Demolding device and wafer-level product demolding method

Abstract

The invention discloses a demolding device and a wafer-level product demolding method, and belongs to the technical field of wafer-level product processing.The device comprises a first suction cup and a second suction cup, the first suction cup and the second suction cup are each provided with a hinge end and an opening and closing end, the hinge ends of the first suction cup and the second suction cup are hinged, and the first suction cup is provided with a first vacuum hole distribution area; the first suction cup is provided with a first vacuum hole distribution area which extends from the opening and closing end to the hinged end, and the second suction cup is provided with a second vacuum hole distribution area which is close to the opening and closing end. The method comprises the steps that S1, the first suction cup is horizontally placed; s2, the wafer glass is adsorbed on a first suction cup; s3, a second suction cup adsorbs the reprinting template; and S4, rotating the second sucking disc back to the first sucking disc until the reprinting template is separated from the wafer glass. In the demolding process, the second object and the first object are separated from one end close to the opening and closing end and then gradually spread to one end close to the hinge end, and in this way, the risk that the first object deforms or is broken can be reduced, and local stress concentration is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer-level product processing, and in particular to a demoulding device and a wafer-level product demoulding method. Background Art

[0002] As the market demand for small-sized products grows day by day, wafer-level products have become the mainstream of the market. The general process of wafer-level product processing is to first make a metal mold or a glass mold, use a metal reprinting stamp (reprinting template), then drip an appropriate amount of glue on the surface of the wafer glass, flatten the glue with a stamp and then solidify the glue to reprint the shape of the surface structure on the stamp onto the glue, and finally separate the stamp from the glue to form a wafer-level product. The inventors know that one of the biggest problems in wafer-level product processing is the difficulty in demolding the product. Generally, the thickness of the wafer glass is about 0.08 to 1 mm. When the stamp and the wafer glass are separated, the wafer glass is easily broken, resulting in a sharp increase in product processing costs. Summary of the invention

[0003] The purpose of the present invention is to solve the above-mentioned technical problems and to provide a demolding device and a wafer-level product demolding method, wherein the first suction cup and the second suction cup can rotate along their hinged ends so that the opening and closing ends of the two can be opened and closed. Since the second vacuum hole arrangement area is close to the opening and closing end of the second suction cup, the end of the second object close to the opening and closing end of the second suction cup is adsorbed. When the first suction cup and the second suction cup are opened, the second object and the first object are first separated from the end close to the opening and closing end, and then gradually spread to the end close to the hinged end, which can reduce the risk of deformation or breakage of the first object caused by the large adhesive area and strong adhesive force of the glue brought about by the direct overall peeling method. At the same time, because the first vacuum hole arrangement area extends from the opening and closing end to the hinged end of the first suction cup, the first object is effectively adsorbed along the direction from the opening and closing end to the hinged end, which can match the separation direction, ensuring that the first object is adsorbed as a whole in this direction, avoiding the problem of local stress concentration and fracture.

[0004] To achieve the above-mentioned purpose, the present invention provides the following scheme: The present invention discloses a demolding device, which is used to separate a first object and a second object bonded by glue, comprising a first suction cup and a second suction cup with adsorption surfaces facing each other, the first suction cup and the second suction cup both having a hinged end and an opening and closing end located on opposite sides, the hinged end of the first suction cup and the hinged end of the second suction cup are hinged to each other, a first vacuum hole layout area for adsorbing the first object is provided on the adsorption surface of the first suction cup, the first vacuum hole layout area extends from the opening and closing end of the first suction cup to the hinged end, a second vacuum hole layout area for adsorbing the second object is provided on the adsorption surface of the second suction cup, and the second vacuum hole layout area is close to the opening and closing end of the second suction cup.

[0005] Preferably, it also includes a base for horizontal placement, the base is provided with a hollow area, the hollow area can accommodate the first suction cup and the second suction cup, the hollow area is provided with a supporting base plate for supporting the back side of the first suction cup, the first suction cup is installed on the supporting base plate, and the base is provided with a hinged seat for the second suction cup to be hinged.

