cooling system uses movable parts to control the microfluidic valve in its driving pump body. It has the disadvantages of complex structure, cumbersome processing technology, inability to accurately control the flow rate for a long time, and inability to provide real-time feedback on temperature rise and fall. At the same time, the piezoelectric cooling pump and the liquid flow check valve in the traditional microfluidic cooling system are glued or spliced, which requires extremely high air tightness and water tightness of the overall structure. The traditional valve pump splicing occupies too large a volume and is easily damaged. Therefore, a piezoelectric driven temperature-controlled flow rate cooling system based on a pump-valve integrated design was born. Summary of the invention

[0004] The object of the present invention is to provide a piezoelectric driven temperature controlled flow rate heat dissipation system and method.

[0005] In a first aspect, the present invention provides a piezoelectric driven temperature-controlled flow rate heat dissipation system, comprising a piezoelectric heat dissipation pump, a heat dissipation module and a liquid cooling box connected to form a circulation loop. The piezoelectric heat dissipation pump comprises a vibration component, a valve body component and a pump body shell. A variable volume chamber is formed between the vibration component and the valve body component. The vibration of the vibration component changes the volume of the variable volume chamber. An input chamber and an output chamber that are independent of each other are provided in the pump body shell. Two cooling liquid pipe openings that are respectively connected to the input chamber and the output chamber are provided on the pump body shell.

[0006] The valve body assembly includes a one-way valve upper plate, a middle valve and a one-way valve lower plate which are stacked in sequence. The one-way valve upper plate is provided with a second one-way input hole and a first one-way output hole which are parallel and independent of each other. Two valve membrane structures are arranged side by side on the middle valve. The one-way valve lower plate is provided with a first one-way input hole and a second one-way output hole which are parallel and independent of each other. The input chamber of the pump body shell, the first one-way input hole on the one-way valve lower plate, the first valve membrane structure of the middle valve, and the first one-way output hole on the one-way valve upper plate are arranged and aligned in sequence to form a first one-way valve structure. The second one-way input hole on the one-way valve upper plate, the second valve membrane structure of the middle valve, the second one-way output hole on the one-way valve lower plate, and the output chamber of the pump body shell are arranged and aligned in sequence to form a second one-way valve structure.

[0007] Preferably, the two coolant pipe openings are arranged on opposite sides of the pump body shell and are coaxially arranged.

[0008] Preferably, the valve membrane structure comprises a flow hole opened in the middle valve, a valve plate located at the center of the flow hole, and a plurality of elastic connecting arms connecting the flow hole and the valve plate. The diameter of the valve plate is larger than the first one-way input hole on the lower plate of the one-way valve and the second one-way input hole on the upper plate of the one-way valve, and smaller than the first one-way output hole on the upper plate of the one-way valve and the second one-way output hole on the lower plate of the one-way valve;

[0009] Preferably, the vibration assembly includes an elastic vibration plate, a sealing ring and a piezoelectric layer. The elastic vibration plate is connected to the pump housing or the valve body assembly and seals the variable volume chamber through the sealing ring. The piezoelectric layer is fixed on the side of the elastic vibration plate away from the valve body assembly.

[0010] Preferably, the piezoelectric heat dissipation pump further comprises a pump cover plate, which is fixed on the pump shell, and the edge of the elastic vibration plate is sandwiched between the stepped surface of the inner cavity of the pump shell and the pump cover plate.

[0011] Preferably, the heat dissipation module comprises a heat sink and a temperature sensor. The heat sink is provided with a heat dissipation channel; the heat dissipation channel and / or the electronic components to be dissipated are provided with a temperature sensor. A flow sensor is connected in series to the circulation loop.

[0012] Preferably, a control module is further included; the control module receives the temperature value measured by the temperature sensor in the heat dissipation module and the flow value measured by the flow sensor.

[0013] Preferably, a PID controller is provided in the control module; the PID controller adjusts the control signal of the piezoelectric cooling pump according to the error between the actual temperature of the electronic components to be cooled and the target temperature.

[0014] Preferably, a signal generator and a power amplifier are provided between the PID controller and the piezoelectric layer in the piezoelectric heat dissipation pump.

