Injection molding equipment for memory card processing and operation method thereof

Abstract

The invention discloses an injection molding device for processing a memory card and an operation method thereof, and relates to the technical field of injection molding processing of memory cards. The injection molding device comprises a base, a lower mold base is fixedly arranged on the base, an upper mold base is correspondingly arranged on the lower mold base, an injection molding cavity is provided on the lower mold base, a lifting module is also arranged on the base, and the lifting module is used to drive the upper mold base and the lower mold base to close or demold; at least one group of injection molding channels is provided on the upper mold base, an injection molding tube is slidably embedded in the injection molding channel, the injection molding tube is connected to a driving module that drives it to slide along the injection molding channel, an injection molding end head is fixedly arranged at the bottom end of the injection molding tube, and a material feeding channel is provided at the axial end of the injection molding end head; wherein a plug for closing the material feeding channel is also arranged in the injection molding tube; the invention drives the plug head to rise and separate from the material feeding channel by the plugging module, so that the returned material in the injection molding tube can be discharged and collected and recycled, and the invention will not generate the phenomenon of returned material in the injection molding channel.

Description

Technical Field

[0001] The present invention relates to the technical field of memory card injection molding processing, and in particular to an injection molding device for memory card processing and an operating method thereof. Background Art

[0002] Injection molding is required during the processing of memory cards. Injection molding technology is mainly used to produce the plastic shell of memory cards. The plastic shell plays a supporting, protective and connecting role during the assembly process of the memory card. Through injection molding, the shape, size and precision of the plastic shell can be precisely controlled to meet the manufacturing requirements of the memory card.

[0003] The injection molding process of the memory card shell is as follows: adding dried plastic particles into the hopper of the injection molding machine; heating the plastic particles to a molten state through the heating of the injection molding machine and the action of the screw extruder; injecting the molten plastic into the cavity of the mold under high pressure; the molten plastic in the mold is cooled and solidified in the mold; after cooling and solidification, the mold is opened and the injection molded product is taken out of the mold.

[0004] Please refer to the attached figure in the instruction manual. Figure 1 During the injection molding process, in order to ensure that the molten plastic can fill the entire molding cavity and make the shell molding more uniform, the amount of material input into the cavity is usually greater than the amount of material required for the molding of the memory card shell, which will cause part of the molten plastic to flow back into the casting channel. These residual plastics are usually called residual materials or return materials. After cooling and molding and demolding, these return materials are integrally molded with the shell and need to be cut off; their existence will not only cause material waste, but also during the cooling and molding process, these plastics will adhere to the casting channel, causing the casting channel to be blocked, and the existing technology can only be cleaned by disassembling the mold or air flow cleaning, which is more cumbersome.

[0005] For details, please refer to the patent document with announcement number CN117790397B, which discloses a multi-layer memory chip packaging device and its working method. It also discloses that an injection hole is opened between the top and the bottom of the upper mold base, and an air hole is opened on one side of the injection hole. Therefore, when the molten plastic is input, some excess material will flow back into the injection hole and the air hole, causing blockage. Summary of the invention

[0006] The purpose of the present invention is to provide an injection molding device for memory card processing and an operation method thereof, so as to solve the following technical problems:

[0007] During the injection molding process of the memory card housing, some plastic will flow back into the casting channel, making it difficult to clean.

[0008] The purpose of the present invention can be achieved through the following technical solutions:

[0009] An injection molding device for processing a memory card comprises a base, a lower mold base is fixedly arranged on the base, an upper mold base is correspondingly arranged on the lower mold base, an injection molding cavity is opened on the lower mold base, and a lifting module is also arranged on the base, and the lifting module is used to drive the upper mold base and the lower mold base to close or release the mold;

[0010] At least one group of injection channels is provided on the upper mold base, an injection tube is slidably embedded in the injection channel, the injection tube is connected to a driving module that drives it to slide along the injection channel, an injection end is fixedly arranged at the bottom end of the injection tube, and a material conveying channel is provided at the axial end of the injection end;

[0011] Among them, a plug for closing the material delivery channel is also arranged in the injection molding tube, and the plug is connected to a plugging module that drives it to move along the axial end of the injection molding tube.

[0012] Preferably, a blocking plate is fixedly arranged at the bottom of the injection channel, and a through groove for passing the injection end head is opened at the central end of the blocking plate;

[0013] Wherein, an annular plate is fixedly arranged on the outer wall of the injection channel, and the outer diameter of the annular plate is larger than the inner diameter of the through groove and smaller than the inner diameter of the injection channel.

