Water-guided laser processing time monitoring method, device and system

Abstract

The present invention discloses a method, device, and system for monitoring water-conducting laser processing time, belonging to the technical field of water-conducting laser processing. The method comprises: obtaining a time point when a laser emitter of a monitored water-conducting laser processing system is operating, and using the time point as a first starting time; obtaining a first penetration time at a point when light emitted by the laser emitter penetrates a workpiece, the first penetration time being determined by detecting laser light using an optical power meter located below the workpiece; and recording first time interval data between each first penetration time and the first starting time. This method, which only requires changes in laser light intensity detected by an optical power meter located below the workpiece, is used to determine the time interval. This method avoids the problem of being unable to obtain real-time processing status due to the influence of water mist during water-conducting laser processing, improves the criteria for determining processing completion time, and enhances processing efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of water-guided laser processing technology, and specifically relates to a method, device and system for monitoring water-guided laser processing time. Background Art

[0002] Water-guided laser technology uses water as a light-conducting medium to transmit laser energy. This technology reduces the heat-affected zone and improves cutting quality. Its high precision and efficiency make it widely used in cutting, welding, and surface treatment. However, water-guided laser processing requires the control of various parameters and strict monitoring of processing time to ensure high efficiency and quality. Traditional monitoring methods typically include a visual inspection system that uses a CCD camera to capture images of the nozzle and beam for optimal alignment, and an optical monitoring system that analyzes and monitors the various optical signals generated during processing. However, water-guided laser processing generates a large amount of water mist, which scatters near the laser focus, interfering with traditional optical monitoring systems. This can also affect visual inspection systems, making it difficult to obtain images of the processed surface, which in turn affects processing time estimation.

[0003] Although special optical designs are used to reduce the impact of water mist, water mist will still affect the performance of optical sensors and interfere with the CCD camera's acquisition of processing images. In addition, the construction and debugging of the optical monitoring system are complex, and the cost of use and maintenance is high. Summary of the Invention

[0004] The object of the present invention is to provide a method, device and system for monitoring water-guided laser processing time, which are used to avoid interference from water mist during water-guided laser processing and to achieve simple and reliable monitoring of processing time.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A method for monitoring water-guided laser processing time, comprising:

[0007] Obtaining a time point when a laser emitter of the monitored water-guided laser processing system is operating, and taking the time point as a first starting time;

[0008] Obtaining a first penetration time of a penetration point when light emitted by the laser emitter penetrates the workpiece, the first penetration time being determined by the laser light detected by an optical power meter located below the workpiece;

[0009] Record first time interval data between each first penetration time and the first start time.

[0010] After recording the time interval data between each penetration time point and the start time, the method further includes:

[0011] Acquiring preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second penetration times corresponding to each penetration point;

[0012] Calculating second time interval data between a second penetration time and a second starting time of each preset penetration point;

[0013] Perform similarity matching on the obtained plurality of first time interval data and each second time interval data;

[0014] Output the matching data of each preset penetration point.

[0015] The similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically performed as follows:

[0016] Extending the fixed time point of each second time interval data into a third time interval data with a first preset value as the extension range, wherein the second time interval data is a fixed time and the third time interval data is a time period with a certain range;

[0017] A current processing time simulated in the monitored water-guided laser processing system is continuously obtained, and when the simulated current processing time is within a time period corresponding to the third time interval data, first time interval data obtained in the time period is matched with second time interval data corresponding to the third time interval data within the time period.

[0018] After the obtained plurality of first time interval data are similarly matched with each second time interval data, the method further includes:

[0019] When the last second time interval data does not match the first time interval data, starting from the second start time and after a second preset time has passed, a pause signal is returned to the monitored water-guided laser processing system.

[0020] Compared to existing technologies, the water-guided laser processing time monitoring method provided by the present invention facilitates the acquisition of the required information. Specifically, it collects the time points at which the laser emitter of the monitored water-guided laser processing system is operating, as well as the first penetration time of the point at which the light emitted by the laser emitter penetrates the workpiece. A simple optical power meter is required to obtain the first penetration time of each penetration point. By recording the first time interval between each penetration point's first penetration time and the first start time, the penetration time of each penetration point can be determined, which can be used to determine whether the workpiece processing was successful. Because the method only requires determining whether the laser penetrated the workpiece during water-guided laser processing, and only requires the change in laser light intensity detected by the optical power meter below the workpiece, and determining the time based on this change in laser light intensity, it avoids the problem of being unable to obtain real-time processing status due to the influence of water mist during water-guided laser processing, improves the criteria for determining processing completion time, and enhances processing efficiency. The present invention has broad potential in practical applications and provides strong support for the research and development and application of water-guided laser technology.

