Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a light-emitting structure, a conductive part, a second electrode, and a driving substrate, a first electrode and a pixel definition layer which are stacked in sequence, the pixel definition layer is provided with a pixel opening, and the pixel opening exposes the first electrode; the light-emitting structure is arranged on the first electrode; the conductive part is arranged on the side surface of the pixel definition layer and the top surface, far away from the driving substrate, of the pixel definition layer, and is insulated from the first electrode; the second electrode is arranged on the surface, away from the driving substrate, of the pixel defining layer and the surface, away from the first electrode, of the light-emitting structure and covers the conductive part. The display panel can improve the problem that the electrode is easy to break at the joint of the top surface and the side wall surface of the pixel definition layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] In the field of display technology, organic light emitting diode (OLED) display devices are widely used in many fields such as flat panel displays, flexible displays, automotive displays and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving and foldability.

[0003] As the requirements for display brightness and lifespan become higher and higher, various new technologies are constantly being researched and developed to enhance display brightness and extend lifespan. Among them, eLEAP technology is most likely to become one of the new technologies for future mass production because it can remove the high-precision metal mask (FMM) for evaporation and can increase the pixel aperture ratio and pixel density, greatly improving product brightness and lifespan.

[0004] However, the preparation process of this technology is relatively complicated, and it is easy for the cathode to be disconnected at the connection between the side and top surfaces of the pixel definition layer, resulting in cathode conductivity discontinuity, causing poor product display. Summary of the invention

[0005] The present application provides a display panel and a method for manufacturing the same, and a display device, in order to solve the problem that the existing cathode is easily disconnected at the connection between the side and top surfaces of the pixel definition layer.

[0006] In order to solve the above technical problems, the first technical solution provided by the present application is: a display panel is provided, comprising a light-emitting structure, a conductive portion, a second electrode, and a driving substrate, a first electrode and a pixel definition layer stacked in sequence; the pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode; the light-emitting structure is arranged on the first electrode; the conductive portion is arranged on the side of the pixel definition layer and on the top surface of the pixel definition layer away from the driving substrate, and is insulated from the first electrode; the second electrode is arranged on the surface of the pixel definition layer away from the driving substrate and on the surface of the light-emitting structure away from the first electrode, and covers the conductive portion.

[0007] In some embodiments, the display panel further includes a conductive isolation structure; the conductive isolation structure is protruding from the pixel definition layer and surrounds the pixel opening and the conductive portion; and the second electrode is in contact with and connected to the conductive isolation structure.

[0008] In some embodiments, the conductive portion is in contact with the conductive isolation structure.

[0009] In some embodiments, the angle at the corner of the conductive portion is greater than or equal to 150° and less than 180°.

[0010] In some embodiments, the light-emitting structure includes a hole transport layer, a light-emitting layer, and an electron transport layer sequentially stacked on the first electrode; and the conductive portion is located on a side of the light-emitting layer away from the hole transport layer.

[0011] In order to solve the above technical problems, the second technical solution provided by the present application is: a method for preparing a display panel is provided, the method comprising: forming a first electrode and a pixel definition layer on a driving substrate in sequence; the pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode. A conductive portion is formed on the side of the pixel definition layer and on the top surface of the pixel definition layer away from the driving substrate; the conductive portion is insulated from the first electrode. A light-emitting structure is formed on the first electrode in the pixel opening. A second electrode is formed on the surface of the pixel definition layer away from the driving substrate and on the surface of the light-emitting structure away from the first electrode; the second electrode covers the conductive portion.

[0012] In some embodiments, between the step of sequentially forming a first electrode and a pixel definition layer on a driving substrate and the step of forming a conductive portion on the side of the pixel definition layer and the top surface of the pixel definition layer away from the driving substrate, the step further includes: forming an isolation layer in the pixel opening; the isolation layer completely covers the first electrode, and the thickness of the isolation layer is greater than the distance between the hole transport layer of the light-emitting structure and the first electrode. Between the step of forming a conductive portion on the side of the pixel definition layer and the top surface of the pixel definition layer away from the driving substrate and the step of forming a light-emitting structure in the first pixel opening, the step further includes: removing the isolation layer.

[0013] In some embodiments, the material of the conductive part is metal; the material of the isolation layer is organic, and the material of the isolation layer and the material of the conductive part repel each other; the first electrode includes a first passivation conductive film, a conductive layer, and a second passivation conductive film stacked on the drive substrate.

[0014] In some embodiments, between the step of sequentially forming a first electrode and a pixel definition layer on a driving substrate and the step of forming a conductive portion on a side of the pixel definition layer and a surface of the pixel definition layer away from the driving substrate, it also includes: forming a conductive isolation structure on a side of the pixel definition layer away from the driving substrate; the conductive isolation structure surrounds the pixel opening and the conductive portion, and the second electrode is in contact with and connected to the conductive isolation structure.

