LED chip packaging structure device

Abstract

The invention discloses an LED chip packaging structure device, and relates to the technical field of semiconductor devices, the LED chip packaging structure device comprises a plastic shell, the inner side surface of the plastic shell is fixedly connected with a pin plate, the position between the pin plate and the plastic shell is fixedly connected with a bolt through a thread, the bottom of the plastic shell is fixedly connected with a bottom support shell, and the bottom support shell is fixedly connected with an LED chip. A lens is fixedly connected to the top of the plastic shell, and a foam plug is fixedly connected to the lower position of the surface of the lens. According to the LED chip packaging structure device, a glue injection hole is formed in the surface of a lens, the glue injection hole and a foam plug are oppositely arranged, a gap is formed between a shell and a heat sink mechanism, a bottom support shell blocks the bottom of the gap, silica gel is poured into the lens, and a cavity among the shell, the lens and the heat sink mechanism is filled with the silica gel; because the silica gel has large viscosity and is not easy to pass through the foam plug, the gas is discharged through the foam plug, thereby realizing rapid assembly of the LED chip packaging structure.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor devices, and in particular to an LED chip packaging structure device. Background Art

[0002] LED packaging components mainly include substrate (heat dissipation), packaging glue (silicone), packaging lens (with high refractive index and light transmittance), etc. The combination of packaging glue and packaging lens not only provides protection for the chip (prevents the chip from failing due to long-term exposure to the air or mechanical damage, so as to improve the stability of the chip), but also achieves better light extraction efficiency, thereby making the LED have better luminous efficiency. LED chip packaging technology usually mounts the LED chip on the PCB and seals it with packaging glue to protect the LED chip from the external environment. Although this packaging technology works well in many cases, there are still some limitations. One of the most important problems is the divergence angle of the LED chip. The divergence angle of the LED chip determines the output characteristics of the light. The smaller divergence angle in the related LED chip packaging structure will limit the application scope of the LED, because the current development increasingly requires wider angle light scattering to achieve more comprehensive lighting, projection or display needs. The Chinese patent announcement number is: CN102255035A, which discloses "A multi-LED chip packaging structure on a substrate". In this patent, a silicone ball lens is arranged on the upper layer of the planar silicone in the prior art COB light source and above the LED chip. The light that is greater than the critical angle in the prior art and reflected back to the silicone at the plane where the planar silicone contacts the air is guided out to the air, thereby improving the light extraction efficiency of the COB light source.

[0003] Due to structural design defects, the existing LED chip packaging structure device has the problem that when multiple chips are packaged, the light emitted by adjacent LED chips to each other will be absorbed, resulting in reduced light output efficiency, and the packaging glue is kept at high temperature for a long time and the internal thermal stress increases, resulting in a decrease in the refractive index and affecting the light emission. Summary of the invention

[0004] The present invention provides an LED chip packaging structure device, which solves the problems mentioned in the above background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an LED chip packaging structure device, comprising a plastic shell, the inner side of the plastic shell is fixedly connected to a pin plate, the position between the pin plate and the plastic shell is fastened with a bolt through a thread, the bottom of the plastic shell is fixedly connected to a bottom support shell, the top of the plastic shell is fixedly connected to a lens, and the position below the lens surface is fixedly connected to a foam plug, and further comprising:

[0006] A heat sink mechanism, the heat sink mechanism is fixedly installed at the middle position of the inner side of the plastic shell, the top of the heat sink mechanism is fixedly connected to the chip board, the heat sink mechanism and the chip board are bonded with thermal conductive glue, and the heat sink mechanism is used to remove the heat from the surface of the chip board;

[0007] A lead-in mechanism, the lead-in mechanism is fixedly mounted on the inner side of the heat sink mechanism, the top of the lead-in mechanism is fixedly connected to the surface of the chip board, and the lead-in mechanism is used for connecting and communicating between multiple chip boards and the conductive pin board;

[0008] The heat sink mechanism includes a conducting assembly, which is fixedly installed in the middle position of the inner side of the plastic shell, the top of the conducting assembly is fixedly connected to a heat exchange block, the top of the heat exchange block is fixedly connected to a bracket assembly, the surface of the heat exchange block is fixedly connected to a plastic pipe, and the plastic pipe, the heat exchange block and the interior of the bracket assembly are connected by gas.