[0021] The present invention further provides a water-conducting laser processing time monitoring device, comprising a first acquisition unit for acquiring a time point when a laser emitter 1 of a monitored water-conducting laser processing system is operating, and taking the time point as a first starting time;

[0022] A second acquisition unit is used to acquire a first penetration time of a penetration point when the light emitted by the laser emitter 1 penetrates the workpiece, the first penetration time being determined by the laser light detected by the optical power meter 71 below the workpiece;

[0023] The recording unit is used to record the first time interval data between each first penetration time and the first start time.

[0024] Compared with the prior art, the beneficial effects of the water-guided laser processing time monitoring device provided by the present invention are the same as the beneficial effects of the water-guided laser processing time monitoring method described in the above technical solution, and are not described in detail here.

[0025] The present invention also provides a water-guided laser processing time monitoring system, comprising:

[0026] An optical power meter 71, which is arranged at the bottom of the monitored workpiece;

[0027] The detection system is electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter 71 respectively. The detection system includes a processor, and the processor is used to run the above-mentioned water-conducting laser processing time monitoring method.

[0028] Compared with the prior art, the beneficial effects of the water-guided laser processing time monitoring system provided by the present invention are the same as the beneficial effects of the water-guided laser processing time monitoring method described in the above technical solution, and are not described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a flow chart of an embodiment of a method for monitoring water-guided laser processing time according to the present invention;

[0030] Figure 2 This is a flow chart of another embodiment of the water-guided laser processing time monitoring method of the present invention;

[0031] Figure 3 This is a block diagram of an embodiment of a water-guided laser processing time monitoring device of the present invention;

[0032] Figure 4 FIG1 is a block diagram of another embodiment of the water-guided laser processing time monitoring device of the present invention;

[0033] Figure 5 Schematic diagram of the overall structure of the water-guided laser processing time monitoring system of the present invention;

[0034] Figure 6 for Figure 5 Enlarged schematic diagram of point A in the middle. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] The present invention will be further described in detail below with reference to specific embodiments, which are intended to explain the present invention rather than to limit it.

[0037] Please refer to Figure 1 , which shows a flow chart of the water-guided laser processing time monitoring method of the present invention,

[0038] Step S10: Obtain the time point at which the laser emitter 1 of the monitored water-based laser processing system is operating, and use this time point as the first starting time. The acquired laser emitter operating time point is provided by the control system 8 of the water-based laser processing system. The time point at which the control system 8 issues a control signal to control the operation of the laser emitter 1 is used as the reference. If there is a delay in the laser emitter 1 receiving the control signal and activating, a delay time can be added manually. The first starting time is the time point at which the control system 8 issues the control signal to control the operation of the laser emitter 1, or the time point at which the control system 8 issues the control signal to control the operation of the laser emitter 1 plus the delay time.

