Water-jet guided laser processing time monitoring method, device and system

Abstract

The invention discloses a water-jet-guided laser processing time monitoring method, device and system, and belongs to the technical field of water-jet-guided laser processing.The water-jet-guided laser processing time monitoring method comprises the steps that the time point when a laser transmitter of a monitored water-jet-guided laser processing system works is obtained, and the time point serves as first starting time; the first punching time of a punching point obtained through detection when the light emitted by the laser emitter punches through the workpiece is obtained, and the first punching time is determined by the laser light detected by an optical power meter located below the workpiece; recording first time interval data between each first punching time and the first starting time; according to the water-jet guided laser machining method, the laser intensity change detected by the optical power meter below the workpiece only needs to be obtained and determined through the laser intensity change, so that the problem that the machining condition cannot be obtained in real time due to the influence of water mist in the water-jet guided laser machining process is solved, the judgment standard of the machining completion time is improved, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of water-conducting laser processing, and specifically relates to a method, device and system for monitoring the time of water-conducting laser processing. Background Art

[0002] Water-guided laser technology is a technology that uses water as a light-conducting medium to transmit laser energy. This technology reduces the heat-affected zone and improves the cutting quality. It is widely used in cutting, welding and surface treatment with its high-precision and high-efficiency process advantages. However, various parameters need to be controlled and the processing time needs to be strictly monitored during the water-guided laser processing to ensure high efficiency and high quality of the processing. Traditional monitoring methods usually include a visual inspection system: using a CCD camera to obtain the nozzle and beam images so that the two can be adjusted to the optimal position; an optical monitoring system: analyzing and monitoring various light signals generated during processing. However, since water-guided lasers generate a large amount of water mist during processing, the water mist will scatter near the laser focus, interfering with the traditional optical monitoring system; the visual inspection system will also be affected, making it difficult to obtain the image of the processed surface, thereby affecting the evaluation of the processing time.

[0003] Although special optical designs are used to reduce the impact of water mist, water mist will still affect the performance of optical sensors and interfere with the CCD camera's acquisition of processed images. In addition, the construction and debugging of the optical monitoring system is complex, and the cost of use and maintenance is high. Summary of the invention

[0004] The object of the present invention is to provide a method, device and system for monitoring water-conducting laser processing time, which are used to avoid interference from water mist during water-conducting laser processing and to realize simple and reliable monitoring of processing time.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A method for monitoring water-conducting laser processing time, comprising:

[0007] Obtaining a time point when a laser transmitter of the monitored water-conducting laser processing system is working, and taking the time point as a first starting time;

[0008] Acquire a first penetration time of a penetration point when the light emitted by the laser transmitter penetrates the workpiece, the first penetration time being determined by the laser light detected by an optical power meter under the workpiece;

[0009] The first time interval data between each first penetration time and the first start time is recorded.

[0010] After recording the time interval data between each penetration time point and the start time, it also includes:

[0011] Acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second punching times corresponding to each punching point;

[0012] Calculating second time interval data between a second penetration time and a second starting time of each preset penetration point;

[0013] By performing similarity matching on the obtained plurality of first time interval data and each second time interval data;

[0014] Output the matching data of each preset penetration point.

[0015] The similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows:

[0016] Extending a fixed time point of each second time interval data into a third time interval data with a first preset value as an extension range, wherein the second time interval data is a fixed time, and the third time interval data is a time period with a certain range;

[0017] The current processing time simulated in the monitored water-conducting laser processing system is continuously obtained, and when the simulated current processing time is in a time period corresponding to the third time interval data, the first time interval data obtained in the time period is matched with the second time interval data corresponding to the third time interval data in the time period.

[0018] After the obtained plurality of first time interval data are similarly matched with each second time interval data, the method further comprises:

[0019] When the last second time interval data does not match the first time interval data, starting from the second start time, after a second preset time has passed, a pause signal is returned to the monitored water-conducting laser processing system.