[0014] Preferably, a positioning plate is fixedly arranged on the top of the injection molding tube, a material delivery tube is fixedly arranged on the plug, and the top of the material delivery tube slides through the top wall of the injection molding tube and is fixed to the adjustment plate;

[0015] Wherein, the blocking module includes a first cylinder fixedly arranged at the bottom of the positioning plate, and a driving end of the first cylinder is fixed to the adjustment plate.

[0016] Preferably, both ends of the adjustment plate are provided with injection ports connected to the material delivery pipe;

[0017] Among them, a plurality of groups of discharge grooves are arranged in a circumferential array on the pipe wall of the feed pipe close to the plug.

[0018] Preferably, a first translation mechanism is fixedly arranged on the upper mold base, a translation plate is fixedly arranged on the driving end of the first translation mechanism, the driving module includes a second cylinder fixedly arranged on the translation plate, and the driving end of the second cylinder is fixed to the positioning plate.

[0019] Preferably, a plurality of exhaust channels are provided at the bottom of the injection cavity, and an air cylinder connected to the exhaust channel is fixedly arranged at the bottom of the lower mold base, an air plug is slidably arranged in the air cylinder, and the air plug is connected to an adjusting module that drives it to slide in the air cylinder.

[0020] Preferably, the adjustment module comprises a gas rod fixed on the gas plug, the diameter of the gas rod is smaller than the inner diameter of the air extraction channel, the gas rod extends to the top of the lower die base, a lifting frame is arranged at the bottom of the lower die base, and each gas plug is fixed to the lifting frame by a connecting rod;

[0021] Wherein, a guide rod is fixedly arranged between the lower die seat and the base, a lifting rod fixed to the lifting frame is provided on the sliding sleeve of the guide rod, and a first spring is provided on the guide rod.

[0022] Preferably, a rectangular groove is provided on the lower mold base at the periphery of the injection cavity, and a rectangular plate for engaging with the rectangular groove is fixedly arranged on one side of the upper mold base close to the lower mold base.

[0023] Preferably, a plunger is fixedly arranged at the top of the gas rod, and the lifting module includes a lifting frame fixedly arranged on the base, a screw is rotatably arranged in the lifting frame, and the screw is fixed to the output end of a servo motor fixedly arranged at the bottom of the lifting frame;

[0024] Among them, a nut is spirally sleeved on the screw, a driving seat is fixedly arranged on the side of the upper mold seat close to the screw, a driving rod is fixedly arranged on one side of the nut, the driving seat is slidably sleeved on the driving rod, a second spring is provided on the driving rod, and the lifting rod extends from one end of the lifting frame to below the driving rod.

[0025] A method for operating an injection molding device for processing a memory card, comprising the following steps:

[0026] The driving module drives the injection tube to be embedded in the injection channel, and the injection end protrudes to the outside of the injection channel;

[0027] The lifting module drives the upper die base and the lower die base to close the mold;

[0028] The injection molding machine inputs the molten plastic into the injection molding tube, and the molten plastic passes through the feeding channel into the injection molding cavity;

[0029] After the injection is completed, the plugging head is driven down by the plugging module so that the lower surface of the plugging head is flush with the upper surface of the injection end head;

[0030] The driving module drives the injection tube to rise so that the lower surface of the injection end is flush with the lower surface of the upper mold base;

[0031] The plugging module drives the plug to descend until it is completely embedded in the feed channel, so as to push the molten plastic in the feed channel into the injection molding cavity;

[0032] Before cooling, the driving module drives the injection tube to rise and separate from the injection channel, and the plugging module drives the plug to rise and separate from the material delivery channel, so that the return material in the injection tube is discharged and collected and recycled;

[0033] After cooling and molding, the lifting module drives the upper mold base and the lower mold base to demold, and the molded memory card shell is taken out.

[0034] Beneficial effects of the present invention:

[0035] After the driving module of the present invention drives the injection molding tube to be embedded in the injection molding channel, the injection molding end head protrudes to the outside of the injection molding channel. When the injection is completed, the plugging module drives the plug to descend so that the lower surface of the plug is flush with the upper surface of the injection molding end head, and the molten plastic in the injection molding tube will no longer enter the injection molding channel. At this time, the driving module drives the injection molding tube to rise so that the lower surface of the injection molding end head is flush with the lower surface of the upper mold base, and finally the plugging module drives the plug to descend until it is completely embedded in the feed channel, so as to completely push the molten plastic in the feed channel into the injection molding cavity, so as to make up for the injection end The space occupied by the head in the injection molding cavity before it rises makes the amount of molten plastic in the injection molding cavity completely equal to the amount of molten plastic required for molding the memory card shell. At the same time, no return material will be formed on the surface of the memory card shell after molding, so no cutting process is required. Before cooling, the injection molding tube is driven to rise and separate from the injection molding channel by the driving module, and then the plugging head is driven to rise and separate from the feeding channel by the blocking module, so that the return material in the injection molding tube can be discharged and collected and recycled. Therefore, the present invention will not generate the phenomenon of return material in the injection molding channel, and there is no need to clean the injection molding channel regularly.