[0039] Step S20, obtain the first penetration time of the penetration point when the light emitted by the laser emitter penetrates the workpiece, which is obtained by detection. The first penetration time is determined by the laser light detected by the optical power meter below the workpiece. The above-mentioned first penetration time is the time from the laser emitter 1 starting to emit the laser to the laser emitted by the laser emitter 1 penetrating the workpiece. When the workpiece is penetrated, the laser passes through the workpiece and irradiates the optical power meter 71 below the workpiece. After the optical power meter 71 receives the laser light, the optical power meter 71 converts the received laser light into an electrical signal and transmits it to the detection system 7. The detection system 7 determines whether the workpiece is penetrated based on the electrical signal sent by the optical power meter 71, and the detection system 7 calculates the time between the time when the laser emitter 1 starts to emit the laser and the time when the optical power meter 71 receives the laser light, that is, the first penetration time. If the workpiece has multiple penetration holes during processing, the penetration time of each penetration hole corresponds to a first penetration time. In one example, laser emitter 1 is used to machine a straight line on a workpiece and penetrate it. The water-guided laser processing system controls a water column containing fully reflected laser light to move from the starting point of the line on the workpiece to the end point of the line. Each time the water column travels a unit of distance, the laser light first strikes the upper surface of the workpiece, at which point the laser light directly received by the optical power meter 71 below the workpiece decreases. Subsequently, the laser fiber, which strikes the upper surface of the workpiece, processes the workpiece. After a period of time, the laser light penetrates the workpiece, and the laser light directly received by the optical power meter 71 increases. Therefore, during the entire machining process, the workpiece will experience numerous first penetration times, as described in step S20. The greater the number of first penetration times, the more accurate the data obtained during monitoring. In practice, in order to increase the intensity contrast of the laser light received by the optical power meter 71 between the punched holes and the non-punched holes during measurement and ensure measurement accuracy, the water-guided laser processing system can be used to control the movement of the water column containing the fully reflected laser light, not by uniform movement, but by point-by-point advance. Specifically, assuming that the above-mentioned straight line specifically includes three consecutive points A, B, and C, the water column moves from point A to point B at a uniform speed, then stays at point B for a period of time (sufficient for the water column to punch through the blank), and then moves from point B to point C at a uniform speed and stays at point C for a period of time. In addition, during monitoring, the water column can also move at a uniform speed throughout the entire process, but during the processing, the optical power meter 71 will still receive information on light intensity changes, which can also be used as monitoring information.

[0040] Step S30 records the first time interval between each first punching time and the first start time. By recording the time from the start of each punching hole to the punching time, it is possible to monitor whether each punching hole is punched on time or not. This can be used to monitor whether the workpiece processing is smooth.

[0041] In addition, in order to more accurately monitor the processing of the workpiece, in step S30, after recording the time interval data between each penetration time point and the start time, the following steps are further performed:

[0042] Step S40 obtains preset data for the laser processing. The preset data includes a preset second start time and a number of preset second penetration times corresponding to each penetration point. The water-guided laser processing system inputs the preset processing data when processing a workpiece. This preset processing data is input into the control system 8 of the water-guided laser processing system. To more accurately monitor the workpiece processing process, the detection system 7 can obtain the preset data for the laser processing in advance.

[0043] Step S50: Calculate the second time interval data between the second punching time and the second starting time of each preset punching point. Calculate the punching time from the start to the end of processing of each punching point, i.e., the second time interval data, based on the preset data.

[0044] Step S60, similar matching is performed by obtaining several first time interval data and each second time interval data. During actual processing, there is a certain deviation between the actual punching time of the workpiece (the first time interval data of each punching hole) and the preset punching time (the second time interval data of each punching hole), but the processing time of the two is close and within a certain range, so an approximate match can be performed. After matching the actual punching time of each punching point with the punching time of each preset punching point, the two sets of data can be intuitively compared. If the preset punching point matches the corresponding actual punching time, it can be determined based on the actual punching time whether the punching point is punched on time, too fast or too slow. If the preset punching point does not match the corresponding actual punching time, the punching point is not punched, indicating that there is still an adhesion part between the required workpiece and the blank, and the output power can be increased or the processing time of the punching point can be extended subsequently.

[0045] To ensure the accuracy of monitoring, step S60 specifically includes:

[0046] Step S61: Expand each fixed time point of the second time interval data into a third time interval data with a first preset value as the expansion range, wherein the second time interval data is a fixed time, and the third time interval data is a time period within a certain range. Expanding the preset single-point time value of the second time interval data into a range value. When performing similarity matching, this can prevent the time error of a certain punched hole caused by accidentally punching through a point that should not be punched during processing. Furthermore, during pre-processing, segmented monitoring can be implemented for the workpiece undergoing the first experimental processing, reducing the number of pre-processing times for experimental workpieces.

[0047] In step S62, the simulated current processing time of the monitored water-guided laser processing system is continuously acquired. When the simulated current processing time falls within a time period corresponding to the third time interval data, the first time interval data acquired within that time period is matched with the second time interval data corresponding to the third time interval data within that time period. During the matching process, random data monitored by the optical power meter 71 outside of the preset time period is excluded, thereby effectively improving the matching accuracy.