[0020] Compared with the prior art, in the water-conducting laser processing time monitoring method provided by the present invention, the required information is easy to collect, that is, the time point when the laser transmitter of the monitored water-conducting laser processing system is working and the first penetration time of the penetration point when the light emitted by the laser transmitter penetrates the workpiece are collected. Only a simple optical power meter is needed to obtain the first penetration time of each penetration point when the workpiece is penetrated. The first time interval data between the first penetration time and the first start time of each penetration point can be recorded to know the penetration time of each penetration point, which can be used to judge whether the workpiece is processed smoothly. Because it only needs to obtain whether the laser penetrates the workpiece during water-conducting laser processing, it only needs to obtain the change in the intensity of the laser light detected by the optical power meter under the workpiece, and it is determined by the above-mentioned change in the intensity of the laser light, so it avoids the problem of being unable to obtain the processing status in real time due to the influence of water mist during water-conducting laser processing, improves the judgment standard for the processing completion time, and improves the processing efficiency. The present invention has broad potential in practical applications and provides strong support for the research and development and application of water-conducting laser technology.

[0021] The present invention also provides a water-conducting laser processing time monitoring device, comprising a first acquisition unit, for acquiring a time point when a laser transmitter 1 of a monitored water-conducting laser processing system is working, and taking the time point as a first starting time;

[0022] A second acquisition unit is used to acquire a first penetration time of a penetration point when the light emitted by the laser emitter 1 penetrates the workpiece, wherein the first penetration time is determined by the laser light detected by the optical power meter 71 under the workpiece;

[0023] The recording unit is used to record the first time interval data between each first penetration time and the first start time.

[0024] Compared with the prior art, the beneficial effects of the water-conducting laser processing time monitoring device provided by the present invention are the same as the beneficial effects of the water-conducting laser processing time monitoring method described in the above technical solution, which will not be described in detail here.

[0025] The present invention also provides a water-conducting laser processing time monitoring system, comprising:

[0026] An optical power meter 71, wherein the optical power meter 71 is arranged at the bottom of the monitored workpiece;

[0027] A detection system, wherein the detection system is electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter 71 respectively, and the detection system includes a processor, and the processor is used to run the above-mentioned water-conducting laser processing time monitoring method.

[0028] Compared with the prior art, the beneficial effects of the water-conducting laser processing time monitoring system provided by the present invention are the same as the beneficial effects of the water-conducting laser processing time monitoring method described in the above technical solution, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a flow chart of an embodiment of a method for monitoring water-conducting laser processing time according to the present invention;

[0030] Figure 2 It is a flow chart of another embodiment of the water-conducting laser processing time monitoring method of the present invention;

[0031] Figure 3 It is a block diagram of an embodiment of a water-conducting laser processing time monitoring device of the present invention;

[0032] Figure 4 It is a block diagram of another embodiment of the water-conducting laser processing time monitoring device of the present invention;

[0033] Figure 5 It is a schematic diagram of the overall structure of the water-conducting laser processing time monitoring system of the present invention;

[0034] Figure 6 for Figure 5 A magnified schematic diagram of center A. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] The present invention is further described in detail below in conjunction with specific embodiments, which are intended to explain the present invention rather than to limit it.

[0037] Please refer to Figure 1 , which shows a flow chart of the water-conducting laser processing time monitoring method of the present invention,

[0038] Step S10, obtaining the time point when the laser emitter 1 of the monitored water-conducting laser processing system is working, and taking the time point as the first starting time. The time point when the laser emitter is working is provided by the control system 8 of the water-conducting laser processing system with relevant data, and is based on the time when the control system 8 controls the control signal of the laser emitter 1 to work. If there is a delay when the laser emitter 1 receives the control signal to start, the delay time can be added manually. The first starting time is the time when the control system 8 controls the control signal of the laser emitter 1 to work, or the time when the control system 8 controls the control signal of the laser emitter 1 to work plus the delay time.

