Fault diagnosis device and method of using the same

Abstract

A fault diagnosis device and its use method include a fault diagnosis box, a control panel, a connection socket, a fault detection line, an anti-drop mechanism, and a heat dissipation mechanism. The top surface of the fault diagnosis box is provided with a control panel, the left side of the fault diagnosis box is fixedly connected to the connection socket, the connection socket is slidably plugged with a fault detection line, the four corners of the fault diagnosis box are provided with anti-drop mechanisms, and the inner bottom of the fault diagnosis box is fixedly connected to the heat dissipation mechanism, which runs through the interior of the fault diagnosis box. The use method includes: a first step, electrically connecting the electromechanical equipment to the fault diagnosis box via the fault detection line; a second step, starting the device; a third step, performing real-time measurement and recording; a fourth step, obtaining test results; and a fifth step, analyzing the results and performing secondary testing after resolving the fault. Therefore, this design can avoid poor contact caused by corrosion of the interface, and achieves better diagnostic results.

Description

Technical Field

[0001] The present invention relates to a diagnostic device and a method for using the same, and belongs to the field of equipment fault diagnosis, in particular to a fault diagnostic device and a method for using the same. Background Art

[0002] Electromechanical equipment generally refers to machinery, electrical appliances, and electrical automation equipment. In the modern equipment of large and medium-sized enterprises such as steel, coal mines, and petrochemicals, various large and complex mechanical equipment play a vital role. Faults generated during the operation of electromechanical equipment need to be connected to a fault diagnosis device for detection and diagnosis. The fault diagnosis device can diagnose faults generated during the operation of electromechanical equipment more accurately and quickly. At present, when in use, the fault diagnosis device is connected to the electromechanical equipment through a connecting wire. However, the interface of the existing device is exposed to the outside for a long time and is easily corroded by dust in the air, resulting in poor contact of the interface, which affects the use of the fault diagnosis device. At the same time, the strength and heat dissipation effect of the existing fault diagnosis device are relatively poor. When it is subjected to a large impact from collision or fall, it is easy to cause damage to the device. The heat inside the device cannot be dissipated in time, which is easy to cause damage to the internal components and reduce the service life of the fault diagnosis device.

[0003] The Chinese patent application with application number 202210984685.2 and application date of August 17, 2022 discloses an electric power equipment maintenance device and maintenance method thereof, including a maintenance box, the top of the maintenance box is movably connected to a box cover, the left side of the interior of the maintenance box is fixedly connected to a measuring instrument, the side of the maintenance box is provided with a wiring port, and the right side of the interior of the maintenance box is fixedly connected to a toolbox. Through the mutual cooperation between the connection frame, the wiring slot, the dust baffle, the annular telescopic rod, the pressing block, the telescopic push rod, the push rod, and the fixed block, the dust baffle is pushed by the annular telescopic rod to protect the wiring slot. When in use, the wire connector is inserted into the wiring slot, and the pressing block is pushed by the telescopic push rod to move it, so that the push rod can push the fixed block so that the fixed block is stuck in the side of the connector. Although this patent can fix the connector of the wire and prevent the connection interface from loosening, it still has the following defects:

[0004] This design cannot avoid poor contact caused by corrosion of the interface, and the diagnostic effect is poor.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of this patent application, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the Invention

[0006] The purpose of the present invention is to overcome the defects and problems in the prior art that poor contact caused by corrosion of the interface cannot be avoided and the diagnostic effect is poor, and to provide a fault diagnosis device and its use method that can avoid poor contact caused by corrosion of the interface and have better diagnostic effect.

[0007] To achieve the above objectives, the technical solution of the present invention is: a fault diagnosis device and a method of using the same, the fault diagnosis device comprising a fault diagnosis box, a control panel, a connection socket, a fault detection line, several anti-fall mechanisms, and a heat dissipation mechanism;

[0008] The two lever arrangement comprises a first end portion mounted on the second support frame, and a second end portion mounted on the second support frame, wherein the first and second support frames are mounted on a link cam of the second end of the driving member.

[0009] A control panel is provided on the right side of the top surface of the fault diagnosis box, the left side of the fault diagnosis box is fixedly connected to the side of the plug-in sleeve with an insertion groove, the insertion groove is slidably plugged with a fault detection line, the four corners of the fault diagnosis box are provided with anti-fall mechanisms, the lower interior of the fault diagnosis box is fixedly connected to the heat dissipation mechanism, and the heat dissipation mechanism runs through the interior of the fault diagnosis box from front to back.

[0010] Each of the rotating baffles includes a rotating plate, a guide slide, a connecting slider, a second spring, and a third sliding groove;

[0011] A third sliding groove is provided at the lower left side of the rotating plate, the top of the inner wall of the third sliding groove is fixedly connected to the top of the guide slide, the second spring is sleeved on the outer surface of the guide slide, the bottom of the second spring is fixedly connected to the top of the connecting slider, one side of the connecting slider is fixedly connected to the rotating disk, and the top of the connecting slider is in contact with the bottom of the guide slide.

[0012] The fault diagnosis device also includes a box cover and a placement slot;

[0013] The box cover is rotatably connected to the top rear side of the fault diagnosis box, and anti-fall mechanisms are provided at the four corners of the box cover;

[0014] A placement slot is provided on the left side of the top of the fault diagnosis box.

[0015] The anti-fall mechanism includes three rubber angle plates, a plurality of limiting slide grooves, a plurality of sliding blocks, a plurality of third springs, a plurality of extrusion columns, a plurality of sliding pressure plates, and a plurality of fourth springs;

[0016] A limiting groove is provided on the inner surface of each of the three rubber angle plates, and the interior of each limiting groove is slidably connected to the sliding block. The outer surface of the sliding block is fixedly connected to one end of a plurality of third springs, and the plurality of third springs are distributed in a circular array, and the other end of the third spring is fixedly connected to the inner wall of the limiting groove; one side of the sliding block is fixedly connected to one end of the extrusion column, the other end of the extrusion column is fixedly connected to one side of the sliding pressure plate, and the other side of the sliding pressure plate is fixedly connected to one end of the fourth spring.

[0017] A plurality of fourth sliding slots are provided inside the four corners of the fault diagnosis box;

[0018] The three-sided rubber angle plates are arranged on the outer surface of the fault diagnosis box, the fourth sliding groove corresponds to the position of the limiting sliding groove, the cross-sectional dimension of the extrusion column is smaller than the cross-sectional dimension of the fourth sliding groove, the sliding pressure plate is slidingly connected to the fourth sliding groove, and the other end of the fourth spring is fixedly connected to the top of the inner wall of the fourth sliding groove.

