A lead-free reflow soldering machine for producing automobile taillight module circuit boards

Abstract

The present invention relates to the technical field of automobile taillight module circuit board welding, and discloses a lead-free reflow soldering machine for producing automobile taillight module circuit boards, comprising an installation unit, a transmission unit, and a rolling unit: the installation unit comprises a workbench, a notch is provided in the middle of the workbench, and a transmission roller is provided in the inner cavity of the notch, and guide notches are provided on the two opposite side walls of the inner cavity of the notch, a coating chamber, an SMT patch placement chamber, a heating and welding chamber, and a cooling chamber are provided above the workbench, and a first sealing heat insulation plate is provided between the coating chamber and the SMT patch placement chamber. The present invention, when the driving assembly moves downward to a certain position, can make the conical block and the special-shaped plate at this time move back and forth with the assistance of the first installation plate and the second installation plate, thereby being able to drive the circular pressing plate to rotate back and forth, so that the circular pressing plate can grind the solder paste spread on the circuit board so that it can be in a uniform state on the circuit board.

Description

Technical Field

[0001] The invention belongs to the technical field of automobile taillight module circuit board welding, and in particular relates to a lead-free reflow soldering machine for producing automobile taillight module circuit boards. Background Art

[0002] In the early stages of automotive taillight module circuit board production, lead-containing soldering was a common technique. However, lead is a heavy metal that poses serious risks to both the environment and human health. With increasing global attention to environmental protection, many countries and regions have introduced strict environmental regulations, restricting or prohibiting the use of lead-containing materials in electronic product manufacturing.

[0003] Lead-free solder is mainly an alloy based on tin (Sn) with added silver (Ag), copper (Cu), bismuth (Bi) and other metal elements; its melting point is generally around 217°C - 220°C, which is higher than the melting point of traditional lead-containing solder; the surface tension of lead-free solder is greater than that of lead-containing solder, and its fluidity is poorer.

[0004] However, in the existing lead-free soldering of automobile taillight module circuit boards, it is often necessary to apply solder paste to the circuit boards. However, when applying the existing solder paste, since it is often applied manually, the solder paste is easily uneven on the circuit boards. As a result, when the circuit boards and SMT patches are heated and the solder paste melts, tin beads are easily formed in the solder paste, resulting in poor welding effect between the circuit boards and the SMT patches.

[0005] In view of this, the present invention is proposed. Summary of the Invention

[0006] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0007] A lead-free reflow soldering machine for producing automobile taillight module circuit boards, comprising a mounting unit, a transmission unit, and a rolling unit:

[0008] The installation unit includes a workbench, a notch is provided in the middle of the workbench, and a transmission roller is provided in the inner cavity of the notch, and guide notches are further provided on the two opposite side walls of the inner cavity of the notch, a coating chamber, an SMT patch placement chamber, a heating and welding chamber and a cooling chamber are provided above the workbench, a first sealed heat insulation board is provided between the coating chamber and the SMT patch placement chamber, a cavity is provided in the first sealed heat insulation board, and a rectangular notch is provided on one side wall, a second sealed movable heat insulation board is slidably provided in the first sealed heat insulation board, a third sealed heat insulation board is provided between each of the SMT patch placement chamber, the heating and welding chamber and the cooling chamber, a plurality of equidistantly distributed support legs are fixedly installed on the bottom of the workbench, each of the support legs is symmetrical with each other, and circuit boards are placed in the inner cavities of the two guide notches;

[0009] The transmission unit includes a driving assembly and a circular pressing plate, wherein the driving assembly is used to drive the rolling unit to drive the circular pressing plate to rotate slightly back and forth;

[0010] The rolling unit includes a first mounting plate and a second mounting plate. The opposite side walls of the first mounting plate and the second mounting plate are each provided with a special-shaped sliding groove. The two special-shaped sliding grooves are parallel to each other. Sliding blocks are slidably installed in the inner cavities of the two special-shaped sliding grooves. The bottoms of the first mounting plate and the second mounting plate are fixedly connected to the circular pressure plate.