[0039] Step S20, obtaining the first penetration time of the penetration point when the light emitted by the laser emitter penetrates the workpiece, the first penetration time is determined by the laser light detected by the optical power meter under the workpiece. The above-mentioned first penetration time is the time from the laser emitter 1 starting to emit the laser to the laser emitted by the laser emitter 1 penetrating the workpiece. When the workpiece is penetrated, the laser passes through the workpiece and irradiates the optical power meter 71 under the workpiece. After the optical power meter 71 receives the laser light, the optical power meter 71 converts the received laser light into an electrical signal and transmits it to the detection system 7. The detection system 7 determines whether the workpiece is penetrated according to the electrical signal sent by the optical power meter 71, and the detection system 7 calculates the time between the time when the laser emitter 1 starts to emit the laser and the time when the optical power meter 71 receives the laser light, that is, the first penetration time. If the workpiece has multiple penetration holes during processing, the penetration time of each penetration hole corresponds to a first penetration time. In one example, a straight line is processed on a blank by a laser from a laser transmitter 1, and the straight line is punched through; the water-guided laser processing system controls a water column containing a total reflection laser to move from the initial point of the straight line on the blank to the terminal point of the straight line; each time the water column travels a unit of distance, the laser will first hit the upper surface of the blank, and at this time, the laser light directly received by the optical power meter 71 located below the blank decreases. Afterwards, the laser optical fiber that hits the upper surface of the blank processes the blank, and after a period of time, the laser punches through the blank, and the laser light directly received by the optical power meter 71 increases. Therefore, during the entire processing process of the blank, there will be many first punch-through times as described in step S20. The more the number of first punch-through times, the more accurate the data obtained during monitoring. In specific implementation, in order to increase the intensity contrast of the laser received by the optical power meter 71 between the punched hole and the non-punched hole during the measurement and ensure the accuracy of the measurement, the water-guided laser processing system can be used to control the water column containing the total reflection laser to move in a point-by-point manner instead of a uniform speed. Specifically, assuming that the above straight line specifically includes three consecutive points A, B, and C, the water column moves from point A to point B at a uniform speed, and then the water column stays at point B for a period of time (the time for the water column to punch through the blank), and then the water column moves from point B to point C at a uniform speed and stays at point C for a period of time. In addition, when monitoring, the movement of the water column can also be uniform throughout the whole process, but during the processing, the optical power meter 71 will still receive the light intensity change information of the intensity change, and the light intensity change information can also be used as monitoring information.

[0040] Step S30, recording the first time interval data between each first punching time and the first start time. By recording the time from the start of each punching hole to the punching time, it is possible to monitor whether each punching hole is punched on time or not. This can be used to monitor whether the processing of the workpiece is smooth.

[0041] In addition, in order to more accurately monitor the processing of the workpiece, in step S30, after recording the time interval data between each penetration time point and the start time, the following steps are further included:

[0042] Step S40, obtaining preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second punching times corresponding to each punching point. When the water-conducting laser processing system processes the workpiece, the preset processing data will be input. The preset processing data is input into the control system 8 of the water-conducting laser processing system. In order to more accurately monitor the processing process of the workpiece, the detection system 7 can obtain the preset data in laser processing in advance.

[0043] Step S50, calculating the second time interval data between the second punching time and the second starting time of each preset punching point. The punching time from the beginning to the end of processing of each punching point, that is, the second time interval data, is calculated by the preset data.

[0044] Step S60, similarly matching the obtained several first time interval data with each second time interval data. During actual processing, there is a certain deviation between the actual punching time of the workpiece (the first time interval data of each punching hole) and the preset punching time (the second time interval data of each punching hole), but the processing time of the two is close and within a certain range, so an approximate match can be performed. After matching the actual punching time of each punching point with the punching time of each preset punching point, the two sets of data can be intuitively compared. If the preset punching point matches the corresponding actual punching time, it can be determined whether the punching point is punched on time, too fast or too slow according to the actual punching time. If the preset punching point does not match the corresponding actual punching time, the punching point is not punched, indicating that the required workpiece and the blank are still adhered to each other. The output power can be increased or the processing time of the punching point can be extended later.

[0045] To ensure the accuracy of monitoring, step S60 specifically includes:

[0046] Step S61, expand the fixed time point of each second time interval data into a third time interval data with a first preset value as the expansion range, wherein the second time interval data is a fixed time, and the third time interval data is a time period with a certain range. Expand the single-point time value of the preset second time interval data into a range value. When performing similarity matching, it can prevent the time error of a certain punching hole obtained when accidentally punching through a punching point that should not be punched during processing. In addition, when performing pre-processing, segmented monitoring can be implemented for the workpiece in the first experimental processing. Reduce the number of pre-processing times for experimentally processed workpieces.

[0047] Step S62, continuously obtain the current processing time simulated in the monitored water-conducting laser processing system, and when the simulated current processing time is in the time period corresponding to the third time interval data, match the first time interval data obtained in the time period with the second time interval data corresponding to the third time interval data in the time period. During the matching, the messy data monitored by the optical power meter 71 outside the preset time period is isolated, so as to effectively improve the matching accuracy.

