CCGA welding column transferring, positioning and welding integrated tool

Abstract

The invention discloses a CCGA welding column transferring, positioning and welding integrated tool which comprises an assembly plate, a plurality of welding columns and a device body, the welding columns and the device body are arranged on the assembly plate, array holes used in cooperation with the welding columns are formed in the top of the assembly plate, and the CCGA welding column transferring, positioning and welding integrated tool relates to the technical field of CCGA device machining. According to the CCGA welding column transferring, positioning and welding integrated tool, through cooperative arrangement of the assembly plate, the array holes, the clamping pieces and the baffles, convenient conditions are provided for installation of the welding columns, convenience is provided for convenient disassembly and assembly of the baffles through arrangement of the clamping pieces, a reference basis is provided for positioning and calibration of device body assembly under arrangement of Mark positioning points, and the CCGA welding column transferring, positioning and welding integrated tool is suitable for popularization and application. And through the arrangement of the positioning assembly, further positioning of the device body can be achieved, stability guarantee is provided for positioning of the device body, meanwhile, the welding quality is guaranteed, after welding is completed, the device body and the welding column can be directly taken out, operation is easy and rapid, and reliable support is provided for batch machining of CCGA column planting.

Description

Technical Field

[0001] The invention relates to the technical field of CCGA device processing, in particular to a CCGA welding column transfer positioning welding integrated tool. Background Art

[0002] Ceramic Column Grid Array, referred to as CCGA, is a ceramic column grid array packaging technology. Compared with traditional PBGA, CCGA has the advantages of good electrothermal performance, strong air tightness, good moisture resistance and high reliability. The column grid replaces the ball grid, which greatly alleviates the thermal fatigue problem caused by the mismatch of thermal expansion coefficients between the alumina ceramic chip carrier and the epoxy resin glass cloth printed circuit board, thereby improving its assembly reliability. CCGA can realize many logic and microprocessor functions. Its packaging form determines its high temperature resistance, high pressure resistance and high reliability. It is suitable for larger sizes and more I / Os, so it occupies a very important position in the field of military, aviation and aerospace electronic product manufacturing.

[0003] The CCGA column grid needs to be soldered to the device package pad. The traditional column planting process is relatively complicated, and it is often necessary to pre-fix the device to be planted. After reflow soldering, the pre-fixed structure needs to be removed to obtain the CCGA with the solder column planted. This process is relatively complicated, inefficient, and difficult to automate. Therefore, a CCGA solder column transfer, positioning, and welding integrated tooling is proposed to achieve fast, simple, and easy-to-operate device column planting. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides an integrated tool for transferring and positioning CCGA welding columns, which solves the problem that the traditional CCGA column planting tool has more parts, more complicated operating procedures, and cannot adapt to the rhythm of mass production.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: CCGA welding column transfer positioning welding integrated tooling, including an assembly plate, and a plurality of welding columns and a device body arranged on the assembly plate, the top of the assembly plate is provided with array holes used in conjunction with the plurality of welding columns, and the bottom of the assembly plate is also fixed with a baffle through a clamping piece; Mark positioning points are provided at the four corners on the top of the assembly plate; Positioning components are also arranged around the top of the assembly plate, and the positioning components are used in conjunction with the device body.

[0006] The present invention is further configured as follows: the array holes include, from top to bottom, guide holes and positioning holes that are connected and arranged in sequence, the guide holes are arranged in a trumpet shape, and the guide angle of the guide holes is greater than or equal to forty-five degrees; The guide hole and the positioning hole are both used in conjunction with the welding column.

[0007] The present invention is further configured as follows: the clamping member includes a blocking plate and two single-opening guide rail frames, the blocking plate is arranged between the open ends of the two single-opening guide rail frames, and a plurality of first springs are fixedly installed on the top of the blocking plate.

[0008] The present invention is further configured as follows: a blind groove is provided at the bottom of the assembly plate, the blocking plate is slidably installed inside the blind groove, and the top of the first spring is fixedly connected to the top of the inner cavity of the blind groove.

[0009] The present invention is further configured as follows: the two single-opening guide rail frames are fixedly installed at the bottom of the assembly plate, the baffle is slidably installed between the two single-opening guide rail frames, and the baffle is arranged directly below a plurality of array holes, and the front side of the baffle is in sliding contact with the back side of the sealing plate.

[0010] The present invention is further configured as follows: the positioning assembly includes a push plate, one side of the push plate is penetrated by and threadedly installed with two first single-head screws, the outer periphery of one end of the two first single-head screws is jointly sleeved with a fixing plate, the outer periphery of one end of the first single-head screw is also sleeved with and fixedly installed with a limiting ring, one end of the first single-head screw is fixedly connected with a knob, the fixing plate is arranged between the knob and the limiting ring, one side of the top of the push plate is provided with an assembly groove, and one side of the top of the push plate is provided with an inclined slope.