[0011] As a preferred embodiment of the present invention, a robotic arm is provided above the SMT patch placement cavity, and an electronic adsorption disk is provided at the bottom of the robotic arm.

[0012] As a preferred embodiment of the present invention, the drive assembly includes a servo motor, which is installed above the inner cavity of the coating chamber. A threaded rod is fixedly installed at the output end of the servo motor, and a threaded sleeve is fixedly installed at the output end of the threaded rod. Two mutually symmetrical guide rods are movably passed through the threaded sleeve, and the top ends of the two guide rods are fixedly connected above the inner cavity of the coating chamber.

[0013] As a preferred embodiment of the present invention, two symmetrical rectangular tubes are fixedly installed at the bottom of the threaded sleeve, and the inner cavities of the two rectangular tubes are each provided with a first sliding mechanism. The first sliding mechanism includes two first sliding grooves, and the two first sliding grooves are respectively opened on the two opposite side walls of the inner cavity of the rectangular tube. The two first sliding grooves are symmetrical to each other, and the inner cavities of the two first sliding grooves are both slidably installed with first sliders, and the two first sliders are symmetrical to each other. A movable plate is fixedly connected to one side wall opposite to the two first sliders, and the two movable plates are symmetrical to each other.

[0014] As a preferred embodiment of the present invention, the bottom of the two movable plates are fixedly connected to a plug-in rod, the two plug-in rods are symmetrical to each other, the first return springs are fixedly installed above the two movable plates, the other ends of the two first return springs are fixedly connected above the inner cavity of the rectangular tube, and special-shaped plates are also fixedly installed above the two movable plates, and the two special-shaped plates are symmetrical to each other.

[0015] As a preferred embodiment of the present invention, two opposite side walls of the two rectangular tubes are provided with placement slots, the two placement slots are symmetrical to each other, and the inner cavities of the two placement slots are both provided with a second sliding mechanism.

[0016] As a preferred embodiment of the present invention, the second sliding mechanism includes two second sliding grooves, which are respectively opened on the two opposite side walls of the placement slot cavity, the two second sliding grooves are symmetrical to each other, and the second sliders are slidably installed in the inner cavities of the two second sliding grooves, and the two second sliders are symmetrical to each other.

[0017] As a preferred embodiment of the present invention, one side wall of each of the four second sliders is fixedly connected to a driving plate, the two driving plates are symmetrical to each other, and the two side walls opposite to each other are fixedly installed with a conical block, the opposite ends of the two driving plates are fixedly connected to a mounting rod, and the opposite ends of the two mounting rods are respectively fixedly connected to the sliding block, and one side wall of each second slider is fixedly connected to a second return spring, and the other end of the second return spring is respectively fixedly connected to the inner wall of the second slide groove.

[0018] As a preferred embodiment of the present invention, a third sliding mechanism is provided above the circular pressure plate, and the third sliding mechanism includes a first circular slide groove, which is opened above the circular pressure plate, and two mutually symmetrical guide sliders are slidably installed in the inner cavity of the first circular slide groove, and a plug rod is fixedly connected above the two guide sliders.

[0019] As a preferred embodiment of the present invention, a second circular groove is provided on the side wall of the circular pressure plate, a movable slider is slidably installed in the inner cavity of the second circular groove, an L-shaped fixing rod is fixedly installed on the movable slider, and the other end of the L-shaped fixing rod is movable through the rectangular groove and is fixedly connected to the second sealed movable insulation plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention drives the circular pressing plate to move vertically downward through the driving component. When the circular pressing plate moves vertically downward, it can squeeze the solder paste placed on the circuit board that is currently limited and spread it around. When the driving component moves downward to a certain position, it can make the conical block and the special-shaped plate move back and forth with the assistance of the first mounting plate and the second mounting plate, so that the circular pressing plate can be driven to rotate back and forth. Therefore, the circular pressing plate can grind the solder paste diffused on the circuit board so that it can be in a uniform state on the circuit board. Therefore, when the SMT patch is placed and the SMT patch and the circuit board are transferred together to the heated welding chamber, the solder paste can be melted, which ensures to a certain extent that no tin beads will appear during the melting process of the solder paste, and at the same time ensures that the solder joints between the circuit board and the SMT patch are full.

