Ink for testing semiconductor chip and production method thereof

Abstract

The invention discloses ink for testing a semiconductor chip and a production method of the ink. The ink for testing the semiconductor chip comprises the following raw materials in percentage: 20-30% of phenoxy resin particles, 55-70% of a diacetone alcohol mixed solvent, 5-10% of a coloring agent and 5% of other additives. According to the ink prepared by the invention, the adhesion performance and the anti-flushing performance are greatly improved, in addition, the effective time is greatly prolonged, the wall hanging condition is also improved, and the utilization rate of a single ink tube is increased.

Description

Technical Field

[0001] The present invention relates to the field of ink technology, and in particular to an ink for semiconductor chip testing and a production method thereof. Background Art

[0002] Semiconductor chip testing ink is an ink used on semiconductor chips. The ink has a short shelf life, resulting in high cost of use. In addition, the ink has poor viscosity and is prone to fall off the semiconductor chip. Based on this, we propose a semiconductor chip testing ink and a production method thereof. Summary of the invention

[0003] Based on the technical problems existing in the background technology, the present invention proposes an ink for semiconductor chip testing and a production method thereof.

[0004] The present invention provides a semiconductor chip testing ink, comprising the following raw materials in the following percentages:

[0005] Phenoxy resin particles 20-30%,

[0006] Diacetone alcohol mixed solvent 55-70%,

[0007] Dye 5-10%,

[0008] Other additives 5%.

[0009] Preferably, the following percentages of raw materials are included:

[0010] Phenoxy resin particles 22-28%,

[0011] Diacetone alcohol mixed solvent 57-68%,

[0012] Dye 6-9%,

[0013] Other additives 5%.

[0014] Preferably, the following percentages of raw materials are included:

[0015] Phenoxy resin particles 25%,

[0016] Diacetone alcohol mixed solvent 62.5%,

[0017] Dye 7.5%,

[0018] Other additives 5%.

[0019] The present invention also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0020] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0021] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 50-60° C., then heating it at a constant temperature for 3-5 hours to wait for the phenoxy resin particles to be completely dissolved, and then cooling it to room temperature to obtain dissolved phenoxy resin;

[0022] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by a stirring device until the dye and other additives are completely dissolved, thereby obtaining ink for semiconductor chip testing;

[0023] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0024] Preferably, in S2, the heating stage can be heated to 53-57°C, preferably to 55°C.

[0025] Preferably, in S3, the stirring device is an electric stirrer.

[0026] Preferably, in S3, while the stirring device is stirring the phenoxy resin to which the dye and other additives are added, the stirring device can also perform a heating operation.

[0027] Compared with the existing technology, the ink prepared by the present invention has greatly improved viscosity and anti-washing properties. In addition, its effective time is greatly extended, the wall hanging situation is also improved, and the utilization rate of a single ink tube is increased. DETAILED DESCRIPTION

[0028] The present invention will be further explained below in conjunction with specific embodiments.

[0029] Example 1

[0030] This embodiment provides a semiconductor chip testing ink, which includes the following raw materials in percentages:

[0031] Phenoxy resin particles 20%,

[0032] Diacetone alcohol mixed solvent 70%,

[0033] Coloring agent 5%,

[0034] Other additives 5%.

[0035] This embodiment also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0036] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0037] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 50° C., then heating it at a constant temperature for 3-5 hours to wait for the phenoxy resin particles to be completely dissolved, and then cooling it to room temperature to obtain dissolved phenoxy resin;

[0038] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by using a stirring device. During the stirring of the phenoxy resin with the dye and other additives by the stirring device, the stirring device can be heated at the same time until the dye and other additives are completely dissolved to obtain ink for semiconductor chip testing, wherein the stirring device is an electric stirrer;

[0039] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0040] Example 2

[0041] This embodiment provides a semiconductor chip testing ink, which includes the following raw materials in percentages:

[0042] Phenoxy resin particles 22%,

[0043] Diacetone alcohol mixed solvent 67%,

[0044] Dye 6%,

[0045] Other additives 5%.

[0046] This embodiment also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0047] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0048] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 53° C., then heating it at a constant temperature for 3-5 hours to wait for the phenoxy resin particles to be completely dissolved, and then cooling it to room temperature to obtain dissolved phenoxy resin;

[0049] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by using a stirring device. During the stirring of the phenoxy resin with the dye and other additives by the stirring device, the stirring device can be heated at the same time until the dye and other additives are completely dissolved to obtain ink for semiconductor chip testing, wherein the stirring device is an electric stirrer;

[0050] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0051] Example 3

[0052] This embodiment provides a semiconductor chip testing ink, which includes the following raw materials in percentages:

[0053] Phenoxy resin particles 25%,

[0054] Diacetone alcohol mixed solvent 62.5%,

[0055] Dye 7.5%,

[0056] Other additives 5%.