[0019] A plurality of fifth sliding grooves are provided inside the four corners of the box cover;

[0020] The three-sided rubber angle plates are arranged on the outer surface of the box cover, the fifth sliding groove corresponds to the position of the limiting sliding groove, the cross-sectional dimension of the extrusion column is smaller than the cross-sectional dimension of the fifth sliding groove, the sliding pressure plate is slidingly connected to the fifth sliding groove, and the other end of the fourth spring is fixedly connected to the top of the inner wall of the fifth sliding groove.

[0021] The heat dissipation mechanism includes a heat dissipation box, two air guide slots, a cooling slot, a plurality of connecting slots, and a plurality of dustproof nets;

[0022] The heat dissipation box has air guide grooves on both the front and rear sides, a cooling groove in the middle, two connecting grooves on the upper surface of the inner surface of the cooling groove, and dustproof nets symmetrically installed on two opposite sides of the heat dissipation box.

[0023] The heat dissipation box passes through the interior and bottom of the fault diagnosis box and is fixedly connected to the fault diagnosis box. The two sides of the heat dissipation box equipped with dustproof nets are located on the sides of the fault diagnosis box.

[0024] The heat dissipation mechanism also includes a plurality of heat dissipation pipes, a plurality of heat-absorbing copper plates, a guide groove, and a semiconductor refrigeration sheet;

[0025] The front part of the heat dissipation pipe is fixedly connected to one side of the inner surface of the cooling groove, and the rear part of the heat dissipation pipe passes through the middle part of several heat-absorbing copper plates and is fixedly connected to the other side of the inner surface of the cooling groove. The front and rear ends of the heat dissipation pipe respectively pass through the interior of the two air guide grooves, and the outer surface of the middle part of the two heat dissipation pipes is fixedly connected to several heat-absorbing copper plates. The upper and lower sides of each heat-absorbing copper plate are provided with a through guide groove. The inner surface of the middle part of the heat dissipation pipe is fixedly connected to the semiconductor refrigeration plate. The top end of the semiconductor refrigeration plate is located inside the cooling groove, and the bottom end of the semiconductor refrigeration plate is located inside the heat dissipation pipe.

[0026] The heat dissipation mechanism further includes a support frame, a motor, a rotating shaft, a first ducting fan, a plurality of connecting columns, a rotating ring, and a second ducting fan;

[0027] The inner wall of the air guide groove on the front side is fixedly connected to the support frame, the middle part of the support frame is fixedly connected to the motor, the output shaft of the motor is fixedly connected to one end of the rotating shaft, the other end of the rotating shaft extends into the interior of the heat dissipation pipe, the front side of the rotating shaft is fixedly connected to the first guide fan, the rear side of the rotating shaft is fixedly connected to four connecting columns, the ends of the four connecting columns away from the rotating shaft are fixedly connected to the rotating ring, the rotating ring is rotatably connected to the heat dissipation pipe, and the outer surface of the rotating ring is fixedly connected to the second guide fan.

[0028] The method of use comprises the following steps:

[0029] Step 1: First connect one end of the fault detection line to the electromechanical equipment, then insert the other end of the fault detection line into the groove to electrically connect it to the fault diagnosis box;

[0030] Step 2: Start the fault diagnosis device first, and then set the corresponding data measurement range and normal working threshold through the control panel according to the different working conditions, applications, and nominal power of the electromechanical equipment;

[0031] Step 3: First, control the fault diagnosis box through the control panel to perform real-time measurements on the electromechanical equipment that needs to be tested, and record the measurement data;

[0032] Step 4: The fault diagnosis box compares and judges the test results and measurement data with the set threshold value to obtain the test results;

[0033] Step 5: First analyze the test results of the fault diagnosis box, find out the problems with the electromechanical equipment, analyze the cause of the fault, and then perform timely maintenance on the fault point. After the fault is eliminated, conduct a secondary test.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] 1. A fault diagnosis device and its use method, the fault diagnosis device comprising a fault diagnosis box, a control panel, a connection socket, a fault detection line, an anti-drop mechanism, and a heat dissipation mechanism, the connection socket comprising a plug-in sleeve, a first sliding groove, an insertion groove, a tightening column, a sliding top plate, a first spring, a second sliding groove, a rotating column, a rotating disk, and a rotating baffle; when in use, when fault diagnosis is not being performed, under the push of the spring, the rotating baffles on both sides press each other to close the connection socket; when fault diagnosis is being performed, one end of the fault detection line is inserted from the insertion groove, and the insertion of the fault detection line plug squeezes the tightening column, which pushes the sliding top plate to slide inside the first sliding groove and squeezes the first spring; at the same time, the sliding top plate drives the second sliding groove to push the rotating column to rotate, the rotating column drives the rotating disk to rotate, and the rotating disk drives the rotating baffle to rotate away from the interior of the connection socket, ensuring normal insertion of the fault detection line plug and avoiding poor contact. Therefore, the present invention can not only perform fault detection and diagnosis, but also avoid poor contact caused by corrosion of the interface, and has a good diagnostic effect.

[0036] 2. In a fault diagnosis device and its use method, the rotating plate is provided with a third sliding groove, the top of the third sliding groove is fixedly connected to the guide slide, the second spring is sleeved on the outer surface of the guide slide, the bottom of the second spring is fixedly connected to the top of the connecting slider, one side of the connecting slider is fixedly connected to the rotating disk, and the top of the connecting slider contacts the bottom of the guide slide; when in use, the rotating disk rotates, driving the connecting slider to rotate, and the connecting slider drives the second spring and the guide slide to rotate, thereby driving the rotating plate to rotate and turn away from the inside of the connecting socket. Due to the use of elastic connecting parts such as springs and the cooperation with the hemispherical tightening column, the vibration and impact during the operation of the device are reduced, thereby improving the service life of the device. Therefore, the present invention can not only avoid poor contact of the interface, but also improve the service life.

[0037] 3. In a fault diagnosis device and its use method, a plurality of third springs arranged in a circular array are fixedly connected to the inner wall of the sliding block and the limiting sliding groove, respectively. The sliding block is fixedly connected to the sliding pressure plate via an extrusion column. The sliding pressure plate is fixedly connected to one end of the fourth spring. The fourth spring is fixedly connected to the fourth sliding groove and the fifth sliding groove, respectively. During use, when the fault diagnosis device is hit or dropped, it will squeeze the three rubber angle plates, driving the sliding block to squeeze the extrusion column. The extrusion column presses the sliding pressure plate to slide inside the fourth sliding groove and the fifth sliding groove, thereby squeezing the fourth spring and providing shock absorption for the fault diagnosis device. At the same time, the three rubber angle plates also squeeze the third spring via the sliding block, providing shock absorption from multiple directions, thereby improving the buffering effect, increasing the strength of the fault diagnosis device, and avoiding damage. Therefore, the present invention can avoid poor interface contact and has a good structural strength.