[0015] In order to solve the above technical problems, the third technical solution provided in the present application is: to provide a display device, the display device includes a circuit board, and the above display panel or a display panel prepared by the above preparation method; wherein the circuit board is electrically connected to the display panel.

[0016] Beneficial effects of the present application: Different from the prior art, the present application provides a display panel and a method for preparing the same, and a display device. The present application provides a conductive portion on the side and top surface of the pixel definition layer, and the second electrode covers the conductive portion, so that at the connection between the side and top surface of the pixel definition layer, the second electrode contacts the conductive portion to form an electrical connection, which can effectively reduce the problem of conductive discontinuity caused by the break of the second electrode at this location. At the same time, by providing the conductive portion on the side and top surface of the pixel definition layer, the connection between the side and top surface of the pixel definition layer can be smoother, thereby reducing the risk of the second electrode breaking at the connection between the side and top surface of the pixel definition layer, reducing the probability of failure of the display panel, and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 is a schematic cross-sectional structure diagram of a display panel provided in one embodiment of the present application;

[0019] Figure 2 is a schematic cross-sectional structure diagram of another display panel provided in one embodiment of the present application;

[0020] Figure 3 is a schematic diagram of the stacked structure of the light-emitting structure provided in the first embodiment of the present application;

[0021] Figure 4 is a schematic cross-sectional structure diagram of a light-emitting structure provided in a second embodiment of the present application;

[0022] Figure 5 is a schematic diagram of a conductive portion provided by an embodiment of the present application;

[0023] Figure 6 is a schematic flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0024] Figure 7 yes Figure 6 Schematic diagram of the preparation process corresponding to step S100;

[0025] Figure 8 yes Figure 6 Schematic diagram of the preparation process corresponding to step S700;

[0026] Fig. 9 yes Figure 6 Schematic diagram of the preparation process corresponding to step S500;

[0027] Fig.10 yes Figure 6 Schematic diagram of the preparation process corresponding to step S200;

[0028] Fig.11 yes Figure 6 Schematic diagram of the preparation process corresponding to step S600;

[0029] Fig.12 yes Figure 6 Schematic diagram of the preparation process corresponding to step S300;

[0030] Fig.13 yes Figure 6 Schematic diagram of the preparation process corresponding to step S400;

[0031] Fig.14 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0032] Figure numerals: 1. display panel; 11. driving substrate; 12. pixel definition layer; 121. top surface; 122. side surface; 123. pixel opening; 13. conductive isolation structure; 131. conductive structure; 1311. metal oxide layer; 1312. main structure; 132. top structure; 14. light-emitting structure; 141. electron transport layer; 142. light-emitting layer; 143. hole transport layer; 144. electron injection layer; 145. hole blocking layer; 146. electron blocking layer; 147. hole injection layer; 15. first electrode; 16. second electrode; 17. conductive part; 171. second outer surface; 172. first outer surface; 173. second conductive sub-part; 174. first conductive sub-part; 175. first conductive layer; 176. second conductive layer; 18. isolation layer. DETAILED DESCRIPTION

[0033] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0034] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0036] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0037] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] The embodiment of the present disclosure provides a display panel. Figure 1 The display panel 1 includes a light emitting structure 14, and a driving substrate 11, a first electrode 15 and a pixel definition layer 12 which are sequentially stacked; the pixel definition layer 12 has a pixel opening 123, and the pixel opening 123 exposes the first electrode 15; the light emitting structure 14 is disposed on the first electrode 15. The display panel 1 also includes a conductive portion 17 and a second electrode 16; the conductive portion 17 is disposed on a side surface 122 of the pixel definition layer 12 and a top surface 121 of the pixel definition layer 12 away from the driving substrate 11, and is insulated from the first electrode 15; the second electrode 16 is disposed on a surface of the pixel definition layer 12 away from the driving substrate 11 and a surface of the light emitting structure 14 away from the first electrode 15, and covers the conductive portion 17.

[0039] In the pixel opening 123 , the first electrode 15 , the light emitting structure 14 , and the second electrode 16 stacked in the pixel opening 123 may constitute a light emitting device.