[0011] The present invention is further configured as follows: the fixing plate is fixedly mounted on the top of the assembly plate by bolts, and the inclined slope is used in conjunction with an edge of the bottom of the device body; The bottom of the push plate is in sliding contact with the top of the assembly plate, and guide strips are fixedly installed on the top of the assembly plate and on both sides of the push plate.

[0012] The present invention is further configured as follows: a positioning plate is slidably mounted inside the assembly groove, a second single-end screw is fixedly mounted on one side of the positioning plate, one end of the second single-end screw passes through the push plate and is threadedly mounted with an adjusting nut, a second spring is sleeved on the outer periphery of the second single-end screw, and two ends of the second spring are respectively in contact with the positioning plate and a side opposite to the assembly groove; The other side of the positioning plate contacts one side of the periphery of the device body.

[0013] The present invention provides a CCGA welding column transfer positioning welding integrated tooling, which has the following beneficial effects: The present invention provides convenient conditions for the installation of solder columns through the coordinated arrangement of the assembly plate, array holes, clamps and baffles, and the arrangement of the clamps facilitates the convenient disassembly and assembly of the baffles. Under the setting of the Mark positioning points, a reference basis is provided for the positioning and calibration of the device body assembly, and through the setting of the positioning components, further positioning of the device body can be achieved, which provides stability for the positioning of the device body and ensures the welding quality. After welding is completed, the device body and the solder columns can be directly taken out, and the operation is simple and quick, providing reliable support for the batch processing of CCGA column planting. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2 This is a schematic diagram of the external structure of the present invention after the solder column and the device body are removed; Figure 3 It is a schematic diagram of the external structure of the present invention from a vertical viewing angle; Figure 4 is a cross-sectional view of the structure of the present invention; Figure 5 It is a schematic diagram of the connection between the assembly plate and the clamping member structure of the present invention; Figure 6 It is a structural schematic diagram of the positioning component of the present invention.

[0015] In the figure: 1. Assembly plate; 101. Array hole; 1011. Guide hole; 1012. Positioning hole; 102. Blind groove; 2. Welding column; 3. Device body; 4. Card connector; 401. Blocking plate; 402. Single opening guide rail frame; 403. First spring; 5. Baffle; 6. Mark positioning point; 7. Positioning assembly; 701. Push plate; 702. First single-end screw; 703. Fixing plate; 704. Limiting ring; 705. Knob; 706. Assembly groove; 707. Inclined slope; 708. Guide strip; 709. Positioning plate; 7010. Second single-end screw; 7011. Adjusting nut; 7012. Second spring. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0017] See also Figure 1-6 , the embodiment of the present invention provides the following technical solutions: Embodiment 1: A CCGA solder column transfer positioning welding integrated tool comprises an assembly board 1 , and a plurality of solder columns 2 and a device body 3 arranged on the assembly board 1 .

[0018] As a preferred solution, in order to achieve convenient positioning of the welding column 2, an array hole 101 is opened on the top of the assembly plate 1 for use with a number of welding columns 2. Specifically, the array hole 101 includes, from top to bottom, a guide hole 1011 and a positioning hole 1012 that are connected and arranged in sequence. The guide hole 1011 is arranged in a trumpet shape, and the guide angle of the guide hole 1011 is greater than or equal to forty-five degrees. The guide hole 1011 and the positioning hole 1012 are both used in conjunction with the welding column 2.

[0019] It should be noted that when two adjacent guide holes 1011 are tangent, the maximum guide angle is reached, and the maximum depth of the guide hole 1011 is less than or equal to one-third of the height of the welding column 2, and the maximum depth of the positioning hole 1012 is greater than or equal to two-thirds of the height of the welding column 2.

[0020] As a preferred solution, in order to prevent the welding column 2 from falling off, the bottom of the assembly plate 1 is also fixed with a baffle 5 through a clamping member 4. Specifically, in order to realize the convenient disassembly and assembly of the baffle 5, the clamping member 4 includes a blocking plate 401 and two single-opening guide rail frames 402. The blocking plate 401 is arranged between the open ends of the two single-opening guide rail frames 402. The two single-opening guide rail frames 402 are fixedly installed at the bottom of the assembly plate 1, and a plurality of first springs 403 are fixedly installed on the top of the blocking plate 401. A blind groove 102 is provided at the bottom of the assembly plate 1. 401 is slidably installed inside the blind groove 102, and the top end of the first spring 403 is fixedly connected to the top of the inner cavity of the blind groove 102, the baffle 5 is slidably installed between the two single-opening guide rail frames 402, and the baffle 5 is arranged directly below a number of array holes 101, the baffle 5 is used to limit the bottom of the welding column 2, the front side of the baffle 5 is in sliding contact with the back of the sealing plate 401, and the sealing plate 401 is used to limit the open ends of the two single-opening guide rail frames 402, ensuring that the baffle 5 can be stably located between the two single-opening guide rail frames 402.