[0038] 4. A fault diagnosis device and its use method, wherein the heat dissipation mechanism includes a heat dissipation box, an air guide slot, a cooling slot, a connecting slot, a dustproof net, a heat dissipation pipe, a heat-absorbing copper plate, a guide slot, a semiconductor refrigeration plate, a support frame, a motor, a rotating shaft, a first guide fan, a connecting column, a rotating ring, and a second guide fan. The heat dissipation box passes through the interior and bottom of the fault diagnosis box and is fixedly connected to the fault diagnosis box. When used, the motor is started, and the output shaft of the motor drives the rotating shaft to rotate. The rotating shaft drives the first guide fan to rotate and drives the connecting column to rotate. The connecting column drives the rotating ring to rotate, thereby driving the second guide fan to rotate, so that the air inside the device circulates in the cooling slot and the guide slot, the heat-absorbing copper plate and the semiconductor refrigeration plate absorb heat and cool the air in the cooling slot, and the cooled air flows into the device through the connecting slot to cool the inside of the device, and the heat absorbed by the heat-absorbing copper plate and the semiconductor refrigeration plate is conducted to the inside of the heat dissipation pipe. The rotation of the first guide fan causes the external air to circulate in the air guide slot and the heat dissipation pipe, thereby dissipating the heat from the heat dissipation pipe and achieving cooling and heat dissipation of the fault diagnosis device. Therefore, the device of the present invention not only has better structural strength, but also has better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0040] Figure 2 It is a structural diagram of the connection between the connecting socket and the fault detection line in the present invention.

[0041] Figure 3 It is a structural diagram of the connecting socket in the present invention.

[0042] Figure 4 It is a top view of the cooperation between the tightening column, the sliding top plate and the rotating disk in the present invention.

[0043] Figure 5 It is a front view of the cooperation between the tightening column, the sliding top plate and the rotating disk in the present invention.

[0044] Figure 6 It is a structural schematic diagram of the rotating baffle in the present invention.

[0045] Figure 7 It is a structural schematic diagram of the anti-fall mechanism in the present invention.

[0046] Figure 8 It is a structural schematic diagram of the heat dissipation mechanism in the present invention.

[0047] Figure 9 It is a structural schematic diagram of the heat-absorbing copper plate in the present invention.

[0048] Figure 10 It is a schematic diagram of the heat pipe in the present invention.

[0049] In the figure: fault diagnosis box 1, fourth sliding slot 11, box cover 2, fifth sliding slot 21, control panel 3, placement slot 4, connection socket 5, plug-in sleeve 51, first sliding slot 511, insertion groove 512, top column 52, sliding top plate 53, second sliding slot 531, first spring 54, rotating column 55, rotating disk 56, rotating baffle 57, rotating plate 571, guide slide 572, connecting slider 573, second spring 574, third sliding slot 575, fault detection line 6, anti-fall Mechanism 7, three-sided rubber angle plate 71, limiting slide groove 72, sliding block 73, third spring 74, extrusion column 75, sliding pressure plate 76, fourth spring 77, heat dissipation mechanism 8, heat dissipation box 81, rotating shaft 810, first fan guide fan 811, connecting column 812, rotating ring 813, second fan guide fan 814, semiconductor refrigeration plate 815, air guide groove 82, cooling groove 83, connecting groove 831, dustproof net 84, heat dissipation pipe 85, heat-absorbing copper plate 86, guide groove 87, support frame 88, motor 89. DETAILED DESCRIPTION

[0050] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0051] See also Figure 1 — Figure 10 A fault diagnosis device and a method of using the same, the fault diagnosis device comprising a fault diagnosis box 1, a control panel 3, a connection socket 5, a fault detection line 6, a plurality of anti-fall mechanisms 7, and a heat dissipation mechanism 8;

[0052] The connecting socket 5 includes a plug-in sleeve 51, a first sliding groove 511, an insertion groove 512, two tightening columns 52, two sliding top plates 53, two first springs 54, two second sliding grooves 531, two rotating columns 55, two rotating disks 56, and two rotating baffles 57; an insertion groove 512 is provided on the upper side of one side of the plug-in sleeve 51, and a first sliding groove 511 is provided on the inner surface of the plug-in sleeve 51 close to the insertion groove 512. The interior of the first sliding groove 511 is slidably connected to the two tightening columns 52, and one end of each tightening column 52 is a hemispherical surface, and the other end of each tightening column 52 is connected to the sliding One side of the movable top plate 53 is fixedly connected, and the other side of the sliding top plate 53 is fixedly connected to one end of the first spring 54, and the other end of the first spring 54 is fixedly connected to the inner wall of the first sliding groove 511, and the hemispherical surfaces of the two tightening columns 52 are in contact; a through second sliding groove 531 is opened inside each of the sliding top plates 53, and the rotating column 55 passes through the second sliding groove 531 and is fixedly connected to the rotating disk 56, and the rotating disk 56 is movably connected to one side of the second sliding groove 531, and a rotating baffle 57 is provided on the rear side of the rotating disk 56, and the side edges of the two rotating baffles 57 are in contact;

[0053] A control panel 3 is provided on the right side of the top surface of the fault diagnosis box 1. The left side of the fault diagnosis box 1 is fixedly connected to the side of the plug-in sleeve 51 on which an insertion groove 512 is provided. A fault detection line 6 is slidably plugged into the insertion groove 512. Anti-fall mechanisms 7 are provided at the four corners of the fault diagnosis box 1. The lower part of the interior of the fault diagnosis box 1 is fixedly connected to a heat dissipation mechanism 8, and the heat dissipation mechanism 8 runs through the interior of the fault diagnosis box 1 from front to back.

[0054] Each of the rotating baffles 57 includes a rotating plate 571, a guide slide 572, a connecting slider 573, a second spring 574, and a third sliding groove 575;

[0055] A third sliding groove 575 is provided at the lower left side of the rotating plate 571, and the top of the inner wall of the third sliding groove 575 is fixedly connected to the top of the guide slide 572. The second spring 574 is sleeved on the outer surface of the guide slide 572, and the bottom of the second spring 574 is fixedly connected to the top of the connecting slider 573. One side of the connecting slider 573 is fixedly connected to the rotating disk 56, and the top of the connecting slider 573 is in contact with the bottom of the guide slide 572.