[0048] Furthermore, to account for the potential for waste during processing, step 63 can be added after step S62. If the last second time interval data does not match the first time interval data, a pause signal is returned to the monitored water-guided laser processing system after a second preset time period, starting from the second start time. If the last perforation hole is not punched during processing, the part that needs to be removed is not removed, and processing is incomplete. In this case, after the maximum processing time is reached, a pause signal is returned, and processing of another product can proceed.

[0049] Step S70: output the matching data of each preset penetration point.

[0050] In a specific embodiment, if Figure 5 As shown: The water-guided laser processing system includes a laser emitter 1 for emitting laser light, an optical system 2 for converging the laser light emitted by the laser emitter 1, a lens 3 for reflecting the laser light converged by the optical system 2, and a coupling system 4 for combining the converged laser light reflected by the lens 3 with a water flow to form a laser water jet, which is then emitted to the processing portion of the workpiece 5 to be processed. The workpiece 5 to be processed is fixedly placed on a workbench 6, and a detection system 7 is provided below the workbench 6. The detection system 7 is connected to a control system 8. The computer in the control system 8 is connected to the laser emitter 1, the optical system 2, and the coupling system 4. The computer in the control system 8 controls the laser emitter 1, the optical system 2, and the coupling system 4 in real time based on signal analysis and processing results, thereby adjusting parameters such as the height, speed, and power of the laser water jet irradiated on the processing portion of the workpiece 5 to be processed, thereby realizing closed-loop monitoring of the laser water jet processing.

[0051] The detection system 7 required in the water-guided laser processing time monitoring method of the present invention monitors the laser water jet emitted when the workpiece penetrates and when the workpiece falls. When the workpiece falls, the laser water jet does not strike the surface of the workpiece, so the full power of the laser water jet is received by the optical power meter 71. The power measured by the optical power meter 71 is displayed as the maximum value of the laser water jet. This power, combined with the water-guided laser processing system, can be used to determine whether the workpiece has fallen. The control system 8 receives the optical power and time monitored in real time by the detection system 7 and performs analysis, processing, and feedback. This avoids the problem of being unable to obtain real-time processing status due to the influence of water mist during water-guided laser processing, improves the judgment standard for processing completion time, and enhances processing efficiency.

[0052] like Figure 6 As shown, the optical power value detected by the optical power meter 71 received by the detection system 7 when the part of the workpiece to be processed is not penetrated is 0. The optical power detected by the optical power meter 71 received at the first time when the part of the workpiece to be processed is greater than 0, and the computer records a processing penetration time at this time. At the beginning of processing, the optical power value detected by the optical power meter 71 is 0. In the middle section of processing, the optical power detected by the optical power meter received when the part of the workpiece to be processed is discontinuously penetrated shows a trend of increasing, decreasing, and then increasing. In the final section of processing, the optical power detected by the optical power meter received when the part of the workpiece to be processed falls remains continuously greater than 0, and the computer records a processing drop time, and at the same time indicates that the processing of the workpiece to be processed is completed. Accurate water-guided laser processing time monitoring is achieved, which helps to judge the completion of processing in real time.

[0053] The specific process of a specific embodiment is disclosed here:

[0054] Step 1: The laser emitter 1 emits a light beam which is shaped into parallel light by the optical system 2. After passing through the reflector 3, the light beam enters the coupling system 4, where the focusing lens focuses the light beam into a non-diffraction light beam with a smaller diameter than the coupling cavity nozzle, a longer collimation range, and a smaller central spot. The light beam is then propagated by total internal reflection in the water column.

[0055] Step 2: Then, the control system 8 controls the laser emitter 1 to make the coupling system 4 emit a slender laser water jet of known power, and the laser water jet and the workpiece to be processed move relative to each other and process simultaneously;

[0056] Step 3: When the workpiece to be processed is not penetrated, the optical power value received by the power meter in the detection system 7 is 0;

[0057] Step 4: When the part to be processed is penetrated for the first time, the optical power value measured by the power meter in the detection system 7 is greater than 0, and the computer in the control system 8 records a processing penetration time;

[0058] Step 5: When the workpiece to be processed is not penetrated continuously, the optical power value measured by the power meter in the detection system 7 shows a trend of increasing, decreasing, and then increasing;

[0059] Step 6: When the workpiece to be processed falls, the optical power value measured by the power meter in the detection system 7 remains continuously greater than 0. At this time, the computer in the control system 8 records a processing drop time, and the workpiece to be processed is completed at the same time;

[0060] Step 7: Steps 3 to 6 constitute one processing. After recording the penetration time and knockout time, the system automatically enters the next processing. The computer in the control system 8 controls the movement of the worktable 6 and adjusts the position of the workpiece 5 to be processed according to the preset processing spacing. The computer retains the processing time recorded last time, then resets and records the processing time for the next time.