[0015] In a second aspect, the present invention provides a piezoelectric driven temperature controlled flow rate heat dissipation method, which uses the aforementioned heat dissipation system; the heat dissipation method is as follows: Step 1: Attach the heat sink of the heat dissipation module to the electronic components to be cooled. The temperature sensor detects the temperature of the electronic components in real time.

[0016] Step 2: If the temperature of the electronic component is higher or lower than the preset target temperature range, the PID controller outputs a control signal according to the error between the actual temperature of the electronic component and the target temperature. The signal generator outputs a piezoelectric drive signal according to the control signal. The piezoelectric drive signal is amplified by the power amplifier and input to the piezoelectric layer to drive the piezoelectric heat dissipation pump to work and adjust the coolant flow output by the piezoelectric heat dissipation pump. If the temperature of the electronic component is in the target temperature range, the current coolant flow is maintained or reduced.

[0017] The present invention has the following beneficial effects: 1. The piezoelectric cooling pump in the present invention realizes the integrated design of micro piezoelectric pump and valve, realizes the control of coolant, replaces the traditional valve-pump separation design, and saves the volume of the piezoelectric micro pump; at the same time, the valve body assembly is integrated inside the pump body shell to ensure the air tightness and water tightness of the piezoelectric cooling pump. In addition, the valve body assembly adopts a three-layer detachable design, forming two one-way valves arranged in opposite directions with a compact structure, and is easy to replace.

[0018] 2. The present invention realizes real-time monitoring of the temperature of electronic components and automatic temperature control of the coolant flow rate through the integrated piezoelectric drive and heat dissipation, so that the microfluidic power can be self-adjusted according to the temperature signal of the electronic components and the control algorithm, so that the present invention can accurately control the temperature of the electronic components and improve the working environment of the electronic components.

[0019] 3. The present invention is integrated into the satellite control board through wireless transmission between various modules, which simplifies the heat dissipation system, further improves the integration of the piezoelectric-driven microfluidic heat dissipation system, and reduces the space occupied by the heat dissipation system and the difficulty of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of a system according to an embodiment of the present invention.

[0021] Figure 2 It is a schematic diagram of the explosion of the piezoelectric heat dissipation pump in the present invention.

[0022] Figure 3 It is a cross-sectional schematic diagram of the piezoelectric heat dissipation pump in the present invention.

[0023] Figure 4 This is a graph showing the relationship between the experimental flow rate and frequency of the piezoelectric heat dissipation pump in the present invention.

[0024] Figure 5 It is the vibration mode diagram of the piezoelectric heat dissipation pump in the present invention at different frequencies.

[0025] Figure 6 This is a relationship diagram of the inlet and outlet flow rates of the piezoelectric heat dissipation pump at different frequencies in the present invention.

[0026] Figure 7 This is a schematic diagram of the heat dissipation control principle of the present invention. DETAILED DESCRIPTION

[0027] The present invention is further described below with reference to the accompanying drawings.

[0028] like Figure 1 As shown, a piezoelectric driven temperature-controlled flow rate heat dissipation system includes a piezoelectric heat dissipation pump, a wireless communication module, a control module, a heat dissipation module, a hose and a liquid cooling box. The piezoelectric heat dissipation pump, the heat dissipation module and the liquid cooling box are sequentially connected through the hose to form a circulation loop of the coolant. In this embodiment, the hose is preferably a silicone hose, and the inner diameter is preferably 0.1mm~0.5mm.

[0029] like Figure 2 and Figure 3 As shown, the piezoelectric heat dissipation pump adopts a piezoelectric pump-valve integrated design structure, including a pump cover plate 1, a vibration assembly, a valve assembly and a pump housing 8 stacked in sequence. A variable volume chamber 10 is formed between the vibration assembly and the valve assembly. The pump housing 8 is provided with parallel and mutually independent input chambers 8-1 and output chambers 8-2. Two coolant pipe ports 9 are provided on the pump housing 8. The two coolant pipe ports 9 are arranged on opposite sides of the pump housing 8 and are coaxially arranged, and are respectively connected to the input chamber 8-1 and the output chamber 8-2.

[0030] The valve body assembly includes a one-way valve upper plate 5, a middle valve 6 and a one-way valve lower plate 7 which are stacked in sequence. The one-way valve upper plate 5 is provided with a second one-way input hole 5-1 and a first one-way output hole 5-2 which are parallel and independent of each other. Two valve membrane structures are arranged side by side on the middle valve 6. The one-way valve lower plate 7 is provided with a first one-way input hole 7-1 and a second one-way output hole 7-2 which are parallel and independent of each other.