[0006] Preferably, a first vacuum chamber is provided in the first suction cup, a first suction hole for connecting to a suction device is provided on the back side of the first suction cup, a plurality of annular grooves which are sequentially arranged from the inside to the outside are provided on the first vacuum hole layout area, the center of the annular groove coincides with the center of the first vacuum hole layout area, the plurality of annular grooves are connected by a cross groove, a first vacuum hole is provided in the cross groove, and the first suction hole and the first vacuum hole are both connected to the first vacuum chamber.

[0007] Preferably, a second vacuum chamber is provided in the second suction cup, a second suction hole for connecting to a suction device is provided on the side wall of the second suction cup, a second vacuum hole is provided in the second vacuum hole layout area, and the second suction hole and the second vacuum hole are both connected to the second vacuum chamber.

[0008] Preferably, the second suction cup is provided with an observation port capable of revealing the first suction cup.

[0009] Preferably, a hinge shaft is provided on the side wall of the second suction cup, and a hinge groove for hinge connection of the hinge shaft is provided on the hinge seat.

[0010] Preferably, it also includes a driving mechanism for driving the second suction cup to rotate, the base is provided with a mounting slot, the driving mechanism includes an articulated block, a driving motor and two lead screw nuts, the screw of the lead screw nut is rotatably connected in the mounting slot, the screw is driven by the driving motor, the nut of the lead screw nut is provided with hinged ears, a connecting rod is hinged on the hinged ears, the connecting rods on the two lead screw nuts are hinged to the two ends of the articulated block respectively, a connecting block for being hinged to the articulated block is fixed on the opening and closing end of the second suction cup, the axis of the screw is parallel to the axis of the articulated end of the first suction cup, the axis of the connecting block is parallel to the axis of the screw, and the axis of the connecting rod is perpendicular to the axis of the screw and the articulated axis of the opening and closing end of the second suction cup.

[0011] Preferably, it also includes a suction device and a control device, and the control device is electrically connected to the suction device and the drive motor.

[0012] Preferably, the control device comprises a computer host, a display and a motor controller, and the computer host is electrically connected to the display and the motor controller respectively.

[0013] A method for demoulding a wafer product is also disclosed, which uses the demoulding device and includes the following steps:

[0014] S1, the first suction cup is placed horizontally, and the second suction cup is located above the first suction cup;

[0015] S2, placing and adsorbing the wafer glass and the reprint template bonded together by glue on the first vacuum hole layout area of ​​the first suction cup, with the wafer glass facing the first vacuum hole layout area, a release agent is applied between the reprint template and the glue in advance, and an adhesion promoter is applied between the wafer glass and the glue in advance;

[0016] S3, rotating the second suction cup toward the first suction cup, so that the second vacuum hole arrangement area absorbs the reprint template;

[0017] S4, rotating the second suction cup away from the first suction cup until the reprint template is separated from the wafer glass.

[0018] Compared with the prior art, the present invention has achieved the following technical effects:

[0019] The demoulding device in the present invention mainly comprises a first suction cup and a second suction cup hinged to each other, so that the first suction cup and the second suction cup can rotate along the hinged end, so that the opening and closing ends of the two can be opened and closed, and the first object of the material to be separated is adsorbed on the first vacuum hole layout area. After the second object is adsorbed on the second vacuum hole layout area, because the second vacuum hole layout area is close to the opening and closing end of the second suction cup, the end of the second object close to the opening and closing end of the second suction cup is adsorbed. When the first suction cup and the second suction cup are opened, the second object and the first object are first separated from the end close to the opening and closing end, and then gradually spread to the end close to the hinged end, which can reduce the risk of deformation or breakage of the first object caused by direct overall opening due to the large adhesion area and strong adhesion of the glue. At the same time, because the first vacuum hole layout area extends from the opening and closing end to the hinged end of the first suction cup, the first object is effectively adsorbed in the direction from the opening and closing end to the hinged end, which can match the separation direction, ensuring that the first object is adsorbed as a whole in this direction, avoiding the problem of local stress concentration and fracture. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1It is a schematic diagram of the three-dimensional structure of two closed suction cups in the demoulding device in the embodiment;

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of two suction cups opened in the demoulding device in the embodiment;