[0022] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the attached figure:

[0024] Figure 1 The figure is a schematic diagram of the three-dimensional structure of a lead-free reflow soldering machine used for producing automobile taillight module circuit boards;

[0025] Figure 2 The figure is a side view schematic diagram of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards;

[0026] Figure 3 This is a schematic diagram of the inner structure of a coating chamber of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards;

[0027] Figure 4 The figure is a schematic diagram of the transmission unit structure of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards;

[0028] Figure 5 This is a schematic diagram of a rectangular tube cross-sectional structure of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards;

[0029] Figure 6 A lead-free reflow soldering machine for producing automobile taillight module circuit boards Figure 5 A in the middle is an enlarged structural diagram;

[0030] Figure 7 A schematic diagram of the inner cavity structure of a placement slot of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards;

[0031] Figure 8 A lead-free reflow soldering machine for producing automobile taillight module circuit boards Figure 7 The enlarged structural diagram at B in the middle;

[0032] Figure 9 This is a schematic diagram of the partial structure of the third sealing and heat insulation installation of a lead-free reflow soldering machine used to produce automobile taillight module circuit boards.

[0033] In the picture:

[0034] 100, mounting unit; 101, workbench; 1011, support leg; 1012, coating chamber; 1013, SMT patch placement chamber; 1014, heating and welding chamber; 1015, cooling chamber; 1016, transport roller; 1017, guide notch; 1018, robotic arm; 1019, electronic adsorption plate; 102, circuit board; 103, first sealed thermal insulation board; 1031, rectangular notch; 1032, second sealed movable thermal insulation board; 1033, third sealed thermal insulation board;

[0035] 200, transmission unit; 201, servo motor; 2011, threaded rod; 2012, threaded sleeve; 2013, guide rod; 202, rectangular tube; 2021, first chute; 2022, first slider; 2023, movable plate; 2024, plug-in rod; 2025, first return spring; 2026, special-shaped plate; 2027, placement notch; 203, circular pressure plate; 2031, first circular chute; 2032, guide slider; 2033, second circular chute; 2034, movable slider; 2035, L-shaped fixing rod;

[0036] 300, rolling unit; 301, conical block; 3011, driving plate; 3012, mounting rod; 3013, second slide groove; 3014, second slider; 3015, second return spring; 302, first mounting plate; 3021, special-shaped slide groove; 3022, sliding block; 303, second mounting plate. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.

[0038] Example 1:

[0039] like Figures 1 to 9As shown, a lead-free reflow soldering machine for producing automobile taillight module circuit boards includes an installation unit 100, a transmission unit 200 and a rolling unit 300: the installation unit 100 includes a workbench 101, a notch is provided in the middle of the workbench 101, and a transmission roller 1016 is provided in the inner cavity of the notch, and guide notches 1017 are provided on the two opposite side walls of the inner cavity of the notch, a coating chamber 1012, an SMT patch placement chamber 1013, a heating and welding chamber 1014 and a cooling chamber 1015 are provided above the workbench 101, a first sealed heat insulation plate 103 is provided between the coating chamber 1012 and the SMT patch placement chamber 1013, a cavity is provided in the first sealed heat insulation plate 103, and a rectangular notch 1031 is provided on one side wall, a second sealed movable heat insulation plate 1032 is slidably provided in the first sealed heat insulation plate 103, the SMT patch placement chamber 1013, the heating and welding chamber 1014 and the cooling chamber 1015 are provided 14 and the cooling chamber 1015 are provided with a third sealing insulation plate 1033, and a plurality of equidistantly distributed support legs 1011 are fixedly installed on the bottom of the workbench 101, and each support leg 1011 is symmetrical with each other, and the circuit board 102 is placed in the inner cavity of the two guide slots 1017; the transmission unit 200 includes a driving component and a circular pressure plate 203, and the driving component is used to drive the rolling unit 300 to drive the circular pressure plate 203 to rotate slightly back and forth; the rolling unit 300 includes a first mounting plate 302 and a second mounting plate 303, and the opposite side walls of the first mounting plate 302 and the second mounting plate 303 are provided with special-shaped sliding grooves 3021, and the two special-shaped sliding grooves 3021 are parallel to each other, and the inner cavities of the two special-shaped sliding grooves 3021 are slidably installed with sliding blocks 3022, and the bottoms of the first mounting plate 302 and the second mounting plate 303 are fixedly connected to the circular pressure plate 203. The circular pressing plate 203 is driven by the driving component to move vertically downward. When the circular pressing plate 203 moves vertically downward, it can squeeze the solder paste placed on the circuit board 102 that is limited at this time and spread it around. When the driving component moves downward to a certain position, it can make the conical block 301 and the special-shaped plate 2026 move back and forth with the assistance of the first mounting plate 302 and the second mounting plate 303, so that the circular pressing plate 203 can be driven to rotate back and forth. Therefore, the circular pressing plate 203 can grind the solder paste spread on the circuit board 102 so that it can be in a uniform state on the circuit board 102. Therefore, when the SMT patch is placed and the SMT patch and the circuit board 102 are transferred to the heating welding chamber 1014 together, the solder paste can be melted, which to a certain extent ensures that no tin beads will appear during the melting process of the solder paste, and at the same time ensures that the solder joints between the circuit board 102 and the SMT patch are full.