[0009] Preferably, an arc-shaped hole is opened inside the heat exchange block, the guide assembly and the middle position of the inner side of the plastic shell are fixed by injecting silicone, and the top end of the plastic tube is fixedly connected with a flaring cylinder.

[0010] Preferably, the plastic shell includes a shell, a flared hole is opened at the upper position of the inner side surface of the shell, an annular groove is opened at the top of the shell, the bottom of the lens is embedded in the annular groove, the shell is used for insulation protection of the pin plate and the heat sink mechanism, the end face of the pin plate passes through the shell to the connecting mechanism, a plurality of chip boards are engaged with the pin plate through the connecting mechanism and realize conductive connection, the flared hole supports the heat sink mechanism, the bolts firmly connect the pin plate and the inner slide, during installation, the bottom of the lens is embedded in the inside of the annular groove, then the two semi-ring plates are butted against each other and embedded in the position below the lens surface, and then the two semi-ring plates are fixed so that the lens is quickly limited.

[0011] Preferably, the plastic shell further comprises an inner slide, the inner side surface of the inner slide is slidably connected to the surface of the pin plate, and a semi-ring plate is fixedly connected to the top of the shell, and the number of the semi-ring plates is two.

[0012] Preferably, the bottom support shell includes a support body, the top of the support body is fixedly installed on the bottom of the plastic shell, an extension plate is fixedly connected to the top of the support body near the inner side, air flow holes are opened on the surface of the support body, a gap is arranged between the inner side surface of the shell and the heat sink mechanism, the extension plate supports and limits the shell and the heat sink mechanism, the edge of the top of the support body is arranged to be warped upward, and a raised ring is arranged at the end of the extension plate away from the support body.

[0013] Preferably, the bottom support shell also includes a raised ring, which is fixedly mounted on the surface of the extension plate near the middle, the top of the extension plate is in close contact with the bottom of the guide assembly, and the bottom of the inner side of the support body is fixedly connected to a convex shell.

[0014] Preferably, the conductive connection assembly includes a conductive connection shell, the surface of the conductive connection shell is fixedly connected to the inner side of the plastic shell by silicone, the inner side of the conductive connection shell is provided with an air flow channel, a plurality of chip boards are evenly arranged inside the bracket assembly, thermal conductive glue is deposited on the bottom of the chip board, the chip board is limited by the thermal conductive glue, and at the same time, the thermal conductive glue enables the heat of the chip board to be directly transferred to the heat exchange block. In the prior art, heat sink metal is used to transfer heat, but the surface of the heat sink gold block is wrapped with plastic over a large area to ensure insulation, and the poor heat transfer capacity of the plastic will lead to heat accumulation.

[0015] Preferably, the conductive connection assembly further comprises an end face tube, the end face tube is fixedly mounted at a position of the conductive connection shell close to the air flow channel, and a rectangular tube is fixedly connected to a position below the surface of the conductive connection shell.

[0016] Preferably, the bracket assembly includes a bracket stand, which is fixedly mounted on the top of the heat exchange block, and a square hole is opened at the bottom of the bracket stand, the chip board is located above the square hole, and multiple chip boards are blocked by partitions, and the surfaces of the bracket stand, partitions and barrier rings are provided with silver-plated mirrors, and the inclined surface cooperates with the silver-plated mirror to effectively make the reflected light point upward, and the silver-plated mirror can reflect the light at the edge of the chip board to the position above the lens surface, and the position of the lens surface near the bottom cannot make the chip board light be guided out, and the end face of the plastic tube is set at a position near the bottom of the lens, and the silver-plated mirror is used to reflect the light that cannot be guided out by the chip board and then guide it out, so that the utilization efficiency of the lens is increased.

[0017] Preferably, the support assembly further comprises a partition, the partition is fixedly mounted on the inner side surface of the support platform, a blocking ring is fixedly connected to the surface of the partition, and the surfaces of the blocking ring and the partition are both provided with inclined surfaces.