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of the driving mechanism in the demoulding device in the embodiment;

[0024] Figure 4 It is a schematic diagram of the top view of the demoulding device in the embodiment;

[0025] Figure 5 It is a bottom view structural schematic diagram of the demoulding device in the embodiment;

[0026] Figure 6 is a schematic diagram of a top view of the structure of the first suction cup in the embodiment;

[0027] Figure 7 is a schematic diagram of the side structure of the first suction cup in the embodiment;

[0028] Figure 8 is a bottom view structural schematic diagram of the first suction cup in the embodiment;

[0029] Fig. 9 is a schematic diagram of a top view of the structure of the second suction cup in the embodiment;

[0030] Fig.10 for Fig. 9 A partial enlarged view of

[0031] Fig.11 is a schematic cross-sectional structural diagram of a second suction cup in the embodiment;

[0032] Fig.12 is a bottom view of the structure of the second suction cup in the embodiment;

[0033] Fig.13 This is a schematic diagram of the structure of the driving mechanism when the two suction cups are closed in the embodiment;

[0034] Fig.14 It is a structural schematic diagram of the driving mechanism when two suction cups are opened in the embodiment;

[0035] Fig.15 It is a schematic diagram of the side structure of the demoulding device when two suction cups are closed in the embodiment;

[0036] Fig.16 It is a schematic diagram of the side structure of the demoulding device when two suction cups are opened in the embodiment;

[0037] Fig.17 Schematic diagram of the hinged position relationship between the hinged seat and the hinged shaft when the two suction cups are closed in the embodiment;

[0038] Fig.18 A schematic diagram of the three-dimensional structure of the base in the embodiment;

[0039] Fig.19 A schematic diagram of a top view of the base in the embodiment;

[0040] Fig. 20 This is a schematic diagram of the bottom view of the base in the embodiment;

[0041] Fig.21 It is a schematic diagram of the side structure of the hinge seat in the embodiment;

[0042] Fig. 22 A schematic diagram of the three-dimensional structure of the supporting base plate in the embodiment;

[0043] Fig.23 is a schematic cross-sectional structural diagram of a supporting base plate in an embodiment;

[0044] Fig.24 It is a schematic diagram of the overall structure of the demoulding device in the embodiment;

[0045] Fig.25 Schematic diagram of the structure of the wafer glass and the reprint template before demoulding in the embodiment;

[0046] Fig.26 Schematic diagram of the structure of the wafer glass and the reprint template after demolding in the embodiment.

[0047] Description of reference numerals:

[0048] 1. Base; 2. First suction cup; 3. Second suction cup; 4. Driving mechanism; 5. Wafer glass; 6. Copy template; 7. Glue; 8. Computer host; 9. Suction device; 10. Motor controller;

[0049] 101, hollow area; 102, supporting bottom plate; 103, hinge seat; 104, hinge slot; 105, mounting slot; 106, first screw hole; 107, second screw hole; 108, third screw hole; 109, fourth screw hole; 110, fifth screw hole; 111, sixth screw hole; 112, motor mounting hole; 1041, semicircular slot; 1042, end wall; 1043, inner curved section;

[0050] 201, annular groove; 202, cross groove; 203, first vacuum hole; 204, first suction hole; 205, seventh screw hole;

[0051] 301, second suction hole; 302, second vacuum hole; 303, observation port; 304, hinge axis;

[0052] 401, hinged block; 402, screw rod; 403, nut; 404, hinged ears; 405, connecting rod; 406, connecting block; 407, driving motor. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] Example 1