[0021] As a preferred solution, in order to achieve efficient automated processing, Mark positioning points 6 are set at the four corners of the top of the assembly board 1, wherein the Mark positioning points 6 are used in conjunction with the automated equipment recognition equipment to print solder paste on the pad of the device body 3 and contact the solder column 2 to achieve accurate positioning of the device body 3, and in order to facilitate the assembly of the device body 3, as shown in the attached Figure 1 and attached Figure 2 As shown, a corner of the outer periphery of the assembly board 1 is set as an inclined surface to provide a direction for the mounting of the device body 3.

[0022] In this embodiment, after the device body 3 and the soldering column 2 are welded and fixed, the device body 3 and the soldering column 2 that have been welded can be directly taken out, and the operation is simple and quick.

[0023] Embodiment 2: This embodiment is an improvement of the previous embodiment. The CCGA welding column transfer positioning welding integrated tooling also includes a positioning component 7 arranged around the top of the assembly plate 1. The positioning component 7 is used in conjunction with the device body 3. Specifically, the positioning component 7 includes a push plate 701. The bottom of the push plate 701 is in sliding contact with the top of the assembly plate 1. Two first single-head screw rods 702 are penetrated and threadedly installed on one side of the push plate 701. The outer periphery of one end of the two first single-head screw rods 702 is jointly sleeved with a fixing plate 703. The fixing plate 703 is fixedly installed on the top of the assembly plate 1 by bolts. The top of the assembly plate 1 and located at the push plate Guide strips 708 are fixedly installed on both sides of the plate 701, and a limit ring 704 is also sleeved and fixedly installed on the outer periphery of one end of the first single-head screw rod 702. A knob 705 is fixedly connected to one end of the first single-head screw rod 702. The fixed plate 703 is arranged between the knob 705 and the limit ring 704, and an inclined slope 707 is arranged on one side of the top of the push plate 701. The inclined slope 707 is used in conjunction with an edge of the bottom of the device body 3 to ensure that the numerical height between the device body 3 and the assembly board 1 is between 0.2mm and 0.5mm, so as to facilitate the subsequent reflow soldering fixation between the device body 3 and the solder column 2.

[0024] As a preferred solution, in order to ensure the relative stability of the position of the device body 3 and to further improve the welding quality between the device body 3 and the welding column 2, an assembly groove 706 is opened on one side of the top of the push plate 701, and a positioning plate 709 is slidably installed inside the assembly groove 706. A second single-head screw rod 7010 is fixedly installed on one side of the positioning plate 709, and the other side of the positioning plate 709 is in contact with one side of the periphery of the device body 3. One end of the second single-head screw rod 7010 passes through the push plate 701 and is threadedly installed with an adjusting nut 7011. The outer periphery of the second single-head screw rod 7010 is sleeved with a second spring 7012, and the two ends of the second spring 7012 are respectively in contact with the positioning plate 709 and the opposite side of the assembly groove 706.

[0025] The advantage of the second embodiment over the first embodiment is that it can also realize convenient positioning of the device body 3 and provide a stable and reliable processing environment for batch pillar planting processing of the device body 3 .

[0026] When in use, the welding column 2 passes through the guide hole 1011 and enters the positioning hole 1012, and the bottom end of the welding column 2 falls on the top of the baffle 5; After printing solder paste on the pads of the device body 3, the device body 3 is placed on a plurality of solder pillars 2 so that the solder paste contacts the solder pillars 2. During the process, an automated device is used to identify the Mark positioning point 6 to accurately position the pads of the device body 3 and the solder pillars 2. Synchronously rotate the two knobs 705 on the same positioning component 7, so that the two first single-head screws 702 drive the push plate 701 to move on the assembly plate 1 until the inclined slope 707 contacts one edge of the bottom of the device body 3. After completing the adjustment of the four positioning components 7, vertically press the device body 3 downward to perform secondary positioning on the device body 3, loosen the adjustment nut 7011, and under the elastic force of the second spring 7012, the second spring 7012 pushes the positioning plate 709 to move in the assembly groove 706 until the positioning plate 709 contacts one side of the device body 3. Repeat the operation until the four positioning plates 709 contact the outer periphery of the device body 3 respectively to complete the positioning. At this time, the device body 3 is no longer pressed vertically downward; The device is sent into a reflow soldering device to perform soldering between the device body 3 and the soldering column 2. After the soldering is completed, the device body 3 is directly taken out and can be separated from the assembly board 1 together with the soldering column 2.