[0048] In addition, considering that waste may be generated during processing, after step S62, step 63 may be added. When the last second time interval data does not match the first time interval data, starting from the second start time, after the second preset time, a pause signal is returned to the monitored water-conducting laser processing system. During processing, if the last punching hole is not punched, the part that needs to be knocked out is not knocked out, and the processing is not completed. At this time, after the maximum processing time is reached, a pause signal is returned to process another product.

[0049] Step S70, outputting the matching data of each preset penetration point.

[0050] In a specific embodiment, if Figure 5 As shown: the water-guided laser processing system includes a laser transmitter 1 for emitting laser, an optical system 2 for converging the laser emitted by the laser transmitter 1, a lens 3 for reflecting the laser converged by the optical system 2, and a coupling system 4 for synthesizing the converged laser reflected by the lens 3 with the water flow into a laser water jet and then emitting it to the processing part of the workpiece 5 to be processed. The workpiece 5 to be processed is fixedly placed on a workbench 6, and a detection system 7 is arranged below the workbench 6. The detection system 7 is connected to a control system 8. The computer in the control system 8 is connected to the laser transmitter 1, the optical system 2, and the coupling system 4. The computer in the control system 8 controls the laser transmitter 1, the optical system 2, and the coupling system 4 in real time according to the signal analysis and processing results, thereby adjusting the height, speed, power and other parameters of the laser water jet irradiated to the processing part of the workpiece 5 to be processed, thereby realizing the closed-loop monitoring processing of the laser water jet.

[0051] The detection targets of the detection system 7 required in the water-conducting laser processing time monitoring method of the present invention are the laser water jet emitted when the workpiece to be processed penetrates and the laser water jet emitted when the workpiece to be processed falls. When the workpiece to be processed falls, since the laser water jet does not hit the surface of the blank, the full power of the laser water jet is received by the optical power meter 71. The power measured by the optical power meter 71 is displayed as the maximum value of the laser water jet. This can be used to comprehensively judge whether the workpiece has fallen based on the water-conducting laser processing system. The control system 8 is used to receive the optical power and time monitored in real time by the detection system 7, and analyze, process and feedback, avoiding the problem of being unable to obtain the processing status in real time due to the influence of water mist during the water-conducting laser processing process, improving the judgment standard for the processing completion time, and improving the processing efficiency.

[0052] like Figure 6 As shown, the optical power value detected by the optical power meter 71 received by the detection system 7 when the part of the workpiece to be processed is not penetrated is 0. The optical power detected by the optical power meter 71 received at the first time when the part of the workpiece to be processed is penetrated is greater than 0, and the computer records a processing penetration time. At the beginning of processing, the optical power value detected by the optical power meter 71 is 0. In the middle section of processing, the optical power detected by the optical power meter when the part of the workpiece to be processed is non-continuously penetrated shows a trend of increasing, decreasing, and increasing. At the end of processing, when the part of the workpiece to be processed falls, the optical power detected by the optical power meter remains continuously greater than 0, and the computer records a processing drop time, indicating that the processing of the workpiece to be processed is completed. Accurate water-conducting laser processing time monitoring is achieved, which is helpful for real-time judgment of the processing completion status.

[0053] The specific process of a specific embodiment is disclosed here:

[0054] Step 1: The laser transmitter 1 emits a light beam which is shaped into parallel light by the optical system 2. After passing through the reflector 3, the light beam enters the coupling system 4, where the focusing lens focuses the light beam into a non-diffraction light beam with a smaller diameter than the coupling cavity nozzle, a longer collimation range, and a smaller central spot, and then propagates through total reflection in the water column;

[0055] Step 2: Then, the control system 8 controls the laser emitter 1 to make the coupling system 4 emit an elongated laser water jet with a known power, and the laser water jet and the workpiece to be processed move relative to each other and process simultaneously;

[0056] Step 3: When the part of the workpiece to be processed is not penetrated, the optical power value received by the power meter in the detection system 7 is 0;

[0057] Step 4: When the part to be processed is penetrated for the first time, the optical power value measured by the power meter in the detection system 7 is greater than 0, and the computer in the control system 8 records a processing penetration time;

[0058] Step 5: When the part of the workpiece to be processed is penetrated discontinuously, the optical power value measured by the power meter in the detection system 7 shows a trend of increasing, decreasing, and then increasing;