[0056] The fault diagnosis device further includes a box cover 2 and a placement slot 4;

[0057] The box cover 2 is rotatably connected to the top rear side of the fault diagnosis box 1, and anti-fall mechanisms 7 are provided at the four corners of the box cover 2;

[0058] A placement slot 4 is provided on the left side of the top of the fault diagnosis box 1 .

[0059] The anti-fall mechanism 7 includes three rubber angle plates 71, a plurality of limiting slide grooves 72, a plurality of sliding blocks 73, a plurality of third springs 74, a plurality of extrusion columns 75, a plurality of sliding pressure plates 76, and a plurality of fourth springs 77;

[0060] The inner surface of each surface of the three-sided rubber angle plate 71 is provided with a limiting sliding groove 72, and the interior of each limiting sliding groove 72 is slidingly connected to a sliding block 73, and the outer surface of the sliding block 73 is fixedly connected to one end of a plurality of third springs 74, and the plurality of third springs 74 are distributed in a ring array, and the other end of the third spring 74 is fixedly connected to the inner wall of the limiting sliding groove 72; one side of the sliding block 73 is fixedly connected to one end of the extrusion column 75, and the other end of the extrusion column 75 is fixedly connected to one side of the sliding pressure plate 76, and the other side of the sliding pressure plate 76 is fixedly connected to one end of the fourth spring 77.

[0061] A plurality of fourth sliding slots 11 are provided at the four corners of the fault diagnosis box 1;

[0062] The three-sided rubber angle plate 71 is arranged on the outer surface of the fault diagnosis box 1, the fourth sliding groove 11 corresponds to the position of the limiting sliding groove 72, the cross-sectional dimension of the extrusion column 75 is smaller than the cross-sectional dimension of the fourth sliding groove 11, the sliding pressure plate 76 is slidingly connected to the fourth sliding groove 11, and the other end of the fourth spring 77 is fixedly connected to the top of the inner wall of the fourth sliding groove 11.

[0063] A plurality of fifth sliding grooves 21 are provided inside the four corners of the box cover 2;

[0064] The three-sided rubber angle plate 71 is arranged on the outer surface of the box cover 2, the position of the fifth sliding groove 21 corresponds to the position of the limiting sliding groove 72, the cross-sectional dimension of the extrusion column 75 is smaller than the cross-sectional dimension of the fifth sliding groove 21, the sliding pressure plate 76 is slidingly connected to the fifth sliding groove 21, and the other end of the fourth spring 77 is fixedly connected to the top of the inner wall of the fifth sliding groove 21.

[0065] The heat dissipation mechanism 8 includes a heat dissipation box 81, two air guide slots 82, a cooling slot 83, a plurality of connecting slots 831, and a plurality of dustproof nets 84;

[0066] The heat dissipation box 81 has air guide grooves 82 on both the front and rear sides. A cooling groove 83 is provided in the middle of the heat dissipation box 81. Two connecting grooves 831 are provided on the upper surface of the inner surface of the cooling groove 83. Dustproof nets 84 are symmetrically installed on two opposite sides of the heat dissipation box 81.

[0067] The heat dissipation box 81 passes through the interior and bottom of the fault diagnosis box 1 and is fixedly connected to the fault diagnosis box 1 . The two sides of the heat dissipation box 81 equipped with dustproof nets 84 are located on the sides of the fault diagnosis box 1 .

[0068] The heat dissipation mechanism 8 further includes a plurality of heat dissipation pipes 85, a plurality of heat-absorbing copper plates 86, a guide groove 87, and a semiconductor cooling sheet 815;

[0069] The front part of the heat dissipation pipe 85 is fixedly connected to one side of the inner surface of the cooling groove 83, and the rear part of the heat dissipation pipe 85 passes through the middle part of several heat-absorbing copper plates 86 and is fixedly connected to the other side of the inner surface of the cooling groove 83. The front and rear ends of the heat dissipation pipe 85 respectively pass through the interior of the two air guide grooves 82, and the outer surface of the middle part of the two heat dissipation pipes 85 is fixedly connected to several heat-absorbing copper plates 86. The upper and lower sides of each heat-absorbing copper plate 86 are provided with a through guide groove 87. The inner surface of the middle part of the heat dissipation pipe 85 is fixedly connected to the semiconductor refrigeration plate 815. The top end of the semiconductor refrigeration plate 815 is located inside the cooling groove 83, and the bottom end of the semiconductor refrigeration plate 815 is located inside the heat dissipation pipe 85.

[0070] The heat dissipation mechanism 8 further includes a support frame 88, a motor 89, a rotating shaft 810, a first guide fan 811, a plurality of connecting columns 812, a rotating ring 813, and a second guide fan 814;

[0071] The inner wall of the air guide groove 82 located on the front side is fixedly connected to the support frame 88, the middle part of the support frame 88 is fixedly connected to the motor 89, the output shaft of the motor 89 is fixedly connected to one end of the rotating shaft 810, and the other end of the rotating shaft 810 extends into the interior of the heat dissipation pipe 85. The front side of the rotating shaft 810 is fixedly connected to the first guide fan 811, and the rear side of the rotating shaft 810 is fixedly connected to four connecting columns 812. The ends of the four connecting columns 812 away from the rotating shaft 810 are fixedly connected to the rotating ring 813, and the rotating ring 813 is rotatably connected to the heat dissipation pipe 85. The outer surface of the rotating ring 813 is fixedly connected to the second guide fan 814.

[0072] The method of use comprises the following steps:

[0073] Step 1: First, connect one end of the fault detection line 6 to the electromechanical device, and then insert the other end of the fault detection line 6 into the groove 512 to electrically connect it to the fault diagnosis box 1;

[0074] Step 2: Start the fault diagnosis device first, and then set the corresponding data measurement range and normal working threshold value through the control panel 3 according to the different working conditions, applications, and nominal power of the electromechanical equipment;

[0075] Step 3: First, control the fault diagnosis box 1 through the control panel 3 to perform real-time measurement on the electromechanical equipment that needs to be tested, and record the measurement data;

[0076] Step 4: The fault diagnosis box 1 compares and determines the test results and measurement data with the set threshold value to obtain the test results;

[0077] Step 5: First analyze the test results of the fault diagnosis box 1, find out the problems of the electromechanical equipment, analyze the cause of the fault, and then perform timely maintenance on the fault point. After the fault is eliminated, perform a second test.

[0078] The supplementary description of the present invention is as follows:

[0079] In the present invention, the insertion groove 512 is preferably adapted to the plug of the fault detection line 6 .

[0080] The present invention preferably matches the position of the third sliding groove 575 with the model of the second spring 574 and the size of the connecting slider 573 so that the rotating baffles 57 on both sides can be pressed against each other under the push of the second spring 574.