[0040] In some examples, the first electrode 15 includes a first passivation conductive film, a conductive layer, and a second passivation conductive film stacked on the drive substrate 11. The conductive layer is made of metal, so that the first electrode 15 can be used as an electrode of the light-emitting device, and can also have a reflective effect, which can be used to reflect the light of the light-emitting structure 14, thereby improving the brightness. The metal can be a metal element, for example, the metal element can be iron, aluminum, copper, silver, etc.; the metal can also be a metal alloy, for example, an alloy of the above metal elements, such as a copper alloy. The materials of the first passivation conductive film and the second passivation conductive film are both non-metallic conductive materials, such as metal oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) and other conductive materials. The first passivation conductive film and the second passivation conductive film wrap the conductive layer to protect the conductive layer and prevent the conductive layer from oxidative denaturation, which affects signal transmission.

[0041] In other examples, the material of the first electrode 15 is metal, and the material of the second electrode 16 is metal. The metal may be a single metal, such as silver (Ag) or gold (Au); the metal may also be a metal alloy, such as an alloy of the above single metals.

[0042] For some examples, see Figure 1 and Figure 3 , the first electrode 15 is an anode, the second electrode 16 is a cathode, and the light emitting structure 14 may include a hole injection layer 147, a hole transport layer 143, an electron blocking layer 146, a light emitting layer 142, a hole blocking layer 145, an electron transport layer 141, and an electron injection layer 144 stacked in sequence on the first electrode 15. In other examples, see Figure 1 and Figure 2 The first electrode 15 is an anode, the second electrode 16 is a cathode, and the light emitting structure 14 may include a hole transport layer 143 , a light emitting layer 142 , and an electron transport layer 141 which are sequentially stacked on the first electrode 15 .

[0043] The driving substrate 11 may be a hard substrate or a flexible substrate, and may be specifically configured according to the usage scenario and usage requirements. The driving substrate 11 includes a driving circuit, which is electrically connected to the first electrode 15 and is used to drive the light-emitting device to emit light. Among them, a light-emitting device electrically connected to the driving circuit may constitute a sub-pixel. When the driving substrate 11 transmits a driving signal to the sub-pixel, under the drive of an external electric field, the first electrode 15 may generate positively charged holes, and the second electrode 16 may generate negatively charged electrons. The holes generated by the first electrode 15 may enter the light-emitting layer 142 through the hole injection layer 147, the hole transport layer 143, and the electron blocking layer 146 in sequence; the electrons may enter the light-emitting layer 142 through the electron transport layer 141 and the hole blocking layer 145 in sequence. The holes in the light-emitting layer 142 recombine with the electrons to form excitons, causing the sub-pixels to emit light.

[0044] The display panel 1 may also include multiple pixel units. The multiple pixel units may include three sub-pixels corresponding to the three primary colors to achieve full-color display; or may include only sub-pixels of one color, such as blue sub-pixels, and then convert the color of light through a quantum dot conversion layer to achieve full-color display; or may include only sub-pixels of one color when used as a light source, and the sub-pixel color may be set according to actual needs. On the display panel 1, multiple pixel units may be arranged according to a preset rule to achieve the desired display effect.

[0045] The pixel definition layer 12 is disposed on the driving substrate 11 and has a plurality of pixel openings 123. The pixel openings 123 are disposed corresponding to the first electrodes 15 and expose the first electrodes. The pixel openings 123 are arranged in an array, and can be arranged specifically according to the arrangement design of the pixel unit. The pixel definition layer 12 can be patterned by a photolithography process, or can also be prepared by other patterning processes.

[0046] The pixel definition layer 12 has a side surface 122 and a top surface 121 . The surface of the pixel definition layer 12 surrounding the pixel opening 123 is the side surface 122 , and the surface of the pixel definition layer 12 away from the driving substrate 11 is the top surface 121 .

[0047] The conductive portion 17 is located in the pixel opening 123 and is disposed on the side surface 122 and the top surface 121 of the pixel definition layer 12. The material of the conductive portion 17 is a material that can conduct electricity (referred to as a conductive material). The conductive material can be a metal; the metal can be a metal single substance, such as gold, silver, copper, aluminum, etc.; the metal can also be an alloy of the above metal single substances, such as a copper alloy. The conductive material can also be a conductive non-metal.

[0048] Exemplarily, the conductive portion 17 is a single-layer structure. Also exemplary, the conductive portion 17 is a plurality of structures. In some examples, see Figure 1 , the conductive part 17 may include a first conductive sub-part 174 and a second conductive sub-part 173; the first conductive sub-part 174 may be disposed on the side surface 122 of the pixel definition layer 12, and the second conductive sub-part 173 may be disposed on the top surface 121 of the pixel definition layer 12 away from the driving substrate 11, and the first conductive sub-part 174 and the second conductive sub-part 173 are connected. The materials of the first conductive sub-part 174 and the second conductive sub-part 173 may be the same or different. In some examples, see Figure 5 , the conductive part 17 may include a first conductive layer 175 and a second conductive layer 176; the first conductive layer 175 and the second conductive layer 176 are stacked. The materials of the first conductive layer 175 and the second conductive layer 176 may be the same or different. For example, the first conductive sub-part 174 and the second conductive sub-part 173 may both include the first conductive layer 175 and the second conductive layer 176.