[0018] Preferably, the guiding mechanism includes a first guide ring and a second guide ring, the surfaces of the first guide ring and the second guide ring are both provided with inner grooves, the first guide ring and the second guide ring are both fixedly mounted on the inner side of the guiding assembly, the first guide ring is arranged above the second guide ring, the first guide ring and the second guide ring are spaced apart from each other, and correspondingly, the two pin plates are also spaced apart from each other, the first guide ring and the second guide ring are both made of copper, two leads are externally connected to the surface of a chip board, the two leads are respectively fixedly mounted downward on the surfaces of the first guide ring and the second guide ring, the surfaces of the leads are both treated with plastic dipping, the end face of the pin plate passes through the shell and extends into the embedded groove, silicone fills the gap between the guiding shell and the shell, so that the pin plate is quickly fixed and limited.

[0019] Preferably, the connecting mechanism also includes a lead wire, the bottom of which is fixedly mounted on the top of the first guide ring, the surfaces of the first guide ring and the second guide ring are provided with embedded grooves, and the top of the lead wire is fixedly connected to the surface of the chip board.

[0020] The present invention provides an LED chip packaging structure device. It has the following beneficial effects:

[0021] 1. The LED chip packaging structure device has a glue injection hole on the surface of the lens, which is arranged opposite to the foam plug. A gap is set between the shell and the heat sink mechanism. The bottom of the gap is blocked by the bottom support shell. Silicone is poured into the interior of the lens. The silicone fills the cavity between the shell, the lens and the heat sink mechanism. Since the viscosity of silicone is relatively high, it is not easy to pass through the foam plug. The gas is discharged through the foam plug, thereby realizing the rapid assembly of the LED chip packaging structure.

[0022] 2. In the LED chip packaging structure device, the support body and the warping structure are arranged on the inner and outer sides of the filling gap. When silicone is poured into the interior of the lens, protection is formed on the inner and outer sides so that the silicone is not easy to overflow. At the same time, a thinner silicone layer can be formed between the extension plate and the shell and the heat sink mechanism, so that the overall structure of the bottom support shell is more tightly connected to the shell and the heat sink mechanism. The support body is made of plastic material. The support body arranged at the bottom raises the heat sink mechanism by a certain distance, so that the heat inside the heat sink mechanism can be easily taken away with the airflow. At the same time, the support body can effectively prevent the metal heat sink mechanism from contacting the metal joint and causing damage to the LED chip.

[0023] 3. The LED chip packaging structure device has a support body arranged directly below the conductive assembly. The LED chip packaging structure will be affected by wind when in use. The airflow passes through the plastic tube, the arc-shaped hole and the conductive assembly in sequence. The airflow takes away the heat of the heat exchange block, and the heated gas is guided to the inside of the support body through the bottom of the conductive assembly. The guidance of the convex shell enables the heated gas to be guided out of the support body, which solves the problem that the packaging glue is kept at high temperature for a long time and the internal thermal stress increases, resulting in a decrease in the refractive index and thus affecting the luminescence.

[0024] 4. The LED chip packaging structure device has a flared tube to promote the flow of gas. The light emitted by the chip board is guided out of the lens to the greatest extent, which can effectively reduce the heat caused by the inability to guide the light. When the airflow circulates and cools inside the plastic tube, heat exchange block and end tube, the efficiency is higher. This solves the problem that when multiple chips are packaged, the light emitted by adjacent LED chips to each other will be absorbed, thereby reducing their light output efficiency.

[0025] 5. In the LED chip packaging structure device, the two pin plates are conductively bonded to the first guide ring and the second guide ring respectively, so that the input end and the output end of the chip plate are conductively bonded to the first guide ring and the second guide ring respectively. The first guide ring and the second guide ring are sleeved on the conductive shell near the airflow channel. When the airflow flows from the inside of the airflow channel to the end face tube, the efficiency of heat being taken away is improved. At the same time, the bonding of multiple chip plates is made more stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A three-dimensional diagram of the top of the LED chip packaging structure device of the present invention;

[0027] Figure 2 A three-dimensional diagram of the bottom of the LED chip packaging structure device of the present invention;

[0028] Figure 3 This is a schematic diagram of the internal structure of the LED chip packaging structure device of the present invention;

[0029] Figure 4 It is a schematic diagram of the structure of the plastic shell of the present invention;

[0030] Figure 5 It is a structural schematic diagram of the bottom support shell of the present invention;

[0031] Figure 6 It is a structural schematic diagram of the bottom of the heat sink mechanism of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the top of the heat sink mechanism of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the guide assembly and the bracket assembly of the present invention;

[0034] Fig. 9 It is a structural schematic diagram of the guiding mechanism of the present invention.