[0036] When the upper mold base and the lower mold base of the present invention are molded together, the air plug can be driven to slide downward in the air cylinder by adjusting the module group, thereby generating negative pressure in the air cylinder, so that the gas in the injection cavity can be sucked into the air cylinder through the exhaust channel, thereby preventing the gas in the injection cavity from affecting the injection quality;

[0037] When driving the upper die seat and the lower die seat to close the mold, the present invention can drive the screw to rotate through the servo motor, and the nut can drive the upper die seat to approach the lower die seat through the driving rod and the driving seat during the movement of the screw. When the upper die seat and the lower die seat are closed, the plunger is not yet embedded in the exhaust channel. The present invention can further drive the nut to descend through the screw, and the driving rod can press the lifting rod to descend during the descent. During this process, the second spring contracts to generate elastic force, and the lifting rod drives the gas rod to descend through the lifting frame, so that the plunger can be embedded in the exhaust channel. The upper surface of the plunger can be flush with the top of the exhaust channel. On the one hand, the effect of closing the exhaust channel can be achieved, and on the other hand, the surface of the memory card shell can be smoother during molding, and no secondary grinding process is required. When the upper die seat rises, the second spring can automatically drive the components to reset. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention will be further described below in conjunction with the accompanying drawings.

[0039] Figure 1 It is a schematic diagram of the structure when the recycled material is generated in the prior art of the present invention;

[0040] Figure 2 It is a structural schematic diagram of an injection molding device for processing a memory card according to the present invention;

[0041] Figure 3 It is a schematic structural diagram of a memory card processing injection molding device during demoulding of the present invention;

[0042] Figure 4 It is a structural schematic diagram of an upper mold base in an injection molding device for processing a memory card according to the present invention;

[0043] Figure 5 It is a structural schematic diagram of a rectangular plate in an injection molding device for processing a memory card according to the present invention;

[0044] Figure 6 It is a structural schematic diagram of a mold base cut in a memory card processing injection molding device of the present invention;

[0045] Figure 7 The present invention Figure 6 The structural diagram of the enlarged part at A in the middle;

[0046] Figure 8 It is a structural schematic diagram of an injection molding tube in a memory card processing injection molding device of the present invention when it is cut;

[0047] Fig. 9 It is a structural schematic diagram of a lower mold base cut in a memory card processing injection molding device of the present invention;

[0048] Fig.10 It is a schematic diagram of the cross-section structure of a memory card processing injection molding device during demoulding of the present invention;

[0049] Fig.11 It is a schematic diagram of the cross-section structure of an injection molding device for processing a memory card according to the present invention when the mold is closed;

[0050] Fig.12 It is a structural schematic diagram of a memory card processing injection molding device of the present invention when the plug is separated from the material feeding channel;

[0051] Fig.13 It is a structural schematic diagram of a memory card processing injection molding device of the present invention when a plug is embedded in a material feeding channel;

[0052] Fig.14 The invention discloses a schematic structural diagram of an injection molding end head in an injection molding device for processing a memory card.

[0053] In the figure: 1, base; 2, screw; 3, upper die seat; 4, lower die seat; 5, blocking plate; 6, plunger; 101, transmission mechanism; 102, lifting frame; 103, second translation mechanism; 104, moving plate; 105, third cylinder; 106, suction cup; 107, collection box; 201, servo motor; 202, nut; 203, driving rod; 204, driving seat; 205, second spring; 206, lifting rod; 207, guide rod; 208, first spring; 301, first translation mechanism; 302, translation plate; 30 3. Second cylinder; 304. Adjustment plate; 305. Injection port; 306. Positioning plate; 307. Injection tube; 308. Injection channel; 309. First cylinder; 310. Feed pipe; 311. Discharge chute; 312. Plug; 401. Limit rod; 402. Injection cavity; 403. Rectangular groove; 404. Exhaust channel; 405. Rectangular plate; 406. Air cylinder; 407. Lifting frame; 408. Air plug; 501. Injection end; 502. Feed channel; 503. Annular plate; 504. Through groove; 601. Air rod. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] Example 1