[0081] In the present invention, the interior of the first sliding groove 511 is preferably slidably connected to the two pressing columns 52 , which means that the two pressing columns 52 can slide inside the first sliding groove 511 .

[0082] In the present invention, each of the rotating disks 56 is preferably movably connected to one side of the second sliding groove 531 , which means that the rotating disk 56 contacts the right side of the second sliding groove 531 and can move along with the movement of the sliding top plate 53 .

[0083] The present invention preferably has the guide grooves 87 on the upper side of each heat-absorbing copper plate 86 have the same position and size, and the guide grooves 87 on the lower side of each heat-absorbing copper plate 86 have the same position and size, and several of the guide grooves 87 form channels on the upper and lower sides respectively to facilitate air circulation.

[0084] The present invention preferably provides a limiting groove 72 on the inner surface of each of the three-sided rubber angle plates 71, which means that each of the three-sided rubber angle plates 71 is provided with three limiting grooves 72 in the directions corresponding to the X-axis, Y-axis and Z-axis, thereby forming all-round protection for the instrument.

[0085] The present invention preferably sets the depth and size of the limiting slide groove 72 according to the size of the device and the anti-fall mechanism 7. In actual use, the depth and size are set based on the minimum impact.

[0086] In the present invention, the depth of the limiting sliding groove 72 preferably does not exceed the thickness of the three rubber angle plates 71 themselves.

[0087] The present invention preferably provides that the interior of each limiting slot 72 is slidably connected to the sliding block 73 , which means that the sliding block 73 is only fixedly connected to the third spring 74 , and the sliding block 73 contacts the interior of the limiting slot 72 and can slide inside the limiting slot 72 .

[0088] The reason why the cross-sectional dimension of the extrusion column 75 is preferably smaller than the cross-sectional dimension of the fourth sliding groove 11 in the present invention is that one end of the extrusion column 75 fixedly connected to the sliding pressure plate 76 can enter the fourth sliding groove 11 and slide inside the fourth sliding groove 11.

[0089] The reason why the cross-sectional dimension of the extrusion column 75 is preferably smaller than the cross-sectional dimension of the fifth sliding groove 21 in the present invention is that one end of the extrusion column 75 fixedly connected to the sliding pressure plate 76 can enter the fifth sliding groove 21 and slide inside the fifth sliding groove 21.

[0090] In the present invention, the other end of the rotating shaft 810 preferably extends into the interior of the heat dissipation pipe 85 , which means that the other end of the rotating shaft 810 enters the interior of the front end of the heat dissipation pipe 85 .

[0091] The present invention preferably has the top end of the semiconductor refrigeration plate 815 located inside the cooling groove 83 and the bottom end of the semiconductor refrigeration plate 815 located inside the heat dissipation tube 85, which means that the cooling surface of the semiconductor refrigeration plate 815 is located inside the cooling groove 83 and the heat dissipation surface of the semiconductor refrigeration plate 815 is located inside the heat dissipation tube 85.

[0092] In the preferred third step of the present invention, when performing real-time testing and data recording, detection is performed based on factors such as test range, data recording, and average value calculation, thereby ensuring the reliability of the test results.

[0093] The reason for performing the secondary detection in the preferred fifth step of the present invention is to test whether the known fault has been successfully repaired.

[0094] Example 1:

[0095] See also Figure 1 — Figure 10, a fault diagnosis device and its use method, the fault diagnosis device includes a fault diagnosis box 1, a control panel 3, a connecting socket 5, a fault detection line 6, a plurality of anti-fall mechanisms 7, and a heat dissipation mechanism 8; the connecting socket 5 includes a plug-in sleeve 51, a first sliding groove 511, an insertion groove 512, two tightening columns 52, two sliding top plates 53, two first springs 54, two second sliding grooves 531, two rotating columns 55, two rotating disks 56, and two rotating baffles 57; an insertion groove 512 is provided on the upper side of one side of the connecting sleeve 51, and a first sliding groove 511 is provided on the inner surface of the plug-in sleeve 51 near the insertion groove 512, and the interior of the first sliding groove 511 is slidably connected to the two tightening columns 52, one end of each tightening column 52 is a hemispherical surface, and the other end of each tightening column 52 is fixedly connected to one side of the sliding top plate 53, and the other side of the sliding top plate 53 is fixedly connected to one end of the first spring 54. Then, the other end of the first spring 54 is fixedly connected to the inner wall of the first sliding groove 511, and the hemispherical surfaces of the two tightening columns 52 are in contact; a second sliding groove 531 is provided inside each of the sliding top plates 53, and the rotating column 55 passes through the second sliding groove 531 and is fixedly connected to the rotating disk 56, and the rotating disk 56 is movably connected to one side of the second sliding groove 531, and a rotating baffle 57 is provided on the rear side of the rotating disk 56, and the sides of the two rotating baffles 57 are in contact; a control panel 3 is provided on the right side of the top surface of the fault diagnosis box 1, and the left side of the fault diagnosis box 1 is fixedly connected to the side of the plug-in sleeve 51 with an insertion groove 512, and the insertion groove 512 is slidably plugged with a fault detection line 6, and anti-fall mechanisms 7 are provided at the four corners of the fault diagnosis box 1, and the lower part of the interior of the fault diagnosis box 1 is fixedly connected to the heat dissipation mechanism 8, and the heat dissipation mechanism 8 runs through the interior of the fault diagnosis box 1 from front to back.

[0096] When in use, to diagnose the fault of the electromechanical equipment, first insert one end of the fault detection line 6 from the insertion groove 512. As the plug of the fault detection line 6 is inserted, the pressing column 52 is squeezed, so that the two pressing columns 52 slide away from each other in the first sliding groove 511. Each pressing column 52 pushes the corresponding sliding top plate 53 to slide in the first sliding groove 511 and squeeze the first spring 54. At the same time, the sliding top plate 53 drives the second sliding groove 531 to move, and the second sliding groove 531 drives the rotating column 55 to rotate. The rotating column 55 drives the rotating disk 56 to rotate, and the rotating disk 56 drives the rotating baffle 57 to rotate away from the inside of the connecting socket 5, ensuring the normal insertion of the fault detection line 6 plug and avoiding poor contact of the socket; when the device is not in use, under the push of the spring, the rotating baffles 57 on both sides press each other to close the connecting socket 5, preventing the connecting socket 5 from being exposed to the outside, thereby protecting the connecting socket 5 from erosion by the external environment, avoiding poor contact during use, and improving the diagnostic effect.