[0055] This embodiment provides a demoulding device for separating a first object (such as a glass wafer 5) and a second object (stamp, i.e., a reprint template 6) bonded by glue. Figures 1 to 26 As shown, it includes a first suction cup 2 and a second suction cup 3. The first suction cup 2 has a hinged end and an opening and closing end located on the opposite side, and the second suction cup 3 also has a hinged end and an opening and closing end located on the opposite side. The hinged end of the first suction cup 2 and the hinged end of the second suction cup 3 are hinged to each other. After the first suction cup 2 and the second suction cup 3 are hinged, the adsorption surface of the first suction cup 2 and the adsorption surface of the second suction cup 3 will be arranged facing each other, so that when the first suction cup 2 and the second suction cup 3 rotate relatively, the adsorption surfaces of the two will be relatively close or relatively far away. A first vacuum hole layout area is provided on the adsorption surface of the first suction cup 2, and the first vacuum hole layout area is used to adsorb the first object on the adsorption surface of the first suction cup 2, and the first vacuum hole layout area extends from the opening and closing end of the first suction cup 2 to the hinged end. A second vacuum hole arrangement area is provided on the adsorption surface of the second suction cup 3, and the second vacuum hole arrangement area is used to adsorb the second object. The second vacuum hole arrangement area is close to the opening and closing end of the second suction cup 3. When the first suction cup 2 and the second suction cup 3 are closed, the second suction cup 3 is just adsorbed on one end of the second object close to the opening and closing end of the second suction cup 3, so that when the first suction cup 2 and the second suction cup 3 are opened, the first object and the second object are first separated from one end close to the opening and closing end of the second suction cup 3, and then gradually separated along the direction toward the hinged end of the second suction cup 3. Preferably, the second vacuum hole arrangement area extends along a direction perpendicular to the direction extending from the opening and closing end of the second suction cup 3 to the hinged end.

[0056] Working process:

[0057] First, the first suction cup 2 and the second suction cup 3 are relatively rotated in a direction of being relatively far away from each other, so that the first suction cup 2 and the second suction cup 3 are opened; then, the first object of the material to be separated (composed of the first object, the glue 7 and the second object) is adsorbed on the first vacuum hole layout area of ​​the first suction cup 2; then, the first suction cup 2 and the second suction cup 3 are relatively rotated in a direction of being relatively close to each other, until the second vacuum hole layout area of ​​the second suction cup 3 adsorbs one end of the second object close to the opening and closing end of the second suction cup 3; then, the first suction cup 2 and the second suction cup 3 are relatively rotated in a direction of being relatively far away from each other, The first object and the second object are first separated from one end close to the opening and closing end of the second suction cup 3, and then gradually separated along the direction of the hinged end of the second suction cup 3 to avoid that the adhesive force of the glue 7 between the first object and the second object is too strong, which may cause the first object to be broken or deformed. At the same time, because the first vacuum hole layout area extends from the opening and closing end of the first suction cup 2 to the hinged end, the first object is adsorbed along the length direction from the opening and closing end to the hinged end of the first suction cup 2, so that the first object is attached to the first suction cup 2 as a whole in this direction, avoiding stress concentration in the first object and cracking.

[0058] In one embodiment, if Figures 1 to 26 As shown, it also includes a base 1, which is used for horizontal placement. A hollow area 101 is provided on the base 1, and the hollow area 101 can accommodate the first suction cup 2 and the second suction cup 3. A supporting base plate 102 is provided at the hollow area 101, and the supporting base plate 102 is used to support the back side (i.e., the side facing away from the adsorption surface) of the first suction cup 2. The supporting base plate 102 is installed on the first suction cup 2, and the supporting base plate 102 is located in the hollow area 101. A hinge seat 103 is provided on the base 1, and the hinge seat 103 is hinged for the second suction cup 3. The base 1 is placed horizontally on an operating table or the ground, and the first suction cup 2 can be placed horizontally. Preferably, the hinge seat 103 can be arranged in the hollow area 101.