[0059] Step 6: When the part of the workpiece to be processed falls, the optical power value measured by the power meter in the detection system 7 remains greater than 0, and the computer in the control system 8 records a processing fall time, and the processing of the workpiece to be processed is completed;

[0060] Step 7: Steps 3 to 6 are one processing. After recording the penetration time and knock-off time, the system automatically enters the next processing. The computer in the control system 8 controls the movement of the worktable 6, adjusts the position of the workpiece 5 to be processed according to the preset processing spacing, and performs the next processing. The computer retains the last recorded processing time, and then resets and records the next processing time;

[0061] Step 8: If there is a situation in which penetration or knockout cannot be achieved during a certain processing, the control system 8 will suspend the current processing according to the preset maximum single processing time and automatically proceed to the next processing (that is, when the preset maximum processing time is reached, regardless of whether the current processing is penetrated or knocked through, the system automatically enters the next processing);

[0062] Step 9: After all the workpieces 5 are processed, the processing time data can be exported from the computer in the control system 8, including each penetration time, knockout time, and a certain processing without penetration or knockout. The present invention greatly improves the accuracy of the processing time, avoids the problem of difficulty in judging the processing situation by human vision, and greatly saves manpower.

[0063] In summary, in the water-conducting laser processing time monitoring method provided by the present invention, the required information is easy to collect, that is, the time point when the laser transmitter of the monitored water-conducting laser processing system is working and the first penetration time of the penetration point when the light emitted by the laser transmitter penetrates the workpiece are collected. Only a simple optical power meter is needed to obtain the first penetration time of each penetration point when the workpiece is penetrated. The first time interval data between the first penetration time and the first start time of each penetration point can be recorded to know the penetration time of each penetration point, which can be used to judge whether the workpiece is processed smoothly. Because it only needs to obtain whether the laser penetrates the workpiece during water-conducting laser processing, it only needs to obtain the change in the intensity of the laser light detected by the optical power meter under the workpiece, and it is determined by the above-mentioned change in the intensity of the laser light, so it avoids the problem of being unable to obtain the processing status in real time due to the influence of water mist during water-conducting laser processing, improves the judgment standard for the processing completion time, and improves the processing efficiency. The present invention has broad potential in practical applications and provides strong support for the research and development and application of water-conducting laser technology.

[0064] Please refer to Figure 3 and Figure 4 , which shows a block diagram of a water-conducting laser processing time monitoring device of the present invention, the water-conducting laser processing time monitoring device comprises:

[0065] A first acquisition unit is used to acquire a time point when the laser emitter 1 of the monitored water-conducting laser processing system is working, and take the time point as a first starting time;

[0066] A second acquisition unit is used to acquire a first penetration time of a penetration point when the light emitted by the laser emitter 1 penetrates the workpiece, wherein the first penetration time is determined by the laser light detected by the optical power meter 71 under the workpiece;

[0067] The recording unit is used to record the first time interval data between each first penetration time and the first start time.

[0068] The water-conducting laser processing time monitoring device also includes:

[0069] A third acquisition unit is used to acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second punching times corresponding to each punching point;

[0070] A calculation unit, used for calculating second time interval data between a second penetration time and a second start time of each preset penetration point;

[0071] A matching unit, configured to perform similarity matching between the obtained plurality of first time interval data and each second time interval data;

[0072] The output unit is used to output the matching data of each preset penetration point.

[0073] The method for performing similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows:

[0074] Extending a fixed time point of each second time interval data into a third time interval data with a first preset value as an extension range, wherein the second time interval data is a fixed time, and the third time interval data is a time period with a certain range;

[0075] The current processing time simulated in the monitored water-conducting laser processing system is continuously obtained, and when the simulated current processing time is in a time period corresponding to the third time interval data, the first time interval data obtained in the time period is matched with the second time interval data corresponding to the third time interval data in the time period.

[0076] The water-conducting laser processing time monitoring device also includes:

[0077] The pause unit is used to return a pause signal to the monitored water-conducting laser processing system after a second preset time has passed, starting from the second start time, when the last second time interval data does not match the first time interval data.

[0078] Compared with the prior art, the beneficial effects of the water-conducting laser processing time monitoring device provided by the present invention are the same as the beneficial effects of the water-conducting laser processing time monitoring method described in the above technical solution, which will not be described in detail here.