[0040] like Figure 9As shown, in a specific embodiment, a mechanical arm 1018 is provided above the inner cavity of the SMT patch placement cavity 1013, and an electronic adsorption plate 1019 is provided at the bottom of the mechanical arm 1018. In this setting, the specific movement mode of the SMT patch is determined.

[0041] Example 2:

[0042] The difference between Example 1 and this example is that: Figures 2 to 7 The figure shows a lead-free reflow soldering machine for producing circuit boards for automotive taillight modules. The drive assembly includes a servo motor 201, which is mounted above the inner cavity of an application chamber 1012. A threaded rod 2011 is fixedly mounted to the output end of the servo motor 201. A threaded sleeve 2012 is fixedly mounted to the output end of the threaded rod 2011. Two symmetrical guide rods 2013 are movably inserted through the threaded sleeve 2012. The top ends of the two guide rods 2013 are fixedly connected above the inner cavity of the application chamber 1012. In this configuration, the installation position and components of the drive assembly are determined.

[0043] like Figures 2 to 7 As shown, in a specific embodiment, two symmetrical rectangular tubes 202 are fixedly mounted at the bottom of the threaded sleeve 2012. Each of the two rectangular tubes 202 has a first sliding mechanism disposed therein. The first sliding mechanism comprises two first chutes 2021, which are located on opposite sides of the inner wall of the rectangular tube 202. The two first chutes 2021 are symmetrical to each other. A first slider 2022 is slidably mounted on the inner wall of each of the two first chutes 2021. The two first sliders 2022 are symmetrical to each other. A movable plate 2023 is fixedly attached to the opposite side wall of the two first sliders 2022. The two movable plates 2023 are symmetrical to each other. This arrangement ensures that when the connecting rod 2024 is stationary, the rectangular tube 202 can move vertically downward.

[0044] like Figures 2 to 7 As shown, further, the bottoms of the two movable plates 2023 are fixedly connected to a plug rod 2024, and the two plug rods 2024 are symmetrical to each other. A first return spring 2025 is fixedly installed above the two movable plates 2023, and the other ends of the two first return springs 2025 are fixedly connected to the upper part of the inner cavity of the rectangular tube 202. A special-shaped plate 2026 is also fixedly installed above the two movable plates 2023, and the two special-shaped plates 2026 are symmetrical to each other. In this configuration, the specific installation positions of the movable plates 2023 and the installation positions of the special-shaped plates 2026 are determined.

[0045] like Figures 2 to 8As shown, further, the two rectangular tubes 202 have opposite side walls each having a placement slot 2027, the two placement slots 2027 are symmetrical to each other, and the inner cavities of the two placement slots 2027 are each provided with a second sliding mechanism. In this configuration, the opening positions of the placement slots 2027 are determined.