[0056] See also Figure 2-Figure 3 As shown, the present invention is an injection molding device for processing a memory card, comprising a base 1, a lower mold base 4 is fixedly arranged on the base 1, an upper mold base 3 is correspondingly arranged on the lower mold base 4, an injection cavity 402 for injection molding a memory card shell is opened on the lower mold base 4, and a lifting module is also arranged on the base 1, and the lifting module is used to drive the upper mold base 3 and the lower mold base 4 to close the mold or demold; specifically, during injection molding, the lifting module can be used to drive the upper mold base 3 and the lower mold base 4 to close the mold so that the injection cavity 402 forms a closed space, and the molten plastic is injected into the injection cavity 402 and cooled to form the memory card shell;

[0057] Correspondingly, after the memory card housing is formed, the lifting module drives the upper mold base 3 and the lower mold base 4 to demold, and the formed memory card housing is taken out.

[0058] In this embodiment, please refer to Figure 3-Figure 4At least one group of injection channels 308 is provided on the upper mold base 3, an injection tube 307 is slidably embedded in the injection channel 308, the injection tube 307 is connected to a driving module that drives it to slide along the injection channel 308, an injection end 501 is fixedly arranged at the bottom end of the injection tube 307, and a feeding channel 502 is provided at the axial end of the injection end 501, wherein a plug 312 for closing the feeding channel 502 is also arranged in the injection tube 307, and the plug 312 is connected to a plugging module that drives it to move along the axial end of the injection tube 307;

[0059] Exemplarily, in this embodiment, two groups of injection channels 308 are provided, and the specific number of the channels provided can be determined to meet actual injection molding requirements, and is not limited thereto.

[0060] It should be noted that, since a certain amount of molten plastic is also contained in the feeding channel 502, when the plug 312 is engaged with the feeding channel 502, in order to prevent the molten plastic in the feeding channel 502 from being pushed into the injection cavity 402 by the plug 312 and causing excessive pressure in the cavity, during injection molding, the driving module drives the injection tube 307 to be embedded in the injection channel 308, so that the injection end 501 protrudes to the outside of the injection channel 308 (see Figure 12-13 ), when the injection is completed, the plugging head 312 is driven down by the plugging module to make the lower surface of the plugging head 312 flush with the upper surface of the injection end 501, and the molten plastic in the injection tube 307 will no longer enter the injection channel 308. At this time, the injection tube 307 is driven up by the driving module to make the lower surface of the injection end 501 flush with the lower surface of the upper mold base 3, and finally the plugging head 312 is driven down by the plugging module until it is completely embedded in the material delivery channel 502 (see Fig.14 ), so as to completely push the molten plastic in the feed channel 502 into the injection cavity 402, so as to make up for the space occupied by the injection end head 501 in the injection cavity 402 before it rises, so that the amount of molten plastic in the injection cavity 402 is completely equal to the amount of molten plastic required for the molding of the memory card shell. At the same time, no return material will be formed on the surface of the memory card shell after molding, so no further cutting process is required; before cooling, this embodiment drives the injection tube 307 to rise and separate from the injection channel 308 through the driving module, and then drives the plug 312 to rise and separate from the feed channel 502 through the blocking module, so that the return material in the injection tube 307 can be discharged and collected and recycled. Therefore, this embodiment will not produce the phenomenon of return material in the injection channel 308, and there is no need to clean the injection channel 308 regularly.

[0061] It should also be noted that in order to ensure that the amount of molten plastic in the feed channel 502 is equal to the amount of molten plastic corresponding to the space occupied by the injection head 501 in the injection cavity 402 before the injection head 501 rises, in this embodiment, reference can be made to Fig.14 , preset:

[0062] The height of the material delivery channel 502 is H, the radius is r, and the volume of the material delivery channel 502 is V1;

[0063] V1=πr 2 H;

[0064] The height of the injection tip 501 protruding from the injection cavity 402 is h, the radius is R, and the volume of the injection tip 501 protruding from the injection cavity 402 is V2;

[0065] V2=πR 2 h;

[0066] Therefore, the values ​​of H, r, h and R can be set accordingly to satisfy V1=V2, and this embodiment does not limit their specific values.