[0035] In the figure: 1, plastic shell; 11, shell; 12, flared hole; 13, annular groove; 14, inner slide; 15, semi-ring plate; 2, pin plate; 3, bolt; 4, bottom support shell; 41, support body; 42, air flow hole; 43, extension plate; 44, raised ring; 45, convex shell; 5, lens; 6, foam plug; 7, heat sink mechanism; 71, guide assembly; 711, guide shell; 712, air flow channel; 713, end face tube; 714, rectangular tube; 72, heat exchange block; 721, arc hole; 73, plastic tube; 74, flared tube; 75, bracket assembly; 751, bracket platform; 752, square hole; 753, partition; 754, barrier ring; 8, guide mechanism; 81, first guide ring; 82, second guide ring; 83, inner groove; 84, embedded groove; 85, lead; 9, chip board. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] First embodiment: Figure 1-Figure 4 As shown, the present invention provides a technical solution: an LED chip packaging structure device, comprising a plastic shell 1, a pin plate 2 is fixedly connected to the inner side of the plastic shell 1, a bolt 3 is fastened by a thread between the pin plate 2 and the plastic shell 1, a bottom support shell 4 is fixedly connected to the bottom of the plastic shell 1, a lens 5 is fixedly connected to the top of the plastic shell 1, and a foam plug 6 is fixedly connected to the position below the surface of the lens 5, and also includes:

[0038] The heat sink mechanism 7 is fixedly installed at the middle position of the inner side of the plastic shell 1, the top of the heat sink mechanism 7 is fixedly connected with the chip board 9, the heat sink mechanism 7 and the chip board 9 are bonded with thermal conductive glue, and the heat sink mechanism 7 is used to remove the heat from the surface of the chip board 9;

[0039] A lead-in mechanism 8, the lead-in mechanism 8 is fixedly mounted on the inner side of the heat sink mechanism 7, the top of the lead-in mechanism 8 is fixedly connected to the surface of the chip board 9, and the lead-in mechanism 8 is used for connecting and communicating between the plurality of chip boards 9 and the conductive pin board 2;

[0040] The plastic shell 1 includes a shell 11, a flared hole 12 is opened at the upper position of the inner side surface of the shell 11, an annular groove 13 is opened at the top of the shell 11, and the bottom of the lens 5 is embedded in the annular groove 13. The plastic shell 1 also includes an inner slide 14, and the inner side surface of the inner slide 14 is slidably connected to the surface of the pin plate 2. A semi-ring plate 15 is fixedly connected to the top of the shell 11, and the number of semi-ring plates 15 is two.

[0041] When in use, the shell 11 is used for insulation protection of the pin plate 2 and the heat sink mechanism 7. The end face of the pin plate 2 passes through the shell 11 to the lead mechanism 8. Multiple chip boards 9 are joined to the pin plate 2 through the lead mechanism 8 and realize conductive connection. The flared hole 12 supports the heat sink mechanism 7. The bolt 3 firmly connects the pin plate 2 with the inner slide 14. During installation, the bottom of the lens 5 is embedded in the inside of the annular groove 13. Then, the two semi-ring plates 15 are docked with each other and embedded in the position below the surface of the lens 5. Then, the two semi-ring plates 15 are fixed so that the lens 5 is quickly limited. The surface of the lens 5 is provided with a glue injection hole, which is arranged opposite to the foam plug 6. A gap is set between the shell 11 and the heat sink mechanism 7. The bottom support shell 4 blocks the bottom of the gap, and silicone is poured into the inside of the lens 5. The silicone fills the cavity between the shell 11, the lens 5 and the heat sink mechanism 7. Since the viscosity of the silicone is relatively large, it is not easy to pass through the foam plug 6. The gas is discharged through the foam plug 6, thereby realizing the rapid assembly of the LED chip packaging structure.