[0046] like Figures 2 to 8 As shown, the second sliding mechanism further includes two second sliding grooves 3013, which are respectively provided on opposite side walls of the inner cavity of the placement slot 2027. The two second sliding grooves 3013 are symmetrical to each other. A second slider 3014 is slidably mounted in the inner cavity of each second sliding groove 3013, and the two second sliders 3014 are symmetrical to each other. In this configuration, the installation position and components of the second sliding mechanism are determined.

[0047] like Figures 2 to 8 As shown, four second sliders 3014 are fixedly connected to opposite side walls of each pair of second sliders 3014. The two driver plates 3011 are symmetrical with each other. Conical blocks 301 are fixedly mounted on opposite side walls of the two driver plates 3011. Opposite ends of the two driver plates 3011 are fixedly connected to mounting rods 3012. Opposite ends of the two mounting rods 3012 are respectively fixedly connected to the sliding block 3022. A second return spring 3015 is fixedly connected to one side wall of each second slider 3014, and the other end of the second return spring 3015 is respectively fixedly connected to the inner wall of the second slide groove 3013. In this configuration, the specific mounting position and connection method of the conical blocks 301 are determined.

[0048] Example 3:

[0049] The difference between Example 2 and this example is that: Figures 2 to 5 and Figure 7 and Figure 9 The figure shows a lead-free reflow soldering machine for producing circuit boards for automotive taillight modules. A third sliding mechanism is positioned above a circular pressure plate 203. The third sliding mechanism comprises a first circular chute 2031, which is positioned above the circular pressure plate 203. Two symmetrical guide sliders 2032 are slidably mounted within the first circular chute 2031. A plug-in rod 2024 is fixedly attached to each of the guide sliders 2032. This configuration ensures that the third sliding mechanism's installation position and components ensure that the circular pressure plate 203 can move vertically downward and rotate slightly.

[0050] like Figures 2 to 5 and Figure 7 as well as Figure 9As shown, in a specific embodiment, a second circular groove 2033 is formed on the side wall of the circular pressure plate 203. A movable slider 2034 is slidably mounted within the inner cavity of the second circular groove 2033. An L-shaped fixing rod 2035 is fixedly mounted on the movable slider 2034. The other end of the L-shaped fixing rod 2035 movably extends through the rectangular notch 1031 and is fixedly connected to the second sealed movable thermal insulation plate 1032. In this arrangement, as the circular pressure plate 203 moves downward, it can drive the second sealed movable thermal insulation plate 1032 to move vertically downward via the L-shaped fixing rod 2035, thereby sealing the coating chamber 1012 and preventing the circuit board 102 from being transported.

[0051] The implementation principle of the lead-free reflow soldering machine for producing automobile taillight module circuit boards of the present invention is as follows:

[0052] First, the worker places the circuit board 102 in two guide slots 1017 on the workbench 101. The controller then controls the conveyor rollers 1016 to move the circuit board 102 (this is conventional technology). Before the circuit board 102 moves, solder paste is placed in the middle of the circuit board.

[0053] When the circuit board 102 is driven by the conveying roller 1016 to move into the inner cavity of the coating chamber 1012, the controller controls the servo motor 201 to operate. When the servo motor 201 operates, it can drive the threaded rod 2011 to rotate. When the threaded rod 2011 rotates, it can drive the threaded sleeve 2012 to move vertically downward with the assistance of the guide rod 2013. When the threaded sleeve 2012 moves vertically downward, it can drive the rectangular tube 202, the plug rod 2024 and the circular pressure plate 203 to move vertically downward, so that the circular pressure plate 203 presses on the circuit board 102 (because the circular pressure plate 203 moves downward, it can drive the second sealing movable heat insulation plate 1032 to move vertically downward through the L-shaped fixing rod 2035, thereby sealing the coating chamber 1012 and preventing the circuit board 102 from being transported);