[0067] Example 2

[0068] Based on Example 1, please refer to Figure 5 , Figure 7-Figure 8 , a blocking plate 5 is fixedly arranged at the bottom of the injection channel 308, and a through groove 504 for passing the injection terminal 501 is opened at the central end of the blocking plate 5, wherein an annular plate 503 is fixedly arranged on the outer wall of the injection channel 308, and the outer diameter of the annular plate 503 is larger than the inner diameter of the through groove 504 and smaller than the inner diameter of the injection channel 308; it can be explained that, in this embodiment, by arranging the annular plate 503 on the outer side of the injection terminal 501, when the injection terminal 501 protrudes into the injection cavity 402, the annular plate 503 just fits with the blocking plate 5, and then the length of the injection terminal 501 protruding into the injection cavity 402 can be limited, so as to prevent the length of the injection terminal 501 protruding into the injection cavity 402 from exceeding a preset value;

[0069] In addition, since the inner diameter of the injection channel 308 is larger than the diameter of the injection tube 307, when the injection tube 307 slides upward in the injection channel 308, external gas can enter the space enclosed by the injection channel 308 and the injection tube 307 to maintain air pressure balance, thereby preventing the injection tube 307 from drawing out the molten plastic in the injection cavity 402 when it rises.

[0070] In this embodiment, please refer to Figure 3-Figure 4 as well as Figure 7-Figure 8The top of the injection tube 307 is fixedly provided with a positioning plate 306, and the feed pipe 310 is fixedly provided on the plug 312. The top of the feed pipe 310 slides through the top wall of the injection tube 307 and is fixed to the adjustment plate 304, wherein the blocking module includes a first cylinder 309 fixedly provided at the bottom of the positioning plate 306, and the driving end of the first cylinder 309 is fixed to the adjustment plate 304; it can be explained that in this embodiment, the adjustment plate 304 can be driven to rise and fall by the first cylinder 309, and the adjustment plate 304 then drives the plug 312 to rise and fall in the injection tube 307 through the feed pipe 310, thereby blocking or opening the feed channel 502.

[0071] In addition, injection ports 305 connected to the feed pipe 310 are provided at both ends of the adjustment plate 304, wherein a plurality of discharge grooves 311 are provided in a circumferential array on the tube wall of the feed pipe 310 on the side of the plug 312; specifically, in this embodiment, when the molten plastic is input into the injection cavity 402, the injection molding machine first inputs the molten plastic into the feed pipe 310 through the injection port 305, and then inputs the molten plastic into the injection pipe 307 through the discharge groove 311, and finally discharges it into the injection cavity 402 through the feed channel 502.

[0072] As a further solution of this embodiment, please refer to Figure 2-Figure 4 , in order to facilitate the discharge and collection of the return material in the injection tube 307, in this embodiment, the first translation mechanism 301 is fixedly arranged on the upper mold base 3, and the driving end of the first translation mechanism 301 is fixedly arranged on the translation plate 302, and the driving module includes a second cylinder 303 fixedly arranged on the translation plate 302, and the driving end of the second cylinder 303 is fixed to the positioning plate 306; it can be explained that in this embodiment, during injection molding, the positioning plate 306 can be driven to rise and fall by the second cylinder 303, and the positioning plate 306 can synchronously drive the injection tube 307 to rise and fall, so as to achieve height adjustment of the injection tube 307. After the injection molding is completed, the second cylinder 303 lifts the injection tube 307 to the top of the upper mold base 3, and then the injection tube 307 is transferred to the side of the upper mold base 3 through the first translation mechanism 301, so as to facilitate the discharge of the molten plastic in the injection tube 307;

[0073] Correspondingly, a collection box 107 is provided on one side of the upper mold base 3, and the collection box 107 is fixed to the base 1 through a mounting frame; specifically, the first translation mechanism 301 can transfer the injection tube 307 to the collection box 107, and the return material in the injection tube 307 can be discharged into the collection box 107 for collection, so as to facilitate subsequent recycling.

[0074] As a further solution of this embodiment, please refer to Figure 3 , Figure 6 as well as Fig. 9During injection molding, the gas present in the injection molding cavity 402 may cause defects such as bubbles and pores to appear in the memory card shell after molding. At the same time, the gas generated during the injection molding process may contain acidic substances. If these substances are not removed in time, they may corrode the mold. In order to discharge the gas in the injection molding cavity 402, a plurality of exhaust channels 404 are opened at the bottom of the injection molding cavity 402, and a gas cylinder 406 connected to the exhaust channel 404 is fixedly arranged at the bottom of the lower mold base 4. A gas plug 408 is slidably arranged in the gas cylinder 406, and the gas plug 408 is connected to an adjusting module that drives it to slide in the gas cylinder 406. It can be explained that when the upper mold base 3 and the lower mold base 4 are molded together, the gas plug 408 can be driven by the adjusting module to slide downward in the gas cylinder 406, and then a negative pressure can be generated in the gas cylinder 406, so that the gas in the injection molding cavity 402 can be sucked into the gas cylinder 406 through the exhaust channel 404, so as to avoid the gas present in the injection molding cavity 402 affecting the injection molding quality.