[0059] In one embodiment, if Figures 1 to 26As shown, a first vacuum cavity is provided in the first suction cup 2, and a first suction hole 204 is provided on the back side of the first suction cup 2, and the first suction hole 204 is used to connect with the suction equipment. A plurality of annular grooves 201 are provided in sequence from the inside to the outside on the first vacuum hole layout area, and the plurality of annular grooves 201 are arranged at intervals, and can be arranged at uniform intervals or at variable intervals. The center of the annular groove 201 coincides with the center of the first vacuum hole layout area. The plurality of annular grooves 201 are connected through a cross groove 202. A first vacuum hole 203 is provided in the cross groove 202, and the cross groove 202 is composed of two strip grooves, and the first vacuum hole 203 is provided in at least one strip groove. The first suction hole 204 and the first vacuum hole 203 are both connected to the first vacuum cavity. After connecting the first suction hole 204 to the suction device, place the first object on the first vacuum hole layout area, i.e., cover the annular groove 201 and the cross groove 202, turn on the suction device, the first suction hole 204 suctions the first vacuum chamber, and then the first vacuum hole 203 suctions the annular groove 201 and the cross groove 202, so that negative pressure is generated between the annular groove 201 and the cross groove 202 and the first object, thereby adsorbing the first object on the first vacuum hole layout area. The arrangement of multiple annular grooves 201 and cross grooves 202 can ensure that the first object and the attachment surface of the first suction cup 2 are adsorbed as a whole, so that when the first object and the second object are separated, the problem of local stress concentration and deformation or fragmentation of the first object is reduced. Preferably, one of the strip grooves of the cross groove 202 is parallel to the extension direction of the opening and closing end of the first suction cup 2 to the hinged end, and the other strip groove is perpendicular to the extension direction of the opening and closing end of the first suction cup 2 to the hinged end, and at least the first vacuum holes 203 are arranged in the strip groove parallel to the extension direction of the opening and closing end of the first suction cup 2 to the hinged end, and the first vacuum holes 203 are evenly spaced along the strip groove.

[0060] In one embodiment, if Figures 1 to 26 As shown, a second vacuum cavity is provided in the second suction cup 3, and a second suction hole 301 is provided on the side wall of the second suction cup 3, and the second suction hole 301 is used to connect with the suction device. A second vacuum hole 302 is provided in the second vacuum hole 302 layout area, and the second suction hole 301 and the second vacuum hole 302 are both connected to the second vacuum cavity. Preferably, the second vacuum holes 302 are arranged at intervals along a direction perpendicular to the opening and closing end of the second suction cup 3 extending to the hinged end. The second vacuum hole 302 can be a circular hole, a strip hole or a hole of other shapes. Preferably, the second vacuum hole 302 is a strip hole, and the length direction of the strip hole is perpendicular to the direction of the opening and closing end of the second suction cup 3 extending to the hinged end.

[0061] In one embodiment, if Figures 1 to 26 As shown, the second suction cup 3 is provided with an observation port 303, through which the first suction cup 2 can be exposed, so that after the first object is adsorbed on the first suction cup 2, it can be observed whether the second object is placed properly.

[0062] In one embodiment, if Figures 1 to 26 As shown, a hinge shaft 304 is provided on the side wall of the second suction cup 3, and a hinge groove 104 is provided on the hinge seat 103 for the hinge shaft 304 to be hinged.

[0063] Further, in one embodiment, if Figures 1 to 26 As shown, the hinge groove 104 can be a slope groove, and a concave semicircular groove 1041 is provided at the bottom end of the slope of the slope groove, and the semicircular groove 1041 is used for the hinge shaft 304 to hinge. The bottom end of the slope of the hinge groove 104 has a certain depth to provide a certain activity space for the hinge shaft 304, that is, the hinge shaft 304 can break away from the semicircular groove and move along the end wall 1042 at the bottom end of the slope of the hinge groove 104 toward the notch direction of the hinge groove 104. The purpose of this arrangement is that when the thickness of the first object and the second object is thicker, during the closing process of the first suction cup 2 and the second suction cup 3, affected by the thickness of the first object and the second object, the hinge shaft 304 of the second suction cup 3 will move away from the second suction cup 3, and then break away from the semicircular groove and move along the end wall 1042 toward the notch direction of the hinge groove 104, so that there is a certain distance between the second suction cup 3 and the first suction cup 2, which is adaptive to the thickness of the first object and the second object, such as Fig.17 As shown. Preferably, the end wall 1042 at the bottom of the slope of the hinge groove 104 is provided with an inner curved section 1043 near the groove opening, which plays a limiting role and prevents the hinge shaft 304 from easily leaving the hinge groove 104.