[0054] When the circular pressure plate 203 is pressed on the circuit board 102, the solder paste on the circuit board 102 will be squeezed and spread to the surrounding areas. At the same time, because the plug-in rod 2024 is plugged into the rectangular tube 202, the plug-in rod 2024 is stationary at this time, but the rectangular tube 202 can continue to move downward. When the rectangular tube 202 moves downward, it can drive the conical block 301 to move vertically downward, so that the conical block 301 can move back and forth with the assistance of the special-shaped plate 2026 (because one end of the conical block 301 is fixedly mounted with a driving plate 3011, and two ends of the driving plate 3011 are provided with a second sliding mechanism, and a second return spring 3015 is fixedly connected between the second slider 3014 and the second slide groove 3013 in the second sliding mechanism. Therefore, when the conical block 301 enters the convex surface of the special-shaped plate 2026, the elasticity can be contracted, and when it enters the concave surface, the elasticity is relaxed, so that the conical block 301 can move back and forth);

[0055] When the conical block 301 moves back and forth, it can drive the mounting rod 3012 to move back and forth. Because one end of the mounting rod 3012 is connected to the second slider 3014 provided on the first mounting plate 302 and the second mounting plate 303, respectively, it can apply a pushing force and a pulling force to the first mounting plate 302 and the second mounting plate 303, thereby enabling the first mounting plate 302 and the second mounting plate 303 to drive the circular pressing plate 203 to rotate back and forth slightly, thereby grinding the spread solder paste on the circuit board 102 back and forth, thereby achieving the purpose of uniformity.

[0056] When the solder paste is in a uniform state on the circuit board 102, the servo motor 201 performs reverse operation at this time, because the second sealed movable insulation plate 1032 can be opened, so that the circuit board 102 can be transferred to the SMT patch placement chamber 1013. At this time, the controller controls the electronic adsorption disk 1019 on the robotic arm 1018 set in the SMT patch placement chamber 1013 to adsorb the SMT patch and place it on the circuit board 102. At this time, the electronic adsorption disk 1019 is powered off, so that the SMT patch can be placed on the circuit board 102. At this time, the circuit board 102 can enter the heating welding chamber 1014 with the assistance of the transmission roller 1016, so as to melt the solder paste at high temperature. After melting, the circuit board 102 is transferred to the cooling chamber 1015 to cool the melted solder paste, so that the welding between the circuit board 102 and the SMT patch can be completed (the opening and closing of the third sealed insulation plate 1033 are both existing technologies).