[0075] In this embodiment, the adjustment module includes a gas rod 601 fixed on the gas plug 408, the diameter of the gas rod 601 is smaller than the inner diameter of the exhaust channel 404, so that the gas can flow through the gap between the gas rod 601 and the exhaust channel 404, the gas rod 601 extends to the top of the lower mold base 4, the bottom of the lower mold base 4 is provided with a lifting frame 407, each gas plug 408 is fixed to the lifting frame 407 through a connecting rod, wherein a guide rod 207 is fixedly arranged between the lower mold base 4 and the base 1, a lifting rod 206 fixed to the lifting frame 407 is provided on the guide rod 207, and a first spring 208 is provided on the guide rod 207 ; Specifically, one end of the first spring 208 is fixed to the lifting rod 206, and the other end is fixed to the lower mold base 4; it can be explained that as the upper mold base 3 moves in the direction of the lower mold base 4, the upper mold base 3 first abuts against the gas rod 601, and then the gas plug 408 can be driven to descend in the gas cylinder 406 through the gas rod 601 to generate negative pressure in the gas cylinder 406. During this process, the gas plug 408 drives the lifting rod 206 to slide on the guide rod 207 through the lifting frame 407 to stretch the first spring 208 and generate elastic force. When the upper mold base 3 is reset, the gas plug 408 and the gas rod 601 can be driven to reset synchronously.

[0076] As a further solution of this embodiment, a rectangular groove 403 is opened on the lower mold base 4 at the periphery of the injection cavity 402, and a rectangular plate 405 for engaging with the rectangular groove 403 is fixedly arranged on the side of the upper mold base 3 close to the lower mold base 4; it can be explained that before the upper mold base 3 and the lower mold base 4 are molded, the rectangular plate 405 is first embedded in the rectangular groove 403, so that a closed space can be formed between the upper mold base 3 and the lower mold base 4 by the rectangular plate 405, and when the upper mold base 3 continues to move, the gas rod 601 can be pressed down to draw the gas in the enclosed air into the gas cylinder 406, thereby, the original gas in the injection cavity 402 can be completely extracted before the mold is closed.

[0077] It should be noted that, before the upper mold base 3 descends, the injection molding machine needs to seal the injection port 305 to prevent the gas from entering the injection cavity 402 again through the injection port 305 during vacuuming.

[0078] Furthermore, when the upper mold base 3 and the lower mold base 4 are molded together, in order to prevent the gas drawn into the gas cylinder 406 from flowing back into the injection cavity 402, in this embodiment, refer to Figure 2-Figure 3 , Figure 6 , Fig. 9 as well as Fig.11 , a plunger 6 is fixedly arranged at the top of the gas rod 601, and the lifting module includes a lifting frame 102 fixedly arranged on the base 1, a screw rod 2 is rotatably arranged in the lifting frame 102, and the screw rod 2 is fixed to the output end of the servo motor 201 fixedly arranged at the bottom of the lifting frame 102, wherein a nut 202 is spirally sleeved on the screw rod 2, a driving seat 204 is fixedly arranged on one side of the upper mold base 3 close to the screw rod 2, a driving rod 203 is fixedly arranged on one side of the nut 202, and the driving seat 204 is slidably sleeved on the driving rod 203, and a second spring 205 is provided on the driving rod 203, one end of the second spring 205 is fixed to the driving seat 204, and the other end is fixed to the top of the driving rod 203, and the end of the lifting rod 206 away from the lifting frame 407 extends to the bottom of the driving rod 203, and a protrusion for limiting the driving seat 204 from sliding downward is also fixedly arranged on the driving rod 203; it can be explained that when driving the upper mold base 3 and the lower mold base 4 to close the mold, the The servo motor 201 drives the screw rod 2 to rotate. During the movement of the nut 202 on the screw rod 2, the upper mold base 3 is driven to approach the lower mold base 4 through the driving rod 203 and the driving seat 204. When the upper mold base 3 and the lower mold base 4 are molded, the plunger 6 is still not embedded in the exhaust channel 404. In this embodiment, the nut 202 can be further driven to descend through the screw rod 2. The driving rod 203 can press the lifting rod 206 to descend during the descent process. During this process, the second spring 205 contracts to generate elastic force. The lifting rod 206 drives the gas rod 601 to descend through the lifting frame 407 to embed the plunger 6 in the exhaust channel 404. The upper surface of the plunger 6 can be flush with the top of the exhaust channel 404. On the one hand, the effect of closing the exhaust channel 404 can be achieved. On the other hand, the surface of the memory card shell can be smoother during molding, and no secondary grinding is required. When the upper mold base 3 rises, the second spring 205 can automatically drive each component to reset.