[0049] In this embodiment, by providing a conductive portion 17 on the side surface 122 and the top surface 121 of the pixel definition layer 12, and making the second electrode 16 cover the conductive portion 17; so that at the connection between the side surface 122 and the top surface 121 of the pixel definition layer 12, the second electrode 16 contacts the conductive portion 17 to form an electrical connection, which can effectively reduce the problem of the second electrode 16 breaking at the connection and causing discontinuous conduction. At the same time, by providing the conductive portion 17 on the side surface 122 and the top surface 121 of the pixel definition layer 12, the connection between the side surface 122 and the top surface 121 of the pixel definition layer 12 can be smoother, thereby reducing the risk of the second electrode 16 breaking at the connection between the side surface 122 and the top surface 121 of the pixel definition layer 12, reducing the probability of failure of the display panel, and improving the product yield.

[0050] In addition, by providing the conductive part 17 to be electrically connected to the second electrode 16, the voltage drop of the second electrode 16 can be reduced, thereby reducing the color shift problem. The overall structure of the second electrode 16 and the conductive part 17 is strong and not easy to break.

[0051] It should be noted that the angle at the corner of the conductive part 17 refers to the angle at the connection between the first outer surface 172 and the second outer surface 171 of the conductive part 17; the first outer surface 172 is the part of the conductive part 17 corresponding to the side surface 122, and the part is a surface away from the side surface 122; the second outer surface 171 is the part of the conductive part 17 corresponding to the top surface 121, and the part is a surface away from the top surface 121.

[0052] In some examples, the angle at the corner of the conductive portion 17 is equal to the angle between the side surface 122 and the top surface 121; for example, the angle at the corner of the conductive portion 17 is equal to 150°, and the angle between the side surface 122 and the top surface 121 is equal to 150°. In other examples, the angle at the corner of the conductive portion 17 is greater than the angle between the side surface 122 and the top surface 121; in this way, the angle at the corner of the conductive portion 17 is increased, making the slope there more gentle, which is conducive to the deposition of the material of the second electrode 16, and further makes the second electrode 16 less likely to break. For example, the angle between the side surface 122 and the top surface 121 is equal to 150°; the angle at the corner of the conductive portion 17 is greater than 150° and less than 180°. The angle at the corner of the conductive portion 17 can be 151°, 155°, 158°, 160°, 165°, 170°, 175°, 177°, 179°, etc. At the same time, the angle between the side surface 122 and the top surface 121 of the pixel definition layer 12 can also be adjusted by adjusting the process parameters to make the angle as large as possible, that is, to make the slope of the pixel definition layer 12 gentler, further improving the problem of easy breakage of the second electrode 16 at the connection between the side surface 122 and the top surface 121 of the pixel definition layer 17.

[0053] Exemplarily, there is a gap between the conductive part 17 and the first electrode 15, so that the conductive part 17 is insulated from the first electrode 15. Also exemplary, there is an insulating part between the conductive part 17 and the first electrode 15, so that the conductive part 17 is insulated from the first electrode 15.

[0054] The light emitting structure 14 includes a hole transport layer 143, a light emitting layer 142 and an electron transport layer 141 which are sequentially stacked on the first electrode 15; the conductive portion 17 is located on the side of the light emitting layer 142 away from the hole transport layer 143. In this way, the conductive portion 17 can be prevented from being in contact with the light emitting layer 142 of the light emitting structure 14 and the layer between the first electrode 15, thereby preventing the normal light emission of the light emitting device from being affected. For example, the conductive portion 17 is not in contact with the light emitting layer 142, the hole transport layer 143 and the first electrode 15.

[0055] The conductive portion 17 is located on the side of the light-emitting layer 142 away from the hole transport layer 143. It can be understood that the conductive portion 17 is not in contact with the light-emitting layer 142 and is located on one side of the light-emitting layer 142. In some examples, the conductive portion 17 is in contact with the electron transport layer 141 of the light-emitting structure 14. For example, the light-emitting structure 14 also includes an electron injection layer 144 and a hole blocking layer 145, and the conductive portion 17 can be in contact with at least one of the electron injection layer 144, the electron transport layer 141 and the hole blocking layer 145. In other examples, there is a gap between the conductive portion 17 and the light-emitting structure 14. Among them, the conductive portion 17 is a ring structure, which is arranged around the first electrode 15.

[0056] In some embodiments, the conductive portion 17 includes a plurality of conductive sub-portions, and the plurality of conductive sub-portions are distributed along the circumference of the pixel opening 123. Two adjacent conductive sub-portions may be spaced apart or directly connected.