Claims

1. A lead-free reflow soldering machine for producing automobile taillight module circuit boards, characterized in that: It includes an installation unit (100), a transmission unit (200) and a rolling unit (300): The installation unit (100) comprises a workbench (101), a slot is provided in the middle of the workbench (101), a transmission roller (1016) is provided in the slot cavity, and guide slots (1017) are provided on two opposite side walls of the slot cavity, a coating chamber (1012), an SMT patch placement chamber (1013), a heating and welding chamber (1014) and a cooling chamber (1015) are provided above the workbench (101), a first sealing heat insulation board (103) is provided between the coating chamber (1012) and the SMT patch placement chamber (1013), and a heat insulation board (103) is provided inside the first sealing heat insulation board (103). A cavity is provided, and a rectangular notch (1031) is provided on one side wall; a second sealed movable heat insulation plate (1032) is slidably provided in the first sealed heat insulation plate (103); a third sealed heat insulation plate (1033) is provided between each of the SMT patch placement cavity (1013), the heating and welding cavity (1014), and the cooling cavity (1015); a plurality of support legs (1011) arranged in equal intervals are fixedly installed on the bottom of the workbench (101); each of the support legs (1011) is symmetrical to each other; and a circuit board (102) is placed in the inner cavity of the two guide notches (1017); The transmission unit (200) comprises a driving assembly and a circular pressing plate (203), wherein the driving assembly is used to drive the rolling unit (300) to drive the circular pressing plate (203) to rotate slightly back and forth; the driving assembly comprises a servo motor (201), wherein the servo motor (201) is mounted above the inner cavity of the coating chamber (1012), wherein a threaded rod (2011) is fixedly mounted on the output end of the servo motor (201), wherein a threaded sleeve (212) is fixedly mounted on the output end of the threaded rod (211), wherein two mutually symmetrical guide rods (213) are movably penetrated on the threaded sleeve (212), wherein the top ends of the two guide rods (213) are fixedly connected above the inner cavity of the coating chamber (1012); Two mutually symmetrical rectangular tubes (202) are fixedly installed at the bottom of the threaded sleeve (2012), and the inner cavities of the two rectangular tubes (202) are both provided with a first sliding mechanism, and the first sliding mechanism includes two first sliding grooves (2021), and the two first sliding grooves (2021) are respectively opened on the two opposite side walls of the inner cavity of the rectangular tube (202), and the two first sliding grooves (2021) are symmetrical to each other. The inner cavities of the two first sliding grooves (2021) are both slidably installed with first sliders (2022), and the two first sliders (2022) are symmetrical to each other. The opposite side walls of the two first sliders (2022) are fixedly connected with a movable plate (223), and the two movable plates (223) are symmetrical to each other. The bottoms of the two movable plates (2023) are fixedly connected to a plug rod (2024), the two plug rods (2024) are symmetrical to each other, a first return spring (2025) is fixedly installed above the two movable plates (2023), the other ends of the two first return springs (2025) are fixedly connected to the upper part of the inner cavity of the rectangular cylinder (202), and a special-shaped plate (2026) is also fixedly installed above the two movable plates (2023), the two special-shaped plates (2026) are symmetrical to each other; A placement slot (2027) is provided on one side wall opposite to the other of the two rectangular cylinders (202), the two placement slots (2027) are symmetrical to each other, and a second sliding mechanism is provided in the inner cavity of the two placement slots (2027); The rolling unit (300) includes a first mounting plate (302) and a second mounting plate (303), and opposite side walls of the first mounting plate (302) and the second mounting plate (303) are each provided with a special-shaped sliding groove (3021), the two special-shaped sliding grooves (3021) are parallel to each other, and the inner cavities of the two special-shaped sliding grooves (3021) are both slidably installed with sliding blocks (3022), and the bottoms of the first mounting plate (302) and the second mounting plate (303) are fixedly connected to the circular pressure plate (203).

2. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: A mechanical arm (1018) is provided above the inner cavity of the SMT patch placement cavity (1013), and an electronic adsorption disk (1019) is provided at the bottom of the mechanical arm (1018).

3. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: The second sliding mechanism includes two second sliding grooves (3013), the two second sliding grooves (3013) are respectively opened on the two opposite side walls of the inner cavity of the placement slot (2027), the two second sliding grooves (3013) are symmetrical to each other, and the inner cavities of the two second sliding grooves (3013) are both slidably installed with second sliders (3014), and the two second sliders (3014) are symmetrical to each other.

4. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 3, characterized in that: The four second sliders (3014) are fixedly connected to driving plates (3011) on opposite side walls of each pair, the two driving plates (3011) are symmetrical to each other, and the tapered blocks (301) are fixedly mounted on opposite side walls of the two driving plates (3011), and the opposite ends of the two driving plates (3011) are fixedly connected to mounting rods (3012), and the opposite ends of the two mounting rods (3012) are respectively fixedly connected to the sliding block (3022), and a second return spring (3015) is fixedly connected to one side wall of each second slider (3014), and the other end of the second return spring (3015) is respectively fixedly connected to the inner wall of the second slide groove (3013).

5. The lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 1, characterized in that: A third sliding mechanism is provided above the circular pressure plate (203), and the third sliding mechanism includes a first circular slide groove (2031). The first circular slide groove (2031) is opened above the circular pressure plate (203), and two mutually symmetrical guide sliders (2032) are slidably installed in the inner cavity of the first circular slide groove (2031), and the two guide sliders (2032) are respectively fixedly connected with a plug rod (2024) above.

6. A lead-free reflow soldering machine for producing automobile taillight module circuit boards according to claim 5, characterized in that: A second circular chute (2033) is provided on the side wall of the circular pressure plate (203), a movable slider (2034) is slidably mounted in the inner cavity of the second circular chute (2033), an L-shaped fixing rod (2035) is fixedly mounted on the movable slider (2034), and the other end of the L-shaped fixing rod (2035) is movably inserted into the rectangular notch (1031) and is fixedly connected to the second sealed movable heat insulation plate (1032).

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