[0097] Example 2:

[0098] The basic content is the same as that of Example 1, except that: each of the rotating baffles 57 includes a rotating plate 571, a guide slide 572, a connecting slider 573, a second spring 574, and a third sliding groove 575; a third sliding groove 575 is opened at the lower left side of the rotating plate 571, the top of the inner wall of the third sliding groove 575 is fixedly connected to the top of the guide slide 572, the second spring 574 is sleeved on the outer surface of the guide slide 572, the bottom of the second spring 574 is fixedly connected to the top of the connecting slider 573, one side of the connecting slider 573 is fixedly connected to the rotating disk 56, and the top of the connecting slider 573 is in contact with the bottom of the guide slide 572.

[0099] When in use, the rotating disk 56 rotates, driving the connecting slider 573 to rotate, and the connecting slider 573 drives the second spring 574 to rotate. The second spring 574 and the connecting slider 573 drive the guide slide 572 to rotate, thereby driving the rotating plate 571 to rotate, so that the rotating baffle 57 is turned away from the inside of the connecting socket 5. Due to the elastic connection between the first spring 54 and the second spring 574 and the hemispherical design of the tightening column 52, a buffer is provided for the insertion process of the fault detection line 6 plug, reducing vibration and impact between the components and improving the service life of the device; when the device is not in use, under the push of the second spring 574, the rotating baffles 57 on both sides press each other tightly, thereby making the closing effect of the connecting socket 5 better.

[0100] Example 3:

[0101] The basic content is the same as that of Example 1, except that: the fault diagnosis device also includes a box cover 2 and a placement slot 4; the box cover 2 is rotatably connected to the top rear side of the fault diagnosis box 1, and anti-fall mechanisms 7 are provided at the four corners of the box cover 2; and a placement slot 4 is provided on the left side of the top of the fault diagnosis box 1.

[0102] During use, after use, the box cover 2 is closed to prevent adverse environmental factors such as dust and moisture from entering the control panel 3 and internal components from the top of the fault diagnosis box 1, thereby avoiding affecting the stability and accuracy of the device. The box cover 2 can also protect the fault diagnosis box 1 from damage caused by impact, etc., thereby increasing the service life of the device; and after use, the fault detection line 6 is placed in the placement slot 4 for easy carrying of the fault detection line 6.

[0103] Example 4:

[0104] The basic content is the same as that of Example 1, except that: the anti-fall mechanism 7 includes three rubber angle plates 71, a plurality of limiting slide grooves 72, a plurality of sliding blocks 73, a plurality of third springs 74, a plurality of extrusion columns 75, a plurality of sliding pressure plates 76, and a plurality of fourth springs 77; the inner surface of each surface of the three rubber angle plates 71 is provided with a limiting slide groove 72, the interior of each limiting slide groove 72 is slidably connected to the sliding block 73, the outer surface of the sliding block 73 is fixedly connected to one end of a plurality of third springs 74, and the plurality of third springs 74 are distributed in an annular array, and the other end of the third spring 74 is fixedly connected to the inner wall of the limiting slide groove 72; one side of the sliding block 73 is fixedly connected to one end of the extrusion column 75, the other end of the extrusion column 75 is fixedly connected to one side of the sliding pressure plate 76, and the other side of the sliding pressure plate 76 is fixedly connected to one end of the fourth spring 77; the The four corners of the fault diagnosis box 1 are provided with several fourth sliding grooves 11; the three-sided rubber angle plates 71 are provided on the outer surface of the fault diagnosis box 1, the fourth sliding groove 11 corresponds to the position of the limiting sliding groove 72, the cross-sectional size of the extrusion column 75 is smaller than the cross-sectional size of the fourth sliding groove 11, the sliding pressure plate 76 is slidably connected to the fourth sliding groove 11, and the other end of the fourth spring 77 is fixedly connected to the top of the inner wall of the fourth sliding groove 11; the four corners of the box cover 2 are provided with several fifth sliding grooves 21; the three-sided rubber angle plates 71 are provided on the outer surface of the box cover 2, the fifth sliding groove 21 corresponds to the position of the limiting sliding groove 72, the cross-sectional size of the extrusion column 75 is smaller than the cross-sectional size of the fifth sliding groove 21, the sliding pressure plate 76 is slidably connected to the fifth sliding groove 21, and the other end of the fourth spring 77 is fixedly connected to the top of the inner wall of the fifth sliding groove 21.

[0105] When in use, when the fault diagnosis device is hit or dropped, the impact caused by the collision or drop causes squeezing of the three-sided rubber angle plates 71, causing the sliding block 73 in the limiting slide groove 72 to slide and squeeze the squeezing column 75. The squeezing column 75 presses the sliding pressure plate 76 to slide inside the fourth sliding groove 11 and the fifth sliding groove 21, squeezing the fourth spring 77, thereby buffering and shock-absorbing the fault diagnosis device. At the same time, the three-sided rubber angle plates 71 will also squeeze the third spring 74 in the limiting slide groove 72 through the sliding block 73, buffering from multiple directions, making the buffering effect better; since the three-sided rubber angle plates 71 are respectively arranged on the outer surfaces of the fault diagnosis box 1 and the box cover 2, the device is protected in all directions, thereby improving the strength of the fault diagnosis device and avoiding damage to the fault diagnosis device.

[0106] Example 5:

[0107] The basic content is the same as that of Example 1, except that: the heat dissipation mechanism 8 includes a heat dissipation box 81, two air guide slots 82, a cooling slot 83, a plurality of connecting slots 831, and a plurality of dustproof nets 84; the heat dissipation box 81 is provided with air guide slots 82 on both the front and rear sides, the middle of the heat dissipation box 81 is provided with a cooling slot 83, two connecting slots 831 are provided above the inner surface of the cooling slot 83, and dustproof nets 84 are symmetrically installed on the two opposite sides of the heat dissipation box 81; the heat dissipation box 81 passes through the interior and bottom of the fault diagnosis box 1 and is fixedly connected to the fault diagnosis box 1, and the heat dissipation box 81 is provided with a plurality of connecting slots 831 and a plurality of dustproof nets 84. The two sides of the fault diagnosis box 1 are provided with dustproof nets 84. The heat dissipation mechanism 8 further includes a plurality of heat dissipation pipes 85, a plurality of heat-absorbing copper plates 86, a guide groove 87, and a semiconductor cooling plate 815. The front portion of the heat dissipation pipe 85 is fixedly connected to one side of the inner surface of the cooling groove 83. The rear portion of the heat dissipation pipe 85 passes through the middle of the plurality of heat-absorbing copper plates 86 and is fixedly connected to the other side of the inner surface of the cooling groove 83. The front and rear ends of the heat dissipation pipe 85 respectively pass through the interior of the two air guide grooves 82. The outer surface of the middle portion of the two heat dissipation pipes 85 is fixedly connected to the plurality of heat-absorbing copper plates 86. The upper and lower sides of the heat-absorbing copper plate 86 are provided with a through guide groove 87, the inner surface of the middle part of the heat dissipation pipe 85 is fixedly connected to the semiconductor cooling plate 815, the top end of the semiconductor cooling plate 815 is located inside the cooling groove 83, and the bottom end of the semiconductor cooling plate 815 is located inside the heat dissipation pipe 85; the heat dissipation mechanism 8 also includes a support frame 88, a motor 89, a rotating shaft 810, a first guide fan 811, a plurality of connecting columns 812, a rotating ring 813, and a second guide fan 814; the inner wall of the guide groove 82 on the front side is fixedly connected to the support frame 88, and the support frame 88 is fixedly connected to the inner wall of the guide groove 82 on the front side. The middle part is fixedly connected to the motor 89, the output shaft of the motor 89 is fixedly connected to one end of the rotating shaft 810, the other end of the rotating shaft 810 extends into the interior of the heat dissipation pipe 85, the front side of the rotating shaft 810 is fixedly connected to the first guide fan 811, the rear side of the rotating shaft 810 is fixedly connected to four connecting columns 812, the four connecting columns 812 are fixedly connected to the rotating ring 813 at one end away from the rotating shaft 810, the rotating ring 813 is rotatably connected to the heat dissipation pipe 85, and the outer surface of the rotating ring 813 is fixedly connected to the second guide fan 814.