[0042] Second embodiment: Figure 4 , Figure 5 As shown, the bottom support shell 4 includes a support body 41, the top of the support body 41 is fixedly mounted on the bottom of the plastic shell 1, an extension plate 43 is fixedly connected to the top of the support body 41 near the inner side, an air flow hole 42 is opened on the surface of the support body 41, and the bottom support shell 4 also includes a raised ring 44, which is fixedly mounted on the surface of the extension plate 43 near the middle, the top of the extension plate 43 is in close contact with the bottom of the guide assembly 71, and a convex shell 45 is fixedly connected to the bottom of the inner side of the support body 41.

[0043] When in use, a gap is provided between the inner side surface of the shell 11 and the heat sink mechanism 7, and the extension plate 43 supports and limits the shell 11 and the heat sink mechanism 7. The edge of the top of the support body 41 is provided with an upward warp, and a raised ring 44 is provided at the end of the extension plate 43 away from the support body 41. The support body 41 and the warping structure are provided on the inner and outer sides of the filling gap. When silicone is poured into the interior of the lens 5, the inner and outer sides form a protection so that the silicone is not easy to overflow. At the same time, a thinner silicone layer can be formed between the extension plate 43, the shell 11 and the heat sink mechanism 7, so that the overall structure of the bottom support shell 4 is more closely connected with the shell 11 and the heat sink mechanism 7. The support body 41 is made of plastic. The support body 41 arranged at the bottom raises the heat sink mechanism 7 by a certain distance, so that the heat inside the heat sink mechanism 7 can be easily carried away with the airflow. At the same time, the support body 41 can effectively prevent the metal heat sink mechanism 7 from contacting the metal joint and causing damage to the LED chip.

[0044] The third embodiment: Figure 5 , Figure 6As shown, the heat sink mechanism 7 includes a conducting assembly 71, which is fixedly installed in the middle position of the inner side of the plastic shell 1, and a heat exchange block 72 is fixedly connected to the top of the conducting assembly 71, and a bracket assembly 75 is fixedly connected to the top of the heat exchange block 72. A plastic tube 73 is fixedly connected to the surface of the heat exchange block 72, and the interiors of the plastic tube 73, the heat exchange block 72 and the bracket assembly 75 are connected by gas. An arc hole 721 is opened in the heat exchange block 72, and the conducting assembly 71 is fixed to the middle position of the inner side of the plastic shell 1 with silicone injection, and the top of the plastic tube 73 is fixedly connected to a flaring tube 74.

[0045] When in use, multiple chip boards 9 are evenly arranged inside the bracket assembly 75, and thermal conductive glue is deposited on the bottom of the chip board 9. The chip board 9 is limited by the thermal conductive glue. At the same time, the thermal conductive glue allows the heat of the chip board 9 to be directly transferred to the heat exchange block 72. In the prior art, heat sink metal is used to transfer heat. However, a large area of ​​the surface of the heat sink gold block is wrapped with plastic to ensure insulation. The poor heat transfer capacity of plastic will lead to heat accumulation. In this device, the support body 41 is arranged directly below the conductive assembly 71. The LED chip packaging structure will be affected by wind when in use. The airflow passes through the plastic tube 73, the arc hole 721 and the conductive assembly 71 in turn. The airflow takes away the heat of the heat exchange block 72, and the heated gas is guided to the inside of the support body 41 through the bottom of the conductive assembly 71. The guidance of the convex shell 45 allows the heated gas to be guided out of the support body 41, which solves the problem that the packaging glue is at high temperature for a long time and the internal thermal stress increases, resulting in a decrease in the refractive index and thus affecting the light emission.

[0046] Fourth embodiment: Figure 6 , Figure 7 , Figure 8 As shown, the conductive connection assembly 71 includes a conductive connection shell 711, the surface of the conductive connection shell 711 is fixedly connected to the inner side of the plastic shell 1 through silicone, and the inner side of the conductive connection shell 711 is provided with an air flow channel 712. The conductive connection assembly 71 also includes an end surface tube 713, which is fixedly installed at a position of the conductive connection shell 711 close to the air flow channel 712, and a rectangular tube 714 is fixedly connected to the lower position of the surface of the conductive connection shell 711;

[0047] The bracket assembly 75 includes a bracket platform 751, which is fixedly installed on the top of the heat exchange block 72. A square hole 752 is provided at the bottom of the bracket platform 751, and the chip board 9 is located above the square hole 752. The bracket assembly 75 also includes a partition 753, which is fixedly installed on the inner side of the bracket platform 751. A blocking ring 754 is fixedly connected to the surface of the partition 753, and the surfaces of the blocking ring 754 and the partition 753 are both provided with inclined surfaces.