[0031] The input chamber 8-1 of the pump housing 8, the first one-way input hole 7-1 on the one-way valve lower plate 7, the first valve membrane structure of the middle valve 6, and the first one-way output hole 5-2 on the one-way valve upper plate 5 are aligned with each other. The second one-way input hole 5-1 on the one-way valve upper plate 5, the second valve membrane structure of the middle valve 6, the second one-way output hole 7-2 on the one-way valve lower plate 7, and the output chamber 8-2 of the pump housing 8 are aligned with each other.

[0032] The middle valve 6 is made of elastic material. The valve membrane structure includes a flow hole opened in the middle valve 6, a valve plate located at the center of the flow hole, and a plurality of elastic connecting arms connecting the flow hole and the outer edge of the valve plate. The plurality of elastic connecting arms are arranged at intervals along the circumference of the valve plate. The elastic connecting arms allow the valve plate to move elastically relative to the axial direction of the flow hole and can pull the valve plate to reset.

[0033] The diameter of the valve plate is larger than the first one-way input hole 7-1 on the one-way valve lower plate 7 and the second one-way input hole 5-1 on the one-way valve upper plate 5, and smaller than the first one-way output hole 5-2 on the one-way valve upper plate 5 and the second one-way output hole 7-2 on the one-way valve lower plate 7; so that the valve plate can completely cover and block the first one-way input hole 7-1 on the one-way valve lower plate 7 and the second one-way input hole 5-1 on the one-way valve upper plate 5, and cannot block the first one-way output hole 5-2 on the one-way valve upper plate 5 and the second one-way output hole 7-2 on the one-way valve lower plate 7. Thus, two one-way valves with compact structure are formed, and the fluid can only be input through the input chamber 8-1 of the pump housing 8, and then output from the output chamber 8-2 of the pump housing 8 after passing through the first one-way input hole 7-1, the first one-way output hole 5-2, the variable volume chamber 10, the second one-way input hole 5-1, and the second one-way output hole 7-2 in sequence, and cannot flow in the reverse direction.

[0034] In this embodiment, the first one-way output hole 5-2 on the one-way valve upper plate 5 and the second one-way output hole 7-2 on the one-way valve lower plate 7 have a diameter of 0.1 mm to 0.3 mm; the forward conduction pressure is very small, which can ensure the passage of a small flow rate, and can achieve one-way flow through passive opening and closing without active control. Therefore, by driving the volume of the variable volume chamber 10 to change periodically through the vibration component, continuous pumping of liquid from the input chamber 8-1 of the pump housing 8 to the output chamber 8-2 can be achieved.

[0035] The vibration assembly includes an elastic vibration plate 4, a sealing ring 2 and a piezoelectric layer 3. The edges of the two sides of the elastic vibration plate 4 are sealed and connected to the pump cover plate 1 and the opposite sides of the one-way valve upper plate 5 through the sealing ring 2. The piezoelectric layer 3 is fixed to the middle part of the side of the elastic vibration plate 4 away from the one-way valve upper plate 5.

[0036] The pump housing 8 is provided with a stepped surface for limiting the edge of the elastic vibrating plate 4, so that the elastic vibrating plate 4 is spaced apart from the one-way valve upper plate. The elastic vibrating plate 4, the one-way valve upper plate 5, and the inner side wall of the pump housing 8 together form a variable volume chamber 10. The inner side surface of the pump cover plate 1 is provided with a groove structure aligned with the middle of the elastic vibrating plate 4 to provide space for the vibration of the middle of the elastic vibrating plate 4.

[0037] In this embodiment, the piezoelectric layer 3 is the core component of the piezoelectric heat dissipation pump and is made of a thin layer of PZT material (lead zirconate titanate piezoelectric ceramic) with a thickness of 0.2 mm. In some other embodiments, other piezoelectric materials and thicknesses that meet the requirements may also be used.

[0038] In this embodiment, the elastic vibrator 4 is used to amplify the amplitude and is made of metal or polymer material, preferably spring steel, and preferably has a thickness of 0.1 mm.