[0108] When in use, the motor 89 is started, and the output shaft of the motor 89 drives the rotating shaft 810 to rotate, and the rotating shaft 810 drives the first guide fan 811 to rotate. At the same time, the rotating shaft 810 drives the four connecting columns 812 to rotate, and the connecting columns 812 drive the rotating ring 813 to rotate, thereby driving the second guide fan 814 to rotate, so that the air inside the device circulates in the cooling groove 83 and the guide groove 87. Because the cooling surface of the semiconductor cooling plate 815 is located inside the cooling groove 83, and the heat dissipation surface of the semiconductor cooling plate 815 is located on the heat dissipation pipe The inside of 85 makes the heat-absorbing copper plate 86 and the semiconductor refrigeration plate 815 absorb heat and cool the air in the cooling groove 83. The cooled air enters the inside of the device from the connecting groove 831 to cool the inside of the device; and the heat absorbed by the heat-absorbing copper plate 86 and the semiconductor refrigeration plate 815 is transferred to the inside of the heat dissipation pipe 85. The rotation of the first guide fan 811 makes the external air circulate in the guide groove 82 and the heat dissipation pipe 85, and discharges the heat inside the heat dissipation pipe 85, thereby improving the heat dissipation effect of the fault diagnosis device and increasing the service life of the fault diagnosis device.

[0109] Example 6:

[0110] The basic content is the same as Example 1, except that the method of use includes the following steps:

[0111] Step 1: First, connect one end of the fault detection line 6 to the electromechanical device, and then insert the other end of the fault detection line 6 into the groove 512 to electrically connect it to the fault diagnosis box 1;

[0112] Step 2: Start the fault diagnosis device first, and then set the corresponding data measurement range and normal working threshold value through the control panel 3 according to the different working conditions, applications, and nominal power of the electromechanical equipment;

[0113] Step 3: First, control the fault diagnosis box 1 through the control panel 3 to perform real-time measurement on the electromechanical equipment that needs to be tested, and record the measurement data;

[0114] Step 4: The fault diagnosis box 1 compares and determines the test results and measurement data with the set threshold value to obtain the test results;

[0115] Step 5: First analyze the test results of the fault diagnosis box 1, find out the problems of the electromechanical equipment, analyze the cause of the fault, and then perform timely maintenance on the fault point. After the fault is eliminated, perform a second test.

[0116] The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modifications or changes made by ordinary technicians in this field based on the contents disclosed in the present invention should be included in the protection scope recorded in the claims.

Claims

1. A fault diagnosis device, characterized in that: The fault diagnosis device comprises a fault diagnosis box (1), a control panel (3), a connection socket (5), a fault detection line (6), a plurality of anti-fall mechanisms (7), and a heat dissipation mechanism (8); The connecting socket (5) comprises a plug-in sleeve (51), a first sliding groove (511), an insertion groove (512), two tightening columns (52), two sliding top plates (53), two first springs (54), two second sliding grooves (531), two rotating columns (55), two rotating disks (56), and two rotating baffles (57); an insertion groove (512) is provided on the upper side of one side of the plug-in sleeve (51), a first sliding groove (511) is provided on the inner surface of the plug-in sleeve (51) near the insertion groove (512), the interior of the first sliding groove (511) is slidably connected to the two tightening columns (52), one end of each tightening column (52) is a hemispherical surface, and each tightening column (52) is provided with a hemispherical surface. The other end is fixedly connected to one side of the sliding top plate (53), the other side of the sliding top plate (53) is fixedly connected to one end of the first spring (54), the other end of the first spring (54) is fixedly connected to the inner wall of the first sliding groove (511), and the hemispherical surfaces of the two tightening columns (52) are in contact with each other; a through second sliding groove (531) is provided inside each of the sliding top plates (53), the rotating column (55) passes through the second sliding groove (531) and is fixedly connected to the rotating disk (56), the rotating disk (56) is movably connected to one side of the second sliding groove (531), and a rotating baffle (57) is provided on the rear side of the rotating disk (56), and the side edges of the two rotating baffles (57) are in contact with each other; A control panel (3) is provided on the right side of the top surface of the fault diagnosis box (1), and the left side of the fault diagnosis box (1) is fixedly connected to a side of the plug-in sleeve (51) provided with an insertion groove (512), and a fault detection line (6) is slidably plugged into the insertion groove (512). Anti-fall mechanisms (7) are provided at the four corners of the fault diagnosis box (1), and the lower part of the interior of the fault diagnosis box (1) is fixedly connected to a heat dissipation mechanism (8), and the heat dissipation mechanism (8) runs through the interior of the fault diagnosis box (1) from front to back.

2. A fault diagnosis device according to claim 1, characterized in that: Each of the rotating baffles (57) includes a rotating plate (571), a guide slide (572), a connecting slide (573), a second spring (574), and a third sliding groove (575); A third sliding groove (575) is provided at the lower left side of the rotating plate (571), and the top of the inner wall of the third sliding groove (575) is fixedly connected to the top of the guide slide (572). The second spring (574) is sleeved on the outer surface of the guide slide (572), and the bottom of the second spring (574) is fixedly connected to the top of the connecting slider (573). One side of the connecting slider (573) is fixedly connected to the rotating disk (56), and the top of the connecting slider (573) is in contact with the bottom of the guide slide (572).