[0061] Step 8: If a certain process fails to penetrate or break through, the control system 8 will suspend the current process according to the preset maximum processing time of a single process and automatically proceed to the next process (that is, when the preset maximum processing time is reached, regardless of whether the current process penetrates or breaks through, the system automatically enters the next process);

[0062] Step 9: After all workpieces 5 are processed, processing time data can be exported from the computer in the control system 8, including each penetration time, knockout time, and any processing times that did not penetrate or knock out. This invention greatly improves the accuracy of processing time, avoids the difficulty of human visual judgment of processing status, and significantly saves manpower.

[0063] In summary, the water-guided laser processing time monitoring method provided by the present invention facilitates the acquisition of the required information, namely, the time points at which the laser emitter of the monitored water-guided laser processing system is operating and the first penetration time of the light emitted by the laser emitter when it penetrates the workpiece. A simple optical power meter is required to obtain the first penetration time of each penetration point. By recording the first time interval between the first penetration time and the first start time of each penetration point, the penetration time of each penetration point can be determined, which can be used to determine whether the workpiece processing was successful. Because it only requires determining whether the laser penetrated the workpiece during water-guided laser processing by measuring the laser light intensity change detected by the optical power meter below the workpiece, and determining the time based on this laser light intensity change, the problem of being unable to obtain real-time processing status due to the influence of water mist during water-guided laser processing is avoided, the criteria for determining the processing completion time are improved, and processing efficiency is enhanced. The present invention has broad potential in practical applications and provides strong support for the research and development and application of water-guided laser technology.

[0064] Please refer to Figure 3 and Figure 4 , which shows a block diagram of a water-guided laser processing time monitoring device of the present invention, the water-guided laser processing time monitoring device comprises:

[0065] A first acquisition unit is used to acquire a time point when the laser emitter 1 of the monitored water-guided laser processing system is working, and use the time point as a first starting time;

[0066] A second acquisition unit is used to acquire a first penetration time of a penetration point when the light emitted by the laser emitter 1 penetrates the workpiece, the first penetration time being determined by the laser light detected by the optical power meter 71 below the workpiece;

[0067] The recording unit is used to record the first time interval data between each first penetration time and the first start time.

[0068] The water-guided laser processing time monitoring device also includes:

[0069] A third acquisition unit is used to acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second penetration times corresponding to each penetration point;

[0070] A calculation unit, configured to calculate second time interval data between a second penetration time and a second starting time of each preset penetration point;

[0071] a matching unit, configured to perform similarity matching between the obtained plurality of first time interval data and each second time interval data;

[0072] The output unit is used to output the matching data of each preset penetration point.

[0073] The method for performing similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows:

[0074] Extending the fixed time point of each second time interval data into a third time interval data with a first preset value as the extension range, wherein the second time interval data is a fixed time and the third time interval data is a time period with a certain range;

[0075] A current processing time simulated in the monitored water-guided laser processing system is continuously obtained, and when the simulated current processing time is within a time period corresponding to the third time interval data, first time interval data obtained in the time period is matched with second time interval data corresponding to the third time interval data within the time period.

[0076] The water-guided laser processing time monitoring device also includes:

[0077] The pause unit is used to return a pause signal to the monitored water-guided laser processing system after a second preset time period has passed, starting from the second start time, when the last second time interval data does not match the first time interval data.

[0078] Compared with the prior art, the beneficial effects of the water-guided laser processing time monitoring device provided by the present invention are the same as the beneficial effects of the water-guided laser processing time monitoring method described in the above technical solution, and are not described in detail here.