[0039] The control module is provided with a PID controller. The piezoelectric heat dissipation pump corresponds to a driving module for driving the piezoelectric layer 3 to vibrate. The driving module includes a signal generator and a power amplifier. The output interface of the power amplifier is connected to the two sides of the piezoelectric layer 3; the driving module can generate a high-voltage signal with a precise frequency to control the deformation of the piezoelectric layer, thereby regulating the piezoelectric heat dissipation pump. The signal generator generates a vibration signal under the control of the PID controller, which is amplified by the power amplifier and then transmitted to the piezoelectric layer 3; the piezoelectric layer 3 is energized and deformed based on the inverse piezoelectric effect of the piezoelectric material, and the piezoelectric material will deform after the electric field is applied. This deformation can cause the variable volume chamber 10 to produce periodic volume changes, thereby driving the fluid to flow. Therefore, the present embodiment can use the PID controller to accurately control the output flow of the piezoelectric heat dissipation pump, thereby efficiently and accurately controlling the operating temperature of the electronic components.

[0040] In some embodiments, the variable volume chamber 10 is cylindrical to ensure that the fluid is evenly distributed therein and obtain stable flow characteristics.

[0041] In some embodiments, the two coolant pipe ports 9 are both made of acrylic material, and the inner diameter of the pipe is 0.5 mm to 3 mm.

[0042] In some embodiments, a flow sensor is connected in series between the piezoelectric heat dissipation pump and the heat dissipation module; in this embodiment, the flow sensor adopts a water column type hydraulic flow sensor, which is used for the coolant flow within a quantitative time, so as to facilitate the observation and calculation of the current piezoelectric drive efficiency.

[0043] In some embodiments, the control module is connected to the heat dissipation module via a wireless communication module, so that the control module can wirelessly receive the flow signal measured by the flow sensor and the temperature signal measured by the heat dissipation module. The wireless communication method uses Bluetooth or Zigbee communication

[0044] In some embodiments, the coolant is a fluorinated liquid, such as 3M's Fluorinert series (such as FC-72, FC-40) or Novec series.

[0045] In this embodiment, the relationship between the flow rate and frequency of the piezoelectric heat dissipation pump measured by experiment is as follows: Figure 4 shown.

[0046] During operation, the coolant is pumped to the heat dissipation channel in the heat sink in the heat dissipation module by the piezoelectric heat dissipation pump, and the coolant dissipates heat from the electronic components being dissipated, and finally flows to the liquid cooling box and cools down in the liquid cooling box. In this embodiment, the coolant is a liquid that is easy to flow and has high thermal conductivity (such as water or fluorinated liquid).

[0047] like Figure 3 The heat dissipation module includes a heat sink and a temperature sensor. A heat dissipation channel is provided in the heat sink; the heat sink is made of a high thermal conductivity material, preferably aluminum or copper; the heat sink increases the heat dissipation area and helps conduct heat from the electronic components to the heat dissipation channel.

[0048] The heat dissipation channel integrated microfluidic technology guides the coolant through the microchannel, and the heat is carried away by the liquid flow. The channel design needs to ensure uniform flow of the fluid to avoid heat accumulation and uneven flow. The inner diameter of the heat dissipation channel is 0.1mm~0.5mm.

[0049] A plurality of temperature sensors are respectively installed at the electronic components to be cooled, the input port and the output port of the cooling channel to provide comprehensive temperature data; the temperature sensors are preferably thermocouples and thermistors.

[0050] In some embodiments, the PID controller in the control module adopts a microcontroller unit (MCU) or an embedded processor, which is responsible for receiving data from sensors and performing calculations and decisions according to a set control algorithm.

[0051] The control module is connected to a display module. The display module is used for human-computer interaction for heat dissipation control, and the human-computer interaction includes displaying the operating status of the piezoelectric heat dissipation pump and manually adjusting the operating status of the piezoelectric heat dissipation pump. The operating status includes the operating temperature of the electronic components and the flow rate of the coolant.