[0048] When in use, multiple chip boards 9 are blocked by partitions 753, and the surfaces of the bracket 751, partitions 753 and blocking rings 754 are provided with silver-plated mirrors. The inclined surface cooperates with the silver-plated mirror to effectively make the reflected light point upward. The silver-plated mirror can reflect the light at the edge of the chip board 9 to the upper position of the lens 5 surface. The position of the lens 5 surface near the bottom cannot make the light of the chip board 9 be guided out. The end face of the plastic tube 73 is set at a position near the bottom of the lens 5, and the light that cannot be guided out by the chip board 9 is reflected and guided out by the silver-plated mirror, so that the utilization efficiency of the lens 5 is increased, and the expanded tube 74 promotes the flow of gas. The light emitted by the chip board 9 is guided out of the lens 5 to the greatest extent, which can effectively reduce the heat caused by the inability to guide the light out. When the airflow circulates and cools down inside the plastic tube 73, the heat exchange block 72 and the end tube 713, the efficiency is higher, which solves the problem that when multiple chips are packaged, the light emitted by adjacent LED chips to each other will be absorbed, thereby reducing their light output efficiency.

[0049] Fifth embodiment: Figure 8 , Fig. 9 As shown, the guiding mechanism 8 includes a first guide ring 81 and a second guide ring 82. The surfaces of the first guide ring 81 and the second guide ring 82 are both provided with inner grooves 83. The first guide ring 81 and the second guide ring 82 are both fixedly mounted on the inner side of the guiding assembly 71. The first guide ring 81 is arranged above the second guide ring 82. The guiding mechanism 8 also includes a lead 85. The bottom of the lead 85 is fixedly mounted on the top of the first guide ring 81. The surfaces of the first guide ring 81 and the second guide ring 82 are both provided with embedded grooves 84. The top of the lead 85 is fixedly connected to the surface of the chip board 9.

[0050] When in use, the first guide ring 81 and the second guide ring 82 are arranged at intervals up and down, and correspondingly, the two pin plates 2 are also arranged at intervals up and down. The first guide ring 81 and the second guide ring 82 are both made of copper. Two leads 85 are externally connected to the surface of a chip board 9. The two leads 85 are fixed downward on the surfaces of the first guide ring 81 and the second guide ring 82, respectively. The surfaces of the leads 85 are all treated with plastic dipping. The end surface of the pin plate 2 passes through the shell 11 and extends to the embedded groove 84. The gap between the conductive shell 711 and the shell 11 is filled with silicone. The gap allows the pin board 2 to be quickly fixed and limited, and the two pin boards 2 are conductively bonded to the first guide ring 81 and the second guide ring 82 respectively, so that the input end and the output end of the chip board 9 are conductively bonded to the first guide ring 81 and the second guide ring 82 respectively. The first guide ring 81 and the second guide ring 82 are sleeved on the position of the guide shell 711 close to the airflow channel 712. When the airflow flows from the inside of the airflow channel 712 to the end tube 713, the efficiency of heat being taken away is improved. At the same time, the bonding of multiple chip boards 9 is made more stable and reliable.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by... does not exclude the existence of other identical elements in the process, method, article or device including the element".