[0057] This embodiment also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0058] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0059] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 55° C., then heating it at a constant temperature for 3-5 hours and waiting for the phenoxy resin particles to be completely dissolved until the temperature cools to room temperature, thereby obtaining dissolved phenoxy resin;

[0060] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by using a stirring device. During the stirring of the phenoxy resin with the dye and other additives by the stirring device, the stirring device can be heated at the same time until the dye and other additives are completely dissolved to obtain ink for semiconductor chip testing, wherein the stirring device is an electric stirrer;

[0061] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0062] Example 4

[0063] This embodiment provides a semiconductor chip testing ink, which includes the following raw materials in percentages:

[0064] Phenoxy resin particles 28%,

[0065] Diacetone alcohol mixed solvent 58%,

[0066] Dye 9%,

[0067] Other additives 5%.

[0068] This embodiment also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0069] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0070] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 57° C., then heating it at a constant temperature for 3-5 hours and waiting for the phenoxy resin particles to be completely dissolved until the temperature cools to room temperature, thereby obtaining dissolved phenoxy resin;

[0071] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by using a stirring device. During the stirring of the phenoxy resin with the dye and other additives by the stirring device, the stirring device can be heated at the same time until the dye and other additives are completely dissolved to obtain ink for semiconductor chip testing, wherein the stirring device is an electric stirrer;

[0072] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0073] Example 5

[0074] This embodiment provides a semiconductor chip testing ink, which includes the following raw materials in percentages:

[0075] Phenoxy resin particles 30%,

[0076] Diacetone alcohol mixed solvent 55%,

[0077] Dye 10%,

[0078] Other additives 5%.

[0079] This embodiment also provides a method for producing ink for semiconductor chip testing, comprising the following steps:

[0080] S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container;

[0081] S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 60° C., then heating it at a constant temperature for 3-5 hours and waiting for the phenoxy resin particles to be completely dissolved until the temperature cools to room temperature, thereby obtaining dissolved phenoxy resin;

[0082] S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by using a stirring device. During the stirring of the phenoxy resin with the dye and other additives by the stirring device, the stirring device can be heated at the same time until the dye and other additives are completely dissolved to obtain ink for semiconductor chip testing, wherein the stirring device is an electric stirrer;

[0083] S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

[0084] The inks prepared in Examples 1-5 were baked in an oven at 250° C. for half an hour. The inks could firmly adhere to the chip and the color did not fade. In addition, the inks were firmly adhered to the chip even after being washed with a high-pressure water gun. The inks prepared in Examples 1-5 were compared with conventional inks as shown in the following table:

[0085]

[0086]

[0087] It can be seen from the above table that the ink prepared by the present invention has greatly improved adhesive properties and anti-washing properties, and its effective time is also greatly extended, among which Example 3 is the best example.

[0088] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip testing ink, characterized in that: The following percentages of raw materials are included: Phenoxy resin particles 20-30%, Diacetone alcohol mixed solvent 55-70%, Dye 5-10%, Other additives 5%.

2. The semiconductor chip testing ink according to claim 1, characterized in that: The following percentages of raw materials are included: Phenoxy resin particles 22-28%, Diacetone alcohol mixed solvent 57-68%, Dye 6-9%, Other additives 5%.

3. The semiconductor chip testing ink according to claim 1, characterized in that: The following percentages of raw materials are included: Phenoxy resin particles 25%, Diacetone alcohol mixed solvent 62.5%, Dye 7.5%, Other additives 5%.

4. A method for producing ink for semiconductor chip testing according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1: firstly, phenoxy resin particles are poured into a glass container, and then a diacetone alcohol mixed solvent is poured into the glass container; S2: placing the glass container containing the diacetone alcohol mixed solvent and phenoxy resin particles in S1 on a heating table and heating it to 50-60° C., then heating it at a constant temperature for 3-5 hours to wait for the phenoxy resin particles to be completely dissolved, and then cooling it to room temperature to obtain dissolved phenoxy resin; S3: adding a dye and other additives in proportion to the phenoxy resin dissolved in S2, and then stirring the phenoxy resin with the dye and other additives by a stirring device until the dye and other additives are completely dissolved, thereby obtaining ink for semiconductor chip testing; S4: Cooling the semiconductor chip test ink obtained in S3, and then pouring it into corresponding ink tubes after cooling.

5. The method for producing ink for semiconductor chip testing according to claim 4, characterized in that: In S2, the heating stage can be heated to 53-57°C, preferably 55°C.

6. The method for producing ink for semiconductor chip testing according to claim 4, characterized in that: In S3, the stirring device is an electric stirrer.

7. The method for producing ink for semiconductor chip testing according to claim 4, characterized in that: In S3, while the stirring device is stirring the phenoxy resin to which the dye and other additives are added, the stirring device can also perform a heating operation.

Images