[0079] Please refer to Figure 5 and Figure 6 , which shows a schematic diagram of a water-guided laser processing time monitoring system of the present invention, the water-guided laser processing time monitoring system comprises:

[0080] An optical power meter 71, which is arranged at the bottom of the monitored workpiece;

[0081] The detection system is electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter 71 respectively. The detection system includes a processor, and the processor is used to run the above-mentioned water-conducting laser processing time monitoring method.

[0082] Compared with the prior art, the beneficial effects of the water-guided laser processing time monitoring system provided by the present invention are the same as the beneficial effects of the water-guided laser processing time monitoring method described in the above technical solution, and are not described in detail here.

[0083] The terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0084] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for monitoring water-guided laser processing time, characterized in that: include: Obtaining a time point when a laser emitter of the monitored water-guided laser processing system is operating, and taking the time point as a first starting time; Obtaining a first penetration time of a penetration point when light emitted by the laser emitter penetrates the workpiece, the first penetration time being determined by the laser light detected by an optical power meter located below the workpiece; Recording first time interval data between each first penetration time and the first start time; After recording the time interval data between each penetration time point and the start time, the method further includes: Acquiring preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second penetration times corresponding to each penetration point; Calculating second time interval data between a second penetration time and a second starting time of each preset penetration point; Perform similarity matching on the obtained plurality of first time interval data and each second time interval data; Output the matching data of each preset penetration point.

2. The water-guided laser processing time monitoring method according to claim 1, characterized in that: The similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically performed as follows: Extending the fixed time point of each second time interval data into a third time interval data with a first preset value as the extension range, wherein the second time interval data is a fixed time and the third time interval data is a time period with a certain range; A current processing time simulated in the monitored water-guided laser processing system is continuously obtained, and when the simulated current processing time is within a time period corresponding to the third time interval data, first time interval data obtained in the time period is matched with second time interval data corresponding to the third time interval data within the time period.

3. The water-guided laser processing time monitoring method according to claim 1, characterized in that: After the obtained plurality of first time interval data are similarly matched with each second time interval data, the method further includes: When the last second time interval data does not match the first time interval data, starting from the second start time and after a second preset time has passed, a pause signal is returned to the monitored water-guided laser processing system.

4. A water-guided laser processing time monitoring device, characterized in that: include: A first acquisition unit is used to acquire a time point when a laser emitter of the monitored water-guided laser processing system is working, and use the time point as a first starting time; a second acquisition unit, configured to acquire a first penetration time of a penetration point when the light emitted by the laser emitter penetrates the workpiece, the first penetration time being determined by the laser light detected by an optical power meter located below the workpiece; a recording unit, configured to record first time interval data between each first penetration time and the first start time; A third acquisition unit is used to acquire preset data in laser processing, wherein the preset data includes a preset second starting time and a plurality of preset second penetration times corresponding to each penetration point; A calculation unit, configured to calculate second time interval data between a second penetration time and a second starting time of each preset penetration point; a matching unit, configured to perform similarity matching between the obtained plurality of first time interval data and each second time interval data; The output unit is used to output the matching data of each preset penetration point.

5. The water-guided laser processing time monitoring device according to claim 4, characterized in that: The method for performing similarity matching between the obtained plurality of first time interval data and each second time interval data is specifically as follows: Extending the fixed time point of each second time interval data into a third time interval data with a first preset value as the extension range, wherein the second time interval data is a fixed time and the third time interval data is a time period with a certain range; A current processing time simulated in the monitored water-guided laser processing system is continuously obtained, and when the simulated current processing time is within a time period corresponding to the third time interval data, first time interval data obtained in the time period is matched with second time interval data corresponding to the third time interval data within the time period.

6. The water-guided laser processing time monitoring device according to claim 5, characterized in that: The water-guided laser processing time monitoring device also includes: The pause unit is used to return a pause signal to the monitored water-guided laser processing system after a second preset time period has passed, starting from the second start time, when the last second time interval data does not match the first time interval data.

7. A water-guided laser processing time monitoring system, characterized in that: include: An optical power meter, the optical power meter being arranged at the bottom of the monitored workpiece; A detection system, the detection system being electrically connected to the control system of the monitored water-conducting laser processing system and the optical power meter, the detection system comprising a processor configured to execute the water-conducting laser processing time monitoring method according to any one of claims 1 to 3.

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