Claims

1. An LED chip packaging structure device, comprising a plastic shell (1), characterized in that: The inner side surface of the plastic shell (1) is fixedly connected to a pin plate (2), a bolt (3) is fastened between the pin plate (2) and the plastic shell (1) by means of a thread, a bottom support shell (4) is fixedly connected to the bottom of the plastic shell (1), a lens (5) is fixedly connected to the top of the plastic shell (1), and a foam plug (6) is fixedly connected to the position below the surface of the lens (5), and further comprises: A heat sink mechanism (7), the heat sink mechanism (7) is fixedly mounted at the middle position of the inner side surface of the plastic shell (1), the top of the heat sink mechanism (7) is fixedly connected to a chip board (9), the heat sink mechanism (7) and the chip board (9) are bonded with a heat-conducting adhesive, and the heat sink mechanism (7) is used to remove heat from the surface of the chip board (9); A lead-in mechanism (8), the lead-in mechanism (8) is fixedly mounted on the inner side of the heat sink mechanism (7), the top of the lead-in mechanism (8) is fixedly connected to the surface of the chip board (9), and the lead-in mechanism (8) is used for connecting and communicating a plurality of chip boards (9) with the conductive pin board (2); The heat sink mechanism (7) comprises a conducting assembly (71), the conducting assembly (71) is fixedly mounted at the middle position of the inner side surface of the plastic shell (1), the top of the conducting assembly (71) is fixedly connected to a heat exchange block (72), the top of the heat exchange block (72) is fixedly connected to a bracket assembly (75), the surface of the heat exchange block (72) is fixedly connected to a plastic pipe (73), and the interiors of the plastic pipe (73), the heat exchange block (72) and the bracket assembly (75) are connected via gas.

2. The LED chip packaging structure device according to claim 1, characterized in that: An arc-shaped hole (721) is provided inside the heat exchange block (72), the guide assembly (71) and the middle portion of the inner side surface of the plastic shell (1) are fixed with silicone injection, and the top end of the plastic tube (73) is fixedly connected with a flaring tube (74).

3. The LED chip packaging structure device according to claim 2, characterized in that: The plastic shell (1) comprises a shell (11), a flared hole (12) is provided at the upper position of the inner side surface of the shell (11), an annular groove (13) is provided at the top of the shell (11), and the bottom of the lens (5) is embedded in the annular groove (13).

4. The LED chip packaging structure device according to claim 3, characterized in that: The plastic shell (1) further comprises an inner slide (14), the inner side surface of the inner slide (14) being slidably connected to the surface of the pin plate (2), and a semi-ring plate (15) being fixedly connected to the top of the shell (11), and the number of the semi-ring plates (15) is two.

5. The LED chip packaging structure device according to claim 4, characterized in that: The bottom support shell (4) comprises a support body (41), the top of the support body (41) is fixedly mounted on the bottom of the plastic shell (1), an extension plate (43) is fixedly connected to the top of the support body (41) near the inner side, and an air flow hole (42) is provided on the surface of the support body (41).

6. The LED chip packaging structure device according to claim 5, characterized in that: The bottom support shell (4) further comprises a raised ring (44), the raised ring (44) being fixedly mounted on a surface of the extension plate (43) near the middle, the top of the extension plate (43) being in close contact with the bottom of the guide assembly (71), and the bottom of the inner side surface of the support body (41) being fixedly connected with a convex shell (45).

7. The LED chip packaging structure device according to claim 1, characterized in that: The conductive connection assembly (71) comprises a conductive connection shell (711), the surface of the conductive connection shell (711) is fixedly connected to the inner side surface of the plastic shell (1) via silica gel, and the inner side surface of the conductive connection shell (711) is provided with an air flow channel (712).

8. The LED chip packaging structure device according to claim 7, characterized in that: The guide connection assembly (71) further comprises an end surface tube (713), wherein the end surface tube (713) is fixedly mounted at a position of the guide connection shell (711) close to the air flow channel (712), and a rectangular tube (714) is fixedly connected to a position below the surface of the guide connection shell (711).

9. The LED chip packaging structure device according to claim 8, characterized in that: The support assembly (75) comprises a support platform (751), wherein the support platform (751) is fixedly mounted on the top of the heat exchange block (72), a square hole (752) is provided at the bottom of the support platform (751), and the chip board (9) is located above the square hole (752).

10. The LED chip packaging structure device according to claim 9, characterized in that: The support assembly (75) further comprises a partition (753), wherein the partition (753) is fixedly mounted on the inner side surface of the support platform (751), a blocking ring (754) is fixedly connected to the surface of the partition (753), and the surfaces of the blocking ring (754) and the partition (753) are both provided with inclined surfaces.

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