3. A fault diagnosis device according to claim 2, characterized in that: The fault diagnosis device further comprises a box cover (2) and a placement slot (4); The box cover (2) is rotatably connected to the top rear side of the fault diagnosis box (1), and anti-fall mechanisms (7) are provided at the four corners of the box cover (2); A placement slot (4) is provided on the left side of the top of the fault diagnosis box (1).

4. A fault diagnosis device according to claim 3, characterized in that: The anti-fall mechanism (7) comprises three rubber angle plates (71), a plurality of limiting slide grooves (72), a plurality of sliding blocks (73), a plurality of third springs (74), a plurality of extrusion columns (75), a plurality of sliding pressure plates (76), and a plurality of fourth springs (77); A limiting slot (72) is provided on the inner surface of each of the three-sided rubber angle plates (71), and the interior of each limiting slot (72) is slidably connected to a sliding block (73). The outer surface of the sliding block (73) is fixedly connected to one end of a plurality of third springs (74), and the plurality of third springs (74) are distributed in an annular array. The other end of the third spring (74) is fixedly connected to the inner wall of the limiting slot (72); one side of the sliding block (73) is fixedly connected to one end of an extrusion column (75), and the other end of the extrusion column (75) is fixedly connected to one side of a sliding pressure plate (76), and the other side of the sliding pressure plate (76) is fixedly connected to one end of a fourth spring (77).

5. A fault diagnosis device according to claim 4, characterized in that: A plurality of fourth sliding slots (11) are provided inside the four corners of the fault diagnosis box (1); The three-sided rubber angle plate (71) is arranged on the outer surface of the fault diagnosis box (1), the fourth sliding groove (11) corresponds to the position of the limiting sliding groove (72), the cross-sectional dimension of the extrusion column (75) is smaller than the cross-sectional dimension of the fourth sliding groove (11), the sliding pressure plate (76) is slidably connected to the fourth sliding groove (11), and the other end of the fourth spring (77) is fixedly connected to the top of the inner wall of the fourth sliding groove (11).

6. A fault diagnosis device according to claim 4, characterized in that: A plurality of fifth sliding grooves (21) are provided inside the four corners of the box cover (2); The three-sided rubber angle plate (71) is arranged on the outer surface of the box cover (2), the position of the fifth sliding groove (21) corresponds to the position of the limiting sliding groove (72), the cross-sectional dimension of the extrusion column (75) is smaller than the cross-sectional dimension of the fifth sliding groove (21), the sliding pressure plate (76) is slidably connected to the fifth sliding groove (21), and the other end of the fourth spring (77) is fixedly connected to the top of the inner wall of the fifth sliding groove (21).

7. A fault diagnosis device according to any one of claims 1 to 6, characterized in that: The heat dissipation mechanism (8) includes a heat dissipation box (81), two air guide slots (82), a cooling slot (83), a plurality of connecting slots (831), and a plurality of dustproof nets (84); The heat dissipation box (81) is provided with air guide grooves (82) on both the front and rear sides thereof, a cooling groove (83) is provided in the middle of the heat dissipation box (81), two connecting grooves (831) are provided above the inner surface of the cooling groove (83), and dustproof screens (84) are symmetrically installed on two opposite sides of the heat dissipation box (81); The heat dissipation box (81) passes through the interior lower portion of the fault diagnosis box (1) and is fixedly connected to the fault diagnosis box (1). The heat dissipation box (81) is provided with two side surfaces of a dustproof net (84) located on the side surfaces of the fault diagnosis box (1).

8. A fault diagnosis device according to claim 7, characterized in that: The heat dissipation mechanism (8) further includes a plurality of heat dissipation pipes (85), a plurality of heat-absorbing copper plates (86), a guide groove (87), and a semiconductor cooling plate (815); The front portion of the heat dissipation pipe (85) is fixedly connected to one side of the inner surface of the cooling groove (83), and the rear portion of the heat dissipation pipe (85) passes through the middle portion of a plurality of heat-absorbing copper plates (86) and is fixedly connected to the other side of the inner surface of the cooling groove (83). The front and rear ends of the heat dissipation pipe (85) respectively pass through the interior of the two air guide grooves (82). The outer surfaces of the middle portions of the two heat dissipation pipes (85) are fixedly connected to the plurality of heat-absorbing copper plates (86). A through flow guide groove (87) is provided on the upper and lower sides of each heat-absorbing copper plate (86). The inner surface of the middle portion of the heat dissipation pipe (85) is fixedly connected to the semiconductor cooling plate (815). The top end of the semiconductor cooling plate (815) is located inside the cooling groove (83), and the bottom end of the semiconductor cooling plate (815) is located inside the heat dissipation pipe (85).

9. A fault diagnosis device according to claim 8, characterized in that: The heat dissipation mechanism (8) further includes a support frame (88), a motor (89), a rotating shaft (810), a first fan guide (811), a plurality of connecting columns (812), a rotating ring (813), and a second fan guide (814); The inner wall of the air guide groove (82) located at the front side is fixedly connected to the support frame (88), the middle part of the support frame (88) is fixedly connected to the motor (89), the output shaft of the motor (89) is fixedly connected to one end of the rotating shaft (810), the other end of the rotating shaft (810) extends into the interior of the heat dissipation pipe (85), the front side of the rotating shaft (810) is fixedly connected to the first guide fan (811), the rear side of the rotating shaft (810) is fixedly connected to four connecting columns (812), one end of the four connecting columns (812) away from the rotating shaft (810) is fixedly connected to the rotating ring (813), the rotating ring (813) is rotatably connected to the heat dissipation pipe (85), and the outer surface of the rotating ring (813) is fixedly connected to the second guide fan (814).

10. A method for using the fault diagnosis device according to claim 1, characterized in that: The method of use comprises the following steps: The first step is to connect one end of the fault detection line (6) to the electromechanical device, and then pass the other end of the fault detection line (6) through the insertion groove (512) to electrically connect it to the fault diagnosis box (1); Step 2: First start the fault diagnosis device, and then set the corresponding data measurement range and normal working threshold value through the control panel (3) according to the different working states, applications and nominal power of the electromechanical equipment; Step 3: First, control the fault diagnosis box (1) through the control panel (3) to perform real-time measurement on the electromechanical equipment to be tested, and record the measurement data; Step 4: The fault diagnosis box (1) compares and judges the test results and measurement data with the set threshold value to obtain the test results; Step 5: First, analyze the test results of the fault diagnosis box (1) and find out the problems of the electromechanical equipment, analyze the cause of the fault, and then perform timely maintenance on the fault point. After the fault is eliminated, conduct a secondary test.

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