[0064] In one embodiment, if Figures 1 to 26As shown, it also includes a driving mechanism 4. The driving mechanism 4 is used to drive the second suction cup 3 to rotate. A mounting groove 105 is provided on the base 1. The driving mechanism 4 includes a hinge block 401, a driving motor 407 and two lead screw nuts. The screw 402 of the lead screw nut is rotatably connected in the mounting groove 105, and the screw 402 is driven by the driving motor 407. The nut of the lead screw nut is provided with a hinged double ear 404, and a connecting rod 405 is hinged on the hinged double ear 404, and the connecting rod 405 is located between the two ears of the hinged double ear 404. The connecting rods 405 on the two lead screw nuts are respectively hinged to the two ends of the hinge block 401. A connecting block 406 is fixed on the opening and closing end of the second suction cup 3, and the connecting block 406 is hinged to the hinge block 401. The axis of the screw 402 is parallel to the hinge axis of the hinge end of the first suction cup 2, the hinge axis of the connecting block 406 is parallel to the axis of the screw 402, and the hinge axis of the connecting rod 405 is perpendicular to the axis of the screw 402 and the hinge axis of the opening and closing end of the second suction cup 3. Preferably, two mounting grooves 105 can be provided for mounting two screws 402 respectively, and the base 1 part between the two mounting grooves 105 can be used to hold the hinge block 401 and limit it, so that when the hinge block 401 contacts the base 1, the first suction cup 2 and the second suction cup 3 fit exactly. Of course, the driving mechanism 4 is mainly provided to realize automatic demoulding. If the driving mechanism 4 is not provided, the second suction cup 3 can be rotated manually to realize manual demoulding. It should be noted that when using, the base 1 needs to be kept stable and motionless. The base 1 can be pressed on the operating platform manually, or the base 1 can be fixed on the operating platform by other components, and then only the second suction cup 3 is rotated, and the first suction cup 2 and the base 1 remain motionless.

[0065] Working process:

[0066] The drive motor 407 is started to drive the screw 402 to rotate, so that the nut 403 can move along the axis direction of the screw 402. When the nuts 403 of the two screws 402 move toward each other, the connecting rod 405 will lift the hinge block 401, and the hinge block 401 will lift the connecting block 406, thereby lifting the opening and closing end of the second suction cup 3, so that the second suction cup 3 and the first suction cup 2 are opened. When the nuts 403 of the two screws 402 move away from each other, the connecting rod 405 will pull down the hinge block 401, and the hinge block 401 will pull down the connecting block 406, thereby pulling down the opening and closing end of the second suction cup 3, so that the second suction cup 3 and the first suction cup 2 are closed.

[0067] In one embodiment, if Figures 1 to 26As shown, it also includes a suction device and a control device, and the control device is electrically connected to the suction device and the drive motor 407. The suction device is used to connect to the first suction hole 204 and the second suction hole 301. The suction device can simultaneously suction the first suction hole 204 and the second suction hole 301, or can independently suction the first suction hole 204 and the second suction hole 301. The suction device and the drive motor 407 can be started by the control device.

[0068] Further, in one embodiment, if Figures 1 to 26 As shown, the suction device may use two vacuum pumps, and the two vacuum pumps are connected to the first suction hole 204 and the second suction hole 301 respectively.

[0069] Further, in one embodiment, if Figures 1 to 26 As shown, the control device includes a computer host, a display and a motor controller, the computer host is electrically connected to the display and the motor controller respectively, and the motor controller is electrically connected to the drive motor 407. Parameters such as suction force and motor speed are input to the suction device and the motor controller through the computer host and the display, and then the motor controller controls the speed of the drive motor 407. Automatic demoulding can be achieved.

[0070] In one embodiment, if Figures 1 to 26 As shown, the opening angle between the first suction cup 2 and the second suction cup 3 can be preset to 0 to 90 degrees, and can certainly be increased or decreased as needed.