[0057] The second electrode 16 is arranged on the surface of the pixel definition layer 12 away from the driving substrate 11 and the surface of the light-emitting structure 14 away from the first electrode 15, and covers the conductive part 17. It can be understood that the conductive part 17 is located between the second electrode 16 and the pixel definition layer 12, and is in contact with the second electrode 16.

[0058] In some embodiments, see Figure 2 The display panel 1 further includes a conductive isolation structure 13 ; the conductive isolation structure 13 is protruding from the pixel definition layer 12 and surrounds a pixel opening 123 and a conductive portion 17 ; and the second electrode 16 is in contact with and connected to the conductive isolation structure 13 .

[0059] The conductive isolation structure 13 separates the multiple light-emitting structures 14, thereby separating two adjacent light-emitting devices to avoid pixel crosstalk. At the same time, the second electrode 16 is arranged in contact with the conductive isolation structure 13 and is connected to the second electrodes 16 of the sub-pixels of the same color through the conductive isolation structure 13, so as to achieve a mesh connection between different pixel units and realize the uniformity of the signal of the entire surface of the second electrode 16.

[0060] In some examples, the conductive portion 17 is in contact with the conductive isolation structure 13, so that the conductive portion 17 and the second electrode 16 as a whole are in contact with the conductive isolation structure 13, increasing the contact area between the second electrode 16 and the conductive portion 17 as a whole and the conductive isolation structure, and enhancing the connection reliability between the second electrode 16 and the conductive portion 17 as a whole and the conductive isolation structure 13, thereby reducing the probability of failure of the display panel 1. Moreover, the voltage drop of the second electrode 16 can be further reduced. In other examples, there is a gap between the conductive portion 17 and the conductive isolation structure 13 (i.e., no contact), and the second electrode 16 fills the gap and contacts the conductive isolation structure to form an electrical connection.

[0061] In some examples, the second electrode 16 is in contact with the conductive isolation structure 13 and extends a preset distance along the side of the conductive isolation structure 13 close to the pixel opening 123 in a direction away from the first electrode 15 to increase the contact area between the second electrode 16 and the conductive isolation structure 13, thereby ensuring the stability of the electrical connection between the second electrode 16 and the conductive isolation structure 13 and avoiding poor conductivity.

[0062] The conductive isolation structure 13 is disposed protruding from the pixel definition layer 12 , which means that the conductive isolation structure 13 is disposed on the top surface 121 of the pixel definition layer 12 .

[0063] The conductive isolation structure 13 may include a conductive structure 131 and a top structure 132 which are sequentially stacked on the pixel definition layer 12. The conductive structure 131 surrounds the pixel opening 123 and the conductive portion 17; the top structure 132 is located on the upper surface of the conductive structure 131 to shield the conductive structure 131, and extends the conductive structure 131 in a direction parallel to the pixel definition layer 12. That is, the top structure 132 is arranged in contact with the conductive structure 131, and the orthographic projection of the top structure 132 on the driving substrate 11 completely covers the orthographic projection of the conductive structure 131 on the driving substrate 11. Specifically, the portion of the top structure 132 extending out of the conductive structure 131 is suspended relative to the conductive structure 131. When evaporating the light-emitting structure 14 and the second electrode 16, the evaporation angle can be adjusted by using the suspended portion of the top structure 132 to adjust the edge range size of each film layer in the light-emitting structure 14. There are multiple conductive isolation structures 13, and two adjacent conductive isolation structures 13 share the same side of the conductive isolation structure 13 to ensure that the spacing between each pixel unit is equal, which is conducive to display uniformity. Specifically, the conductive isolation structure 13 is a ring structure that specifically matches the shape of the pixel unit to prepare a pixel unit with a preset shape.

[0064] In a direction perpendicular to the driving substrate 11 , the longitudinal section of the side wall of the conductive structure 131 is trapezoidal, and the cross section of the side wall of the conductive structure 131 gradually decreases in a direction close to the top structure 132 to facilitate the contact setting of the second electrode 16 with the conductive structure 131 .

[0065] In some examples, the conductive structure 131 may include a main structure 1312 and a metal oxide layer 1311 disposed on a surface of the main structure 1312 , and the material of the main structure 1312 includes metal.

[0066] In this article, contact connection means that two components are in contact and connected. For example, in this article, the conductive part 17 is in contact with the conductive isolation structure 13, which means that the conductive part 17 is in contact with the conductive isolation structure 13 and is connected.

[0067] The embodiment of the present disclosure also provides a method for preparing the display panel 1, see Figure 6 The preparation method includes steps S100 to S500.