[0052] The relationship between the parameters of the piezoelectric heat pump (such as geometric parameters, driving voltage amplitude and frequency), the fluid movement speed and the heat exchange is established as follows: The phenomenon that the lower temperature fluid flows through the surface of the hot object to cool the hot object belongs to convection heat transfer and satisfies Newton's cooling law, that is: .in, For heat transfer, is the convective heat transfer coefficient, is the heat exchange surface area, is the solid surface temperature, is the fluid temperature. Obviously, when hour, A positive value indicates that heat is transferred from the solid to the fluid. When q is negative, it means that heat is transferred from the fluid to the solid. It can be seen that the surface heat transfer coefficient is affected by many factors. It mainly depends on the fluid velocity in the channel and the geometric form of the heat transfer surface, as well as the thermophysical properties of the fluid (such as thermal conductivity, viscosity, specific heat capacity, density, etc.).

[0053] In this embodiment, the piezoelectric heat dissipation pump is simplified into a theoretical analysis model consisting of a piezoelectric layer 3, an elastic vibrator 4, a compressible fluid and a rigid wall; the optimal design values ​​of the structural dimensions of the piezoelectric layer 3 and the elastic vibrator 4, the driving voltage amplitude V and the driving frequency can be determined by solving the fluid-solid coupling equations of the piezoelectric-elastic driving layer and the fluid (including: the motion equilibrium equation of the elastic body and the Navier-Stokes equations of the fluid). Then, the approximate relationship between the fluid flow velocity and the voltage and frequency is obtained.

[0054] The piezoelectric layer and the elastic vibrating piece 4 are fixedly supported on the cylindrical pump cavity model; Figure 5 As shown in the figure, at different frequencies, the elastic vibrator 4 exhibits different vibration modes; according to the image, when the piezoelectric vibrator is in the first-order vibration mode, the pump chamber exhibits the largest volume change, so we choose the frequency corresponding to the first-order vibration mode (below 2372.5Hz) as the driving input. The simulation results of flow rate changes with time at different frequencies obtained by fluid-solid coupling simulation are shown in Figure 2. Figure 6 shown.

[0055] In some embodiments, the user observes the real-time temperature value of the display module, and generally presets the operating temperature range of the electronic components that require heat dissipation as follows: the yellow signal area indicates that the operating temperature of the electronic components is below the optimal power temperature; the green signal area indicates that the operating temperature is normal; the red signal area indicates that the current temperature is too high and needs heat dissipation. According to the experimental test and simulation results, the flow peak value of the overall structure per unit time in the low frequency band and the high frequency band is given respectively, which is used to change the internal algorithm of the PID controller. The user can select different piezoelectric layers 3 and corresponding PID controllers according to the temperature and flow feedback displayed by the display module and the power of the electronic components.

[0056] In this embodiment, the size of the piezoelectric micropump and the size of the liquid cooling box can be reasonably changed according to the actual application background to ensure that the piezoelectric layer can drive the elastic rigid sheet to deform and squeeze the coolant in the pump chamber space. This embodiment is easy to operate, has a simple structure and small space requirement, and can meet but is not limited to the heat dissipation needs of satellite electronic components in the aerospace field.

[0057] like Figure 7 As shown, the working method of the piezoelectric driven microfluidic pore heat dissipation system based on temperature feedback flow rate controllable includes the following steps: Step 1: The temperature sensor in the heat dissipation module detects the temperature of the electronic components in real time.

[0058] Step 2: The PID controller in the control module is started. If the temperature of the electronic components is higher or lower than the preset target temperature range, the PID controller outputs a control signal according to the error between the actual temperature of the electronic components and the target temperature. The signal generator outputs a piezoelectric drive signal according to the control signal. The piezoelectric drive signal is amplified by the power amplifier and input to the piezoelectric layer to drive the piezoelectric heat dissipation pump to work, increase or decrease the coolant flow output by the piezoelectric heat dissipation pump, so that the temperature of the electronic components is reduced or increased, close to the target temperature.

[0059] If the temperature of the electronic components is within the target temperature range, the PID controller will enter the energy-saving standby mode to continue monitoring and maintain the current drive coolant flow rate.