[0079] Please refer to Figure 5 and Figure 6 , which shows a schematic diagram of a water-conducting laser processing time monitoring system of the present invention, the water-conducting laser processing time monitoring system comprises:

[0080] An optical power meter 71, wherein the optical power meter 71 is arranged at the bottom of the monitored workpiece;

[0081] A detection system, wherein the detection system is electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter 71 respectively, and the detection system includes a processor, and the processor is used to run the above-mentioned water-conducting laser processing time monitoring method.

[0082] Compared with the prior art, the beneficial effects of the water-conducting laser processing time monitoring system provided by the present invention are the same as the beneficial effects of the water-conducting laser processing time monitoring method described in the above technical solution, which will not be described in detail here.

[0083] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0084] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for monitoring water-conducting laser processing time, characterized in that: include: Obtaining a time point when a laser transmitter of the monitored water-conducting laser processing system is working, and taking the time point as a first starting time; Acquire a first penetration time of a penetration point when the light emitted by the laser transmitter penetrates the workpiece, the first penetration time being determined by the laser light detected by an optical power meter under the workpiece; The first time interval data between each first penetration time and the first start time is recorded.

2. The water-conducting laser processing time monitoring method according to claim 1, characterized in that: After recording the time interval data between each penetration time point and the start time, it also includes: Acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second punching times corresponding to each punching point; Calculating second time interval data between a second penetration time and a second starting time of each preset penetration point; By performing similarity matching on the obtained plurality of first time interval data and each second time interval data; Output the matching data of each preset penetration point.

3. The water-conducting laser processing time monitoring method according to claim 2, characterized in that: The similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows: Extending a fixed time point of each second time interval data into a third time interval data with a first preset value as an extension range, wherein the second time interval data is a fixed time, and the third time interval data is a time period with a certain range; The current processing time simulated in the monitored water-conducting laser processing system is continuously obtained, and when the simulated current processing time is in a time period corresponding to the third time interval data, the first time interval data obtained in the time period is matched with the second time interval data corresponding to the third time interval data in the time period.

4. The water-conducting laser processing time monitoring method according to claim 2, characterized in that: After the obtained plurality of first time interval data are similarly matched with each second time interval data, the method further comprises: When the last second time interval data does not match the first time interval data, starting from the second start time, after a second preset time has passed, a pause signal is returned to the monitored water-conducting laser processing system.

5. A water-conducting laser processing time monitoring device, characterized in that: include: A first acquisition unit, used to acquire a time point when a laser transmitter of the monitored water-conducting laser processing system is working, and take the time point as a first starting time; A second acquisition unit is used to acquire a first penetration time of a penetration point when the light emitted by the laser emitter penetrates the workpiece, wherein the first penetration time is determined by the laser light detected by an optical power meter under the workpiece; The recording unit is used to record the first time interval data between each first penetration time and the first start time.

6. The water-conducting laser processing time monitoring device according to claim 5, characterized in that: The water-conducting laser processing time monitoring device also includes: A third acquisition unit is used to acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second punching times corresponding to each punching point; A calculation unit, used for calculating second time interval data between a second penetration time and a second start time of each preset penetration point; A matching unit, configured to perform similarity matching between the obtained plurality of first time interval data and each second time interval data; The output unit is used to output the matching data of each preset penetration point.

7. The water-conducting laser processing time monitoring device according to claim 6, characterized in that: The method for performing similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows: Extending a fixed time point of each second time interval data into a third time interval data with a first preset value as an extension range, wherein the second time interval data is a fixed time, and the third time interval data is a time period with a certain range; The current processing time simulated in the monitored water-conducting laser processing system is continuously obtained, and when the simulated current processing time is in a time period corresponding to the third time interval data, the first time interval data obtained in the time period is matched with the second time interval data corresponding to the third time interval data in the time period.

8. The water-conducting laser processing time monitoring device according to claim 6, characterized in that: The water-conducting laser processing time monitoring device also includes: The pause unit is used to return a pause signal to the monitored water-conducting laser processing system after a second preset time has passed, starting from the second start time, when the last second time interval data does not match the first time interval data.

9. A water-guided laser processing time monitoring system, characterized in that: include: An optical power meter, the optical power meter is arranged at the bottom of the monitored workpiece; A detection system, wherein the detection system is electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter, respectively, and the detection system comprises a processor, and the processor is used to run the water-conducting laser processing time monitoring method according to any one of claims 1 to 4.

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