[0071] In one embodiment, if Figures 1 to 26 As shown, the base 1 is fixed to the hinge seat 103 by screws. The base 1 is fixed to the support base plate 102 by screws. The support base plate 102 is fixed to the first suction cup 2 by screws. For example, a first screw hole 106 is provided on the side wall of the hollow area 101 of the base 1, and a third screw hole 108 is provided on the hinge seat 103. The screws are screwed into the first screw hole 106 and the third screw hole 108 to realize the screw connection between the base 1 and the hinge seat 103. A second screw hole 107 is provided on the back side of the base 1, a fourth screw hole 109 and a fifth screw hole 110 are provided on the support base plate 102, and a seventh screw hole 205 is provided on the back side of the first suction cup 2. The second screw hole 107 and the fourth screw hole 109 cooperate to realize the screw connection between the base 1 and the support base plate 102, and the fifth screw hole 110 and the seventh screw hole 205 cooperate to realize the screw connection between the support base plate 102 and the first suction cup 2. The mounting groove 105 of the base 1 is provided with a sixth screw hole 111 and a motor mounting hole 112 . The sixth screw hole 111 is for screw connection of the driving motor 407 , and the motor mounting hole 112 is for the output shaft of the driving motor 407 to extend into and connect with the screw rod 407 .

[0072] Example 2

[0073] This embodiment provides a method for demoulding a wafer product. Figures 1 to 26 As shown, the demoulding device described in Example 1 is used, comprising the following steps:

[0074] S2, placing and adsorbing the wafer glass 5 and the reprint template 6 bonded together by the glue 7 on the first vacuum hole layout area of ​​the first suction cup 2, with the wafer glass 5 facing the first vacuum hole layout area, a release agent is applied between the reprint template 6 and the glue 7 in advance, and an adhesion promoter is applied between the wafer glass 5 and the glue 7 in advance;

[0075] S3, rotating the second suction cup 3 toward the first suction cup 2, so that the second vacuum hole arrangement area is adsorbed on the reprint template 6;

[0076] S4, rotating the second suction cup 3 away from the first suction cup 2 until the reprint template 6 is separated from the wafer glass 5.

[0077] When the first suction cup 2 and the second suction cup 3 are rotated relative to each other in the direction of being relatively away from each other, the opening and closing ends of the two are opened first, so a gap will be opened first at the end of the wafer glass 5 and the reprint template 6 close to the opening and closing top, and then the wafer glass 5 and the reprint template 6 will gradually separate. Compared with directly pulling the reprint template 6 as a whole from the wafer glass 5, this method can avoid the excessive bonding force of the glue 7 between the wafer glass 5 and the reprint template 6, which may cause the wafer glass 5 to break. At the same time, because the first vacuum hole layout area extends from the opening and closing end of the first suction cup 2 to the hinged end, the wafer glass 5 is adsorbed along the length direction from the opening and closing end of the first suction cup 2 to the hinged end, so that the wafer glass 5 is attached to the first suction cup 2 as a whole in this direction, avoiding local stress concentration problems on the wafer glass 5 and cracking.

[0078] In one embodiment, if Figures 1 to 26As shown, when the first suction cup 2 and the second suction cup 3 in the demolding device are closed, the initial angle between the first suction cup 2 and the second suction cup 3 is A0=0°, and the output shaft of the drive motor 407 has an initial angle B0. In order to make the initial transmission have a certain force, the initial angle B0>0° is required. Preferably, B0=10°. The length of the screw 402 is L1, that is, the maximum effective stroke of the nut 403 is L1, the length of the connecting rod 405 is L2, and the distance from the center of the second suction cup 3 to the hinge block 401 is N1. In the initial state, L1=L2*SIN(B0). As the drive motor 407 rotates, the stroke of the nut 403 gradually decreases. Since the length L2 of the transmission workpiece remains unchanged, B0 increases to B1. The range of B1 is 10°~60°, A0 changes from 0° to A1>0 degrees, and the preferred angle range of A1 is 0~30 degrees, so that there is a certain stress between the stamp (reprint template 6) and the wafer glass 5. As L1 continues to increase, when the angle of A1 reaches a certain degree, the stamp (reprint template 6) and the wafer glass 5 are completely separated. For different types of products, the distance L2 moved by the nut 403 and the change of the angle A1 between the first suction cup 2 and the second suction cup 3 can be obtained by the formula A1=arctan((L12-L22)^0.5 / N1), thereby solving the problem of demolding of wafer-level products.