[0079] In addition, at least two groups of limiting rods 401 for sliding connection with the upper mold base 3 are fixedly arranged on the lower mold base 4 to improve the stability of the upper mold base 3 when it is raised or lowered.

[0080] In order to output the formed memory card housing, in this embodiment, refer to Figure 1A second translation mechanism 103 is also arranged on the base 1, and a driving end of the second translation mechanism 103 is fixed to the moving plate 104, and a third cylinder 105 is fixedly arranged on the end of the moving plate 104, and a plurality of groups of suction cups 106 are fixedly arranged on the driving end of the third cylinder 105, wherein a conveying mechanism 101 is also arranged on the base 1 to output the formed memory card shell; it can be explained that after the memory card shell is formed, as the upper die seat 3 is separated from the lower die seat 4, the gas rod 601 can be reset and raised under the elastic force of the first spring 208, thereby lifting the memory card shell to a certain height, and in this embodiment, the suction cup 106 can be driven to move above the memory card shell by the second translation mechanism 103, and the third cylinder 105 can drive the suction cup 106 to adsorb the memory card shell, thereby transferring the formed memory card shell to the conveying mechanism 101 and outputting it.

[0081] A method for operating an injection molding device for processing a memory card, comprising the following steps:

[0082] S1. The driving module drives the injection tube 307 to be embedded in the injection channel 308, and the injection end 501 protrudes to the outside of the injection channel 308 (see Figure 12-13 );

[0083] See also Figure 2-Figure 3 , S2, the lifting module drives the upper die base 3 and the lower die base 4 to close the mold;

[0084] S3, the injection molding machine inputs the molten plastic into the injection tube 307, and the molten plastic passes through the feeding channel 502 and enters the injection cavity 402;

[0085] See also Figure 6-Figure 8 After the injection is completed, the plug 312 is driven down by the plugging module so that the lower surface of the plug 312 is flush with the upper surface of the injection end 501;

[0086] S5, the driving module drives the injection tube 307 to rise, so that the lower surface of the injection end 501 is flush with the lower surface of the upper mold base 3;

[0087] S6. The plugging module drives the plug 312 to descend until it is completely embedded in the feed channel 502 (see Fig.14 ), so as to push the molten plastic in the feed channel 502 into the injection cavity 402;

[0088] S6. Before cooling, the driving module drives the injection tube 307 to rise and separate from the injection channel 308, and the blocking module drives the plug 312 to rise and separate from the material delivery channel 502, so that the return material in the injection tube 307 is discharged and collected and recycled;

[0089] S7. After cooling and molding, the lifting module drives the upper mold base 3 and the lower mold base 4 to demold, and the molded memory card housing is taken out.

[0090] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0091] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0092] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An injection molding device for processing a memory card, comprising a base (1), a lower mold base (4) being fixedly arranged on the base (1), an upper mold base (3) being correspondingly arranged on the lower mold base (4), an injection molding cavity (402) being provided on the lower mold base (4), and a lifting module being arranged on the base (1), the lifting module being used to drive the upper mold base (3) and the lower mold base (4) to engage in mold closing or demolding; It is characterized in that At least one group of injection channels (308) is provided on the upper mold base (3), an injection tube (307) is slidably embedded in the injection channel (308), the injection tube (307) is connected to a driving module that drives it to slide along the injection channel (308), an injection end head (501) is fixedly arranged at the bottom end of the injection tube (307), and a material conveying channel (502) is provided at the axial end of the injection end head (501); The injection tube (307) is also provided with a plug (312) for closing the material delivery channel (502), and the plug (312) is connected to a plugging module that drives it to move along the axial end of the injection tube (307); a plurality of exhaust channels (404) are provided at the bottom of the injection cavity (402), and a gas cylinder (406) that is connected to the exhaust channel (404) is correspondingly fixedly provided at the bottom of the lower mold base (4), and a gas plug (408) is slidably provided in the gas cylinder (406), and the gas plug (408) is connected to an adjustment module that drives it to slide in the gas cylinder (406); The regulating module comprises a gas rod (601) fixed on the gas plug (408); the diameter of the gas rod (601) is smaller than the inner diameter of the air extraction channel (404); the gas rod (601) extends to the top of the lower die base (4); a lifting frame (407) is arranged at the bottom of the lower die base (4); and each gas plug (408) is fixed to the lifting frame (407) via a connecting rod; A guide rod (207) is fixedly arranged between the lower die seat (4) and the base (1), a lifting rod (206) fixed to a lifting frame (407) is provided on a sliding sleeve on the guide rod (207), and a first spring (208) is provided on the guide rod (207).