Claims

1. A piezoelectric driven temperature controlled flow rate heat dissipation system, comprising a piezoelectric heat dissipation pump, a heat dissipation module and a liquid cooling box connected in a circulation loop; characterized in that: The piezoelectric heat dissipation pump comprises a vibration component, a valve body component and a pump body shell (8); a variable volume chamber (10) is formed between the vibration component and the valve body component; the vibration of the vibration component changes the volume of the variable volume chamber (10); an input chamber (8-1) and an output chamber (8-2) which are independent of each other are provided in the pump body shell (8); and two cooling liquid pipe ports (9) which are respectively connected to the input chamber (8-1) and the output chamber (8-2) are provided on the pump body shell (8); The valve body assembly comprises a one-way valve upper plate (5), a middle valve (6) and a one-way valve lower plate (7) which are stacked in sequence; the one-way valve upper plate (5) is provided with a second one-way input hole (5-1) and a first one-way output hole (5-2) which are arranged in parallel and independently of each other; the middle valve (6) is provided with two valve membrane structures arranged in parallel; the one-way valve lower plate (7) is provided with a first one-way input hole (7-1) and a second one-way output hole (7-2) which are arranged in parallel and independently of each other; the input chamber (8-1) and the one-way valve lower plate (8) of the pump body housing (8) are The first one-way input hole (7-1) on the one-way valve lower plate (7), the first valve membrane structure of the middle valve (6), and the first one-way output hole (5-2) on the one-way valve upper plate (5) are aligned in sequence to form a first one-way valve structure; the second one-way input hole (5-1) on the one-way valve upper plate (5), the second valve membrane structure of the middle valve (6), the second one-way output hole (7-2) on the one-way valve lower plate (7), and the output chamber (8-2) of the pump body housing (8) are aligned in sequence to form a second one-way valve structure.

2. A piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: The two coolant pipe openings (9) are arranged on opposite sides of the pump housing (8) and are coaxially arranged.

3. A piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: The valve membrane structure comprises a flow hole opened in the middle valve (6), a valve plate located at the center of the flow hole, and a plurality of elastic connecting arms connecting the flow hole and the valve plate; the diameter of the valve plate is larger than the first one-way input hole (7-1) on the one-way valve lower plate (7) and the second one-way input hole (5-1) on the one-way valve upper plate (5), and smaller than the first one-way output hole (5-2) on the one-way valve upper plate (5) and the second one-way output hole (7-2) on the one-way valve lower plate (7).

4. The piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: The vibration component comprises an elastic vibration plate (4), a sealing ring (2) and a piezoelectric layer (3); the elastic vibration plate (4) is connected to a pump housing (8) or a valve body component and seals a variable volume chamber (10) via the sealing ring (2); and the piezoelectric layer (3) is fixed to a side of the elastic vibration plate (4) facing away from the valve body component.

5. The piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: The piezoelectric heat dissipation pump further comprises a pump cover plate (1); the pump cover plate (1) is fixed on the pump shell (8); and the edge of the elastic vibration plate (4) is sandwiched between the stepped surface of the inner cavity of the pump shell (8) and the pump cover plate (1).

6. The piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: The heat dissipation module comprises a heat sink and a temperature sensor; a heat dissipation channel is arranged in the heat sink; a temperature sensor is arranged on the heat dissipation channel and / or the electronic components to be dissipated; and a flow sensor is connected in series on the circulation loop.

7. The piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 1, characterized in that: It also includes a control module; the control module receives the temperature value measured by the temperature sensor in the heat dissipation module and the flow value measured by the flow sensor.

8. A piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 7, characterized in that: The control module is provided with a PID controller; the PID controller adjusts the control signal of the piezoelectric cooling pump according to the error between the actual temperature of the electronic components to be cooled and the target temperature.

9. A piezoelectric driven temperature controlled flow rate heat dissipation system according to claim 8, characterized in that: A signal generator and a power amplifier are arranged between the PID controller and the piezoelectric layer in the piezoelectric heat dissipation pump.

10. A piezoelectric driven temperature controlled flow rate heat dissipation method, characterized in that: Using the heat dissipation system as claimed in claim 9; the heat dissipation method is as follows: Step 1: attach the heat sink of the heat dissipation module to the electronic components to be cooled; the temperature sensor detects the temperature of the electronic components in real time; Step 2: If the temperature of the electronic component is higher or lower than the preset target temperature range, the PID controller outputs a control signal according to the error between the actual temperature of the electronic component and the target temperature; the signal generator outputs a piezoelectric drive signal according to the control signal; The piezoelectric driving signal is amplified by the power amplifier and input into the piezoelectric layer to drive the piezoelectric cooling pump to work and adjust the coolant flow output by the piezoelectric cooling pump; if the temperature of the electronic components is within the target temperature range, the current coolant flow is maintained or reduced.

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