[0027] As an expanded explanation, in order to efficiently install a plurality of welding columns 2 into the assembly plate 1, a sieve plate or other automatic column insertion methods can be used to efficiently assemble the welding columns 2.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A CCGA solder column transfer positioning welding integrated tool, comprising an assembly plate (1), and a plurality of solder columns (2) and a device body (3) arranged on the assembly plate (1), characterized in that: The top of the assembly plate (1) is provided with an array hole (101) for use with a plurality of welding columns (2), and the bottom of the assembly plate (1) is also fixed with a baffle (5) by means of a clamping piece (4); Mark positioning points (6) are provided at the four corners of the top of the assembly plate (1); Positioning components (7) are also arranged around the top of the assembly plate (1), and the positioning components (7) are used in conjunction with the device body (3).

2. The CCGA welding column transfer positioning welding integrated tooling according to claim 1 is characterized in that: The array holes (101) include, from top to bottom, a guide hole (1011) and a positioning hole (1012) which are connected to each other, the guide hole (1011) being arranged in a trumpet shape, and a guide angle of the guide hole (1011) being greater than or equal to forty-five degrees; The guide hole (1011) and the positioning hole (1012) are both used in conjunction with the welding column (2).

3. The CCGA welding column transfer positioning welding integrated tooling according to claim 1 is characterized in that: The clamping member (4) comprises a blocking plate (401) and two single-opening guide rail frames (402); the blocking plate (401) is arranged between the open ends of the two single-opening guide rail frames (402), and a plurality of first springs (403) are fixedly mounted on the top of the blocking plate (401).

4. The CCGA welding column transfer positioning welding integrated tooling according to claim 3 is characterized in that: A blind groove (102) is provided at the bottom of the assembly plate (1), the blocking plate (401) is slidably mounted inside the blind groove (102), and the top end of the first spring (403) is fixedly connected to the top of the inner cavity of the blind groove (102).

5. The CCGA welding column transfer positioning welding integrated tooling according to claim 4 is characterized in that: The two single-opening guide rail frames (402) are fixedly mounted on the bottom of the assembly plate (1), the baffle plate (5) is slidably mounted between the two single-opening guide rail frames (402), and the baffle plate (5) is arranged directly below a plurality of array holes (101), and the front surface of the baffle plate (5) is in sliding contact with the back surface of the blocking plate (401).

6. The CCGA welding column transfer positioning welding integrated tool according to claim 1, characterized in that: The positioning assembly (7) comprises a push plate (701), one side of the push plate (701) penetrates and is threadedly mounted with two first single-head screws (702), the outer peripheries of one end of the two first single-head screws (702) are collectively sleeved with a fixing plate (703), the outer periphery of one end of the first single-head screw (702) is also sleeved with and fixedly mounted with a limiting ring (704), one end of the first single-head screw (702) is fixedly connected with a knob (705), the fixing plate (703) is arranged between the knob (705) and the limiting ring (704), one side of the top of the push plate (701) is provided with an assembly groove (706), and one side of the top of the push plate (701) is provided with an inclined slope (707).

7. The CCGA welding column transfer positioning welding integrated tooling according to claim 6, characterized in that: The fixing plate (703) is fixedly mounted on the top of the assembly plate (1) by means of bolts, and the inclined slope (707) is used in conjunction with an edge of the bottom of the device body (3); The bottom of the push plate (701) is in sliding contact with the top of the assembly plate (1), and guide strips (708) are fixedly mounted on the top of the assembly plate (1) and on both sides of the push plate (701).

8. The CCGA welding column transfer positioning welding integrated tooling according to claim 6, characterized in that: A positioning plate (709) is slidably mounted inside the assembly groove (706), a second single-head screw (7010) is fixedly mounted on one side of the positioning plate (709), one end of the second single-head screw (7010) passes through the push plate (701) and is threadedly mounted with an adjusting nut (7011), a second spring (7012) is sleeved on the outer periphery of the second single-head screw (7010), and two ends of the second spring (7012) are respectively in contact with the positioning plate (709) and the side opposite to the assembly groove (706); The other side of the positioning plate (709) contacts one side of the periphery of the device body (3).

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