2. The memory card processing injection molding device according to claim 1, characterized in that: A blocking plate (5) is fixedly arranged at the bottom of the injection channel (308), and a through groove (504) for passing the injection end head (501) is formed at the central end of the blocking plate (5); Wherein, an annular plate (503) is fixedly arranged on the outer wall of the injection channel (308), and the outer diameter of the annular plate (503) is larger than the inner diameter of the through groove (504) and smaller than the inner diameter of the injection channel (308).

3. The memory card processing injection molding device according to claim 1, characterized in that: A positioning plate (306) is fixedly arranged on the top of the injection molding tube (307), a material delivery tube (310) is fixedly arranged on the plug (312), and the top of the material delivery tube (310) slides through the top wall of the injection molding tube (307) and is fixed to the adjustment plate (304); The blocking module comprises a first cylinder (309) fixedly arranged at the bottom of the positioning plate (306), and a driving end of the first cylinder (309) is fixed to the adjustment plate (304).

4. The memory card processing injection molding device according to claim 3, characterized in that: Both ends of the adjustment plate (304) are provided with injection ports (305) connected to the material delivery pipe (310); A plurality of groups of discharge grooves (311) are provided in a circumferential array on the pipe wall of the feed pipe (310) on the side close to the plug (312).

5. The memory card processing injection molding device according to claim 3, characterized in that: A first translation mechanism (301) is fixedly arranged on the upper die seat (3); a translation plate (302) is fixedly arranged on the driving end of the first translation mechanism (301); the driving module comprises a second cylinder (303) fixedly arranged on the translation plate (302); and the driving end of the second cylinder (303) is fixed to the positioning plate (306).

6. The injection molding equipment for processing memory cards according to claim 1, characterized in that: A rectangular groove (403) is provided on the lower mold base (4) at the periphery of the injection cavity (402), and a rectangular plate (405) for engaging with the rectangular groove (403) is fixedly arranged on one side of the upper mold base (3) close to the lower mold base (4).

7. The injection molding equipment for processing memory cards according to claim 1, characterized in that: A plunger (6) is fixedly arranged at the top of the gas rod (601), and the lifting module comprises a lifting frame (102) fixedly arranged on the base (1), a screw rod (2) is rotatably arranged in the lifting frame (102), and the screw rod (2) is fixed to the output end of a servo motor (201) fixedly arranged at the bottom of the lifting frame (102); The screw rod (2) is spirally sleeved with a nut (202); a driving seat (204) is fixedly arranged on one side of the upper die seat (3) close to the screw rod (2); a driving rod (203) is fixedly arranged on one side of the nut (202); the driving seat (204) is slidably sleeved on the driving rod (203); a second spring (205) is provided on the driving rod (203); and an end of the lifting rod (206) away from the lifting frame (407) extends to below the driving rod (203).

8. A method for operating an injection molding device for processing a memory card, characterized in that: The memory card processing injection molding device according to any one of claims 1 to 7 further comprises the following steps: The driving module drives the injection tube (307) to be embedded in the injection channel (308), and the injection end (501) protrudes to the outside of the injection channel (308); The lifting module drives the upper die base (3) and the lower die base (4) to close the mold; The injection molding machine inputs the molten plastic into the injection molding tube (307), and the molten plastic passes through the material delivery channel (502) and enters the injection molding cavity (402); After the injection is completed, the plug (312) is driven downward by the plugging module so that the lower surface of the plug (312) is flush with the upper surface of the injection end (501); The driving module drives the injection tube (307) to rise so that the lower surface of the injection end (501) is flush with the lower surface of the upper mold base (3); The plugging module drives the plug (312) to descend until it is completely embedded in the material delivery channel (502) so as to push the molten plastic in the material delivery channel (502) into the injection molding cavity (402); Before cooling, the driving module drives the injection tube (307) to rise and separate from the injection channel (308), and the plugging module drives the plug (312) to rise and separate from the material delivery channel (502), so that the return material in the injection tube (307) is discharged and collected and recycled; After cooling and molding, the lifting module drives the upper mold base (3) and the lower mold base (4) to demould, and the molded memory card housing is taken out.

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