[0068] See also Figure 6 and Figure 7 , step S100 , forming a first electrode 15 and a pixel definition layer 12 in sequence on the driving substrate 11 ; the pixel definition layer 12 has a pixel opening 123 , and the pixel opening 123 exposes the first electrode 15 .

[0069] Step S100 may include step S110 and step S120 in sequence.

[0070] Step S110 , forming first electrodes 15 on the driving substrate 11 in sequence.

[0071] Step S120 , forming a pixel definition layer 12 on the portion of the driving substrate 11 not covered by the first electrode 15 and on the first electrode 15 .

[0072] The explanation, connection relationship and effect of the driving substrate 11 , the first electrode 15 and the pixel definition layer 12 can refer to the relevant description of the display panel 1 mentioned above.

[0073] See also Figure 6 and Fig.10 , step S200 , forming a conductive portion 17 on the side surface 122 of the pixel definition layer 12 and the top surface 121 of the pixel definition layer 12 away from the driving substrate 11 ; the conductive portion 17 is insulated from the first electrode 15 .

[0074] In some embodiments, see Figure 6 , Fig. 9 and Fig.11 The preparation method further includes step S500 and step S600; wherein step S500 is between step S100 and step S200, and step S600 is between step S200 and step S300.

[0075] See also Figure 6 and Fig. 9 , step S500, forming an isolation layer 18 in the pixel opening 123; the isolation layer 18 completely covers the first electrode 15, and the thickness of the isolation layer 18 is greater than the distance between the hole transport layer 143 of the light emitting structure 14 and the first electrode 15.

[0076] See also Figure 6 and Fig.11 , step S600, removing the isolation layer 18.

[0077] In this way, the isolation layer 18 can prevent the material of the conductive part 17 from being formed on the first electrode 15, thereby preventing the conductive part 17 from being short-circuited with the first electrode 15. After removing the isolation layer 18, the light-emitting structure 14 can be formed on the first electrode 15. The thickness of the isolation layer 18 is greater than the distance between the hole transport layer 143 of the light-emitting structure 14 and the first electrode 15, and when the light-emitting structure 14 is formed, the conductive part 17 can be prevented from being in contact with the light-emitting layer 142 of the light-emitting structure 14 and the first electrode 15.

[0078] The distance between the hole transport layer 143 of the light emitting structure 14 and the first electrode 15 can be understood as the distance between the surface of the hole transport layer 143 away from the first electrode 15 and the surface of the first electrode 15 close to the hole transport side in the direction perpendicular to the driving substrate 11. In some examples, the light emitting structure 14 only includes the electron transport layer 141, the light emitting layer 142 and the hole transport layer 143, and the thickness of the isolation layer 18 is greater than the sum of the thicknesses of the hole transport layer 143 and the light emitting layer 142. In other examples, the light emitting structure 14 only includes the electron injection layer 144, the electron transport layer 141, the hole blocking layer 145, the light emitting layer 142, the electron blocking layer 146, the hole transport layer 143 and the hole injection layer 147, and the thickness of the isolation layer 18 is greater than the sum of the thicknesses of the light emitting layer 142, the electron blocking layer 146, the hole transport layer 143 and the hole injection layer 147.

[0079] In some examples, the material of the conductive part 17 is metal; the material of the isolation layer 18 is organic, and the material of the isolation layer 18 and the material of the conductive part 17 repel each other; the first electrode 15 includes a first passivation conductive film, a conductive layer, and a second passivation conductive film stacked on the drive substrate 11. In this way, there is no mutual repulsion between the material of the second passivation conductive film and the material of the isolation layer 18, so that the material of the isolation layer 18 can be deposited on the second passivation conductive film to form the isolation layer 18. Since the material of the isolation layer 18 and the material of the conductive part 17 repel each other, the material of the conductive part 17 cannot be deposited on the isolation layer 18, so that the material of the conductive part 17 can only be attached to the side 122 of the pixel definition layer 12 and the top surface 121 of the pixel definition layer 12 away from the drive substrate 11 to form the conductive part 17. Therefore, there is no need to use a mask to prepare the conductive part 17.

[0080] The material of the conductive part 17 is metal; the metal can be a metal element, for example, the metal element can be iron, aluminum, copper, silver, etc.; the metal can also be a metal alloy, for example, an alloy of the above metal elements, such as a copper alloy. The material of the isolation layer 18 is an organic matter, and the organic matter can be a cathode patterning material (CPM), and the CPM material is a fluorine-containing organic material, such as a substituted fluorinated cyclotriphosphinate compound. The CPM material is incompatible with the metal and repel each other. The CPM material can be deposited on the second passivation conductive film by low-temperature vacuum evaporation to form the isolation layer 18. The materials of the first passivation conductive film and the second passivation conductive film are both non-metallic conductive materials, such as metal oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) and other conductive materials. The first passivation conductive film and the second passivation conductive film wrap the conductive layer to prevent the conductive layer from oxidizing and degenerating, which affects signal transmission.