[0079] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A demoulding device for separating a first object and a second object bonded by glue, characterized in that: The invention comprises a first suction cup and a second suction cup with adsorption surfaces facing each other, wherein the first suction cup and the second suction cup both have a hinged end and an opening and closing end located on opposite sides, the hinged end of the first suction cup and the hinged end of the second suction cup are hinged to each other, a first vacuum hole layout area for adsorbing a first object is provided on the adsorption surface of the first suction cup, the first vacuum hole layout area extends from the opening and closing end of the first suction cup to the hinged end, a second vacuum hole layout area for adsorbing a second object is provided on the adsorption surface of the second suction cup, and the second vacuum hole layout area is close to the opening and closing end of the second suction cup.

2. The demoulding device according to claim 1, characterized in that: It also includes a base for horizontal placement, the base is provided with a hollow area, the hollow area can accommodate the first suction cup and the second suction cup, the hollow area is provided with a supporting base plate for supporting the back side of the first suction cup, the first suction cup is installed on the supporting base plate, and the base is provided with a hinge seat for the second suction cup to be hinged.

3. The demoulding device according to claim 2, characterized in that: A first vacuum chamber is provided in the first suction cup, a first suction hole for connecting to a suction device is provided on the back side of the first suction cup, a plurality of annular grooves which are sequentially arranged from the inside to the outside are provided on the first vacuum hole layout area, the center of the annular groove coincides with the center of the first vacuum hole layout area, the plurality of annular grooves are connected by a cross groove, a first vacuum hole is provided in the cross groove, and the first suction hole and the first vacuum hole are both connected to the first vacuum chamber.

4. The demoulding device according to claim 2, characterized in that: A second vacuum cavity is provided in the second suction cup, a second suction hole for connecting with a suction device is provided on the side wall of the second suction cup, a second vacuum hole is provided in the second vacuum hole layout area, and the second suction hole and the second vacuum hole are both connected to the second vacuum cavity.

5. The demoulding device according to claim 4, characterized in that: The second suction cup is provided with an observation port capable of revealing the first suction cup.

6. The demoulding device according to claim 4, characterized in that: A hinge shaft is arranged on the side wall of the second suction cup, and a hinge groove for hinge connection of the hinge shaft is arranged on the hinge seat.

7. The demoulding device according to claim 4, characterized in that: The cam is connected to the second suction cup by a driving mechanism for driving the second suction cup to rotate. The cam is provided with a mounting groove. The driving mechanism comprises a hinge block, a driving motor and two lead screw nuts. The screw of the lead screw nut is rotatably connected in the mounting groove. The screw is driven by the driving motor. The nut of the lead screw nut is provided with hinged ears. A connecting rod is hinged on the hinged ears. The connecting rods on the two lead screw nuts are hinged to the two ends of the hinge block respectively. A connecting block for being hinged to the hinge block is fixed on the opening and closing end of the second suction cup. The axis of the screw is parallel to the axis of the hinge end of the first suction cup. The axis of the connecting block is parallel to the axis of the screw. The axis of the connecting rod is perpendicular to the axis of the screw and the axis of the opening and closing end of the second suction cup.

8. The demoulding device according to claim 7, characterized in that: It also includes a suction device and a control device, wherein the control device is electrically connected to the suction device and the drive motor.

9. The demoulding device according to claim 8, characterized in that: The control device comprises a computer host, a display and a motor controller, and the computer host is electrically connected to the display and the motor controller respectively.

10. A method for demoulding a wafer product, characterized in that: The demoulding device according to any one of claims 1 to 9 comprises the following steps: S1, the first suction cup is placed horizontally, and the second suction cup is located above the first suction cup; S2, placing and adsorbing the wafer glass and the reprint template bonded together by glue on the first vacuum hole layout area of ​​the first suction cup, with the wafer glass facing the first vacuum hole layout area, a release agent is applied between the reprint template and the glue in advance, and an adhesion promoter is applied between the wafer glass and the glue in advance; S3, rotating the second suction cup toward the first suction cup, so that the second vacuum hole arrangement area absorbs the reprint template; S4, rotating the second suction cup away from the first suction cup until the reprint template is separated from the wafer glass.

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