[0081] In other examples, a first conductive layer is formed on the side surface 122 of the pixel definition layer 12, the top surface 121 of the pixel definition layer 12 away from the drive substrate 11, and the isolation layer 18, and a portion of the first conductive layer directly facing the isolation layer 18 is removed, and the remaining portion of the first conductive layer is the conductive portion 17. The method for removing the portion of the first conductive layer directly facing the isolation layer 18 may be an etching method, etc.

[0082] In other embodiments, a second conductive layer is formed on the side surface 122 of the pixel definition layer 12, the top surface 121 of the pixel definition layer 12 away from the driving substrate 11, and the first electrode 15. For example, the portion of the second conductive layer that is directly opposite to the first electrode 15 is removed, and the remaining portion of the second conductive layer is the conductive portion 17. For another example, the third portion between the first portion and the second portion of the second conductive layer is removed, so that the first portion is spaced apart from the second portion, the first portion is the conductive portion 17, and the third portion is located on the first electrode piece. The third portion can be removed; or the third portion and the first electrode piece can form a whole, which can be used as, for example, an anode. The removal method can be an etching method, etc.

[0083] Step S300, see Figure 6 and Fig.12 , a light emitting structure 14 is formed on the first electrode 15 in the pixel opening 123 .

[0084] The description of the light emitting structure 14 may refer to the related description of the light emitting structure 14 in the above-mentioned display panel 1 .

[0085] Step S400, see Figure 6 and Fig.13 A second electrode 16 is formed on a surface of the pixel definition layer 12 away from the driving substrate 11 and a surface of the light emitting structure 14 away from the first electrode 15 ; the second electrode 16 covers the conductive portion 17 .

[0086] In this embodiment, the conductive portion 17 is formed on the side 122 and the top surface 121 of the pixel definition layer 12, and the second electrode 16 covers the conductive portion 17; so that at the connection between the side 122 and the top surface 121 of the pixel definition layer 12, the second electrode 16 contacts the conductive portion 17 to form an electrical connection, which can effectively reduce the problem of the second electrode 16 breaking at the connection and causing discontinuous conduction. At the same time, the conductive portion 17 is formed on the side 122 and the top surface 121 of the pixel definition layer 12, which can make the connection between the side 122 and the top surface 121 of the pixel definition layer 12 smoother, thereby reducing the risk of the second electrode 16 breaking at the connection between the side 122 and the top surface 121 of the pixel definition layer 12, reducing the probability of failure of the display panel, and improving the product yield. The description of the second electrode 16 can refer to the relevant description of the second electrode 16 of the display panel 1 mentioned above.

[0087] In some embodiments, see Figure 6 and Figure 8 The preparation method further includes step S700; wherein step S700 is between step S100 and step S200.

[0088] Step S700 , forming a conductive isolation structure 13 on a side of the pixel definition layer 12 away from the driving substrate 11 ; the conductive isolation structure 13 surrounds the pixel opening 123 and the conductive portion 17 , and the second electrode 16 is in contact with and connected to the conductive isolation structure 13 .

[0089] The description and effect of the conductive isolation structure 13 may refer to the relevant description and effect of the conductive isolation structure 13 of the above-mentioned display panel 1 .

[0090] For some examples, see Figure 6 to Figure 13 , the steps of the preparation method are step S100, step S700, step S500, step S200, step S600, step S300, and step S200. Among them, the material of the conductive part 17 may also be deposited on the top structure 132 to form a third metal layer, and the top structure 132 isolates the conductive structure 131 from the third metal layer, so that the conductive structure 131 is insulated from the third metal layer. Among them, the third metal layer can be removed or retained. When evaporating the conductive part 17, the light-emitting structure 14, and the second electrode 16, the evaporation angle can be adjusted by the suspended part of the top structure 132 to adjust the edge range size of each film layer in the light-emitting structure 14, and the conductive part 17 and the second electrode 16 are both evaporated to contact with the conductive structure 131. Among them, since the material of the isolation layer 18 and the material of the conductive part 17 repel each other, the conductive isolation structure 13 and the isolation layer 18 can be used to evaporate and form the conductive part 17, so that the mask is not required to evaporate and form the conductive part 17, which simplifies the process steps and saves costs. Furthermore, the area size of the conductive portion 17 close to the conductive isolation structure can be adjusted by adjusting the evaporation angle of the evaporation source, thereby adjusting the extension distance of the conductive portion 17 on the pixel definition layer 12 in the direction close to the conductive isolation structure.

[0091] In some examples, the first electrode 15 is an anode and the second electrode 16 is a cathode. In other examples, the first electrode 15 is a cathode and the second electrode 16 is an anode. This article takes the first electrode 15 as an anode and the second electrode 16 as a cathode as an example for description.

[0092] The embodiment of the present disclosure provides a display device. The display device can be used in the fields of tablets, mobile phones, vehicles, lighting, etc. Fig.14 The display device includes a display panel 1 and a circuit board (not shown), the circuit board is electrically connected to the display panel 1, and is used to provide the display panel 1 with various drive signals, power signals and other display signals required by the display panel 1.

[0093] The specific structure and function of the display panel 1 are the same or similar to those of the display panel 1 in the above embodiment, and the same technical effect can be achieved. For details, please refer to the above description. The display panel 1 can be the display panel 1 in the above embodiment, or it can be the display panel 1 prepared by the above preparation method. The display device can effectively improve the display brightness and pixel density, and can improve the product yield.

[0094] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising: A driving substrate, a first electrode and a pixel definition layer are sequentially stacked; The pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode; A light emitting structure is disposed on the first electrode; It is characterized in that The display panel also includes a conductive portion and a second electrode; the conductive portion is arranged on the side of the pixel definition layer and the top surface of the pixel definition layer away from the driving substrate, and is insulated from the first electrode; the second electrode is arranged on the surface of the pixel definition layer away from the driving substrate and the surface of the light-emitting structure away from the first electrode, and covers the conductive portion.

2. The display panel according to claim 1, characterized in that: The display panel further includes a conductive isolation structure; the conductive isolation structure is arranged to protrude from the pixel definition layer and surround the pixel opening and the conductive portion; and the second electrode is in contact with and connected to the conductive isolation structure.

3. The display panel according to claim 2, characterized in that: The conductive portion is in contact with and connected to the conductive isolation structure.

4. The display panel according to any one of claims 1 to 3, characterized in that: The included angle at the corner of the conductive portion is greater than or equal to 150° and less than 180°.

5. The display panel according to any one of claims 1 to 3, characterized in that: The light-emitting structure comprises a hole transport layer, a light-emitting layer and an electron transport layer which are sequentially stacked on the first electrode; and the conductive portion is located on a side of the light-emitting layer away from the hole transport layer.

6. A method for preparing a display panel, characterized in that: include: forming a first electrode and a pixel definition layer in sequence on the driving substrate; The pixel definition layer has a pixel opening, and the pixel opening exposes the first electrode; forming a conductive portion on a side surface of the pixel definition layer and a top surface of the pixel definition layer away from the drive substrate; the conductive portion is insulated from the first electrode; forming a light emitting structure on the first electrode in the pixel opening; A second electrode is formed on a surface of the pixel definition layer away from the drive substrate and a surface of the light emitting structure away from the first electrode; the second electrode covers the conductive portion.

7. The method for preparing a display panel according to claim 6, characterized in that: Between the step of sequentially forming a first electrode and a pixel definition layer on the driving substrate and the step of forming a conductive portion on the side surface of the pixel definition layer and the top surface of the pixel definition layer away from the driving substrate, the method further includes: An isolation layer is formed in the pixel opening; the isolation layer completely covers the first electrode, and the thickness of the isolation layer is greater than the distance between the hole transport layer of the light-emitting structure and the first electrode; Between the step of forming a conductive portion on the side surface of the pixel definition layer and on the top surface of the pixel definition layer away from the drive substrate and the step of forming a light emitting structure in the pixel opening, the method further includes: Remove the isolation layer.

8. The method for preparing a display panel according to claim 7, characterized in that: The conductive part is made of metal; the isolation layer is made of organic matter, and the isolation layer and the conductive part are mutually exclusive; the first electrode includes a first passivation conductive film, a conductive layer, and a second passivation conductive film stacked on the drive substrate.

9. The method for preparing a display panel according to any one of claims 6 to 8, characterized in that: Between the step of sequentially forming a first electrode and a pixel definition layer on the drive substrate and the step of forming a conductive portion on a side surface of the pixel definition layer and a surface of the pixel definition layer away from the drive substrate, the method further includes: A conductive isolation structure is formed on a side of the pixel definition layer away from the drive substrate; the conductive isolation structure surrounds the pixel opening and the conductive portion, and the second electrode is in contact with and connected to the conductive isolation structure.

10. A display device, characterized in that: include: Circuit boards; as well as, The display panel according to any one of claims 1 to 5; Alternatively, a display panel prepared by the preparation method according to any one of claims 6 to 9; wherein the circuit board is electrically connected to the display panel.

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